CN109545838B - Display panel and display device - Google Patents
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- CN109545838B CN109545838B CN201811562190.0A CN201811562190A CN109545838B CN 109545838 B CN109545838 B CN 109545838B CN 201811562190 A CN201811562190 A CN 201811562190A CN 109545838 B CN109545838 B CN 109545838B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/40—OLEDs integrated with touch screens
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The embodiment of the application provides a display panel and a display device, and the display panel and the display device comprise a display area and a non-display area arranged around the display area, wherein the non-display area comprises a frame sealing glue area; the display panel further comprises a touch unit and a plurality of touch leads for providing signals to the touch unit, and the touch leads are arranged in the non-display area; the touch lead comprises a first touch lead and a second touch lead, and the first touch lead is arranged between the display area and the frame sealing glue area; the second touch lead covers the frame sealing glue area. At least part of the touch lead in the touch function layer is arranged in the frame sealing glue area, so that the area of a non-display area is saved, the size of a left/right frame of the display panel is correspondingly reduced, and the OLED display panel with a narrow frame can be realized.
Description
[ technical field ] A method for producing a semiconductor device
The application relates to the technical field of display, in particular to a display panel and a display device.
[ background of the invention ]
With the vigorous development of flat panel Display technology, Organic Light Emitting Display (OLED) has been widely used due to its excellent characteristics of self-luminescence, high brightness, wide viewing angle, fast response, etc.
In recent two years, with the continuous popularization of the concept of "full screen" products, the design concept of extremely narrow frame and frameless frame has become the mainstream product design direction in the design of OLED display products. Due to the current consumer electronics field, the touch function in the OLED display product is generally integrated in the OLED display panel, that is, the touch function layer is integrated on the OLED display panel, and generally formed on the light emitting side of the OLED display panel. Because the touch control functional layer is provided with the touch control lead, the touch control chip receives and feeds back a touch control signal to the touch control functional layer through the touch control lead. Since the touch lead is generally disposed in the non-display area, how to dispose the touch lead in the OLED display panel under the concept of "full-screen" product is also an important issue in the design of current display products.
[ application contents ]
In view of this, embodiments of the present application provide a display panel and a display device, where at least a portion of touch leads in a touch functional layer is disposed in a frame sealing adhesive region, so as to save an area of a non-display region, and accordingly, a size of a left/right frame of the display panel is reduced, and an OLED display panel with a "very narrow frame" can be implemented.
In one aspect, an embodiment of the present application provides a display panel, including a display area and a non-display area disposed around the display area, where the non-display area includes a frame sealing adhesive area;
the display panel further comprises a touch unit and a plurality of touch leads for providing signals to the touch unit, and the touch leads are arranged in the non-display area;
the touch lead comprises a first touch lead and a second touch lead, and the first touch lead is arranged between the display area and the frame sealing glue area; the second touch lead covers the frame sealing glue area.
Optionally, a first distance D1 exists between any two adjacent first touch leads; a second distance D2 exists between any two adjacent second touch leads; the second pitch D2 is greater than the first pitch D1.
Optionally, the first distance D1 and the second distance D2 are 10 to 20 times the first distance D1.
Optionally, the second pitch D2 is greater than 100 μm.
Optionally, the width of the second touch lead is less than or equal to the width of the first touch lead.
Optionally, the width of the first touch lead is 3 μm to 8 μm.
Optionally, the display panel further includes a cover substrate and an array substrate which are oppositely disposed, and in the non-display area, the cover substrate and the array substrate are bonded by a frame sealing adhesive to form the frame sealing adhesive area; the frame sealing glue area is also provided with a grounding lead which is connected with zero potential or negative potential; the grounding lead covers the frame sealing rubber area;
the touch unit, the touch lead and the grounding lead are arranged on the cover plate substrate.
Optionally, the ground lead includes a plurality of first sub-ground leads, wherein the plurality of first sub-ground leads are electrically connected in parallel with each other.
Optionally, a plurality of the first sub-ground leads are arranged in a substantially parallel interval with each other; wherein any two adjacent first sub-ground leads have a third spacing D3 therebetween, wherein the third spacing D3 is substantially equal to the second spacing D2.
Optionally, a width of the first sub-ground lead is substantially equal to a width of the second touch lead.
Optionally, the first touch lead, the second touch lead, and the first sub-ground lead are patterned from the same metal layer.
Optionally, the ground lead comprises a second ground lead and a third ground lead, both of which are electrically connected in parallel; the second grounding lead is formed by patterning a first metal layer, and the third grounding lead is formed by patterning a first transparent conductive layer.
Optionally, an insulating layer is disposed between the first metal layer and the first transparent conductive layer, and the second ground lead is connected to the third ground lead through a through hole penetrating through the insulating layer; the first metal layer is arranged on one side, close to the cover plate substrate, of the insulating layer; the first transparent conducting layer is arranged on one side, away from the cover plate substrate, of the insulating layer.
Optionally, the width of the third ground lead is 10 to 35 times the width of the second ground lead.
Optionally, the third grounding lead extends from the frame sealing adhesive region to the display region.
Optionally, the second ground lead, the first touch lead and the second touch lead are formed by patterning the first metal layer.
In another aspect, an embodiment of the present application provides a display device, which includes the above display panel.
According to the display panel and the display device provided by the embodiment of the application, at least part of the touch lead in the touch function layer is arranged in the frame sealing glue area, so that the area of the non-display area is saved; meanwhile, in order to further reduce the area occupation ratio of non-display, the resistance of the grounding lead is reduced by arranging the grounding lead in the touch control function layer in the frame sealing adhesive area and connecting a plurality of grounding wires in parallel or adding transparent conductive wires such as Indium Tin Oxide (ITO) and the like. Therefore, the area between the frame sealing rubber area and the display area can be reduced, and the overall resistance of the grounding lead can be reduced.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a display panel in the related art;
FIG. 2 is a schematic cross-sectional view of the display panel of FIG. 1 taken along the line A1-A1;
fig. 3 is a schematic structural diagram of a display panel provided in an embodiment of the present application;
FIG. 4 is a schematic cross-sectional view of the display panel of FIG. 3 taken along the line B1-B1;
fig. 5 is a schematic structural diagram of another display panel provided in the embodiment of the present application;
FIG. 6 is an enlarged schematic view of the display panel of FIG. 5 within a dashed line box A;
FIG. 7 is a schematic cross-sectional view of the display panel of FIG. 5 taken along the dashed line C1-C1;
fig. 8 is a schematic structural diagram of another display panel provided in the embodiment of the present application;
FIG. 9 is an enlarged schematic view of the display panel of FIG. 8 within the dashed box B;
FIG. 10 is a schematic cross-sectional view of the display panel of FIG. 8 taken along the dashed line E1-E1;
fig. 11 is a schematic structural diagram of a display device according to an embodiment of the present application.
[ detailed description ] embodiments
For better understanding of the technical solutions of the present application, the following detailed descriptions of the embodiments of the present application are provided with reference to the accompanying drawings.
It should be understood that the embodiments described are only a few embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terminology used in the embodiments of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the examples of this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be understood that the term "and/or" as used herein is merely one type of association that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.
In the description herein, it is to be understood that the terms "substantially", "approximately", "about", "substantially", and the like, as used in the claims and the examples herein, are intended to be generally accepted as not being precise, within the scope of reasonable process operation or tolerance.
It should be understood that although the terms first, second, third, etc. may be used to describe the pixel groups in the embodiments of the present application, the touch leads should not be limited to these terms. These terms are only used to distinguish the touch leads from each other. For example, the first touch lead may be referred to as a second touch lead, and similarly, the second touch lead may also be referred to as a first touch lead without departing from the scope of the embodiments of the present application.
Through intensive and thorough research, the applicant of the present application has addressed the problems of the prior art, such as shown in fig. 1-2, wherein fig. 1 is a schematic structural diagram of a display panel in the related art; FIG. 2 is a schematic cross-sectional view of the display panel of FIG. 1 taken along the dashed line A1-A1. As shown in fig. 1 to 2, a display panel 1 in the related art includes a cover substrate 5 and an array substrate 6, which are bonded by a sealant 4, wherein the sealant 4 may be a glass sealant, and the cover substrate 5 and the array substrate 6 are bonded after being cured by laser irradiation. The cover substrate 5 is formed with a touch functional layer, which is generally disposed on the light emitting side of the display panel, and may be an independent control chip or integrated with the display control chip of the display panel. The touch function layer comprises touch units 2 and touch leads 3 correspondingly connected with each touch unit 2, and the touch leads 3 are connected with the touch units 2 and a corresponding control chip (not shown in the figure), so that the control chip can receive and feed back control signals to the touch units 2. As shown in fig. 1 and 2, the touch lead 3 is disposed in the non-display area DA of the display panel 1, and more specifically, the touch lead 3 is disposed in the empty area G between the frame sealing adhesive area F and the display area AA of the display panel 1. In order to ensure that the plurality of touch leads 3 are electrically insulated from each other, a predetermined distance between the plurality of touch leads 3 needs to be maintained. Generally, the number of the touch leads 3 is at least twenty or more, so that the width of the reserved space G is relatively large. In the related art, the touch lead 3 is entirely disposed in the margin region G and is parallel to the frame sealing adhesive region F, so as to form the non-display region DA of the display panel 1. As the requirement for the touch precision of the OLED display product is higher, the number of the corresponding touch units 2 is larger, and the number of the corresponding touch leads 3 is also increased gradually. Thus, the required width of the blank region G of the display panel 1 is increased, and the non-display region DA of the left/right frame of the display panel 1 is increased. This is in contradiction with the current design concept of "full screen" or "very narrow bezel". The applicant provides a display panel and a display device by deeply analyzing the technical problems existing at present, as shown in fig. 3 to 11, at least part of touch leads in a touch functional layer are arranged in a frame sealing adhesive region, so that the area of a non-display region is saved, the size of a left/right frame of the display panel is correspondingly reduced, and an OLED display panel with a very narrow frame can be realized.
As shown in fig. 3 to 11, an embodiment of the present application provides a display panel, including a display area and a non-display area disposed around the display area, where the non-display area includes a frame sealing adhesive area; the display panel also comprises a touch unit and a plurality of touch leads for providing signals for the touch unit, and the touch leads are arranged in the non-display area; the touch lead comprises a first touch lead and a second touch lead. The first touch lead is arranged between the display area and the frame sealing glue area; the second touch lead covers the frame sealing rubber area.
The technical solution in this application will be explained in detail below:
as shown in fig. 3 to 4, fig. 3 is a schematic structural diagram of a display panel according to an embodiment of the present disclosure; FIG. 4 is a cross-sectional illustration of the display panel of FIG. 3 taken along the dashed line B1-B1. According to the function of the display panel, the display panel 100 can be divided into a display area AA and a non-display area DA surrounding the display area AA, wherein the non-display area DA includes a frame sealing adhesive area F and a blank area G between the frame sealing adhesive area F and the display area AA. In addition, the display panel 100 includes an array substrate 16 and a cover substrate 15 that are oppositely disposed. The array substrate 16 and the cover substrate 15 may be glass substrates or polymer light-transmitting substrates, and in the non-display area DA, the two substrates are bonded by the frame sealing adhesive 14. Specifically, the frame sealing adhesive 14 may be a glass frit, and the glass frit is coated at the peripheral edge of the non-display area DA of the array substrate 16 or the cover substrate 15, and then laser irradiation is performed on the glass frit, so that the glass frit is solidified after being in a molten state, thereby implementing an adhesive function. Herein, the region where the frame sealing adhesive 14 is disposed is a frame sealing adhesive region F.
With continued reference to fig. 3 and 4, in the display area AA, a pixel driving circuit and a corresponding light emitting pixel unit are formed on the array substrate 16, and in the non-display area DA such as the left-out area G, a gate driving circuit, a light emission control circuit, and the like are formed. Each of the electric devices on the array substrate 16 may be formed by LTPS (Low Temperature Poly-Si) process, or may be formed by oxide semiconductor process to form a thin film transistor TFT and a corresponding metal signal line. The corresponding light-emitting pixel unit can be an OLED light-emitting pixel unit, and an OLED light-emitting device capable of emitting light of different colors can be formed by an evaporation process or an inkjet printing technology.
In addition, in order to implement the touch function, the display panel 100 further includes a touch function layer located in the display area AA, and the touch function layer is disposed outside the cover substrate 15, that is, on the light emitting side of the display panel 100. As shown in fig. 3 and 4, the touch function layer includes a plurality of touch units 12 and touch leads 13 for providing signals to the touch units 12. In this embodiment, the touch unit 12 may include a touch sensing electrode and a touch feedback electrode that are independent from each other, and sense whether a touch action occurs through a capacitance change between the touch sensing electrode and the touch feedback electrode. It can be understood that the touch function layer adopts a mutual capacitance touch mode. In addition, each touch sensing electrode and each touch feedback electrode correspond to at least one touch lead 13 electrically connected thereto, and transmit the touch signal on the touch sensing electrode to a touch chip (not shown in the figure). The touch chip may be independent of the display panel 100, and electrically connected to the display panel 100 through an FPC (flexible circuit board). Of course, the touch chip may be integrated in the non-display area DA of the display panel 100, and the control chip may be bent to the back of the display panel 100 by bending the non-display area DA. In addition, it should be noted that the touch chip may be two modules that are independent from the display chip of the display panel 100, or both modules may be located in the same control chip, and the control chip may implement both the display control of the display panel 100 and the touch control of the display panel 100. In addition, in the present application, the touch function layer may also adopt a self-contained touch mode.
With continued reference to fig. 3 and 4, in the present embodiment, the touch lead 13 includes a first touch lead 131 and a second touch lead 132, which are electrically connected to the corresponding touch units 12 and the touch chips respectively. The first touch lead 131 is disposed between the display area AA and the frame sealing adhesive area F; the second touch lead 132 covers the sealant region F.
Specifically, the first touch lead 131 is disposed on the cover substrate 15 (on a side away from the array substrate 16) and corresponds to the left space G of the display panel 100; the second touch lead 132 is also disposed on the cover substrate 15 and covers the frame sealing adhesive region F. It should be noted that the second touch lead 132 may completely cover the frame sealing adhesive region F, for example, when the second touch lead 132 is made of a transparent metal material, such as Indium Tin Oxide (ITO). In this application, in one implementation, the second touch lead 132 partially covers the sealant region F, wherein the second touch lead 132 may be a metal opaque material with good conductivity, such as conductivity not less than that of copper or aluminum. That is, as shown in fig. 3 and 4, a plurality of second touch leads 132 are disposed in the frame sealing adhesive region F, and a preset gap is disposed between any two adjacent second touch leads 132. It should be noted that the second touch lead 132 corresponding to each touch unit 12 may be a metal signal line; or a plurality of metal signal wires can be connected in parallel with each other at equal potentials. In the embodiment of the present application, the second touch lead 132 corresponding to each touch unit 12 is taken as a metal signal line for example. The single metal signal wire is adopted, so that good conductive performance is kept, and meanwhile, the light transmittance of the frame sealing glue in the frame sealing glue area F is ensured when the frame sealing glue is solidified through laser irradiation. The inventors of the present application found through intensive research that the width and the corresponding pitch of the second touch lead 132 need to be defined accordingly.
Specifically, as shown in fig. 4, a second distance D2, which may be greater than 100 μm, is between any two adjacent second touch leads 132. In the manufacturing process of the display panel 100, the frame sealing adhesive needs to be irradiated by laser to be cured. In order to ensure the laser transmittance of the frame sealing adhesive region F and fully melt the frame sealing adhesive such as frit, the distance between the two second touch leads 132 needs to be as large as possible. On the other hand, in order to reduce the width of the left space G as much as possible, the touch lead 13 needs to be disposed in the frame sealing adhesive region F as much as possible. Therefore, the inventors of the present application found through intensive studies that the second distance D2 is at least larger than the width D2 of the second touch lead 132.
As shown in fig. 4, in addition, in order to match the number of the touch leads in the left space G and the frame sealing adhesive region F, a reasonable number of first touch leads 131 are arranged in the left space G to reduce the width of the left space G, and meanwhile, the conductivity of the first touch leads 131 is ensured. The inventors of the present application found through intensive studies that the width and the corresponding pitch of the first touch signal lines 131 need to be defined accordingly. The first distance D1 exists between any two adjacent first touch leads 131, and the second distance D2 is greater than the first distance D1. Specifically, the second pitch D2 is 10 to 20 times the first pitch D1. Therefore, the laser light transmittance in the frame sealing glue area F can be ensured, and the frame sealing glue such as glass frit is fully melted. In addition, in consideration of reducing the width of the reserved space G as much as possible, in the embodiment of the present application, the width d1 of the first touch lead 131 is 3 μm to 8 μm, and in this line width range, the first touch lead 131 can ensure that no loss is caused by the influence of resistance in the process of transmitting the touch signal, so that the touch performance of the touch functional layer can be ensured. In addition, for simplicity and ease in process, the width d2 of the second touch lead 132 may be set to be equal to the width d1 of the first touch lead 131. That is, the first touch lead 131 and the second touch lead 132 having the same width may be simultaneously formed through the same metal layer. However, in order to further increase the laser transmittance of the frame sealing adhesive region F, the width d2 of the second touch lead 132 may be smaller than the width d1 of the first touch lead 131.
Although the narrower the width of the second touch control leads 132, the larger the distance between any two second touch control leads 132, and the higher the laser transmittance of the frame sealing adhesive region F, the curing of the frame sealing adhesive 14 can be fully ensured. However, if the width of the second touch lead 132 is too narrow, the resistance on the second touch lead 132 is too large, and thus the loss of touch signal transmission is too large, and the touch performance of the touch functional layer is greatly reduced. However, in order to ensure the conductivity of the second touch lead 132, it is necessary to ensure that the width d2 of the second touch lead 132 is greater than 1 μm.
On the basis of the above embodiments, the embodiments of the present application also disclose another display panel. Specifically, as shown in fig. 5 to 7, fig. 5 is a schematic structural diagram of another display panel provided in the embodiment of the present application; FIG. 6 is an enlarged schematic view of the display panel of FIG. 5 within a dashed line box A; FIG. 7 is a schematic cross-sectional view of the display panel of FIG. 5 taken along the dashed line C1-C1. In which like reference numerals refer to like parts throughout figures 3-4. In this embodiment, the same technical parts as those in the above embodiments are omitted for brevity. The technical points in this embodiment will be described below.
As shown in fig. 5 to 7, in order to prevent static electricity from accumulating in the display panel 100 and damage to the touch cells and/or the touch leads in the touch functional layer, in the present embodiment, the ground lead 17 is disposed on the same layer as the touch functional layer, that is, in the present embodiment, the touch cells 12, the touch leads 13, and the ground lead 17 are disposed on the cover substrate 15. A zero potential or a negative potential, such as a constant zero potential outside the display panel, is connected through the ground lead 17, thereby preventing electrostatic damage to devices in the display panel. Specifically, in the present embodiment, the grounding lead 17 is in the non-display area DA of the display panel 100, that is, as shown in fig. 5, the grounding lead 17 is disposed around the display area AA, specifically, the grounding lead 17 covers the frame sealing adhesive area F, so as to save the width of the non-display area DA.
The ground lead 17 is required to have a large line width due to its antistatic function, and generally, if the ground lead 17 is a single metal wire, the width thereof may be 30 μm to 100 μm. This is because, if the width of the ground lead 17 is too narrow, the resistance thereof becomes too large, and the prevention of the electrostatic action cannot be achieved. However, if the width of the ground lead 17 is greater than 100 μm, the ground lead 17 may have a certain reflectivity to light because the ground lead 17 is made of a metal material. It is found through research that if the width of the ground lead 17 is greater than 100 μm, a strong reflection phenomenon occurs, thereby affecting the display effect of the display panel.
There is a certain disadvantage in using a single wire as the ground lead 17. As shown in fig. 6 and 7, in the present embodiment, the ground lead 17 includes a plurality of first sub-ground leads 171, wherein the plurality of first sub-ground leads 171 are electrically connected in parallel with each other. That is, in order to prevent the sealant 14 from being irradiated by the laser in the display panel 100 due to the excessively large line width of the ground lead 17, the sealant 14, such as the frit, cannot be sufficiently melted due to the insufficient transmittance, and thus the array substrate 16 and the cover substrate 15 cannot be sufficiently bonded to each other. By providing one ground lead 17 as the first sub-ground lead 171 having a plurality of branches, the first sub-ground lead 171 has a comb-like structure as shown in fig. 6, so that there is a gap between them. Thereby ensuring the laser transmittance of the frame sealing glue area F.
Specifically, the plurality of first sub-ground leads 171 are disposed at substantially parallel intervals from each other; any two adjacent first sub-ground leads 171 have a third distance D3 therebetween. In order to achieve uniformity of laser transmission in the frame sealing adhesive region F, it is ensured that the curing degree of the frame sealing adhesive 14 is consistent. In the present embodiment, the third distance D3 may be substantially equal to the second distance D2. That is, any adjacent two first sub-ground leads 171 have a third distance D3 therebetween, which may be greater than 100 μm; alternatively, the third distance D3 is 10 to 20 times the first distance D1. Therefore, the laser light transmittance in the frame sealing glue area F can be ensured, and the frame sealing glue such as glass frit is fully melted. Meanwhile, in order to further ensure the transmittance of the laser light, the first sub-ground lead 171 has a first sub-width d3 in the present application, wherein the width of the first sub-width d3 may be the same as the width of the first touch lead 131 or the width of the second touch lead 132. Meanwhile, the same metal layer can be patterned, and the forming process is simple.
In addition, in order to further ensure the uniformity of the laser transmission in the frame sealing adhesive region F, the width of the first sub-ground lead 171 is substantially equal to the width of the second touch lead 132. That is, the first sub-ground lead 171 needs to be greater than 1 μm to secure its electrical conductivity, and also less than or equal to 3 μm to 8 μm to secure a space between the two first sub-ground leads 171.
In addition, in the present embodiment, in order to simplify the manufacturing process of the grounding lead 17, the first touch lead 131, the second touch lead 132 and the first sub-grounding lead 171 may be patterned in the same layer by using the same metal layer with higher conductivity, such as copper or aluminum. Of course, in order to further improve the antistatic capability of the grounding lead 17, the grounding lead 17 may be patterned by using a metal layer having a conductivity greater than that of the touch lead 13.
On the basis of the above embodiments, the embodiments of the present application also disclose another display panel. Specifically, as shown in fig. 8 to 10, fig. 8 is a schematic structural diagram of another display panel provided in the embodiment of the present application; FIG. 9 is an enlarged schematic view of the display panel of FIG. 8 within the dashed box B; FIG. 10 is a schematic cross-sectional view of the display panel of FIG. 8 taken along the dashed line E1-E1. In which like reference numerals refer to like parts throughout figures 3-7. In this embodiment, the same technical parts as those in the above embodiments are omitted for brevity. The technical points in this embodiment will be described below.
As shown in fig. 8 to 10, in order to prevent static electricity from accumulating in the display panel 100 and damage to the touch cells and/or the touch leads in the touch functional layer, in the present embodiment, the ground lead 17 is provided on the touch functional layer, that is, in the present embodiment, the touch cells 12, the touch leads 13, and the ground lead 17 are provided on the cover substrate 15. A zero potential or a negative potential, such as a constant zero potential outside the display panel, is connected through the ground lead 17, thereby preventing electrostatic damage to devices in the display panel. Specifically, in the present embodiment, the grounding lead 17 is in the non-display area DA of the display panel 100, that is, as shown in fig. 5, the grounding lead 17 is disposed around the display area AA, specifically, the grounding lead 17 covers the frame sealing adhesive area F, so as to save the width of the non-display area DA.
In order to further save the area occupied by the ground lead 17 in the non-display area AA, the present embodiment reduces the area of the ground lead 17 in the non-display area DA by extending a part of the ground lead 17 toward the display area AA.
Specifically, as shown in fig. 8 to 10, the ground lead 17 includes: the second ground lead 172 and the third ground lead 173 are electrically connected in parallel, thereby reducing the resistance of the ground lead 17 as a whole. Specifically, the second ground lead 172 and the third ground lead 173 are patterned from different conductive layers. The second ground lead 172 is patterned from a first metal layer, and the third ground lead 173 is patterned from a first transparent conductive layer, such as ITO. Since the ITO is a transparent conductive material, the ITO can be used as the third ground lead 173 and extends from the frame sealing adhesive region F to the display region AA without affecting the display function of the display panel. In addition, since the third ground lead 173 is made of ITO having a relatively large resistivity, in order to equalize the resistivity with the second ground lead 172, the width of the third ground lead 173 is increased in the present embodiment, so that the resistance on the ground lead 17 is reduced as a whole, thereby ensuring a good electrostatic protection capability of the ground lead 17. Specifically, in the present embodiment, the width d5 of the third ground lead 173 is 10 to 35 times the width d4 of the second ground lead 172. The width d4 of the second ground lead 172 may be the same as the width d2 of the second touch lead 132, or smaller than the width of the second touch lead 132.
In addition, as shown in fig. 10, in the present embodiment, an insulating layer 18 is disposed between the first metal layer and the first transparent conductive layer, and the second ground lead 172 is connected to the third ground lead 173 through a through hole K penetrating the insulating layer 18. Wherein, the first metal layer is disposed on one side of the insulating layer 18 close to the cover substrate 15; the first transparent conductive layer is disposed on a side of the insulating layer 18 facing away from the cover substrate 15.
As shown in fig. 11, fig. 11 is a schematic structural diagram of a display device provided in the embodiment of the present application, and the display device 1000 includes the display panel 100. The specific structure of the display panel 100 has been described in detail in the above embodiments, and is not described herein again. Of course, the display device shown in fig. 11 is only a schematic illustration, and the display device may be any electronic device with a display function, such as a mobile phone, a tablet computer, a notebook computer, an electronic book, or a television.
According to the display panel and the display device provided by the embodiment of the application, at least part of the touch lead in the touch function layer is arranged in the frame sealing glue area, so that the area of the non-display area is saved; meanwhile, in order to further reduce the area occupation ratio of non-display, the grounding wires in the touch function layer are arranged in the frame sealing adhesive area, and the resistance of the grounding wires is reduced by connecting a plurality of grounding wires in parallel or adding transparent conductive wires such as ITO (indium tin oxide) and the like. Therefore, the area between the frame sealing rubber area and the display area can be reduced, and the overall resistance of the grounding wire can be reduced.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the scope of protection of the present application.
Claims (17)
1. The display panel is characterized by comprising a display area and a non-display area arranged around the display area, wherein the non-display area comprises a frame sealing glue area;
the display panel further comprises a touch functional layer and a cover plate substrate; the touch functional layer is arranged on the outer side of the cover plate substrate;
the touch control functional layer comprises a touch control unit and a plurality of touch control lead wires for providing signals for the touch control unit, and the touch control lead wires are arranged in the non-display area;
the touch lead comprises a first touch lead and a second touch lead, and the first touch lead is arranged between the display area and the frame sealing glue area; the second touch lead covers the frame sealing glue area.
2. The display panel according to claim 1, wherein a first distance D1 is provided between any two adjacent first touch leads; a second distance D2 is reserved between any two adjacent second touch leads;
the second pitch D2 is greater than the first pitch D1.
3. The display panel according to claim 2, wherein the first distance D1 and the second distance D2 are 10 to 20 times the first distance D1.
4. The display panel according to claim 2, wherein the second distance D2 is greater than 100 μm.
5. The display panel according to claim 1, wherein the width of the second touch lead is less than or equal to the width of the first touch lead.
6. The display panel according to claim 2 or 5, wherein the width of the first touch lead is 3 μm to 8 μm.
7. The display panel according to claim 2, wherein the display panel further comprises a cover substrate and an array substrate which are arranged oppositely, and in the non-display area, the cover substrate and the array substrate are bonded by a frame sealing adhesive to form the frame sealing adhesive area;
the frame sealing glue area is also provided with a grounding lead which is connected with zero potential or negative potential; the grounding lead covers the frame sealing rubber area;
the touch unit, the touch lead and the grounding lead are arranged on the cover plate substrate.
8. The display panel according to claim 7, wherein the ground lead comprises a plurality of first sub-ground leads, wherein the plurality of first sub-ground leads are electrically connected in parallel to each other.
9. The display panel of claim 8, wherein the first sub-ground leads are spaced substantially parallel to each other;
wherein any two adjacent first sub-ground leads have a third spacing D3 therebetween, wherein the third spacing D3 is substantially equal to the second spacing D2.
10. The display panel of claim 8, wherein the width of the first sub-ground lead is substantially equal to the width of the second touch lead.
11. The display panel according to claim 8, wherein the first touch lead, the second touch lead, and the first sub-ground lead are patterned from the same metal layer.
12. The display panel according to claim 7, wherein the ground lead comprises a second ground lead and a third ground lead electrically connected in parallel;
the second grounding lead is formed by patterning a first metal layer, and the third grounding lead is formed by patterning a first transparent conductive layer.
13. The display panel according to claim 12, wherein an insulating layer is provided between the first metal layer and the first transparent conductive layer, and wherein the second ground lead is connected to the third ground lead through a through hole penetrating the insulating layer;
the first metal layer is arranged on one side, close to the cover plate substrate, of the insulating layer;
the first transparent conducting layer is arranged on one side, away from the cover plate substrate, of the insulating layer.
14. The display panel according to claim 12, wherein the width of the third ground lead is 10 to 35 times the width of the second ground lead.
15. The display panel according to claim 12, wherein the third ground lead extends from the sealant region to the display region.
16. The display panel according to any one of claims 15, wherein the second ground lead, the first touch lead, and the second touch lead are patterned from the first metal layer.
17. A display device comprising the display panel according to any one of claims 1 to 16.
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| CN110456942B (en) * | 2019-08-13 | 2022-10-14 | 昆山国显光电有限公司 | Touch display panel and touch display device |
| CN110703950B (en) * | 2019-10-10 | 2022-07-15 | 业成科技（成都）有限公司 | Touch structure and touch display device |
| CN111158197A (en) * | 2020-01-02 | 2020-05-15 | Tcl华星光电技术有限公司 | Liquid crystal display panel and preparation method thereof |
| CN110888558B (en) * | 2020-01-02 | 2024-01-02 | 业成科技（成都）有限公司 | Touch panel and touch device |
| CN111477666B (en) | 2020-04-29 | 2023-05-12 | 京东方科技集团股份有限公司 | Display panel, manufacturing method thereof and display device |
| CN111752411B (en) * | 2020-06-12 | 2021-09-24 | 惠州市华星光电技术有限公司 | Touch control display device |
| CN113157143B (en) * | 2021-05-26 | 2024-04-23 | 京东方科技集团股份有限公司 | Display panel and display device |
| CN114203039A (en) * | 2021-12-02 | 2022-03-18 | 昆山国显光电有限公司 | Display panel and display device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105739154A (en) * | 2016-04-29 | 2016-07-06 | 上海天马有机发光显示技术有限公司 | Display panel and electronic equipment |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090140987A1 (en) * | 2007-12-04 | 2009-06-04 | Kai-Ti Yang | Duplex touch panel |
| CN101833183B (en) * | 2010-05-24 | 2012-02-01 | 友达光电股份有限公司 | Liquid crystal display panel |
| TW201426468A (en) * | 2012-12-17 | 2014-07-01 | Hon Hai Prec Ind Co Ltd | Electronic device having capacitive touch screen |
| TWI514055B (en) * | 2013-05-16 | 2015-12-21 | Au Optronics Corp | Display panel and manufacturing method thereof |
| US20150022729A1 (en) * | 2013-07-22 | 2015-01-22 | Teh-Zheng Lin | Layered assembly of touch panel |
| CN104298016A (en) * | 2014-10-28 | 2015-01-21 | 合肥鑫晟光电科技有限公司 | Array substrate, preparing method of array substrate, display panel and display device |
| CN106299148B (en) * | 2015-06-10 | 2018-04-03 | 上海和辉光电有限公司 | The encapsulating structure and method for packing of display panel |
| CN106020530B (en) * | 2016-05-06 | 2019-10-01 | 上海天马微电子有限公司 | Touch display panel and touch display device |
| CN108710235A (en) * | 2018-06-26 | 2018-10-26 | 惠州市华星光电技术有限公司 | cutting method |
-
2018
- 2018-12-20 CN CN201811562190.0A patent/CN109545838B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105739154A (en) * | 2016-04-29 | 2016-07-06 | 上海天马有机发光显示技术有限公司 | Display panel and electronic equipment |
Non-Patent Citations (1)
| Title |
|---|
| 王海生.一种内嵌式触控显示液晶屏的设计与实现.《 中国科学院大学(工程管理与信息技术学院)硕士学位论文》.2016, * |
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