CN100334927C - 用于提高电路板内层铜面与聚合材料粘结力的棕化处理液 - Google Patents
用于提高电路板内层铜面与聚合材料粘结力的棕化处理液 Download PDFInfo
- Publication number
- CN100334927C CN100334927C CNB2004100268492A CN200410026849A CN100334927C CN 100334927 C CN100334927 C CN 100334927C CN B2004100268492 A CNB2004100268492 A CN B2004100268492A CN 200410026849 A CN200410026849 A CN 200410026849A CN 100334927 C CN100334927 C CN 100334927C
- Authority
- CN
- China
- Prior art keywords
- treatment fluid
- grams per
- brown
- litre
- liter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Laminated Bodies (AREA)
Abstract
Description
例 | 缓蚀剂 | 外观 | 蚀刻速率uin | 剥离强度lb/in | 热应力288±5℃10秒5次 |
比较例 | 苯并三氮唑 | 棕色 | 25 | 5.2 | 切片分析无分层、不起泡 |
实施例一 | 5-甲基-1-氯苯并三氮唑 | 均匀棕色 | 25 | 6.2 | 5次切片分析无分层、不起泡 |
实施例二 | 1-巯基苯并三氮唑 | 均匀浅棕色 | 25 | 6.0 | 5次切片分析无分层、不起泡 |
实施例三 | 5-甲基1-羟基苯并三氮唑 | 均匀棕色 | 25 | 6.3 | 5次切片分析无分层、不起泡 |
实施例四 | 4-羟基苯并三氮唑 | 均匀棕色 | 25 | 6.0 | 5次切片分析无分层、不起泡 |
实施例五 | 5-甲基-1-羟基苯并三氮唑1-巯基苯并三氮唑 | 均匀棕色 | 20 | 6.3 | 5次切片分析无分层、不起泡 |
实施例六 | 吲哚满二酮 | 深棕色 | 20 | 5.9 | 5次切片分析无分层、不起泡 |
实施例七 | BHTAM | 深棕色 | 20 | 5.9 | 5次切片分析无分层、不起泡 |
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2004100268492A CN100334927C (zh) | 2004-04-13 | 2004-04-13 | 用于提高电路板内层铜面与聚合材料粘结力的棕化处理液 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2004100268492A CN100334927C (zh) | 2004-04-13 | 2004-04-13 | 用于提高电路板内层铜面与聚合材料粘结力的棕化处理液 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1564650A CN1564650A (zh) | 2005-01-12 |
CN100334927C true CN100334927C (zh) | 2007-08-29 |
Family
ID=34480765
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100268492A Expired - Fee Related CN100334927C (zh) | 2004-04-13 | 2004-04-13 | 用于提高电路板内层铜面与聚合材料粘结力的棕化处理液 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN100334927C (zh) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102168266B (zh) * | 2011-03-21 | 2013-01-23 | 东莞市富默克化工有限公司 | 一种适用于高温、无卤板材的电路板棕化液 |
CN104694909B (zh) * | 2014-07-03 | 2017-01-25 | 广东丹邦科技有限公司 | 一种铜表面粗化剂 |
CN104928667B (zh) * | 2015-06-08 | 2018-07-20 | 华南理工大学 | 一种基于功能化离子液体的印制电路板处理用棕化液 |
CN104928661B (zh) * | 2015-06-08 | 2017-10-20 | 华南理工大学 | 一种用于印制电路板的复合离子液体棕化液 |
CN105050324B (zh) * | 2015-07-01 | 2018-06-12 | 广东光华科技股份有限公司 | 铜表面粗化处理液及其处理方法 |
CN105714280A (zh) * | 2016-04-06 | 2016-06-29 | 武汉创新特科技有限公司 | 一种印制电路板棕化处理液 |
CN107190254B (zh) * | 2017-05-22 | 2019-04-23 | 博敏电子股份有限公司 | 一种印制电路板的新型棕化处理液 |
CN110324989A (zh) * | 2018-03-28 | 2019-10-11 | 东莞市斯坦得电子材料有限公司 | 一种用于印制线路板内层芯板棕氧化工艺 |
CN110093600A (zh) * | 2018-05-29 | 2019-08-06 | 苏州铱诺化学材料有限公司 | 一种pcb棕化液及其制备方法 |
CN108882547A (zh) * | 2018-07-16 | 2018-11-23 | 信丰福昌发电子有限公司 | 一种线路板阻焊前处理的工艺 |
CN109706453B (zh) * | 2018-12-28 | 2021-02-23 | 广东东硕科技有限公司 | 苯并吡嗪类化合物在铜面粗化中的应用及包含其的铜面粗化用组合物 |
CN111826645A (zh) * | 2020-07-31 | 2020-10-27 | 国网河南省电力公司西峡县供电公司 | 一种电路板内层铜箔棕化液 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1175344A (zh) * | 1994-12-12 | 1998-03-04 | 阿尔菲弗赖伊有限公司 | 铜的涂敷 |
EP1158843A1 (en) * | 2000-05-22 | 2001-11-28 | Macdermid Incorporated | Process for improving adhesion of polymeric materials to metal surfaces. |
CN1344134A (zh) * | 2000-09-21 | 2002-04-10 | 麦克德米德有限公司 | 改善高分子材料与金属表面粘附性的方法 |
US6372027B1 (en) * | 1999-05-31 | 2002-04-16 | Alfachimici S.P.A. | Process for promoting adhesion between an inorganic substrate and an organic polymer |
CN1431939A (zh) * | 2000-06-08 | 2003-07-23 | 麦克德米德有限公司 | 改进聚合物材料对金属表面粘合性的方法 |
-
2004
- 2004-04-13 CN CNB2004100268492A patent/CN100334927C/zh not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1175344A (zh) * | 1994-12-12 | 1998-03-04 | 阿尔菲弗赖伊有限公司 | 铜的涂敷 |
US6372027B1 (en) * | 1999-05-31 | 2002-04-16 | Alfachimici S.P.A. | Process for promoting adhesion between an inorganic substrate and an organic polymer |
EP1158843A1 (en) * | 2000-05-22 | 2001-11-28 | Macdermid Incorporated | Process for improving adhesion of polymeric materials to metal surfaces. |
CN1431939A (zh) * | 2000-06-08 | 2003-07-23 | 麦克德米德有限公司 | 改进聚合物材料对金属表面粘合性的方法 |
CN1344134A (zh) * | 2000-09-21 | 2002-04-10 | 麦克德米德有限公司 | 改善高分子材料与金属表面粘附性的方法 |
Also Published As
Publication number | Publication date |
---|---|
CN1564650A (zh) | 2005-01-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN100334927C (zh) | 用于提高电路板内层铜面与聚合材料粘结力的棕化处理液 | |
CN102424964B (zh) | 一种含巯基化合物的棕化处理液 | |
CN101715495B (zh) | 酸性铜电镀浴组合物 | |
CN105714280A (zh) | 一种印制电路板棕化处理液 | |
CN1282505C (zh) | 用于增加聚合物材料对金属表面粘合性的组合物 | |
CN102046849A (zh) | 增进抗酸性的组合物 | |
CN1839219A (zh) | 印刷电路板中的增粘剂 | |
CN111826645A (zh) | 一种电路板内层铜箔棕化液 | |
CN109536965B (zh) | 用于去除半导体封装件不良镀锡层的剥锡剂及其制备方法 | |
CN110468398B (zh) | 一种植酸钝化液以及制备和钝化处理方法 | |
CN106119946A (zh) | 一种铝合金电解剥离剂 | |
CN102888628B (zh) | Pet基材的fpc板材电镀镍工作液 | |
CN107971655B (zh) | 一种高抗热性有机保焊剂及其应用 | |
CN1059244C (zh) | 有机防锈处理铜箔 | |
CN104744974B (zh) | 一种pcb用改进型活化液及在pcb通孔和盲孔内生成高分子导电膜的生产工艺 | |
CN103555104A (zh) | 钢铁防腐专用高分子材料及其制备方法和应用工艺 | |
CN104928667B (zh) | 一种基于功能化离子液体的印制电路板处理用棕化液 | |
CN115873469A (zh) | 一种石墨烯涂料的制备方法、自修复涂层及应用 | |
CN1201032C (zh) | 锡镀层表面抗氧化剂及其使用工艺 | |
CN108640301A (zh) | 一种化工领域用阻垢缓蚀剂及其制备工艺 | |
CN106337196A (zh) | 用于印制线路板贵金属表面处理的微观孔隙封闭剂 | |
KR101494618B1 (ko) | 인쇄회로기판용 화성처리 조성물 및 이를 이용한 화성처리 방법 | |
CN107964658B (zh) | 一种铜及其金属制品缓蚀剂及其制备方法和应用 | |
JP4065110B2 (ja) | 銅または銅合金の表面処理法およびプリント配線板の製造法 | |
US20230199972A1 (en) | One-Step Oxide Bath for Improving Adhesion of Polymeric Materials to Metal Substrates |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: GUANG DONG TONESET SCIENCE & TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: 1GUANGHUA CHEMICAL PLANT CO., LTD., GUANGDONG Effective date: 20071116 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20071116 Address after: Chen Dong Cun Industrial Zone Six fertile town Baiyun District of Guangzhou City, Guangdong province 510545 Co-patentee after: Guanghau Chemical Co., Ltd., Guangdong Patentee after: Guangdong Toneset Science & Technology Co., Ltd. Address before: 515021 No. four, Guanghua Road, Jinping District, Guangdong, Shantou 26 Patentee before: Guanghau Chemical Co., Ltd., Guangdong |
|
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: Chen Dong Cun Industrial Zone Six fertile town Baiyun District of Guangzhou City, Guangdong province 510545 Co-patentee after: Guangdong Guanghua Science and Technology Co., Ltd. Patentee after: Guangdong Toneset Science & Technology Co., Ltd. Address before: Chen Dong Cun Industrial Zone Six fertile town Baiyun District of Guangzhou City, Guangdong province 510545 Co-patentee before: Guanghau Chemical Co., Ltd., Guangdong Patentee before: Guangdong Toneset Science & Technology Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070829 Termination date: 20190413 |
|
CF01 | Termination of patent right due to non-payment of annual fee |