CN109950425A - Production method, display panel and the electronic equipment of display panel - Google Patents
Production method, display panel and the electronic equipment of display panel Download PDFInfo
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- CN109950425A CN109950425A CN201910176611.4A CN201910176611A CN109950425A CN 109950425 A CN109950425 A CN 109950425A CN 201910176611 A CN201910176611 A CN 201910176611A CN 109950425 A CN109950425 A CN 109950425A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 33
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 104
- 230000000903 blocking effect Effects 0.000 claims abstract description 99
- 239000010409 thin film Substances 0.000 claims abstract description 59
- 239000003292 glue Substances 0.000 claims abstract description 57
- 239000010408 film Substances 0.000 claims abstract description 47
- 239000002096 quantum dot Substances 0.000 claims abstract description 25
- 238000005538 encapsulation Methods 0.000 claims abstract description 11
- 238000010521 absorption reaction Methods 0.000 claims description 31
- 230000004888 barrier function Effects 0.000 claims description 23
- 239000011159 matrix material Substances 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 abstract description 9
- 238000000034 method Methods 0.000 abstract description 7
- 238000004806 packaging method and process Methods 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 170
- 238000010586 diagram Methods 0.000 description 12
- 239000000463 material Substances 0.000 description 11
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 11
- 238000002360 preparation method Methods 0.000 description 8
- 238000007641 inkjet printing Methods 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 238000000231 atomic layer deposition Methods 0.000 description 6
- 238000007740 vapor deposition Methods 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 229910004205 SiNX Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The embodiment of the present application discloses production method, display panel and the electronic equipment of a kind of display panel, wherein this method comprises: providing a thin film transistor base plate；Blue light organic emissive diode component and the first water blocking layer are made, on thin film transistor base plate to obtain thin film transistor base plate encapsulating structure；One cover board is provided；Color film, quantum layer and the second water blocking layer are formed, on the cover board to obtain cover board encapsulating structure；It is thin film transistor base plate encapsulating structure and the progress of cover board encapsulating structure is vacuum abutted, wherein the first water blocking layer is bonded with the second water blocking layer by the way that filling glue is corresponding.The embodiment of the present application is by making BOLED on the tft substrate and being packaged, then QD is made on the cover board and is packaged, it is finally that TFT substrate encapsulating structure and cover board encapsulating structure is vacuum abutted, the packaging effect of display panel can be effectively promoted, and encapsulation requirement of the large scale display panel to quantum dot and Organic Light Emitting Diode can be met simultaneously.
Description
Technical field
This application involves field of display technology, and in particular to a kind of production method of display panel, display panel and electronics
Equipment.
Background technique
Quantum dot (Quantum Dot, QD) is a kind of inorganic nano level semiconductor material, by applying certain light to it
Pressure and electric field, it will issue the light of specific frequency, and the frequency of the light issued can become with the change of the size of quantum dot
Change, thus the size by being precisely controlled quantum dot can issue very pure RGB three primary colors, so that colour gamut is significantly improved,
It has been widely applied in QD-LCD TV at present.Organic Light Emitting Diode (Organic Light-Emitting Diode, OLED)
Possess the characteristics such as self-luminous, ultra-thin, fast response time, wide viewing angle, blue light organic emissive diode component (Blue Organic
Light-Emitting Diode, BOLED) it is ideal quantum dot excitation light source.Therefore combination (the QD- of quantum dot and BOLED
BOLED the advantages of) panel made will possess quantum dot and OLED simultaneously, to promote properties of product.
But QD and OLED are easy to be influenced by steam, it is necessary to be packaged.The mainstream of QD-LCD quantum dot is encapsulated as at present
The flaky material that quantum dot is accompanied between film is attached between backlight and liquid crystal display panel by On-Surface mode, but
In QD-BOLED panel, quanta point material in panel itself, although therefore On-Surface method it is more mature in QD-LCD, simultaneously
It is not suitable for QD-BOLED.Therefore need to develop new packaging method and structure to be packaged to QD-BOLED TV panel.
Summary of the invention
The embodiment of the present application provides production method, display panel and the electronic equipment of a kind of display panel, can effectively mention
The packaging effect of display panel is risen, and encapsulation of the large scale display panel to quantum dot and Organic Light Emitting Diode can be met simultaneously
It is required that.
The embodiment of the present application provides a kind of production method of display panel, comprising:
One thin film transistor base plate is provided；
Blue light organic emissive diode component and the first water blocking layer are made, on the thin film transistor base plate to obtain
Thin film transistor base plate encapsulating structure；
One cover board is provided；
Color film, quantum layer and the second water blocking layer are formed, on the cover board to obtain cover board encapsulating structure；
It is the thin film transistor base plate encapsulating structure and the progress of cover board encapsulating structure is vacuum abutted, wherein described first
Water blocking layer is bonded with the second water blocking layer by the way that filling glue is corresponding.
It is described to be made on the thin film transistor base plate in the production method of display panel described in the embodiment of the present application
Make blue light organic emissive diode component and the first water blocking layer, to obtain thin film transistor base plate encapsulating structure, comprising:
Blue light organic emissive diode component is made on the thin film transistor base plate；
The first water blocking layer is formed on the blue light organic emissive diode component, to obtain thin film transistor base plate encapsulation
Structure.
It is described to be made on the thin film transistor base plate in the production method of display panel described in the embodiment of the present application
Make blue light organic emissive diode component, comprising:
The blue light organic emissive two is made on the thin film transistor base plate by way of vapor deposition or inkjet printing
Pole pipe device.
It is described in the blue light organic emissive diode in the production method of display panel described in the embodiment of the present application
The first water blocking layer is formed on device, comprising:
It is formed on the blue light organic emissive diode component by way of plasma enhanced chemical vapor deposition
First water blocking layer.
It is described that color film, amount are formed on the cover board in the production method of display panel described in the embodiment of the present application
Sublayer and the second water blocking layer, to obtain cover board encapsulating structure, comprising:
Color film is formed on the cover board；
Barrier layer is formed on the color film, and forms pixel defining layer on the barrier layer；
Quantum layer is formed in the pixel defining layer；
The second water blocking layer is formed on the quantum layer；
It is successively coated with moisture absorption layer and frame glue in the periphery of second water blocking layer, and is coated with institute in the inside of the moisture absorption layer
Filling glue is stated, to obtain cover board encapsulating structure.
It is described that color film, packet are formed on the cover board in the production method of display panel described in the embodiment of the present application
It includes:
Being formed on the cover board has red pixel cell, green pixel cell, blue pixel cells and black square
The color film of battle array, wherein the black matrix" is distributed in the periphery and each adjacent red pixel cell, green picture of the color film
Between plain unit, blue pixel cells.
It is described to form barrier layer on the color film in the production method of display panel described in the embodiment of the present application,
Include:
The barrier layer is deposited on the color film by way of plasma enhanced chemical vapor deposition.
In the production method of display panel described in the embodiment of the present application, the pixel defining layer includes that multiple intervals are set
The pixel definition unit set, it is described to form quantum layer in the pixel defining layer, comprising:
Quantum dot is set between each spaced pixel definition unit, to form the quantum layer.
It is described in each spaced pixel in the production method of display panel described in the embodiment of the present application
Quantum dot is set between definition unit, comprising:
Quantum dot is set between each spaced pixel definition unit by way of inkjet printing.
It is described that the second resistance is formed on the quantum layer in the production method of display panel described in the embodiment of the present application
Water layer, comprising:
Institute is formed on the quantum layer by way of plasma enhanced chemical vapor deposition or atomic layer deposition
State the second water blocking layer.
It is described to encapsulate the thin film transistor base plate in the production method of display panel described in the embodiment of the present application
Structure and cover board encapsulating structure are vacuum abutted, comprising:
The thin film transistor base plate encapsulating structure and cover board encapsulation are tied by the moisture absorption layer, frame glue and filling glue
Structure is vacuum abutted, wherein first water blocking layer is bonded with the second water blocking layer by the way that the filling glue is corresponding, and the moisture absorption layer
The periphery of first water blocking layer is extended to frame glue；
The moisture absorption layer, frame glue and filling glue are solidified by way of ultra-violet curing or heating.
The embodiment of the present application also provides a kind of display panel, comprising: thin film transistor base plate encapsulating structure and cover board encapsulate
Structure；
Wherein, the thin film transistor base plate encapsulating structure includes that the thin film transistor base plate set gradually, blue light are organic
LED device and the first water blocking layer；
The cover board encapsulating structure includes the cover board set gradually, color film, quantum layer and the second water blocking layer, wherein institute
It states the first water blocking layer and is bonded with the second water blocking layer by the way that filling glue is corresponding.
In display panel described in the embodiment of the present application, the cover board encapsulating structure further includes barrier layer and pixel definition
Layer；
Wherein, on the color film, the pixel defining layer is arranged on the barrier layer, described for the barrier layer setting
Quantum layer is arranged in the pixel defining layer, and second water blocking layer is arranged on the quantum layer；
The periphery of second water blocking layer is also successively coated with moisture absorption layer and frame glue, and is coated in the inside of the moisture absorption layer
There is filling glue；First water blocking layer is bonded with the second water blocking layer by the way that the filling glue is corresponding, and the moisture absorption layer and frame glue
Extend to the periphery of first water blocking layer.
In display panel described in the embodiment of the present application, the pixel defining layer includes that multiple spaced pixels are fixed
Adopted unit is equipped with quantum dot, between each spaced pixel definition unit to form the quantum layer.
The embodiment of the present application also provides a kind of electronic equipment, including shell and display panel, and the display panel is mounted on
On the shell, the display panel is display panel described in the application any embodiment.
The production method of a kind of display panel provided by the embodiments of the present application, by providing a thin film transistor base plate；?
Blue light organic emissive diode component and the first water blocking layer are made on thin film transistor base plate, to obtain thin film transistor base plate
Encapsulating structure；One cover board is provided；Color film, quantum layer and the second water blocking layer are formed, on the cover board to obtain cover board encapsulating structure；
It is thin film transistor base plate encapsulating structure and the progress of cover board encapsulating structure is vacuum abutted, wherein the first water blocking layer blocks water with second
Layer passes through the corresponding fitting of filling glue.Then the embodiment of the present application is being covered by making BOLED on the tft substrate and being packaged
QD is made on plate and is packaged, it is finally that TFT substrate encapsulating structure and cover board encapsulating structure is vacuum abutted, it can effectively be promoted
The packaging effect of display panel, and large scale display panel can be met simultaneously, the encapsulation of quantum dot and Organic Light Emitting Diode is wanted
It asks.
Detailed description of the invention
In order to more clearly explain the technical solutions in the embodiments of the present application, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, the drawings in the following description are only some examples of the present application, for
For those skilled in the art, without creative efforts, it can also be obtained according to these attached drawings other attached
Figure.
Fig. 1 is the structural schematic diagram of electronic equipment provided by the embodiments of the present application.
Fig. 2 is the structural schematic diagram of display panel provided by the embodiments of the present application.
Fig. 3 is the first pass schematic diagram of the preparation method of display panel provided by the embodiments of the present application.
Fig. 4 is the second procedure schematic diagram of the preparation method of display panel provided by the embodiments of the present application.
Fig. 5 is the third flow diagram of the preparation method of display panel provided by the embodiments of the present application.
Fig. 6 is the 4th flow diagram of the preparation method of display panel provided by the embodiments of the present application.
Fig. 7 is the 5th flow diagram of the preparation method of display panel provided by the embodiments of the present application.
Fig. 8 and Fig. 9 is the preparation process flow schematic diagram of display panel provided by the embodiments of the present application.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present application, technical solutions in the embodiments of the present application carries out clear, complete
Site preparation description.Obviously, described embodiments are only a part of embodiments of the present application, instead of all the embodiments.It is based on
Embodiment in the application, those skilled in the art's every other implementation obtained without creative efforts
Example, shall fall in the protection scope of this application.
In the description of the present application, it is to be understood that term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " up time
The orientation or positional relationship of the instructions such as needle ", " counterclockwise " is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of
It describes the application and simplifies description, rather than the device or element of indication or suggestion meaning must have a particular orientation, with spy
Fixed orientation construction and operation, therefore should not be understood as the limitation to the application.In addition, term " first ", " second " are only used for
Purpose is described, relative importance is not understood to indicate or imply or implicitly indicates the quantity of indicated technical characteristic.
" first " is defined as a result, the feature of " second " can explicitly or implicitly include one or more feature.?
In the description of the present application, the meaning of " plurality " is two or more, unless otherwise specifically defined.
In the description of the present application, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected or can mutually communicate；It can be directly connected, it can also be by between intermediary
It connects connected, can be the connection inside two elements or the interaction relationship of two elements.For the ordinary skill of this field
For personnel, the concrete meaning of above-mentioned term in this application can be understood as the case may be.
In this application unless specifically defined or limited otherwise, fisrt feature second feature "upper" or "lower"
It may include that the first and second features directly contact, also may include that the first and second features are not direct contacts but pass through it
Between other characterisation contact.Moreover, fisrt feature includes the first spy above the second feature " above ", " above " and " above "
Sign is right above second feature and oblique upper, or is merely representative of first feature horizontal height higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " include that fisrt feature is directly below and diagonally below the second feature, or is merely representative of
First feature horizontal height is less than second feature.
Following disclosure provides many different embodiments or example is used to realize the different structure of the application.In order to
Simplify disclosure herein, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, and
And purpose does not lie in limitation the application.In addition, the application can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, itself not indicate between discussed various embodiments and/or setting
Relationship.In addition, this application provides various specific techniques and material example, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
The embodiment of the present application provides production method, display panel and the electronic equipment of a kind of display panel, the display panel
It can integrate in the electronic device, which can be made of the production method of display panel, which can be with
It is the equipment such as intelligent wearable device, smart phone, tablet computer, smart television.
Referring to Fig. 1, Fig. 1 is the structural schematic diagram of electronic equipment provided by the embodiments of the present application.The electronic equipment 100 can
To include display panel 10, control circuit 20 and shell 30.It should be noted that electronic equipment 100 shown in FIG. 1 is not
It is limited to the above content, can also includes other devices, for example can also includes camera, antenna structure, line unlocked state etc..
Wherein, display panel 10 is set on shell 30.
In some embodiments, display panel 10 can be fixed on shell 30, and display panel 10 and shell 30 form close
Space is closed, to accommodate the devices such as control circuit 20.
In some embodiments, shell 30 can be to be fabricated from a flexible material, for example be plastic casing or silica gel shell
Deng.
Wherein, which is mounted in shell 30, which can be the mainboard of electronic equipment 100,
Can integrate in control circuit 20 battery, antenna structure, microphone, loudspeaker, earphone interface, Universal Serial Bus Interface,
One in the functional units such as camera, range sensor, ambient light sensor, receiver and processor, it is two or more.
Wherein, which is mounted in shell 30, meanwhile, which is electrically connected to control circuit 20
On, to form the display surface of electronic equipment 100.The display panel 10 may include display area and non-display area.The display
Region can be used to show the picture of electronic equipment 100 or carry out touching manipulation etc. for user.The non-display area can be used for
Various functional units are set.
Referring to Fig. 2, Fig. 2 is the structural schematic diagram of display panel provided by the embodiments of the present application.The display panel 10 can
To include thin film transistor base plate encapsulating structure 11 and cover board encapsulating structure 12.
Wherein, thin film transistor base plate encapsulating structure 11 includes thin film transistor base plate (the Thin Film set gradually
Transistor, TFT) 111, blue light organic emissive diode component 112 and the first water blocking layer 113.
Cover board encapsulating structure 12 includes the cover board 121 set gradually, color film 122, quantum layer 123 and the second water blocking layer
124。
Wherein, the first water blocking layer 113 is bonded with the second water blocking layer 124 by the way that filling glue 125 is corresponding.
Wherein, color film 122 can be colored filter (Color filter, CF).
In some embodiments, color film 122 includes red pixel cell 1221, green pixel cell 1222, blue pixel
Unit 1223 and black matrix" 1224, wherein black matrix" 1224 be distributed in color film 122 periphery and each adjacent red
Pixel unit 1221, green pixel cell 1222, between blue pixel cells 1223.
In some embodiments, the first water blocking layer 113 can be by silicon nitride (SiNx), silicon oxynitride (SiON), silica
(SiOx) etc. any material or multiple materials are made.
In some embodiments, the second water blocking layer 124 can be by silicon nitride (SiNx), silicon oxynitride (SiON), silica
(SiOx), any material such as aluminum oxide (Al2O3), silica (SiO2) or multiple materials are made.
Wherein, the first water blocking layer 113 and the second water blocking layer 124 can be single layer structure or multilayered structure.When for multilayer
When structure, it can be made of multilayer inorganic material film；Or it can be made of multiple layer metal material film；Or by inorganic material
Material film is arranged alternately with metallic material film and is made.
In some embodiments, cover board encapsulating structure 12 further includes barrier layer 126 and pixel defining layer 127.
Wherein, barrier layer 126 is arranged on color film 122, and pixel defining layer 127 is arranged on barrier layer 126, quantum layer
123 are arranged in pixel defining layer 127, and the second water blocking layer 124 is arranged on quantum layer 123.
Wherein, the periphery of the second water blocking layer 124 is also successively coated with moisture absorption layer 128 and frame glue 129, and in moisture absorption layer 128
Inside be coated with filling glue 125；First water blocking layer 113 is bonded with the second water blocking layer 124 by the way that filling glue 125 is corresponding, and is inhaled
Wet layer 128 and frame glue 129 extend to the periphery of the first water blocking layer 113.
In some embodiments, pixel defining layer 127 includes multiple spaced pixel definition units 1271, each
Quantum dot 1231 is equipped between spaced pixel definition unit 1271, to form quantum layer 123.
In some embodiments, the first water blocking layer 113 coats blue light organic emissive diode component 112, the second water blocking layer
124 and barrier layer 126 coat quantum layer 123, and the first water blocking layer 113, the second water blocking layer 124 and barrier layer 126 are located at moisture absorption
The inside of layer 128.
Display panel 10 provided by the embodiments of the present application, including thin film transistor base plate encapsulating structure 11 and cover board encapsulation are tied
Structure 12；Thin film transistor base plate encapsulating structure 11 includes thin film transistor base plate (the Thin Film set gradually
Transistor, TFT) 111, blue light organic emissive diode component 112 and the first water blocking layer 113；Cover board encapsulating structure 12
Including cover board 121, color film 122, quantum layer 123 and the second water blocking layer 124 set gradually, wherein the first water blocking layer 113 with
Second water blocking layer 124 passes through the corresponding fitting of filling glue 125.The embodiment of the present application is by being packaged in TFT substrate encapsulation knot for BOLED
In structure, and QD is packaged in cover board encapsulating structure, finally that TFT substrate encapsulating structure and cover board encapsulating structure is vacuum abutted, can
Effectively to promote the packaging effect of display panel, and large scale display panel can be met simultaneously to quantum dot and organic light-emitting diodes
The encapsulation requirement of pipe.
In order to further describe the application, it is described below from the direction of the production method of display panel.
Please refer to Fig. 3 to Fig. 6, Fig. 3 to Fig. 6 be the production method of display panel provided by the embodiments of the present application first to
4th flow diagram.The production method of the display panel includes:
Step 101, a thin film transistor base plate 111 is provided.
Step 102, blue light organic emissive diode component 112 and the first resistance are made on thin film transistor base plate 111
Water layer 113, to obtain thin film transistor base plate encapsulating structure 11.
In some embodiments, as shown in figure 4, step 102 can be realized by step 1021 to 1022, specifically:
Step 1021, blue light organic emissive diode component 112 is made on thin film transistor base plate 111.
In some embodiments, blue light organic emissive diode component 112, packet are made on thin film transistor base plate 111
It includes:
Blue light organic emissive diode device is made on thin film transistor base plate 111 by way of vapor deposition or inkjet printing
Part 112.
Step 1022, the first water blocking layer 113 is formed, on blue light organic emissive diode component 112 to obtain film crystalline substance
Body pipe substrate encapsulation structure.
In some embodiments, the first water blocking layer 113 is formed on blue light organic emissive diode component 112, comprising:
Pass through plasma enhanced chemical vapor deposition (Plasma Enhanced Chemical Vapor
Deposition, PECVD) mode the first water blocking layer 113 is formed on blue light organic emissive diode component 112.
In some embodiments, the side of atomic layer deposition (Atomic Layer Deposition, ALD) can also be passed through
Formula forms the first water blocking layer 113 on blue light organic emissive diode component 112.
Step 103, a cover board 121 is provided.
Step 104, color film 122, quantum layer 123 and the second water blocking layer 124 are formed, on cover board 121 to obtain cover board
Encapsulating structure 12.
In some embodiments, as shown in figure 5, step 104 can be realized by step 1041 to 1045, specifically:
Step 1041, color film 122 is formed on cover board 121.
In some embodiments, color film 122 is formed on cover board 121, comprising:
Being formed on cover board 121 has red pixel cell 1221, green pixel cell 1222, blue pixel cells 1223
And the color film 122 of black matrix" 1224, wherein black matrix" 1224 be distributed in color film 122 periphery and each adjacent red
Pixel unit 1221, green pixel cell 1222, between blue pixel cells 1223.
Step 1042, barrier layer 126 is formed on color film 122, and pixel defining layer 127 is formed on barrier layer 126.
In some embodiments, barrier layer 126 is formed on color film 122, comprising:
Barrier layer 126 is deposited on color film 122 by way of plasma enhanced chemical vapor deposition.
Step 1043, quantum layer 123 is formed in pixel defining layer 127.
In some embodiments, pixel defining layer 127 includes multiple spaced pixel definition units 1271, in pixel
Quantum layer 123 is formed on definition layer 127, comprising:
Quantum dot 1231 is set between each spaced pixel definition unit 1271, to form the quantum layer
123。
In some embodiments, quantum dot 1231, packet are set between each spaced pixel definition unit 1271
It includes:
Quantum dot 1231 is set between each spaced pixel definition unit 1271 by way of inkjet printing.
Step 1044, the second water blocking layer 124 is formed on quantum layer 123.
In some embodiments, the second water blocking layer 124 is formed on quantum layer 123, comprising:
Second is formed on quantum layer 123 by way of plasma enhanced chemical vapor deposition or atomic layer deposition
Water blocking layer 124.
Step 1045, it is successively coated with moisture absorption layer 128 and frame glue 129 in the periphery of the second water blocking layer 124, and in moisture absorption layer
128 inside coating filling glue 125, to obtain cover board encapsulating structure 12.
For example, moisture absorption layer 128 and frame glue 129 can be successively coated in the periphery of the second water blocking layer 124 by dispenser, and
In the inside of moisture absorption layer 128 coating filling glue 125.
Step 105, thin film transistor base plate encapsulating structure 11 is carried out with cover board encapsulating structure 12 vacuum abutted, wherein
First water blocking layer 113 is bonded with the second water blocking layer 124 by the way that filling glue 125 is corresponding.
In some embodiments, as shown in fig. 6, step 105 can be realized by step 1051 to 1052, specifically:
Step 1051, by moisture absorption layer 128, frame glue 120 and filling glue 125 by thin film transistor base plate encapsulating structure 11
It is vacuum abutted with cover board encapsulating structure 12, wherein the first water blocking layer 113 is pasted with the second water blocking layer 124 by the way that filling glue 125 is corresponding
It closes, and moisture absorption layer 128 and frame glue 129 extend to the periphery of the first water blocking layer 113.
Step 1052, moisture absorption layer 128, frame glue 129 and filling glue 125 are carried out by way of ultra-violet curing or heating
Solidification.
In order to further describe the application, Fig. 7 to Fig. 9 is please referred to, Fig. 7 is display panel provided by the embodiments of the present application
5th flow diagram of production method, Fig. 8 and Fig. 9 are that the preparation process flow of display panel provided by the embodiments of the present application is shown
It is intended to.The production method of the display panel includes:
Step 201, a thin film transistor base plate 111 is provided.
Step 202, blue light organic emissive is made on thin film transistor base plate 111 by way of vapor deposition or inkjet printing
Diode component 112.
Step 203, in blue light organic emissive diode component 112 by way of plasma enhanced chemical vapor deposition
The first water blocking layer 113 of upper formation.
Step 204, a cover board 121 is provided.
Step 205, being formed on cover board 121 has red pixel cell 1221, green pixel cell 1222, blue pixel
The color film 122 of unit 1223 and black matrix" 1224.
Wherein, black matrix" 1224 is distributed in the periphery and each adjacent red pixel cell 1221, green of color film 122
Between pixel unit 1222, blue pixel cells 1223.
Step 206, barrier layer 126 is deposited on color film 122 by way of plasma enhanced chemical vapor deposition, with
And pixel defining layer 127 is formed on barrier layer 126.
Step 207, quantum layer 123 is formed in pixel defining layer 127 by way of inkjet printing.
In some embodiments, pixel defining layer 127 includes multiple spaced pixel definition units 1271.It can lead to
Quantum dot 1231 is arranged in the mode for crossing inkjet printing between each spaced pixel definition unit 1271, described in being formed
Quantum layer 123.
Step 208, the second water blocking layer 124 is formed on quantum layer 123.
In some embodiments, can by way of plasma enhanced chemical vapor deposition or atomic layer deposition
The second water blocking layer 124 is formed on quantum layer 123.
Step 209, it is successively coated with moisture absorption layer 128 and frame glue 129 in the periphery of the second water blocking layer 124, and in moisture absorption layer 128
Inside coating filling glue 125, to obtain cover board encapsulating structure 12.
Step 210, thin film transistor base plate encapsulating structure 11 is carried out with cover board encapsulating structure 12 vacuum abutted.Wherein,
First water blocking layer 113 is bonded with the second water blocking layer 124 by the way that filling glue 125 is corresponding.
In some embodiments, by moisture absorption layer 128, frame glue 120 and glue 125 can be filled by thin film transistor base plate
Encapsulating structure 11 and cover board encapsulating structure 12 are vacuum abutted, wherein the first water blocking layer 113 and the second water blocking layer 124 pass through filling
The corresponding fitting of glue 125, and moisture absorption layer 128 and frame glue 129 extend to the periphery of the first water blocking layer 113.
Step 211, moisture absorption layer 128, frame glue 129 and filling glue 125 are carried out by way of ultra-violet curing or heating
Solidification.
The production method of a kind of display panel provided by the embodiments of the present application, by providing a thin film transistor base plate；?
Blue light organic emissive diode component and the first water blocking layer are made on thin film transistor base plate, to obtain thin film transistor base plate
Encapsulating structure；One cover board is provided；Color film, quantum layer and the second water blocking layer are formed, on the cover board to obtain cover board encapsulating structure；
It is thin film transistor base plate encapsulating structure and the progress of cover board encapsulating structure is vacuum abutted, wherein the first water blocking layer blocks water with second
Layer passes through the corresponding fitting of filling glue.Then the embodiment of the present application is being covered by making BOLED on the tft substrate and being packaged
QD is made on plate and is packaged, it is finally that TFT substrate encapsulating structure and cover board encapsulating structure is vacuum abutted, it can effectively be promoted
The packaging effect of display panel, and large scale display panel can be met simultaneously, the encapsulation of quantum dot and Organic Light Emitting Diode is wanted
It asks.
The production method of display panel provided by the embodiments of the present application, display panel and electronic equipment have been carried out in detail above
Thin to introduce, specific examples are used herein to illustrate the principle and implementation manner of the present application, and above embodiments are said
It is bright to be merely used to help understand the application.Meanwhile for those skilled in the art, according to the thought of the application, specific real
Apply in mode and application range that there will be changes, in conclusion the content of the present specification should not be construed as the limit to the application
System.
Claims (10)
1. a kind of production method of display panel characterized by comprising
One thin film transistor base plate is provided；
Blue light organic emissive diode component and the first water blocking layer are made, on the thin film transistor base plate to obtain film
Transistor base encapsulating structure；
One cover board is provided；
Color film, quantum layer and the second water blocking layer are formed, on the cover board to obtain cover board encapsulating structure；
It is the thin film transistor base plate encapsulating structure and the progress of cover board encapsulating structure is vacuum abutted, wherein described first blocks water
Layer is bonded with the second water blocking layer by the way that filling glue is corresponding.
2. the production method of display panel as described in claim 1, which is characterized in that described in the thin film transistor base plate
Upper production blue light organic emissive diode component and the first water blocking layer, to obtain thin film transistor base plate encapsulating structure, comprising:
Blue light organic emissive diode component is made on the thin film transistor base plate；
The first water blocking layer is formed on the blue light organic emissive diode component, to obtain thin film transistor base plate encapsulation knot
Structure.
3. the production method of display panel as described in claim 1, which is characterized in that described to form coloured silk on the cover board
Film, quantum layer and the second water blocking layer, to obtain cover board encapsulating structure, including
Color film is formed on the cover board；
Barrier layer is formed on the color film, and forms pixel defining layer on the barrier layer；
Quantum layer is formed in the pixel defining layer；
The second water blocking layer is formed on the quantum layer；
Moisture absorption layer and frame glue are successively coated in the periphery of second water blocking layer, and are filled out described in the coating of the inside of the moisture absorption layer
Glue is filled, to obtain cover board encapsulating structure.
4. the production method of display panel as claimed in claim 3, which is characterized in that described to form coloured silk on the cover board
Film, comprising:
Being formed on the cover board has red pixel cell, green pixel cell, blue pixel cells and black matrix"
Color film, wherein the black matrix" is distributed in the periphery and each adjacent red pixel cell, green pixel list of the color film
Between member, blue pixel cells.
5. the production method of display panel as claimed in claim 3, which is characterized in that the pixel defining layer includes multiple
It is described to form quantum layer in the pixel defining layer every the pixel definition unit of setting, comprising:
Quantum dot is set between each spaced pixel definition unit, to form the quantum layer.
6. the production method of display panel as claimed in claim 3, which is characterized in that described by the thin film transistor base plate
Encapsulating structure and cover board encapsulating structure are vacuum abutted, comprising:
It is by the moisture absorption layer, frame glue and filling glue that the thin film transistor base plate encapsulating structure and cover board encapsulating structure is true
Sky fitting, wherein first water blocking layer is bonded with the second water blocking layer by the way that the filling glue is corresponding, and the moisture absorption layer and frame
Glue extends to the periphery of first water blocking layer；
The moisture absorption layer, frame glue and filling glue are solidified by way of ultra-violet curing or heating.
7. a kind of display panel characterized by comprising thin film transistor base plate encapsulating structure and cover board encapsulating structure；
Wherein, the thin film transistor base plate encapsulating structure includes the thin film transistor base plate set gradually, blue light organic emissive
Diode component and the first water blocking layer；
The cover board encapsulating structure includes the cover board set gradually, color film, quantum layer and the second water blocking layer, wherein described the
One water blocking layer is bonded with the second water blocking layer by the way that filling glue is corresponding.
8. display panel as claimed in claim 7, which is characterized in that the cover board encapsulating structure further includes barrier layer and pixel
Definition layer；
Wherein, the barrier layer setting is on the color film, and the pixel defining layer is arranged on the barrier layer, the quantum
Layer is arranged in the pixel defining layer, and second water blocking layer is arranged on the quantum layer；
The periphery of second water blocking layer is also successively coated with moisture absorption layer and frame glue, and is coated with and fills out on the inside of the moisture absorption layer
Fill glue；First water blocking layer is bonded with the second water blocking layer by the way that the filling glue is corresponding, and the moisture absorption layer and frame glue extend
To the periphery of first water blocking layer.
9. display panel as claimed in claim 8, which is characterized in that the pixel defining layer includes multiple spaced pictures
Plain definition unit is equipped with quantum dot, between each spaced pixel definition unit to form the quantum layer.
10. a kind of electronic equipment, which is characterized in that including shell and display panel, the display panel is mounted on the shell
On, the display panel is the described in any item display panels of claim 7 to 9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910176611.4A CN109950425A (en) | 2019-03-08 | 2019-03-08 | Production method, display panel and the electronic equipment of display panel |
| PCT/CN2019/080205 WO2020181591A1 (en) | 2019-03-08 | 2019-03-28 | Display panel manufacturing method, display panel, and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910176611.4A CN109950425A (en) | 2019-03-08 | 2019-03-08 | Production method, display panel and the electronic equipment of display panel |
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| CN109950425A true CN109950425A (en) | 2019-06-28 |
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| CN201910176611.4A Pending CN109950425A (en) | 2019-03-08 | 2019-03-08 | Production method, display panel and the electronic equipment of display panel |
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| Country | Link |
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| WO (1) | WO2020181591A1 (en) |
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Application publication date: 20190628 |