CN109537035B - Wafer electroplating device with horizontal conveying type single wafer - Google Patents
Wafer electroplating device with horizontal conveying type single wafer Download PDFInfo
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- CN109537035B CN109537035B CN201811601470.8A CN201811601470A CN109537035B CN 109537035 B CN109537035 B CN 109537035B CN 201811601470 A CN201811601470 A CN 201811601470A CN 109537035 B CN109537035 B CN 109537035B
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- 238000009713 electroplating Methods 0.000 title claims abstract description 48
- 238000011010 flushing procedure Methods 0.000 claims abstract description 61
- 230000005540 biological transmission Effects 0.000 claims abstract description 51
- 238000007603 infrared drying Methods 0.000 claims abstract description 14
- 238000007664 blowing Methods 0.000 claims abstract description 13
- 238000005530 etching Methods 0.000 claims abstract description 13
- 238000007599 discharging Methods 0.000 claims abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 35
- 239000007788 liquid Substances 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 12
- 239000003814 drug Substances 0.000 claims description 10
- 238000007747 plating Methods 0.000 claims description 9
- 238000009423 ventilation Methods 0.000 claims description 9
- 239000000428 dust Substances 0.000 claims description 8
- 239000008367 deionised water Substances 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 6
- 239000011324 bead Substances 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 239000000126 substance Substances 0.000 abstract description 15
- 238000012423 maintenance Methods 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 53
- 229910021641 deionized water Inorganic materials 0.000 description 5
- 239000003344 environmental pollutant Substances 0.000 description 5
- 231100000719 pollutant Toxicity 0.000 description 5
- 238000010494 dissociation reaction Methods 0.000 description 4
- 230000005593 dissociations Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 3
- 229910001431 copper ion Inorganic materials 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 2
- 239000000725 suspension Substances 0.000 description 2
- 101100493711 Caenorhabditis elegans bath-41 gene Proteins 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000861 blow drying Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a wafer electroplating device with a horizontal conveying type single wafer, which comprises a transmission mechanism, a first flushing chamber, an etching chamber, a second flushing chamber, a third flushing chamber, an electroplating chamber, a fourth flushing chamber, a fifth flushing chamber, an air blowing chamber and an infrared drying chamber; the transmission mechanism comprises a feeding transmission opening and a discharging transmission opening, the bottoms of the feeding transmission opening and the discharging transmission opening are fixedly provided with a first motor and a transmission device, the upper part of the transmission device is fixedly provided with a supporting plate, and the transmission device is in linkage with a transmission roller horizontally arranged in the middle of the supporting plate; the first flushing chamber comprises a first fixing frame, the second flushing chamber comprises a second fixing frame, and the third flushing chamber comprises a third fixing frame. According to the invention, the transmission mechanism, the first flushing chamber, the etching chamber, the second flushing chamber, the third flushing chamber, the electroplating chamber, the fourth flushing chamber, the fifth flushing chamber, the air blowing chamber and the infrared drying chamber are arranged, so that the wafer is transmitted in one direction by the transmission roller, and the equipment and maintenance cost of electroplating chemicals are effectively reduced.
Description
Technical Field
The invention relates to the field of semiconductor wet manufacturing equipment, in particular to a wafer electroplating device with a horizontal conveying type single wafer.
Background
A semiconductor refers to a material whose conductivity can be controlled, ranging from an insulator to a conductor, and is of great importance from a technological or economic point of view, and its electrical properties must be predictable and stable in order to meet the demands of mass production. For a semiconductor, defects in the material wafer are often responsible for affecting device performance.
In the current wafer electroplating device, the situation of insufficient productivity frequently occurs in use, and in this case, a plurality of machines are required to be added to meet the production of the productivity. However, the economic loss to enterprises is large, and the space of the factory buildings of the enterprises is occupied.
Disclosure of Invention
In order to overcome the technical problems, the invention aims to provide a wafer electroplating device with a horizontal conveying type single wafer, which is characterized in that a transmission mechanism, a first flushing chamber, an etching chamber, a second flushing chamber, a third flushing chamber, an electroplating chamber, a fourth flushing chamber, a fifth flushing chamber, an air blowing chamber and an infrared drying chamber are arranged, so that the wafer is driven in one direction by a transmission roller, dirt particles adhered to the surface of the wafer are primarily removed, oxidation pollutant substances on the surface are removed, chemical microetching solution with low residual concentration on the surface is removed, pollutants on the surface are completely removed, copper ion electroplating process is performed, residual electroplating chemical solution on the surface is primarily diluted and removed, residual electroplating chemical substances on the surface of the wafer are completely removed, water drops on the surface are primarily dried, and finally the wafer is transferred to a discharge conveying opening by heat conduction. Effectively reduces the equipment and maintenance cost of electroplating chemicals.
The aim of the invention can be achieved by the following technical scheme:
The wafer electroplating device comprises a transmission mechanism, a first flushing chamber, an etching chamber, a second flushing chamber, a third flushing chamber, an electroplating chamber, a fourth flushing chamber, a fifth flushing chamber, an air blowing chamber and an infrared drying chamber;
The transmission mechanism comprises a feeding transmission opening and a discharging transmission opening, wherein the bottoms of the feeding transmission opening and the discharging transmission opening are fixedly provided with a first motor and a transmission device, the upper part of the transmission device is fixedly provided with a supporting plate, and the transmission device is in linkage with a transmission roller horizontally arranged in the middle of the supporting plate;
The first flushing chamber and the third flushing chamber comprise a dissociation water tank, the second flushing chamber, the fourth flushing chamber and the fifth flushing chamber comprise a commercial water tank, the dissociation water tank and the top of the commercial water tank are fixedly provided with a first fixing frame, two ends of the middle position of the top of the first fixing frame are provided with threaded sliding grooves, a matched threaded rod is arranged between the threaded sliding grooves, and the top of the threaded rod is fixedly connected with an output shaft of a second motor;
The etching chamber comprises a liquid medicine box, a second fixing frame is fixedly arranged above the liquid medicine box, a chute plate is fixedly arranged at the top of the second fixing frame, a limiting plate is fixedly arranged in the middle of the chute plate, first air pumps are fixedly arranged at two ends in the chute plate, a first telescopic rod is fixedly connected with the output end of each first air pump, and a sliding block is fixedly connected with each first telescopic rod;
The electroplating chamber comprises a tank body, an anode plate is fixedly arranged above the tank body, an inner sealing ring is fixedly arranged between the anode plate and the tank body, an electroplating water tank is fixedly arranged at the top of the anode plate, and an outer sealing ring is fixedly arranged at one side of the electroplating water tank;
the air blowing chamber comprises a third fixing frame, air knife bases are fixedly arranged at the top and the bottom of the third fixing frame, air knife edges are fixedly arranged between the air knife bases, and a first air baffle and a second air baffle are respectively and fixedly arranged at two sides of the top of each air knife edge;
the infrared drying chamber comprises a fourth fixing frame, a plurality of through holes are formed in the surfaces of two sides of the fourth fixing frame in a penetrating mode, a limiting spring is fixedly arranged on one side of the fourth fixing frame, an elastic button is fixedly installed on the limiting spring, heating lamp tubes are fixedly connected between the elastic buttons, a hanging rail is fixedly arranged at the top of the fourth fixing frame, and a blower through pipe is slidably arranged at the bottom of the hanging rail;
The first fixing frame, the second fixing frame, the third fixing frame and the fourth fixing frame are fixedly connected through connecting rods.
Further, the second motor top is provided with the shield, shield bottom both ends fixedly connected with runs through the jib of screw thread spout, jib bottom is fixedly provided with first nozzle fixing base, first nozzle fixing base side is fixedly provided with first nozzle.
Further, the slider bottom runs through the slipway board fixedly connected with second air pump, second telescopic link is connected to second air pump bottom output, second telescopic link bottom one side is fixed to be provided with the brush, brush one side is provided with the second nozzle fixing base, second nozzle fixing base bottom side is provided with the second nozzle, pipeline spiral gyration between second nozzle and the liquid medicine case is connected.
Further, the through holes at the top of the air knife base are connected to the two ends of the first wind shield and the two ends of the second wind shield through wind shield fixing rods, and limit bolts are rotatably arranged at the two ends of the wind shield fixing rods.
Further, the air blower is fixedly arranged at the bottom of the air blower through pipe, rotating beads are fixedly arranged at two sides of the bottom of the air blower, a ventilating plate is rotatably arranged between the rotating beads, and a plurality of ventilation holes are fixedly formed in the surface of the ventilating plate.
Further, the electroplating liquid is fixedly placed in the electroplating water tank.
The invention has the beneficial effects that:
(1) According to the wafer electroplating device with the horizontal conveying type single wafer, a transmission mechanism, a first flushing chamber, an etching chamber, a second flushing chamber, a third flushing chamber, an electroplating chamber, a fourth flushing chamber, a fifth flushing chamber, an air blowing chamber and an infrared drying chamber are arranged, so that the wafer is driven in one direction by a transmission roller, oxidation pollutant on the surface is removed from the primarily removed wafer surface, chemical microetching solution with low residual concentration on the surface is removed, pollutants on the surface are completely removed, electroplating copper ions are completely removed, the electroplating chemical solution with residual on the surface is primarily diluted and removed, residual electroplating chemical substances on the surface of the wafer are completely removed, the wafer is primarily dried by heat conduction, and finally the wafer is transferred to a discharge conveying opening. Effectively reduces the equipment and maintenance cost of electroplating chemicals.
(2) Through setting up the second motor, second motor output shaft rotates and drives the threaded rod and rotate in the screw thread spout, drives the shield round trip movement. The dust cover drives the suspender to move, and the suspender drives the first nozzle fixing seat to move, so that the wafer is washed by deionized water or municipal water more fully, and the whole process is electroplated more fully.
(3) Through the air blowing chamber, the limit bolt can be rotated according to the required air quantity, the wind shield fixing rod is moved, the distance between the first wind shield and the second wind shield is pushed, the wind force of the wind knife edge can be adjusted, and the wind speed can be controlled.
(4) By arranging the infrared drying chamber, the elastic button can be highly pressed as required, and the vertical height of the heating lamp tube can be moved. And then the elastic button is released, and the elastic button is clamped in the through hole to fix the column heating lamp tube. The heating lamp tube radiates heat to the wafer to dry the wafer. And meanwhile, the air blower blows hot air generated by the heating lamp tube through the bottom vent hole to conduct heat to the wafer so as to fully dry the wafer.
Drawings
The invention is further described below with reference to the accompanying drawings.
FIG. 1 is a schematic view of a wafer electroplating apparatus with horizontal conveyance of single wafers according to the present invention.
Fig. 2 is a schematic structural view of the transmission mechanism of the present invention.
Fig. 3 is a schematic view of the connection structure of the threaded chute and the threaded rod of the present invention.
Fig. 4 is a schematic view of the first flushing chamber structure of the present invention.
FIG. 5 is a schematic view of the etching chamber structure and the plating chamber structure of the present invention.
FIG. 6 is a schematic view of the structure of the plating chamber of the present invention.
Fig. 7 is a schematic view of the structure of the blower chamber of the present invention.
Fig. 8 is a schematic diagram of the air knife base and air knife edge connection structure of the invention.
Fig. 9 is a schematic view of the structure of the infrared drying chamber of the present invention.
Fig. 10 is a side cross-sectional view of a ventilation board of the present invention.
In the figure: 1. a transmission mechanism; 2. a first flushing chamber; 3. an etching chamber; 4. a second flushing chamber; 5. a third flushing chamber; 6. an electroplating chamber; 7. a fourth flushing chamber; 8. a fifth flushing chamber; 9. an air blowing chamber; 10. an infrared drying chamber; 11. a feed transfer opening; 12. a discharge transfer opening; 13. a first motor; 14. a transmission device; 15. a support plate; 16. a driving roller; 17. removing the water tank; 18. a utility water tank; 19. a first fixing frame; 20. a threaded chute; 21. a threaded rod; 22. a second motor; 23. a dust cover; 24. a boom; 25. a first nozzle holder; 26. a first nozzle; 27. a liquid medicine tank; 28. the second fixing frame; 29. a chute plate; 291. a limiting plate; 30. a first air pump; 31. a first telescopic rod; 32. a slide block; 33. a second air pump; 34. a second telescopic rod; 35. a brush; 36. the second nozzle fixing seat; 37. a second nozzle; 38. a tank body; 39. an anode plate; 40. an inner seal ring; 41. a plating water tank; 42. an outer seal ring; 43. a third fixing frame; 44. an air knife base; 45. an air knife edge; 46. a first wind deflector; 47. a second wind deflector; 48. a wind deflector fixing rod; 49. a limit bolt; 50. a fourth fixing frame; 51. perforating; 52. a limit spring; 53. an elastic button; 54. heating the lamp tube; 55. a hanger rail; 56. a blower tube; 57. a blower; 58. rotating the beads; 59. a ventilation board; 60. a vent hole; 61. and (5) connecting a rod.
Detailed Description
The technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-10, the invention is a wafer electroplating device with horizontal conveying of single wafer, comprising a transmission mechanism 1, a first flushing chamber 2, an etching chamber 3, a second flushing chamber 4, a third flushing chamber 5, an electroplating chamber 6, a fourth flushing chamber 7, a fifth flushing chamber 8, a blowing chamber 9 and an infrared drying chamber 10;
the transmission mechanism 1 comprises a feeding transmission opening 11 and a discharging transmission opening 12, wherein the bottoms of the feeding transmission opening 11 and the discharging transmission opening 12 are fixedly provided with a first motor 13 and a transmission device 14, the upper part of the transmission device 14 is fixedly provided with a supporting plate 15, and the transmission device 14 is in linkage with a transmission roller 16 horizontally arranged in the middle of the supporting plate 15;
The first flushing chamber 2 and the third flushing chamber 5 comprise a dissociation water tank 17, the second flushing chamber 4, the fourth flushing chamber 7 and the fifth flushing chamber 8 comprise a water tank 18, a first fixing frame 19 is fixedly arranged at the tops of the dissociation water tank 17 and the water tank 18, threaded sliding grooves 20 are formed in two ends of the middle position of the top of the first fixing frame 19, a matched threaded rod 21 is arranged between the threaded sliding grooves 20, and the top of the threaded rod 21 is fixedly connected with an output shaft of a second motor 22;
The etching chamber 3 comprises a liquid medicine box 27, a second fixing frame 28 is fixedly arranged above the liquid medicine box 27, a sliding groove plate 29 is fixedly arranged at the top of the second fixing frame 28, a limiting plate 291 is fixedly arranged in the middle of the sliding groove plate 29, first air pumps 30 are fixedly arranged at two ends in the sliding groove plate 29, the output ends of the first air pumps 30 are fixedly connected with first telescopic rods 31, and the first telescopic rods 31 are fixedly connected with sliding blocks 32;
The electroplating chamber 6 comprises a tank body 38, an anode plate 39 is fixedly arranged above the tank body 38, an inner sealing ring 40 is fixedly arranged between the anode plate 39 and the tank body 38, an electroplating water tank 41 is fixedly arranged at the top of the anode plate 39, and an outer sealing ring 42 is fixedly arranged at one side of the electroplating water tank 41;
The air blowing chamber 9 comprises a third fixing frame 43, wherein air knife bases 44 are fixedly arranged at the top and the bottom of the third fixing frame 43, air knife edges 45 are fixedly arranged between the air knife bases 44, and a first air baffle 46 and a second air baffle 47 are respectively and fixedly arranged at two sides of the top of the air knife edges 45;
The infrared drying chamber 10 comprises a fourth fixing frame 50, a plurality of through holes 51 are formed in the surfaces of the two sides of the fourth fixing frame 50 in a penetrating manner, a limiting spring 52 is fixedly arranged on one side of the fourth fixing frame 50, an elastic button 53 is fixedly arranged on the limiting spring 52, heating lamp tubes 54 are fixedly connected between the elastic buttons 53, a hanging rail 55 is fixedly arranged at the top of the fourth fixing frame 50, and a blower through pipe 56 is slidably arranged at the bottom of the hanging rail 55;
the first fixing frame 17, the second fixing frame 28, the third fixing frame 43, the fourth fixing frame 50 and the electroplating water tank 41 are fixedly connected through a connecting rod 61.
Specifically, the top of the second motor 22 is provided with a dust cover 23, two ends of the bottom of the dust cover 23 are fixedly connected with a suspension rod 24 penetrating through the threaded chute 20, a first nozzle fixing seat 25 is fixedly arranged at the bottom of the suspension rod 24, and a first nozzle 26 is fixedly arranged on the side face of the first nozzle fixing seat 25. The bottom of the sliding block 32 penetrates through the sliding groove plate 29 and is fixedly connected with a second air pump 33, the output end of the bottom of the second air pump 33 is connected with a second telescopic rod 34, a hairbrush 35 is fixedly arranged on one side of the bottom of the second telescopic rod 34, a second nozzle fixing seat 36 is arranged on one side of the hairbrush 35, a second nozzle 37 is arranged on the side face of the bottom of the second nozzle fixing seat 36, and a pipeline between the second nozzle 37 and the liquid medicine tank 27 is spirally and rotatably connected. Both ends of the first wind deflector 46 and the second wind deflector 47 are connected to a through hole at the top of the wind knife base 44 through wind deflector fixing rods 48, and limit bolts 49 are rotatably arranged at both ends of the wind deflector fixing rods 48. The fixed air-blower 57 that is provided with in air-blower siphunculus 56 bottom, the fixed rotation pearl 58 that is provided with in air-blower 57 bottom both sides, rotation is provided with ventilation board 59 between the rotation pearl 58, and ventilation board 59 surface fixing is provided with a plurality of ventilation holes 60. The plating bath 41 is fixedly filled with a plating solution.
Referring to fig. 1 to 10, the wafer electroplating apparatus of the present embodiment is designed to operate as follows:
1) The wafer to be electroplated is placed on the feeding and conveying opening 11, and the first motor 13 drives the transmission device 14 to drive the transmission roller 16 to horizontally transmit. The driving roller 16 conveys the wafer to the first rinsing chamber 2. The output shaft of the second motor 22 rotates to drive the threaded rod 21 to rotate in the threaded chute 20 and drive the dust cover 23 to move back and forth. The dust cover 23 drives the hanging rod 24 to move, the hanging rod 24 drives the first nozzle fixing seat 25 to move, the first nozzle 26 pumps the deionized water in the deionized water tank 17, the deionized water is discharged to the wafer, and dirt particles adhered to the surface of the wafer are primarily removed.
2) The driving roller 16 continues to convey the wafer to the etching chamber 3, and the first air pump 30 moves back and forth through the first telescopic rod 31 at the output end, and the first telescopic rod 31 drives the sliding block 32 to move back and forth between the chute plates 29. The sliding block 32 drives the second air pump 33, the output end at the bottom of the second air pump 33 pushes the second telescopic rod 34 to move, and the hairbrush 35 at the bottom wipes the wafer. And the second nozzle 37 extracts the chemical liquid in the chemical liquid tank 27 through the pipeline to remove the oxidation pollutant on the surface of the wafer.
3) The driving roller 16 continues to convey the wafer to the second rinse chamber 4, and the first nozzle 26 pumps the water in the water tank 18 to remove the residual low-concentration chemical microetching solution on the wafer surface. The driving roller 16 continues to convey the wafer to the third rinsing chamber 5, and the first nozzle 26 pumps deionized water through the pipe to completely remove contaminants on the surface of the wafer.
4) The wafer is transferred to the plating chamber 6 and the anode plate 39 performs a copper ion plating process on the wafer. After the electroplating is finished, the wafer is transferred to the fourth flushing chamber 7, and a large amount of water is sprayed from the first nozzle 26 to impact the surface of the wafer, so that the residual electroplating chemical solution on the surface is preliminarily diluted and removed. And then the wafer is transmitted to a fifth flushing chamber 8, the first nozzle 26 sprays the city water, and the residual electroplating chemical substances on the surface of the wafer are completely removed.
5) The wafer is conveyed to the blowing chamber 9 again, the limiting bolt 49 is rotated according to the required air quantity, the wind shield fixing rod 48 is moved, the distance between the first wind shield 46 and the second wind shield 47 is pushed, and the air knife edge 45 performs preliminary blow-drying on water drops on the surface of the wafer. The wafer is then transferred to the infrared drying chamber 10, and the elastic button 53 is pressed at a desired height to move the vertical height of the heating lamp 54. And then the elastic button 53 is released, and the elastic button 53 is clamped in the through hole 51 to fix the column heating lamp tube 54. The heating lamp 54 irradiates the wafer with heat to dry it. And the blower 57 blows the hot air generated by the heating lamps 54 through the bottom vent holes 60 to thermally conduct heat to the wafer so that it is sufficiently dried. The final drive roller 16 transfers the wafer to the outfeed transfer opening 12.
In the description of the present specification, the descriptions of the terms "one embodiment," "example," "specific example," and the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing is merely illustrative and explanatory of the invention, as various modifications and additions may be made to the particular embodiments described, or in a similar manner, by those skilled in the art, without departing from the scope of the invention or exceeding the scope of the invention as defined in the claims.
Claims (4)
1. The wafer electroplating device with the horizontal conveying type single wafer is characterized by comprising a transmission mechanism (1), a first flushing chamber (2), an etching chamber (3), a second flushing chamber (4), a third flushing chamber (5), an electroplating chamber (6), a fourth flushing chamber (7), a fifth flushing chamber (8), a blowing chamber (9) and an infrared drying chamber (10);
The transmission mechanism (1) comprises a feeding transmission opening (11) and a discharging transmission opening (12), wherein a first motor (13) and a transmission device (14) are fixedly arranged at the bottoms of the feeding transmission opening (11) and the discharging transmission opening (12), a supporting plate (15) is fixedly arranged at the upper part of the transmission device (14), and the transmission device (14) is in linkage with a transmission roller (16) horizontally arranged in the middle of the supporting plate (15);
the first flushing chamber (2) and the third flushing chamber (5) comprise a de-ionized water tank (17), the second flushing chamber (4), the fourth flushing chamber (7) and the fifth flushing chamber (8) comprise a commercial water tank (18), first fixing frames (19) are fixedly arranged at the tops of the de-ionized water tank (17) and the commercial water tank (18), threaded sliding grooves (20) are formed in two ends of the middle position of the top of each first fixing frame (19), matched threaded rods (21) are arranged between the threaded sliding grooves (20), and output shafts of second motors (22) are fixedly connected to the tops of the threaded rods (21);
The etching chamber (3) comprises a liquid medicine box (27), a second fixing frame (28) is fixedly arranged above the liquid medicine box (27), a sliding groove plate (29) is fixedly arranged at the top of the second fixing frame (28), a limiting plate (291) is fixedly arranged in the middle of the sliding groove plate (29), first air pumps (30) are fixedly arranged at the two ends in the sliding groove plate (29), a first telescopic rod (31) is fixedly connected with the output end of each first air pump (30), and a sliding block (32) is fixedly connected with each first telescopic rod (31);
The electroplating chamber (6) comprises a tank body (38), an anode plate (39) is fixedly arranged above the tank body (38), an inner sealing ring (40) is fixedly arranged between the anode plate (39) and the tank body (38), an electroplating water tank (41) is fixedly arranged at the top of the anode plate (39), and an outer sealing ring (42) is fixedly arranged at one side of the electroplating water tank (41);
The air blowing chamber (9) comprises a third fixing frame (43), air knife bases (44) are fixedly arranged at the top and the bottom of the third fixing frame (43), air knife edges (45) are fixedly arranged between the air knife bases (44), and a first air baffle (46) and a second air baffle (47) are respectively fixedly arranged at two sides of the top of the air knife edges (45);
the infrared drying chamber (10) comprises a fourth fixing frame (50), a plurality of through holes (51) are formed in the surfaces of two sides of the fourth fixing frame (50) in a penetrating mode, a limiting spring (52) is fixedly arranged on one side of the fourth fixing frame (50), an elastic button (53) is fixedly installed on the limiting spring (52), heating lamp tubes (54) are fixedly connected between the elastic buttons (53), a hanging rail (55) is fixedly arranged at the top of the fourth fixing frame (50), and a blower through pipe (56) is slidably arranged at the bottom of the hanging rail (55);
a dust cover (23) is arranged at the top of the second motor (22), hanging rods (24) penetrating through the threaded sliding grooves (20) are fixedly connected to two ends of the bottom of the dust cover (23), a first nozzle fixing seat (25) is fixedly arranged at the bottom of the hanging rods (24), and a first nozzle (26) is fixedly arranged on the side face of the first nozzle fixing seat (25);
The bottom of the sliding block (32) penetrates through the chute plate (29) and is fixedly connected with a second air pump (33), the output end of the bottom of the second air pump (33) is connected with a second telescopic rod (34), a hairbrush (35) is fixedly arranged on one side of the bottom of the second telescopic rod (34), a second nozzle fixing seat (36) is arranged on one side of the hairbrush (35), a second nozzle (37) is arranged on the side surface of the bottom of the second nozzle fixing seat (36), and a pipeline between the second nozzle (37) and the liquid medicine box (27) is spirally and rotatably connected;
The first fixing frame (19), the second fixing frame (28), the third fixing frame (43), the fourth fixing frame (50) and the electroplating water tank (41) are fixedly connected through a connecting rod (61), the first nozzle (26) and the second nozzle (37) are arranged on the same horizontal line, and the bottoms of the first fixing frame (19), the second fixing frame (28), the third fixing frame (43), the fourth fixing frame (50) and the electroplating water tank (41) are fixedly arranged at the top of the supporting plate (15).
2. The wafer electroplating device according to claim 1, wherein two ends of the first wind deflector (46) and the second wind deflector (47) are connected to a through hole at the top of the air knife base (44) through wind deflector fixing rods (48), and limit bolts (49) are rotatably arranged at two ends of the wind deflector fixing rods (48).
3. The wafer electroplating device of claim 1, wherein a blower (57) is fixedly arranged at the bottom of the blower through pipe (56), rotating beads (58) are fixedly arranged at two sides of the bottom of the blower (57), a ventilation plate (59) is rotatably arranged between the rotating beads (58), and a plurality of ventilation holes (60) are fixedly arranged on the surface of the ventilation plate (59).
4. The wafer plating apparatus of claim 1, wherein a plating solution is fixedly placed in the plating bath (41).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811601470.8A CN109537035B (en) | 2018-12-26 | 2018-12-26 | Wafer electroplating device with horizontal conveying type single wafer |
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| CN201811601470.8A CN109537035B (en) | 2018-12-26 | 2018-12-26 | Wafer electroplating device with horizontal conveying type single wafer |
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| CN109537035A CN109537035A (en) | 2019-03-29 |
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| CN209352989U (en) * | 2018-12-26 | 2019-09-06 | 安徽宏实自动化装备有限公司 | The Wafer electroplating device of piece leaf horizontal feed formula |
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| US6294060B1 (en) * | 1999-10-21 | 2001-09-25 | Ati Properties, Inc. | Conveyorized electroplating device |
| TWI342346B (en) * | 2006-06-15 | 2011-05-21 | Horizontal electroplating and electro-deposition method on a substrate | |
| TWI629116B (en) * | 2016-06-28 | 2018-07-11 | 荏原製作所股份有限公司 | Cleaning apparatus, plating apparatus using the same, and cleaning method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN209352989U (en) * | 2018-12-26 | 2019-09-06 | 安徽宏实自动化装备有限公司 | The Wafer electroplating device of piece leaf horizontal feed formula |
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