CN109148333A - A kind of wafer separate device and method - Google Patents
A kind of wafer separate device and method Download PDFInfo
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- CN109148333A CN109148333A CN201810880065.8A CN201810880065A CN109148333A CN 109148333 A CN109148333 A CN 109148333A CN 201810880065 A CN201810880065 A CN 201810880065A CN 109148333 A CN109148333 A CN 109148333A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- Microelectronics & Electronic Packaging (AREA)
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Abstract
The present invention relates to technical field of semiconductors more particularly to a kind of wafer separate device and methods, applied to the bonded wafer for being bonded with the first wafer and the second wafer, wherein include: one first separation assembly and one second separation assembly；First separation assembly includes for fixing the first of the first wafer the fixed device, and the first moving cell for driving the first fixed device and the first wafer to be moved to a first direction；Second separation assembly includes for fixing the second of the second wafer the fixed device, and the second moving cell for driving the second fixed device and the second wafer to be moved to a second direction；Air knife formation component, if including dry gas stream export mouth, air-flow exports mouth and is arranged towards at the bonding of bonded wafer；Wherein, first direction and second direction are reversed each other；Can be avoided makes wafer damage and deformation during para-linkage wafer is separated, to guarantee the yield of product wafer.
Description
Technical field
The present invention relates to technical field of semiconductors more particularly to a kind of wafer separate device and methods.
Background technique
In current semiconductor technology, for the number for increasing chip, the bonding technology of wafer and wafer is core emphasis.
In wafer bond techniques, the alignment precision in the bonding gap and bonding that generate between wafer bonding is can not thoroughly solve two
Hang-up.
The bonding gap generated between wafer bonding, especially large-sized bonding gap can be broken in the grinding technics of rear end
Fall, causes wafer scratch to scrap, and influence normal product below.The alignment precision of wafer bonding can also seriously affect technique
Back segment be made, further will affect the connection of circuit, the yield of wafer can be reduced.
In current technical process, it will do it alignment precision after the completion of wafer bonding and measure and be bonded gap detection, such as
Fruit discovery wafer bonding alignment precision occurs deviating or there is very large-sized bonding gap, then is set using bonded wafer separation
The technique again of wafer is realized in standby just separation.
Current bonded wafer separation equipment passes through horse using the good wafer of upper and lower scroll chuck vacuum suction, then in a point
Up to the edge wedge-shaped plastic blade Intercalative binding wafer, bonded interface is admitted air into.Passing through motor control upper and lower scroll chuck
It is mobile to both direction, two wafers are pulled open, separation is completed.Due to being to be inserted directly into mooching knife using motor, often
It causes to scratch in the two panels crystal column surface of insertion, finally influences the yield of this partial region, kill effective chip, it may when serious
Wafer is caused to form unmodifiable deformation.
Summary of the invention
In view of the above-mentioned problems, the invention proposes a kind of wafer separate device, applied to being bonded with the first wafer and second
The bonded wafer of wafer, wherein include:
One first separation assembly and one second separation assembly；
First separation assembly includes the first fixation device for fixing first wafer, and for driving
State the first moving cell that the first fixed device and first wafer are moved to a first direction；
Second separation assembly includes the second fixation device for fixing second wafer, and for driving
State the second moving cell that the second fixed device and second wafer are moved to a second direction；
Air knife formation component, if including dry gas stream export mouth, the air-flow exports bonding of the mouth towards the bonded wafer
Place's setting；
Wherein, the first direction and the second direction are reversed each other.
Above-mentioned wafer separate device, wherein several air-flow output mouths are uniformly divided centered on the bonded wafer
The surrounding being distributed at the bonding of the bonded wafer.
Above-mentioned wafer separate device, wherein the quantity of the air-flow output mouth is 4.
Above-mentioned wafer separate device, wherein the air knife formation component further includes an air compressor, the air pressure
Contracting machine is connect with each air-flow output mouth, is exported for generating compressed air to each air-flow output mouth.
Above-mentioned wafer separate device, wherein the top of each air-flow output mouth is elongated, and width is 0.03~
0.07mm。
Above-mentioned wafer separate device, wherein first moving cell includes the first motor for generating power；With
And
Second moving cell includes the second motor for generating power.
Above-mentioned wafer separate device, wherein the first fixed device and/or the second fixed device are chuck.
A kind of wafer separate method, wherein include:
Step S1 provides the bonded wafer including one first wafer and one second wafer, and passes through one first fixed dress
Fixed first wafer is set, and passes through one second fixed fixed second wafer of device；
Step S2 provides an air knife formation component, and starts the air knife formation component, to pass through the air knife generation group
The air-flow output mouth of part forms the air knife for cutting at the bonding of the bonded wafer；
Step S3 provides one first moving cell and one second moving cell, and first moving cell is respectively started
With second moving cell, transported with driving described first to fix device and first wafer to the first direction
It is dynamic, and the described second fixed device and second wafer is driven to be moved to the second direction；
Step S4 continues the step S3, after first wafer and second wafer are kept completely separate, terminates；
Wherein, the first direction and the second direction are reversed each other.
Above-mentioned wafer separate method, wherein the air knife with a thickness of 0.03~0.07mm.
Above-mentioned wafer separate method, wherein the first fixed device and/or the second fixed device are chuck.
The utility model has the advantages that a kind of wafer separate device and method proposed by the present invention, can be avoided and carry out in para-linkage wafer
Make wafer damage and deformation during separation, to guarantee the yield of product wafer.
Detailed description of the invention
Fig. 1 is the structure principle chart of wafer separate device in one embodiment of the invention；
Fig. 2 is the step flow chart of wafer separate method in one embodiment of the invention.
Specific embodiment
Invention is further explained with reference to the accompanying drawings and examples.
Embodiment one
As shown in Figure 1, in a preferred embodiment, propose a kind of wafer separate device, applied to being bonded with
The bonded wafer 1 of one wafer 10 and the second wafer 20, wherein may include:
One first separation assembly 100 and one second separation assembly 200；
First separation assembly 100 includes for fixing the first of the first wafer 10 the fixed device 110, and for driving the
The first moving cell 120 that one fixed device 110 and the first wafer 10 are moved to a first direction；
Second separation assembly 200 includes for fixing the second of the second wafer 20 the fixed device 210, and for driving the
The second moving cell 220 that two fixed devices 210 and the second wafer 20 are moved to a second direction；
Air knife formation component, if including dry gas stream export mouth 310, air-flow exports mouth 310 towards at the bonding of bonded wafer 1
Setting；
Wherein, first direction and second direction are reversed each other.
In above-mentioned technical proposal, air-flow output mouth 310 is used to generate the air knife with cutting force, the formation basic theory of air knife
Are as follows: the big air-flow blast wind higher than tens times of surrounding air is formed by the geometry of Coanda effect principle and air knife
Curtain, i.e. the air-flow thin slice of speedy carding process；Coanda effect, i.e. fluid are changed to by leaving original flow direction with protrusion
The tendency of body surface flowing, when between fluid and body surface that it is flowed through there are when mantle friction, as long as curvature is little, stream
Know from experience and flowed along body surface, using this effect, by air-flow export mouth 310 be designed be obtained with it is expected
Air knife shape and effect；Preferably, first direction and second direction perpendicular to bonded wafer 1 bonding face, to provide maximum
Tensile stress the first wafer 10 and the second wafer 20 are pulled open；Air knife formation component can also include the air-flow for generating speedy carding process
Other component, details are not described herein.
In a preferred embodiment, if dry gas stream exports mouth 310 centered on bonded wafer 1, it is uniformly distributed in key
Surrounding at the bonding of synthetic circle 1, to make the reduction situation of the bonding force of bonded wafer 1 in wafer crystalline substance when forming air knife
It is uniform on circle 1.
In a preferred embodiment, the quantity of air-flow output mouth 310 can be 4, in other embodiments, may be used also
Air-flow to be other quantity exports mouth 310.
In a preferred embodiment, air knife formation component further includes an air compressor, air compressor and each
Air-flow exports mouth 310 and connects, and exports for generating compressed air to each air-flow output mouth 310.
In a preferred embodiment, the top of each air-flow output mouth is elongated, and width is 0.03~0.07mm
(millimeter), for example, can be 0.04mm or 0.045mm or 0.05mm or 0.055mm or 0.06mm etc..
In a preferred embodiment, the first moving cell 120 may include the first motor for generating power；With
And
Second moving cell 220 may include the second motor for generating power.
It can also include that auxiliary is transported in above-mentioned technical proposal, in the first moving cell 120 and the second moving cell 220
The linear movement mechanism of dynamic control, such as ball screw.
In a preferred embodiment, the first fixed device 110 and/or the second fixed device 210 can be chuck.
Embodiment two
As shown in Fig. 2, in a preferred embodiment, it is also proposed that a kind of wafer separate method, it can be using as above
Any wafer separate device, wherein may include:
Step S1 provides the bonded wafer including one first wafer and one second wafer, and passes through one first fixed dress
It sets and fixes the first wafer, and the second wafer is fixed by one second fixed device；
Step S2 provides an air knife formation component, and starts air knife formation component, to pass through the air-flow of air knife formation component
Output mouth forms the air knife for cutting at the bonding of bonded wafer；
Step S3 provides one first moving cell and one second moving cell, and the first moving cell and is respectively started
Two moving cells to drive the first fixed device and the first wafer to be moved to first direction, and drive the second fixed dress
It sets and is moved with the second wafer to second direction；
Step S4, continuation steps S3 then terminate after the first wafer and the second wafer are kept completely separate；
Wherein, first direction and second direction are reversed each other.
In above-mentioned technical proposal, first direction and second direction can be perpendicular to the bonding faces of bonded wafer, to provide
Maximum tensile stress pulls open the first wafer and the second wafer.
In a preferred embodiment, air knife with a thickness of 0.03~0.07mm, for example, can be 0.04mm,
Or 0.045mm or 0.05mm or 0.055mm or 0.06mm etc..
In a preferred embodiment, the first fixed device 110 and/or the second fixed device 210 can be chuck.
In conclusion a kind of wafer separate device proposed by the present invention, applied to being bonded with the first wafer and the second wafer
Bonded wafer, wherein include: one first separation assembly and one second separation assembly；First separation assembly includes for fixing
The fixed device of the first of first wafer, and for driving the first fixed device and the first wafer to be moved to a first direction
The first moving cell；Second separation assembly includes for fixing the second of the second wafer the fixed device, and for driving the
The second moving cell that two fixed devices and the second wafer are moved to a second direction；Air knife formation component, including it is several
Air-flow exports mouth, and air-flow exports mouth towards setting at the bonding of bonded wafer；Wherein, first direction and second direction are anti-each other
To；Can be avoided makes wafer damage and deformation during para-linkage wafer is separated, to guarantee the good of product wafer
Rate.
By description and accompanying drawings, the exemplary embodiments of the specific structure of specific embodiment are given, based on present invention essence
Mind can also make other conversions.Although foregoing invention proposes existing preferred embodiment, however, these contents are not intended as
Limitation.
For a person skilled in the art, after reading above description, various changes and modifications undoubtedly be will be evident.
Therefore, appended claims should regard the whole variations and modifications for covering true intention and range of the invention as.It is weighing
The range and content of any and all equivalences, are all considered as still belonging to the intent and scope of the invention within the scope of sharp claim.
Claims (10)
1. a kind of wafer separate device, applied to the bonded wafer for being bonded with the first wafer and the second wafer, which is characterized in that packet
It includes:
One first separation assembly and one second separation assembly；
First separation assembly includes for fixing the first of first wafer the fixed device, and for driving described the
The first moving cell that one fixed device and first wafer are moved to a first direction；
Second separation assembly includes for fixing the second of second wafer the fixed device, and for driving described the
The second moving cell that two fixed devices and second wafer are moved to a second direction；
Air knife formation component, if including dry gas stream export mouth, the air-flow exports mouth towards setting at the bonding of the bonded wafer
It sets；
Wherein, the first direction and the second direction are reversed each other.
2. wafer separate device according to claim 1, which is characterized in that several air-flow output mouths are with the bonding
Centered on wafer, the surrounding that is uniformly distributed at the bonding of the bonded wafer.
3. wafer separate device according to claim 1, which is characterized in that the quantity of the air-flow output mouth is 4.
4. wafer separate device according to claim 1, which is characterized in that the air knife formation component further includes an air
Compressor, the air compressor connect with each air-flow output mouth, export for generating compressed air to each described
Air-flow exports mouth.
5. wafer separate device according to claim 1, which is characterized in that the top of each air-flow output mouth is in length
Bar shaped, width are 0.03~0.07mm.
6. wafer separate device according to claim 1, which is characterized in that first moving cell includes for generating
First motor of power；And
Second moving cell includes the second motor for generating power.
7. wafer separate method according to claim 1, which is characterized in that the first fixed device and/or described the
Two fixed devices are chuck.
8. a kind of wafer separate method characterized by comprising
Step S1 provides the bonded wafer including one first wafer and one second wafer, and solid by one first fixed device
Fixed first wafer, and pass through one second fixed fixed second wafer of device；
Step S2 provides an air knife formation component, and starts the air knife formation component, to pass through the air knife formation component
The air-flow output mouth forms the air knife for cutting at the bonding of the bonded wafer；
Step S3 provides one first moving cell and one second moving cell, and first moving cell and institute is respectively started
The second moving cell is stated, to drive the described first fixed device and first wafer to be moved to the first direction, with
And the described second fixed device and second wafer is driven to be moved to the second direction；
Step S4 continues the step S3, after first wafer and second wafer are kept completely separate, terminates；
Wherein, the first direction and the second direction are reversed each other.
9. wafer separate method according to claim 8, which is characterized in that the air knife with a thickness of 0.03~
0.07mm。
10. wafer separate method according to claim 8, which is characterized in that the first fixed device and/or described the
Two fixed devices are chuck.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810880065.8A CN109148333A (en) | 2018-08-03 | 2018-08-03 | A kind of wafer separate device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810880065.8A CN109148333A (en) | 2018-08-03 | 2018-08-03 | A kind of wafer separate device and method |
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| Publication Number | Publication Date |
|---|---|
| CN109148333A true CN109148333A (en) | 2019-01-04 |
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ID=64791496
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810880065.8A Pending CN109148333A (en) | 2018-08-03 | 2018-08-03 | A kind of wafer separate device and method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118299298A (en) * | 2024-04-11 | 2024-07-05 | 芯慧联芯(苏州)科技有限公司 | Device and method for unlocking |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1221973A (en) * | 1997-12-26 | 1999-07-07 | 佳能株式会社 | Object separating apparatus and method, and method of manufacturing semiconductor substrate |
| US9362147B2 (en) * | 2008-10-29 | 2016-06-07 | SCREEN Holdings Co., Ltd. | Substrate treatment method |
-
2018
- 2018-08-03 CN CN201810880065.8A patent/CN109148333A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1221973A (en) * | 1997-12-26 | 1999-07-07 | 佳能株式会社 | Object separating apparatus and method, and method of manufacturing semiconductor substrate |
| US9362147B2 (en) * | 2008-10-29 | 2016-06-07 | SCREEN Holdings Co., Ltd. | Substrate treatment method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118299298A (en) * | 2024-04-11 | 2024-07-05 | 芯慧联芯(苏州)科技有限公司 | Device and method for unlocking |
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Application publication date: 20190104 |