CN109686672A - The method of protective layer and the product of surface formation matcoveredn are formed in body surface - Google Patents
The method of protective layer and the product of surface formation matcoveredn are formed in body surface Download PDFInfo
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- CN109686672A CN109686672A CN201710970552.9A CN201710970552A CN109686672A CN 109686672 A CN109686672 A CN 109686672A CN 201710970552 A CN201710970552 A CN 201710970552A CN 109686672 A CN109686672 A CN 109686672A
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- China
- Prior art keywords
- carbon atom
- atom number
- protective layer
- alkyl
- alkenyl
- Prior art date
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- 239000011241 protective layer Substances 0.000 title claims abstract description 118
- 238000000034 method Methods 0.000 title claims abstract description 56
- 230000015572 biosynthetic process Effects 0.000 title description 16
- 150000001875 compounds Chemical class 0.000 claims abstract description 36
- 239000000126 substance Substances 0.000 claims abstract description 29
- 229910052799 carbon Inorganic materials 0.000 claims description 131
- 239000007789 gas Substances 0.000 claims description 72
- 125000000217 alkyl group Chemical group 0.000 claims description 61
- 125000003342 alkenyl group Chemical group 0.000 claims description 48
- 125000003118 aryl group Chemical group 0.000 claims description 48
- -1 trimethylsiloxy group Chemical group 0.000 claims description 47
- 229910052739 hydrogen Inorganic materials 0.000 claims description 38
- 239000001257 hydrogen Substances 0.000 claims description 38
- 239000010410 layer Substances 0.000 claims description 37
- 150000002431 hydrogen Chemical class 0.000 claims description 27
- 125000003545 alkoxy group Chemical group 0.000 claims description 24
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims description 23
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 23
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims description 23
- 229910052794 bromium Inorganic materials 0.000 claims description 23
- 229910052801 chlorine Inorganic materials 0.000 claims description 23
- 239000000460 chlorine Substances 0.000 claims description 23
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 21
- 125000004469 siloxy group Chemical group [SiH3]O* 0.000 claims description 20
- 229910052736 halogen Inorganic materials 0.000 claims description 17
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 claims description 17
- 229920000642 polymer Polymers 0.000 claims description 17
- 238000006884 silylation reaction Methods 0.000 claims description 16
- 239000012159 carrier gas Substances 0.000 claims description 14
- 150000002367 halogens Chemical class 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 13
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 11
- DCERHCFNWRGHLK-UHFFFAOYSA-N C[Si](C)C Chemical compound C[Si](C)C DCERHCFNWRGHLK-UHFFFAOYSA-N 0.000 claims description 8
- 238000004891 communication Methods 0.000 claims description 8
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 7
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims description 7
- 230000003252 repetitive effect Effects 0.000 claims description 7
- 125000004429 atom Chemical group 0.000 claims description 6
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 6
- 125000001424 substituent group Chemical group 0.000 claims description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 5
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 claims description 5
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 claims description 5
- 239000011261 inert gas Substances 0.000 claims description 5
- 150000002500 ions Chemical class 0.000 claims description 5
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 claims description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 5
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 5
- 229920002554 vinyl polymer Polymers 0.000 claims description 5
- YFCGDEUVHLPRCZ-UHFFFAOYSA-N [dimethyl(trimethylsilyloxy)silyl]oxy-dimethyl-trimethylsilyloxysilane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C YFCGDEUVHLPRCZ-UHFFFAOYSA-N 0.000 claims description 4
- 239000012528 membrane Substances 0.000 claims description 4
- 125000001820 oxy group Chemical group [*:1]O[*:2] 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims description 2
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 claims description 2
- 239000004744 fabric Substances 0.000 claims description 2
- 125000001967 indiganyl group Chemical group [H][In]([H])[*] 0.000 claims description 2
- 125000003698 tetramethyl group Chemical group [H]C([H])([H])* 0.000 claims description 2
- 125000004432 carbon atom Chemical group C* 0.000 claims 54
- 150000001350 alkyl halides Chemical class 0.000 claims 2
- 150000001721 carbon Chemical group 0.000 description 68
- 239000007788 liquid Substances 0.000 description 18
- 238000012360 testing method Methods 0.000 description 14
- 238000002474 experimental method Methods 0.000 description 10
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 9
- KZNRNQGTVRTDPN-UHFFFAOYSA-N 2-chloro-1,4-dimethylbenzene Chemical group CC1=CC=C(C)C(Cl)=C1 KZNRNQGTVRTDPN-UHFFFAOYSA-N 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 6
- 230000001681 protective effect Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- GETTZEONDQJALK-UHFFFAOYSA-N (trifluoromethyl)benzene Chemical class FC(F)(F)C1=CC=CC=C1 GETTZEONDQJALK-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 239000012530 fluid Substances 0.000 description 4
- 239000001307 helium Substances 0.000 description 4
- 229910052734 helium Inorganic materials 0.000 description 4
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 4
- 239000003921 oil Substances 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 230000032683 aging Effects 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- HCDGVLDPFQMKDK-UHFFFAOYSA-N hexafluoropropylene Chemical compound FC(F)=C(F)C(F)(F)F HCDGVLDPFQMKDK-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- 241000208340 Araliaceae Species 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 2
- 235000003140 Panax quinquefolius Nutrition 0.000 description 2
- URLKBWYHVLBVBO-UHFFFAOYSA-N Para-Xylene Chemical group CC1=CC=C(C)C=C1 URLKBWYHVLBVBO-UHFFFAOYSA-N 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- 244000062793 Sorghum vulgare Species 0.000 description 2
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Natural products CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 125000005605 benzo group Chemical group 0.000 description 2
- 229940049706 benzodiazepine Drugs 0.000 description 2
- 229940125782 compound 2 Drugs 0.000 description 2
- 229940126214 compound 3 Drugs 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 235000008434 ginseng Nutrition 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- ZGEGCLOFRBLKSE-UHFFFAOYSA-N methylene hexane Natural products CCCCCC=C ZGEGCLOFRBLKSE-UHFFFAOYSA-N 0.000 description 2
- 235000019713 millet Nutrition 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 2
- GPRLSGONYQIRFK-MNYXATJNSA-N triton Chemical compound [3H+] GPRLSGONYQIRFK-MNYXATJNSA-N 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- UYLCWXDMIDTFBE-UHFFFAOYSA-N 1,2-xylene;dihydrochloride Chemical compound Cl.Cl.CC1=CC=CC=C1C UYLCWXDMIDTFBE-UHFFFAOYSA-N 0.000 description 1
- VJGCZWVJDRIHNC-UHFFFAOYSA-N 1-fluoroprop-1-ene Chemical compound CC=CF VJGCZWVJDRIHNC-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 1
- ADANNTOYRVPQLJ-UHFFFAOYSA-N [dimethyl(trimethylsilyloxy)silyl]oxy-[[dimethyl(trimethylsilyloxy)silyl]oxy-dimethylsilyl]oxy-dimethylsilane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C ADANNTOYRVPQLJ-UHFFFAOYSA-N 0.000 description 1
- 125000005073 adamantyl group Chemical group C12(CC3CC(CC(C1)C3)C2)* 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000000443 aerosol Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 238000005660 chlorination reaction Methods 0.000 description 1
- 229940125904 compound 1 Drugs 0.000 description 1
- 229940125773 compound 10 Drugs 0.000 description 1
- 229940125898 compound 5 Drugs 0.000 description 1
- 230000010485 coping Effects 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 125000001047 cyclobutenyl group Chemical group C1(=CCC1)* 0.000 description 1
- 125000001995 cyclobutyl group Chemical group [H]C1([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000001559 cyclopropyl group Chemical group [H]C1([H])C([H])([H])C1([H])* 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- JZZIHCLFHIXETF-UHFFFAOYSA-N dimethylsilicon Chemical compound C[Si]C JZZIHCLFHIXETF-UHFFFAOYSA-N 0.000 description 1
- MYRTYDVEIRVNKP-UHFFFAOYSA-N divinylbenzene Substances C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 1
- SQNZJJAZBFDUTD-UHFFFAOYSA-N durene Chemical compound CC1=CC(C)=C(C)C=C1C SQNZJJAZBFDUTD-UHFFFAOYSA-N 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000006038 hexenyl group Chemical group 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- ZLVXBBHTMQJRSX-VMGNSXQWSA-N jdtic Chemical compound C1([C@]2(C)CCN(C[C@@H]2C)C[C@H](C(C)C)NC(=O)[C@@H]2NCC3=CC(O)=CC=C3C2)=CC=CC(O)=C1 ZLVXBBHTMQJRSX-VMGNSXQWSA-N 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- AUHZEENZYGFFBQ-UHFFFAOYSA-N mesitylene Substances CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 description 1
- 125000001827 mesitylenyl group Chemical group [H]C1=C(C(*)=C(C([H])=C1C([H])([H])[H])C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- AFFLGGQVNFXPEV-UHFFFAOYSA-N n-decene Natural products CCCCCCCCC=C AFFLGGQVNFXPEV-UHFFFAOYSA-N 0.000 description 1
- 125000005187 nonenyl group Chemical group C(=CCCCCCCC)* 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004365 octenyl group Chemical group C(=CCCCCCC)* 0.000 description 1
- 125000005447 octyloxy group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])O* 0.000 description 1
- AICOOMRHRUFYCM-ZRRPKQBOSA-N oxazine, 1 Chemical compound C([C@@H]1[C@H](C(C[C@]2(C)[C@@H]([C@H](C)N(C)C)[C@H](O)C[C@]21C)=O)CC1=CC2)C[C@H]1[C@@]1(C)[C@H]2N=C(C(C)C)OC1 AICOOMRHRUFYCM-ZRRPKQBOSA-N 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 125000002255 pentenyl group Chemical group C(=CCCC)* 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 239000013047 polymeric layer Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000013112 stability test Methods 0.000 description 1
- 238000010025 steaming Methods 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 229940008424 tetradecamethylhexasiloxane Drugs 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 125000000025 triisopropylsilyl group Chemical group C(C)(C)[Si](C(C)C)(C(C)C)* 0.000 description 1
- BZLZKLMROPIZSR-UHFFFAOYSA-N triphenylsilicon Chemical compound C1=CC=CC=C1[Si](C=1C=CC=CC=1)C1=CC=CC=C1 BZLZKLMROPIZSR-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
-
- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M10/00—Physical treatment of fibres, threads, yarns, fabrics, or fibrous goods made from such materials, e.g. ultrasonic, corona discharge, irradiation, electric currents, or magnetic fields; Physical treatment combined with treatment with chemical compounds or elements
- D06M10/04—Physical treatment combined with treatment with chemical compounds or elements
- D06M10/08—Organic compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Textile Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
The present invention provides a kind of method for forming protective layer in body surface, comprising: at least part surface of the object is exposed in the first plasma, to form the first protective layer at least part surface of the object；It is exposed in the second plasma with by least part surface for being formed with the object of first protective layer, to form the second protective layer；The second gas for forming second plasma is different from forming the first gas of first plasma, and the second gas includes the compound indicated by chemical formula (II).
Description
Technical field
The present invention relates to a kind of products of method and surface formation matcoveredn that protective layer is formed in body surface.
Background technique
People production and daily life in, it is often necessary to its object used from by liquid (water, oil, aqueous solution or
Person other mixing liquids etc. for containing water, oil) its surface is contacted, cause object to be contaminated, soak, or because these liquid
It acts on and causes physical damage.Here, the object that people use is product.For example, product include electrical equipment, electronic equipment,
Filter membrane, wrist-watch and wearing product.
In the existing technology for preventing object from being contacted by liquid, disclose it is a kind of by using containing polymer it is equal from
Daughter forms protective polymers layer in body surface, exists for example, Chinese Patent Application No. CN200780002557 discloses one kind
Body surface forms protective polymers layer, to prevent object to be contaminated by the liquid or soak.In another example Chinese Patent Application No.
CN2013100842664 discloses a kind of electrical or electronic equipment or the surface of its component is formed with protective polymers layer
Product and a kind of method for forming protective polymers layer on the surface of electrical or electronic equipment or its component.In in another example
State number of patent application CN200880114449 discloses the filter membrane that a kind of surface is formed with polymeric layer.However, existing
By the way that using the plasma containing polymer, in the technology that body surface forms protective polymers layer, existing prevents object quilt
The problems such as ability of fluid contact surface is weak, and the binding force of protective polymers layer and body surface is poor.
Summary of the invention
To solve the above-mentioned problems, the present invention proposes a kind of method for forming protective layer in body surface, through the invention
The method for forming protective layer in body surface proposed, can be improved prevents object by the ability of fluid contact surface and prevents from steaming
The ability that vapour penetrates, meanwhile, it is capable to improve the binding force of protective layer and body surface, and extreme in high temperature and humidity, low temperature etc.
Under the conditions of also have good environmental stability.
Technical scheme is as follows.
1. a kind of method for forming protective layer in body surface characterized by comprising
At least part surface of the object is exposed in the first plasma, at least one of the object
Surface is divided to form the first protective layer；With
At least part surface for being formed with the object of first protective layer is exposed in the second plasma,
To form the second protective layer；
The second gas for forming second plasma is different from forming the first gas of first plasma,
The second gas includes the compound indicated by chemical formula (II),
Wherein, R1、R2、R3、R4、R5、R6Separately selected from hydrogen, chlorine, bromine, iodine, carbon atom number 1 to 20 alkyl or halogen
Substituted alkyl, the alkenyl of carbon atom number 2 to 20 or halogenated alkenyl, the alkoxy of carbon atom number 1 to 20, carbon atom number 2 to 18 silicon
The aryl or halogenated aryl of alkyl, the siloxy of carbon atom number 3 to 18 and carbon atom number 6 to 12, X are the repetition list of polymer
Member, k are the arbitrary integer in 0 to 7；
The structure of repetitive unit X is as shown in chemical formula (III):
Wherein, R7、R8It is separately former selected from hydrogen, chlorine, bromine, iodine, the alkyl of carbon atom number 1 to 20 or halogenated alkyl, carbon
The alkenyl or halogenated alkenyl of subnumber 2 to 20, the alkoxy of carbon atom number 1 to 20, carbon atom number 2 to 18 silylation, carbon atom
The siloxy of number 3 to 18 and the aryl of carbon atom number 6 to 12 or halogenated aryl.
2. the method for forming protective layer in body surface according to (1), which is characterized in that R1、R2、R3、R4、R5、R6
Separately selected from hydrogen, chlorine, bromine, iodine, the alkyl of carbon atom number 1 to 10 or halogenated alkyl, carbon atom number 2 to 10 alkenyl or
Halogenated alkenyl, the alkoxy of carbon atom number 1 to 10, the silylation of carbon atom number 2 to 12, carbon atom number 3 to 12 siloxy with
And the aryl or halogenated aryl of carbon atom number 6 to 10；
R7、R8Separately it is selected from hydrogen, chlorine, bromine, iodine, the alkyl of carbon atom number 1 to 10 or halogenated alkyl, carbon atom number 2
To 10 alkenyl or halogenated alkenyl, the alkoxy of carbon atom number 1 to 10, the silylation of carbon atom number 2 to 12, carbon atom number 3 to
12 siloxy and the aryl of carbon atom number 6 to 10 or halogenated aryl.
3. the method for forming protective layer in body surface according to (1), which is characterized in that R1、R2、R3、R4、R5、R6
Separately alkenyl or halogen selected from hydrogen, chlorine, bromine, iodine, the alkyl of carbon atom number 1 to 6 or halogenated alkyl, carbon atom number 2 to 6
Aryl for alkenyl, the alkoxy of carbon atom number 1,2 or 3, trimethyl silicon substrate, trimethylsiloxy group and carbon atom number 6 to 8 or
Halogenated aryl；R7、R8Separately it is selected from methyl, ethyl, n-propyl, isopropyl, vinyl, acrylic, methoxyl group, ethoxy
Base, trimethyl silicon substrate, trimethylsiloxy group and phenyl.
4. the method for forming protective layer in body surface according to (1), which is characterized in that chemical formula (II) indicated
Compound is selected from hexamethyldisiloxane, octamethyltrisiloxane, decamethyl tetrasiloxane, ten dimethyl, five siloxanes, 14
One of six siloxanes of methyl, nine siloxanes of ten hexamethyls, seven siloxanes, ten prestoxs, eight siloxanes and two decamethyls with
On.
5. the method for forming protective layer in body surface according to (1), which is characterized in that formed described first it is equal from
The first gas of daughter includes the compound indicated by chemical formula (I),
Wherein, T1Represent C1-C3Alkyl, C1-C3Halogenated alkyl or C2-C3Alkenyl；T2、T3、T4、T5、T6Separately generation
Table hydrogen, halogen, C1-C3Alkyl, C1-C3Halogenated alkyl or C2-C3Alkenyl；T2-T6In at least one be not hydrogen or halogen.
6. the method for forming protective layer in body surface according to (5), which is characterized in that in formula (I) structure, when
T1-T6In have and only there are two for methyl when, at least one in the atom or substituent group of other non-methyl is not hydrogen.
7. the method for forming protective layer in body surface according to (1), which is characterized in that described the will be formed with
Before at least part surface of the object of one protective layer is exposed in the second plasma, it will first be formed with described first
At least part surface of the object of protective layer is exposed to the third plasma formed by the third gas comprising fluorohydrocarbon
In body, to form middle layer.
8. the method for forming protective layer in body surface according to (7), which is characterized in that the fluorohydrocarbon is selected from
CF4、C2F4、C2F6、C3F6、C3F8、C4F8One of or it is a variety of.
9. the method for forming protective layer in body surface according to any one of (1) to (6), which is characterized in that
The first gas for forming first plasma further includes the first carrier gas, and first carrier gas is selected from indifferent gas
Body, CF4、C3F8、N2、H2At least one of；And
The second gas for forming second plasma further includes the second carrier gas, and second carrier gas is selected from indifferent gas
Body, CF4、C3F8、N2、H2At least one of.
10. the method for forming protective layer in body surface according to (7), which is characterized in that form described third etc.
The third gas of gas ions further includes third carrier gas, and the third carrier gas is selected from inert gas, CF4、C3F8、N2、H2In at least
It is a kind of.
11. the product that a kind of surface forms matcoveredn, which is characterized in that the protective layer includes the first protective layer, institute
The first protective layer is formed in the product by being exposed at least part surface in the first plasma is stated, and
Second protective layer, second protective layer pass through at least the one of the product that will be formed with first protective layer
Part of the surface is exposed to the outer surface that first protective layer is formed in the second plasma；
The second gas for forming second plasma is different from forming the first gas of first plasma,
The second gas includes the compound indicated by chemical formula (II),
Wherein, R1、R2、R3、R4、R5、R6Separately selected from hydrogen, chlorine, bromine, iodine, carbon atom number 1 to 20 alkyl or halogen
Substituted alkyl, the alkenyl of carbon atom number 2 to 20 or halogenated alkenyl, the alkoxy of carbon atom number 1 to 20, carbon atom number 2 to 18 silicon
The aryl or halogenated aryl of alkyl, the siloxy of carbon atom number 3 to 18 and carbon atom number 6 to 12, X are the repetition list of polymer
Member, k are the arbitrary integer in 0 to 7；
The structure of repetitive unit X is as shown in chemical formula (III):
Wherein, R7、R8It is separately former selected from hydrogen, chlorine, bromine, iodine, the alkyl of carbon atom number 1 to 20 or halogenated alkyl, carbon
The alkenyl or halogenated alkenyl of subnumber 2 to 20, the alkoxy of carbon atom number 1 to 20, carbon atom number 2 to 18 silylation, carbon atom
The siloxy of number 3 to 18 and the aryl of carbon atom number 6 to 12 or halogenated aryl.
12. the product of the formation of the surface according to (11) matcoveredn, which is characterized in that R1、R2、R3、R4、R5、R6Point
Not alkenyl or halogen independently selected from hydrogen, chlorine, bromine, iodine, the alkyl of carbon atom number 1 to 10 or halogenated alkyl, carbon atom number 2 to 10
For alkenyl, the alkoxy of carbon atom number 1 to 10, the silylation of carbon atom number 2 to 12, carbon atom number 3 to 12 siloxy and
The aryl or halogenated aryl of carbon atom number 6 to 10；
R7、R8Separately it is selected from hydrogen, chlorine, bromine, iodine, the alkyl of carbon atom number 1 to 10 or halogenated alkyl, carbon atom number 2
To 10 alkenyl or halogenated alkenyl, the alkoxy of carbon atom number 1 to 10, the silylation of carbon atom number 2 to 12, carbon atom number 3 to
12 siloxy and the aryl of carbon atom number 6 to 10 or halogenated aryl.
13. the product of the formation of the surface according to (11) matcoveredn, which is characterized in that R1、R2、R3、R4、R5、R6Point
Not independently selected from hydrogen, chlorine, bromine, iodine, the alkyl of carbon atom number 1 to 6 or halogenated alkyl, the alkenyl of carbon atom number 2 to 6 or halogenated
Alkenyl, the alkoxy of carbon atom number 1,2 or 3, trimethyl silicon substrate, trimethylsiloxy group and carbon atom number 6 to 8 aryl or halogen
For aryl；R7、R8Separately selected from methyl, ethyl, n-propyl, isopropyl, vinyl, acrylic, methoxyl group, ethyoxyl,
Trimethyl silicon substrate, trimethylsiloxy group and phenyl.
14. the product of the formation of the surface according to (11) matcoveredn, which is characterized in that the change that chemical formula (II) indicates
It closes object and is selected from hexamethyldisiloxane, octamethyltrisiloxane, decamethyl tetrasiloxane, ten dimethyl, five siloxanes, ten tetramethyls
One or more of six siloxanes of base, nine siloxanes of ten hexamethyls, seven siloxanes, ten prestoxs, eight siloxanes and two decamethyls.
15. the product of the formation of the surface according to (11) matcoveredn, which is characterized in that form the first plasma
First gas includes the compound indicated by chemical formula (I),
Wherein, T1Represent C1-C3Alkyl, C1-C3Halogenated alkyl or C2-C3Alkenyl；T2、T3、T4、T5、T6Separately generation
Table hydrogen, halogen, C1-C3Alkyl, C1-C3Halogenated alkyl or C2-C3Alkenyl；T2-T6In at least one be not hydrogen or halogen.
16. the product of the formation of the surface according to (15) matcoveredn, which is characterized in that in formula (I) structure, work as T1-T6
In have and only there are two for methyl when, at least one in the atom or substituent group of other non-methyl is not hydrogen.
17. the product of the formation of the surface according to (11) matcoveredn, which is characterized in that in first protective layer and
Between second protective layer, also there is middle layer, the third plasma that the middle layer is formed by the third gas comprising fluorohydrocarbon
Body is formed.
18. the product of the formation of the surface according to (11) matcoveredn, which is characterized in that the product includes: electrical
At least one of equipment, electronic equipment, wrist-watch, cloth, permeable membrane and wearing product.
19. the product of the formation of the surface according to (18) matcoveredn, which is characterized in that the electrical equipment includes:
Any one of communication base station, transformer equipment, data switching equipment, the vehicles, outdoor lightings and/or communication base
It stands, any component of any one of transformer equipment, data switching equipment, the vehicles, outdoor lightings.
20. the product of the formation of the surface according to (18) matcoveredn, which is characterized in that the electronic equipment includes:
Any one of handheld communication devices, electronic game station, wearable electronic and/or handheld communication devices, electronics trip
Any component of any one of equipment, the wearable electronic of playing.
21. the product of the formation of the surface according to (18) matcoveredn, which is characterized in that
The wearing product includes clothes, shoes and hats and/or ornaments.
Technical effect
In the method for body surface formation protective layer and with the guarantor formed by this method provided by according to the present invention
The product of sheath, can be improved prevents object by the ability of fluid contact surface and the ability for preventing steam from penetrating, meanwhile, it is capable to
The binding force of protective layer and body surface is improved, and also there is good environment under the extreme conditions such as high temperature and humidity, low temperature
Stability.
Specific embodiment
The technical solution of more than one embodiment of the invention is described below.Obviously, reality as described herein
It applies example to be only a part of the embodiment of the present invention, instead of all the embodiments.It should be noted that based on these in the present invention
Embodiment, those of ordinary skill in the art's every other embodiment obtained, shall fall within the protection scope of the present invention.
It should be noted that in the present invention, the statement of " gas " refer to individually or the gas of form of mixtures or
Steam and aerosol.
" closely knit protective layer " refers to that the protective layer can either prevent liquid by that can prevent gas from passing through again.
" lyophobicity protective layer " refers to that the protective layer can prevent liquid from passing through, and allows gas to pass through under normal circumstances.
" liquid " refers to liquid, including water, oil, aqueous solution or other contain at least one of water or mixing liquid etc. of oil.
The method according to an embodiment of the invention for forming protective layer in body surface, forms the first plasma
First gas includes the compound indicated by chemical formula (I),
Wherein, T1Represent C1-C3Alkyl, C1-C3Halogenated alkyl or C2-C3Alkenyl；T2、T3、T4、T5、T6Separately generation
Table hydrogen, halogen, C1-C3Alkyl, C1-C3Halogenated alkyl or C2-C3Alkenyl；T2-T6In at least one be not hydrogen or halogen；And work as
T1-T6In have and only there are two for methyl when, at least one in the atom or substituent group of other non-methyl is not hydrogen.
For example, the compound that chemical formula (I) indicates is o, m, p- methyl styrene, Isosorbide-5-Nitrae-divinylbenzene, 1,2,4- tri-
Toluene, mesitylene, durol, to two benzotrifluorides etc..
The method according to an embodiment of the invention for forming protective layer in body surface, in formula (I) structure, works as T1-T6
In have and only there are two for methyl when, preferably at least having one in the atom or substituent group of other non-methyl is not hydrogen.It is above-mentioned excellent
Formula (I) compound example of choosing can be 2- chloro-p-xylene, tetrafluoro paraxylene etc..
It is recognised that at least part surface of object be exposed to by include compound that chemical formula (I) indicates the
In the first plasma that one gas is formed after the scheduled time, it is deposited at least part surface of the object based on chemistry
The first polymer layer for the compound that formula (I) indicates.
The method according to an embodiment of the invention for forming protective layer in body surface, forms the second plasma
Second gas includes the compound indicated by chemical formula (II),
Wherein, R1、R2、R3、R4、R5、R6Separately selected from hydrogen, chlorine, bromine, iodine, carbon atom number 1 to 20 alkyl or halogen
Substituted alkyl, the alkenyl of carbon atom number 1 to 20 or halogenated alkenyl, the alkoxy of carbon atom number 1 to 20, carbon atom number 2 to 18 silicon
The aryl or halogenated aryl of alkyl, the siloxy of carbon atom number 3 to 18 and carbon atom number 6 to 12.X is the repetition list of polymer
Member；K is the arbitrary integer in 0 to 7.
Shown in the structure of repetitive unit X such as formula (III):
Wherein, R7、R8It is separately former selected from hydrogen, chlorine, bromine, iodine, the alkyl of carbon atom number 1 to 20 or halogenated alkyl, carbon
The alkenyl or halogenated alkenyl of subnumber 2 to 20, the alkoxy of carbon atom number 1 to 20, carbon atom number 2 to 18 silylation, carbon atom
The siloxy of number 3 to 18 and the aryl of carbon atom number 6 to 12.
Specifically, as the alkyl of carbon atom number 1 to 20, alkyl group or naphthenic base be can be.It is easy to vaporize, Shu from taking into account
Effect of fluidity and binding force etc. consideration, the preferably alkyl of carbon atom number 1 to 10, more preferably methyl, ethyl, positive third
Base, isopropyl.
As alkyl group, can enumerate methyl, ethyl, n-propyl, isopropyl, normal-butyl, sec-butyl, tert-butyl, just, it is secondary,
Tertiary pentyl, just, secondary, tertiary hexyl, just, secondary, tertiary heptyl, just, secondary, t-octyl, just, secondary, tertiary nonyl, just, secondary, tertiary decyl etc..It is excellent
Select methyl, ethyl, n-propyl, isopropyl.
As naphthenic base, cyclopropyl, cyclobutyl, cyclopenta, cyclohexyl, 4- methylcyclohexyl, adamantyl, drop can be enumerated
Bornyl etc..Cyclic carbon number preferably 3 to 12, more preferable 3 to 6.
It as aryl, such as can enumerate: phenyl, tolyl, naphthalene, xenyl etc..
As alkoxy, it is expressed as-OY, as the example of Y, the example of the alkyl of above-mentioned carbon atom number 1 to 20 can be enumerated.
Alkoxy can enumerate methoxyl group, ethyoxyl, propoxyl group, butoxy, amoxy, hexyloxy, oxygroup in heptan, octyloxy, nonyl epoxide, the last of the ten Heavenly stems
Oxygroup etc..It is preferred that methoxyl group and ethyoxyl.
As the alkenyl of carbon atom number 2 to 20, vinyl, acrylic, cyclobutenyl, pentenyl, hexenyl, heptene can be enumerated
Base, octenyl, nonenyl, decene base etc..
As the silylation of carbon atom number 2 to 18, dimethyl silicon substrate, triisopropylsilyl, tert-butyl diphenyl can be enumerated
Silicon substrate etc..
As the siloxy of carbon atom number 3 to 18, trimethylsiloxy group, tri-tert siloxy, triphenyl silicon can be enumerated
Oxygroup etc..
As the halogen atom in halogenated alkyl, halogenated alkenyl and halogenated aryl, chlorine, bromine, iodine can be enumerated.
As the alkyl in halogenated alkyl, with the example of abovementioned alkyl.
As the alkenyl in halogenated alkenyl, with the example of above-mentioned alkenyl.
As the aryl in halogenated aryl, with the example of above-mentioned aryl.
Specifically, the compound of chemical formula (II) is preferably hexamethyldisiloxane, octamethyltrisiloxane, decamethyl four
Siloxanes, ten dimethyl, five siloxanes, tetradecamethylhexasiloxane, ten hexamethyls, seven siloxanes, ten prestoxs, eight siloxanes or
Two decamethyls, nine siloxanes.
It is recognised that being exposed at least part surface for being formed with the object of the first protective layer by including chemical formula
(II) in the second plasma that the second gas of the compound indicated is formed after the scheduled time, at least part of the object
The second polymer layer of the compound indicated based on chemical formula (II) is deposited on surface.
The method according to an embodiment of the invention for forming protective layer in body surface, the first protective layer are closely knit guarantor
Sheath.Second protective layer is lyophobicity protective layer.
One example of the method according to an embodiment of the invention that protective layer is formed in body surface, will form
Before thering is at least part surface of the object of first protective layer to be exposed in the second plasma, will first it be formed with
At least part surface of the object of first protective layer is exposed to formed by the third gas comprising fluorohydrocarbon
In three plasma body, to form middle layer.The fluorohydrocarbon can enumerate CF4、C2F4、C2F6、C3F6、C3F8、C4F8。
In this way, by between the first protective layer and the second protective layer be arranged middle layer can further increase protective layer with
The binding force of body surface, to improve the protection service life of protective layer, while raising prevents energy of the object by fluid contact surface
Power.
According to one embodiment of present invention, including the first plasma of formation of the compound indicated by chemical formula (I)
First gas the first plasma is formed in the plasma chamber of plasma apparatus.Plasma apparatus includes pairs of
The electrode of setting, the electrode being arranged in pairs are contained in plasma chamber.
According to one embodiment of present invention, including the second plasma of formation of the compound indicated by chemical formula (II)
Second gas the second plasma is formed in the plasma chamber of plasma apparatus.Plasma apparatus includes pairs of
The electrode of setting, the electrode being arranged in pairs are contained in plasma chamber.
According to one embodiment of present invention, it is being waited including the third gas by forming third plasma comprising fluorohydrocarbon
Third plasma is formed in the plasma chamber of gas ions equipment.Plasma apparatus includes the electrode being arranged in pairs, at
The electrode of setting is contained in plasma chamber.
It is of the invention in the method that body surface forms protective layer, plasma polymerization occurs accurate in an efficient way
Condition can change according to the factor such as the property of polymer, processed product, and it is normal that these conditions are able to use this field
Method and/or technology are advised to determine.
Suitable plasma for methods described herein includes nonequilibrium plasma, for example, by radio frequency (Rf),
Microwave or direct current (DC) generate, and are preferably generated by radio frequency (Rf).They can be in atmospheric pressure as known in the art or low
In an atmosphere pressing operation.
Various forms of plasma apparatus can be used to generate gaseous plasma.In general, these devices include holding
Device, the plasma chamber that can produce plasma and the electrode being arranged in pairs, the electrode being arranged in pairs are contained in plasma
In body cavity body.The specific example of such device is on the books in such as WO2005/089961 and WO02/28548, in addition to this,
Many other commercially available plasma generating devices, such as 160 integral type plasma handling system of Triton, Verus ICP etc.
Gas ions system (millet is manufactured with Science and Technology Ltd.) is also to be applicable in.
In general, product to be processed is placed in plasma chamber together with the gaseous polymer precursor to be deposited,
Glow discharge is lighted in the chamber and applies suitable voltage, can be pulse voltage or continuous voltage, preferably pulse electricity
Pressure.
The gas used in plasma may include the steam of individual monomeric compound, but it can be with carrier gas
Body especially inert gas (such as helium or argon gas), CF4、C3F8、N2、H2At least one of mixing.Particularly, due to can be with
The fragmentation of monomer is minimized, preferred carrier gas is helium.
In all cases, by applying high frequency voltage such as 13.56MHz, glow discharge is suitably ignited, Ke Yiyou
The electrode of plasma chamber interior applies.
It can be with the rate of the range of at least 1 sccm (sccm) and preferably 1-100sccm suitably
Gas, steam or admixture of gas are provided.
In the case of the monomer vapour, according to the property of monomer its with the 80-300mg/min for example, about speed of 120mg/min
Rate suitably provides, while applying pulse voltage.
Gas or steam can be inhaled into or be pumped into heating region.Particularly, when using plasma chamber, due to
Lead to the reduction of room pressure using aspiration pump, gas or steam can be inhaled into interior, if it is liquid, such as can wait
Gas or steam are vaporizated into outside gas ions room.
It is polymerize using steam of the invention, can be kept under the pressure of 0.0001-1000 millitorr, preferably about
It keeps under the pressure of 0.1-500 millitorr, is more preferably kept under the pressure of 0.1-200 millitorr.
Apply as impulse electric field, applied field has the peak power of 10-5000W, the preferably peak work of 30-1000W
Rate, the peak power of more preferable 50-500W.Pulse is applied with the sequence of fixed frequency, frequency 1-500Hz, preferably 10-
200Hz, more preferable 50-150Hz.Each sequence, which is divided into, opens and closes two parts, wherein service time account for sequence always continue when
Between ratio be known as duty ratio, duty cycle range can be 1%-95%, preferably 1%-50%, more preferable 5%-30%.With this
The Typical average powers that method obtains are 20W.
According to embodiment of the present invention, when needed, the container for filling the compound of the present invention can be heated
To predetermined temperature, in the plasma chamber for guaranteeing to be transported to plasma apparatus in the form of gas by compound.Into one
Step ground says that when needed, the channel for the plasma chamber that plasma apparatus can be transported to compound is heated, and
Holding is heated to predetermined temperature.
According to embodiment of the present invention, the electrode being arranged in pairs first is connected with continuous radio-frequency power supply, and even
Continuous radio-frequency power supply applies above-mentioned continuous radio frequency power to the electrode being arranged in pairs and continues at the first time, then, to be arranged in pairs
Electrode is connected with pulse radiation frequency power supply, and pulse radiation frequency power supply applies above-mentioned pulse radiation frequency electric power to the electrode being arranged in pairs
And continued for the second time.
Embodiment
Present invention will be further explained below with reference to specific examples.It will be understood by those skilled in the art that these embodiments are only
For illustrating the present invention rather than limiting the scope of the invention.
Experimental raw:
The compound that the second gas of the second plasma is formed in each embodiment is listed in the table below 1.
Table 1:
Experiment equipment: (160 integral type plasma handling system of Triton, Shanghai millet have plasma handling system with science and technology
The manufacture of limit company), every technical parameter please refers to product manual.
Embodiment 1
100 transistors are placed in plasma chamber body, cavity is emptied to the base pressure of 3-10 millitorr, then makes helium
Gas is passed through in cavity with 20sccm until pressure reaches 80 millitorrs.Then cause continuous function at 13.56MHz, 300W using RF
Rate plasma 5 minutes.
Then, 2- chloro-p-xylene steam is introduced into cavity with 120 mg minutes rates, and by the plasma
Body switches to following pulsed plasma: peak power 100W, frequency 50Hz, duty ratio 5%.2- chloro-p-xylene
Ionize and formed with autoreactivity on the surface of transistor the first protective layer of continuous uniform.After continuing 15 minutes, close
Plasma electrical source simultaneously stops supplying 2- chloro-p-xylene steam.
The intracorporal vacuum of chamber is maintained, the steam of compound 1 is introduced into cavity with 120 mg minutes rates, and by institute
It states plasma and switches to following pulsed plasma: peak power 150W, frequency 50Hz, duty ratio 5%.Chemical combination
The ionization of object 1 and the second protective layer for forming continuous uniform on the surface of transistor with autoreactivity.Continue after twenty minutes, to close
It closes plasma electrical source and stops supplying the steam of compound 1.
The cavity is emptied into base pressure, then ventilate again to atmospheric pressure and takes out sample, obtains that there is two layers of protective layer
Sample 1.
Embodiment 2
100 transistors are placed in plasma chamber body, cavity is emptied to the base pressure of 3-10 millitorr, then makes helium
Gas is passed through in cavity with 20sccm until pressure reaches 80 millitorrs.Then cause continuous function at 13.56MHz, 300W using RF
Rate plasma 5 minutes.
Then, 2- chloro-p-xylene steam is introduced into cavity with 120 mg minutes rates, and by the plasma
Body switches to following pulsed plasma: peak power 100W, frequency 50Hz, duty ratio 5%.To 2- xylene dichloride
Ionize and formed with autoreactivity on the surface of transistor the first protective layer of continuous uniform.After continuing 15 minutes, close
Plasma electrical source simultaneously stops supplying 2- chloro-p-xylene steam.
The intracorporal vacuum of chamber is maintained, hexafluoropropene steam is introduced into cavity with 120 mg minutes rates, and by institute
It states plasma and switches to following pulsed plasma: peak power 100W, frequency 100Hz, duty ratio 5%.Six
Fluoropropene ionization and the middle layer for forming continuous uniform on the surface of transistor with autoreactivity.Continue after ten minutes, to close
It closes plasma electrical source and stops supplying hexafluoropropene steam.
The intracorporal vacuum of chamber is maintained, the steam of compound 2 is introduced into cavity with 120 mg minutes rates, and by institute
It states plasma and switches to following pulsed plasma: peak power 150W, frequency 100Hz, duty ratio 5%.Change
It closes the ionization of object 2 and forms the second protective layer of continuous uniform on the surface of transistor with autoreactivity.Continue after twenty minutes,
It closes plasma electrical source and stops supplying the steam of compound 2.
The cavity is emptied into base pressure, then ventilate again to atmospheric pressure and takes out sample, is obtained with three-layer protection layer
Sample 2.
Embodiment 3
100 knitted gloves are placed in plasma chamber body, cavity is emptied to the base pressure of 3-10 millitorr, is then made
Nitrogen is passed through in cavity with 20sccm until pressure reaches 80 millitorrs.Then caused at 13.56MHz, 300W continuously using RF
Power plasma 5 minutes.
Then, 1,2,4- front three benzene vapour is introduced into cavity with 120 mg minutes rates, and by the plasma
Body switches to following pulsed plasma: peak power 100W, frequency 50Hz, duty ratio 25%.1,2,4- front three
Benzene ionization and the first protective layer for forming continuous uniform on the surface of transistor with autoreactivity.After continuing 15 minutes, close
It closes plasma electrical source and stops supplying 1,2,4- front three benzene vapour.
The intracorporal vacuum of chamber is maintained, the steam of compound 3 is introduced into cavity with 120 mg minutes rates, and by institute
It states plasma and switches to following pulsed plasma: peak power 150W, frequency 50Hz, duty ratio 25%.Change
It closes the ionization of object 3 and forms the second protective layer of continuous uniform on the surface of transistor with autoreactivity.Continue after twenty minutes,
It closes plasma electrical source and stops supplying the steam of compound 3.
The cavity is emptied into base pressure, then ventilate again to atmospheric pressure and takes out sample, obtains that there is two layers of protective layer
Sample 3.
Embodiment 4
100 knitted gloves are placed in plasma chamber body, cavity is emptied to the base pressure of 3-10 millitorr, is then made
Nitrogen is passed through in cavity with 20sccm until pressure reaches 80 millitorrs.Then caused at 13.56MHz, 300W continuously using RF
Power plasma 5 minutes.
Then, two benzotrifluoride steam will be introduced into cavity with 120 mg minutes rates, and by the plasma
Body switches to following pulsed plasma: peak power 100W, frequency 50Hz, duty ratio 5%.To two benzotrifluorides
Ionize and formed with autoreactivity on the surface of transistor the first protective layer of continuous uniform.After continuing 15 minutes, close
Plasma electrical source simultaneously stops for coping with two benzotrifluoride steam.
The intracorporal vacuum of chamber is maintained, octafluoro butylene steam is introduced into cavity with 120 mg minutes rates, and by institute
It states plasma and switches to following pulsed plasma: peak power 100W, frequency 100Hz, duty ratio 3%.Eight
The ionization of fluorine butylene and the middle layer for forming continuous uniform on the surface of transistor with autoreactivity.Continue after ten minutes, to close
It closes plasma electrical source and stops supplying octafluoro butylene steam.
The intracorporal vacuum of chamber is maintained, the steam of compound 4 is introduced into cavity with 120 mg minutes rates, and by institute
It states plasma and switches to following pulsed plasma: peak power 150W, frequency 100Hz, duty ratio 3%.Change
It closes the ionization of object 4 and forms the second protective layer of continuous uniform on the surface of transistor with autoreactivity.Continue after twenty minutes,
It closes plasma electrical source and stops supplying the steam of compound 4.
The cavity is emptied into base pressure, then ventilate again to atmospheric pressure and takes out sample, is obtained with three-layer protection layer
Sample 4.
Embodiment 5
Other than the second gas for forming the second protective layer is replaced with the compound 5 of table 1, same as Example 1ly
Operation prepares the sample 5 with two layers of protective layer.
Embodiment 6
Other than the second gas for forming the second protective layer is replaced with the compound 6 of table 1, same as Example 2ly
Operation prepares the sample 6 with three-layer protection layer.
Embodiment 7
The second protective layer will be formed in addition to the first gas for forming the first protective layer is replaced with 1,3,5- triethyl group benzos
Second gas replace with except the compound 7 of table 1, operate same as Example 1ly, prepare the sample with two layers of protective layer
7。
Embodiment 8
The second protective layer will be formed in addition to the first gas for forming the first protective layer is replaced with 1,3,5- triethyl group benzos
Second gas replace with except the compound 8 of table 1, operate same as Example 2ly, prepare the sample with three-layer protection layer
8。
Embodiment 9
In addition to the first gas for forming the first protective layer is replaced with 2- chloro-p-xylene and the second protective layer will be formed
Second gas replaces with except the compound 9 of table 1, operates same as Example 3ly, prepares the sample 9 with two layers of protective layer.
Embodiment 10
In addition to the first gas for forming the first protective layer is replaced with 2- chloro-p-xylene and the second protective layer will be formed
Second gas replaces with except the compound 10 of table 1, operates same as Example 4ly, prepares the sample with three-layer protection layer
10。
Comparative example 1
Other than changing the gas for forming the second protective layer into hexafluoropropene, operates similarly with example 1, prepare ratio
Compared with the sample of example 1.
Performance evaluation
1. hydrophobicity
1.1 test apparatus
Static Contact angle measuring instrument (manufacture of model Theta Lite:Biolin company)
1.2 test methods and result
Static Contact angle tester is mainly used for measuring the contact angle of liquid versus solid, the i.e. wellability of liquid versus solid,
Various liquid can be measured to the contact angle of a variety of materials.Static contact angle, which refers to, drips a drop in a solid level plane,
At solid-liquid-gas three-phase point of interface on the surface of solids, liquid phase is clipped in it by liquid-vapor interface and two tangent line of solid-liquid interface
Formed angle when middle.Contact angle is bigger, illustrates that this material is better to the repellency of test liquid, wellability is poorer.
The present invention adopts water as liquid, wellability of the test protective layer to water.Respectively from 100 samples of each embodiment
In randomly select 5, according to above-mentioned method, the protective layer of sample prepared by 1-4 of the embodiment of the present invention and comparative example into
Row contact angle test takes its average value as test result.
As a result as shown in table 2 below.
Table 2 (n=5)
2. water and salt fog permeability test
2.1 experimental method
Salt spray test (GB6458-86 standard, 48 hours, corrosion-free), this law are using salt spray tester by chlorination
The experimental liquid of sodium solution is sprayed on a kind of corrosion tests on protective layer with mist.This method is using 5% salt water at 35 DEG C
In the environment of with spraying form to sample carry out accelerated ageing corrosion experiment observe the embodiment of the present invention respectively after 48 hours
Whether the protective layer of the sample prepared in 1-10, comparative example is complete, that is, has corrosion-free.
2.2 experimental result
Test result is as follows shown in table 3.
Table 3 (n=100)
3. adhesiveness
3.1 experimental method
Using pressure sensitive adhesive tape method test film to the adhesiveness of ground.
The experiment is used to evaluate the bond strength of protective layer and substrate, and this method uses the pressure sensitive adhesive tape of standard to test work
Tool, first with certain power by pressure surface adhesive tape pressure on the protection layer, then check protection layer is under a stable power traction
It is no to be removed from matrix surface.According to the method described above, the protection of the sample prepared by 1-10 of the embodiment of the present invention and comparative example
Layer is tested.
3.2 result
Test result shows that in each 100 samples of each embodiment, 93% or more sample protective layer does not have with substrate
Peeling off phenomenon, and there is no removings for the sample protective layer and substrate that comparative example only has 87%.
Experimental result is listed in the table below shown in 4.
Table 4 (n=100)
4. high/low temperature experiment and high temperature and humidity experiment
This experiment is the environmental stability test in order to verify protective layer, and verifying protective layer is steady under various extreme conditions
Qualitative and reliability, it is real by carrying out accelerated ageing to sample in tropical deterioration equipment and high/low temperature aging equipment
It tests.
According to the test method of national standard GB/T2423.2, the protective layer sample of each sample of inventive embodiments preparation is carried out
48 hours senile experiments under the conditions of 48 hours senile experiments, and -40 DEG C under 85 DEG C/85% damp condition, test hair
In each 100 samples of existing sample 1-10, its protective layer bubble-free/removing/layering/spot of 90% or more sample shows this
The protective layer that the method for invention is formed has good environmental stability under the extreme conditions such as high temperature and humidity, low temperature,
And comparative example 1 only has 75% sample protective layer bubble-free/removing/layering/spot.
Although being not particularly illustrated above to the present invention, it will be understood to those skilled in the art that disclosed in the prior art
Content can be by connected applications into the present invention.For example, disclosed in Chinese Patent Application No. CN201380012311.3
The method and apparatus that the first gas of compound comprising being indicated by chemical formula (I) forms the first plasma is equally applicable to this
Invention corresponding method, and disclosed in it by the third gas comprising fluorohydrocarbon is formed third plasma method and
Equipment is equally applicable to corresponding method of the invention.In another example Chinese Patent Application No. CN200780002629,
Disclosed in CN200780048614, CN200980120491, CN200780002557 and CN200880114449 will comprising by
The method and apparatus that the second gas for the compound that chemical formula (II) indicates forms the second plasma is equally applicable to the present invention
Corresponding method.In another example equipment disclosed in the Chinese patent application that Chinese Patent Application No. is 201610815598.9, ginseng
Several and method, those skilled in the art may be incorporated into the present invention.Those skilled in the art is it is recognised that the present invention
In object and product and be not limited to defined by above description, can also include these patent disclosures all objects and
Product.For example, electronic equipment described in the invention further includes institute disclosed in Chinese Patent Application No. CN200780002557
There are electronic equipment and electrical equipment.In another example if the present invention does not illustrate, the ginseng of technique disclosed in these prior arts
Number, method, embodiment etc. can also be integrated in the present invention by way of replacement.
Above to it is provided by the present invention it is a kind of body surface formed protective layer method and surface be formed with protection
The product of layer is described in detail, and specific case used herein explains the principle of the present invention and embodiment
It states, method and inventive concept of the invention that the above embodiments are only used to help understand；Meanwhile for the one of this field
As technical staff, according to the thought of the present invention, there will be changes in the specific implementation manner and application range, to sum up institute
It states, the contents of this specification are not to be construed as limiting the invention.
Claims (21)
1. a kind of method for forming protective layer in body surface characterized by comprising
At least part surface of the object is exposed in the first plasma, at least part table of the object
Face forms the first protective layer；With
At least part surface for being formed with the object of first protective layer is exposed in the second plasma, with shape
At the second protective layer；
The second gas for forming second plasma is different from forming the first gas of first plasma,
The second gas includes the compound indicated by chemical formula (II),
Wherein, R1、R2、R3、R4、R5、R6Separately selected from hydrogen, chlorine, bromine, iodine, carbon atom number 1 to 20 alkyl or alkyl halide
Base, the alkenyl of carbon atom number 2 to 20 or halogenated alkenyl, the alkoxy of carbon atom number 1 to 20, carbon atom number 2 to 18 silylation,
The siloxy of carbon atom number 3 to 18 and the aryl of carbon atom number 6 to 12 or halogenated aryl, X are the repetitive unit of polymer, k
For the arbitrary integer in 0 to 7；
The structure of repetitive unit X is as shown in chemical formula (III):
Wherein, R7、R8Separately selected from hydrogen, chlorine, bromine, iodine, the alkyl of carbon atom number 1 to 20 or halogenated alkyl, carbon atom number
2 to 20 alkenyl or halogenated alkenyl, the alkoxy of carbon atom number 1 to 20, the silylation of carbon atom number 2 to 18, carbon atom number 3 to
18 siloxy and the aryl of carbon atom number 6 to 12 or halogenated aryl.
2. the method according to claim 1 for forming protective layer in body surface, which is characterized in that R1、R2、R3、R4、R5、
R6Alkenyl separately selected from hydrogen, chlorine, bromine, iodine, the alkyl of carbon atom number 1 to 10 or halogenated alkyl, carbon atom number 2 to 10
Or the siloxy of the alkoxy of halogenated alkenyl, carbon atom number 1 to 10, the silylation of carbon atom number 2 to 12, carbon atom number 3 to 12
And the aryl or halogenated aryl of carbon atom number 6 to 10；
R7、R8Separately selected from hydrogen, chlorine, bromine, iodine, the alkyl of carbon atom number 1 to 10 or halogenated alkyl, carbon atom number 2 to 10
Alkenyl or halogenated alkenyl, the alkoxy of carbon atom number 1 to 10, the silylation of carbon atom number 2 to 12, carbon atom number 3 to 12
The aryl or halogenated aryl of siloxy and carbon atom number 6 to 10.
3. the method according to claim 1 for forming protective layer in body surface, which is characterized in that R1、R2、R3、R4、R5、
R6Separately selected from hydrogen, chlorine, bromine, iodine, the alkyl of carbon atom number 1 to 6 or halogenated alkyl, carbon atom number 2 to 6 alkenyl or
Halogenated alkenyl, the alkoxy of carbon atom number 1,2 or 3, trimethyl silicon substrate, trimethylsiloxy group and carbon atom number 6 to 8 aryl
Or halogenated aryl；R7、R8Separately it is selected from methyl, ethyl, n-propyl, isopropyl, vinyl, acrylic, methoxyl group, second
Oxygroup, trimethyl silicon substrate, trimethylsiloxy group and phenyl.
4. the method according to claim 1 for forming protective layer in body surface, which is characterized in that chemical formula (II) indicates
Compound be selected from hexamethyldisiloxane, octamethyltrisiloxane, decamethyl tetrasiloxane, ten dimethyl, five siloxanes, ten
One of six siloxanes of tetramethyl, nine siloxanes of ten hexamethyls, seven siloxanes, ten prestoxs, eight siloxanes and two decamethyls with
On.
5. the method according to claim 1 for forming protective layer in body surface, which is characterized in that form described first etc.
The first gas of gas ions includes the compound indicated by chemical formula (I),
Wherein, T1Represent C1-C3Alkyl, C1-C3Halogenated alkyl or C2-C3Alkenyl；T2、T3、T4、T5、T6Separately represent hydrogen,
Halogen, C1-C3Alkyl, C1-C3Halogenated alkyl or C2-C3Alkenyl；T2-T6In at least one be not hydrogen or halogen.
6. the method according to claim 5 for forming protective layer in body surface, which is characterized in that in formula (I) structure, when
T1-T6In have and only there are two for methyl when, at least one in the atom or substituent group of other non-methyl is not hydrogen.
7. the method according to claim 1 for forming protective layer in body surface, which is characterized in that described that will be formed with
Before at least part surface of the object of first protective layer is exposed in the second plasma, it will first be formed with described
At least part surface of the object of one protective layer be exposed to third formed by the third gas comprising fluorohydrocarbon etc. from
In daughter, to form middle layer.
8. the method according to claim 7 for forming protective layer in body surface, which is characterized in that the fluorohydrocarbon is selected from
CF4、C2F4、C2F6、C3F6、C3F8、C4F8One of or it is a variety of.
9. the method as claimed in any of claims 1 to 6 for forming protective layer in body surface, which is characterized in that
The first gas for forming first plasma further includes the first carrier gas, and first carrier gas is selected from inert gas, CF4、
C3F8、N2、H2At least one of；And
The second gas for forming second plasma further includes the second carrier gas, and second carrier gas is selected from inert gas, CF4、
C3F8、N2、H2At least one of.
10. the method according to claim 7 for forming protective layer in body surface, which is characterized in that form the third
The third gas of plasma further includes third carrier gas, and the third carrier gas is selected from inert gas, CF4、C3F8、N2、H2In extremely
Few one kind.
11. the product that a kind of surface forms matcoveredn, which is characterized in that the protective layer includes the first protective layer, and described the
One protective layer is formed at least part surface of the product by being exposed in the first plasma, and
Second protective layer, second protective layer pass through at least part that will be formed with the product of first protective layer
Surface is exposed to the outer surface that first protective layer is formed in the second plasma；
The second gas for forming second plasma is different from forming the first gas of first plasma,
The second gas includes the compound indicated by chemical formula (II),
Wherein, R1、R2、R3、R4、R5、R6Separately selected from hydrogen, chlorine, bromine, iodine, carbon atom number 1 to 20 alkyl or alkyl halide
Base, the alkenyl of carbon atom number 2 to 20 or halogenated alkenyl, the alkoxy of carbon atom number 1 to 20, carbon atom number 2 to 18 silylation,
The siloxy of carbon atom number 3 to 18 and the aryl of carbon atom number 6 to 12 or halogenated aryl, X are the repetitive unit of polymer, k
For the arbitrary integer in 0 to 7；
The structure of repetitive unit X is as shown in chemical formula (III):
Wherein, R7、R8Separately selected from hydrogen, chlorine, bromine, iodine, the alkyl of carbon atom number 1 to 20 or halogenated alkyl, carbon atom number
2 to 20 alkenyl or halogenated alkenyl, the alkoxy of carbon atom number 1 to 20, the silylation of carbon atom number 2 to 18, carbon atom number 3 to
18 siloxy and the aryl of carbon atom number 6 to 12 or halogenated aryl.
12. the product that surface according to claim 11 forms matcoveredn, which is characterized in that R1、R2、R3、R4、R5、R6
Separately selected from hydrogen, chlorine, bromine, iodine, the alkyl of carbon atom number 1 to 10 or halogenated alkyl, carbon atom number 2 to 10 alkenyl or
Halogenated alkenyl, the alkoxy of carbon atom number 1 to 10, the silylation of carbon atom number 2 to 12, carbon atom number 3 to 12 siloxy with
And the aryl or halogenated aryl of carbon atom number 6 to 10；
R7、R8Separately selected from hydrogen, chlorine, bromine, iodine, the alkyl of carbon atom number 1 to 10 or halogenated alkyl, carbon atom number 2 to 10
Alkenyl or halogenated alkenyl, the alkoxy of carbon atom number 1 to 10, the silylation of carbon atom number 2 to 12, carbon atom number 3 to 12
The aryl or halogenated aryl of siloxy and carbon atom number 6 to 10.
13. the product that surface according to claim 11 forms matcoveredn, which is characterized in that R1、R2、R3、R4、R5、R6
Separately alkenyl or halogen selected from hydrogen, chlorine, bromine, iodine, the alkyl of carbon atom number 1 to 6 or halogenated alkyl, carbon atom number 2 to 6
Aryl for alkenyl, the alkoxy of carbon atom number 1,2 or 3, trimethyl silicon substrate, trimethylsiloxy group and carbon atom number 6 to 8 or
Halogenated aryl；R7、R8Separately it is selected from methyl, ethyl, n-propyl, isopropyl, vinyl, acrylic, methoxyl group, ethoxy
Base, trimethyl silicon substrate, trimethylsiloxy group and phenyl.
14. the product that surface according to claim 11 forms matcoveredn, which is characterized in that chemical formula (II) indicated
Compound is selected from hexamethyldisiloxane, octamethyltrisiloxane, decamethyl tetrasiloxane, ten dimethyl, five siloxanes, 14
One of six siloxanes of methyl, nine siloxanes of ten hexamethyls, seven siloxanes, ten prestoxs, eight siloxanes and two decamethyls with
On.
15. the product that surface according to claim 11 forms matcoveredn, which is characterized in that form the first plasma
First gas include the compound indicated by chemical formula (I),
Wherein, T1Represent C1-C3Alkyl, C1-C3Halogenated alkyl or C2-C3Alkenyl；T2、T3、T4、T5、T6Separately represent hydrogen,
Halogen, C1-C3Alkyl, C1-C3Halogenated alkyl or C2-C3Alkenyl；T2-T6In at least one be not hydrogen or halogen.
16. the product that surface according to claim 15 forms matcoveredn, which is characterized in that in formula (I) structure, work as T1-
T6In have and only there are two for methyl when, at least one in the atom or substituent group of other non-methyl is not hydrogen.
17. the product that surface according to claim 11 forms matcoveredn, which is characterized in that in first protective layer
And second between protective layer, also has a middle layer, third that the middle layer is formed by the third gas comprising fluorohydrocarbon etc. from
Daughter is formed.
18. the product that surface according to claim 11 forms matcoveredn, which is characterized in that the product includes: electricity
At least one of gas equipment, electronic equipment, wrist-watch, cloth, permeable membrane and wearing product.
19. the product that surface according to claim 18 forms matcoveredn, which is characterized in that the electrical equipment packet
It includes: any one of communication base station, transformer equipment, data switching equipment, the vehicles, outdoor lightings and/or communication
Any component of any one of base station, transformer equipment, data switching equipment, the vehicles, outdoor lightings.
20. the product that surface according to claim 18 forms matcoveredn, which is characterized in that the electronic equipment packet
It includes: any one of handheld communication devices, electronic game station, wearable electronic and/or handheld communication devices, electronics
Any component of any one of game station, wearable electronic.
21. the product that surface according to claim 18 forms matcoveredn, which is characterized in that the wearing product includes
Clothes, shoes and hats and/or ornaments.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115386087A (en) * | 2022-10-26 | 2022-11-25 | 广东粤港澳大湾区黄埔材料研究院 | Hydrosilylation self-crosslinking self-chain-extension linear polysiloxane and preparation method thereof |
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| CN104302412A (en) * | 2012-03-06 | 2015-01-21 | 赛姆布兰特有限公司 | Coated electrical assembly |
| CN106105403A (en) * | 2013-12-10 | 2016-11-09 | 欧洲等离子公司 | Face coat |
| CN106916331A (en) * | 2010-02-23 | 2017-07-04 | 赛姆布兰特有限公司 | The polymer coating of plasma polymerization |
| WO2017125741A1 (en) * | 2016-01-22 | 2017-07-27 | Semblant Limited | Coated electrical assembly |
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| CN106916331A (en) * | 2010-02-23 | 2017-07-04 | 赛姆布兰特有限公司 | The polymer coating of plasma polymerization |
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| CN115386087B (en) * | 2022-10-26 | 2023-02-03 | 广东粤港澳大湾区黄埔材料研究院 | Hydrosilylation self-crosslinking self-chain-extension linear polysiloxane and preparation method thereof |
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