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CN100382241C - Exposure apparatus and method for producing device - Google Patents

Exposure apparatus and method for producing device Download PDF

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Publication number
CN100382241C
CN100382241C CNB2003801054193A CN200380105419A CN100382241C CN 100382241 C CN100382241 C CN 100382241C CN B2003801054193 A CNB2003801054193 A CN B2003801054193A CN 200380105419 A CN200380105419 A CN 200380105419A CN 100382241 C CN100382241 C CN 100382241C
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China
Prior art keywords
substrate
liquid
exposure
exposure device
unit
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CN1723537A (en
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马込伸贵
高岩宏明
荒井大
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Nikon Corp
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Nikon Corp
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  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

An exposure system includes an exposure section for irradiating a formed resist film with exposing light through a mask with an immersion liquid provided on the resist film, and a drying section for drying a surface of the resist film after irradiation.

Description

Exposure device and exposure system
Technical field
The present invention relates between projection optical system and substrate at least a portion full of liquid, use the device making method that used liquid is removed device and used this exposure device in the exposure device that substrate exposed by projection optical system institute projected pattern picture, this exposure device.
Background technology
Semiconductor device or liquid crystal display device are to make to photosensitive on-chip, so-called photolithographic method by the pattern transfer that will be formed on the mask.Employed exposure device in this photoetching process operation has the supporting mask platform of mask and the chip bench of bearing substrate, Yi Bian mobile one by one mask platform and chip bench arrive substrate via projection optical system with the pattern transfer of mask.In recent years, wish the further high-resolutionization of projection optical system for the further highly integrated people that adapt to device pattern.The exploring degree of the big more then projection optical system of numerical aperture of the short more or projection optical system of the exposure wavelength that uses is just high more.For this reason, the employed exposure wavelength of exposure device is the short wavelengthization year by year, and the numerical aperture of projection optical system also constantly increases.And though the exposure wavelength of current main-stream is the 248nm of KrF exciplex laser, more the 193nm of short wavelength's ArF exciplex laser also just constantly is practical.In addition, when exposing, also very important with the same depth of focus of exploring degree (DOF).Exploring degree R and depth of focus δ represent with following formula respectively.
R＝k1·λ/NA …(1)
δ＝±k2·λ/NA 2…(2)
Here, λ is an exposure wavelength, and NA is the numerical aperture of projection optical system, and k1, k2 are processing coefficients (process coefficient).As can be known in order to improve exploring degree R, depth of focus δ becomes narrow if make exposure wavelength lambda shorten, make numerical aperture NA to become greatly then according to (1) formula, (2) formula.
If the too narrow substrate surface that makes of depth of focus δ is with respect to the identical difficulty that will become of the image planes of projection optical system, the tolerance limit during exposure actions (margin) probably will be not enough.Thereby the method as shortening the exposure wavelength and the expansion depth of focus has in fact for example proposed No. 99/49504 disclosed immersion method of communique of international publication.This immersion method is that liquid such as water or organic solvent is full of below projection optical system and between the substrate surface, utilizing the exposure light wavelength in the liquid is that airborne 1/n (n is that liquid refractive index is generally about 1.2～1.6) this point is improved the exploring degree, simultaneously the depth of focus is enlarged the doubly such method of about n.
, state immersion method in the use and substrate is carried out under the situation of exposure-processed, situation about understanding after exposure-processed at the surperficial remaining liquid of substrate is arranged.If carry out conveyance in that this remaining liquid is attached under the state of substrate, then liquid falls from substrate in conveyance, because of the liquid that is fallen makes each device of conveyance path periphery or parts get rusty, the bad situations such as cleannes that can't keep the environment that disposes exposure device will take place.Perhaps, also has the situation that causes the environmental change (humidity variation) of exposure device periphery because of the liquid that is fallen.Then for example will produce fluctuating in the air on the light path of used interference of light meter in operating position is measured if the humidity variation takes place, operating position is measured and just can precision not carried out well, and produces the problem that does not obtain desirable pattern transfer precision and so on.In addition, if carry out for example development treatment, then can produce the misgivings that can not produce device in that liquid is attached under the state of substrate with desirable performance.
Summary of the invention
The present invention finishes in view of such situation, its objective is provides a kind of when full of liquid carries out exposure-processed between projection optical system and the substrate, the device of the deterioration of the device of the liquid that can suppress to result to be attached to substrate after exposure, the device making method of having assembled the exposure device of this device and having used this exposure device.
In order to solve above-mentioned problem, the present invention adopts the following formation corresponding with Fig. 1～Figure 15 shown in the execution mode.Wherein, be attached to parenthesized the symbol only example of this key element, the not intention that each key element is limited on each key element.
According to the 1st technical scheme of the present invention, provide a kind of and be transferred to pattern image on the substrate and, possess: the projection optical system that pattern image is projected to substrate the exposure device that substrate exposes via liquid; The fluid supply unit of feed fluid in to the process of substrate exposure; In to the process of substrate exposure, reclaim from the liquids recovery unit of the liquid of aforesaid liquid feed unit supply; And will expose the substrate conveyance by the connecting portion that is connected to processing unit to the above-mentioned processing unit, do not remove and reclaimed the unit recovery by aforesaid liquid, the liquid that remains in the liquid on the above-mentioned substrate surface that exposed is removed the unit, and wherein above-mentioned processing unit is used for handling the above-mentioned substrate that exposed after the substrate exposure is finished.
According to the present invention, remove device owing to be arranged on the liquid that conveyance removes before the liquid that is attached to substrate to the processing unit that the substrate of having implemented exposure-processed is carried out predetermined processing, so can under the state of having removed liquid, carry out predetermined process to substrate.Thereby, can make device with desirable performance.
According to the 2nd technical scheme of the present invention, a kind of exposure device (SYS, EX) is provided, it is via liquid (50) pattern image to be transferred on the substrate (P) and to the exposure device (EX) that substrate (P) exposes, and possesses: the projection optical system (PL) that pattern image is projected to substrate (P); Remove the liquid of the liquid (50) that is attached to the substrate (P) that has been exposed and remove device (100,22,33,34); Substrate (P) conveyance that has been exposed is removed the 1st conveyance member (H2,43) of device (100,22,33,34) to liquid; And will be remove device (100,22,33,34) and remove the substrate (P) of liquid (50) and remove the 2nd conveyance member (H2,43) that device (100,22,33,34) carries out conveyance from liquid by liquid.
According to the present invention, remove device owing to be arranged on the liquid of removing the liquid of the exposure usefulness that is attached to substrate after the exposure of substrate, fall and cause the generation of bad situation such as environmental change from substrate so can be suppressed at liquid in the substrate conveyance.In this case, just can will utilize immersion method to carry out exposure-processed and the substrate conveyance that is attached with liquid is removed device to liquid by the 1st conveyance member.Then, removed the substrate of liquid and use 2nd conveyance member different to carry out conveyance with the 1st conveyance member by removing device by liquid, just can be with the position of this substrate conveyance under the state of non-cohesive liquid on the substrate to regulation.In addition, in the present invention, its surperficial at least a portion of preferably above-mentioned the 1st conveyance member is anti-fluidity (repulsion liquid: liquid-repellent).
According to the 3rd technical scheme of the present invention, a kind of exposure device (SYS, EX) is provided, it is via liquid (50) pattern image to be transferred on the substrate (P) and to the exposure device (EX) that substrate (P) exposes, and possesses: the projection optical system (PL) that pattern image is projected to substrate (P); The substrate (P) that has been exposed is carried out the conveyer (H) of conveyance; And be arranged at the conveyance path of substrate (P), the liquid of removing the liquid (50) that is attached to substrate (P) is removed device (100,22,33,34), wherein, liquid is removed device (100,22,33,34) and is had covering substrate (P) at least a portion on every side to prevent carrying out liquid (50) the lid shell that liquid (50) splashes when removing (25,30,40).
According to the present invention, because being set, the liquid of the liquid of removing the exposure usefulness that is attached to substrate removes device in the way in the conveyance path of the conveyer of conveyance substrate, so the liquid that can utilize the exposure-processed of exposure device (exposure device body) simultaneously and utilize liquid in the way that is arranged at the conveyance path to remove device is removed processing.Thereby, can not can make production capacity reduce ground and carry out each processing.In the case, because liquid removes device and has the lid shell mechanism that prevents liquid splash, so can prevent that liquid splash is around the conveyance path.Thereby, just can prevent the generation that environmental changes such as humidity variation or device get rusty etc.In addition, in the present invention, preferably above-mentioned lid shell mechanism comprises chamber.
In the exposure device of above-mentioned the 1st～3 technical scheme, preferably aforesaid liquid is removed device and is had the decontaminating apparatus that the substrate after the above-mentioned exposure is cleaned, and after utilizing above-mentioned decontaminating apparatus that above-mentioned substrate is cleaned, removes the detergent remover that is attached to above-mentioned substrate.
According to the 4th technical scheme of the present invention, provide a kind of exposure device (SYS, EX) it be pattern image is transferred to that substrate (P) is gone up and, possesses: the projection optical system (PL) that pattern image is projected to substrate (P) to the exposure device (EX) that substrate (P) exposes via liquid (50); The chip bench (PST) that keeps substrate (P); And, remove the liquid of the liquid (50) that is attached to substrate (P) and remove device (22) taking out of the substrate (P) that has been exposed from chip bench (PST) before.
According to the present invention,, just can be suppressed at the generation of the bad situation that liquid in the conveyance of substrate falls and so on from substrate by substrate was being removed the liquid that is attached to substrate before the chip bench that carries out exposure-processed is taken out of.
In the exposure device of above-mentioned the 1st～4 technical scheme, also can be after above-mentioned exposure, the substrate that is attached with aforesaid liquid with respect to the horizontal plane carries out conveyance with predetermined angular.In addition, aforesaid liquid remove device can be by blowing away (blowing off), sucking (suction) and/or dry (drying) remove above-mentioned on-chip liquid.
According to the 5th technical scheme of the present invention, a kind of exposure device (SYS, EX) is provided, it is via liquid (50) pattern image to be transferred on the substrate (P) and to the exposure device (EX) that substrate (P) exposes, and possesses: the projection optical system (PL) that pattern image is projected to substrate (P); The substrate (P) that has been exposed is carried out the conveyer (H) of conveyance; And the liquid handling mechanism that handles the liquid (50) that the substrate (P) after the exposure falls at least a portion under the conveyance path of substrate (P).
According to the present invention, with the substrate after the conveyer conveyance exposure time, even liquid attached on the substrate, by with liquid handling mechanism the liquid that falls from substrate being handled, just can prevent that liquid splash is around the conveyance path in conveyance.Thereby, just can prevent the generation of getting rusty of environmental changes such as humidity variation or device etc.The aforesaid liquid processing mechanism can be made of channel parts that is configured at least a portion under the above-mentioned conveyance path and the output mechanism of discharging via the liquid that this channel parts reclaimed.
According to the 6th technical scheme of the present invention, a kind of exposure device (EX) is provided, it is via liquid (50) pattern image to be transferred on the substrate (P) and to the exposure device (EX) that substrate (P) exposes, and possesses: the projection optical system (PL) that pattern image is projected to substrate (P); And substrate (P) taken out of to the processing unit (C/D) of handling the substrate (P) be exposed before, the decontaminating apparatus (150) that the substrate (P) that has been exposed is clean.
According to the present invention, just can with in immersion exposure or the foreign matter etc. that is attached to substrate surface in the conveyance of substrate after the exposure wash off, can send clean substrate.Particularly, be liquid, for example beyond the water at the used liquid of immersion exposure, under the situation of the liquid of red deal oil or fluorine family wet goods organic system, for not to after substrate handle and bring influence to wish in advance such liquid to be removed with decontaminating apparatus.
According to the 7th technical scheme of the present invention, a kind of exposure device (SYS, EX) is provided, it is via liquid (50) pattern image to be transferred on the substrate (P) and to the exposure device (EX) that substrate (P) exposes, and possesses: the projection optical system (PL) that pattern image is projected to substrate (P); The substrate (P) that is attached with liquid is carried out the 1st conveyance member (H2,43) of conveyance; And the 2nd conveyance member (H1, H3,44) that the substrate of attaching liq (P) is not carried out conveyance.
According to the present invention, owing to distinguish to use the substrate that is attached with liquid is carried out the 1st conveyance member of conveyance and the 2nd conveyance member that the substrate of attaching liq is not carried out conveyance, so just can prevent that liquid is attached to the 2nd conveyance member or liquid and is attached to substrate with the conveyance of the 2nd conveyance member institute, and can suppress liquid diffusion, splash.
According to the 8th technical scheme of the present invention, a kind of exposure device (SYS is provided, EX), it is to go up the exposure device (EX) of irradiation exposure light so that substrate (P) is exposed via liquid (50) at substrate (P), possesses: keep movably the 1st holding member (PST1) of substrate; Keep movably the 2nd holding member (PST2) of substrate; And when the substrate that above-mentioned the 1st holding member is kept is just exposing, be attached to the liquid of removing that above-mentioned the 2nd holding member is kept, that finish the liquid of the substrate that exposes and remove device (100,30).
According to the present invention, remove at least a portion of processing by the liquid of the substrate after the exposure that is kept on parallel exposure-processed of carrying out the substrate that kept on the holding member and another holding member, just can suppress to follow liquid remove processing device production capacity lowly.
According to the 9th technical scheme of the present invention, provide a kind of and upward and to the liquid that the exposure device (EX) that substrate (P) exposes uses remove device (100), possess: the maintaining part (21,36,43) of the substrate (P) that maintenance has been exposed with pattern image being transferred to substrate (P) via liquid (50); And the liquid of removing the liquid (50) that is present in the exposure usefulness on the substrate (P) is removed mechanism (22,33,34,37,38).
According to the 10th technical scheme of the present invention, provide a kind of exposure system to possess: exposure device of the present invention and the processing unit that the substrate that has exposed is handled.Above-mentioned processing unit be included in the applying device (coating unit) of coating photosensitive material on the base material of substrate and developing apparatus that the substrate that has been exposed is developed at least one.
In the present invention, provide so that be the device making method of feature with the exposure device of technique scheme.According to the present invention since the variation of the exposure-processed environment of the liquid that can suppress to result to be attached to substrate or bring exposure-processed after the influence of predetermined process (development treatment etc.) of substrate, so can make device with desirable performance.
Description of drawings
Fig. 1 is the summary pie graph of expression as an execution mode of the device manufacturing system of exposure device of the present invention.
Fig. 2 is the figure that watches Fig. 1 from the top.
Fig. 3 is the summary pie graph of an execution mode that the exposure device body of exposure-processed is carried out in expression.
Fig. 4 is expression supply nozzle and the figure that reclaims the configuration example of nozzle.
Fig. 5 is the summary pie graph that expression liquid related to the present invention is removed an execution mode of device.
Fig. 6 is the summary pie graph that expression liquid related to the present invention is removed other execution modes of device.
It (b) is the summary pie graph that expression liquid related to the present invention is removed other execution modes of device that Fig. 7 (a) reaches.
Fig. 8 is the summary pie graph that expression liquid related to the present invention is removed other execution modes of device.
Fig. 9 is the summary pie graph that expression liquid related to the present invention is removed other execution modes of device.
Figure 10 is the summary pie graph that expression liquid related to the present invention is removed other execution modes of device.
Figure 11 is the summary pie graph that expression liquid related to the present invention is removed other execution modes of device.
Figure 12 is the summary pie graph that expression liquid related to the present invention is removed other execution modes of device.
Figure 13 is the summary pie graph of expression as other execution modes of the device manufacturing system of exposure device of the present invention.
Figure 14 is the summary pie graph of expression as other execution modes of the device manufacturing system of exposure device of the present invention.
Figure 15 is the flow chart of Ah one of the manufacturing process example of expression semiconductor device.
Embodiment
The 1st execution mode
Below, with reference to accompanying drawing on one side with regard to of the present invention exposure device and device making method describe on one side.Fig. 1 is the figure, the summary pie graph of watching from the side of an execution mode of the device manufacturing system of expression with exposure device of the present invention, and Fig. 2 is the figure that watches Fig. 1 from the top.
In Fig. 1, Fig. 2, device manufacturing system SYS has exposure device EX-SYS, applicator developer device C/D-SYS.Exposure device EX-SYS has: the interface portion IF of the connecting portion of formation and applicator developer device C/D-SYS, to be full of with liquid 50 between projection optical system PL and the substrate P, the exposure device body EX that pattern image is projected to that substrate P goes up and substrate P is exposed via projection optical system PL and liquid 50, the conveyer H of conveyance substrate P between interface portion IF and exposure device body EX, be arranged in the way in conveyance path of conveyer H, the liquid of removing the liquid that is attached to the substrate P after the exposure-processed is removed device 100 and is all together the control device CONT of all actions of control exposure device EX-SYS.Applicator developer device C/D-SYS has: to the applying device C of the base material coating photoresist (emulsion) that carries out the substrate P before the exposure-processed with to carry out developing apparatus (processing unit) D of development treatment through the substrate P after the exposure-processed in exposure device body EX.Exposure device body EX is configured in the 1st chamber device CH1 inside of cleannes having been carried out management.On the other hand, applying device C and developing apparatus D are configured in the 2nd chamber device CH2 inside different with the 1st chamber device CH1.Then, the 1st chamber device CH1 that accommodates exposure device body EX couples together via interface portion IF with the 2nd chamber device CH2 that accommodates applying device C and developing apparatus D.Here, in the following description, the applying device C and suitable altogether be referred to as " the applicator developer body C/D " of developing apparatus D of the 2nd chamber device CH2 inside will be housed in.
As shown in Figure 1, exposure device body EX has: the lamp optical system IL that the mask M that mask platform MST is supported with exposure light EL throws light on, to project to the projection optical system PL on the substrate P with the pattern image of the mask M after the exposure light EL illumination, and the chip bench PST of bearing substrate P.Exposure device body EX in the present embodiment adopts the so-called double-workbench system with 2 chip bench PST1, PST2.Concrete formation as the double-workbench system, at the flat 10-163099 communique of Japan Patent Publication Laid-Open, the flat 10-214783 communique of Japan Patent Publication Laid-Open, special table 2000-505958 communique, United States Patent (USP) 6,341, No. 007,6,400, No. 441,6,549, No. 269 and 6,590, wait in the document for No. 634 to disclose, can be with reference to these documents.Home in the scope that is allowed in the decree of the specified or selected country of border application, quote these United States Patent (USP)s and as a part described herein.In the present invention, can adopt disclosed double-workbench system in the above-mentioned document.In addition, the exposure device body EX in the present embodiment is on one side going up mask M scanning exposure apparatus (so-called scanning one by one portable exposure device) that formed pattern on substrate P expose towards the mutual different direction (contrary direction) on the scanning direction with moved further with substrate P with mask M on one side.In the following description, be located at that the synchronous moving direction (scanning direction) of mask M and substrate P is X-direction in the horizontal plane, be located at horizontal plane interior be Y direction (non-scanning direction) with the direction of X-direction quadrature, to establish perpendicular to the consistent direction of the optical axis AX of X-axis and Y direction and projection optical system PL be Z-direction.In addition, will be made as θ X, θ Y and θ Z direction around the direction of X-axis, Y-axis and Z axle respectively.In addition, said here " substrate " is included in the situation that has applied resist on the semiconductor wafer, and " mask " is included in the netting twine (reticle) that forms on the substrate through the equipment pattern of reduced projection.
Conveyer H has: will carry out the 1st carrying device H1 that exposure-processed substrate P before moves into (loading) chip bench PST, will through the substrate P after the exposure-processed from chip bench PST take out of (unloading), conveyance to liquid is removed the 2nd carrying device H2 of device 100, and removes the 3rd carrying device H3 of conveyance substrate P between device 100 and the interface portion IF at liquid.1st, the 2nd, the 3rd carrying device H1, H2, H3 are arranged on the 1st chamber device CH1 inside.The substrate P that has implemented the coating processing of photoresist with applicator developer body C/D (applying device C) gives the 3rd carrying device H3 via interface portion IF.Here, the baffle plate that is provided with peristome and this peristome is opened and closed in part with the 1st, the 2nd chamber device CH1, CH2 interface portion IF opposite separately.In the conveyance action for interface portion IF of substrate P, baffle plate is by opening.The 3rd carrying device H3 removes the substrate P that device 100 will carry out before the exposure-processed via liquid and gives the 1st carrying device H1.In addition, when giving the 1st carrying device H1 from the 3rd carrying device H3, can not remove device 100 yet but give the 1st carrying device H1 via other not shown carrying devices or relay via liquid with substrate P.The 1st carrying device H1 is loaded into the substrate P that is sent here the chip bench PST of exposure device body EX.Unload from chip bench PST by the 2nd carrying device H2 through the substrate P after the exposure-processed.Substrate P after the 2nd carrying device H2 removes device 100 and will unload via liquid gives the 3rd carrying device H3.Substrate P with the conveyance of the 3rd carrying device H3 institute is transported to applicator developer body C/D (developing apparatus D) via interface portion IF.Developing apparatus D implements development treatment to the substrate P that is sent here.
In addition, because the 2nd carrying device H2 that the substrate P of the possibility of distinguish using the substrate P that does not soak that will carry out before the exposure-processed to move into the 1st carrying device H1 of chip bench PST and will soaking through having after the exposure-processed takes out of from chip bench PST, be attached to back side with the substrate P of the 1st carrying device H1 institute conveyance etc. so can prevent liquid, and can be at the last attaching liq of the 1st carrying device (conveyance member) H1.
Fig. 3 is the summary pie graph of exposure device body EX.Lamp optical system IL throws light on to the mask M that mask platform MST is supported with exposure light EL, have exposure light source, make the illumination homogenization of the light beam that penetrates from exposure light source the optics integrator, to condenser, the relay lens system of carrying out optically focused from the exposure light EL of optics integrator, will utilize the light EL that exposes mask M on the field of illumination set the variable field of view aperture etc. of slit-shaped for.Thrown light on the exposure light EL of the Illumination Distribution of homogeneous by lamp optical system IL in regulation field of illumination on the mask M.As the exposure light EL that penetrates from lamp optical system IL, for example use to swash and penetrate light (wavelength 248nm) extreme ultraviolet light (DUV light) of etc.ing from the bright line (g line, h line, i line) of the ultra-violet (UV) band that mercury vapor lamp penetrates and KrF exciplex, or sharp light (wavelength 193nm) and the F of penetrating of ArF exciplex 2Swash and penetrate light (wavelength 157nm) equal vacuum ultraviolet light (VUV light) etc.In the present embodiment, use the ArF exciplex to swash and penetrate light.
Mask platform MST supports mask M, can be in the plane perpendicular to the optical axis AX of projection optical system PL, be to carry out 2 dimensions in the XY plane to move and can carry out small rotation along θ Z direction.Mask platform MST is driven by mask platform drive unit MSTD such as linear motors.Mask platform drive unit MSTD is controlled by control device CONT.The position and the anglec of rotation of the 2 dimension directions of the mask M on the mask platform MST are measured in real time by laser interferometer, and measurement result is output to control device CONT.Control device CONT drives the location of carrying out the mask M that mask platform MST supported thus based on the measurement result of laser interferometer to mask platform drive unit MSTD.
To be PL carry out projection exposure with the pattern of mask M with the projection multiplying power β of regulation to projection optics on substrate P, is made of a plurality of optical elements (lens), and these optical elements are supported by lens barrel (barrel) PK as metal parts.In the present embodiment, projection optical system PL is that projection multiplying power β is for example 1/4 or 1/5 reduction system.In addition, projection optical system PL waits some in times system and the expansion system, also can use speculum to constitute.In addition, in the front (substrate P side) of the projection optical system PL of present embodiment, optical element (lens) 60 exposes from lens barrel PK.This optical element 60 is provided with respect to lens barrel PK is detachable (replacing).
Chip bench PST supporting substrate P possesses the Z workbench 51 that keeps substrate P via substrate holder, the XY worktable 52 of supporting Z workbench 51, and the pedestal 53 of supporting XY worktable 52.Chip bench PST is driven by chip bench drive unit PSTD such as linear motors.Chip bench drive unit PSTD is controlled by control device CONT.Control position on position (focal position) on the Z-direction of the substrate P that Z workbench 51 kept and θ X, the θ Y direction by driving Z workbench 51.In addition, control position on the XY direction of substrate P (with the position of the parallel in fact direction of the image planes of projection optical system PL) by driving XY worktable 52.Promptly, the focal position of 51 couples of substrate P of Z workbench and inclination angle are controlled in automatic focus (auto-focus) mode and (auto-leveling) mode of automatically adjusting merges to the image planes of projection optical system PL with the surface of substrate P, and XY worktable 52 is carried out the X-direction of substrate P and the location on the Y direction.In addition, self-evidently also Z workbench and XY worktable can be provided with integratedly.
Chip bench PST (Z workbench 51) is provided with moving lens 54.In addition, be provided with laser interferometer 55 in the position relative with moving lens 54.The position and the anglec of rotation of the 2 dimension directions of the substrate P on the chip bench PST are measured in real time by laser interferometer 55, and measurement result is output to control device CONT.Control device CONT drives the location of carrying out the substrate P that supported on the chip bench PST thus based on the measurement result of laser interferometer 55 to chip bench drive unit PSTD.
In the present embodiment, for exposure wavelength essence is shortened to improve the exploring degree,, and be suitable for immersion method simultaneously with the expansion of depth of focus essence.For this reason, at least the pattern image with mask M be transferred on the substrate P during, the front end face of the optical element (lens) 60 of the substrate P side of the surface of substrate P and projection optical system PL (below) be full of the liquid 50 of regulation between 7.As described above, the front lens 60 that constitute at projection optical system PL expose, and liquid 50 only contacts with lens 60.Thus, just can prevent the corrosion etc. of the lens barrel PK that forms by metal.In the present embodiment, on liquid 50, use pure water.Pure water not only swashs at the ArF exciplex penetrates light, for example is made as from the bright line (g line, h line, i line) of the ultra-violet (UV) band that mercury vapor lamp penetrates and KrF exciplex at the light EL that will expose and also can sees through this exposure light EL under the sharp situation of penetrating light extreme ultraviolet lights (DUV light) such as (wavelength 248nm).
Exposure device EX has the liquid withdrawal system 2 to the liquid 50 in the fluid Supplying apparatus 1 of the liquid 50 of the 56 supply regulations of the space between the front end face of projection optical system PL (front end faces of lens 60) 7 and the substrate P and recovery space 56.Fluid Supplying apparatus 1 is used at least a portion between projection optical system PL and the substrate P is full of with liquid 50, has the container of accommodating liquid 50, force (forcing) pump etc.On fluid Supplying apparatus 1, connect an end of supply pipe 3, connecting supply nozzle 4 in the other end of supply pipe 3.Fluid Supplying apparatus 1 is via supply pipe 3 and 4 pairs of spaces of supply nozzle, 56 feed fluids 50.
Liquid withdrawal system 2 has the container of the liquid 50 that suction pump, collecting post reclaim etc.On liquid withdrawal system 2, connecting an end of recovery tube 6, connecting recovery nozzle 5 in the other end of recovery tube 6.Liquid withdrawal system 2 reclaims via the liquid 50 that reclaims nozzle 5 and 6 pairs of spaces 56 of recovery tube.When to space 56 fulls of liquid 50, control device CONT drives fluid Supplying apparatus 1, space 56 is supplied with the liquid 50 of ormal weight via supply pipe 3 and supply nozzle 4 time per units, drive liquid withdrawal system 2 simultaneously, via the liquid 50 that reclaims nozzle 5 and recovery tube 6 time per units 56 recovery ormal weights from the space.Thus, keeping liquid 50 at the front end face 7 of projection optical system PL and the space 56 between the substrate P.
60 its leading section 60A of lens bottom of projection optical system PL only remain necessary part and elongated rectangular and form in Y direction (non-scanning direction) in the scanning direction.A part of pattern image of mask M is projected to the rectangular projection region under the front end face 60A when scan exposure, move with speed V at-directions X (perhaps+directions X) with respect to projection optical system PL mask M, synchronised makes substrate P move with speed β V (β is the projection multiplying power) at+directions X (perhaps-directions X) via XY worktable 52 therewith.Then, behind the end exposure to a shooting area, the stepping by substrate P makes next shooting area move to the scanning starting position, below, carry out exposure-processed successively in step-scan (step-and-scan) mode for each shooting area.In the present embodiment, the moving direction that is parallel to substrate P flows through liquid 50 in the same direction with the moving direction of substrate and sets like this.
Fig. 4 is the leading section 60A of the lens 60 of expression projection optical system PL, at the supply nozzle 4 of X-direction feed fluid 50 (4A～4C) and the figure of the position of the recovery nozzle 5 of withdrawal liquid 50 (5A, 5B) relation.In Fig. 4, the front end face 60A of lens 60 is shaped as at the elongated rectangle of Y direction, at 3 supply nozzle 4A～4C of+directions X side configuration, reclaim nozzle 5A, 5B so that clip the leading section 60A of the lens 60 of projection optical system PL in X-direction in-2 of directions X side configurations.Then, supply nozzle 4A～4C is connected to fluid Supplying apparatus 1 via supply pipe 3, reclaims nozzle 5A, 5B and is connected to liquid withdrawal system 2 via recovery tube 4.In addition, supply nozzle 4A～4C supply nozzle 8A～8C and reclaiming nozzle 9A, 9B with the position configuration that nozzle 5A, the 5B center with respect to leading section 60A of reclaiming has roughly rotated 180 °.Supply nozzle 4A～4C and recovery nozzle 9A, 9B arrange on Y direction alternately, supply nozzle 8A～8C and recovery nozzle 5A, 5B arrange on Y direction alternately, supply nozzle 8A～8C is connected to fluid Supplying apparatus 1 via supply pipe 10, reclaims nozzle 9A, 9B and is connected to liquid withdrawal system 2 via recovery tube 11.In addition, carry out supplying with so that between projection optical system PL and substrate P, the gas part does not take place from the liquid of nozzle.
In exposure device body EX, towards the scanning direction (directions X) shown in the arrow Xa (with reference to Fig. 4) substrate P is moved under the situation of carrying out scan exposure, use supply pipe 3, supply nozzle 4A～4C, recovery tube 4 and reclaim nozzle 5A, 5B, carry out the supply and the recovery of liquid 50 by means of fluid Supplying apparatus 1 and liquid withdrawal system 2.Promptly, when substrate P court-directions X moves, (4A～4C) liquid 50 is fed between projection optical system PL and the substrate P from fluid Supplying apparatus 1 via supply pipe 3 and supply nozzle 4, simultaneously be recycled to liquid withdrawal system 2, flow at-directions X in order to be full of between lens 60 and the substrate P liquid 50 via reclaiming nozzle 5 (5A, 5B) and recovery tube 6 liquid 50.On the other hand, towards the scanning direction (+directions X) shown in the arrow Xb substrate P is moved under the situation of carrying out scan exposure, use supply pipe 10, supply nozzle 8A～8C, recovery tube 11 and reclaim nozzle 9A, 9B, carry out the supply and the recovery of liquid 50 by means of fluid Supplying apparatus 1 and liquid withdrawal system 2.Promptly, when substrate P court+directions X moves, (8A～8C) liquid 50 is supplied between projection optical system PL and the substrate P from fluid Supplying apparatus 1 via supply pipe 10 and supply nozzle 8, simultaneously be recycled to liquid withdrawal system 2, flow at+directions X in order to be full of between lens 60 and the substrate P liquid 50 via reclaiming nozzle 9 (9A, 9B) and recovery tube 11 liquid 50.Like this, control device CONT use fluid Supplying apparatus 1 and liquid withdrawal system 2 flow through liquid 50 along the moving direction of substrate P.In this case, the liquid of being supplied with via supply nozzle 4 from fluid Supplying apparatus 1 50 for example, since follow to substrate P-the mobile space 56 that is introduced into of directions X flows like this, so also liquid 50 easily can be supplied with space 56 even if the energize of fluid Supplying apparatus 1 is less.And, by switch the direction that liquid 50 is flowed according to the scanning direction, edge+directions X or-can both be full of with liquid 50 between the front end face 7 and substrate P of lens 60 under the situation of directions X either direction scanning substrate P, and can obtain the higher exploring degree and the wider depth of focus.
Then, on one side with reference to Fig. 5 on one side in the exposure device with regard to the 1st execution mode used liquid remove device 100 and describe.Liquid remove device 100 be arranged in the way in conveyance path of conveyer H, will be owing to immersion method attached to removing through the P liquid 50 of the substrate after the exposure-processed.In the present embodiment, liquid is removed device 100 and is set between the 2nd carrying device H2 and the 3rd carrying device H3.Liquid is removed device 100 and is had table device 20, is arranged at table device 20, keeps the cradle portion 21 of following central portion of substrate P and the rotating mechanism 22 that the cradle portion (holder) 21 that keeps substrate P is rotated.The vacuum suction hole of a part that keeps vacuum plant is being set on cradle portion 21, and cradle portion 21 absorption keep the following central portion of substrate P.Rotating mechanism 22 is made of the motor that is arranged at table device 20 inside, by making axial region 23 rotations that are connected to cradle portion 21 cradle portion 21 is rotated.And table device 20, cradle portion 21 and rotating mechanism 22 are set at chamber 25 inside as lid shell mechanism, are provided with liquid attracting device (liquid-sucking) 29 via stream 28 in chamber 25.Stream 28 is provided with valve 28A.
Cradle portion 21 liftably is provided with respect to the top of table device 20 with axial region (shaft) 23.When the cradle portion 21 that keeps substrate P rose with respect to table device 20, substrate P left from table device 20, can be rotated by means of the driving of rotating mechanism 22.On the other hand, substrate P is kept by the 2nd cradle portion 24 that is arranged at above the table device 20 when cradle portion 21 descends.
Chamber 25 has the 1st peristome 26 that is formed at the 2nd carrying device H2 side and the 2nd peristome 27 that is formed at the 3rd carrying device H3 side.The 1st peristome 26 is provided with the 1st baffle plate 26A that the 1st peristome 26 is opened and closed, and the 2nd peristome 27 is provided with the 2nd baffle plate 27A that the 2nd peristome 27 is opened and closed.1st, the on-off action of the 2nd baffle plate 26A, 27A is controlled by control device CONT.If the 1st baffle plate 26A can be removed the table device 20 of device 100 via the 1st peristome 26 visit liquid by open then the 2nd carrying device H2.That is, the 2nd carrying device H2 can carry out conveyance (moving into) with the table device 20 that substrate P removes device 100 to liquid via the 1st peristome 26.The 3rd carrying device H3 removes the table device 20 of device 100 via the 2nd peristome 27 addressable liquid.That is, the 3rd carrying device H3 can carry out conveyance (taking out of) with the table device 20 that substrate P removes device 100 to liquid via the 2nd peristome 27.On the other hand, by being closed, the 1st, the 2nd baffle plate 26A, 27A make chamber 25 inner sealings.
Then, utilizing Fig. 1 and Fig. 2 just to possess above-mentioned exposure device body EX and liquid removes the action of the device manufacturing system SYS of device 100 and describes.
In exposure device body EX, the substrate P that is kept on the chip bench PST1 utilizes immersion method to expose, with its parallel substrate P, carry out the detection of alignment mark or the measurement of surface information (AF (automatic focus)/AL (adjusting automatically) information) to being kept on the chip bench PST2.Fig. 1 represents that chip bench PST1 carries out exposure actions in exposure device body (exposure position) EX, and chip bench PST2 measures the situation of action on the measuring position.In the exposure device body, carry out the liquid supply of fluid Supplying apparatus 1 and the liquids recovery of liquid withdrawal system 2, the light path of the exposure light of the image planes side of projection optical system PL is full of with liquid 50.If the exposure-processed of the substrate P that is kept on the chip bench PST1 is finished, then the liquid of stop liquid feedway 1 is supplied with, and carries out liquids recovery by liquid withdrawal system 2.If utilize the liquids recovery of liquid withdrawal system 2 to finish, then chip bench PST1 keeps out of the way from exposure device body EX, and the chip bench PST2 that has finished various measurements simultaneously is placed into exposure device body (exposure position) EX.The substrate P of the exposure-processed that is through with on chip bench PST1 is loaded onto the 2nd carrying device H2 by means of chip bench PST1.The chip bench PST1 of the substrate P unloading after the exposure-processed that is through with accepts unexposed substrate P from the 1st carrying device H1, the various measurements on the beginning measuring position.On the substrate P that the 2nd carrying device H2 is unloaded, be attached with a little, remove device 100 to liquid by the 2nd carrying device H2 conveyance not by liquid withdrawal system 2 liquid 50 that is over that reclaims.Like this, carry out the exposure-processed of the substrate P that chip bench PST2 kept and the various measurements that chip bench PST1 protects the unexposed substrate P that treats side by side, and with liquid remove device 100 carry out on tight front is through with the substrate P of exposure-processed the removing of residual liquid.
In addition, on the substrate P that chip bench PST2 is kept when the fluid Supplying apparatus 1 beginning feed fluid, do not carry out the measurement action of essence at chip bench PST1, but only carry out moving of chip bench PST1, chip bench PST1 is stopped to good.By handling like this, just can prevent that on chip bench PST2 the vibration that produced brings influence to the measurement action of the chip bench PST1 the measuring position when fluid Supplying apparatus 1 beginning liquid is supplied with.In addition, when stopping on chip bench PST2 feed fluid, under the still unclosed situation of measurement action of chip bench PST1 on the measuring position, also can be when stop liquid be supplied with, do not carry out the measurement action of essence at chip bench PST1, but only carry out moving of chip bench PST1, chip bench PST1 is stopped.
Control device CONT is accompanied by the liquid of the 2nd carrying device H2 is removed the approaching with the 1st baffle plate 26A open (with reference to Fig. 5) of device 100.At this moment, the 2nd baffle plate 27A closes.The 2nd carrying device H2 gives the table device 20 that liquid is removed device 100 via the 1st peristome 26 with substrate P.At this moment, cradle portion 21 descends, and substrate P is held in cradle portion 21 and the 2nd cradle portion 24 on the table device 20.
In case substrate P is delivered to table device 20, the 2 carrying device H2 just to be kept out of the way from chamber 25 via the 1st peristome 26.If the 2nd carrying device H2 keeps out of the way then control device CONT closes the 1st baffle plate 26A from chamber 25.Thus, chamber 25 is inner sealed.If chamber 25 is inner sealed, then control device CONT rises cradle portion 21.When cradle portion 21 rose, the substrate P that absorption remains in this cradle portion 21 also rose with respect to table device 20.Then, control device CONT drives rotating mechanism 22, and cradle portion 21 is rotated towards θ Z direction with substrate P.Make substrate P rotation by rotating mechanism 22, just disperse from substrate P by means of action of centrifugal force attached to the liquid 50 of the upper and lower surface of substrate P.Thus, just remove attached to the liquid 50 of substrate P from substrate P.Here, because substrate P is configured in chamber 25 inside as lid shell mechanism, so around the liquid 5 that disperses from substrate P can not splash in.
The liquid 50 that disperses from substrate P is reclaimed by the liquid attracting device 29 that is connected to chamber 25.Liquid attracting device 29 is by attracting to reclaim the liquid 50 that disperses from substrate P with chamber 25 gas inside with the liquid 50 that splashes.Here, liquid attracting device 29 is proceeded chamber 25 gas inside and the attraction of the liquid 50 that splashes action.In view of the above, because liquid 50 can not remain in chamber 25 inside such as the inwall of chamber 25 or the end, so that chamber 25 humidity inside can not change is too big.In addition, even when open baffle 26A, 27A, gas moist in the chamber 25 can not flow out to outside the chamber 25 yet.
In case substrate P has rotated the stipulated time (perhaps stipulating rotation number), just the stop the rotation driving of mechanism 22 of control device CONT descends substrate P with cradle portion 21.Then, open the 2nd baffle plate 27A of control device CONT.In case the 2nd baffle plate 27A is by opening, the 3rd carrying device (the 2nd conveyance member) H3 is just via the 2nd peristome 27 visit table devices 20, the substrate P that keeps the liquid 50 on the table device 20 to be removed.Maintenance is removed the 3rd carrying device H3 that device 100 has been removed the substrate P of liquid 50 by liquid, substrate P is taken out of via the 2nd peristome 27 from chamber 25 inside.
As shown in Figure 1, remove the substrate P that device 100 has been removed liquid 50, be transported to applicator developer body C/D via interface portion IF by means of liquid.Applicator developer body C/D (developing apparatus D) implements development treatment to the substrate P that is sent here.Like this, before the exposure device EX-SYS of present embodiment takes out of substrate P applicator developer device CD-SYS via interface portion IF, remove device 100 by means of liquid and remove the liquid 50 that is attached to substrate P.
As described above such, arrive applicator developer device C/D-SYS (developing apparatus D) before owing to will in exposure device body EX, implement the substrate P conveyance of exposure-processed, remove device 100 with liquid and remove the liquid 50 that is attached to substrate P, so can eliminate the influence of liquid 50 for development treatment.In addition, remove the liquid 50 that is attached to substrate P by remove device 100 by liquid, just can prevent that in the conveyance of substrate P liquid falls, causes the 1st chamber device CH1 humidity inside to change (environmental change) from substrate P, perhaps make the generation of the good situation that each device on the conveyance path or parts get rusty etc.
In addition, carry out conveyance with the 2nd carrying device H2, use the 3rd carrying device H3 different to carry out conveyance the substrate P that has removed liquid 50, so the 3rd carrying device H3 can not drenched by liquid 50 with the 2nd carrying device H2 owing to will be attached with the substrate P of liquid 50.Thereby, can attaching liq 50 on the substrate P of the 3rd carrying device H3 institute conveyance, in addition, can prevent the splashing of liquid 50 on the conveyance path of the 3rd carrying device H3 reliably.
In addition,, liquid is arranged in the way in conveyance path of conveyer H, so the liquid that can utilize the exposure-processed of exposure device body EX simultaneously and utilize liquid to remove device 100 is removed processing because being removed device 100.Thereby, can not make production capacity reduce ground and carry out each processing.And, owing to be to carry out liquid in chamber 25 inside to remove processing, so around can preventing that liquid 50 is splashed to.
In addition, though in the present embodiment, when the applicator developer device C/D-SYS as processing unit is arrived in the substrate P conveyance after the exposure-processed, carrying out conveyance via the interface portion IF as connecting portion so is illustrated, but for example in applicator developer device C/D-SYS, possess under the situation of interface portion IF, perhaps be not directly connected under the situation of exposure device EX-SYS via interface portion IF at applicator developer device C/D-SYS, perhaps, processing unit be the substrate accommodation device and not via the substrate P conveyance of interface portion IF after with exposure-processed under the situation of substrate accommodation device, the peristome of the 1st chamber device CH1 just becomes the connecting portion of exposure device EX-SYS.
As described above, the liquid in the present embodiment 50 is made of pure water.Pure water can easily obtain in a large number at semiconductor fabrication factory etc., also has not the advantage for the bad influence of photoresist on the substrate P (photoresist) or optical element (lens) etc. simultaneously.In addition, for the bad influence of environment, the amount of impurity is extremely not low simultaneously for pure water, so can also expect the surface of substrate P and be arranged at the effect that the surface of optical element of the front end face of projection optical system PL is cleaned.
And, pure water (water) is that the refractive index n of the exposure light EL of 193nm degree is considered to about 1.44～1.47 with respect to wavelength, penetrate under the situation of light (wavelength 193nm) as the light source of exposure light EL utilizing the ArF exciplex to swash, on substrate P with 1/n, promptly about 131～134nm degree is obtained higher exploring degree by the short wavelengthization.And then, compare in the depth of focus and the air doubly, promptly about 1.44～1.47 times of degree are extended with about n, so under the situation that the situation that can guarantee and use in air gets final product with the depth of focus of degree, the numerical aperture of projection optical system PL is further increased, and the exploring degree also will improve in this.
Though in the present embodiment, at the front end of projection optical system PL lens 60 have been installed, but, can also be used optical sheet in the adjustment of optical characteristics, for example aberration (spherical aberration, coma aberration etc.) at projection optical system PL as the optical element of the front end that is installed on projection optical system PL.It perhaps also can be the planopaallel plate that can see through exposure light EL.By being made as planopaallel plate with the optical element that liquid 50 contacts than lens cheapness, even will make when the carrying of exposure device EX, assembling, adjustment etc. the material that the homogeneity of the illumination of the transmission coefficient of projection optical system PL, the exposure light EL on the substrate P and Illumination Distribution reduces (for example silicon family organic substance etc.) be attached to this planopaallel plate, only before feed fluid 50, change this planopaallel plate and get final product, have the advantage lower and so on than its replacement cost of situation that will be made as lens with the optical element that liquid 50 contacts.Promptly, the surface of making adhering to of impurity the liquid 50 etc. the optical element that contacts with liquid 50 dirty owing to the particle or result from of splashing that takes place from resist because of the irradiation of exposure light EL, so need change this optical element termly, by this optical element being made as cheap planopaallel plate, compare the cost step-down that just can make the replacing parts with lens, and can make and change the desired time and shorten, can also suppress the low of the rising of maintenance cost (operating cost) or production capacity.
In addition, under the optical element of the front end of the projection optical system PL produced because of flowing of liquid 50 and the bigger situation of the pressure between the substrate P, can also not replaceable this optical element but firmly fix optical element so that it can be because of this pressure activity.
In addition, though in the present embodiment, be the formation that between projection optical system PL and substrate P surface, is full of, but also can be the constituting of full of liquid 50 under the state that the cover glass be made up of planopaallel plate is installed on the surface of substrate P for example with liquid 50.
In addition, in the respective embodiments described above, the shape of said nozzle does not limit especially, for example can carry out the supply or the recovery of liquid 50 with two pairs of nozzles for the long limit of leading section 60A yet.In addition, since in the case from+directions X or-either direction of directions X all can carry out the supply and the recovery of liquid 50, so also can dispose supply nozzle up and down side by side and reclaim nozzle.
The 2nd execution mode
Then, on one side with reference to Fig. 6 on one side in the exposure device with regard to the 2nd execution mode of the present invention used liquid remove device 100 and describe.Here, in the following description, remove beyond the device 100, because identical with the 1st execution mode or be equal to so simple or omit its explanation about liquid.
In Fig. 6, liquid is removed device 100, for liquid 50 being splashed when the removing of the liquid 50 that is attached to substrate P, and possesses the lid shell portion (cover) 30 of a part that constitutes the lid shell mechanism around the covering substrate P.Liquid in the present embodiment is removed device 100 and is not had chamber 25.Lid shell portion sees on 30 planes and roughly is circular formation, has groove (pocket) 30A of portion in this annulus inside.In the concave part 30A of lid shell portion 30, connecting liquid attracting device 29.In addition, lid shell portion 30 is configurable at the recess 31 that is formed at table device 20, by means of elevating mechanism 32 can with respect to table device 20 up and down (ground can haunt) be provided with.Carrying out when liquid removes processing, lid shell portion 30 also rises when cradle portion 21 rises.Since lid shell portion 30 be configured to covering substrate P around, so the liquid 50 that disperses because of the rotation of substrate P is recycled to the concave part 30A that covers shell portion 30.The liquid 50 that is recycled to concave part 30A is reclaimed by liquid attracting device 29.
As described above like that, as lid shell mechanism can also use covering substrate P around lid shell portion 30.Thus, with the 1st execution mode in the chamber 25 that illustrated compare and can prevent that liquid 50 from splashing towards periphery with easy formation.
The 3rd execution mode
Then, on one side with reference to Fig. 7 on one side in the exposure device with regard to the 3rd execution mode used liquid remove device 100 and describe.The characteristic of present embodiment is removed the rotating mechanism 22 of device 100 and the chip bench PST this point that lid shell portion 30 is arranged at the exposure device body EX that carries out exposure-processed for constituting liquid.So omit its explanation because the structure of exposure device body EX is identical with the 1st execution mode.
In Fig. 7 (a), chip bench PST has cradle portion 21 and the 2nd cradle portion 24 that keeps substrate P and can accommodate the recess 31 that covers shell portion 30.Then, shown in Fig. 7 (a), to the substrate P that kept on cradle portion 21 and the 2nd cradle portion 24 via projection optical system PL and liquid 50 pattern transferring pictures.In case the exposure-processed for substrate P finishes, control device CONT, shown in Fig. 7 (b), stop for the supply between projection optical system PL and the substrate P, simultaneously the liquid 50 that reclaims on the substrate P by means of liquid withdrawal system 2 from the liquid 50 of fluid Supplying apparatus 1.If this reclaims the end of job, chip bench PST is kept out of the way under projection optical system PL.Then, control device CONT will cover shell portion 30 and rise when the cradle portion 21 that keeps substrate P is risen, drive rotating mechanism 22 substrate P is rotated.Thus, not reclaiming the liquid 50 that is over and is attached to substrate P with liquid withdrawal system 2 just is removed from substrate P.Then, in case will remove attached to the liquid 50 of substrate P, the 2nd carrying device H2 just takes out of substrate P from chip bench PST.
As described above such, liquid can also be removed device 100 and be arranged at chip bench PST.And, by before substrate P is taken out of from the chip bench PST that carries out exposure-processed, remove the liquid that is attached to substrate P, just can prevent the generation of the bad situation that in the conveyance of substrate P liquid 50 falls and so on from substrate P.In addition, in the present embodiment, because exposure device body EX adopts the double-workbench system, thus can carry out exposure-processed among the 1st chip bench PST1 simultaneously and the liquid among the 2nd chip bench PST2 is removed processing, and can not make production capacity reduce ground to carry out all processing.
In addition, though in the 3rd execution mode, for the substrate P after the exposure-processed is being removed the liquid that is attached to substrate P before the chip bench PST conveyance and is adopting the mechanism that makes substrate P rotation, but both can be provided with the hair-dryer (blower) that blows liquid off or with the liquid withdrawal system 2 different mechanisms that the residual liquid on the substrate P is attracted that are provided with separately, also can and use them.
The 4th execution mode
Then, on one side with reference to Fig. 8 on one side in the exposure device with regard to the 4th execution mode used liquid remove device 100 and describe.Liquid shown in Figure 8 is removed in device 100 way for the conveyance path that is arranged at conveyer H, promptly between the 2nd carrying device H2 and the 3rd carrying device H3, possess the formation of chamber 25.So omit its explanation because the structure of exposure device body EX is identical with the 1st execution mode.
In Fig. 8, liquid is removed device 100 and is possessed: by the surface (top) of substrate P is blown liquid 50 that jet body makes the surface that is attached to this substrate P disperse remove the 1st blow the portion of scraping (blow section) 33 and by the back side (following) of substrate P is blown liquid 50 that jet body makes the back side that is attached to this substrate P disperse remove the 2nd blow the portion of scraping 34.1st, the 2nd blows the portion of scraping 33,34 and is connected to gas supply device 35 via stream respectively.Stream is provided with the filter that the foreign matter (dust or mist of oil) that substrate P is blown in the gas of spray is removed.And gas supply device 35 will be supplied with the 1st, the 2nd through the gas of super-dry and blow the portion of scraping 33,34.In the present embodiment, gas supply device 35 is supplied with dry air.
Fig. 9 is the figure that watches chamber 25 inside of Fig. 8 from the top.As shown in Figure 9, the Y direction both ends of substrate P below it keep (in addition, holding device 36 is not illustrated in Fig. 8) by holding device 36.Holding device 36 transmits substrate P, and keeps the substrate P that transmitted by the 2nd carrying device H2.In addition, the substrate P that is kept on the holding device 36 is passed to the 3rd carrying device H3.The 1st blows the portion of scraping 33 possesses the 33A of nozzle body portion that the Y direction of establishing is a length direction and arranges a plurality of nozzle bore 33B that are provided with at the length direction of the 33A of nozzle body portion.The dry air of supplying with from gas supply device 35 blows out respectively from a plurality of nozzle bore 33B.The 2nd blows the portion of scraping 34 also has and the 1st blows the formation that the portion of scraping 33 is equal to, and having the Y direction of establishing is nozzle body portion and a plurality of nozzle bore of length direction.
The substrate P and the 1st, the 2nd that is kept on the holding device 36 blows the portion of scraping 33,34 and can be provided with relatively moving.In the present embodiment, the 1st, the 2nd blows the substrate P that is kept on 33,34 pairs of holding devices 36 of the portion of scraping and moves in the enterprising line scanning of X-direction.In addition, both can on holding device 36, drive unit be set, and make substrate P blow the portion of scraping 33,34 and move, and also can make the 1st, the 2nd to blow the portion of scraping 33,34 and holding device 36 both move with respect to the 1st, the 2nd.
Then, the action of removing device 100 with regard to the liquid with above-mentioned formation describes.The substrate P that the 2nd carrying device H2 will be attached with liquid 50 gives holding device 36.Control device CONT utilizes the 1st, the 2nd to blow 33,34 couples of substrate P that holding device 36 is being kept of the portion of scraping and blow jet body.Here, blowing 33,34 in the portion of scraping by the 1st, the 2nd blows the gas of spray and blows spray with respect to the surface and the back side of substrate P from incline direction.Control device CONT is while making the 1st, the 2nd to blow substrate P that the portion of scraping 33,34 kept with respect to holding device 36 in X-direction and move and blow jet body.Here, because the 1st, the 2nd length of blowing nozzle body portion separately of the portion of scraping 33,34 is far longer than substrate P, so jet body is not all blown at the table back side of substrate P with omitting.Make liquid 50 disperse, remove by blowing jet body attached to substrate P.The liquid 50 that disperses is recycled to liquid attracting device 29.The substrate P that has removed liquid 50 is sent to the 3rd carrying device H3.
The 5th execution mode
Then, on one side with reference to Figure 10 on one side in the exposure device with regard to the 5th execution mode used liquid remove device 100 and describe.In Figure 10, liquid is removed device 100 and is possessed: via stream be connected to liquid attracting device 29, the 1st, the 2nd attraction portion 37,38 that the liquid 50 at the surface that is attached to substrate P respectively and the back side is attracted and chamber 25 inside are carried out dry drying device 39.1st, the 2nd attraction portion 37,38 can be provided with in X-direction with respect to substrate P with relatively moving.When the liquid of removing attached to substrate P 50, control device CONT is close under the state of substrate P the 1st, the 2nd attraction portion 37,38, drives liquid attracting device 29.Thus, the liquid 50 attached to substrate P attracted to liquid attracting device 29 via the 1st, the 2nd attraction portion 37,38.Then, while make the 1st, the 2nd attraction portion 37,38 move the attraction action that utilizes liquid attracting device 29 in X-direction, remove liquid 50 thus attached to substrate P with respect to substrate P.At this moment, 39 pairs of chamber 25 internal feeds of drying device are through the gas (dry air) of super-dry.Driving by means of drying device 39 makes chamber 25 inside carry out drying, just can promote liquid 50 to remove from substrate P thus.So omit its explanation because the structure of exposure device body EX is identical with the 1st execution mode.
In addition, also can carry out simultaneously and utilize attraction (sucking) the action illustrated mistake of Figure 10, that attract the liquid 50 on the substrate P and utilize the gas illustrated mistake of Fig. 8, that boast the portion of scraping to blow and scrape (gas-blowing) action.Perhaps, also can after carry out attracting action and gas to blow to scrape some in the action, carry out another.In addition, can also utilize the drying action of drying device 39 side by side, also can carry out drying and move attracting action or gas to blow the front and back of scraping action.That is, can make to attract action, dry action and gas blow scrapes the suitable execution that combines of action (liquid blows action off).
The 6th execution mode
Then, on one side remove device 100 with regard to the liquid of the exposure device of the 6th execution mode on one side with reference to Figure 11 and describe.In addition, so omit its explanation because the structure of exposure device body EX is identical with the 1st execution mode.In Figure 11, liquid is removed device 100 and possessed: 1st, the 2nd blows the portion of scraping 33,34 and accommodates the 1st, the 2nd and blow the chamber 40 of the portion of scraping 33,34.Chamber 40 in the present embodiment has the 1st, the 2nd peristome 41,42 that forms in the Z-direction dislocation.In addition, though on the 1st, the 2nd peristome 41,42 in the present embodiment baffle plate is not set, also baffle plate can be set.And the 2nd carrying device H2 in the present embodiment has under the state that keeps substrate P can insert the arm (the 1st conveyance member) 43 of chamber 40 inside via the 1st peristome 41.Arm 43 will utilize immersion method through exposure-processed, be attached with liquid 50 substrate P with respect to the horizontal plane (XY plane) tilted to carry out conveyance under the state of predetermined angular, insert in this chamber 40.Here, keep being attached with the 1st peristome 41 that the arm 43 of the substrate P of liquid 50 is inserted, be formed at lower side from the 2nd peristome 42 in Z-direction, arm 43 makes the direction of insertion front side (conveyance direction front side) with respect to chamber 40 carry out conveyance towards the top.
Then, arm 43 makes substrate P blow the portion of scraping 33,34 with respect to the 1st, the 2nd under the state of the inclination of keeping substrate P to move.1st, the 2nd blows 33,34 couples of substrate P that move of the portion of scraping and blows jet body.Be removed by means of the blowing spray of gas attached to substrate P liquid 50.At this moment, because substrate P tilts,, removing from the liquid 50 of substrate P will be promoted so liquid 50 moves to the incline direction lower side of substrate P easily because of deadweight.The liquid of removing from substrate P 50 lodges in chamber 40 inside, is recycled to the liquid attracting device 29 as retracting device.In addition, also can under the state that substrate P is tilted, make liquid 50 move to the incline direction lower side of substrate P, the liquid 50 that comes together in this incline direction lower side is blown jet body by means of deadweight.In addition, can also carry out with above-mentioned dry action and use.That is, remove the liquid of device 100 as liquid and remove, both can use substrate P rotation, substrate P to tilt, attract action, dry action and gas blow a certain method of scraping in the action (liquid blows action off), also can be with they suitable combining.
The end of substrate P after liquid 50 is removed reaches chamber 40 outsides from the 2nd peristome 42.Near the 2nd peristome 42, be provided with arm (the 2nd conveyance member) 44 as the 3rd carrying device H3.The substrate P that removes behind the liquid 50 is directly given arm 44 from arm 43.
In addition, though here, be when being inserted into chamber 40, to make substrate P tilt to carry out conveyance so to be illustrated, but also can be in the position beyond the chamber 40, so that be attached with the state continuation conveyance that the substrate P of liquid 50 is inclined relative to horizontal predetermined angular.Thus, the liquid 50 that is attached to substrate P falls from substrate P because of deadweight in conveyance.In addition, be provided with the retracting device that the liquid 50 that leaves from substrate P because of deadweight is reclaimed in the conveyance path at this moment.In addition, with respect to the horizontal plane angle of inclination can be set arbitrarily when conveyance substrate P, can also be 90 degree.That is, can also under the state that substrate P is stood vertically, carry out conveyance.
In the respective embodiments described above, conveyance is attached with the 2nd carrying device H2 of substrate P of liquid 50 or the surface of arm 43, preferably anti-fluidity.Thus, be attached to the 2nd carrying device H2 (arm 43), also can immediately and easily this liquid 50 be removed from the 2nd carrying device H2 (arm 43) even if when conveyance substrate P, be attached to the liquid 50 of this substrate P.Thereby, just can prevent that the liquid 50 that is attached to the 2nd carrying device H2 (arm 43) from adhering to (adhering to again) generation to the bad situation of substrate P and so on.The anti-liquid that becomes anti-fluidity as the surface that makes the 2nd carrying device H2 (arm 43) is handled (water-proofing treatment), for example lists the coating of using the material with anti-fluidity and handles.As material, for example list synthetic resin such as fluorine compounds of group or silicon compound or polyethylene or acrylic resin with anti-fluidity.In addition, being used for the surface-treated film both can be the film that monofilm also can be made up of multilayer.In addition, both can all implement anti-liquid and handle, also can implement a part to the surface of the 2nd carrying device H2 (arm 43).
The 7th execution mode
Though in the illustrated execution mode of reference Figure 11, under the state that substrate P is tilted, carry out conveyance, removing device 100 with the liquid in the way that is arranged at this conveyance path tilts substrate P, but as shown in figure 12, also can be behind the end exposure of substrate P, substrate P is carried out conveyance (unloading) before, the chip bench PST (Z workbench 51) that makes maintenance be attached with the substrate P of liquid 50 tilts, and carries out removing of liquid 50 thus.In Figure 12, chip bench PST (Z workbench 51) substantial middle portion in the above keeps substrate P, forms the circular liquids recovery mouth (accumulator tank) 73 of recyclable liquid 50 around substrate P, is disposing liquid and attract parts 71 on this accumulator tank 73.Be formed with in Z workbench 51 inside the one end is connected with accumulator tank 73, the other end is connected to the stream of the liquids recovery mechanism that is arranged at Z workbench 51 outsides.Liquids recovery mechanism has the container of the liquid that vacuum pump equal vacuum system (suction device), collecting post reclaim etc.Liquid attracts parts 71 for example to be made of porous materials such as porous ceramic or sponges, can keep the liquid 50 of ormal weight.In addition, on the Z workbench 51, the substrate P that kept of Z workbench 51 and liquid attracts between the parts 71 (accumulator tank 73), is provided with the auxiliary sheet part (auxiliary plate) 79 of the ring-type that the periphery of this substrate P is surrounded with Rack.It is roughly consistent that the apparent height of auxiliary sheet part 79 is configured to the apparent height of the substrate P that kept with Z workbench 51.Then, the liquid that is configured to surround with Rack the periphery of this auxiliary sheet part 79 attracts parts 71 (accumulator tank 73) to play and will not reclaim the effect that the liquid 50 that is over attracts (recovery) with liquid withdrawal system 2.Among this external Figure 12, Z workbench 51+the X side end is arranged on the moving lens 54X that Y direction is extended, be arranged on the moving lens 54Y that X-direction is extended at the Y side end, laser interferometer will swash penetrates illumination and is mapped to these moving lens 54X, 54Y the X-direction of chip bench PST and the position on the Y direction are detected.
After the exposure of substrate P is finished, with substrate P before from Z workbench 51 shown in Figure 12 (chip bench PST) conveyance (unloading), Z workbench 51 utilizes the adjusting mechanism that is arranged at this Z workbench 51 to tilt, follow the substrate P on this Z workbench 51 also to tilt, flow to accumulator tank 73 by means of action of gravity (deadweight) and reclaimed remaining in liquid 50 on the substrate P behind the end exposure thus.In addition, expose finish after and when the tilting action before the conveyance as the Z workbench 51 of liquids recovery action, for example worry because of 51 inclinations of Z workbench are made under the leading section and Z workbench 51 (substrate P) case of collision of projection optical system PL, Z workbench 51 (chip bench PST) is kept out of the way under projection optical system PL, carried out above-mentioned tilting action in the position of leaving with projection optical system PL.Under this execution mode situation, the chip bench and the control of tilting thereof are removed device performance function as liquid.
In addition, though in the above-described embodiment, by means of the inclination of chip bench PST (Z workbench 51) make substrate P tilt, to remove the liquid on the substrate P, but also can be as disclosed in the flat 1-214042 communique of Japan Patent Publication Laid-Open, the supported component mounting that moves up and down at the maintenance substrate P of loading that will be used for substrate P and unloading also can make substrate P tilt by means of the inclination of these supported parts under the situation of chip bench PST.In addition, also can before be taken out of from chip bench PST, substrate P blow spray dry air or warm braw and make its drying.That is,, both can use the blowing off of rotation, liquid of substrate P, the attraction of liquid, the inclination of substrate P, utilize the use that combines that also can suit someway in the drying of blowing spray of gas as substrate P is removed from the liquid of chip bench PST before taking out of.
The 8th execution mode
Then, on one side describe with regard to the exposure device of the 8th execution mode of the present invention on one side with reference to Figure 13.The characteristic of present embodiment is when possessing liquid and removing device 100, in exposure device body EX and liquid are removed the way in conveyance path of device 100, decontaminating apparatus 150 this point that the substrate P after using detergent remover with exposure-processed cleans are set.In addition, except utilizing single chip bench PST, the exposure device body is identical with execution mode 1 in the present embodiment.
In Figure 13, decontaminating apparatus 150 have chamber 151 and be arranged on chamber 151 inside, to supplied with the detergent remover feedway 152 of detergent remover to the substrate P of chamber 151 inside by conveyance.Detergent remover feedway 152 is supplied with detergent remover respectively below reaching on substrate P.Chamber 151 has at the 1st peristome 153 of exposure device body EX side opening and removes the 2nd peristome 154 of device 100 side openings at liquid.On the 1st, the 2nd peristome 153,154, be respectively arranged with baffle plate 153A, 154A that the 1st, the 2nd peristome 153,154 is opened and closed.In exposure device body EX through the substrate P after the exposure-processed by the 5th carrying device (not shown) via the 1st peristome 153 by chamber 151 inside of conveyance to decontaminating apparatus 150.Be provided with the holding device that keeps substrate P in chamber 151 inside, substrate P uses detergent remover to clean processing under by the state that holding device kept.Removed device 100 by conveyance to liquid by the 2nd carrying device H2 through cleaning the substrate P that handles.Liquid is removed device 100 and is removed the detergent remover that is attached to substrate P.
Here, in exposure-processed, can make liquid beyond the water as liquid 50 based on the exposure device body EX of immersion method.In the present embodiment, use fluorine family oil as liquid 50.For example, the light source at exposure light EL is F 2Under the situation of laser, because this F 2Swash penetrate light can permeate water, so can see through F by use 2Swash for example fluorine family oil of penetrating light and carry out exposure-processed as liquid 50.Like this, as liquid 50, just can use the liquid beyond dewatering, in addition as liquid 50, can also use have for the permeability of exposure light EL and refractive index is high as far as possible, at the coated stable for example red deal oil of photoresist of projection optical system PL or substrate P surface.Then, using as liquid 50 under the situation of the liquid different with water, with regard to can enough decontaminating apparatus 150 couples of substrate P clean and carry out liquid again after the processing and remove processing.Like this, by substrate P is cleaned, just can with in immersion exposure or the foreign matter that is attached to substrate P in the conveyance of substrate P etc. wash off, liquid is afterwards removed also and can successfully be carried out, just the clean substrate P of attaching liq or foreign matter not can be sent from exposure device.
Liquid is removed device 100 and also can be used the liquid that is arranged at the arbitrary exposure device in the execution mode 1～6 to remove device 100.In addition, cleaning with the removing also of liquid that is attached to substrate P of substrate P can be carried out in same place.For example, can also among chamber 25, clean with liquid and remove.
The 9th execution mode
Then, on one side describe with regard to the exposure device and the device manufacturing system of the 9th execution mode of the present invention on one side with reference to Figure 14.The characteristic of present embodiment is under the conveyance path of the conveyer H that substrate P conveyance is removed device 100 to liquid, and liquid handling mechanism 160 this point that the liquid that falls of substrate P after exposure is handled are set.In addition, in the present embodiment, chip bench is provided with two of PST1, PST2, and exposure device body and execution mode 1 are same.
In Figure 14, the liquid attracting device 162 that liquid handling mechanism 160 has the channel parts 161 under the conveyance path that is disposed at conveyer H and will discharge from channel parts 161 via the liquid 50 that channel parts 161 is reclaimed.In the present embodiment, channel parts 161 is arranged at chip bench PST (PST1, PST2) and liquid is removed between the device 100, that is under the conveyance path of the 2nd carrying device H2.Channel parts 161 is arranged at chamber device CH1 inside, and liquid attracting device 162 is arranged at chamber device CH1 outside.Channel parts 161 is connected via pipeline 163 with liquid attracting device 162, is provided with the valve 163A that the stream that makes this pipeline 163 opens and closes in pipeline 163.
Though among with the substrate P that is attached with liquid 50 after the 2nd carrying device H2 conveyance exposure, the possibility that has liquid 50 to fall from substrate P, this liquid that falls 50 can enough channel parts 161 reclaim.Reclaim by the liquid 50 usefulness channel parts 161 that will fall, just can prevent bad situations such as liquid 50 splashes around the conveyance path.And, the liquid 50 that is arranged at by 162 pairs of liquid attracting devices on the channel parts 161 of chamber device CH1 inside attracts just can make liquid 50 to be discharged to chamber device CH1 outside, and do not remain in the channel parts 161 of chamber device CH1 inside, and can prevent the inner bad situation that humidity change (environmental turbulence) takes place at chamber device CH1.Here, liquid attracting device 162 both can be recycled to the attraction action of the liquid 50 of channel parts 161 continuously, also can only attract action in predefined specified time limit intermittently.Because by attracting action continuously, liquid 50 just can not remain in the channel parts 16, can further prevent the change of chamber device CH1 humidity inside.On the other hand, for example in the exposure of the substrate P of exposure device body EX, do not utilize the attraction action (discharging operation) of liquid attracting device 162 but only during beyond the exposure, attract action, just can prevent thus because of attracting the vibration that action takes place exposure accuracy to be brought the bad situation of influence and so on.
In addition, substrate P that might attaching liq is carried out whole under the conveyance path of conveyance though wish that channel parts 161 is arranged on, also can be in the place of the influence of the liquid that is easy to be subjected to fall from substrate P partly, be provided with discretely.In addition,, be not limited to channel parts 161 and liquid and attract mechanism 162, get final product so long as can reclaim the formation of the liquid that falls from substrate P etc. as the liquid handling mechanism 160 under the conveyance path.
Liquid is removed device 100 and also can be used the liquid that is arranged at arbitrary exposure device in the 1st～6 execution mode to remove device 100.In addition, decontaminating apparatus used in the 1st～6 execution mode can also be arranged in the conveyance path.
In addition, though in the above-described embodiment, it is to be over and to adhere to (remaining) in the liquid of substrate P and be provided with in order to remove not reclaim with liquid withdrawal system 2 that liquid is removed device 100, also may not necessarily need liquid withdrawal system 2.
Substrate P as the respective embodiments described above; be not only the semiconductor wafer of semiconductor device manufacturing usefulness, the glass substrate that also applicable display device is used or, the ceramic sheet used of film magnetic head or used mask or master (synthetic quartz, silicon wafer) of netting twine etc. in exposure device.
In addition, though in the above-described embodiment, employing is the local exposure device that is full of with liquid between projection optical system PL and substrate P, but the immersion exposure device that among liquid bath, moves for the maintenance workbench that makes the substrate that keeps exposure object or, on workbench, form the liquid tank of prescribed depth and keep the immersion exposure device of substrate also can be suitable for the present invention therein.The immersion exposure device that among liquid bath, moves as the workbench that makes the substrate that keeps exposure object, for example in the flat 6-124873 communique of Japan Patent Publication Laid-Open, disclose, in addition, the immersion exposure device that also keeps substrate as the liquid tank that on workbench, forms prescribed depth therein, for example at flat 10-303114 communique of Japan Patent Publication Laid-Open or United States Patent (USP) the 5th, 825, disclose in detail respectively in No. 043, home in the scope that decree allowed of the specified or selected country of border application, quote these communiques and as a part described herein.
As exposure device (exposure device body) EX, except the pattern of mask M being carried out the scanning exposure apparatus (scanning portable one by one exposure device) of step-scan (step-and-scan) mode of scan exposure with moved further mask M and substrate P, can also be applicable to making under the static state of mask M and substrate P the pattern of mask M is summed up exposure, make substrate P successively the stepping stepping of moving repeat the projection aligner (portable one by one exposure device) of (step-and-repeat) mode.In addition, the present invention can also be applicable to the exposure devices of 2 overlapping steppings of carrying out transfer printing of pattern part being sewed up (step-and-stitch) mode on substrate P at least.
Kind as exposure device EX, be not limited to the exposure device of the semiconductor element manufacturing usefulness of exposure semiconductor element pattern on substrate P, the liquid crystal display cells manufacturing with or the exposure device of display manufacturing usefulness or the be used for exposure device etc. of making film magnetic head, imaging apparatus (CCD) or netting twine or mask etc. also can extensively be suitable for.
In chip bench PST or mask platform MST, use under the situation of linear motor, also can use the air floating type that has utilized air bearing and utilize Lorentz force or reactance power a certain in the magnetic suspension type.In addition, each workbench PST, MST both can be the types that moves along guide rail, also can be the nothing guiding types that guide rail is not set.The example that utilizes linear motor is at United States Patent (USP) 5,623, and 853 and 5,528, disclose in 118, home in the scope that is allowed in the decree of the specified or selected country of border application, quote the record content of these documents respectively and as a part described herein.
As the driving mechanism of each workbench PST, MST, the opposed planar motors that drives each workbench PST, MST by means of electromagnetic force in armature unit of coil of can also having used with two-dimensional arrangement the magnet unit of magnet, two-dimensional arrangement.In this case, a certain side in magnet unit and the armature unit is connected to workbench PST, MST, the all-moving surface side that the opposing party of magnet unit and armature unit is arranged at workbench PST, MST gets final product.
To take place counter-force in order making, not pass to projection optical system PL, also can use frame parts mechanically to be discharged into ground (the earth) because of moving of chip bench PST.The processing method of this counter-force, for example, at United States Patent (USP) 5,528, at length disclose in 118 (the flat 8-166475 communiques of Japan Patent Publication Laid-Open), home in the scope that is allowed in the decree of the specified or selected country of border application, quote the open of this United States Patent (USP) and as a part described herein.In addition, take place counter-force, do not pass to projection optical system PL, also can use frame parts mechanically to escape into ground (the earth) in order to make because of moving of mask platform MST.The processing method of this counter-force, for example, at United States Patent (USP) the 5th, 874, at length disclose in 820 (the flat 8-330224 communiques of Japan Patent Publication Laid-Open), home in the scope that is allowed in the decree of the specified or selected country of border application, quote the open of this U. S. application and as a part described herein.
As described above, the exposure device EX of the application's execution mode makes mechanical precision, electric precision, optical accuracy to guarantee regulation by the various subsystems that assembling comprises each inscape of enumerating in the scope that the application's patent requires.In order to ensure these various precision, before and after this assembling, carry out for the adjustment that reaches optical accuracy, carry out for the adjustment that reaches mechanical precision, carry out in order to reach the adjustment of electric precision for various electrical systems for various machinery system for various optical systems.Assembling procedure from various subsystems to exposure device comprises the distribution connection of the mutual mechanical connection of various subsystems, electric circuit, the pipe arrangement connection of air pressure circuit etc.Self-evident at various subsystems from then on before the assembling procedure of exposure device, each subsystem assembling procedure is separately arranged.In case various subsystems finish to the assembling procedure of exposure device, just comprehensively adjust, and guarantee as all various precision of exposure device.In addition, wishing that being manufactured on of exposure device managed in the clean room of temperature and cleannes etc. carries out.
The micro element of semiconductor device etc., make through following steps as shown in figure 15, promptly, carry out the step 201 of the functional performance design of micro element, exposure-processed step 204, the device number of assembling steps (comprising cutting action, bond sequence, packaging process) 205 that make step 202, make step 203, the exposure device EX by aforementioned embodiments exposes the pattern of mask on substrate, check step 206 etc. as the substrate of the base material of device based on the mask (netting twine) of this design procedure.In addition, in exposure-processed step 204, be included in the preceding surface-treated step of carrying out substrate for the hydrophily of substrate and liquid is adjusted of exposure.
Utilizability on the industry
According to the present invention, just can prevent that exposure-processed environmental turbulence or liquid from splashing towards periphery. Thereby, just can prevent low based on the exposure-processed precision of this environmental turbulence or liquid splash, And make the device with desirable performance. In addition, because can be with attaching liq or different not The substrate of thing is sent from exposure device, so can make the device with desirable performance.

Claims (11)

1. one kind is transferred to pattern image on the substrate via liquid and to the exposure device that substrate exposes, possesses:
Pattern image is projected to the projection optical system of substrate;
The fluid supply unit of feed fluid in to the process of substrate exposure;
In to the process of substrate exposure, reclaim from the liquids recovery unit of the liquid of aforesaid liquid feed unit supply; And
The substrate conveyance will expose by the connecting portion that is connected to processing unit to the above-mentioned processing unit, remove not and to be reclaimed the liquid that reclaims, remains in the liquid on the above-mentioned substrate surface that exposed in the unit by aforesaid liquid and remove the unit, wherein above-mentioned processing unit is used for handling the above-mentioned substrate that exposed after the substrate exposure is finished.
2. according to the described exposure device of claim 1, it is characterized in that:
After above-mentioned exposure, the substrate that is attached with aforesaid liquid with respect to the horizontal plane with predetermined angular by conveyance.
3. according to the described exposure device of claim 1, it is characterized in that:
Aforesaid liquid is removed the unit and is sucked above-mentioned on-chip liquid.
4. according to the described exposure device of claim 1, it is characterized in that:
Aforesaid liquid is removed the dry above-mentioned on-chip liquid in unit.
5. according to the described exposure device of claim 1, it is characterized in that:
Aforesaid liquid is removed the unit and is blown above-mentioned on-chip liquid off.
6. according to the described exposure device of claim 1, it is characterized in that:
Aforesaid liquid is removed the unit and is comprised the rotating mechanism that the substrate that is attached with aforesaid liquid is rotated.
7. according to the described exposure device of claim 1, it is characterized in that:
Aforesaid liquid is removed the unit tilts the substrate that is attached with aforesaid liquid.
8. according to the described exposure device of claim 1, it is characterized in that:
Aforesaid liquid is removed the unit and is removed the liquid that is attached to above-mentioned substrate two sides.
9. according to the described exposure device of claim 1, it is characterized in that:
Aforesaid liquid is removed the unit and is removed the liquid that is attached to above-mentioned substrate back.
10. according to the described exposure device of claim 1, it is characterized in that also possessing:
Chip bench, aforesaid liquid are removed the unit and are set on this chip bench.
11. an exposure system possesses:
The described exposure device of claim 1; And
To the processing unit that the substrate that has exposed is handled, above-mentioned processing unit be included in the applying device of coating photosensitive material on the base material of substrate and developing apparatus that the substrate that has been exposed is developed at least one.
CNB2003801054193A 2002-12-10 2003-12-05 Exposure apparatus and method for producing device Expired - Fee Related CN100382241C (en)

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CN106886133A (en) * 2012-08-28 2017-06-23 株式会社尼康 Patterning device and substrate supporting arrangement

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JP6358564B2 (en) * 2012-11-30 2018-07-18 株式会社ニコン Conveying system, exposure apparatus, conveying method, exposure method, device manufacturing method, and suction apparatus

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CN106886133B (en) * 2012-08-28 2018-06-29 株式会社尼康 Patterning device and substrate supporting arrangement

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CN101241317B (en) 2010-11-17
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