CN109192393A - A kind of preparation method and its product of spliced transparent conductive film electrode - Google Patents
A kind of preparation method and its product of spliced transparent conductive film electrode Download PDFInfo
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- CN109192393A CN109192393A CN201811037907.XA CN201811037907A CN109192393A CN 109192393 A CN109192393 A CN 109192393A CN 201811037907 A CN201811037907 A CN 201811037907A CN 109192393 A CN109192393 A CN 109192393A
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- conductive film
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
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Abstract
The present invention discloses a kind of spliced transparent conductive film electrode, which is characterized in that the spliced transparent conductive film electrode is set gradually from top to bottom: thin film electrode layer, glue-line, basal layer;If the thin film electrode layer is formed by the splicing of dry plate transparent conductive film, the splicing gap width between adjacent transparent conductive film is less than 2mm, splices and is filled with electrocondution slurry in gap, conducts so that can be fully achieved between transparent conductive film.The present invention, by the splicing to membrane electrode, enables film size further expansion in the case where not changing the preparation process of existing conductive film, and its preparation process is simple, can be realized scale of mass production.
Description
Technical field
The present invention relates to a kind of preparation method of transparent electrode more particularly to a kind of spliced transparent conductive film electrodes
Preparation method.
Background technique
Transparent electrode is a kind of with high transparency, while being believed again with the special electrode material of high conductivity in photon
The various fields such as breath technology, photoelectric technology, new energy and defense military are all widely used.With the development of science and technology, people
Requirement to electronic equipment it is higher and higher, electronic device starts to develop towards flexibility ultrathin, thus makes flexible transparent lead
Conductive film becomes the new lover of transparent electrode.Transparent conductive film is typically referred to the average saturating of visible light (380~780nm of wavelength)
Light rate is greater than the film that 80%, resistance is less than 10-3 Ω cm, due to itself translucency, electric conductivity and flexibility, transparent conductive film
It is widely used in the fields such as touch screen, display, smart window, light modulation film, electromagnetic shielding film.Currently on the market using at most saturating
Prescribed electrode is ito glass and ITO conductive film.
Since the preparation of this kind of material transparent electrode of ITO is usually to use magnetron sputtering, the methods of vacuum evaporation, to setting
Standby to require harshness, equipment manufacturing cost is very high;Secondly indium resource is rare, and the application of the following ITO electrode will be by phase in the long term
When big restriction;And ITO electrode resistance it is minimum can only achieve several ohm, it is higher not to be able to satisfy some conduction needs
Occasion.Therefore some novel transparent electrode materials have also been emerged in the market in recent years, wherein protrusion is electric macromolecule the most
Transparent electrode and nano metal grid transparent electrode.The electrode being coated with conducting polymer ink, cost is relatively low, preparation process letter
Single, only the more traditional ITO of electric conductivity is far short of what is expected, and the occasion competitive advantage not high for some pairs of conduction needs is obvious.And
Nano metal grid electrode, cost is equally matched with ITO, but electric conductivity be it is good compared with ITO very much, resistance can be down to bold and unconstrained Europe
Grade, this requires electronic product today of response speed, and nothing is suspected to have very big market.
No matter any transparent conductive film, to realize at present the large-sized electrode of high conductivity (surface resistance be lower than 30 Ω ∕
Volume production) all suffers from huge difficulty.Such as: for low-resistance ITO conductive film, once preparing area expansion, lead
Electric homogeneity has larger difference, and in addition the dosage of its target ability also can greatly increase, preparation cost and its high, generally also
It is difficult to realize market-oriented application;Such as: novel silver nanowires conductive film is coated on larger wide cut ruler due to its electrically conductive ink
Mobility in very little film substrate can generate significant difference, prepare area and be often also difficult to more than 1.2 meters;Such as: metal grill
Transparent conductive film, as a kind of high conductivity film, once accomplishing that wide cut is more than 80cm, yields can be can be greatly reduced, meeting
There is grid broken string, the defects of coming unglued, therefore does not have production, so general metal grill conductive film currently on the market
Bandpass is in 50cm or less.
Summary of the invention
In view of the above-mentioned problems, the present invention provides a kind of sides for preparing transparent conductive film electrode in the way of splicing
Method.This method can effectively expand the size of membrane electrode.
The present invention provides a kind of method that transparent conductive film electrode is prepared in the way of splicing, which includes
Following steps:
Step (1) cloth glue: one layer of joint adhesive is arranged in substrate, and guarantees that joint adhesive reaches complete tiling on substrate;
Step (2) splicing: if taking dry plate transparent conductive film, they are spliced into tiled arrangements on joint adhesive, electrically conducting transparent is thin
Splicing gap width between film is less than 2mm;
Step (3) fitting: utilizing make-up machine, deaeration machine, by heating, vacuumizing, add high pressure, the treatment process such as deaeration, so that
Completely tiling fitting between conductive film-joint adhesive-substrate three, between each layer without any bubble, fold, rise and fall the defects of;
Step (4) solidification: by heat treatment or UV processing mode, joint adhesive being fully cured, thus that conductive film is complete
It is fitted in substrate;
Step (5) joint filling: electrocondution slurry is inserted among splicing gap, solidifies electrocondution slurry, thus obtains spliced transparent
Conductive film electrode.
Preferably, splicing electrode can use two kinds of joint filling methods: one is dispensing joint filling, by dispenser by conductive paste
Material fills between gap, and electrocondution slurry is solidified;Another kind is silk-screen joint filling, and preparing width is that conductive film splices slit width
The silk printing screen version pattern of 1.5 ~ 10 times of degree is inserted electrocondution slurry among splicing gap by screen printing mode, and will be conductive
Slurry curing.
The present invention also provides a kind of spliced transparent conductive film electrodes, it is characterised in that the spliced electrically conducting transparent
Membrane electrode is set gradually from top to bottom: thin film electrode layer, glue-line, basal layer;If the thin film electrode layer is transparent by dry plate
Conductive film splicing is formed, and the splicing gap width between adjacent transparent conductive film is less than 2mm, is spliced and is filled in gap
Electrocondution slurry conducts so that can be fully achieved between transparent conductive film
Preferably, the joint adhesive that glue-line uses includes OCA optical cement, SCA optical cement, EVA glue, the combination of AB glue or aforementioned glue.
It is another preferably, basal layer use substrate include flexible and transparent substrate, rigid transparent substrates or aforementioned substrates
Combination.
It is an advantage of the current invention that in the case where not changing the preparation process of existing conductive film, by thin-film electro
The splicing of pole enables film size further expansion, and its preparation process is simple, can be realized scale of mass production.
Detailed description of the invention
Fig. 1 is the top view that embodiment 1 splices electrode.
Fig. 2 is that embodiment 1 splices the top view after electrode joint filling.
Fig. 3 is the top view that embodiment 2 splices electrode.
Fig. 4 is the side view that embodiment 2 splices electrode.
Specific embodiment
Embodiment 1
As shown in Figure 1, a kind of spliced transparent conductive film electrode, sets gradually: thin film electrode layer 2, glue-line, base from top to bottom
Bottom 1, three-decker fits closely.Thin film electrode layer 2 is formed by the splicing of two panels transparent conductive film, and adjacent transparent is conductive
3 width of splicing gap between film is less than 2mm.Splice in gap filled with electrocondution slurry (with such as figure after electrocondution slurry joint filling
3) it, is conducted so that can be fully achieved between transparent conductive film.
The joint adhesive that glue-line uses includes any combination of OCA optical cement, SCA optical cement, EVA glue, AB glue or aforementioned glue.
The substrate that basal layer uses includes the combination of flexible and transparent substrate, rigid transparent substrates or aforementioned substrates.
The method that transparent conductive film electrode is prepared in the way of splicing, is included the following steps:
1. cloth glue
The SCA glue film for cutting a 100cm*50cm is laid on same size or slightly large-sized glass, it is ensured that glue film
With glass alignment.
2. splicing
The nano silver grid transparent conductive film of two 50cm*50cm is taken, 125 μm of film thickness, they is aligned splicing and is arranged in SCA
On glue film, splicing gap width is less than 0.5mm.
3. fitting
The glass for arranging transparent conductive film is placed in make-up machine, hot pressing fitting is completed at 85 DEG C, then be transferred into de-
Bubble machine carries out vacuum defoamation processing, it is ensured that obtains splicing electrode, completely tile patch between conductive film-joint adhesive-substrate three
It closes, without any bubble between each layer, fold, the defects of rising and falling.
4. solidification
The electrode that will be bonded is placed in ultraviolet processing equipment, is irradiated 1min under the conditions of the energy density of 1200mj/cm2, is made
It obtains SCA glue to be fully cured, is thus completely bonded in conductive film on glass.
5. joint filling
Use special pattern for width 2mm, conductive silver paste is inserted by screen printing mode and spelled by the halftone of the rectangle of long 50cm
Among seam gap, dry 5min is thin to get the spliced electrically conducting transparent for having arrived 50cm*100cm at 170 μm of silk-screen film thickness, 110 DEG C
Membrane electrode.
Embodiment 2
As shown in Figure 3,4, a kind of spliced transparent conductive film electrode, sets gradually: thin film electrode layer 2, glue-line from top to bottom
4, basal layer 1, three-decker fit closely.Thin film electrode layer 2 is formed by four transparent conductive film splicings, adjacent transparent
3 width of splicing gap between conductive film is less than 2mm.Splice and be filled with electrocondution slurry in gap, so that transparent conductive film
Between can be fully achieved and conduct.
The method that transparent conductive film electrode is prepared in the way of splicing, is included the following steps:
1. cloth glue
The SCA glue film for cutting a 100cm*100cm, is laid on the PET film of same size, it is ensured that glue film and PET film
Alignment.
2. splicing
The nano silver grid transparent conductive film of four 50cm*50cm is taken, 125 μm of film thickness, they is aligned splicing and is arranged in SCA
On glue film, splicing gap width is less than 0.5mm.
3. fitting
The PET film for arranging transparent conductive film is placed in make-up machine, hot pressing fitting is completed at 85 DEG C, then be transferred into de-
Bubble machine carries out vacuum defoamation processing, it is ensured that obtains splicing electrode, completely tile patch between conductive film-joint adhesive-substrate three
It closes, without any bubble between each layer, fold, the defects of rising and falling.
4. solidification
The electrode that will be bonded is placed in ultraviolet processing equipment, is irradiated 1min under the conditions of the energy density of 1200mj/cm2, is made
It obtains SCA glue to be fully cured, is thus completely bonded in conductive film on glass.
5. joint filling
Use special pattern for width 2mm, the halftone of the rectangle of long 100cm is inserted conductive silver paste by screen printing mode
Splice among gap, dry 5min transparent leads at 170 μm of silk-screen thickness, 110 DEG C to get the spliced of 100cm*100cm has been arrived
Conductive film electrode.
Claims (7)
1. a kind of spliced transparent conductive film electrode, which is characterized in that the spliced transparent conductive film electrode on to
Under set gradually: thin film electrode layer, glue-line, basal layer;If the thin film electrode layer is to splice institute by dry plate transparent conductive film
It being formed, the splicing gap width between adjacent transparent conductive film is less than 2mm, and splice in gap and is disposed with electrocondution slurry, so that
It can be fully achieved and conduct between transparent conductive film.
2. spliced transparent conductive film electrode according to claim 1, which is characterized in that the joint adhesive packet that glue-line uses
Include any combination of OCA optical cement, SCA optical cement, EVA glue, AB glue or aforementioned glue.
3. spliced transparent conductive film electrode according to claim 1, which is characterized in that the substrate packet that basal layer uses
Include the combination of flexible and transparent substrate, rigid transparent substrates or aforementioned substrates.
4. a kind of method for preparing transparent conductive film electrode in the way of splicing, it is characterised in that the following steps are included:
Step (1) cloth glue: one layer of joint adhesive is arranged in substrate, and guarantees that joint adhesive reaches complete tiling on substrate;
Step (2) splicing: if taking dry plate transparent conductive film, they are spliced into tiled arrangements on joint adhesive, electrically conducting transparent is thin
Splicing gap width between film is less than 2mm;
Step (3) fitting: realize that completely tiling is pasted between conductive film-joint adhesive-substrate three using make-up machine, deaeration machine
It closes, between each layer the defects of bubble-free, fold, fluctuating;
Step (4) solidification: by heat treatment or UV processing mode, joint adhesive being fully cured, thus that conductive film is complete
It is fitted in substrate;
Step (5) joint filling: electrocondution slurry is inserted among splicing gap, and electrocondution slurry is solidified, is thus obtained spliced
Bright conductive film electrode.
5. preparation method as claimed in claim 4, which is characterized in that use dispensing joint filling, filled out electrocondution slurry by dispenser
Enter to splice among gap.
6. preparation method as claimed in claim 4, which is characterized in that use silk-screen joint filling, prepare silk printing screen version pattern, pass through silk
Net mode of printing inserts electrocondution slurry among splicing gap.
7. preparation method as claimed in claim 6, which is characterized in that silk printing screen version pattern width is that conductive film splices slit width
1.5 ~ 10 times of degree.
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN113625899A (en) * | 2021-08-20 | 2021-11-09 | 河源市汇亮鑫光电科技股份有限公司 | Method for preparing large-size touch screen functional sheet by using small screen printing plate |
TWI853161B (en) * | 2021-04-19 | 2024-08-21 | 洋華光電股份有限公司 | Method for manufacturing large-size touch sensing patterns by parallel connection |
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CN104992748A (en) * | 2015-06-16 | 2015-10-21 | 复旦大学 | Planar flexible electrode capable of being spliced and preparing method thereof |
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CN106887480A (en) * | 2017-04-13 | 2017-06-23 | 中节能太阳能科技(镇江)有限公司 | A kind of multi-disc splices efficient crystal silicon battery component |
CN107678587A (en) * | 2017-09-27 | 2018-02-09 | 深圳市骏达光电股份有限公司 | Touch sensitive layer and preparation method thereof |
CN207571722U (en) * | 2017-11-22 | 2018-07-03 | 创新维(深圳)电子有限公司 | Spliced capacitance touch screen |
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JP2011124188A (en) * | 2009-12-14 | 2011-06-23 | Fuji Electric Systems Co Ltd | Connection method of oxide superconductive wire |
CN102479843A (en) * | 2010-11-24 | 2012-05-30 | 吉富新能源科技(上海)有限公司 | Split type film solar battery composition structure |
CN104992748A (en) * | 2015-06-16 | 2015-10-21 | 复旦大学 | Planar flexible electrode capable of being spliced and preparing method thereof |
CN205404010U (en) * | 2016-03-04 | 2016-07-27 | 廖波 | Can splice pressure membrane |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI853161B (en) * | 2021-04-19 | 2024-08-21 | 洋華光電股份有限公司 | Method for manufacturing large-size touch sensing patterns by parallel connection |
CN113625899A (en) * | 2021-08-20 | 2021-11-09 | 河源市汇亮鑫光电科技股份有限公司 | Method for preparing large-size touch screen functional sheet by using small screen printing plate |
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Effective date of registration: 20220322 Address after: 100093 J-6, second floor, building 16, Yuquan Huigu, Tsinghua Science Park, No. 3 minzhuang Road, Haidian District, Beijing Patentee after: Beijing City Hongye Technology Co.,Ltd. Address before: No.285, Zhizhong Road, Qunying Industrial Zone, Yangzhong City, Zhenjiang City, Jiangsu Province, 212200 Patentee before: JIANGSU TIANGUAN CARBONE NANO MATERIALS CO.,LTD. |
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