CN109698894B

CN109698894B - Photosensitive assembly and camera module based on metal support

Info

Publication number: CN109698894B
Application number: CN201710985806.4A
Authority: CN
Inventors: 赵波杰; 梅哲文
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2017-10-20
Filing date: 2017-10-20
Publication date: 2023-06-30
Anticipated expiration: 2037-10-20
Also published as: CN111345021A; WO2019076352A1; CN109698894A

Abstract

The photosensitive assembly comprises a circuit board, a photosensitive element and a molding base, wherein the photosensitive element is electrically connected to the circuit board, and the module is integrally formed on the circuit board and the photosensitive element. The photosensitive assembly further comprises a light filtering element and a metal bracket, wherein the metal bracket is arranged on the top surface of the molding base for installing the light filtering element, and a light window for providing a light path for the photosensitive element is formed among the light filtering element, the light filtering element bracket and the molding base.

Description

Photosensitive assembly and camera module based on metal support

Technical Field

The invention relates to the field of camera modules, in particular to a photosensitive assembly and a camera module based on a filter element mounted by a metal bracket.

Background

The camera module is one of indispensable components of the intelligent electronic device, such as but not limited to intelligent electronic devices including smart phones, cameras, computer devices, wearable devices, and the like. In the development trend of light, thin and integrated intelligent devices, the requirements for camera modules are also increasing. Particularly, along with popularization and development of intelligent equipment, the intelligent equipment increasingly tends to be light and thin, correspondingly, the camera module is adapted to development, and multifunctional integration, light and thin miniaturization are also increasingly required, so that the occupied volume of the camera module assembled on the intelligent electronic equipment can be correspondingly reduced, and the imaging requirement of the equipment on the camera module is met. Therefore, manufacturers of camera modules continue to strive to design, produce and manufacture camera modules that meet these requirements.

The molding packaging process is a packaging technology which is developed on the basis of the traditional COB (Chip on Board) packaging process. As shown in fig. 1A, is a circuit board assembly prepared using a conventional molding and encapsulation process. In this structure, a molding part 1 is packaged on a circuit board 2 in a molding packaging manner so as to integrally cover at least a part of the circuit board and electronic components assembled on the circuit board, such as a photosensitive chip 3, a passive electronic component and the like, and an optical filter 4 is attached to the top side of the molding part 1, so that the space occupied independently by the electronic components of the camera module and the matching safety space reserved in the assembly process are reduced, and the problem that dust attached to the electronic components affects the imaging quality of the camera module is solved. However, this solution also brings new technical problems.

Those skilled in the art will appreciate that the optical filter 4 is an extremely important element in the camera module, and is capable of filtering stray light such as infrared light in light, so that the final imaging effect is better close to the visual effect observed by human eyes. Since the optical filter 4 is a fragile and highly sensitive precision electronic device, it occupies a large weight in the cost of the entire camera module. Therefore, in the molding packaging technology, the filter 4 becomes a difficulty in implementation.

More specifically, compared with the conventional COB packaging method, the molding part 1 prepared by the molding packaging process is provided to integrally encapsulate the electronic component mounted on the circuit board 2 and utilize the spatial position of the electronic component. Accordingly, the mounting space provided for the optical filter 4 by the molding part 1 is correspondingly increased with respect to the lens holder in the conventional COB package technology. At this time, if the filter 4 is selected to be directly mounted to the corresponding region of the top surface of the molding part, the area required for the filter 4 is large. Accordingly, the cost of the optical filter is proportional to the area required by the optical filter, and as the area of the optical filter increases, the preparation accuracy of the optical filter is more difficult to control and the hardness of the optical filter is correspondingly reduced. Therefore, when the area required for the filter 4 increases, not only does this increase in cost, but also increases the difficulty of installation and implementation.

Further, in general, the filter 4 is directly assembled to the top side of the molding part 1 to hold the filter 4 above the photosensitive region of the photosensitive chip 3 by the molding part 1. The optical filter 4 is made of a fragile material, so that when the optical filter 4 is assembled on the molding part 1, the surface of the optical filter 4 is not uniformly stressed and is easy to break or damage.

In order to solve the problems of high installation difficulty, easy breakage and high cost of the optical filter 4, an improvement scheme exists in the prior art: a filter element mount 5 is additionally provided to improve the mounting conditions of the filter 4. In a specific implementation, as shown in fig. 1B, the filter element mount 5 is mounted on the top surface of the molding part 1, so that the filter 4 is mounted by the filter element mount 5 instead of the molding part 1. Accordingly, the size of the filter 4 can be reduced by adjusting the size of the mounting groove of the filter holder 5, and the breakage of the filter 4 can be prevented by providing a supporting force by the filter holder 5.

However, the conventional optical filter element lens base 5 is manufactured through an integral molding process, such as a molding process or an injection molding process, and has a large thickness. For example, in the circuit board assembly of the conventional camera module, typically, for example, in a specific embodiment, the height of the molding part 1 is 0.3mm, the height of the circuit board 2 is 0.2mm, and the height of the filter element mount 5 is about 0.3mm, which exceeds half of the overall height of the circuit board and the molding part. Therefore, the overall height of the circuit board assembly is increased by the optical filter lens base 5, so that the optical back focus of the camera module is correspondingly increased, and the reduction of the optical back focus is always pursued in the optical design of the camera module.

Disclosure of Invention

It is an object of the present invention to provide a metal bracket-based photosensitive assembly and camera module, wherein the camera module includes a metal bracket that mates with a molded base of the camera module to provide support for other components of the camera module.

It is another object of the present invention to provide a photosensitive assembly and a camera module based on a metal bracket, wherein the metal bracket is mounted on a corresponding position on the top surface of the molded base, so as to provide a proper mounting position for the filter element of the camera module instead of the molded base.

Another object of the present invention is to provide a photosensitive assembly and an image capturing module based on a metal bracket, wherein the metal bracket is made of a metal material, and has a relatively thin thickness compared to the existing optical filter element lens base, so that the overall height dimension of the image capturing module can be reduced.

Another object of the present invention is to provide a photosensitive assembly and an image capturing module based on a metal bracket, wherein the metal bracket is made of a metal material, and has a relatively thin thickness compared to the existing optical filter element lens base, so that the optical back focus of the image capturing module can be reduced.

It is another object of the present invention to provide a photosensitive assembly and camera module based on a metal bracket, wherein in some embodiments, the outer edge of the metal bracket is inside the outer edge of the top surface of the molded base, so as to avoid the metal bracket from being broken by external force of a side part, and further damage to the filter element.

Another object of the present invention is to provide a photosensitive assembly and an image pickup module based on a metal bracket, wherein in some embodiments, a part of the outer edge of the metal bracket is located between the outer edge of the top surface of the molding base and the outer edge of the lens/driver/fixed barrel, so as to avoid the metal bracket from being broken by external force impact of a side part, further possibly causing damage to the filter element, and to conform to an arc or inclined plane of the edge of the electronic device when being mounted on the electronic device.

Another object of the present invention is to provide a photosensitive assembly and a camera module based on a metal bracket, wherein an optical absorption layer is formed on an outer surface of the metal bracket, so as to prevent stray light reflected by the metal bracket from entering a photosensitive area of the camera module, and influence imaging quality.

Another object of the present invention is to provide a photosensitive assembly and an image capturing module based on a metal support, wherein a light shielding area is formed between a light absorbing layer on an outer surface of the metal support and an inner surface of the mold base, so that light reflected by the inner surface of the mold base to reach the light absorbing layer is absorbed by the light absorbing layer, thereby preventing the light from reaching the photosensitive element and affecting imaging quality.

It is another object of the present invention to provide a photosensitive assembly and an image capturing module based on a metal bracket, wherein in some embodiments, the step surface may be not higher than the height of the electronic component of the circuit board but not lower than the height of the lead, so as to further move down the position of the metal bracket.

Another object of the present invention is to provide a photosensitive assembly and an image capturing module based on a metal bracket, wherein a better light transmission channel is provided for the image capturing module by setting a light transmission region of the metal bracket, so as to prevent external stray light from entering the photosensitive region of the image capturing module from the perspective of a physical structure.

Another object of the present invention is to provide a photosensitive assembly and an image capturing module based on a metal bracket, wherein the metal bracket is made of a metal material, so that the metal bracket is not easy to deform during a subsequent baking and curing process of the image capturing module, and a relative positional relationship between the metal bracket and a device mounted on the metal bracket is effectively ensured to be stable.

Another object of the present invention is to provide a photosensitive assembly and an image capturing module based on a metal bracket, wherein the metal bracket is made of a metal material, and has good thermal conductivity, so that heat generated in the circuit board can be conducted and dissipated through the metal bracket during the subsequent operation of the image capturing module.

Another object of the present invention is to provide a photosensitive assembly and a camera module based on a metal bracket, wherein the metal bracket is formed with an air vent, and the air vent is suitable for providing an air vent in the baking and fixing process of the camera module, so as to prevent the filter element from being damaged or broken due to thermal expansion of the air in the closed space in the camera module.

It is another object of the present invention to provide a photosensitive assembly and an image capturing module based on a metal bracket, wherein in some embodiments, the metal bracket has a supporting slot, and the filter element is adapted to be mounted in the supporting slot of the filter element, so that the position of the filter element is relatively sunk.

Another object of the present invention is to provide a photosensitive assembly and an image capturing module based on a metal bracket, wherein the height of the supporting groove is slightly larger than the thickness of the optical filter element, so that when the optical filter element is mounted on the supporting groove of the optical filter element, the optical filter element does not protrude from the top surface of the metal bracket, thereby effectively preventing the optical filter element from touching with the last optical lens of the image capturing module.

Another object of the present invention is to provide a photosensitive assembly and an image pickup module based on a metal holder, wherein the metal holder made of a metal material has a relatively high flatness, so that when an optical lens or a driver or a fixed barrel of the image pickup module is supported to the metal holder instead of the molded base, the installation and calibration of the optical lens or the driver are facilitated.

Another object of the present invention is to provide a photosensitive assembly and an image capturing module based on a metal bracket, wherein the size of the optical filter element required can be reduced when the optical filter element is assembled to the molded base through the metal bracket, so as to reduce the cost.

Another object of the present invention is to provide a photosensitive assembly and an image capturing module based on a metal bracket, wherein the metal bracket is made of a metal material, the processing process is relatively mature and simple, and the cost of the metal material is relatively low.

Another object of the present invention is to provide a photosensitive assembly and a camera module based on a metal support, wherein the metal support with different specifications can be prepared by a metal processing process, such as a stamping processing process, so as to adapt to the requirements of different camera modules on different metal supports.

Other advantages and features of the invention will become apparent from the following description, and may be realized by means of the instrumentalities and combinations particularly pointed out in the claims.

To achieve at least one of the objects of the invention, the present invention provides a photosensitive assembly, comprising:

a circuit board;

the photosensitive element is electrically connected to the circuit board;

a molding base, wherein the molding base is integrally formed with the circuit board and the photosensitive element;

a filter element; and

and a metal bracket, wherein the metal bracket is arranged on the top surface of the molding base for installing the light filtering element, and a light window for providing a light path for the photosensitive element is formed among the light filtering element, the metal bracket and the molding base.

Further objects and advantages of the present invention will become fully apparent from the following description and the accompanying drawings.

These and other objects, features and advantages of the present invention will become more fully apparent from the following detailed description, the accompanying drawings and the appended claims.

Drawings

Fig. 1A is a schematic cross-sectional view of a circuit board assembly of a camera module according to one prior art.

Fig. 1B is a schematic cross-sectional view of a circuit board assembly of a camera module according to another prior art.

Fig. 2 is a schematic cross-sectional view of an image capturing module according to a preferred embodiment.

Fig. 3 is a schematic cross-sectional view of an image capturing module according to a modified embodiment of the present invention.

Fig. 4 is a schematic optical path propagation diagram of the camera module according to the above preferred embodiment of the invention. .

Fig. 5 is a schematic cross-sectional view of another variant of the camera module according to the above preferred embodiment of the present invention.

Fig. 6 is a schematic cross-sectional view of another variant of the camera module according to the above preferred embodiment of the present invention.

Fig. 7 is a schematic cross-sectional view of another variant of the camera module according to the above preferred embodiment of the present invention.

Fig. 8 is a schematic cross-sectional view of another variant of the camera module according to the above preferred embodiment of the present invention.

Fig. 9 is a schematic cross-sectional view of another variant of the camera module according to the above preferred embodiment of the present invention.

Fig. 10 is a schematic cross-sectional view of an image capturing module according to a second preferred embodiment of the present invention.

Fig. 10A is a schematic cross-sectional view of a variant embodiment of the camera module according to the second preferred embodiment of the present invention.

Fig. 10B is a schematic cross-sectional view of another variant of the camera module according to the second preferred embodiment of the present invention.

Fig. 10C is a schematic cross-sectional view of another variant of the camera module according to the second preferred embodiment of the present invention.

Fig. 10D is a schematic cross-sectional view of another variant of the camera module according to the second preferred embodiment of the present invention.

Fig. 11 is a schematic cross-sectional view of another variant of the camera module according to the second preferred embodiment of the present invention.

Fig. 12 is a schematic cross-sectional view of another variant of the camera module according to the second preferred embodiment of the present invention.

Fig. 13 is a schematic cross-sectional view of an image capturing module according to a third preferred embodiment of the present invention.

Fig. 14 is a perspective exploded view of a camera module according to a fourth preferred embodiment of the present invention.

Fig. 15 is a perspective exploded view of a modified embodiment of the camera module according to the fourth preferred embodiment.

Fig. 16A is a schematic diagram of one of the steps of manufacturing the camera module in the above preferred embodiment.

Fig. 16B is a schematic view of a second step of manufacturing the camera module in the above preferred embodiment.

FIG. 16C is a schematic view of a third step of manufacturing the camera module according to the preferred embodiment.

Fig. 17A is a schematic diagram of a fourth step of manufacturing the image capturing module in the above preferred embodiment.

Fig. 17B is a schematic diagram of a fifth step of manufacturing the camera module in the above preferred embodiment.

Fig. 18 is a schematic diagram of a sixth step of manufacturing the image capturing module in the above preferred embodiment.

Fig. 19 is a schematic view of a seventh step of manufacturing the image capturing module in the above preferred embodiment.

Fig. 20 is a schematic view of an eighth step of manufacturing the image pickup module in the above preferred embodiment.

Detailed Description

The following description is presented to enable one of ordinary skill in the art to make and use the invention. The preferred embodiments in the following description are by way of example only and other obvious variations will occur to those skilled in the art. The basic principles of the invention defined in the following description may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.

It will be appreciated by those skilled in the art that in the present disclosure, the terms "longitudinal," "transverse," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," etc. refer to an orientation or positional relationship based on that shown in the drawings, which is merely for convenience of description and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore the above terms should not be construed as limiting the present invention.

It is to be understood that the terms "a" and "an" are to be interpreted as referring to "at least one" or "one or more," i.e., in one embodiment, the number of elements may be one, while in another embodiment, the number of elements may be more than one, and the term "a" is not to be construed as limiting the number.

Referring to fig. 2, a camera module according to a first preferred embodiment of the present invention is illustrated, wherein the camera module can be applied to various electronic devices, such as but not limited to smart phones, wearable devices, computer devices, televisions, vehicles, cameras, monitoring devices, and the camera module cooperates with the electronic devices to perform functions of capturing and reproducing target images.

As shown in fig. 2, the image capturing module includes a photosensitive assembly 10 and an optical lens 20, wherein the optical lens 20 is located in a photosensitive path of the photosensitive assembly 10 to collect image information of a measured object through the optical lens 20. In particular, in this preferred implementation of the invention, the camera module is a fixed focus camera module, i.e. the focal length between the optical lens 20 and the photosensitive assembly 10 is not adjustable. In particular, the optical lens 20 is assembled on top of the photosensitive assembly 10 through a lens barrel 20 as a lens carrying element. It will be appreciated that as the packaging process improves, the size of the camera module is continuously reduced, and in another variant embodiment, the optical lens 20 is assembled on top of the photosensitive assembly 10 in a "bare lens" manner, i.e. at this time, the optical lens 20 is directly mounted on the top region of the photosensitive assembly 10 without the lens barrel 20 or the lens carrying element, as shown in fig. 10D.

It should be appreciated by those skilled in the art that, in another embodiment of the present invention, as shown in fig. 3, the image capturing module may be implemented as a dynamic focus image capturing module, that is, in this embodiment, the image capturing module further includes a driving element 30, the driving element 30 is mounted on the top side of the photosensitive assembly 10, and the optical lens 20 is assembled to the driving element 30, so that when the driving element 30 is driven, the relative positional relationship between the optical lens 20 and a photosensitive element 12 of the photosensitive assembly 10 is changed, in such a way that an optical focusing function is achieved. It is worth mentioning that the driving element 30 includes, but is not limited to, voice coil motor, stepper motor, MEMS, etc.

More specifically, as shown in fig. 2, the photosensitive assembly 10 includes a circuit board 11, a photosensitive element 12, and a molded base 13. The photosensitive element 12 is conductively connected to the circuit board 11, wherein light from the measured object passes through the photosensitive assembly 10 and reaches the photosensitive element 12, so that the optical signal of the measured object is further converted into an electrical signal which can be identified and operated by the electronic device through the photosensitive reaction of the photosensitive element 12, and functions such as image acquisition and reproduction of the measured object are realized. The molding base 13 is integrally formed with the circuit board 11 and the photosensitive element 12, and covers at least a portion of the circuit board 11 and the photosensitive element 12, so that the photosensitive assembly 10 and the camera module have a compact and miniaturized structure.

In the preferred embodiment of the present invention, the photosensitive element 12 may be mounted on the corresponding region of the wiring board 11 by SMT (Surface Mounting Technology, surface mount technology), for example, and further, an electrical connection between the wiring board 11 and the photosensitive element 12 is achieved by a set of leads 14. That is, in the preferred embodiment of the present invention, the photosensitive assembly 10 further includes a set of leads 14, and the leads 14 extend between the photosensitive element 12 and the wiring board 11 to conduct the wiring board 11 and the photosensitive element 12 through the leads 14. Those skilled in the art will appreciate that the manner in which the wiring board 11 and the photosensitive element 12 are conducted is referred to as a "gold-plating" process. It should be noted that, in the present invention, the manner of forward "wire bonding" is selected, that is, the lead 14 extends from the circuit board 11 to the photosensitive element 12, or the manner of reverse "wire bonding" is selected, that is, the lead 14 extends from the photosensitive element 12 to the circuit board 11, so that the photosensitive element 12 and the circuit board 11 are conducted, which is not limited by the present invention. Of course, in other embodiments of the present invention, the photosensitive element 12 may be mounted on the circuit board 11 by other manners, such as embedding, FC (Flip Chip), and the like. It will be appreciated by those skilled in the art that the manner of mounting and conducting between the photosensitive element 12 and the wiring board 11 is not a limitation of the present invention.

Further, after the photosensitive element 12 is mounted on the circuit board 11 and is in conduction with the circuit board 11, a molding process is performed to form the molded base 13 on the photosensitive element 12 and the circuit board 11. As shown in fig. 2, the molding base 13 is integrally formed on the photosensitive element 12 and the circuit board 11, and covers at least a portion of the photosensitive element 12 and a series of electronic components mounted on the circuit board 11, so that the overall size of the photosensitive assembly 10 is effectively reduced, and dust and impurities similar to those in a conventional camera module are effectively prevented from adhering to the electronic components to pollute the photosensitive element 12 and affect the imaging effect. More specifically, the molding base 13 includes a molding base body 131 and a light window 132 formed by the molding base body 131, wherein the light window is a closed space and corresponds to at least a photosensitive area of the photosensitive element 12, so as to allow light from the outside to enter the photosensitive element 12 through the light window 132 to complete image capturing. In particular, in the preferred embodiment of the present invention, the molded base body 131 has a closed annular configuration so as to provide a closed internal environment for the photosensitive element 12, preventing ambient stray light from entering the photosensitive element 12 from the side.

It should be noted that, preferably, in the present invention, the molded base body 131 has a central symmetrical structure, and has an inner surface 1311 defined as the inner surface 1311 of the molded base. The molded base inner surface 1311 may extend upward from the circuit board 11 and the photosensitive element 12 with a constant slope, or the molded base inner surface 1311 may extend upward from the circuit board 11 and the photosensitive element 12 with no slope, i.e., the molded base inner surface 1311 is substantially perpendicular to the circuit board 11. It will be appreciated that in further embodiments of the invention, the molded base inner surface 1311 has multiple segments of surfaces, wherein the segments of surfaces do not extend in a coplanar relationship such that the molded base 13 has a multi-segment structure, e.g., may have inclined and vertical extensions.

In order to make the imaging effect of the camera module closer to human eyes, the photosensitive assembly 10 further includes a filter element 40, where the filter element 40 is disposed between the optical lens 20 and the photosensitive element 12, so as to filter the optical signal of the measured object collected by the optical lens 20. In particular, the filter element 40 is maintained on the photosensitive path formed by the optical lens 20 and the photosensitive element 12, so that the light passing through the optical lens 20 is filtered by the filter element 40, so that the light incident on the photosensitive element 12 does not contain stray light such as infrared light, and the final imaging effect is closer to the visual effect of human eyes. In the present invention, the filter element 40 is exemplified by, but not limited to, an infrared cut filter, a blue glass filter, a wafer level infrared cut filter. In other embodiments, a full transmissive sheet or visible light filter is also possible.

Accordingly, as shown in fig. 2, in the preferred embodiment of the present invention, the photosensitive assembly 10 further includes a metal bracket 50, and the metal bracket 50 is disposed between the filter element 40 and the mold base 13 to improve the installation condition and the installation environment of the filter element 40 by the metal bracket 50. More specifically, the metal bracket 50 is mounted to the top surface of the molded base 13 for mounting the filter element 40. Thus, in the preferred embodiment of the present invention, the filter element 40 is mounted to the top surface of the molded base 13 without direct contact, so that the quality and size of the molding of the top surface of the molded base 13 does not directly affect the mounting of the filter element 40. That is, in the preferred embodiment of the present invention, the metal bracket 50 provides a mounting place for the filter element 40 instead of the molding base 13, and thus, the mounting environment and mounting condition of the filter element 40 depend on the characteristics of the metal bracket 50. The thickness of the metal holder 50 is 0.03 to 0.2mm, and the height thereof can be reduced to less than 0.1mm, for example, about 0.08mm, so that the height of the photosensitive member can be significantly reduced.

In particular, as shown in fig. 2, in the preferred embodiment of the present invention, the metal bracket 50 is made of a metal material, which has a relatively high flatness. When the filter element 40 is mounted on the metal bracket 50, the contact surfaces of the filter element 40 and the metal bracket 50 are uniformly stressed, so that the probability of breakage or damage of the filter element 40 due to uneven stress in the mounting process is effectively reduced. Meanwhile, the filter element 40 and the metal holder 50 are overlapped, and thus, the flatness of the filter element 40 depends on the flatness of the metal holder 50. Thus, in the preferred embodiment of the present invention, the filter element 40 has a relatively high flatness, so that light passing through the optical lens 20 can be effectively filtered at the filter element 40.

Further, as shown in fig. 2, the metal bracket 50 has a closed planar ring structure, which includes a ring-shaped body 51 and a light-passing opening 52 formed by the ring-shaped body 51, wherein when the metal bracket 50 is mounted on the molding base 13, the ring-shaped body 51 is partially overlapped and attached to the top surface of the molding base 13, and at the same time, the light-passing opening 52 corresponds to the light window 132 of the molding base body 131 to form a complete light path. It will be appreciated that the annular body 51 partially overlaps the top surface of the molded base 13 and extends inwardly of the molded base 13, and thus the area required for the filter element 40 to be mounted to the annular body 51 of the metal bracket 50 can be reduced accordingly to reduce cost and difficulty of installation.

In addition, the light-passing opening 52 of the metal bracket 50 corresponds to the light window 132 of the molded base 13, and thus the light-sensing angle and light-sensing range of the light-sensing element 12 can be changed by adjusting the characteristics of the light-passing opening 52 of the metal bracket 50. More specifically, in this preferred embodiment of the present invention, the metal holder 50 is partially suspended from the top surface of the molded base 13, and thus the size of the light-passing opening 52 of the metal holder 50 is slightly smaller than the light window 132 of the molded base 13, so that the light-passing opening 52 can further limit the light-sensing angle and light-sensing range of the light-sensing element 12. Preferably, as shown in fig. 2, the inner side surface of the light-passing opening 52 is an inclined surface 511, and the inclined surface 511 faces the photosensitive element 12, in such a way that an incident angle and an incident range are defined to correspond to a photosensitive area of the photosensitive element 12. It should be noted that, in the present invention, the light-passing hole 52 may be processed by a metal etching process or a metal etching process, so that the inclined surface 511 of the light-passing hole 52 has relatively high flatness. Of course, those skilled in the art will appreciate that the light-passing opening 52 of the filter element 40 may also be manufactured by a metal stamping process, however, since relatively large burrs may be generated, the inner edge of the light-passing opening 52 and the inclined surface 511 need to be further finished.

It should be noted that, in the preferred embodiment of the present invention, when the metal bracket 50 is mounted on the top surface of the molding base 13, the outer edge of the metal bracket 50 is located inside the outer periphery of the molding base 13, in such a way that the metal bracket 50 is prevented from being broken or cracked due to a bending force generated by the side thereof being pressed or impacted during the subsequent mounting and use. That is, in the preferred embodiment of the present invention, the outer edge of the metal bracket 50 does not protrude from the outer periphery of the molding base 13, so that the side surface of the metal bracket 50 is always in an unstressed state during the subsequent installation and use, so as to avoid the damage of the filter element 40 due to the deformation of the metal bracket 50.

More specifically, as shown in fig. 2, the outer edge of the metal bracket 50 is close to the outer periphery of the molding base 13, so that, on one hand, the metal bracket 50 can be firmly mounted on the top surface (relatively large contact area) of the molding base 13, and on the other hand, the molding base 13 can effectively block external mountings, such as a case of a smart phone, from touching the side surface of the metal bracket 50, so that the side surface of the metal bracket 50 is always in an unstressed state, and thus the filter element 40 can be effectively prevented from being broken or damaged due to bending of the metal bracket 50. It should be noted that the edge of the metal bracket 50 is close to the outer periphery of the molding base 13, that is, the metal bracket 50 covers almost all areas of the top surface of the molding base 13, so that the optical lens 20 can be directly assembled to the metal bracket 50 during the subsequent assembly of the optical lens 20, instead of being conventionally assembled to the top surface of the molding base 13. It should be appreciated that the metal bracket 50 is made of a metal material, which has a relatively high flatness, and thus, facilitates the alignment and adjustment of the optical lens 20. This will be described in more detail in the following description of the optical lens 20.

Of course, those skilled in the art will appreciate that in other variant embodiments of the present invention, the metal bracket 50 may be disposed on the top surface of the molding base 13 and located inside the optical lens 20, at which time the optical lens 20 is assembled on the top surface of the molding base 13, and the metal bracket 50 is effectively isolated from the inside of the optical lens 20. That is, in this modified embodiment of the present invention, the metal holder 50 does not provide a mounting support surface for the optical lens 20.

A variant embodiment of the metal holder 50 is shown in fig. 8, wherein the metal holder 50 has a countersunk mounting structure 53, so that the mounting position of the filter element 40 extends into the light window 132. That is, in this modified embodiment of the present invention, the metal bracket 50 has a three-dimensional structure. More specifically, in this embodiment of the invention, the metal bracket 50 includes an annular body 51, at least one inward extending arm 531 and at least one submerged arm 532, wherein the submerged arm 532 and the inward extending arm 531 form the submerged structure. As shown in fig. 8, the sinking arm 532 is integrally extended from the annular body 51 in a turning manner and longitudinally to lower the mounting position of the optical filter 40, so that the optical filter 40 is relatively far away from the optical lens 20 to prevent contact between the last lens of the optical lens 20 and is closer to the photosensitive element 12 to facilitate filtering stray light. The inward extending arm 531 and the downward extending arm 532 are integrally extended in a turning direction and in a lateral direction so as to provide a mounting position for the filter element 40 in a horizontal direction, so that the optical axes of the filter element 40 and the photosensitive element 12 coincide. Specifically, in the practice of the present invention, the metal bracket 50 includes four integrally connected inner extension arms 531 and four integrally connected sinker arms 532, each of the inner extension arms 531 and each of the sinker arms 532 extending at different positions to form the sinker mount structure 53.

It is worth mentioning that in this variant embodiment of the invention, the filter element 40 has a relatively good ductility since it is made of metallic material. Therefore, in the process of actually forming the metal bracket 50, for example, by a metal stamping process, the metal bracket 50 can be stamped to form various height differences so as to meet the requirements of camera modules with different specifications. Therefore, the filter element 40 lens base with different specifications can be prepared without replacing the forming die of the filter element 40 lens base like the prior art, so that the cost can be further reduced.

It should be noted that, in the present invention, the metal bracket 50 is made of a metal material having a relatively thin thickness, so that the height of the camera module can be further reduced as a whole. In particular, the thickness of the metal bracket 50 made of metal material can be greatly reduced compared to the conventional lens base of the filter element 40 formed by injection molding process, so as to reduce the optical back focus of the camera module and the overall height thereof.

Further, in the present invention, the metal bracket 50 is made of a metal material, for example, an iron-based, aluminum-based, or copper-based material, or the like. For example, in one specific example, it is embodied as a steel sheet. It is well known that metallic materials have high light reflection properties and produce relatively large amounts of reflected stray light. To eliminate the influence of this factor on the imaging quality, a light absorbing layer 54 is further disposed in the corresponding region between the filter elements 40 to prevent light from being reflected at the surface of the metal support 50 and entering the photosensitive element 12, thereby affecting the final imaging effect.

More specifically, as shown in fig. 2, in the preferred embodiment of the present invention, the light absorbing layer 54 covers the outer surface of the metal holder 50, so that a portion of the light passing through the optical lens 20 enters the photosensitive element 12 through the light-passing opening 52, and a portion of the light falling on the surface of the metal holder 50 is absorbed by the light absorbing layer 54, in such a way that the light falling on the surface of the metal holder 50 is effectively prevented from entering the photosensitive element 12 through multiple reflections, thereby affecting the imaging quality. Preferably, as shown in fig. 4, the light absorbing layer 54 is disposed on both the bottom surface and the top surface of the light filtering element 40, so that the stray light falling on the top surface of the metal bracket 50 and the stray light incident on the bottom surface of the metal bracket 50 can be effectively absorbed. Stray light incident on the inner surface of the mold base 13 and reflected to the bottom surface of the metal holder 50 can be absorbed by the light absorbing layer 54, so that a light shielding area is formed between the inner surface of the mold base 13 and the light absorbing layer 54 of the bottom surface of the metal holder 50. More preferably, in order to further secure the light absorbing effect of the light absorbing layer 54, the light absorbing layer 54 is disposed to cover the entire outer surface of the metal holder 50. Of course, those skilled in the art will appreciate that, in another variant of the present invention, as shown in fig. 9, the light absorbing layer 54 may be disposed only in the area of the metal support 50 near the light-transmitting opening 52, so as to reduce the probability of the reflected stray light entering the photosensitive element 12.

It should be noted that the light absorbing layer 54 may be formed on the corresponding region of the metal bracket 50 through a plating or film-coating process. Those skilled in the art will appreciate that the manner in which the light absorbing layer 54 is formed is not a limitation of the present invention. It will be appreciated that the process of forming the light absorbing layer 54 is performed after the metal bracket 50 is stamped to prevent the light absorbing layer 54 from being scratched during the stamping of the metal bracket 50 such that its integrity is compromised. Preferably, the light absorbing layer 54 is a black absorptive opaque material. In addition, in another variant implementation, it is also possible to roughen the surface of the metal support 50, so as to reduce the stray light reflected off after incidence on the metal support 50.

In order to further ensure that the metal support 50 can meet the requirement of certain stray light, as shown in fig. 10A, the optical filter element 40 includes an optical filter element body 41 and an optical shielding layer 42, and an optical shielding layer 42 is optionally disposed in a corresponding region of the optical filter element 40, so as to limit the light transmission range of the optical filter element 40 through the optical shielding layer 42. More specifically, in the preferred embodiment of the present invention, the light shielding layer 42 is formed on the top surface of the optical filter 40 such that the optical filter body 41 of the optical filter 40 has a peripheral portion 411 and a light filtering portion 412 at the periphery, wherein the light collected through the optical lens 20 can enter the photosensitive element 12 through the light filtering portion 412. Accordingly, the relative positional relationship between the outer peripheral portion 411 and the filter portion 412 can be set, and further limitation of the lighting range and the lighting angle can be achieved.

It should be noted that, in the present invention, the light shielding layer 42 may be made of a light absorbing material or made of a material capable of reducing light reflection, and the manufacturing process may be a photoresist or a silk screen process, etc., and a black absorptive opaque material is formed on the surface of the filter body 41.

It should be appreciated that, in the actual implementation process, the position of the outer peripheral portion 411 may be adjusted accordingly according to the actual requirement. For example, in another embodiment of the present invention, the light shielding layer 42 may be formed on the bottom surface of the filter body 41 of the filter 40, as shown in fig. 10B. That is, in this embodiment, the bottom surface of the filter element 40 is provided with a light shielding layer 42. In particular, the inner edge of the light shielding layer 42 exceeds or aligns with the inner edge of the metal bracket 50 to define the size of the light-transmitting area of the camera module. Stray light incident on the inner surface of the mold base 13 is absorbed when reflected to the light shielding layer 42, thereby reducing stray light reaching the photosensitive element 12.

In another embodiment of the present invention, as shown in fig. 10C, the light shielding layer 42 may be disposed on the front and back surfaces of the optical filter element 40 at the same time, and preferably, the light shielding layers 42 formed on the front and back surfaces correspond to each other, so as to further ensure that the optical filter element 40 can meet a certain stray light requirement through a dual safety mechanism.

Further, it should be appreciated by those skilled in the art that when the metal bracket 50 is attached to the corresponding position on the top surface of the molding base 13 by an adhesive medium, such as glue, and the light filter element 40 is mounted on the metal bracket 50, the photosensitive assembly 10 needs to be baked and cured to fix the metal bracket 50 on the molding base 13. It should be noted that the filter element 40, the metal bracket 50 and the molding base 13 form a closed space, i.e. the optical window, so that during baking and curing, the gas in the closed space impacts the filter element 40 due to thermal expansion, which may cause breakage or breakage of the filter element 40.

Accordingly, in order to solve the problem, referring to the manufacturing process of fig. 16 to 20, and particularly as shown in fig. 18 or 19, the filter element 40 is further provided with an air vent 55, wherein the air vent 55 is in communication with the closed space formed by the optical window 132, so that the heat-expanded gas can be diffused to the outside through the air vent 55 during the baking curing process, to effectively prevent the unnecessary impact of the internal air pressure surge on the filter element 40. More specifically, in the preferred embodiment of the present invention, the air escape holes 55 are provided adjacent to the light-passing holes 52 of the metal holder 50, and the air escape holes 55 communicate with the closed space formed by the light windows 132 when the metal holder 50 is attached to the corresponding position of the mold base 13. Further, when the filter element 40 is mounted to the metal bracket 50, the air vent 55 is partially shielded by the filter element 40 and partially exposed to the outside, so that the air in the closed space formed by the light window 132 can be diffused to the outside through the air vent area exposed to the outside.

It will be appreciated by those skilled in the art that when the photosensitive member 10 is baked and cured, the air vent 55 is preferably re-closed to prevent external dust from penetrating into the photosensitive member 10 through the air vent, thereby affecting the image quality. Accordingly, in the preferred embodiment of the present invention, the air vent 55 has a communication area 551 and a sealing area. When the filter element 40 is disposed on the metal bracket 50, the air vent 55 partially overlaps the filter element 40 to form the communication region 551 and the sealing region, wherein the communication region 551 extends into the airtight space formed by the optical window 132 for gas conduction, and the sealing region corresponds to the top surface of the molding base 13 for sealing by sealant.

Preferably, in this preferred embodiment of the present invention, the sealing area integrally extends to the communication area 551, and the opening size of the sealing area is larger than the opening size of the communication area 551, so as to facilitate glue application and fixing in the sealing area. More preferably, the opening depth of the sealing region is greater than the opening depth of the communication region 551 to prevent the glue applied to the sealing region from overflowing into the sealing space, thereby preventing the photosensitive element 12 from being contaminated.

It will be readily appreciated by those skilled in the art that in further embodiments of the invention, the escape passage may be provided at the top of the molded base 13. More specifically, the air escape channel is concavely formed at the top of the molding base 13, so that one end of the air escape channel is communicated with the closed space formed by the optical window 132, and the opposite end of the air escape channel is communicated with the outside, so that when the air escape channel is circulated along the air escape channel in the closed space formed by the optical window 132 during the baking and fixing process, the damage of the original value of the filtering caused by the air pressure surge is prevented. Preferably, in this embodiment of the present invention, the escape passage is provided at a soft board side of the photosensitive assembly 10, because the molding base 13 of this side is relatively narrow, facilitating the processing of the escape passage.

It should be noted that the metal bracket 50 is made of a metal material, so that the metal bracket 50 is not easily deformed during baking and curing, so as to effectively ensure that the relative positional relationship between the metal bracket 50 and the device mounted on the metal bracket 50 is kept stable.

Further, after the photosensitive assembly 10 is baked and cured, the optical lens 20 is assembled on the top side of the molding base 13. It should be appreciated that in this preferred embodiment of the invention, the metal bracket 50 may be assembled to the metal bracket 50 instead of the molded base 13. Therefore, the molding quality of the molded base 13 has no direct effect on the mounting and alignment of the optical lens 20. In particular, since the metal bracket 50 is made of a metal material and has relatively high flatness, the optical lens 20 can be assembled to the metal bracket 50 by means of mechanical fixing and has relatively high precision, so that the installation and calibration costs of the optical lens 20 can be greatly reduced. Of course, those skilled in the art will appreciate that the optical lens 20 may be assembled to the metal bracket 50 by Active Alignment (Active Alignment) to ensure the mounting accuracy of the optical lens 20.

Accordingly, when the optical lens 20 is assembled to the metal bracket 50, the metal bracket 50 is limited between the molding base 13 and the optical lens 20, so as to prevent the metal bracket 50 from being displaced due to vibration of the camera module during subsequent use.

It should be noted that, in another embodiment of the invention, the optical lens 20 is assembled to the metal bracket 50 through a driving element 30. Likewise, the metal bracket 50 having a relatively high flatness also facilitates the mounting and alignment of the driving element 30. Further, it should be apparent to those skilled in the art that the metal bracket 50 can provide a corresponding solution for solving the problem of difficulty in mounting and calibrating the dual lenses of the dual camera module.

Referring to fig. 11, a camera module according to a second preferred embodiment of the present invention is illustrated, wherein the structure of the camera module shown in the second preferred embodiment is substantially identical to that shown in the first preferred embodiment except for the mounting position of the metal bracket 50A.

In particular, as shown in fig. 11, in the preferred embodiment of the present invention, the top surface of the molding base 13A has an inner stepped surface 133A, and the stepped surface 133A is formed inside the molding base 13A for supporting the metal holder 50. Accordingly, the metal bracket 50A includes an annular main body 51A and a light-passing opening 52A formed by the annular main body 51, wherein when the metal bracket 50A is mounted on the molding base 13A, the annular main body 51A is partially overlapped and attached to the step surface 133A of the molding base 13A, and meanwhile, the light-passing opening 52A corresponds to the light window 132A of the molding base main body 131A, so as to form a complete light path. It should be appreciated that in the preferred embodiment of the present invention, the metal bracket 50A is mounted on the step surface 133A, such that the metal bracket 50A is far away from the optical lens 20A, thereby effectively avoiding the contact between the filter element 40A and the last lens of the optical lens 20A. Preferably, the step surface 133A may be not higher than the height of the electronic component of the circuit board but not lower than the height of the lead by utilizing the characteristic that the electronic component of the circuit board is higher than the lead, so that the position of the metal bracket 50A is further moved downward.

The light-passing opening 52A of the metal bracket 50A corresponds to the light window 132A of the molded base 13A, and thus the light-sensing angle and light-sensing range of the light-sensing element 12A can be changed by adjusting the characteristics of the light-passing opening 52A of the metal bracket 50A. More specifically, in this preferred embodiment of the present invention, the metal holder 50A is partially supported by the stepped surface 133A of the molded base 13A, and therefore, the size of the light-passing opening 52A of the metal holder 50A is slightly smaller than the light window 132A of the molded base 13A, so that the light-passing opening 52A can further limit the light-sensing angle and light-sensing range of the light-sensing element 12A. Preferably, the inner side surface of the light-passing opening 52A is an inclined surface 511A, and the inclined surface 511A faces the photosensitive element 12A, in such a way that an incident angle and an incident range are defined to correspond to a photosensitive area of the photosensitive element 12A.

It should be noted that, in the preferred embodiment of the present invention, the metal bracket 50A is mounted on the step surface 133A of the molding base 13A, so that the metal bracket 50A is protectively located inside the molding base 13A, in such a way that the metal bracket 50A is prevented from being broken or cracked due to a bending force generated by the side thereof being pressed or impacted during the subsequent mounting and use.

Further, as shown in fig. 12, a modified embodiment of the metal bracket 50A is shown, in which the metal bracket 50A has a sinking mounting structure 53A so that the mounting position of the filter element 40A is deep into the light window 132A. That is, in this modified embodiment of the present invention, the metal holder 50A has a three-dimensional structure. More specifically, in this embodiment of the invention, the metal bracket 50A includes an annular body 51A, at least one inwardly extending arm 531A and at least one submerged arm 532A, wherein the submerged arm 532A and the inwardly extending arm 531A form the submerged mounting structure 53A. As shown in fig. 12, the sinking arm 532A is integrally extended from the annular main body 51A in a turning manner and longitudinally, so as to lower the height of the installation position of the optical filter 40A, so that the optical filter 40A is relatively far away from the optical lens 20A to prevent touching between the last lens of the optical lens 20A and is closer to the photosensitive element 12A, so as to facilitate filtering of stray light. The inward extending arm 531A is integrally extended from the sinking arm 532A in a laterally and turning manner so as to provide a mounting position for the filter element 40A in a horizontal direction so that the optical axes of the filter element 40A and the photosensitive element 12A coincide. Specifically, in the practice of the present invention, the metal bracket 50A includes four integrally connected inner extension arms 531A and four integrally connected sinking arms 532A, each of the inner extension arms 531A and each of the sinking arms 532A extending at different positions to form the sinking mounting structure 53A.

It is worth mentioning that in this variant embodiment of the invention, since the filter element 40A is made of metallic material, it has a relatively good ductility. Therefore, in the process of actually forming the metal bracket 50A, for example, by a metal stamping process, the metal bracket 50A can be stamped to form various height differences so as to meet the requirements of camera modules with different specifications. Therefore, the filter element 40A lens base with different specifications can be prepared without replacing the forming die of the filter element 40A lens base like the prior art, so that the cost can be further reduced.

Referring to fig. 13, a camera module according to a third preferred embodiment of the present invention is illustrated, wherein the structure of the camera module shown in the third preferred embodiment is substantially identical to that shown in the first preferred embodiment, except for the structural configuration of the metal bracket 50B.

Those skilled in the art will appreciate that as the molding process progresses, the size of the photosensitive element 10 after molding becomes smaller and smaller, and even some optical lenses 20B have been larger than the size of the photosensitive element 10B. At this time, if the optical lens 20B is assembled on the top side of the molding base 13B, the optical lens 20B is partially suspended, and the structure is unstable.

Accordingly, as shown in fig. 13, in the preferred embodiment of the present invention, the metal bracket 50B is protrusively extended from the outer circumference of the molding base 13B for supporting the optical lens 20B partially suspended so as to reinforce the supporting structure of the optical lens 20B. That is, in the preferred embodiment of the present invention, the metal bracket 50B provides a support platform for the optical lens 20B.

In particular, in the preferred embodiment of the present invention, the outer periphery of the metal bracket 50B is located inside the outer periphery of the optical lens 20B, so that when the camera module is assembled in an electronic device, such as a smart phone, the side surface of the metal bracket 50B will not collide with the electronic device, so as to avoid the deformation of the metal bracket 50B to generate a bending force to damage the filter element 40B. That is, in the preferred embodiment of the present invention, the length of the metal holder 50 protruding from the outer peripheral portion of the molding base 13B is smaller than the length of the optical lens 20B protruding from the molding base 13.

It should be appreciated that the camera module provided by the third preferred embodiment of the present invention is adapted to accommodate mounting of electronic devices that are not planar. For example, as shown in fig. 13, the camera module is mounted on an electronic device, wherein a housing 80B of the electronic device has an arc-shaped curved surface. At this time, the conventional square-shaped camera module obviously cannot be adapted to the installation conditions at this time. Specifically, during the process of assembling the camera module to the electronic device, the molding base 13B is disposed on one side of the housing 80B, and the optical lens 20B of the camera module is disposed in a staggered protruding manner and abuts against the other side of the housing 80B, so as to form a stable fixing structure.

Referring to fig. 14, an array camera module according to a fourth preferred embodiment of the present invention is illustrated. The array camera module comprises a camera module and a plurality of camera modules, wherein the camera module comprises a plurality of photosensitive assemblies 10C and a plurality of optical lenses 20C, and the optical lenses 20C are positioned on a photosensitive path of the photosensitive assemblies 10C so as to collect image information of a measured target through the optical lenses 20C. In particular, in this preferred implementation of the invention, the camera module is implemented as a binocular camera module or even more purpose camera module, i.e. the camera module comprises two or more optical lenses 20C. This aspect is not limiting in scope.

It should be noted that the binocular camera module may be implemented as a fixed focus binocular camera module, i.e., the focal length between the optical lens 20C and the photosensitive assembly 10C is not adjustable. In particular, the optical lens 20C may be assembled on top of the photosensitive assembly 10C through a lens barrel 20C as a lens-carrying element. It will be appreciated that as the packaging process improves, the overall size of the camera module is continuously reduced, and in other variant embodiments, the optical lens 20C is assembled on top of the photosensitive assembly 10C in a "bare lens" manner, i.e., at this time, the optical lens 20C is directly mounted on the top region of the photosensitive assembly 10C without the lens barrel 20C or the lens-carrying element. Or the dual camera module is a moving focus camera module, and the optical lens 20C is assembled to a corresponding driver.

More specifically, as shown in fig. 14, the photosensitive assembly 10C includes at least one circuit board 11C, two photosensitive elements 12C, and at least one molded base 13C. The photosensitive elements 12C are respectively connected to the circuit board 11C in a conductive manner, wherein light from the measured object passes through the photosensitive assembly 10C and reaches each photosensitive element 12C, so as to further convert the optical signal of the measured object into an electrical signal which can be identified and operated by the electronic device through the photosensitive reaction of each photosensitive element 12C, thereby realizing functions such as image collection and reproduction of the measured object. The molding base 13C is integrally formed with the circuit board 11C and the photosensitive element 12C, and covers at least a portion of the circuit board 11C and the photosensitive element 12C, so that the photosensitive assembly 10C and the camera module have a compact and miniaturized structure.

It should be noted that, in the present invention, the circuit board 13C may be an integrated circuit board or a split circuit board, where when the circuit board 13C is an integrated circuit board, the photosensitive elements 12C are correspondingly attached to the corresponding areas of the circuit board 13C, so as to provide a flat mounting surface for the photosensitive elements 12C through the integrated circuit board 13C. When the circuit board 13C is a split circuit board, the circuit board 13C includes two split circuit boards, and the split circuit boards are respectively suitable for mounting the photosensitive elements 13C. At this time, the assembly and working space between the two split circuit boards are independent.

In the preferred embodiment of the present invention, the photosensitive elements 12C may be mounted on the respective areas of the wiring board 11C by SMT (Surface Mounting Technology, surface mount technology), for example, and further, electrical connection between the wiring board 11C and the photosensitive elements 12C is achieved by a set of leads 14C. Those skilled in the art will appreciate that the manner in which the wiring board 11C and the photosensitive element 12C are turned on is referred to as a "gold-plating" process. It should be noted that, in the present invention, the manner of forward "wire bonding" is selected, that is, the lead 14C extends from the circuit board 11C to the photosensitive element 12C, or the manner of reverse "wire bonding" is selected, that is, the lead 14C extends from the photosensitive element 12C to the circuit board 11C, so that the photosensitive element 12C and the circuit board 11C are conducted, which is not limited to the present invention.

Further, after the photosensitive element 12C is mounted on the circuit board 11C and is electrically connected to the circuit board 11C, a molding process is performed to form the molded base 13C on the photosensitive element 12C and the circuit board 11C. The molding base 13C is integrally formed with the photosensitive element 12 and the circuit board 11C, and covers at least a portion of the photosensitive element 12 and a series of electronic components mounted on the circuit board 11C, so that the overall size of the photosensitive assembly 10C is effectively reduced, and dust and impurities similar to those in a conventional camera module are effectively prevented from adhering to the electronic components to pollute the photosensitive element 12C and affect the imaging effect. Accordingly, in the present invention, the molded base may be an integrally molded base, that is, the molded base is integrally formed with the wiring board (an integral wiring board or a separate wiring board) and the photosensitive element. It is also possible that the molding base is a split molding base, that is, the molding base includes two independent molding bases, and the split molding base is integrally formed on the circuit board and the photosensitive element, respectively.

More specifically, the molding base 13C includes a molding base body 131C and at least one light window 132C formed by the molding base body 131C, wherein the light window 132C is a closed space and corresponds to at least a photosensitive area of the photosensitive element 12C, respectively, to allow light energy from the outside to radiate to the photosensitive element 12C through the light window 132C to complete image capturing. In particular, in the preferred embodiment of the present invention, the molded base body 131C has a closed annular structure so as to provide a closed internal environment for the photosensitive element 12C, preventing external stray light from entering the photosensitive element 12C from the side.

In order to make the imaging effect of the camera module closer to human eyes, the photosensitive assembly 10C further includes two filter elements 40C, where the filter elements 40C are respectively disposed between the optical lens 20C and the photosensitive element 12C, so as to filter the optical signal of the measured object collected by the optical lens 20C. In particular, the filter element 40C is maintained on the photosensitive path formed by the optical lens 20C and the photosensitive element 12C, so that the light passing through the optical lens 20C is filtered by the filter element 40C, so that the light radiated to the photosensitive element 12C does not contain stray light such as infrared light, and the final imaging effect is closer to the visual effect of human eyes.

Further, the photosensitive assembly 10C further includes at least one metal bracket 50C, and the metal bracket 50C is disposed between the filter element 40C and the molding base 13C, so as to improve the installation condition and the installation environment of the filter element 40C by the metal bracket 50C. That is, at this time, the filter element is mounted to the top surface of the mold base without direct contact, and therefore, the molding quality and size of the top surface of the mold base do not directly affect the mounting of the filter element.

In particular, in this preferred embodiment of the present invention, the metal holder is made of a metal material having a relatively high flatness, thereby more facilitating the mounting alignment of the filter element 40C and the optical lens 20C. More specifically, when the filter element 40C is mounted on the metal bracket 50C, the contact surfaces of the filter element 40C and the metal bracket 50C are uniformly stressed, so that the probability of breakage or damage of the filter element 40C due to uneven stress during the mounting process is effectively reduced. Meanwhile, the filter element 40C and the metal holder 50C are disposed to overlap, and thus, the flatness of the filter element 40C depends on the flatness of the metal holder 50C. Accordingly, in the preferred embodiment of the present invention, the filter element 40C has a relatively high flatness, so that light passing through the optical lens 20C can be effectively filtered at the filter element 40C.

When the optical lens is assembled on the metal bracket, the metal bracket has higher flatness, so that the optical lens can be assembled on the metal bracket 50C in a mechanically fixed manner, thereby greatly reducing the installation and calibration cost of the optical lens 20C. Of course, those skilled in the art will appreciate that the optical lens 20C may be assembled to the metal bracket 50C by Active Alignment (Active Alignment) to ensure the mounting accuracy of the optical lens 20C.

It should be noted that, in the preferred embodiment of the present invention, as shown in fig. 14, the metal bracket 50C has an integral structure, that is, the metal bracket includes an annular main body 51C and has two light-passing openings 52C, wherein when the metal bracket 50C is assembled on the top surface of the molding base 13C, the annular main body 51C is attached to the top surface of the molding base 13C, and the light-passing openings 52C respectively correspond to the light windows 132C and the photosensitive elements 12C. Of course, it will be appreciated by those skilled in the art that in another variant of the present invention, as shown in fig. 15, the metal bracket 50C has a split structure, that is, the photosensitive assembly 10C includes two independent metal brackets 50C, the metal brackets 50C are respectively adapted to be attached to the top surface of the molded base 13C, and the light-transmitting openings 52C of the metal brackets 50C respectively correspond to the light windows 132 and the photosensitive elements 13C. In addition, the filter elements 40 of the photosensitive elements may be integrally formed or independent.

Further, in the present invention, the metal bracket 50C is made of a metal material, such as an iron-based, aluminum-based, or copper-based material, or the like. For example, in one specific example, it is embodied as a steel sheet. It is well known that metallic materials have high light reflection properties and produce relatively large amounts of reflected stray light. To eliminate the influence of this factor on the imaging quality, a light absorbing layer 54C is further disposed in the corresponding region between the filter elements 40C to prevent light from being reflected on the surface of the metal support 50C and entering the photosensitive element 12C, thereby affecting the final imaging effect.

More specifically, in the preferred embodiment of the present invention, the light absorbing layer 54C covers the outer surface of the metal support 50C, so that part of the light collected by the optical lens 20C enters the photosensitive element 12C through the light-passing opening 52C, and part of the light falling on the surface of the metal support 50C is absorbed by the light absorbing layer 54C, in such a way that the light falling on the surface of the metal support 50C is effectively prevented from entering the photosensitive element 12C through multiple reflections, and the imaging quality is affected. Preferably, the light absorbing layer 54C is disposed on both the bottom surface and the top surface of the light filtering element 40C, so that the stray light falling on the top surface of the metal bracket 50C and the stray light radiated to the bottom surface of the metal bracket 50C can be absorbed effectively. More preferably, in order to further secure the light absorbing effect of the light absorbing layer 54C, the light absorbing layer 54C is provided to cover the entire outer surface of the metal holder 50C. Of course, those skilled in the art will appreciate that in other variant embodiments of the present invention, the light absorbing layer 54C may be disposed only in the area of the metal support 50C near the light-transmitting opening 52C, so as to reduce the probability of the reflected stray light entering the photosensitive element 12C.

It should be noted that the light absorbing layer 54C may be formed on the corresponding region of the metal support 50C by plating or film-coating. Those skilled in the art will appreciate that the manner in which the light absorbing layer 54C is formed is not a limitation of the present invention. It will be appreciated that the process of forming the light absorbing layer 54C is performed after the metal bracket 50C is stamped to prevent the light absorbing layer 54C from being scratched during the stamping of the metal bracket 50C such that its integrity is compromised.

In addition, it is understood that the structure of the camera module monomer in the above embodiment can be applied to the array camera module of the present invention.

It will thus be seen that the objects of the invention are efficiently attained. The embodiments for explaining the functional and structural principles of the present invention have been fully illustrated and described, and the present invention is not limited by the changes based on the principles of the embodiments. Accordingly, the invention includes all modifications encompassed within the scope and spirit of the following claims.

Claims

1. A photosensitive assembly, comprising:

a circuit board;

a photosensitive element;

the molding base is integrally formed with the circuit board and the photosensitive element;

A filter element; and

the metal bracket is attached to the top surface of the molding base through an adhesive medium, and the outer side edge of the metal bracket is positioned on the inner side of the outer periphery of the molding base for installing the light filtering element, wherein a light window for providing a light path for the photosensitive element is formed among the light filtering element, the metal bracket and the molding base.

2. The photosensitive assembly of claim 1, wherein the metal bracket comprises an annular main body and a light through hole formed by the annular main body, the light through hole corresponds to the light window, and the optical filter element is attached to the top side or the bottom side of the metal bracket.

3. The photosensitive assembly of claim 1, wherein the metal bracket comprises a light absorbing layer disposed on a surface of the metal bracket.

4. The photosensitive assembly of claim 1, wherein an outer edge of the metal bracket is located inward of an outer periphery of the molded base.

5. A photosensitive assembly as claimed in claim 3, wherein the light absorbing layer metal support is black light absorbing opaque material formed on a bottom side surface of the metal support or all surfaces of the metal support.

6. The photosensitive assembly of claim 1, wherein the filter element comprises a filter element body and an annular light shielding layer disposed on a top surface and/or a bottom surface of the filter element body metal bracket, such that a middle portion of the filter element forms a filter portion for effectively filtering light.

7. The photosensitive assembly of any of claims 1-6, wherein the metal bracket further comprises an air vent, wherein the air vent is in communication with the light window formed by the filter element, the metal bracket, and the molded base; or the photosensitive assembly has an air vent formed in the molded base.

8. A photosensitive assembly according to claim 1, wherein the top surface of the molded base has an inner stepped surface, and the metal bracket is at least partially mounted to the stepped surface, preferably, the stepped surface is not higher than the electronic component of the wiring board by a height not lower than the lead between the wiring board and the photosensitive element.

9. An imaging module comprising a lens and a photosensitive assembly according to any one of claims 1 to 8.

10. An array camera module, which is characterized by comprising at least two optical lenses and at least two photosensitive assemblies according to any one of claims 1 to 8, wherein the circuit boards in the at least two photosensitive assemblies are connected into a whole or are independent; the molded bases are integrally connected or independent; the metal brackets are connected integrally or independently; the filter elements are integrated or independent.