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CN100466679C - 图像传感器 - Google Patents

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Publication number
CN100466679C
CN100466679C CNB2004100856174A CN200410085617A CN100466679C CN 100466679 C CN100466679 C CN 100466679C CN B2004100856174 A CNB2004100856174 A CN B2004100856174A CN 200410085617 A CN200410085617 A CN 200410085617A CN 100466679 C CN100466679 C CN 100466679C
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CN
China
Prior art keywords
transparent panel
imageing sensor
base plate
light
lens
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2004100856174A
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English (en)
Other versions
CN1678012A (zh
Inventor
远藤孝文
野上阳平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Filing date
Publication date
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Publication of CN1678012A publication Critical patent/CN1678012A/zh
Application granted granted Critical
Publication of CN100466679C publication Critical patent/CN100466679C/zh
Anticipated expiration legal-status Critical
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    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
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Abstract

本发明涉及一种图像传感器，它由以下两部分组成，即将接受由透镜聚焦的反射光的多个摄像元件配置成直线的多块半导体芯片搭载用的传感器基板；以及介于所述透镜和传感器基板之间，使与相邻半导体芯片的边界区域相当的光路区域具有折射功能，并将射入所述半导体芯片的该边界区域的反射光分配给相邻的所述半导体芯片的每一个摄像元件的透明体。

Description

图像传感器
技术领域
本发明涉及图像输入装置中使用的图像传感器，尤其是涉及作为光电变换元件装有多块半导体芯片的密集型图像传感器。
背景技术
作为图像传感器的构成之一，在专利文献1的图9中，揭示了一种将多块芯片排列起来，使芯片间(芯片的边界)的间距误差产生的浓度差不显著的图像读取装置。图中，C1及C2为芯片(光电变换元件)、Ca及Cb为相邻的芯片端部、La为相邻的芯片端部间隙的距离。另外，r为摄像元件(受光元件)、P为摄像元件间的间隔、P＇为芯片边界处的摄像元件间隔。另外，在上述公报的图3(C)中，C14及C21为位于相邻的芯片边界的摄像元件。
又在专利文献2的图4，揭示了将多块光学元件芯片排列起来的读取装置。图中，1为光学元件芯片、2为元件(受光元件)、3为长度方向(倾斜)的端面、3a为芯片1的表面一侧的边缘、3b为芯片1的背面一侧(基板一侧)的边缘、7为基板、8为银糊。
[专利文献1]特开2003—101724号公报
[专利文献2]特开平6—218985号公报
将多块芯片排列在基板上的图像传感器中，专利文献1由于边界摄像元件间隔P＇相对摄像元件间隔P变长，所以将摄像元件C14的输出和摄像元件C21的输出的平均值作为插补数据追加，但是因不是原来的图像数据，所以就生成模拟数据。
另外，在专利文献2中，在提高旋转叶片的刚性，使旋转叶片倾斜的同时进行切割(dicing)，使芯片1表面侧的边缘3a凸出，使背面侧的边缘3b退避，因此使边界摄像元件间隔P＇能接近原来的摄像元件间隔P。
但是，在利用模具粘合剂(die bonder)等自动安装时，考虑到由于安装精度引起的芯片之间的碰撞(接触)，有必要将芯片之间预先隔离开来后再进行安装。另外，即使芯片已经高精度安装，由于在位于下部的银糊8等粘接剂上进行机械安装，故安装后位置会有变化。
还由于粘接时使粘接剂热固化(Cure)以固定芯片，不能忽视由于固化时粘接剂收缩引起芯片随机移动造成的位置变化，所以存在的问题是在多块芯片的排列上，最终不能高精度地安装。
发明内容
本发明的图像传感器为解决上述问题而作，其目的在于提供一种即使在不用插补数据(假想摄像元件的数据)，而且边界摄像元件间隔P＇比同一芯片上的摄像元件间隔P大时，仍能如实地读取芯片边界区域的图像的图像传感器。
本发明的图像传感器具备：对被拍摄物体照射光的光源、沿与所述被拍摄物体的移动方向成直角的方向延伸，在整个规定读取宽度上将来自所述被拍摄物体的反射光聚焦的透镜、装有将接收由该透镜聚焦的反射光的多个摄像元件配置成直线设置的多块半导体芯片的传感器基板；介于所述透镜和传感器基板之间并设置在互相邻近的所述半导体芯片间隙附近的至少具有具有圆弧面的凹口部及凸出部中一个的透明板、以及至少收容或支持所述透镜、传感器基板、和透明板的壳体。
因而，本发明的图像传感器即使在不用插补数据(假想摄像元件的数据)，而且边界摄像元件间隔比同一芯片上的摄像元件间隔大时，仍能如实地读取边界区域的图像。
附图说明
图1为本发明实施例1的图像传感器的剖面构成图。
图2为本发明实施例1的图像传感器的棒状透镜陈列和透明板及传感器基板间位置关系图。
图3为表示本发明实施例1的透明板的凹口部位置和大概形状的示意图。
图4为表示本发明实施例1的图像传感器的传感器基板上的半导体芯片位置关系的示意图。
图5为表示本发明实施例1的透明板的下表面部分的形状的示意图。
图6表示本发明实施例1的透明板下表面部分的剖面形状。
图7为本发明实施例1的透明板的部分外观图。
图8用于说明介质边界上的光折射。
图9用于说明本发明实施例1的透明板的结构原理。
图10表示射向本发明实施例1图像传感器的传感器基板的光的路径。
图11为表示本发明实施例1的透明板具体结构的局部放大图。
图12为表示本发明实施例1的图像传感器最佳画质区域的图。
图13为本发明实施例2的透明板的部分外观图。
图14用于说明凸出倾斜的介质边界上的光折射。
图15为说明本发明实施例2的透明板结构原理用的说明图。
图16为本发明实施例3的透明板部分外观图。
图17为本发明实施例4的透明板部分外观图。
图18表示本发明实施例5的图像传感器的最佳画质区域。
图19为本发明实施例6的图像传感器的剖面结构图。
图20为本发明实施例6的图像传感器的其它剖面结构图。
图21为本发明实施例7的透明板的部分外观图。
具体实施方式
实施例1
以下说明本发明的实施例1。图1为本发明的图像传感器的剖面结构图。在图1中，1为照射被拍摄物体(原稿、纸币、支票、有价证券等)的光源、2为确保被拍摄物体的行走面或保护密封图像传感器的玻璃板、3是作为被拍摄物体的原稿、4为将原稿3反射的光聚光的透镜(棒状透镜阵列)、5为让反射光通过的透明板、6为摄像元件或其驱动电路构成的半导体芯片、7为安装半导体芯片6的传感器基板、8为进行输入输出信号交接用的连接器(connector)、9为收容或支持棒状透镜阵列或透明板及传感器基板的壳体、10为驱动原稿3的驱动压纸卷筒，通常不装在图像传感器上。
以下说明动作。图1中，来自光源1的光通过玻璃板2照射原稿3。原稿3上反射的部分散射光成为反射光，通过玻璃板2由棒状透镜阵列4聚焦。由棒状透镜阵列4会聚的反射光通过透明板5射入传感器基板7上的半导体芯片6的摄像元件(受光元件)。
将原稿面和设置在半导体芯片上的摄像元件间的距离称为光路长，沿该光路射入的部分散射光作为反射光由半导体芯片6接收。棒状透镜阵列4、透明板5、及半导体芯片6的摄像元件部分以光路轴为中心划分进行配置。
图2为表示在整个长度方向(原稿读取方向)上棒状透镜阵列4、透明板5及传感器基板7上的半导体芯片6的位置关系和形状的外观(俯视)图。还有，11表示在半导体芯片6上形成的摄像元件。图3为表示在透明板5的下表面上形成的凹口部，该凹口部的间隔(A)和半导体芯片6的安装间隔一致。图4表示传感器基板7上相邻半导体芯片6的位置关系，P为摄像元件间隔、P＇为边界摄像元件间隔、S为摄像元件11的受光区域的尺寸，受光区域为方形或矩形。Lgap为相邻的半导体芯片间隔(半导体芯片6的间隔)。还有，11e表示位于半导体芯片6两端的摄像元件(边界摄像元件)。
图5是表示透明板5下表面的凹口形状的平面图，透明板5沿整个透明板5的长度方向由被拍摄物体3移动方向侧的一方为用圆弧形的命名为A部的部分和矩形的命名为B部的部分构成的面、及被拍摄物体3移动方向侧另一方面为用矩形的命名为C部的部分和圆弧形的命名为D部的部分构成的面，这两个面区域组成。图6表示图5的A部、B部的剖面形状及C部、D部的剖面形状。图7为透明板5的凹口形状区域的外观(俯视)图。
通常从介质A不垂直地射入介质B的光，在介质A的折射率大于介质B的折射率的情况下，如图8所示，在介质A和介质B的边界上产生折射并弯曲。相对纸面的水平线，若介质A(折射率n＝1.5)和介质B(折射率n＝1.0)的边界部向右上方倾斜，则折射光就相对于入射光向左弯曲，若介质A和介质B的边界向右下方倾斜，则折射光相对于入射光向右弯曲。图9表示将图8示出的介质A和介质B的左右边界部与纸面的正面及纸面的背面重合在一起的图。这时，相对于射入的垂直光其折射光作为正面部分光和背面部分光出现。
图10为表示图5及图6示出的正面、背面折射面的折射光射向传感器基板7的光的方向示意图。这时，射入半导体芯片6的边界区域的垂直光由折射而分开，射向位于边界的摄像元件(边界摄像元件)11e方向。
图11表示与射入半导体芯片6的边界区域的垂直光对应的透明板5的区域的具体尺寸。本实施例中表示透明塑料材料用丙烯树脂，并对该区域进行曲面加工及切削，作为宽0.2mm、高0.03mm的凹口区域的透明板5。还有，透明板5也可用透明的玻璃材料进行研磨加工。
图12表示将图11所示的设置凹口部的透明板5组装入具有300DPI的读取密度的图像传感器，并试验图像的再现性的数据。试验采用以300DPI的密度印刷红·蓝·绿色的带状图案，判断与半导体芯片6边界部区域相当的图像的再现性。图像精度因以由半导体芯片6的安装位置决定的芯片间间隔(Lgap)为依据的参数、和以透明板5下表面和摄像元件11间的距离(Δh)为依据的参数而变化，故考虑到这些因素进行测量及判断。图12表示Lgap为0.2mm时通过改变Δh也能确保良好画质的情况。
实施例2
图13表示取代实施例1说明的图7示出的凹形状，将透明板5的形状做成凸出形状的透明板51。关于该透明板51的凸出形状现在用图14及图15与图8及图9对比进行说明。图14中，若介质A和介质B的边界部向右下方倾斜，则折射光相对入射光向右弯曲，若介质A和介质B向右上方倾斜，则折射光相对入射光向左弯曲。图15为将图14示出的介质A和介质B的边界部和纸面正面及纸面背面重合在一起的图。这时，相对入射的垂直光其折射光向右弯曲的光成为背面部分的光。这一点和图8及图9示出的实施例1的部分光的方向互为相反方向。即在半导体芯片6的边界区域上，使用凹口形状的透明板5的情况和使用凸出形状的透明板51的情况，配光情况都相同。
实施例3
图16表示对本发明实施例1的图7示出的图像传感器的透明板5的不连续区域实施遮光的透明板。在实施例1及实施例2中主要阐述半导体芯片6边界区域的垂直光，但是还有与垂直光相比稍有倾斜的来自原稿3的反射有效光，透明板5上有相对其厚度(2mm)高度(h)为0.03mm的凹口部，则有效光的一部分全反射，射入其它摄像元件11，所以读取图像的可见度下降，为了防止这种现象，在与光路轴平行的不连续区域即台阶状部、倾斜部涂布市售的焊料保护层用的黑墨水适当干燥再使其固化后作为遮光部30。
实施例4
图17表示对本发明实施例2的图13示出的图像传感器的透明板51的不连续区域实施遮光用的透明板。由于有较垂直光稍有倾斜的来自原稿3的反射有效光，如透明板51上有相对其厚度(2mm)高度(h)为0.03mm的凸出部，则部分有效光全反射，射入其它摄像元件，11，故读取图像的可见度下降。为了防止这一现象，和实施3一样地在与光路轴平行的不连续区域即台阶状部、倾斜部涂布市售的焊料保护层用的黑墨水再使其固化作为遮光部30。
实施例5
图18表示取代本发明实施例1示出的有300DPI密度的图像传感器，构成600DPI密度的图像传感器，作为透明板，将实现图11示出的凹口部的透明板5设置在图像传感器上，试验图像再现性的数据。试验和实施例1一样采用以300DPI的密度印刷红·蓝·绿的条状图案，判定半导体芯片边界部图像的再现性。图18表示Lgap为0.1mm时通过将Δh设为最佳值，也能确保良好的画质。还有，本实施例中对用凹口部构成的透明板5作了说明，但采用凸出部代替凹口部构成的透明板51也能得到同样的试验结果。
另外，在透明板5的凹口部或透明板51的凸出部的不连续区域形成遮光部30时，由于对于原稿来的垂直光的受光几乎成为主体，所以600DPI的图像传感器除了可见度外画像的锐度(图像边界部的浓度差)也能够得到改善。
实施例6
图19表示使用设置凹部91a，能使沿本发明实施例1至实施例5所示的图像传感器的壳体9的光路轴安装(载置)的透明板5或透明板51的位置阶梯性变更的壳体91的图像传感器的剖面图。装在图像传感器上的半导体芯片6无论是300DPI的分辨率还是600DPI的分辨率，各半导体芯片6的读取方向上的尺寸都略小于12.8mm，1块半导体芯片6为300DPI时有144个摄像元件(摄像元件间隔约0.084mm)，600DPI时有288个摄像元件(摄像元件间隔约0.042mm)，所以尽管分辨率不同，相邻的半导体芯片6的间隙(间隔)在安装时的制造过程中是相同的。
因此本实施例中，600DPI传感器基板7和300DPI传感器基板7为同一形状，安装位置也相同，但由于必须改变插入光路轴的透明板的位置，所以透明板改变宽度方向的尺寸，为了分别收容这些不同尺寸的透明板，通过将其插入阶梯状设置凹部(91a)的壳体91，从而在300DPI用的传感器基板7的情况下和600DPI用的传感器基板7的情况下都能方便地装入壳体91，故能够得到的效果是，能与摄像元件的分辨率无关地共用壳体91，也能确保高精度的读取品质。
另外，也可以通过在射到透明板的反射光的入射区域外沿读取方向，在透明板上，在直径约0.2mmΦ左右的600DPI分辨率用和300DPI分辨率用的图像传感器之间分别设置多个高度不同的突起，而且在壳体9的规定位置上设置适于这些突起的各个配合孔，代替壳体91的凹部91a，这样也能起到同样的效果。即如图20所示，通过分开使用凸起部高度低的600DPI用的透明板和凸起部的高度稍高的300DPI用透明板52，能改变透明板52和传感器基板7间的距离。还有，在设置凹部91a的壳体91上能用粘结剂将透明板52和壳体9加以固定，但是在凸起设在透明板上的透明板52上能用插入配合形式与壳体9固定在一起。
还有，本实施例中，对于图像传感器分辨率的规格不同的情况阐述了变更透明板与传感器基板间的距离所用的手段，但并不限与此，彩色图像传感器，除了红(RED)、绿(GREEN)、蓝(BLUE)外，由于在纸币判别等用途的情况下重点使用装有红外线光源和紫外线光源的图像传感器，所以也可以使用于调整由于各种光的波长不同产生的图像传感器的共轭长差。
实施例7
实施例1至6中，透明板的凹口部或凸出部沿与原稿的移动方向平行的面由前面部和背面部两块构成，分散在两处设置一对凹口部(图7)或设置一对凸出部(图13)，但再以细分为4块的构成设置两对或两对以上的分散区域也能获得同样的效果。
又如图21所示，因为在将凹口部和凸出部加以组合的透明板53，光向一个方向集中照射，通过将凹口部或凸出部设置在半导体芯片6间隔的两侧的一半导体芯片6边界附近区域，能够使该光集中于另一半导体芯片6的边界摄像元件11e。
本发明实施例1至7的透明板中，将凹口部或凸出部设置在与半导体芯片间隔(Lgap)的摄像元件11的平面附近相当的透明板下表面上，在透明板的厚度薄的时候，凹口部或凸出部设置在透明板上表面也因为能设置在摄像元件11附近，所以也有相应的效果。
另外，本发明实施例1至7所示的图像传感器，透明板采用一体成型的结构，但是也可以将透明板做薄，仅在Lgap附近分散设置。
本发明的实施例1至7所示的图像传感器中，使用折射率(n)约为1.5的塑料材料或钠玻璃材料作为透明体，但是在使折射光急剧弯曲，将来自更远处的折射光向所要的边界摄像元件11e一侧照射的情况下，采用n＝2.0左右的透明的晶体或石英，也有相应的效果。
如上所述，实施例1至7所示的图像传感器由于在相邻的半导体芯片间有大的间隙，即使该区域中没有摄像元件11，也可以用边界摄像元件11e接受来自原稿(例如纸币等)的最初的光，所以能高精度地读取不失真的图像输出。另外，将假想摄像元件作为图像数据插补，由于不会不合规地增加摄像元件数量，所以图像传感器的信号处理也容易。

Claims (5)

1.一种图像传感器，其特征在于，具备
对被拍摄物体照射光的光源；
沿与所述被拍摄物体移动方向成直角的方向延伸，在整个规定的读取宽度上将所述被拍摄物体来的反射光聚焦的透镜；
装有将接收由该透镜聚焦的反射光的多个摄像元件配置成直线设置的多块半导体芯片的传感器基板；
介于所述透镜和传感器基板之间，设在相邻的所述半导体芯片的间隙附近的，具有圆弧面的凹口部及凸出部中至少有其一的透明板；以及
至少收容或支持所述透镜、传感器基板和透明板的壳体。
2.如权利要求1所述的图像传感器，其特征在于，所述透明板在沿与被拍摄物体移动方向平行的面上被分割形成所述凹口部或凸出部。
3.如权利要求1所述的图像传感器，其特征在于，所述透明板被分割形成混合存在的凹口部及凸出部。
4.如权利要求1所述的图像传感器，其特征在于，所述凹口部及/或凸出部的，与光路轴平行的面上具有遮光部。
5.如权利要求1所述的图像传感器，其特征在于，所述壳体能改变所述传感器基板与透明板之间的距离地收容或支持至少所述透镜、传感器基板、及透明板。
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