CN109219255A - A kind of production method and PCB of non-metallic stepped groove - Google Patents
A kind of production method and PCB of non-metallic stepped groove Download PDFInfo
- Publication number
- CN109219255A CN109219255A CN201811353967.2A CN201811353967A CN109219255A CN 109219255 A CN109219255 A CN 109219255A CN 201811353967 A CN201811353967 A CN 201811353967A CN 109219255 A CN109219255 A CN 109219255A
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- Prior art keywords
- stepped groove
- core plate
- layer
- metallic
- production method
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Laser Beam Processing (AREA)
Abstract
The embodiment of the invention discloses the production methods and PCB of a kind of non-metallic stepped groove, this method comprises: top layer core plate, prepreg and bottom core plate mixed pressure are made a multi-layer board；The position of multi-layer board stepped groove to be opened up carries out controlled depth milling plate, mills from top layer core plate to prepreg, until the remaining certain thickness dielectric layer of prepreg, obtains the multi-layer board with stepped groove；Laser ablation is carried out to dielectric layer, removes remaining media layer；The medium that laser ablation process remains on copper face is further removed by sandblasting process, so that copper face of the bottom core plate in stepped groove slot bottom position is completely exposed；The oxide layer on copper face is removed by microetch process；Layers of copper by bottom core plate in stepped groove slot bottom position etches away, and forms non-metallic stepped groove.Technical solution provided by the invention, compared with the existing technology, technique is simpler, is not necessarily to special installation or special process, both reduces operation difficulty, also improve stepped groove dimensional accuracy, and high-volume is suitble to make.
Description
Technical field
The present embodiments relate to printed circuit board technology field more particularly to a kind of production sides of non-metallic stepped groove
Method and PCB.
Background technique
With the development of science and technology electronic product has become indispensable articles for daily use in for people's lives, and PCB
(Printed Circuit Board, printed wiring board) is the important component of electronic product, and people produce electronics in recent years
The functional requirement of product is more and more, and thus to PCB, higher requirements are also raised.In general, special for the ease of being installed on PCB
The device that the device or needs of function sink, it is often necessary to which stepped groove is set on PCB, and stepped groove is also to realize the big function of product
The pith of rate heat dissipation, is in industry widely used.
The side wall of stepped groove can metallize, can also be non-metallic；And the PCB non-metallic for ladder groove sidewall,
There are mainly two types of production methods general at present:
One kind be controlled depth milling production method, this production method not only control depth difficulty it is bigger, be difficult controlled depth milling to specified line
Road floor leads to not meet design requirement；And figure can not be made in slot bottom.
Another kind is buries gasket production method, due to being limited by shim size production ability and dimensional accuracy, current nothing
Legal system makees the stepped groove of 2*5mm or less size.
Therefore for the non-metallic stepped groove of microsize, manufacture craft is unable to satisfy batch making requirement at present.
Summary of the invention
The technical problem to be solved in the present invention is that in view of the deficiencies of the prior art, providing a kind of non-metallic stepped groove
Production method and PCB, to solve the prior art existing manufacture craft when making the non-metallic stepped groove of microsize
It is unable to satisfy the defect problem of requirement, operating difficulties and poor universality.
To achieve the above object, the present invention provides technical solution below:
In a first aspect, the embodiment of the present invention provides a kind of production method of non-metallic stepped groove, this method comprises:
Top layer core plate, prepreg and bottom core plate are made into a multi-layer board according to scheduled laminated layer sequence mixed pressure；
Controlled depth milling plate is carried out in the position of multi-layer board stepped groove to be opened up, is milled from the top layer core plate to prepreg
Inside, until the remaining certain thickness dielectric layer of the prepreg, obtains the multi-layer board with stepped groove；
Laser ablation is carried out to the dielectric layer, removes remaining media layer；
The medium that laser ablation process remains on copper face is further removed by sandblasting process, so that the bottom core plate
Copper face in stepped groove slot bottom position is completely exposed；
The oxide layer on copper face is removed by microetch process；
Layers of copper by the bottom core plate in stepped groove slot bottom position etches away, and forms non-metallic stepped groove.
Further, in the production method, the top layer core plate is common material core plate, and the bottom core plate is high frequency
Material core plate.
Further, in the production method, the dielectric layer with a thickness of 0~3mil.
Further, in the production method, the dielectric layer includes the macromolecule resin being fully cured, and by described
Macromolecule resin cladding, the molding glass fabric of establishment.
Further, in the production method, in the step of carrying out laser ablation to the dielectric layer, the laser that uses for
Carbon dioxide laser.
Further, in the production method, laser ablation process is further removed by sandblasting process and remains in copper face
On medium the step of in, the gas that uses is the high pressure gas that is mixed with sandblasting powder.
Further, in the production method, the sandblasting powder is aluminum oxide powder.
Further, in the production method, the diameter of the aluminum oxide powder is 5~10 μm.
Further, in the production method, the side wall and the equal no copper layer of slot bottom of the non-metallic stepped groove.
Second aspect, the embodiment of the present invention also provide a kind of PCB, including non-metallic stepped groove, the stepped groove according to
Any production method of first aspect is made.
Compared with prior art, the invention has the following advantages:
Using the embodiment of the present invention, a PCB with stepped groove can be made into, and the side wall of its stepped groove and slot bottom are non-
Metallization schemes；In the production process, using preparatory controlled depth milling plate, then laser ablation removes remaining resin, then uses microetch
Add sandblasting process to remove remaining glass fibre and copper face oxide, falls slot bottom copper eventually by outer graphics etched
Layer, ultimately forms side wall and the non-metallic stepped groove of slot bottom, compared with the existing technology, in the production non-metallic ladder of microsize
When slot, process is simpler, is not necessarily to special installation or special process, both reduces operation difficulty, also improve stepped groove
Dimensional accuracy is suitble to high-volume to make.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention without any creative labor, may be used also for those of ordinary skill in the art
To obtain other attached drawings according to these attached drawings.
Fig. 1 is the flow diagram of the production method for the non-metallic stepped groove that the embodiment of the present invention one provides；
Fig. 2 is the multiple-plate topology view of lamination mixed pressure that the embodiment of the present invention one provides；
Fig. 3 is topology view of the multi-layer board after controlled depth milling plate shown in Fig. 2；
Fig. 4 is topology view of the multi-layer board after laser ablation shown in Fig. 3；
Fig. 5 is topology view of the multi-layer board after sandblasting shown in Fig. 4；
Fig. 6 is topology view of the multi-layer board after microetch shown in Fig. 5；
Fig. 7 is topology view of the multi-layer board shown in Fig. 6 after layers of copper etching.
Specific embodiment
The present invention is described in further detail with reference to the accompanying drawings and examples.It is understood that this place is retouched
The specific embodiment stated is used only for explaining the present invention rather than limiting the invention.It also should be noted that in order to just
Only the parts related to the present invention are shown in description, attached drawing rather than entire infrastructure.
Embodiment one
Referring to Fig. 1, the present embodiment one provides a kind of production method of non-metallic stepped groove, comprising steps of
S101, top layer core plate, prepreg and bottom core plate are made into a multi-layer board according to scheduled laminated layer sequence mixed pressure,
As shown in Figure 2.
Wherein, the top layer core plate is common material core plate, and the bottom core plate is high frequency material core plate.
It should be noted that microsize stepped groove is mainly used on high-frequency microwave rf board, high frequency material has pole
Low dielectric loss (excellent electric property), but have the characteristics that expensive therefore general high-frequency microwave rf board
It is all made of high frequency material and the mode of common material mixed pressure makes, in order to guarantee the transmitting of radio frequency end signal not by the shadow of common material
It rings, stepped groove often completely non-metallic in this high-frequency signal transmitting position production side wall and bottom surface, this stepped groove requires side wall
With bottom surface entirely without metal layer, high frequency material is fully retained, and common material hollows out completely.
S102, controlled depth milling plate is carried out in the position of multi-layer board stepped groove to be opened up, milled from the top layer core plate to half
Inside cured sheets, until the remaining certain thickness dielectric layer of the prepreg, obtains the multi-layer board with stepped groove, such as schemes
Shown in 3.
Wherein, the dielectric layer with a thickness of 0~3mil, specifically include the macromolecule resin being fully cured, and by institute
State macromolecule resin cladding, the molding glass fabric of establishment.
S103, laser ablation is carried out to the dielectric layer, removes remaining media layer, as shown in Figure 4.
In one embodiment, it is preferred that laser ablation is carried out to the dielectric layer using carbon dioxide laser.
It should be noted that fuel factor that laser ablation was generated using substance and when laser action or chemical reaction come into
Row effect, different types of substance are not quite similar to the absorption of laser and response characteristic, such as in embodiments of the present invention, glass fibers
There are biggish difference, (macromolecule resin is easy ablation, glass fibers to the absorptivity of Wei Bu, macromolecule resin and copper to carbon dioxide
Wei Bu is not easy ablation, and copper face hardly reacts), macromolecule resin and most of glass fabric are gone using this characteristic
Except (can remain extremely a small amount of glass fabric particle), and layers of copper can then be fully retained.
S104, the medium that laser ablation process remains on copper face is further removed by sandblasting process, so that the bottom
Copper face of the layer core plate in stepped groove slot bottom position is completely exposed, as shown in Figure 5.
In one embodiment, it is preferred that using the height for the aluminum oxide powder for being mixed with 5~10 μ m diameter sizes
Body of calming the anger removal laser ablation process remains in the medium on copper face.
It is that will affect high frequency it should be noted that allowing it to continue to be adhered on copper face if glass fibre does not clean up
Signal transfer functions, it is therefore desirable to using the high pressure gas for the aluminum oxide powder for being mixed with 5~10 μ m diameter sizes, punching
Surface of material is hit, using the friction of fine particle and body surface, washes away the coherent substance (glass fibre) on removal surface.
S105, the oxide layer on copper face is removed by microetch process, as shown in Figure 6.
There is the substance for influencing layers of copper etching, i.e. oxide layer on copper face, it is therefore desirable to remove it by microetch process.
S106, the layers of copper by the bottom core plate in stepped groove slot bottom position etch away, and form non-metallic ladder
Slot, as shown in Figure 7.
Wherein, the side wall of the non-metallic stepped groove and the equal no copper layer of slot bottom, meet high frequency signal transmission requirement.
A kind of production method of non-metallic stepped groove provided in an embodiment of the present invention, can be made into one has stepped groove
PCB, and the side wall of its stepped groove and slot bottom are non-metallic design；In the production process, using preparatory controlled depth milling plate, then
Laser ablation removes remaining resin, then adds sandblasting process to remove remaining glass fibre and copper face oxide with microetch, finally
Fall slot bottom layers of copper by outer graphics etched, ultimately form side wall and the non-metallic stepped groove of slot bottom, relative to existing
There is technology, in the non-metallic stepped groove of production microsize, process is simpler, is not necessarily to special installation or special flow
Journey both reduces operation difficulty, also improves stepped groove dimensional accuracy, and high-volume is suitble to make.
Embodiment two
The present embodiment two provides a kind of PCB comprising non-metallic stepped groove, the stepped groove are provided according to embodiment one
Production method be made.
The side wall and the equal no copper layer of slot bottom of the non-metallic stepped groove.
A kind of PCB provided in an embodiment of the present invention, compared with the existing technology, in the production non-metallic stepped groove of microsize
When, process is simpler, is not necessarily to special installation or special process, both reduces operation difficulty, also improve stepped groove ruler
Very little precision is suitble to high-volume to make.
The above, the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although referring to before
Stating embodiment, invention is explained in detail, those skilled in the art should understand that: it still can be to preceding
Technical solution documented by each embodiment is stated to modify or equivalent replacement of some of the technical features；And these
It modifies or replaces, the spirit and scope for technical solution of various embodiments of the present invention that it does not separate the essence of the corresponding technical solution.
Claims (10)
1. a kind of production method of non-metallic stepped groove characterized by comprising
Top layer core plate, prepreg and bottom core plate are made into a multi-layer board according to scheduled laminated layer sequence mixed pressure；
Controlled depth milling plate is carried out in the position of multi-layer board stepped groove to be opened up, is milled from the top layer core plate to prepreg
Portion, until the remaining certain thickness dielectric layer of the prepreg, obtains the multi-layer board with stepped groove；
Laser ablation is carried out to the dielectric layer, removes remaining media layer；
The medium that laser ablation process remains on copper face is further removed by sandblasting process, so that the bottom core plate is in institute
The copper face for stating stepped groove slot bottom position is completely exposed；
The oxide layer on copper face is removed by microetch process；
Layers of copper by the bottom core plate in stepped groove slot bottom position etches away, and forms non-metallic stepped groove.
2. the production method of non-metallic stepped groove according to claim 1, which is characterized in that the top layer core plate is general
Logical material core plate, the bottom core plate are high frequency material core plate.
3. the production method of non-metallic stepped groove according to claim 1, which is characterized in that the thickness of the dielectric layer
For 0~3mil.
4. the production method of non-metallic stepped groove according to claim 3, which is characterized in that the dielectric layer included
The macromolecule resin of all solidstate, and coated by the macromolecule resin, the molding glass fabric of establishment.
5. the production method of non-metallic stepped groove according to claim 1, it is characterised in that: carried out to the dielectric layer
In the step of laser ablation, the laser used is carbon dioxide laser.
6. the production method of non-metallic stepped groove according to claim 1, it is characterised in that: by sandblasting process into one
In step removal laser ablation process the step of remaining in the medium on copper face, the gas that uses is the high pressure gas that is mixed with sandblasting powder
Body.
7. the production method of non-metallic stepped groove according to claim 6, which is characterized in that the sandblasting powder is three oxygen
Change two aluminium powders.
8. the production method of non-metallic stepped groove according to claim 1, which is characterized in that the aluminium oxide powder
The diameter at end is 5~10 μm.
9. the production method of non-metallic stepped groove according to claim 1, it is characterised in that: the non-metallic ladder
The equal no copper layer of side wall and slot bottom of slot.
10. a kind of PCB, including non-metallic stepped groove, which is characterized in that the stepped groove is according to claim 1 to 9 any institutes
The production method stated is made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201811353967.2A CN109219255A (en) | 2018-11-14 | 2018-11-14 | A kind of production method and PCB of non-metallic stepped groove |
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| CN201811353967.2A CN109219255A (en) | 2018-11-14 | 2018-11-14 | A kind of production method and PCB of non-metallic stepped groove |
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| CN109219255A true CN109219255A (en) | 2019-01-15 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110125808A (en) * | 2019-04-20 | 2019-08-16 | 无锡天杨电子有限公司 | A kind of ceramic copper-clad plate machinery removes the tooling and method of conversion zone |
| CN113973433A (en) * | 2020-07-24 | 2022-01-25 | 宏启胜精密电子(秦皇岛)有限公司 | Embedded circuit board and manufacturing method thereof |
| CN114916146A (en) * | 2022-05-05 | 2022-08-16 | 深圳明阳电路科技股份有限公司 | PCB manufacturing method and PCB |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007115987A (en) * | 2005-10-21 | 2007-05-10 | Toyota Motor Corp | Semiconductor device and method of assembling same |
| CN101188916A (en) * | 2006-11-17 | 2008-05-28 | 富葵精密组件(深圳)有限公司 | Method for making flexible circuit board with differential break structure |
| CN102349360A (en) * | 2009-01-09 | 2012-02-08 | At&S奥地利科技及系统技术股份公司 | Printed circuit board element having at least one laser beam stop element and method for producing a printed circuit board element |
| US20140264788A1 (en) * | 2013-03-18 | 2014-09-18 | Fujitsu Limited | High-frequency module |
| CN105764258A (en) * | 2016-04-22 | 2016-07-13 | 深圳崇达多层线路板有限公司 | Method of making step groove on PCB |
| CN106165131A (en) * | 2014-01-29 | 2016-11-23 | At&S奥地利科技与系统技术股份公司 | Method for producing circuit board |
| CN107529293A (en) * | 2017-09-18 | 2017-12-29 | 广东欧珀移动通信有限公司 | A kind of mobile terminal, multilayer PCB circuit board and its manufacture method |
| CN107835587A (en) * | 2017-09-11 | 2018-03-23 | 四川省华兴宇电子科技有限公司 | A kind of high-frequency microwave multilayer printed circuit blind slot and its manufacture craft |
| CN107949190A (en) * | 2017-10-20 | 2018-04-20 | 江门崇达电路技术有限公司 | A kind of manufacture craft of high drop ladder wiring board |
| CN108156769A (en) * | 2016-12-06 | 2018-06-12 | Ｊｘ金属株式会社 | Surface treatment copper foil, the copper foil with carrier, laminate, the manufacturing method of printed wiring board and e-machine manufacturing method |
-
2018
- 2018-11-14 CN CN201811353967.2A patent/CN109219255A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007115987A (en) * | 2005-10-21 | 2007-05-10 | Toyota Motor Corp | Semiconductor device and method of assembling same |
| CN101188916A (en) * | 2006-11-17 | 2008-05-28 | 富葵精密组件(深圳)有限公司 | Method for making flexible circuit board with differential break structure |
| CN102349360A (en) * | 2009-01-09 | 2012-02-08 | At&S奥地利科技及系统技术股份公司 | Printed circuit board element having at least one laser beam stop element and method for producing a printed circuit board element |
| US20140264788A1 (en) * | 2013-03-18 | 2014-09-18 | Fujitsu Limited | High-frequency module |
| CN106165131A (en) * | 2014-01-29 | 2016-11-23 | At&S奥地利科技与系统技术股份公司 | Method for producing circuit board |
| CN105764258A (en) * | 2016-04-22 | 2016-07-13 | 深圳崇达多层线路板有限公司 | Method of making step groove on PCB |
| CN108156769A (en) * | 2016-12-06 | 2018-06-12 | Ｊｘ金属株式会社 | Surface treatment copper foil, the copper foil with carrier, laminate, the manufacturing method of printed wiring board and e-machine manufacturing method |
| CN107835587A (en) * | 2017-09-11 | 2018-03-23 | 四川省华兴宇电子科技有限公司 | A kind of high-frequency microwave multilayer printed circuit blind slot and its manufacture craft |
| CN107529293A (en) * | 2017-09-18 | 2017-12-29 | 广东欧珀移动通信有限公司 | A kind of mobile terminal, multilayer PCB circuit board and its manufacture method |
| CN107949190A (en) * | 2017-10-20 | 2018-04-20 | 江门崇达电路技术有限公司 | A kind of manufacture craft of high drop ladder wiring board |
Non-Patent Citations (1)
| Title |
|---|
| 金鸿，陈森等: "《印刷电路技术》", 31 January 2004, 化学工业出版社 * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110125808A (en) * | 2019-04-20 | 2019-08-16 | 无锡天杨电子有限公司 | A kind of ceramic copper-clad plate machinery removes the tooling and method of conversion zone |
| CN113973433A (en) * | 2020-07-24 | 2022-01-25 | 宏启胜精密电子(秦皇岛)有限公司 | Embedded circuit board and manufacturing method thereof |
| CN113973433B (en) * | 2020-07-24 | 2023-08-18 | 宏启胜精密电子(秦皇岛)有限公司 | Built-in circuit board and manufacturing method thereof |
| CN114916146A (en) * | 2022-05-05 | 2022-08-16 | 深圳明阳电路科技股份有限公司 | PCB manufacturing method and PCB |
| CN114916146B (en) * | 2022-05-05 | 2024-05-17 | 深圳明阳电路科技股份有限公司 | PCB manufacturing method and PCB |
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Application publication date: 20190115 |