CN109855772B - Capacitive six-dimensional force sensor - Google Patents
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Abstract
The invention discloses a novel capacitive six-dimensional force sensor which comprises a deformation layer, a measurement layer, a PCB and an overload protection part. The measuring layer is fixed on the deformation layer inner ring, and the PCB board is fixed on the deformation layer outer ring. The movable electrode part on the measuring layer and the static electrode part on the PCB form 8 capacitors, wherein 4 capacitors are vertical capacitors with edge effect, and 4 capacitors are parallel plate capacitors. The inner ring of the deformation layer is subjected to space force to deform the snake-shaped beam of the deformation layer, so that the pole distance of the two poles of the capacitor is changed, the corresponding capacitance is also changed, the change value of the capacitance is acquired through the detection circuit, decoupling calculation is carried out, and the six-dimensional value of the counter stress is obtained. The invention adopts the design method of layering the measuring layer and the deformation layer to reduce the manufacturing difficulty, and simultaneously adopts the snake-shaped beam to make the rigidity of each dimension of the sensor similar when the sensor is full-scale, so as to meet the requirements of wide range and high sensitivity of the sensor.
Description
Technical Field
The invention belongs to the technical field of sensors, relates to a force sensor, and in particular relates to a capacitive six-dimensional force sensor.
Background
The six-dimensional force sensor can realize measurement of a spatial six-dimensional force signal, is used as one of the most important sensors for realizing industrial intellectualization, and is widely applied to the fields of machining, automobile manufacturing, intelligent robots, aerospace and the like. Force sensors are of many types, and the manner of generating force signals can be classified into strain type, piezoelectric type, piezomagnetic type, optical type, capacitive type, and the like. The force sensors which are mature in the market at present are mainly electromagnetic and strain. The essence of the output signal of the electromagnetic force sensor is that two paths of angular displacement signals with phase difference are combined to obtain moment information; the sensor is a non-contact sensor without abrasion, but cannot be applied to a robot due to the large size. The strain gauge has higher sensitivity and faster response, but the structure and circuit design are complex, the force decoupling is difficult, an additional A/D converter is needed, a strain gauge is needed to be precisely adhered, the strain gauge is easy to damage, and the strain gauge is too sensitive to electromagnetic noise.
The capacitive force sensor has the advantages of good temperature stability, simple structure, strong adaptability, small electrostatic attraction, good dynamic response, capability of realizing non-contact detection and the like. However, there are also some problems with the capacitive force sensor at present, such as: the capacitive force sensor has the limitations of use due to high output impedance, poor load capacity, low sensitivity and poor anti-interference capacity. Meanwhile, research of domestic capacitive sensors is mostly single-dimensional force sensors, six-dimensional force sensors are less in research, and the single-dimensional force sensors cannot detect complex forces at the tail end of a robot.
Disclosure of Invention
The invention aims to solve the problems of the existing capacitive force sensor, provides a capacitive six-dimensional force sensor, realizes six-dimensional force simultaneous detection, and simultaneously enables the sensor to have the technical indexes of wide range and high sensitivity.
In order to solve the technical problems, the invention adopts the following technical scheme:
The capacitive six-dimensional force sensor comprises a deformation layer 1, a measurement layer 2, a PCB 3 and an overload protection part 4; the deformation layer 1 at least comprises a deformation layer outer ring 5, a deformation layer inner ring 6, a snake-shaped beam 7 and an overload protection beam 8, wherein the upper surface and the lower surface of the deformation layer outer ring 5 are respectively provided with a boss 9 and a rectangular groove 10, and the boss 9 and the rectangular groove 10 are respectively provided with threaded holes for connecting the PCB 3 and the overload protection base 22; the deformation layer inner ring 6 is provided with a threaded hole 11 and a through hole 12 which are respectively used for connecting the measuring layer 2 and a joint reducer spindle; the deformation layer outer ring 5 is provided with a countersunk hole 26 for connecting an external load; the measuring layer 2 at least comprises a vertical capacitance moving electrode part 13, a parallel plate capacitance moving electrode part 14 and a measuring layer inner ring 15; the PCB 3 is provided with a mounting hole 16, a rectangular groove 17, a vertical capacitance electrostatic electrode part 18, a parallel plate capacitance electrostatic electrode part 19 and a sensor detection circuit; the serpentine beam 7 is located between the deformation layer outer ring 5 and the deformation layer inner ring 6. The mounting holes 16 are used for fixing the PCB 3 on the boss 9 of the deformation layer outer ring 5; the rectangular groove 17 is used for placing the vertical capacitive moving electrode portion 13.
The vertical type movable electrode part 13 at least comprises a first vertical type movable capacitance electrode 13-1, a second vertical type movable capacitance electrode 13-2, a third vertical type movable capacitance electrode 13-3 and a fourth vertical type movable capacitance electrode 13-4, and is uniformly distributed on the outer edge of the inner ring 15 of the measuring layer, and the other end of the measuring layer is suspended; the parallel plate capacitance moving electrode part 14 at least comprises a first parallel plate capacitance moving electrode 14-1, a second parallel plate capacitance moving electrode 14-2, a third parallel plate capacitance moving electrode 14-3 and a fourth parallel plate capacitance moving electrode 14-4, and is uniformly distributed on the outer edge of the inner ring 15 of the measuring layer, and the other end of the measuring layer is suspended; the vertical capacitance electrostatic electrode part 18 at least comprises a first vertical capacitance electrostatic electrode 18-1, a second vertical capacitance electrostatic electrode 18-2, a third vertical capacitance electrostatic electrode 18-3 and a fourth vertical capacitance electrostatic electrode 18-4; the parallel plate capacitance static electrode portion 19 includes at least a first parallel plate capacitance static electrode 19-1, a second parallel plate capacitance static electrode 19-2, a third parallel plate capacitance static electrode 19-3, and a fourth parallel plate capacitance static electrode 19-4.
The vertical capacitance electrode portion 13 and the vertical capacitance electrostatic electrode portion 18 constitute a vertical capacitor 20; the vertical capacitor 20 means: the first vertical capacitor movable electrode 13-1 is perpendicular to the first vertical capacitor static electrode 18-1, and a certain gap exists between the two electrode plates to form a first vertical capacitor 20-1 with an edge effect; the second vertical capacitance movable electrode 13-2 is perpendicular to the second vertical capacitance static electrode 18-2, and a certain gap exists between the two electrode plates to form a second vertical capacitor 20-2 with an edge effect; the third vertical capacitor movable electrode 13-3 is vertical to the third vertical capacitor static electrode 18-3, and a certain gap exists between the two electrode plates to form a third vertical capacitor 20-3 with an edge effect; the fourth vertical capacitor moving electrode 13-4 is perpendicular to the fourth vertical capacitor static electrode 18-4, and a certain gap exists between the two electrode plates, so as to form a fourth vertical capacitor 20-4 with an edge effect.
The first vertical type capacitor 20-1 and the third vertical type capacitor 20-3 are distributed along the X axis and symmetrical about the Y axis; the second vertical type capacitor 20-2 and the fourth vertical type capacitor 20-4 are distributed along the Y axis and symmetrical about the X axis.
The parallel plate moving electrode portion 14 and the parallel plate stationary electrode portion 19 constitute a parallel plate capacitor 21; the parallel plate capacitor 21 refers to: the first parallel plate capacitance movable electrode 14-1 is parallel to the first parallel plate capacitance static electrode 19-1, and a certain gap exists between the two plates to form a first parallel plate capacitor 21-1; the second parallel plate capacitance movable electrode 14-2 is parallel to the second parallel plate capacitance static electrode 19-2, and a certain gap exists between the two plates to form a second parallel plate capacitor 21-2; the third parallel plate capacitance movable electrode 14-3 is parallel to the third parallel plate capacitance static electrode 19-3, and a certain gap exists between the two plates to form a third parallel plate capacitor 21-3; the fourth parallel plate capacitance moving electrode 14-4 is parallel to the fourth parallel plate capacitance static electrode 19-4, and a certain gap exists between the two plates to form a first parallel plate capacitor 21-4.
The first parallel plate capacitor 21-1, the second parallel plate capacitor 21-2, the third parallel plate capacitor 21-3, and the fourth parallel plate capacitor 21-4 are uniformly distributed perpendicular to and around the Z-axis. When the sensor works, any force can be decomposed into space forces in the six directions of F X、FY、FZ、MX、MY、MZ, the pole distance h of 8 capacitors is changed when the sensor is stressed, the change amount is delta h 1、Δh2、Δh3、Δh4、Δh5、Δh6、Δh7、Δh8, and therefore the capacitance value is changed, and the change amount is delta C 1、ΔC2、ΔC3、ΔC4、ΔC5、ΔC6、ΔC7、ΔC8. Finally, the value of the spatial force F X、FY、FZ、MX、MY、MZ can be determined by a decoupling algorithm.
Wherein F X、FY、FZ represents force in X direction, force in Y direction and force in Z direction, and the unit is N;
M X、MY、MZ represents an X-direction moment, a Y-direction moment and a Z-direction moment respectively, and the unit is N.m.
The overload protection part 4 at least comprises an overload protection beam 8, an overload protection base 22 and an overload protection block 23; the overload protection beam 8 is a cantilever beam connected to the outer edge of the inner ring 5 of the deformation layer, and a threaded hole 24 is formed in the beam; the overload protection block 23 is of an L-shaped structure, is fixedly connected to the tail end of the overload protection beam 8 through a threaded hole 24, and a certain gap exists between the overload protection block 23 and the inner wall of the overload protection base 22; the overload protection base 22 is fixedly connected in the rectangular groove 10 through a threaded hole 25; the overload protection section 4 plays a multidirectional protection role in the sensor.
Compared with the prior art, the invention has the characteristics and advantages that:
The invention measures six-dimensional force based on the principle of capacitance edge effect and the principle of parallel capacitor, and adopts the snake beam to make the rigidity of each dimension of the sensor similar when the sensor is full scale, so as to meet the requirements of wide range and high sensitivity of the sensor. The invention also adopts the upper and lower layered distribution of the measuring layer and the deformation layer, and the measuring layer and the deformation layer can use different materials, so that the sensor is easier to process, and the manufacturing cost of the sensor is reduced. The overload protection device is added with an overload protection base, so that multidirectional overload protection can be realized.
Drawings
FIG. 1 is an exploded perspective view of the present invention;
FIG. 2 is a perspective view of the present invention;
FIG. 3 is a schematic view of the PCB in Z-direction of the present invention;
FIG. 4 is a schematic view of the measurement layer and PCB assembly in the Z-direction of the present invention;
FIG. 5 is an enlarged partial view of the overload protection portion of the present invention;
In the accompanying drawings: 1. a deformation layer; 2. a measurement layer; 3, a PCB board; 4. an overload protection part; 5. an outer ring of the deformation layer; 6. an inner ring of the deformation layer; 7. a snake beam; 8. an overload protection beam; 9. a boss; 10. rectangular grooves; 11. a threaded hole; 12. a through hole; 13. a vertical type movable electrode portion; 13-1, a first vertical capacitive moving electrode; 13-2, a second vertical capacitive moving electrode; 13-3, a third vertical capacitive moving electrode; 13-4, a fourth vertical capacitive moving electrode; 14. a parallel plate capacitance electrode portion; 14-1. A first parallel plate capacitive moving electrode; 14-2, a second parallel plate capacitive moving electrode; 14-3-a third parallel plate capacitive moving electrode; 14-4, a fourth parallel plate capacitive moving electrode; 15. measuring an inner ring of the layer; 16. a mounting hole; 17. rectangular grooves; 18. a vertical capacitance electrostatic electrode portion; 18-1, a first vertical capacitor static electrode; 18-2, a second vertical capacitance static electrode; 18-3, a third vertical capacitor static electrode; 18-4, a fourth vertical capacitance electrostatic electrode 19, a parallel plate capacitance electrostatic electrode portion; 19-1. A first parallel plate capacitive stationary electrode; 19-2, a second parallel plate capacitor static electrode; 19-3, a third parallel plate capacitance static electrode; 19-4, a fourth parallel plate capacitor static electrode; 20. a vertical capacitor; 20-1, a first vertical capacitor; 20-2 a second vertical capacitor; 20-3 a third vertical capacitor; 20-4 a fourth vertical capacitor; 21. a parallel plate capacitor; 21-1. A first parallel plate capacitor; 21-2. A second parallel plate capacitor; 21-3 a third parallel plate capacitor; 21-4 a fourth parallel plate capacitor; 22. an overload protection base; 23. an overload protection block; 24. a threaded hole; 25. a threaded hole; 26 countersunk holes.
Detailed Description
For a better understanding of the present invention, exemplary embodiments of the present invention will be described below with reference to the accompanying drawings.
The capacitive six-dimensional force sensor of the invention as shown in fig. 1 to 5 comprises a deformation layer 1, a measurement layer 2, a PCB 3 and an overload protection part 4; the deformation layer 1 at least comprises a deformation layer outer ring 5, a deformation layer inner ring 6, a snake-shaped beam 7 and an overload protection beam 8, wherein the upper surface and the lower surface of the deformation layer outer ring 5 are respectively provided with a boss 9 and a rectangular groove 10, and the boss 9 and the rectangular groove 10 are respectively provided with threaded holes for connecting the PCB 3 and the overload protection base 22; the deformation layer inner ring 6 is provided with a threaded hole 11 and a through hole 12 which are respectively used for connecting the measuring layer 2 and a joint reducer spindle; the deformation layer outer ring 5 is provided with a countersunk hole 26 for connecting an external load; the measuring layer 2 at least comprises a vertical capacitance moving electrode part 13, a parallel plate capacitance moving electrode part 14 and a measuring layer inner ring 15; the PCB 3 is provided with a mounting hole 16, a rectangular groove 17, a vertical capacitance electrostatic electrode part 18, a parallel plate capacitance electrostatic electrode part 19 and a sensor detection circuit; the serpentine beam 7 is located between the deformation layer outer ring 5 and the deformation layer inner ring 6. The mounting holes 16 are used for fixing the PCB 3 on the boss 9 of the deformation layer outer ring 5; the rectangular groove 17 is used for placing the vertical capacitive moving electrode portion 13.
The vertical type movable electrode part 13 at least comprises a first vertical type movable capacitance electrode 13-1, a second vertical type movable capacitance electrode 13-2, a third vertical type movable capacitance electrode 13-3 and a fourth vertical type movable capacitance electrode 13-4, and is uniformly distributed on the outer edge of the inner ring 15 of the measuring layer, and the other end of the measuring layer is suspended; the parallel plate capacitance moving electrode part 14 at least comprises a first parallel plate capacitance moving electrode 14-1, a second parallel plate capacitance moving electrode 14-2, a third parallel plate capacitance moving electrode 14-3 and a fourth parallel plate capacitance moving electrode 14-4, and is uniformly distributed on the outer edge of the inner ring 15 of the measuring layer, and the other end of the measuring layer is suspended; the vertical capacitance electrostatic electrode part 18 at least comprises a first vertical capacitance electrostatic electrode 18-1, a second vertical capacitance electrostatic electrode 18-2, a third vertical capacitance electrostatic electrode 18-3 and a fourth vertical capacitance electrostatic electrode 18-4; the parallel plate capacitance static electrode portion 19 includes at least a first parallel plate capacitance static electrode 19-1, a second parallel plate capacitance static electrode 19-2, a third parallel plate capacitance static electrode 19-3, and a fourth parallel plate capacitance static electrode 19-4.
The vertical capacitance electrode portion 13 and the vertical capacitance electrostatic electrode portion 18 constitute a vertical capacitor 20; the vertical capacitor 20 means: the first vertical capacitor movable electrode 13-1 is perpendicular to the first vertical capacitor static electrode 18-1, and a certain gap exists between the two electrode plates to form a first vertical capacitor 20-1 with an edge effect; the second vertical capacitance movable electrode 13-2 is perpendicular to the second vertical capacitance static electrode 18-2, and a certain gap exists between the two electrode plates to form a second vertical capacitor 20-2 with an edge effect; the third vertical capacitor movable electrode 13-3 is vertical to the third vertical capacitor static electrode 18-3, and a certain gap exists between the two electrode plates to form a third vertical capacitor 20-3 with an edge effect; the fourth vertical capacitor moving electrode 13-4 is perpendicular to the fourth vertical capacitor static electrode 18-4, and a certain gap exists between the two electrode plates, so as to form a fourth vertical capacitor 20-4 with an edge effect.
The first vertical type capacitor 20-1 and the third vertical type capacitor 20-3 are distributed along the X axis and symmetrical about the Y axis; the second vertical type capacitor 20-2 and the fourth vertical type capacitor 20-4 are distributed along the Y axis and symmetrical about the X axis.
The parallel plate moving electrode portion 14 and the parallel plate stationary electrode portion 19 constitute a parallel plate capacitor 21; the parallel plate capacitor 21 refers to: the first parallel plate capacitance movable electrode 14-1 is parallel to the first parallel plate capacitance static electrode 19-1, and a certain gap exists between the two plates to form a first parallel plate capacitor 21-1; the second parallel plate capacitance movable electrode 14-2 is parallel to the second parallel plate capacitance static electrode 19-2, and a certain gap exists between the two plates to form a second parallel plate capacitor 21-2; the third parallel plate capacitance movable electrode 14-3 is parallel to the third parallel plate capacitance static electrode 19-3, and a certain gap exists between the two plates to form a third parallel plate capacitor 21-3; the fourth parallel plate capacitance moving electrode 14-4 is parallel to the fourth parallel plate capacitance static electrode 19-4, and a certain gap exists between the two plates to form a first parallel plate capacitor 21-4.
The first parallel plate capacitor 21-1, the second parallel plate capacitor 21-2, the third parallel plate capacitor 21-3, and the fourth parallel plate capacitor 21-4 are uniformly distributed perpendicular to and around the Z-axis.
The working principle is as follows: when any force is applied, the force can be decomposed into space forces in six directions of F X、FY、FZ、MX、MY、MZ, so that the snake-shaped beam 7 deforms, the first vertical capacitor 20-1, the second electric vertical capacitor 20-2, the third vertical capacitor 20-3, the fourth vertical capacitor 20-4, the first parallel plate capacitor 21-1, the second parallel plate capacitor 21-2, the third parallel plate capacitor 21-3 and the first parallel plate capacitor 21-4 change with the polar distance, the change amount is delta h 1、Δh2、Δh3、Δh4、Δh5、Δh6、Δh7、Δh8, the capacitance value is changed, and the change amount is delta C 1、ΔC2、ΔC3、ΔC4、ΔC5、ΔC6、ΔC7、ΔC8. Assuming that the input force is linear with the capacitance change, a 6×8 matrix a can be obtained through experimentation, and the following decoupling formula is established:
F＝AΔC
in the middle of ,F＝(FX、FY、FZ、MX、MY、MZ)T,ΔC＝(ΔC1、ΔC2、ΔC3、ΔC4、ΔC5、ΔC6、ΔC7、ΔC8)T;
F X、FY、FZ represents the force in the X direction, the force in the Y direction and the force in the Z direction, respectively, and the unit is N;
M X、MY、MZ respectively represents an X-direction moment, a Y-direction moment and a Z-direction moment, and the unit is N.m;
From the above analysis, the value of the six-dimensional space force F X、FY、FZ、MX、MY、MZ can be found.
The overload protection part 4 at least comprises an overload protection beam 8, an overload protection base 22 and an overload protection block 23; the overload protection beam 8 is a cantilever beam connected to the outer edge of the inner ring 5 of the deformation layer, and a threaded hole 24 is formed in the beam; the overload protection block 23 is of an L-shaped structure, is fixedly connected to the tail end of the overload protection beam 8 through a threaded hole 24, and a certain gap exists between the overload protection block 23 and the inner wall of the overload protection base 22; the overload protection base 22 is fixedly connected in the rectangular groove 10 through a threaded hole 25; the overload protection section 4 plays a multidirectional protection role in the sensor.
The above is only a preferred embodiment of the present invention, but the present invention is not limited to this example, and the number of capacitors used in this example is 8, the number of vertical capacitors and parallel capacitors is 4, the number of capacitors is 6, and the number of vertical capacitors and parallel capacitors is 3, which are also the scope of the present invention, and it should be pointed out that all equivalent technical variations studied by applying the principles of the present invention are included in the scope of the patent of this invention.
Claims (8)
1. A capacitive six-dimensional force sensor, characterized by: the device at least comprises a deformation layer (1), a measuring layer (2), a PCB (3) and an overload protection part (4); the deformation layer (1) at least comprises a deformation layer outer ring (5), a deformation layer inner ring (6), a snake-shaped beam (7) and an overload protection beam (8); a boss (9) and a rectangular groove (10) are respectively arranged on the upper part and the lower part of the outer ring (5) of the deformation layer; a threaded hole (11) and a through hole (12) are formed in the deformation layer inner ring (6); the measuring layer (2) is fixedly connected to the inner ring (6) of the deformation layer through a threaded hole (11); the measuring layer (2) at least comprises a vertical capacitive electrode part (13), a parallel plate capacitive electrode part (14) and a measuring layer inner ring (15), wherein the vertical capacitive electrode part (13) is uniformly distributed on the outer edge of the measuring layer inner ring (15), the other end of the vertical capacitive electrode part is suspended, the parallel plate capacitive electrode part (14) is uniformly distributed on the outer edge of the measuring layer inner ring (15), the other end of the parallel plate capacitive electrode part is suspended, the PCB (3) is fixedly connected to a boss (9) on the deformation layer outer ring (5), the PCB (3) is provided with a mounting hole (16), a rectangular groove (17), a vertical capacitive electrode part (18), a parallel plate capacitive electrode part (19) and a sensor detection circuit, the rectangular groove (17) is used for placing the vertical capacitive electrode part (13), and the vertical capacitive electrode part (13) is perpendicular to the vertical capacitive electrode part (18) to form a vertical capacitor (20); -said parallel plate capacitive electrode portion (14) constitutes a parallel plate capacitor (21) parallel to said parallel plate capacitive electrode portion (19); the serpentine beam (7) is located between the deformation layer outer ring (5) and the deformation layer inner ring (6).
2. A capacitive six-dimensional force sensor according to claim 1, characterized in that: the vertical capacitance electrode part (13) at least comprises a first vertical capacitance electrode (13-1), a second vertical capacitance electrode (13-2), a third vertical capacitance electrode (13-3) and a fourth vertical capacitance electrode (13-4); the parallel plate capacitance moving electrode (14) at least comprises a first parallel plate capacitance moving electrode (14-1), a second parallel plate capacitance moving electrode (14-2), a third parallel plate capacitance moving electrode (14-3) and a fourth parallel plate capacitance moving electrode (14-4).
3. A capacitive six-dimensional force sensor according to claim 2, characterized in that: the vertical capacitance electrostatic electrode part (18) at least comprises a first vertical capacitance electrostatic electrode (18-1), a second vertical capacitance electrostatic electrode (18-2), a third vertical capacitance electrostatic electrode (18-3) and a fourth vertical capacitance electrostatic electrode (18-4); the parallel plate capacitance electrostatic electrode part (19) at least comprises a first parallel plate capacitance electrostatic electrode (19-1), a second parallel plate capacitance electrostatic electrode (19-2), a third parallel plate capacitance electrostatic electrode (19-3) and a fourth parallel capacitance plate electrostatic electrode (19-4); the mounting holes (16) are used for fixedly connecting the PCB (3) to the boss (9) of the outer ring (5) of the deformation layer.
4. A capacitive six-dimensional force sensor according to claim 2 or 3, characterized in that: the vertical capacitance electrode portion (13) and the vertical capacitance electrostatic electrode portion (18) constitute a vertical capacitor (20);
The vertical capacitor (20) is: the first vertical capacitor movable electrode (13-1) is vertical to the first vertical capacitor static electrode (18-1), and a certain gap exists between the two plates to form a first vertical capacitor (20-1) with an edge effect; the second vertical capacitance movable electrode (13-2) is vertical to the second vertical capacitance static electrode (18-2), and a certain gap exists between the two plates to form a second vertical capacitor (20-2) with edge effect; the third vertical capacitance movable electrode (13-3) is vertical to the third vertical capacitance static electrode (18-3), and a certain gap exists between the two plates to form a third vertical capacitor (20-3) with an edge effect; the fourth vertical capacitor movable electrode (13-4) is perpendicular to the fourth vertical capacitor static electrode (18-4), and a certain gap exists between the two plates to form a fourth vertical capacitor (20-4) with edge effect.
5. The capacitive six-dimensional force sensor of claim 4, wherein: the first vertical capacitor (20-1) and the third vertical capacitor (20-3) are distributed along the X axis and are symmetrical about the Y axis; the second vertical type capacitor (20-2) and the fourth vertical type capacitor (20-4) are distributed along the Y axis and symmetrical about the X axis.
6. A capacitive six-dimensional force sensor according to claim 2 or 3, characterized in that: the parallel plate capacitance electrode portion (14) and the parallel plate capacitance electrode portion (19) constitute a parallel plate capacitor (21);
The parallel plate capacitor (21) means: the first parallel plate capacitance movable electrode (14-1) is parallel to the first parallel plate capacitance static electrode (19-1), and a certain gap exists between the two plates to form a first parallel plate capacitor (21-1); the second parallel plate capacitance movable electrode (14-2) is parallel to the second parallel plate capacitance static electrode (19-2), and a certain gap exists between the two plates to form a second level line plate container (21-2); the third parallel plate capacitance movable electrode (14-3) is parallel to the third parallel plate capacitance static electrode (19-3), and a certain gap exists between the two plates to form a third parallel plate capacitor (21-3); the fourth parallel plate capacitance movable electrode (14-4) is parallel to the fourth parallel plate capacitance static electrode (19-4), and a certain gap exists between the two plates to form a first parallel plate capacitor (21-4).
7. The capacitive six-dimensional force sensor of claim 6, wherein: the first parallel plate capacitor (21-1), the second parallel plate capacitor (21-2), the third parallel plate capacitor (21-3) and the fourth parallel plate capacitor (21-4) are perpendicular to the Z axis and uniformly distributed around the Z axis.
8. A capacitive six-dimensional force sensor according to claim 1, characterized in that: the overload protection part (4) at least comprises an overload protection beam (8), an overload protection base (22) and an overload protection block (23); the overload protection beam (8) is a cantilever beam connected to the outer edge of the inner ring (5) of the deformation layer, and a threaded hole (24) is formed in the beam; the overload protection block (23) is of an L-shaped structure and is fixedly connected to the tail end of the overload protection beam (8) through a threaded hole (24), and a certain gap exists between the overload protection block (23) and the inner wall of the overload protection base (22); the overload protection base (22) is fixedly connected in the rectangular groove (10) through a threaded hole (25); the overload protection part (4) plays a multi-directional overload protection role in the whole sensor.
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| US10190928B1 (en) * | 2016-11-17 | 2019-01-29 | X Development Llc | Flexible sensor for measuring flex or torque |
| CN110243528B (en) * | 2019-07-08 | 2020-11-03 | 台州学院 | Six-dimensional force detection device based on liquid pressure measurement |
| CN110579304A (en) * | 2019-10-17 | 2019-12-17 | 广西大学 | Differential capacitance multidimensional force sensor |
| CN111693198B (en) * | 2020-05-15 | 2021-06-01 | 吉林大学 | Double-plate type six-dimensional force torque sensor |
| CN112345136A (en) * | 2020-10-27 | 2021-02-09 | 广西安博特智能科技有限公司 | Anti-interference capacitive torque sensor |
| CN114623959A (en) * | 2020-12-10 | 2022-06-14 | 苏州艾利特机器人有限公司 | High overload protection force sensor |
| CN113218558B (en) * | 2021-05-08 | 2022-11-01 | 广西大学 | Capacitance type six-dimensional force sensor capacitor plate displacement calculation method |
| CN114659696B (en) * | 2022-03-22 | 2024-02-20 | 广西大学 | Capacitive six-dimensional force sensor |
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