CN109116879B - Temperature controller - Google Patents
Temperature controller Download PDFInfo
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- CN109116879B CN109116879B CN201811221945.0A CN201811221945A CN109116879B CN 109116879 B CN109116879 B CN 109116879B CN 201811221945 A CN201811221945 A CN 201811221945A CN 109116879 B CN109116879 B CN 109116879B
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- refrigerating
- tested
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- 238000010438 heat treatment Methods 0.000 claims abstract description 99
- 238000012360 testing method Methods 0.000 claims abstract description 83
- 238000002955 isolation Methods 0.000 claims abstract description 18
- 238000002788 crimping Methods 0.000 claims abstract description 10
- 238000001816 cooling Methods 0.000 claims description 28
- 238000005057 refrigeration Methods 0.000 claims description 17
- 230000006835 compression Effects 0.000 claims description 11
- 238000007906 compression Methods 0.000 claims description 11
- 238000003466 welding Methods 0.000 claims description 10
- 238000000926 separation method Methods 0.000 claims description 7
- 230000000149 penetrating effect Effects 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims description 5
- 230000005484 gravity Effects 0.000 claims description 3
- 238000001514 detection method Methods 0.000 abstract description 5
- 238000005259 measurement Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000012942 design verification Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/003—Environmental or reliability tests
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- Automation & Control Theory (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention belongs to the technical field of detection jigs, and discloses a temperature controller. The temperature controller comprises a heating component and a refrigerating component, wherein the heating component is positioned at one side of the element to be detected, and when the temperature controller heats, the heating component contacts with the element to be detected and starts heating; the refrigerating assembly is positioned at one side of the heating assembly far away from the element to be tested, and an isolation assembly is arranged between the heating assembly and the refrigerating assembly; when the heating component heats the element to be detected, the refrigerating component is isolated from the heating component through the isolating component; the driving assembly can be abutted against the refrigerating assembly and drives the refrigerating assembly to vertically move downwards to be in contact with the crimping assembly. The isolation component of the temperature controller can isolate the refrigerating component from the heating component, so that the testing accuracy of the element to be tested is ensured.
Description
Technical Field
The invention relates to the technical field of detection jigs, in particular to a temperature controller.
Background
With the rapid development of the semiconductor industry, the industries of designing, packaging, detecting and the like of electronic elements have wide application prospects. Especially in the field of chip detection, the testing device is particularly important as an essential detection jig for chip detection.
Because different kinds of chips are used according to different purposes, the chips are often in relatively high-temperature, low-temperature and normal-temperature environments in the normal use process. In order to ensure the accuracy of the test, the test device needs to simulate whether the chip can work normally or not in a high-temperature and low-temperature environment. Most of the existing testing devices can only provide high-temperature and low-temperature environments for chips independently, and users need to purchase two types of testing devices for refrigeration and heating at the same time, so that great economic burden is brought to the users. Although a small number of test devices can simultaneously meet two modes of high temperature and low temperature, as the refrigerating module and the heating module are in contact with each other, when the refrigerating module can influence the heating module in the high temperature mode, the measurement of the chip in the high temperature mode is interfered, the accuracy of the chip measurement is influenced, and the measurement precision is low.
Disclosure of Invention
The invention aims to provide a temperature controller which can provide high-temperature and low-temperature environments for performance test of an element to be tested and reduce the influence of a refrigerating assembly on a heating assembly in a high-temperature mode, thereby improving the measurement accuracy of the element to be tested.
To achieve the purpose, the invention adopts the following technical scheme:
A temperature controller, which comprises a main body,
A thermostat for providing a desired test temperature for an element to be tested, the thermostat comprising:
the heating component is positioned at one side of the element to be detected, and when the heating component is heated, the heating component is contacted with the element to be detected and starts heating;
The refrigerating assembly is positioned at one side of the heating assembly far away from the element to be tested, and an isolation assembly is arranged between the heating assembly and the refrigerating assembly;
During heating, the heating component is contacted with the element to be measured for heating, and the refrigerating component is separated from the heating component through the isolation component; when refrigerating, the heating component stops heating, the refrigerating component moves to one side of the heating component and contacts with the heating component, and the refrigerating component is started to realize refrigeration.
Preferably, the temperature controller further comprises:
A test socket for placing a component to be tested;
The crimping assembly is in contact with the heating assembly and is abutted against the element to be tested; the test socket is arranged right below the heating assembly, the top surface of the test socket is provided with a containing groove for containing the element to be tested, and the test socket is used for testing the performance of the element to be tested.
Preferably, the refrigerating assembly is supported above the heating assembly, the isolating assembly comprises a separating spring, the refrigerating assembly is pressed downwards during refrigeration, the separating spring is compressed by the refrigerating assembly in a downward movement mode, and the refrigerating assembly is in contact with the heating assembly.
Preferably, the temperature controller further comprises a driving assembly, wherein the driving assembly can be abutted to the refrigerating assembly and drives the refrigerating assembly to vertically move downwards to a position where the refrigerating assembly is in contact with the crimping assembly.
Preferably, the crimping assembly comprises a connecting plate, wherein a pressure head is convexly arranged in the direction of the connecting plate towards the accommodating groove, and the pressure head can extend into the accommodating groove and is abutted to the element to be tested.
Preferably, the temperature controller further comprises a test box, the pressure welding assembly further comprises a pressure welding pre-tightening piece arranged between the test box and the connecting plate, the pressure welding pre-tightening piece is an elastic piece, when the pressure welding assembly is abutted to the element to be tested, the pressure welding pre-tightening piece is compressed under the action of gravity of the test box, downward reaction force generated by the compression pre-tightening piece acts on the pressure head, and the pressure head is in close contact with the element to be tested.
Preferably, the pressure pre-tightening piece is a pressure spring, the pressure assembly further comprises a first bolt penetrating through the connecting plate and the test box, the pressure spring is sleeved on the first bolt and arranged between the connecting plate and the inner wall of the test box, and the connecting plate can vertically move up and down along the first bolt.
Preferably, the heating assembly comprises a heating plate, and a positioning groove for accommodating the heating plate is formed in the connecting plate.
Preferably, the cooling assembly comprises a cooling fin arranged above the connecting plate, a fan arranged on the side surface of the test box and a cooling fin, and the cooling fin is arranged inside the cooling fin and faces one side of the heating assembly;
And a heat conducting fin is arranged between the connecting plate and the radiating fin.
Preferably, the isolation assembly further comprises a second bolt penetrating through the connecting plate and the heat conducting fin, the separation spring is sleeved on the second bolt and arranged between the connecting plate and the heat conducting fin, and the heat conducting fin can vertically move up and down along the second bolt.
The invention has the beneficial effects that:
The temperature controller provided by the invention can provide high-temperature and low-temperature environments required by testing for the element to be tested, and can perform environment testing on the chip so as to verify the performance of the element to be tested in a high-temperature and low-temperature state. Meanwhile, when a high-temperature environment is required to be provided for the element to be tested, the isolation assembly can isolate the refrigerating assembly from the heating assembly, so that the refrigerating assembly is prevented from contacting with the heating assembly, the interference of the refrigerating assembly on the heating assembly in a high-temperature mode is avoided, the required test temperature and test accuracy of the element to be tested are ensured, and the measurement accuracy of the element to be tested is improved.
Drawings
FIG. 1 is a schematic view of a thermostat of the present invention;
FIG. 2 is a schematic view of a test box in the thermostat of the present invention;
FIG. 3 is an exploded view of a test case in the thermostat of the present invention;
Fig. 4 is a cross-sectional view of the thermostat of the present invention.
In the figure:
1. A test box; 2. a test socket; 3. a crimping assembly; 4. a heating assembly; 5. a refrigeration assembly; 6. an isolation assembly; 7. a drive assembly; 8. a sensor; 9. a heat conductive sheet; 10. a fixing seat;
11. positioning columns;
21. A receiving groove; 22. positioning holes;
31. A connecting plate; 32. a pressure head; 33. a pressure spring; 34. a first bolt;
41. A heating sheet;
51. A heat sink; 52. a cooling sheet; 53. a fan;
61. A separation spring; 62. a second bolt;
71. a screw; 72. a handle.
Detailed Description
In order to make the technical problems solved by the present invention, the technical solutions adopted and the technical effects achieved more clear, the technical solutions of the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to fall within the scope of the invention.
In the description of the present invention, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
In the present invention, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
The technical scheme of the invention is further described below by the specific embodiments with reference to the accompanying drawings.
The embodiment provides a temperature controller for providing a required test temperature of a component to be tested, for testing performance of the component to be tested in a laboratory or in a design verification stage of the component to be tested, as shown in fig. 1-3, the temperature controller comprises two major parts, one part is a test socket 2, the other part is a test box 1 located right above the test socket 2, and a compression joint assembly 3, a heating assembly 4, a refrigerating assembly 5, an isolation assembly 6 and a driving assembly 7 all arranged in the test box 1, a holding groove 21 for holding the component to be tested is arranged on the top surface of the test socket 2, the test socket 2 is used for testing performance of the component to be tested, and the component to be tested in the embodiment is a chip. The test box 1 is a box body with a cuboid structure and is used for supporting and accommodating the crimping assembly 3, the heating assembly 4, the refrigerating assembly 5, the isolation assembly 6 and the driving assembly 7, and integrating the five assemblies into a whole, so that the test box is compact in structure and convenient for a user to use and carry.
As shown in fig. 1-2, the bottom to top of the test box 1 is sequentially overlapped with the compression joint assembly 3, the heating assembly 4, the isolation assembly 6, the refrigeration assembly 5 and the driving assembly 7 from bottom to top, the heating assembly 4 is positioned at one side of the element to be tested, when heating, the heating assembly 4 contacts with the element to be tested and starts heating, the refrigeration assembly 5 is positioned at one side of the heating assembly 4 away from the element to be tested, and the isolation assembly 6 is arranged between the heating assembly 4 and the refrigeration assembly 5. Before testing, the compression joint assembly 3 is partially inserted into the accommodating groove 21 and abutted against the element to be tested, as shown in fig. 3, when the element to be tested needs to be provided with a high-temperature environment, the heating assembly 4 works to heat and transfer heat to the compression joint assembly 3, so that the test socket 2 can test the performance of the element to be tested in the high-temperature environment. At this time, the isolation component 6 is arranged between the heating component 4 and the refrigerating component 5, the refrigerating component 5 is isolated from the heating component 4 through the isolation component 6, the influence of the refrigerating component 5 on the heating component 4 in a high temperature mode is reduced, the required test temperature and test accuracy of the element to be tested are ensured, and the measurement accuracy of the element to be tested is improved; when the low-temperature environment is required to be provided for the element to be tested, the heating component 4 is stopped, meanwhile, the driving component 7 vertically penetrates through the top of the test box 1 downwards to move towards one side of the heating component 4 and abut against the refrigerating component 5, the driving component 7 drives the refrigerating component 5 to continuously vertically move downwards to the position contacting with the crimping component 3, and then the refrigerating component 5 is started, so that the refrigerating component 5 cools and dissipates heat for the element to be tested, and the test socket 2 is used for testing the performance of the element to be tested in the low-temperature environment.
The temperature controller provided by the embodiment can provide high-temperature and low-temperature environments required by the test for the element to be tested, and perform environment test on the chip so as to verify the performance of the element to be tested in a high-temperature and low-temperature state. Meanwhile, when a high-temperature environment is needed to be provided for the element to be tested, the isolation assembly 6 can isolate the refrigerating assembly 5 from the heating assembly 4, so that the refrigerating assembly 5 is prevented from contacting with the heating assembly 4, the interference of the refrigerating assembly 5 on the heating assembly 4 in a high-temperature mode is avoided, the required test temperature and test accuracy of the element to be tested are ensured, and the measurement accuracy of the element to be tested is improved.
As shown in fig. 3 to 4, the compression joint assembly 3 includes a connecting plate 31, a pressure head 32 and a pressure spring 33, the connecting plate 31 has a cuboid structure, one side of the connecting plate 31 is used for bearing the heating assembly 4 and supporting components located on the connecting plate 31, and the pressure head 32 is convexly arranged on the other side of the connecting plate 31, specifically, towards one side of the accommodating groove 21. The first bolt 34 is arranged on the inner wall of the connecting plate 31 and the testing box 1 in a penetrating way, the pressure spring 33 is sleeved on the first bolt 34 and arranged between the connecting plate 31 and the inner wall of the testing box 1, and the connecting plate 31 can vertically move up and down along the first bolt 34.
The pressure head 32 can stretch into the holding tank 21 and butt in the component that awaits measuring, compresses compression spring 33, and the compression spring 33 produces ascending effort and the downwardly directed reaction force to the connecting plate 31 production respectively to test box 1, and this downwardly directed reaction force has guaranteed the compactness of pressure head 32 and the contact of component that awaits measuring, prevents to appear the poor condition of contact between pressure head 32 and the component that awaits measuring to influence the test effect under high temperature environment. In addition to the pressure spring, an elastic rubber ring or other elastic component may be used as the compression pre-tightening component, and the first bolt 34 may not be provided in this design, and the position of the pressure spring may be limited by the slot, which is not limited by the specific structural form.
The connecting plate 31 and the pressure head 32 are of an integrated structure, and the connecting plate 31 and the pressure head 32 are made of metal copper, so that the heat conduction is achieved. After the pressing head 32 abuts against the element to be tested, the heating assembly 4 is enabled to transfer heat generated by heating to the element to be tested through the connecting plate 31 and the pressing head 32, so as to provide a high-temperature environment required by testing for the element to be tested.
In order to facilitate accurate positioning of the pressure head 32 and the accommodating groove 21, a plurality of positioning columns 11 penetrate through the test box 1, a plurality of positioning holes 22 are formed in the test socket 2 corresponding to the positioning columns 11, in this embodiment, the number of the positioning columns 11 and the number of the positioning holes 22 are four as an example, each positioning column 11 can be inserted into the corresponding positioning hole 22, and the positioning columns 11 and the positioning holes 22 are matched to play a role in positioning and guiding.
As shown in fig. 3 to 4, the heating assembly 4 specifically includes a heating plate 41 and a heating power line, wherein one end of the heating power line is connected to an external power source, and the other end of the heating power line is electrically connected to the heating plate 41. A positioning groove for accommodating the heating plate 41 is arranged on one side of the connecting plate 31, the heating plate 41 is specifically a ceramic heating plate, and when an external power supply is turned on, the heating plate 41 works and can generate heat. In order to be able to monitor the temperature of the component to be measured, the temperature controller further comprises a sensor 8 for detecting the temperature of the component to be measured, and one side of the connection plate 31 is provided with a recess for accommodating the sensor 8.
As shown in fig. 3-4, the cooling module 5 includes a heat sink 51 disposed above the connection plate 31, a fan 53 disposed on a side of the test box 1, and a cooling fin 52, where the cooling fin 52 is disposed inside the heat sink 51 and faces one side of the heating module 4. The cooling fin 52 is also called a thermoelectric semiconductor cooling component, peltier, the cooling fin 52 is a heat conducting patch, the cooling fin 52 has two sides, one side absorbs heat and the other side dissipates heat, but the cooling fin 52 itself does not generate cold. When the cooling fin 52 is powered on, the heat at the cold end of the cooling fin 52 is transferred to the hot end, resulting in a decrease in the temperature of the cold end and an increase in the temperature of the hot end, so that the heat around the device under test is extracted, and the heat is discharged through the cooling fin 51 and the fan 53, so as to provide a low-temperature environment required for testing the device under test.
Because the refrigeration component 5 is located right above the heating component 4, in order to facilitate the refrigeration component 5 to rapidly realize the cooling and heat dissipation of the element to be tested, a heat conducting fin 9 is further arranged between the connecting plate 31 and the heat radiating fin 51. The heat conducting fin 9 is made of metal copper material, has strong heat conducting property, and is convenient for transferring heat around the element to be tested to the refrigerating fin 52.
In order to reduce the interference of the refrigeration unit 5 on the heating unit 4, the isolation unit 6 specifically includes a separation spring 61 and a second bolt 62 penetrating the connection plate 31 and the heat conducting strip 9, the second bolt 62 connects the connection plate 31 and the heat conducting strip 9, the separation spring 61 is sleeved on the second bolt 62 and is disposed between the connection plate 31 and the heat conducting strip 9, and the heat conducting strip 9 can move along the second bolt 62. Under the action of the separating spring 61, a certain gap exists between the heat conducting fin 9 and the heating fin 41, when the heating fin 41 heats, heat is prevented from being transferred to the refrigerating assembly 5 through the heat conducting fin 9, heat dissipation is reduced, and therefore testing accuracy of the element to be tested in a high-temperature environment is guaranteed.
As shown in fig. 3-4, the driving assembly 7 includes a fixing seat 10 disposed at the top of the test box 1, a screw 71 and a handle 72, one end of the screw 71 is screwed to the fixing seat 10 and abuts against the top of the refrigeration assembly 5, and the other end of the screw 71 is provided with the handle 72. When the component to be tested needs to be tested in a low-temperature environment, an operator manually or pneumatically rotates the handle 72 to enable the screw 71 to be abutted against the top of the cooling fin 51, then continues to rotate the handle 72, the screw 71 continues to be abutted against the cooling fin 51 and pushes the cooling fin 52 and the heat conducting fin 9 to vertically move downwards, the separation spring 61 is compressed by the heat conducting fin 9 until the heat conducting fin 9 is in contact with the top surface of the connecting plate 31, and at the moment, the cooling fin 52 works to finish the test of the chip in the low-temperature environment. After the low temperature test is completed, the handle 72 is reversely rotated, and the heat conductive sheet 9, the cooling sheet 52 and the heat radiating sheet 51 are vertically moved upward by the compressed separating spring 61 to complete the resetting process for the next use.
The working process of the temperature controller provided by the embodiment is as follows:
When the high-temperature environment of the element to be tested is tested, the driving assembly pushes down the test box 1, the test box integrally moves downwards to extend the pressure head 32 into the accommodating groove 21 and is abutted against the element to be tested, the pressure spring 33 is compressed under the action of gravity of the test box 1, the compressed pressure spring 33 generates downward reaction force to the connecting plate 31, so that the pressure head 32 is in close contact with the element to be tested, a certain gap exists between the heat conducting fin 9 and the heating fin 41 under the action of the separating spring 61, and when the heating fin 41 works and can generate heat, the heat is prevented from being transferred to the refrigerating assembly 5 through the heat conducting fin 9, so that the element to be tested can perform performance test under the high-temperature environment.
When the low-temperature environment of the component to be tested is tested, after the pressure head 32 is abutted against the component to be tested, an operator manually or pneumatically rotates the handle 72 to enable the screw 71 to be abutted against the top of the radiating fin 51, then continues to rotate the handle 72, the screw 71 continues to be abutted against the radiating fin 51 and pushes the refrigerating fin 52 and the heat conducting fin 9 to vertically move downwards, the heat conducting fin 9 compresses the separating spring 61 until the heat conducting fin 9 is in contact with the top surface of the connecting plate 31, and at the moment, the refrigerating fin 52 works to finish the test of the chip in the low-temperature environment. After the low temperature test is completed, the handle 72 is reversely rotated, and the heat conductive sheet 9, the cooling sheet 52 and the heat radiating sheet 51 are vertically moved upward by the compressed separating spring 61 to complete the resetting process for the next use.
In the description herein, it should be understood that the terms "upper," "lower," "right," and the like are used for convenience in description and simplicity of operation only, and are not to be construed as limiting the invention, as the devices or elements referred to must have, be constructed or operated in a particular orientation. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for providing a special meaning.
In the description herein, reference to the term "one embodiment," "an example," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples.
Furthermore, the foregoing description of the preferred embodiments and the principles of the invention is provided herein. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, while the invention has been described in connection with the above embodiments, the invention is not limited to the embodiments, but may be embodied in many other equivalent forms without departing from the spirit or scope of the invention, which is set forth in the following claims.
Claims (7)
1. A thermostat for providing a desired test temperature for a component to be tested, the thermostat comprising:
the heating component (4) is positioned on one side of the element to be detected, and when the element to be detected is heated, the heating component (4) is contacted with the element to be detected and starts heating;
The device comprises a refrigerating component (5), wherein the refrigerating component (5) is positioned at one side of a heating component (4) far away from an element to be tested, and an isolation component (6) is arranged between the heating component (4) and the refrigerating component (5);
a test socket (2) for placing a component to be tested;
the crimping assembly (3) is in contact with the heating assembly (4), and the crimping assembly (3) is abutted against the element to be tested;
The refrigerating assembly (5) is supported above the heating assembly (4), the isolation assembly (6) comprises a separation spring (61), the refrigerating assembly (5) is pressed downwards during refrigeration, the refrigerating assembly (5) moves downwards to compress the separation spring (61), and the refrigerating assembly (5) is in contact with the heating assembly (6);
The driving assembly (7) can be abutted against the refrigerating assembly (5) and drives the refrigerating assembly (5) to vertically move downwards to a position contacted with the crimping assembly (3);
During heating, the heating component (4) is in contact with the element to be measured for heating, and the refrigerating component (5) is separated from the heating component (4) through the isolating component (6); when in refrigeration, the heating component stops heating, the refrigeration component (5) moves to one side of the heating component (4) and contacts with the heating component (4), and the refrigeration component (5) is started to realize refrigeration;
The compression joint assembly (3) comprises a connecting plate (31), and the refrigeration assembly (5) comprises radiating fins (51) arranged above the connecting plate (31); a heat conducting sheet (9) is arranged between the connecting plate (31) and the radiating fin (51); the connecting plate (31) is of a cuboid structure;
The isolation assembly (6) further comprises a second bolt (62) penetrating through the connecting plate (31) and the heat conducting fin (9), the separating spring (61) is sleeved on the second bolt (62) and arranged between the connecting plate (31) and the heat conducting fin (9), and the heat conducting fin (9) can vertically move up and down along the second bolt (62).
2. Temperature controller according to claim 1, characterized in that the test socket (2) is arranged directly under the heating assembly (4), the top surface of the test socket (2) is provided with a receiving groove (21) for receiving a component to be tested, and the test socket (2) is used for testing the performance of the component to be tested.
3. Temperature controller according to claim 2, characterized in that the connection plate (31) is provided with a protruding pressure head (32) towards the receiving groove (21), which pressure head (32) can extend into the receiving groove (21) and abut against the component to be tested.
4. A thermostat according to claim 3, characterized in that the thermostat further comprises a test box (1), the pressure welding assembly (3) further comprises a pressure welding pre-tightening piece arranged between the test box (1) and the connecting plate (31), the pressure welding pre-tightening piece is an elastic piece, when the pressure welding assembly (3) is abutted to the element to be tested, the pressure welding pre-tightening piece is compressed under the action of the gravity of the test box (1), the downward reaction force generated by the compression pre-tightening piece acts on the pressure head (32), and the pressure head (32) is in close contact with the element to be tested.
5. The temperature controller according to claim 4, wherein the pressure pre-tightening piece is a pressure spring (33), the pressure assembly (3) further comprises a first bolt (34) penetrating through the connecting plate (31) and the test box (1), the pressure spring (33) is sleeved on the first bolt (34) and is arranged between the connecting plate (31) and the inner wall of the test box (1), and the connecting plate (31) can vertically move up and down along the first bolt (34).
6. A thermostat according to claim 4, characterized in that the heating assembly (4) comprises a heating plate (41), and that the connection plate (31) is provided with a positioning groove for receiving the heating plate (41).
7. The temperature controller according to claim 6, wherein the cooling assembly (5) further comprises a fan (53) and a cooling plate (52) arranged on the side surface of the test box (1), and the cooling plate (52) is arranged inside the cooling plate (51) and faces to one side of the heating assembly (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811221945.0A CN109116879B (en) | 2018-10-19 | 2018-10-19 | Temperature controller |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811221945.0A CN109116879B (en) | 2018-10-19 | 2018-10-19 | Temperature controller |
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| Publication Number | Publication Date |
|---|---|
| CN109116879A CN109116879A (en) | 2019-01-01 |
| CN109116879B true CN109116879B (en) | 2024-09-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811221945.0A Active CN109116879B (en) | 2018-10-19 | 2018-10-19 | Temperature controller |
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| CN (1) | CN109116879B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110174247B (en) * | 2019-05-29 | 2024-07-09 | 深圳市亚派光电器件有限公司 | Optical device testing device |
| CN110261695A (en) * | 2019-06-12 | 2019-09-20 | 深圳市江波龙电子股份有限公司 | A kind of test device |
| CN113125934B (en) * | 2019-12-31 | 2023-02-10 | 深圳市江波龙电子股份有限公司 | Chip test circuit and chip test equipment |
| CN112283973A (en) * | 2020-10-16 | 2021-01-29 | 广东唯实生物技术有限公司 | Thermal control device and immunodiagnosis system |
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| CN112595921B (en) * | 2021-03-02 | 2021-05-18 | 天津金海通半导体设备股份有限公司 | High-low temperature testing device and method for electronic element |
| CN114252330A (en) * | 2021-11-10 | 2022-03-29 | 吉林省华控试验仪器有限责任公司 | Loading device |
| CN114077241B (en) * | 2021-11-24 | 2023-11-21 | 合肥启胜自动化科技有限公司 | Durability testing machine for temperature controller |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106909186A (en) * | 2015-10-16 | 2017-06-30 | 鸿劲科技股份有限公司 | Temperature control device and method for testing equipment splicer |
| CN208722062U (en) * | 2018-10-19 | 2019-04-09 | 苏州华兴源创科技股份有限公司 | A kind of temperature controller |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3611174B2 (en) * | 1998-03-30 | 2005-01-19 | オリオン機械株式会社 | Semiconductor wafer temperature test equipment |
| JP2002043381A (en) * | 2000-07-19 | 2002-02-08 | Tokyo Electron Ltd | Water temperature controller |
| CN1922501A (en) * | 2004-02-27 | 2007-02-28 | 威尔斯-Cti股份有限公司 | Aging testing apparatus and method |
| US7495458B2 (en) * | 2006-05-17 | 2009-02-24 | Texas Instruments Incorporated | Probe card and temperature stabilizer for testing semiconductor devices |
| CN203893956U (en) * | 2014-05-21 | 2014-10-22 | 索菲菲 | Testing and screening device for practical semiconductor refrigeration block |
| TW201809697A (en) * | 2016-06-24 | 2018-03-16 | 鴻勁科技股份有限公司 | Temperature control device for press-bonding unit of electronic component and testing device using the same capable of keeping the temperature difference between primary and secondary effect surfaces of a cooling chip within a better range |
-
2018
- 2018-10-19 CN CN201811221945.0A patent/CN109116879B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106909186A (en) * | 2015-10-16 | 2017-06-30 | 鸿劲科技股份有限公司 | Temperature control device and method for testing equipment splicer |
| CN208722062U (en) * | 2018-10-19 | 2019-04-09 | 苏州华兴源创科技股份有限公司 | A kind of temperature controller |
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