CN100422365C - ISIC leading wire frame copper tape and its production process - Google Patents
ISIC leading wire frame copper tape and its production process Download PDFInfo
- Publication number
- CN100422365C CN100422365C CNB031498515A CN03149851A CN100422365C CN 100422365 C CN100422365 C CN 100422365C CN B031498515 A CNB031498515 A CN B031498515A CN 03149851 A CN03149851 A CN 03149851A CN 100422365 C CN100422365 C CN 100422365C
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- frame copper
- wire frame
- rolling
- lead frame
- leading wire
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The present invention relates to a leading wire frame copper tape for an LSIC (Large Scale Integrated Circuit). A copper material is used as a base material, and a small quantity of various elements are added; under the condition of keeping definite conductivity, alloy intensity and a comprehensive performance index are improved. Solid solution strengthening and precipitation strengthening principles are utilized to obtain the alloy leading wire frame copper tape material with high strength and high conductivity. The present invention is characterized in that the leading wire frame copper tape is prepared from 96.1 wt% to 98.85 wt% of copper material, 1.0 wt% to 3.5 wt% of nickel, 0.1 wt% to 1.0 wt% of silicon and 0.05 wt% to 0.4 wt% of mixed rare earth raw material as an additive agent, and the rest is unavoidable impurities which are less than or equal to 0.15%. Firstly, an ingot blank is molded, rolled with high accuracy, and is repetitively aged at a temperature of 500 DEG C for 4 hours; then, precision shearing and finished product coiling are carried out for preparing the leading wire frame copper tape.
Description
Technical field:
The present invention relates to the metalworking technology field, particularly a kind of LSIC (large-scale integrated circuit) lead frame copper strip and process for making thereof.
Background technology:
LSIC (large-scale integrated circuit) is on IC integrated circuit lead frame copper strip basis with lead frame copper strip, according to of the different requirements of different unicircuit to the electric conductivity index, the difference of comprehensive mechanical property index request, and the serial copper alloy lead wire frame copper strips of research and development, the product of a kind of continuous upgrading of domestic import substitutes; At present, towards high strength, the development of high conductivity required direction, thereby certainly will requirements at the higher level be proposed to the comprehensive applicable elements of copper base frame material, under the prerequisite that guarantees certain electric conductivity, improving alloy strength is the pressing problem that each manufacturing enterprise and research and development personnel are faced with comprehensive mechanical index.
Summary of the invention:
Purpose of the present invention is exactly in order to satisfy the actual needs of unicircuit manufacturing enterprise, developed a kind of LSIC with lead frame copper strip and process for making thereof, saved foreign exchange, reduced production costs, ensure the quality of products and technical performance index, satisfy the reasonable request of unicircuit manufacturing enterprise.
The present invention adopts following technical scheme, realizes the foregoing invention purpose:
Large-scale integrated circuit lead frame copper strip of the present invention, it is a kind of a small amount of multiple element that in copper product, adds, under the prerequisite that guarantees certain electric conductivity, improve alloy strength and integrated performance index, utilize solution strengthening and precipitation strength principle, reach the alloy lead wire framework copper strips material of high strength, high conductivity; Concrete material component is: according to weight ratio: copper product is 96.1%-98.85%, and nickel is: 1.0%-3.5%, and silicon is: 0.1%-1.0%, mixed rare-earth materials is made additive: 0.05%-0.4%, and impurity inevitably ≯ 0.2%;
Described large-scale integrated circuit is with the process for making of lead frame copper strip, the hot rolling hardening in its manufacture craft flow process, employing be that 900-950 ℃ of hot rolling handled, and online hardening is carried out solution treatment.
Described large-scale integrated circuit is with the process for making of lead frame copper strip, the high-precision rolling processing in its manufacture craft flow process, adopt high-precision rolling-interrupted aging carries out repeatedly; High-precisionly carry out 500 ℃ of 4 hours timeliness after rolling, again through high-precision rolling, 500 ℃ of 4 hours timeliness once more, fully interrupted aging is separated out.
Owing to adopted technical scheme as mentioned above, the present invention has following superiority:
Large-scale integrated circuit of the present invention makes our country save the foreign exchange expenditure with the production of lead frame copper strip, has reduced the cost of each manufacturing enterprise, has guaranteed the enforcement of quality and technical performance index, has satisfied the reasonable request of unicircuit manufacturing enterprise.
Adopt stretch-bending straightening equipment to carry out stretch-bending straightening in the manufacture craft flow process of the present invention, behind stretch-bending straightening, can eliminate the unrelieved stress in the copper strips preferably.
Adopted accurate sub-cut-finished product to batch in the manufacture craft flow process of the present invention, it makes copper strips have good shape and surface quality.
The drawing explanation
Fig. 1 is a LSIC lead frame copper strip manufacture craft schema:
Embodiment one:
Making a kind of specification is the copper alloy lead wire frame copper strips of 0.10mm (thickness) * 32mm (width), at first, and the nickel with 3.2%, 0.75% silicon, 0.3% mixed rare-earth materials is done additive, and 95.7% copper, weigh in proportion respectively, drop in the induction furnace back, in atmosphere furnace temperature is risen to 1300-1350 ℃, treat that metal melts fully after, drop into mixed rare-earth materials and do additive, after fully stirring, make the stokehold chemical analysis, pour into ingot blank after qualified; Adopt antivacuum founding-hot rolling hardening-high-precision rolling-interrupted aging-stretch-bending straightening-accurate sub-cut-finished product such as batches at art breading repeatedly; Its each performance index are: electric conductivity is 44-59.5%IACS, and alloy strength can reach 546-750Mpa, unit elongation 7%, vickers hardness hv 171-260; The hot rolling hardening adopts 900-950 ℃ of hot rolling, and onlinely carries out solution treatment with the normal-temperature water hardening; High-precision rolling after, carried out 500 ℃ of timeliness 4 hours; Finish rolling system once more, 500 ℃ of 4 hours interrupted agings once more, stretch-bending straightening is effectively eliminated unrelieved stress in the copper strips; Batch through accurate sub-cut-finished product again and form; After testing, the copper strips strength of materials reaches 646Mpa, unit elongation 7%, and vickers hardness hv 210, electric conductivity 59.5%IASC can satisfy the reasonable request of large-scale integrated circuit manufacturing enterprise to lead frame copper strip fully.
Claims (4)
1. large-scale integrated circuit lead frame copper strip, with the copper product is base-material, add a small amount of multiple element, under the prerequisite that guarantees certain conductivity, improve alloy strength and integrated performance index, utilize solution strengthening and precipitation strength principle, reach the alloy lead wire framework copper strips material of high strength, high conductivity; It is characterized in that: the concrete material component of described lead frame copper strip is, according to weight ratio: copper product is 96.1%-98.85%, nickel is 1.0%-3.5%, silicon is 0.1%-1.0%, mixed rare-earth materials is additive 0.05%-0.4%, and the impurity of inevitable ≯ 0.2%, adopt antivacuum founding-hot rolling hardening-high-precision rolling-interrupted aging-stretch-bending straightening-accurate sub-cut-finished product batches and forms; Wherein said high-precision rolling-interrupted aging, carry out repeatedly; Each performance index of described lead frame copper strip are: electric conductivity 59.5%IASC, alloy strength 546-750Mpa, unit elongation 7%, vickers hardness hv 171-260.
2. the large-scale integrated circuit as claimed in claim 1 preparation method of lead frame copper strip, it is characterized in that: after this lead frame copper strip is weighed by the material component proportioning, adopt antivacuum founding-hot rolling hardening-high-precision rolling-interrupted aging-stretch-bending straightening-accurate sub-cut-finished product batches and forms; Wherein said high-precision rolling-interrupted aging, carry out repeatedly.
3. preparation method as claimed in claim 2 is characterized in that: described hot rolling hardening, employing be that 900-950 ℃ of hot rolling handled, and online hardening is carried out solution treatment.
4. preparation method as claimed in claim 2 is characterized in that: described high-precision rolling-interrupted aging, carry out repeatedly, be meant and high-precisionly carry out 500 ℃ of 4 hours timeliness after rolling, again through high-precision rolling, 500 ℃ of 4 hours timeliness once more, fully interrupted aging is separated out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031498515A CN100422365C (en) | 2003-07-28 | 2003-07-28 | ISIC leading wire frame copper tape and its production process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031498515A CN100422365C (en) | 2003-07-28 | 2003-07-28 | ISIC leading wire frame copper tape and its production process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1477220A CN1477220A (en) | 2004-02-25 |
| CN100422365C true CN100422365C (en) | 2008-10-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031498515A Expired - Fee Related CN100422365C (en) | 2003-07-28 | 2003-07-28 | ISIC leading wire frame copper tape and its production process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100422365C (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102014207332B4 (en) * | 2014-04-16 | 2016-12-01 | Federal-Mogul Wiesbaden Gmbh | Lead-free CuFe2P bearing material with chipbreaker |
| CN105088010B (en) * | 2015-08-31 | 2017-08-25 | 河南科技大学 | A kind of high-strength highly-conductive rare earth copper zirconium alloy and preparation method thereof |
| CN105154715A (en) * | 2015-09-01 | 2015-12-16 | 洛阳奥瑞特铜业有限公司 | High-performance copper alloy material and preparation method thereof |
| CN107988512A (en) * | 2017-11-30 | 2018-05-04 | 中铝洛阳铜加工有限公司 | A kind of high strength and high flexibility cupro-nickel silicon cobalt system lead frame processing technology |
| CN108057732B (en) * | 2017-12-05 | 2019-11-15 | 中铝洛阳铜加工有限公司 | A kind of preparation method of dispersion-strengthened Cu and oxygen-free copper composite bar |
| CN113755714B (en) * | 2021-06-22 | 2022-08-19 | 上海交通大学 | High-thermal-conductivity copper alloy suitable for casting process and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4466939A (en) * | 1982-10-20 | 1984-08-21 | Poong San Metal Corporation | Process of producing copper-alloy and copper alloy plate used for making electrical or electronic parts |
| CN1114468A (en) * | 1994-06-14 | 1996-01-03 | 冶金工业部长沙矿冶研究院 | Composite material for lead frame |
| CN1417357A (en) * | 2002-11-15 | 2003-05-14 | 清华大学 | High-strength and high-conductivity RE-Cu alloy and its production process |
-
2003
- 2003-07-28 CN CNB031498515A patent/CN100422365C/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4466939A (en) * | 1982-10-20 | 1984-08-21 | Poong San Metal Corporation | Process of producing copper-alloy and copper alloy plate used for making electrical or electronic parts |
| CN1114468A (en) * | 1994-06-14 | 1996-01-03 | 冶金工业部长沙矿冶研究院 | Composite material for lead frame |
| CN1417357A (en) * | 2002-11-15 | 2003-05-14 | 清华大学 | High-strength and high-conductivity RE-Cu alloy and its production process |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1477220A (en) | 2004-02-25 |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081001 Termination date: 20130728 |