CN109270683A - Imaging modules and electronic device - Google Patents
Imaging modules and electronic device Download PDFInfo
- Publication number
- CN109270683A CN109270683A CN201811421644.2A CN201811421644A CN109270683A CN 109270683 A CN109270683 A CN 109270683A CN 201811421644 A CN201811421644 A CN 201811421644A CN 109270683 A CN109270683 A CN 109270683A
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- Prior art keywords
- imaging modules
- adjustable lens
- lens
- substrate
- ontology
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0875—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more refracting elements
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B13/00—Viewfinders; Focusing aids for cameras; Means for focusing for cameras; Autofocus systems for cameras
- G03B13/32—Means for focusing
- G03B13/34—Power focusing
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- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Studio Devices (AREA)
Abstract
The electronic device and imaging modules of the application includes chip assembly, lens subassembly, adjustable lens assemblies and connection line.Chip assembly includes substrate and the Image Sensor being disposed on the substrate.Lens subassembly is arranged on chip assembly.Adjustable lens assemblies are contained in lens subassembly, Image Sensor is used to receive the light across adjustable lens assemblies and lens subassembly, adjustable lens assemblies include piezoelectric actuator and adjustable lens, and piezoelectric actuator is for deformation occurs to change the curvature of the refractive surface of adjustable lens for driving adjustable lens under the action of electrical signals.Connection line is arranged on lens subassembly and is electrically connected adjustable lens assemblies and substrate.The imaging modules and electronic device of the application embodiment are by the curvature of the refractive surface of change adjustable lens to realize focus operation, the movement of opposite chip component is not had to since adjustable lens only need deformation, so as to omit the additional driving device such as voice coil motor, in this way, advantageously reducing the volume of imaging modules.
Description
Technical field
This application involves imaging device technical fields, more specifically, are related to a kind of imaging modules and electronic device.
Background technique
Mobile lens mould group is all made of voice coil motor driving lens movement, to carry out scene focusing, voice coil motor at present
In the presence of the volume for considerably increasing lens module, hinder lens module do it is small do it is thin, meanwhile, voice coil motor passes through magneticaction
Drive lens are mobile to complete to focus, and the peripheral magnetic field that other electronic components generate can interfere the normal work of voice coil motor.
Summary of the invention
The application embodiment provides a kind of imaging modules and electronic device.
The imaging modules of the application embodiment include chip assembly, lens subassembly, adjustable lens assemblies and connection line；
The chip assembly includes the Image Sensor of substrate and setting on the substrate.The lens subassembly is arranged in the chip
On component；The adjustable lens assemblies are contained in the lens subassembly, the Image Sensor for receive across it is described can
Adjust the light of lens subassembly and the lens subassembly, the adjustable lens assemblies include piezoelectric actuator and adjustable lens, described
Deformation occurs for driving the adjustable lens under the action of electrical signals to change the folding of the adjustable lens for piezoelectric actuator
The curvature of reflective surface；The connection line is arranged on the lens subassembly and is electrically connected adjustable lens assemblies and described
Substrate.
The electronic device of the application embodiment includes shell and the imaging modules, and the imaging modules are arranged described
On shell.
The imaging modules and electronic device of the application embodiment by the way that adjustable lens assemblies are arranged in lens subassembly, and
It is electrically connected substrate and piezoelectric actuator by connection line, connection line can convey change and be applied on piezoelectric actuator
Electric signal is to change the curvature of the refractive surface of adjustable lens, to realize the focus function of imaging modules.Imaging modules are right
Jiao Shi, deformation occurs the surfaces of adjustable lens can be completed focusing, and adjustable lens assemblies only can deformation occurs without opposite core
Piece component moves, so as to omit the additional driving device such as voice coil motor, to reduce the volume of imaging modules.In addition,
Since the deformation of adjustable lens is to be generated by electric signal driving piezoelectric actuator without being affected by magnetic fields, thus mould is imaged
Group not will receive the influence in the peripheral magnetic field that other extraneous electronic components generate at work, so that imaging modules is anti-interference
Ability is stronger；Further, piezoelectric actuator will not generate hysteresis under the action of electrical signals, so that adjustable lens are in electricity
The fast speed that deformation occurs under signal function is can rapidly realize focusing.
The additional aspect and advantage of presently filed embodiment will be set forth in part in the description, partially will be from following
Description in become obvious, or recognized by the practice of presently filed embodiment.
Detailed description of the invention
The above-mentioned and/or additional aspect and advantage of the application is from combining in description of the following accompanying drawings to embodiment by change
It obtains obviously and is readily appreciated that, in which:
Fig. 1 is the schematic perspective view of the imaging modules of the application embodiment.
Fig. 2 is the perspective exploded view of the imaging modules of the application embodiment.
Fig. 3 is diagrammatic cross-section of the imaging modules in Fig. 1 along III-III line.
Fig. 4 is the schematic perspective view of the adjustable lens assemblies of the imaging modules of the application embodiment.
Fig. 5 is the perspective exploded view of the adjustable lens assemblies of the imaging modules of the application embodiment.
The diagrammatic cross-section of adjustable lens assemblies in Fig. 6 Fig. 4 along line VI -- VI.
Fig. 7 is the schematic perspective view of the electronic device of the application embodiment.
Fig. 8 is the schematic perspective view of another state of the electronic device of the application embodiment.
Specific embodiment
Presently filed embodiment is described further below in conjunction with attached drawing.Same or similar label is from beginning in attached drawing
To the same or similar element of expression or element with the same or similar functions eventually.
In addition, the presently filed embodiment described with reference to the accompanying drawing is exemplary, it is only used for explaining the application's
Embodiment, and should not be understood as the limitation to the application.
Fig. 1 and Fig. 2 is please referred to, the application embodiment provides a kind of imaging modules 100.Imaging modules 100 can be according to
By the visual light imaging mould group (including color image imaging modules and black white image imaging modules) of visual light imaging, it is also possible to
By the infrared imaging mould group of infrared imaging.Imaging modules 100 include chip assembly 10, lens subassembly 30, adjustable lens group
Part 40 and connection line 50.Chip assembly 10 includes the Image Sensor 12 of substrate 11 and setting on the substrate 11.Lens subassembly
30 are arranged on chip assembly 10.Adjustable lens assemblies 40 are contained in lens subassembly 30, and Image Sensor 12 is worn for receiving
Cross the light of adjustable lens assemblies 40 and lens subassembly 30.Incorporated by reference to Fig. 3, adjustable lens assemblies 40 include piezoelectric actuator 43 and
Adjustable lens 45, piezoelectric actuator 43 is for that deformation occurs to be adjustable to change for driving adjustable lens 45 under the action of electrical signals
The curvature of the refractive surface 450 of mirror 45.Connection line 50 is arranged on lens subassembly 30 and is electrically connected adjustable lens assemblies 40
And substrate 11.
Specifically, the refractive surface 450 of adjustable lens 45 is the surface that light passes through adjustable lens 45, when light is by rolling over
When reflective surface 450, light can be reflected.When piezoelectric actuator 43 is applied with electric signal, piezoelectric actuator 43 can become
Shape simultaneously drives adjustable lens 45 to deform, the refractive surface 450 that can make adjustable lens 45 and adjustable lens 45 deform
Curvature changes.The curvature of refractive surface 450 is related to the intensity for the electric signal that piezoelectric actuator 43 is subject to, for example, applying
Voltage on piezoelectric actuator 43 is bigger, and the curvature of refractive surface 450 is bigger.Connection line 50 is electrically connected adjustable lens group
Circuit on part 40 and substrate 11, the circuit are used to provide electric signal to adjustable lens assemblies 40.When the refraction of adjustable lens 45
When the curvature on surface 450 changes, the focal length of imaging modules 100 is also changed correspondingly, and the curvature and pressure of refractive surface 450
The intensity for the electric signal that electric actuator 43 is subject to is related, thus by changing the electric signal size being applied on piezoelectric actuator 43
The curvature of the refractive surface 450 of adjustable lens 45 can be changed to change the focal length of imaging modules 100.
Movement of the imaging modules 100 of present embodiment due to not needing to drive entire adjustable lens 45 or lens subassembly 30
Change focal length, thus using imaging modules 100 compared to using for voice coil motor focusing having the following beneficial effects: (1)
Power consumption of the adjustable lens assemblies 40 when changing focal length is lower, such as the focal length of change adjustable lens assemblies 40 can only need 5
The power consumption of milliwatt or so；(2) adjustable lens assemblies 40 will not be different because of the placement direction of imaging modules 100, and cause driving saturating
It will not be affected by gravity when the mobile discrepant problem of complexity of mirror assembly 30, i.e. change focal length；(3) adjustable lens
45 and lens subassembly 30 do not need to move, would not also shift when moving because of adjustable lens 45 and lens subassembly 30, and
Lead to the problem that optical axis is unstable；(4) test and timing are being carried out to adjustable lens assemblies 40, it is only necessary to adjustable to one
Mirror 45 is tested and is corrected, and does not need that multiple eyeglasses 32 on lens subassembly 30 are tested and corrected, and is reduced and is surveyed
The cost of examination and correction；(5) adjustable lens 45 will not generate hysteresis under the action of electrical signals；(6) adjustable lens assemblies
40 are directly installed in lens subassembly 30 without encapsulation, it is thus possible to omit encapsulating material and be conducive to imaging modules
100 miniaturization.
When needing to adjust the focal length of imaging modules 100, according to the size for the focal length for needing to adjust, to piezoelectric actuator 43
Apply the electric signal of corresponding size, so that piezoelectric actuator 43 generates corresponding deformation, the deformation of piezoelectric actuator 43 causes can
Effect of the lens 45 by external force is adjusted, adjustable lens 45 generate corresponding deformation, and are finally reached the purpose focused.It can be with
Understand, due to not needing traditional mechanical structure and being driven during entirely focusing, 40 work of adjustable lens assemblies
Noise will not be generated when making, and it is shorter, it can be achieved that rapid focus to focus the required time.
In addition, during realizing zoom using adjustable lens assemblies 40, adjustable lens 45 and Image Sensor 12 it
Between distance will not change, the field range of imaging modules 100 will not change, can be fast in conjunction with adjustable lens assemblies 40
The characteristic of speed focusing can shoot to obtain the image of multiple different object space focal planes in a short time.Multiple images are closed
At all objects clearly image can be obtained in field range；Or it can be selected to need to be imaged in multiple images
Clearly face or depth bounds, then carry out it is background blurring, it is background blurring to be realized using single imaging modules 100.
The imaging modules 100 of the application embodiment are led to by the way that adjustable lens assemblies 40 are arranged in lens subassembly 30
Cross connection line 50 and be electrically connected substrate 11 and piezoelectric actuator 43, connection line 50 can convey change be applied to it is piezoelectric actuated
Electric signal on device 43 is to change the curvature of the refractive surface 450 of adjustable lens 45, to realize the focusing function of imaging modules 100
Energy.For imaging modules 100 in focusing, deformation occurs the surfaces of adjustable lens 45 can be completed focusing, and adjustable lens assemblies 40
Can deformation occurs moves without opposite chip component 10, so as to omit the additional driving device such as voice coil motor, with
Reduce the volume of imaging modules 100.Further, since the deformation of adjustable lens 45 is generated by electric signal driving piezoelectric actuator 43
Without being affected by magnetic fields, thus imaging modules 100 not will receive what other extraneous electronic components generated at work
The influence in peripheral magnetic field, so that the anti-interference ability of imaging modules 100 is stronger；Further, piezoelectric actuator 43 is in electric signal
Under the action of will not generate hysteresis, thus adjustable lens 45 under electric signal effect the fast speed that deformation occurs with can
Rapidly realize focusing.
Fig. 1 and Fig. 2 are please referred to, the imaging modules 100 of the application embodiment can be used for mobile phone, tablet computer, notebook
Computer, game machine, Intelligent bracelet, head show the electronic equipments such as equipment, unmanned plane.Imaging modules 100 include chip assembly 10, bracket
Component 20, lens subassembly 30, adjustable lens assemblies 40, connection line 50 and Protective film 60.
Referring to Fig. 2, chip assembly 10 includes substrate 11 and Image Sensor 12.Substrate 11 can be printed circuit board,
Flexible circuit board or rigid-flexible circuit board.It may also be formed with circuit on substrate 11, connection terminal 13 be provided on the circuit,
Connection terminal 13 can be connect by connection line 50 with adjustable lens assemblies 40, to provide telecommunications for adjustable lens assemblies 40
Number.In present embodiment, the quantity of connection terminal 13 is two, and two connection terminals 13 are located at the same side of substrate 11 and lean on
The corner location of nearly substrate 11.It is appreciated that the electronic components such as transistor, resistance, capacitor also can be set on substrate 11.
Image Sensor 12 is fixed on the substrate 11, and Image Sensor 12 is located at the same of substrate 11 with connection terminal 13
Side.Image Sensor 12 is used to sense the extraneous light for entering imaging modules 100 and converts optical signals to electric signal to be formed
Image.Image Sensor 12 can be charge coupled cell (Charge-coupled Device, CCD) or complementary metal oxidation
Object semiconductor (Complementary Metal Oxide Semiconductor, CMOS) image sensor.Chip assembly 10 can
With the mainboard for imaging modules 100 to be connected to electronic device 200 (referring to Fig. 7), for example, by Image Sensor 12 with can
Lens subassembly 40 is adjusted to be electrically connected on mainboard, so that imaging modules 100 are communicated with the mainboard of electronic device 200.
Fig. 2 and Fig. 3 are please referred to, bracket component 20 is erected on chip assembly 10.Bracket component 20 includes bracket 21 and filter
Mating plate 22.Bracket 21 is in rectangular ring structure.Bracket 21 includes upper surface 23, lower surface 24 and lateral surface 25.Upper surface 23 with
Lower surface 24 is located at the opposite two sides of bracket 21, and lateral surface 25 connects upper surface 23 and lower surface 24.Upper surface 23 is under
Surface 24 offers upper groove 26 and lower groove 27 respectively, and upper groove 26 is connected to lower groove 27, the cross section ruler of upper groove 26
The very little cross sectional dimensions less than lower groove 27 is to form plummer 29, wherein cross sectional dimensions is the outer profile size of cross section.
Bracket 21 is arranged on the substrate 11 of chip assembly 10, and lower surface 24 is towards substrate 11 and Image Sensor 12 fixed
Surface.It the lower surface 24 of bracket 21 can be fixed on the substrate 11 by viscose glue.After bracket 21 and substrate 11 are fixed, it is located at substrate 11
Upper Image Sensor 12 and other electronic components are housed in lower groove 27, and the connection terminal 13 on substrate 11 is located at lower groove
Outside 27, the electronic component on substrate 11 is caused directly to damage in this way, on the one hand can be avoided extraneous factor, on the other hand
It can accomplish not blocking connection terminal 13 again, ensure that the electric connection of connection line 50 Yu substrate 11.
Bracket 21 is also provided with perforation 28, and perforation 28 runs through upper surface 23 and lower surface 24, wherein perforation 28 runs through following table
The position of the connection terminal 13 for being located proximate to substrate 11 in face 24.In this way, connection line 50 can be threaded through after perforating 28 and connection
Terminal 13 is electrically connected.
Optical filter 22 is arranged on plummer 29 and is housed in upper groove 26, optical filter 22 and 12 phase of Image Sensor
It is right.Optical filter 22 can be fixed on plummer 29 by viscose glue.Optical filter 22 can be used for filtering out the interference into imaging modules 100
Light, such as when imaging modules 100 are visual light imaging mould group 100, optical filter 22 can be used for filtering out infrared light, filter at this time
Mating plate 22 specifically can be smalt, to reduce influence of the infrared light to image quality.It is infrared imaging mould in imaging modules 100
When group 100, optical filter 22 can be used for filtering out visible light, to reduce influence of the visible light to image quality.
Referring to Fig. 2, the side of the separate chip assembly 10 of bracket component 20 is arranged in lens subassembly 30.Lens subassembly 30 wraps
Include lens barrel 31 and eyeglass 32.Along the light direction that enters of lens subassembly 30, lens barrel 31 includes sequentially connected third ontology 35, second
Body 34 and the first noumenon 33.The first noumenon 33 and third ontology 35 are square structure, the structure in a circular table shape of the second ontology 34.The
The cross sectional dimensions of one ontology 33 is greater than the cross sectional dimensions of the second ontology 34, and the cross sectional dimensions of the second ontology 34 is greater than third
The cross sectional dimensions of ontology 35, wherein cross sectional dimensions is the outer profile size of cross section.
Lens barrel 31 is arranged in the upper surface 23 of bracket 21 and covers upper groove 26 and avoid perforation 28, specifically, first
The surface far from the second ontology 34 of ontology 33 is fixed on the upper surface 23 of bracket 21 and open perforation 28 (does not cover perforation
28).In one example, lens barrel 31 can be directly anchored on bracket 21 by viscose glue.In another example, lens barrel 31 and branch
It is also provided with washer 70 (vibration amplitude that washer 70 can reduce imaging modules 100) between frame 21, can first lead to washer 70
It is fixed on the stent 21 to cross viscose glue, then lens barrel 31 is fixed on washer 70 by viscose glue again.
The surface far from the second ontology 34 of third ontology 35 offers accommodating chamber 36, and accommodating chamber 36 is square structure.
Lens barrel 31 offers wire casing 37, and wire casing 37 extends in accommodating chamber 36 from the outer surface of lens barrel 31.Specifically, first
Ontology 33 includes top surface 330 and side 331, and the second ontology 34 includes top surface 340 and side 341, and third ontology 35 includes top surface
350 and side 351, accommodating chamber 36 includes side 361 and bottom surface 362.Wire casing 37 includes main line slot 371 and branch's wire casing 372.It is main
Wire casing 371 at least forms two, and branch's wire casing 372 at least forms four, and at least two branch's wire casings 372 are respectively at least two
A correspondence of main line slot 371 connects.Each main line slot 371 is provided with the side of the top surface 330 of the first noumenon 33, the first noumenon 33
331, the side 341 of the second ontology 34 and the top surface 340 of the second ontology 34, the main line slot 37 of the side 331 of the first noumenon 33 with
The perforation 28 of bracket 21 is corresponding, and in other words, main line slot 371 is from the side of the first noumenon 33 331 and perforates 28 corresponding positions successively
By the side 331 of the first noumenon 33, the top surface 330 of the first noumenon 33, the side 341 of the second ontology 34, until extending to the
The top surface 340 of two ontologies 34.Each branch's wire casing 372 is provided with the side of the top surface 350 of third ontology 35, third ontology 35
351, the side 361 of accommodating chamber 36 and the bottom surface 362 of accommodating chamber 36.In other words, branch's wire casing 372 from 371 phase of main line slot
The place of connecing successively by the side 351 of third ontology 35, the top surface 350 of third ontology 35, the side 361 of accommodating chamber 36, until prolong
Extend to the bottom surface 362 of accommodating chamber 36.When main line slot 371 is two, and each main line slot 371 corresponds to Liang Ge branch wire casing 372,
Two main line slots 371 are symmetrical about the plane of symmetry S of lens barrel 31, the wire casing of branch two-by-two 372 in four branch's wire casings 372 also about
The plane of symmetry S of lens barrel 31 is symmetrical, wherein plane of symmetry S is the optical axis by lens barrel 31 and be parallel to third ontology 35 open up line
The side 351 of slot 37.
Eyeglass 32 is located in lens barrel 31.The quantity of eyeglass 32 can for one or more, eyeglass 32 may include refractor,
One of dust-proof eyeglass, filter glass are a variety of.
In one example, bracket component 20 and lens subassembly 30 can be integral structure；In another example, it is imaged
Mould group 100 can be not provided with bracket component 20, at this point, optical filter 22 is arranged in lens subassembly 30, and be located at the first noumenon 33
Wire casing 37 at side 331 can extend directly at the connection terminal 13 of substrate 11.
Referring to Fig. 2, adjustable lens assemblies 40 are located in accommodating chamber 36.Incorporated by reference to fig. 4 to fig. 6, adjustable lens assemblies 40
Including support frame 41, substrate 42, piezoelectric actuator 43, film 44, adjustable lens 45 and supporting substrate 46.
Support frame 41 is square cyclic structure.The surface in accommodating chamber 36 and with accommodating chamber 36 is arranged in support frame 41
Fitting.Substrate 42, piezoelectric actuator 43, film 44, adjustable lens 45 and supporting substrate 46 are supported the encirclement of frame 41.
Substrate 42 is square cyclic structure.Substrate 42 is bonded with the inner surface of support frame 41, and substrate 42 can be avoided adjustable
The amplitude of 45 deformation of lens is excessive.Substrate 42 can be used silicon materials and be made.
Piezoelectric actuator 43 is square cyclic structure.The bottom of the close accommodating chamber 36 of support frame 41 is arranged in piezoelectric actuator 43
The side in face 362, for piezoelectric actuator 43 between bottom surface 362 and substrate 42, piezoelectric actuator 43 can be by way of glued
It is fixed on bottom surface 362.The size of the inner ring of piezoelectric actuator 43 is less than the size of the inner ring of substrate 42.Piezoelectric actuator 43 can
Think piezoelectric ceramics.
Film 44 is square laminated structure.Film 44 be bonded with piezoelectric actuator 43 and be arranged in piezoelectric actuator 43 with
The opposite surface in the bottom surface 362 of accommodating chamber 36.Film 44 can be glass film 44.
In present embodiment, substrate 42, piezoelectric actuator 43 and film 44 are independent structure respectively, can lead between three
Glued mode is crossed to be combined together, specifically, film 44 can be combined together by way of glued with piezoelectric actuator 43,
Substrate 42 can be combined together by way of glued with film 44.Certainly, in other embodiments, substrate 42, piezoelectricity cause
Dynamic device 43 and film 44 may be made as the piezoelectric actuator mould group of integral structure.For example, in the mistake of manufacture piezoelectric actuator mould group
Cheng Zhong can manufacture film 44 first, then manufacture substrate 42 and piezoelectric actuator 43 respectively in the two sides of film 44.Another
In embodiment, first piezoelectric actuator 43 (ceramics) can be embedded in mold, then pass through dual molding process for film 44
(glass material) and substrate 42 (silicon material) is integrally formed the piezoelectric actuator that integral structure is formed on piezoelectric actuator 43
Mould group.
Adjustable lens 45 can be the transparent flexible polymers such as resin, silica gel.Adjustable lens 45 can be in the extruding of external force
Or deformation occurs and the curvature of the outer surface (refractive surface 450) of adjustable lens 45 is made to change under the effect of pullling, Jin Ergai
Become adjustable lens 45 to the size of interception of rays, that is to say the focal length for changing imaging modules 100.
The surface of the separate piezoelectric actuator 43 of film 44, the refractive surface of adjustable lens 45 is arranged in adjustable lens 45
450 are bonded together with film 44.The inner wall of adjustable lens 45 and substrate 42 is separately to provide deformation sky for adjustable lens 45
Between.
Supporting substrate 46 is in rectangular configuration.Supporting substrate 46 be arranged in the surface of the separate film 44 of adjustable lens 45 and by
Substrate 42 surrounds, and supporting substrate 46 is bonded with adjustable lens 45, in this way, when deformation occurs for adjustable lens 45, due to branch support group
The restriction effect of plate 46, the one side that adjustable lens 45 are bonded with supporting substrate 46 can not deformation occurs, in other words adjustable lens
The curvature of 45 one sides being bonded with supporting substrate 46 does not change, and deformation quantity is concentrated on refractive surface 450.Support
Substrate 46 can be made of translucent material, for example, supporting substrate 46 can be glass substrate.
Into imaging modules 100 light pass through adjustable lens assemblies 40 when, light can sequentially pass through supporting substrate
46, the first light hole 431 of adjustable lens 45, film 44 and piezoelectric actuator 43.
When deformation occurs under electric signal (voltage) effect and film 44 and adjustable lens 45 is driven to send out for piezoelectric actuator 43
Raw deformation, so that the curvature of the refractive surface 450 of adjustable lens 45 be made to change, the curvature and piezoelectricity of refractive surface 450 are caused
The intensity for the electric signal that dynamic device 43 is subject to is related, for example, the voltage being applied on piezoelectric actuator 43 is bigger, refractive surface 450
Curvature it is bigger.When the curvature of the refractive surface 450 of adjustable lens 45 changes, the focal length of imaging modules 100 is also therewith
Change, so that the focal length of imaging modules 100 can be changed by changing the electric signal size being applied on piezoelectric actuator 43.It changes
Sentence is talked about, when needing to adjust the focal length of imaging modules 100, it is only necessary to according to the size for the focal length for needing to adjust, be caused to piezoelectricity
Dynamic device 43 applies the electric signal of corresponding size, so that piezoelectric actuator 43 generates corresponding deformation, the deformation of piezoelectric actuator 43
Cause adjustable lens 45 by the effect of external force, adjustable lens 45 generate corresponding deformation, and are finally reached the mesh focused
's.
Incorporated by reference to Fig. 1 and Fig. 2, connection line 50 is formed on lens subassembly 30 and bracket component 20 and is housed in wire casing 37
Interior, since connection line 50 is housed in wire casing 37, connection line 50 is not easy to be scraped by external foreign matter and influenced its conduction
Performance, and connection line 50 is securely fixed in wire casing 37, is not easy.
Specifically, connection line 50 includes the first sub-line road 51 and the second sub-line road 52.First sub-line road 51 accommodates online
In slot 37, the second sub-line road 52 is threaded through at the perforation 28 of bracket 21.First sub-line road 51 includes main line 53 and branched line
54.Main line 53 at least forms two, and branched line 54 also at least forms two and is separately connected at least two main lines road 53.
Main line 53 is housed in main line slot 371, and branched line 54 is housed in branch's wire casing 371.
In present embodiment, the quantity of main line 53 is two, and the quantity of the branched line 54 of every main line 53 is two
Item, every main line 53 and corresponding two branched lines 54 composition route and another main line 53 with corresponding two points
The route that branch line 54 forms is in symmetry, i.e. the first sub-line road 51 is symmetrical about plane of symmetry S.Positioned at the bottom surface of accommodating chamber 36
Branched line 54 at 362 is electrically connected by pin 71 (referring to Fig. 5) with piezoelectric actuator 43, the quantity and branch line of pin 71
The quantity on road 54 is consistent, and the quantity of pin 71 is four, and four pins 71 are located at four corner locations of piezoelectric actuator 43.When
So, in other embodiments, branched line 54 can also be electrically connected by conducting resinl and piezoelectric actuator 43.
Second sub-line road 52 is formed on the stent 21.Perforation 28 of the second sub-line road 52 from the upper surface 23 for being located at bracket 21
Place extends at the perforation 28 of lower surface 24, in this way, the setting of the second sub-line road 52 is in perforation 28, the second sub-line road 52 is not easy
It is scraped by external foreign matter and influences its electric conductivity, and the second sub-line road 52 is securely fixed in perforation 28, is not easy to take off
Out.Wherein, the second sub-line road 52 positioned at upper surface 23 is concordant with upper surface 23, and the second sub-line road 52 positioned at lower surface 24 is convex
Bracket 21 is outer out and bends towards the lateral surface 25 of bracket 21.The second sub-line road 52 at upper surface 23 can pass through conducting resinl and position
The first sub-line road 51 at the side of the first noumenon 33 331 is electrically connected, the second son at the lateral surface 25 of bracket 21
Route 52 is in contact to realize and be electrically connected with the connection terminal 13 of substrate 11.Certainly, in other embodiments, it is located at upper table
The second sub-line road 52 in face 23 can also protrude upper surface 23, and the second sub-line road 52 positioned at lower surface 24 can also be with lower surface
24 is concordant.In this way, the side that third ontology 33 is arranged in the second sub-line road 52 and the first sub-line road 51 of upper surface 23 is arranged in
The main line 53 in face 331 contacts, and the second sub-line road 52 that lower surface 24 is arranged in passes through the connection terminal of conducting resinl and substrate 11
It is electrically connected.
In one example, the first sub-line road 51 includes the first connecting pin 55, and the first connecting pin 55 is located at the first noumenon 33
Side 331.First connecting pin 55 can be weld pad；Alternatively, the first connecting pin 55 or pin, one end setting of pin
On the side of the first noumenon 33 331, the other end extends outwardly from the side of the first noumenon 33 331 and is vacantly arranged；Alternatively, the
One connecting pin 55 or elastic slice, one end of elastic slice are arranged on the side 331 of the first noumenon 33, and the other end is from the first noumenon
33 side 331 extends outwardly and is vacantly arranged.
When lens subassembly 30 is arranged on bracket component 20, the second sub-line road 52 includes second connection end 56, and second connects
At the perforation 28 for connecing the upper surface 23 that end 56 is located at bracket 21, at this point, the first connecting pin 55 carries out electrical property with second connection end 56
Connection.
When imaging modules 100 are not provided with bracket component 20, the first connecting pin 55 and the circuit (connection terminal on substrate 11
13) it is electrically connected, specifically, the first connecting pin 55 and connection terminal 13 can weld together or be connected to by conducting resinl
Together.
In another example, bracket 21 does not open up perforation 28, and the second sub-line road 52 is arranged on the outer surface of bracket 21.Second
Sub-line road 52 extends to the lateral surface 25 of bracket 21 from the upper surface of bracket 21 23 and is in contact with the connection terminal of substrate 11 13.
The structure annular in shape of Protective film 60.Protective film 60 is arranged on adjustable lens assemblies 40.Specifically, Protective film 60 is arranged
In the side of the separate piezoelectric actuator 43 of support frame 41.Protective film 60 can be made of lighttight material.
In one example, Protective film 60 is square cyclic structure, and Protective film 60 also can be used translucent material and be made.It blocks
Film 60 includes transparent area and shading region, and shading region is around transparent area.Wherein, transparent area is to be not coated with the light transmission base for being furnished with black ink
Material part, and shading region is the base material part for being coated with black ink.Alternatively, transparent area is the second light hole 61 of Protective film 60
(shown in Fig. 3), and shading region is the base material part for being coated with black ink of light-transmitting substrate.
Fig. 7 and Fig. 8 are please referred to, present invention also provides a kind of electronic device 200, electronic device 200 includes 201 He of shell
The imaging modules 100 of above-mentioned any one embodiment, imaging modules 100 are arranged on shell 201.
Electronic device 200 can use the image that imaging modules 100 obtain target scene, such as the shooting for scene is shone
Piece or recorded video etc..It is aobvious that electronic device 200 specifically can be mobile phone, tablet computer, laptop, monitoring camera, head
The equipment such as equipment, smartwatch, intelligent helmet.The application embodiment is illustrated so that electronic device 200 is mobile phone as an example, can
To understand, the concrete form of electronic device 200 is not limited to mobile phone, can also be other, and this is not restricted.
Shell 201 can be the shell of electronic device 200.Shell 201 can be used as the installation carrier of imaging modules 100,
Shell 201 can provide the protection of waterproof and dustproof, shatter-resistant for imaging modules 100.In one example, it can be opened on shell 201
Equipped with through-hole, when imaging modules 100 are arranged on shell 201, the incidence holes of imaging modules 100 can with through-hole alignment, and
Through-hole can be provided with the front or the back side of shell 201.In another example, display screen is also equipped on shell 201
204, imaging modules 100 can be set below display screen 204, that is, light is connect after passing through display screen 204 by imaging modules 100
It receives and is used to be imaged.In another example, when not needing using imaging modules 100, imaging modules 100 are located at display screen
204 lower sections, display screen 204 block imaging modules 100；When needing using imaging modules 100, driving display screen 204 and imaging
100 relative motion of mould group (such as driving display screen 204 and the opposite sliding of imaging modules 100 or relative rotation), so that display screen
204 no longer block imaging modules 100, receive ambient light convenient for imaging modules 100.
In one example, imaging modules 100 are housed in shell 201 and can stretch out out of shell 201, at this point, shell
Do not need to open up hole corresponding with the disengaging light direction of imaging modules 100 on body 201, for example, shell 201 include main body 202 and
Movable part 203, imaging modules 100 are mounted on movable part 203, and movable part 203 under the drive of the drive can be relative to
Main body 202 moves, and movable part 203 can slide relative to main body 202, with slide into main body 202 it is (as shown in Figure 7) inside or from master
(as shown in Figure 8) is skidded off in body 202.When needing using imaging modules 100, movable part 203 drives imaging modules 100 from shell
It is reached in 201 outside shell 201；When not needing using imaging modules 100, movable part 203 drives imaging modules 100 from shell
Outside 201 in receiving to shell 201.
The electronic device 200 of the application embodiment is led to by the way that adjustable lens assemblies 40 are arranged in lens subassembly 30
Cross connection line 50 and be electrically connected substrate 11 and piezoelectric actuator 43, connection line 50 can convey change be applied to it is piezoelectric actuated
Electric signal on device 43 is to change the curvature of the refractive surface 450 of adjustable lens 45, to realize the focusing function of imaging modules 100
Energy.For imaging modules 100 in focusing, deformation occurs the surfaces of adjustable lens 45 can be completed focusing, and adjustable lens assemblies 40
Can deformation occurs moves without opposite chip component 10, so as to omit the additional driving device such as voice coil motor, with
Reduce the volume of imaging modules 100.Further, since the deformation of adjustable lens 45 is generated by electric signal driving piezoelectric actuator 43
Without being affected by magnetic fields, thus imaging modules 100 not will receive what other extraneous electronic components generated at work
The influence in peripheral magnetic field, so that the anti-interference ability of imaging modules 100 is stronger；Further, piezoelectric actuator 43 is in electric signal
Under the action of will not generate hysteresis, thus adjustable lens 45 under electric signal effect the fast speed that deformation occurs with can
Rapidly realize focusing.
In the description of this specification, reference term " certain embodiments ", " embodiment ", " some embodiment party
The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " means in conjunction with the embodiment
Or example particular features, structures, materials, or characteristics described are contained at least one embodiment or example of the application.
In the present specification, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, description
Particular features, structures, materials, or characteristics can be in any one or more embodiments or example with suitable side
Formula combines.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include at least one described feature.In the description of the present application, the meaning of " plurality " is at least two, such as two,
Three, unless otherwise specifically defined.
Although embodiments herein has been shown and described above, it is to be understood that above-described embodiment is example
Property, it should not be understood as the limitation to the application, those skilled in the art within the scope of application can be to above-mentioned
Embodiment is changed, modifies, replacement and variant, and scope of the present application is defined by the claims and their equivalents.
Claims (13)
1. a kind of imaging modules characterized by comprising
Chip assembly, the chip assembly include the Image Sensor of substrate and setting on the substrate；
Lens subassembly, the lens subassembly are arranged on the chip assembly；
Adjustable lens assemblies, the adjustable lens assemblies are contained in the lens subassembly, and the Image Sensor is for receiving
Across the adjustable lens assemblies and the light of the lens subassembly, the adjustable lens assemblies include piezoelectric actuator and adjustable
Lens, that deformation occurs for driving the adjustable lens under the action of electrical signals is described adjustable to change for the piezoelectric actuator
The curvature of the refractive surface of lens；And
Connection line, the connection line are arranged on the lens subassembly and are electrically connected adjustable lens assemblies and described
Substrate.
2. imaging modules according to claim 1, which is characterized in that the lens subassembly includes lens barrel and is arranged described
Eyeglass in lens barrel offers wire casing on the lens barrel, and the connection line is formed in the wire casing.
3. imaging modules according to claim 2, which is characterized in that along light direction is entered, the lens barrel includes being sequentially connected
Third ontology, the second ontology and the first noumenon, the cross sectional dimensions of second ontology is less than the transversal of the first noumenon
Face size and the cross sectional dimensions for being greater than the third ontology, the third ontology are formed with accommodating chamber, the adjustable lens group
Part is contained in the accommodating chamber.
4. imaging modules according to claim 3, which is characterized in that the wire casing is provided with the appearance of the first noumenon
Face, the outer surface of second ontology and the third ontology outer surface and extend in the accommodating chamber.
5. imaging modules according to claim 4, which is characterized in that the position that opens up of the wire casing includes the first
The top surface and side of body, the top surface of second ontology and side, the top surface of the third ontology and side and the accommodating chamber
Side.
6. imaging modules according to claim 4, which is characterized in that the third ontology includes far from second ontology
Top surface, the accommodating chamber opens up on the top surface, and the connection line includes at least two main lines road and a plurality of branch line
Road, the main line be arranged on the outer surface of the first noumenon and the outer surface of second ontology and with substrate electricity
Property connection, a plurality of branched line is arranged on the outer surface of second ontology, on the outer surface of the third ontology simultaneously
It extends in the accommodating chamber, one end of a plurality of branched line is connect with the main line, a plurality of branched line
The other end is arranged on the bottom surface of the accommodating chamber.
7. imaging modules according to claim 6, which is characterized in that the adjustable lens assemblies further include with it is a plurality of described
The corresponding multiple pins of branched line, multiple pins are housed in the accommodating chamber, each pin and corresponding institute
State branched line electric connection.
8. imaging modules according to claim 1, which is characterized in that the imaging modules further include bracket component, described
Bracket component includes hollow bracket and the optical filter that is mounted in the bracket, and the bracket component is arranged in the chipset
Between part and the lens subassembly；The connection line includes the first sub-line road and the second sub-line road, and first sub-line road is set
The adjustable lens assemblies are set on the lens subassembly and are electrically connected, second sub-line road is arranged on the bracket,
Second sub-line road is electrically connected separate described adjustable lens assemblies one end and the substrate on first sub-line road.
9. imaging modules according to claim 8, which is characterized in that the bracket includes opposite upper surface and following table
Face, the bracket offer the perforation through the upper surface and the lower surface, and the second sub-line road is threaded through described wear
In hole, the opposite end on second sub-line road is exposed at respectively on the upper surface and the lower surface.
10. imaging modules according to claim 8, which is characterized in that the imaging modules further include washer, the washer
It is arranged between the bracket and the lens subassembly.
11. according to claim 1 to imaging modules described in 10 any one, which is characterized in that the adjustable lens assemblies are also
Include:
Support frame in a ring, the piezoelectric actuator are located in support frame as described above；
Substrate in a ring, the substrate are located in support frame as described above, and the side of the substrate is arranged in the piezoelectric actuator；
Film, between the substrate and the piezoelectric actuator, the adjustable lens are arranged in the film film
It goes up and is located in the substrate；And
Supporting substrate, the supporting substrate are located in support frame as described above and are arranged in the separate film of the adjustable lens
Side.
12. imaging modules according to claim 11, which is characterized in that the imaging modules further include blocking in a ring
The side far from the piezoelectric actuator of support frame as described above is arranged in film, the Protective film.
13. a kind of electronic device characterized by comprising
Shell；And
Imaging modules described in claim 1 to 12 any one, the imaging modules setting is on the housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811421644.2A CN109270683A (en) | 2018-11-26 | 2018-11-26 | Imaging modules and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811421644.2A CN109270683A (en) | 2018-11-26 | 2018-11-26 | Imaging modules and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109270683A true CN109270683A (en) | 2019-01-25 |
Family
ID=65191610
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811421644.2A Pending CN109270683A (en) | 2018-11-26 | 2018-11-26 | Imaging modules and electronic device |
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| Country | Link |
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| CN (1) | CN109270683A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020107985A1 (en) * | 2018-11-26 | 2020-06-04 | Oppo广东移动通信有限公司 | Imaging module and electronic apparatus |
| WO2020107996A1 (en) * | 2018-11-26 | 2020-06-04 | Oppo广东移动通信有限公司 | Imaging module and electronic device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103389609A (en) * | 2012-05-07 | 2013-11-13 | Lg伊诺特有限公司 | Camera module |
| CN106657749A (en) * | 2017-01-23 | 2017-05-10 | 深圳市金立通信设备有限公司 | Camera module, terminal and focusing method |
| US20180143506A1 (en) * | 2016-11-21 | 2018-05-24 | Gopro, Inc. | Tunable polymer dispersed liquid crystal doublet prism |
| CN108322632A (en) * | 2018-02-28 | 2018-07-24 | 广东欧珀移动通信有限公司 | Camera module, electronic device and camera module production method |
| CN207926731U (en) * | 2018-03-13 | 2018-09-28 | 欧菲影像技术（广州）有限公司 | Camera module and electronic equipment |
-
2018
- 2018-11-26 CN CN201811421644.2A patent/CN109270683A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103389609A (en) * | 2012-05-07 | 2013-11-13 | Lg伊诺特有限公司 | Camera module |
| US20180143506A1 (en) * | 2016-11-21 | 2018-05-24 | Gopro, Inc. | Tunable polymer dispersed liquid crystal doublet prism |
| CN106657749A (en) * | 2017-01-23 | 2017-05-10 | 深圳市金立通信设备有限公司 | Camera module, terminal and focusing method |
| CN108322632A (en) * | 2018-02-28 | 2018-07-24 | 广东欧珀移动通信有限公司 | Camera module, electronic device and camera module production method |
| CN207926731U (en) * | 2018-03-13 | 2018-09-28 | 欧菲影像技术（广州）有限公司 | Camera module and electronic equipment |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020107985A1 (en) * | 2018-11-26 | 2020-06-04 | Oppo广东移动通信有限公司 | Imaging module and electronic apparatus |
| WO2020107996A1 (en) * | 2018-11-26 | 2020-06-04 | Oppo广东移动通信有限公司 | Imaging module and electronic device |
| US11892749B2 (en) | 2018-11-26 | 2024-02-06 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Imaging module and electronic apparatus |
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