CN109244045B - Miniaturized metal tube shell packaging structure of thick film substrate - Google Patents
Miniaturized metal tube shell packaging structure of thick film substrate Download PDFInfo
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- CN109244045B CN109244045B CN201811144181.XA CN201811144181A CN109244045B CN 109244045 B CN109244045 B CN 109244045B CN 201811144181 A CN201811144181 A CN 201811144181A CN 109244045 B CN109244045 B CN 109244045B
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- thick film
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- 239000000758 substrate Substances 0.000 title claims abstract description 72
- 239000002184 metal Substances 0.000 title claims abstract description 41
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 41
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 14
- 239000000919 ceramic Substances 0.000 claims abstract description 57
- 238000000034 method Methods 0.000 claims abstract description 26
- 150000003071 polychlorinated biphenyls Chemical class 0.000 claims abstract description 3
- 238000007639 printing Methods 0.000 claims description 20
- 238000005476 soldering Methods 0.000 claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 10
- 238000007650 screen-printing Methods 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 238000012360 testing method Methods 0.000 abstract description 9
- 230000009286 beneficial effect Effects 0.000 abstract description 5
- 238000003466 welding Methods 0.000 description 11
- 238000005516 engineering process Methods 0.000 description 9
- 238000013461 design Methods 0.000 description 7
- 230000010354 integration Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000012545 processing Methods 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000013500 performance material Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- JAYCNKDKIKZTAF-UHFFFAOYSA-N 1-chloro-2-(2-chlorophenyl)benzene Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1Cl JAYCNKDKIKZTAF-UHFFFAOYSA-N 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 101100084627 Neurospora crassa (strain ATCC 24698 / 74-OR23-1A / CBS 708.71 / DSM 1257 / FGSC 987) pcb-4 gene Proteins 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Combinations Of Printed Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a miniaturized metal tube shell packaging structure of a thick film substrate, wherein an upper layer of PCB board and a lower layer of PCB board with set intervals are sleeved on pins of a tube shell base, and the upper layer of PCB board and the lower layer of PCB board are electrically connected through the pins or pins; the upper or/and lower surfaces of the upper and lower layers of PCB boards are provided with surface mounting elements; and a ceramic substrate is welded on the upper surface of the upper PCB, and a metal cap covers the base of the tube shell to hermetically package the two layers of PCBs. The circuit unit and the resistor with high requirements on the resistor precision are printed on the ceramic substrate by adopting a thick film process, so that the active fine adjustment of the resistor is facilitated, and the resistor is easy to operate; reasonable division of the circuit layout is beneficial to testing the circuit performance of each board and reduces the testing difficulty.
Description
Technical Field
The invention relates to a miniaturized metal tube shell packaging structure of a thick film substrate.
Background
The currently known packaging technology of a thick film substrate assembled metal tube shell structure generally comprises the steps of assembling a surface-mounted device or a bare chip on the front surface of a substrate; and then the back of the substrate is fixed with the tube shell in an adhesive mode, and finally the tube shell and the metal cover plate are subjected to parallel seam welding, so that the full-airtight packaging structure of the metal tube shell is realized.
Disadvantages: the single substrate is bonded with the metal tube shell for encapsulation, so that the back of the substrate cannot be bonded with components, and only the front of the substrate is assembled with surface-mounted components or bare chips, thereby resulting in lower circuit integration level.
Disclosure of Invention
The invention aims to provide a miniaturized metal tube shell packaging structure of a thick film substrate, which can solve the substrate packaging problems of special requirements such as high required resistance precision, and the like, improve the integrated level of the substrate packaging, reduce the processing packaging difficulty, be easy to operate and reduce the testing difficulty of circuit performance.
The technical scheme for realizing the purpose of the invention comprises the following steps:
a miniaturized metal tube shell packaging structure of thick film base plate, characterized by that, set up the upper, lower two-layer PCB board of the interval on the pin of the tube shell base, upper, lower two-layer PCB board is connected electrically through the pin or contact pin;
wherein, the upper or/and lower surface of the upper and lower two-layer PCB board is provided with surface mounting elements; the upper surface of the upper layer PCB is also welded with a ceramic substrate,
the metal cap covers the tube shell base to hermetically package the two layers of PCB boards.
The circuit on the ceramic substrate is formed by adopting a thick film printing process or a screen printing process.
Active devices on the ceramic substrate are bonded by bare chips.
The ceramic substrate is electrically connected with the upper PCB by silver plating copper wires or PAD area welding.
The ceramic substrate is electrically connected between the front side and the back side through conduction band side connection.
The resistor thick film exceeding the set precision on the lower PCB is printed on the ceramic substrate on the upper PCB; the two ends of the resistor are welded on the upper PCB through silver-plated copper wires, and then are electrically connected with the lower PCB through pins or contact pins.
The space between the upper and lower layers of PCB boards is fixed by the supporting ring.
And a supporting ring is sleeved on pins between the tube shell base and the lower PCB.
The upper and lower layers of PCB boards are sleeved and welded on pins of the tube shell base in a soldering mode.
An insulating pad is arranged on one surface of the tube shell base, which faces to the lower PCB.
The invention has the advantages that:
1) Reasonable division of the circuit layout is beneficial to testing the circuit performance of each board and reduces the testing difficulty.
2) The circuit unit and the resistor with high requirements on the resistor precision in the circuit are both made of thick film technology, and the resistor is printed on the ceramic substrate, so that the active fine adjustment of the resistor is facilitated, the bare chip is subjected to gold wire bonding, the conventional technology is met, and the operation is easy.
3) The 2-layer PCB printed board is sleeved on the pins of the metal tube shell in a soldering manner, and a soldering surface-mounted device is adopted in the assembly of the PCB, so that the method meets the conventional process and is easy to operate.
4) The ceramic substrate circuit module is used as a device to be soldered on a PCB, so that the assembly is simple, and the circuit module with high precision requirement can be realized by adopting a thick film process.
5) The ceramic base plate and the printing plate are mixed and assembled in the tube shell base, and the tube shell base and the metal cap form full-airtight package through laser welding.
Drawings
Fig. 1 is a front view of a metal shell base;
FIG. 2 is a side view of FIG. 1;
FIG. 3 is an assembly block diagram;
fig. 4 is a side view of fig. 3.
Detailed Description
The invention is further described below with reference to the accompanying drawings. The following examples are only for more clearly illustrating the technical aspects of the present invention, and are not intended to limit the scope of the present invention.
Referring to fig. 1-4, the ceramic substrate and the printing plate are mixed and assembled in the tube shell base, and the tube shell base 1 and the metal cap 2 are formed into a full-airtight package by laser welding. The design technology of the miniaturized metal tube shell package of the thick film and the printing plate is that 2 layers of PCB boards are sleeved on pins of a tube shell base in a soldering mode, the front and back surfaces of a lower layer of PCB board 3 are completely surface-mounted parts, the front and back surfaces of an upper layer of PCB board 4 are also surface-mounted parts, and a ceramic substrate 5 is welded on the front (upper surface) of the upper layer of PCB board. The ceramic substrate 5 is subjected to thick film printing technology, screen printing technology and active device bonding by bare chip gold wire. The space between the two layers of PCB boards is fixed through the support ring 6, and the support ring 6 is sleeved on the pins 11 of the base of the tube shell. The internal electrical connection between the upper and lower layers of the PCB board is electrically connected with the pins 11 of the base of the tube shell through the soldering pins 7. The resistor has high precision, the circuit unit needing active fine adjustment is processed by a thick film printing process of a ceramic substrate, the resistor is adjusted, and meanwhile, the integration level is improved by adopting a bare chip gold wire bonding mode. The ceramic substrate 5 is used as a device unit to be soldered on the upper layer PCB 4, and the ceramic substrate 5 is electrically connected with the upper layer PCB by silver-plated copper wires 9 or PAD area soldering, and the front and back surfaces of the ceramic substrate are electrically connected through the side connection of the ceramic substrate to realize front and back wiring. An insulating pad 8 (as the case may be) is adhered to the bottom surface of the package base to prevent shorting with the surface mount device. Finally, the full-airtight packaging of the metal tube shell is realized by a laser seam welding mode.
The complete process of the invention will be described in detail below.
1. Technical characteristics (technical problem to be solved)
1.1 Technical scheme characteristics
1) The scheme is that a technology of laser welding is adopted by adopting a domestic mature metal tube shell base and a metal cap, and is characterized in that: high reliability, impact resistance and easy operation.
2) The substrate material adopts Al 2 O 3 And other material base plates, has certain mechanical impact resistance, and is characterized by universal material selection.
3) The thick film printing process and the printed board process are all common processes, and the production and the processing are easy.
4) The design is flexible, the modification and reworking are convenient, the processing difficulty of the process is obviously reduced, and the yield is greatly improved.
5) The metal cap is suitable for the structural design of all metal tube shell bases and metal cap packages with similar structures.
1.2 Technical difficulties
1) The integrated level of the circuit is high, the density is high, the effective area of the layout is only one third of that of a common thick film process circuit, so that the upper and lower layers of PCB boards are sleeved on the pins of the tube shell, the area of the layout is increased, and the integrated level is improved.
2) The circuit has high precision resistor and needs active fine adjustment, so that the circuit part and resistor with precision requirement must adopt ceramic substrate thick film printing process, and the integration level is required to be improved. In order to solve the problem, the ceramic substrate printed by thick film and the PCB patch are mixed and assembled.
3) The ceramic substrate adopts thick film printing, the front component adopts bare chip gold wire bonding process, the high-precision resistor adopts screen printing, the requirements of high precision and on-line active fine adjustment of the resistor can be met, and the integration level is improved.
4) The wiring of the front and the back of the ceramic substrate is realized by the side connection printing of the ceramic substrate; and the ceramic substrate and the PCB are electrically interconnected and fixedly assembled, and the electrical interconnection and the installation on the upper PCB are realized by soldering the bonding area on the back of the ceramic substrate.
5) The ceramic substrate and the upper PCB are electrically connected, and the electrical connection can be realized by adopting a silver-plated copper wire soldering process with high reliability.
6) Interconnection between upper PCB and lower PCB board: the area of the tube shell is small, pins on the tube shell base are used as circuit output pins, the interconnection between the upper layer of PCB and the lower layer of PCB is difficult, the two layers of PCB are interconnected through the contact pin, and the pins on the tube shell base are utilized for interconnection.
7) The high-precision resistor on the lower PCB is printed on the ceramic substrate on the upper PCB.
8) The high-precision resistor on the lower PCB needs to be printed on the ceramic substrate, and the thick-film ceramic substrate is soldered on the upper PCB, so that the electric connection is difficult to realize. The two ends of the high-precision resistor which can be printed by thick film are welded on the upper PCB board through silver-plated copper wires, and then are electrically connected with the lower PCB board through contact pins.
9) The assembly must take new thought. An insulating pad is adhered on the tube shell base, an upper layer PCB printing plate and a lower layer PCB printing plate are sleeved on pins of the tube shell base, a thick film process of gold wire bonding is adopted for thick film printing of the ceramic substrate, soldering is arranged on the upper layer PCB, and the upper layer PCB and the lower layer PCB are interconnected through outer pins and contact pins.
10 The design requires reduced processing difficulty and easy operation, so that the common process must be selected to meet the requirements.
2. Technical proposal
The design technology of the miniaturized metal tube shell package of thick film and printing plate is that 2 layers of PCB printing plates are sleeved on pins 11 of the metal tube shell in a soldering way, the lower layer of PCB plate completely adopts a surface-mounted part, the upper layer of PCB plate also adopts a surface-mounted part, a thick film printing resistor is adopted on a ceramic substrate welded on the upper layer of PCB plate, and an active device adopts bare chip gold wire bonding. The space between the two layers of PCB printed boards is fixed through the support ring, and the internal electrical connection between the PCB boards is connected through the soldering pins. The resistor has high precision, the circuit unit and the resistor which need active fine adjustment are processed and adjusted through the thick film printing process of the ceramic substrate, and meanwhile, the integration level is improved by adopting a bare chip gold wire bonding mode. The ceramic substrate is used as a device unit to be soldered on the PCB, bonding and electrical connection with the received PCB are realized between the ceramic substrate and the PCB in a mode of silver plating copper wires and PAD area soldering, and front and back wiring is realized through side connection of the ceramic substrate. Finally, the full-airtight packaging of the metal tube shell is realized by a laser seam welding mode. The following design scheme is adopted.
1) Segmentation of circuit layouts
In order to facilitate testing, the units of the upper and lower PCB printed boards are divided as much as possible according to the respective functional blocks, which is beneficial to testing each board. The circuit unit with high resistance precision is printed on the ceramic substrate, the ceramic substrate can be printed on the back of the ceramic substrate through the side connection of the conduction band, and then is electrically connected with the upper PCB board in a welded mode, and the circuit unit is arranged on the upper layer in the tube shell. The circuit unit of the PCB with the lower layer being the surface-mounted part is printed with a small amount of resistors with high precision on the ceramic substrate, the two ends of each resistor are connected to the upper PCB through silver-plated copper wires, and the two circuit boards are connected through pins to realize the electrical function of the circuit, so that the testability of the circuit is solved, and the resistance debugging function of the high-precision circuit unit is also realized.
2) Layout of ceramic substrate
The circuit unit with high resistance precision requirement is printed on the ceramic substrate, can be printed on the back of the ceramic substrate through side connection, is connected with the upper PCB board by welding, and is arranged on the upper layer of the tube shell. A small amount of resistors with high precision in the circuit unit of the PCB with the lower layer being the surface mount component are also printed on the ceramic substrate, the two ends of the resistor are connected to the upper layer of the received PCB through silver-plated copper wires by welding, and the two PCB are communicated through the contact pin, so that the electrical function of the circuit is realized.
3) Communication mode between upper and lower layers of PCB boards
The upper and lower layers of PCB boards are sleeved on pins of the tube shell base through holes, and the pins are used as output function pins and also used as internal electrical connection channels of 2 PCB circuits. The internal electrical connection between the PCBs is also electrically connected by punching and soldering pins.
4) Packaging tube shell
The metal tube shell comprises a tube shell base and a metal cap. As shown in fig. 1 and 2, the base of the tube shell is a platform with 2 rows of dual in-line pins, and a narrow short step is arranged around the edge of the platform and used for carrying out laser seam welding with the metal cap. The metal cap is a cuboid cavity with one surface open and welded with the base of the tube shell to form an airtight package.
5) Assembly structure
And the pins of the base of the tube shell are sleeved with supporting rings for supporting the lower PCB. The pins of the tube shell base are sleeved with lower-layer PCB plates, and a layer of insulating material pad can be placed between the lower-layer PCB plates and the tube shell base or the insulating material pad can be not placed according to actual conditions; then, a supporting ring is sleeved on the pin, and pins for isolating the interval between the two layers of PCB boards are welded; and sleeving and soldering the upper PCB on the pins and the pins, wherein the lower surface of the upper PCB is a surface-mounted device, the surface-mounted device and a ceramic substrate are soldered on the upper surface, a thick film printing process and a gold wire bonding process are adopted on the ceramic substrate, the ceramic substrate and the upper PCB are electrically connected through silver plating copper wires or other connection modes, and finally, a metal cap is welded on a tube shell base by laser to form the airtight package. The assembly structure is shown in fig. 2.
3. Technical advantage (beneficial effect)
1) Reasonable division of the circuit layout is beneficial to testing the circuit performance of each board and reduces the testing difficulty.
2) The circuit unit and the resistor with high requirements on the resistor precision in the circuit are both made of thick film technology, and the resistor is printed on the ceramic substrate, so that the active fine adjustment of the resistor is facilitated, the bare chip is subjected to gold wire bonding, the conventional technology is met, and the operation is easy.
3) The 2-layer PCB printed board is sleeved on the pins of the metal tube shell in a soldering manner, and a soldering surface-mounted device is adopted in the assembly of the PCB, so that the method meets the conventional process and is easy to operate.
4) The ceramic substrate circuit module is used as a device to be soldered on the upper layer PCB, so that the assembly is simple, and the circuit module with high precision requirement can be realized by adopting a thick film process.
5) The ceramic base plate and the printing plate are mixed and assembled in the tube shell base, and the tube shell base and the metal cap form full-airtight package through laser welding.
4. Design of technological parameters
1) An adhesive material: conductive epoxy H37MP, H20E or equivalent performance materials;
solder paste RHG55-OF-2063 or NC-62-90A
2) Connecting material: gold wire, silver-plated copper wire, contact pin or equivalent performance material;
3) A tube shell base: gold-plated or nickel-plated kovar or comparable performance material products;
4) A substrate: ceramic substrate and PCB board.
The foregoing is merely a preferred embodiment of the present invention, and it should be noted that modifications and variations could be made by those skilled in the art without departing from the technical principles of the present invention, and such modifications and variations should also be regarded as being within the scope of the invention.
Claims (7)
1. A miniaturized metal tube shell packaging structure of thick film base plate, characterized by that, set up upper-layer PCB board, lower floor PCB board of interval on the pin of the tube shell base, upper-layer PCB board, lower floor PCB board are connected electrically through the pin or contact pin;
wherein, the upper or/and lower surfaces of the upper layer PCB and the lower layer PCB are provided with surface mounting elements; the upper surface of the upper layer PCB is also welded with a ceramic substrate,
the metal cap covers the base of the tube shell, and the two layers of PCB boards are hermetically packaged;
the circuit on the ceramic substrate is formed by adopting a thick film printing process or a screen printing process;
the resistor thick film exceeding the set precision on the lower PCB is printed on the ceramic substrate on the upper PCB; the two ends of the resistor are welded on the upper PCB through silver-plated copper wires and are electrically connected with the lower PCB through pins or contact pins;
the space between the upper and lower layers of PCB boards is fixed by the supporting ring.
2. The miniaturized metal shell package structure of claim 1 wherein active devices on the ceramic substrate are gold bonded with bare die.
3. The miniaturized metal shell package structure of the thick film substrate according to claim 1, wherein the ceramic substrate is electrically connected with the upper layer PCB board by silver-plated copper wires or PAD area soldering.
4. The miniaturized metal shell package of claim 1 wherein the ceramic substrate is electrically connected between the front and back surfaces by conduction band side connections.
5. The miniaturized metal package of claim 1, wherein the support ring is sleeved on the pins between the package base and the underlying PCB.
6. The miniaturized metal package of thick film substrates of claim 1, wherein the upper and lower PCBs are soldered to pins of the package base by soldering.
7. The miniaturized metal package of claim 1, wherein the insulating pad is disposed on a surface of the package base facing the underlying PCB.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811144181.XA CN109244045B (en) | 2018-09-29 | 2018-09-29 | Miniaturized metal tube shell packaging structure of thick film substrate |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811144181.XA CN109244045B (en) | 2018-09-29 | 2018-09-29 | Miniaturized metal tube shell packaging structure of thick film substrate |
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| CN109244045A CN109244045A (en) | 2019-01-18 |
| CN109244045B true CN109244045B (en) | 2024-04-05 |
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| CN110225656A (en) * | 2019-06-06 | 2019-09-10 | 中国兵器工业集团第二一四研究所苏州研发中心 | A kind of assemble method minimizing printing plate |
| CN110429009B (en) * | 2019-08-30 | 2024-03-29 | 桂林航天电子有限公司 | 2-type solid relay with staggered structure |
| CN110581124B (en) * | 2019-09-12 | 2021-03-19 | 西安电子科技大学 | Preparation method of multi-level fused three-dimensional system integrated structure |
| CN110544673B (en) * | 2019-09-12 | 2021-03-19 | 西安电子科技大学 | Multilayer fused three-dimensional system integrated structure |
| CN111653526A (en) * | 2020-03-24 | 2020-09-11 | 鑫金微半导体(深圳)有限公司 | SiP 3-dimensional packaging and processing method of high-power hybrid semiconductor integrated circuit |
| CN113690677A (en) * | 2021-08-27 | 2021-11-23 | 中国电子科技集团公司第十四研究所 | Hybrid integrated power module capable of being plugged and unplugged quickly |
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