CN109005645A - A kind of production method of the double electric thick gold finger of PCB - Google Patents
A kind of production method of the double electric thick gold finger of PCB Download PDFInfo
- Publication number
- CN109005645A CN109005645A CN201811003191.1A CN201811003191A CN109005645A CN 109005645 A CN109005645 A CN 109005645A CN 201811003191 A CN201811003191 A CN 201811003191A CN 109005645 A CN109005645 A CN 109005645A
- Authority
- CN
- China
- Prior art keywords
- metal foil
- pcb
- gold finger
- thick gold
- electric thick
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The present invention provides a kind of production method of double electric thick gold finger of PCB, which comprises the following steps: metal foil and core plate arrange according to setting by S1.；S2. it is pressed by way of segmentation pressing；S3. the copper that sinks removes glue: including using plasma process, utilizing N2、CF4、O2Any one of three kinds of gas, temperature set 60-90 DEG C of time, 35-55min, except glue speed is 0.2-0.4mg/cm2；S4. plate face residue glue, asterism residue glue situation are checked, and carries out grinding process residue glue；S5. detection pressing quality: 288 DEG C thermal shock 6 times, every time 10 seconds without plate bursting phenomenon, without copper area without starved, core thickness is 0.05 ± 0.025mm；S6. electric thick gold finger；S7. gold finger lead is lost；S8. change gold.The production method of the double electric thick gold finger of PCB of the invention, it can effectively improve the interlayer heat resistance of PCB inner layers after pressing, the generation for effectively avoiding plate from sticking up has quality in excellent hole, impedance can satisfy the demand of a variety of electronic products, can effectively ensure that the gold of electric thick gold finger is thick.
Description
Technical field
The invention belongs to wiring board processing technique fields, and in particular to a kind of production method of the double electric thick gold finger of PCB.
Background technique
PCB is the major technique in high-end electronic devices.High-performance, high speed and light and handy characteristic in meeting the requirements,
A kind of multidisciplinary industry, in PCB product no matter rigidity, it is flexible, make major contribution for high-end electronic devices.PCB industry exists
Occupy very big status in electronics techniques.PCB is electronic component important in one, is applied to all electronic equipments, including
Electronic watch, calculator, or even computer, communication, have application in weapon system.PCB printed board can complete integrated circuit
Electric interconnection between element.Wherein design, documentation and the manufacture of printed board are the Developing Electronic Products of many large sizes
In, one of most important success factor.
In PCB manufacturing, the low DK material of high-frequency high-speed is more and more applied to the production of high-end PCB product, high to meet
The demand of PCB product, the especially pcb board in unmanned plane are held, is needed double electric thick gold golden finger (disconnected golden finger design), it is existing
It is not mature enough in technology for such design, needs to improve.
Summary of the invention
In view of this, the present invention provides a kind of production method of double electric thick gold finger of PCB, the double electricity of PCB of the invention
The production method of thick golden finger can effectively improve the interlayer heat resistance of PCB inner layers after pressing, effectively plate be avoided to stick up
Occur, there is quality in excellent hole, impedance can satisfy the demand of a variety of electronic products, can effectively ensure that electric thick gold finger
Gold it is thick.
The technical solution of the present invention is as follows: a kind of production method of the double electric thick gold finger of PCB, which is characterized in that including with
Lower step:
S1. metal foil and core plate arrange according to setting；
S2. it is pressed by way of segmentation pressing；
S3. the copper that sinks removes glue: including using plasma process, utilizing N2 、CF4、O2Any one of three kinds of gas, temperature setting
60-90 DEG C of time, 35-55min, except glue speed is 0.2-0.4mg/cm2；
S4. plate face residue glue, asterism residue glue situation are checked, and carries out grinding process residue glue；
S5. detection pressing quality: 288 DEG C thermal shock 6 times, every time 10 seconds without plate bursting phenomenon, without copper area without starved, core thickness is
0.05±0.025mm；
S6. electric thick gold finger；
S7. gold finger lead is lost；
S8. change gold.
Further, the PCB includes at least 2 layers of metal foil, 1 layer of core plate.
Further, the inside arrangement of the PCB is successively are as follows: metal foil, core plate, metal foil.
Further, the inside arrangement of the PCB is successively are as follows: metal foil, core plate, metal foil, PP layers, metal
Foil, core plate, metal foil.
Further, the inside arrangement of the PCB is successively are as follows: metal foil, core plate, metal foil, PP layers, metal
Foil, core plate, metal foil, PP layers, metal foil, core plate, metal foil.
Further, it is described segmentation pressing technique be using temperature-gradient method: 140 DEG C, 150 DEG C, 175 DEG C, 190 DEG C,
190 DEG C, 210 DEG C, 210 DEG C, 200 DEG C, 200 DEG C, 140 DEG C, every section of corresponding tonnage are 50 PSI, 100 PSI, 150
PSI, 380 PSI, 400 PSI, 400 PSI, 400 PSI, 400 PSI, 200 PSI, 200 PSI, every section of temperature is corresponding to be added
It is 2 min, 5 min, 3 min, 4 min, 8 min, 10 min, 83 min, 30 min, 40 min, 20 min between working hour.
Further, the core plate with a thickness of 0.05mm, described PP layers with a thickness of 0.05-0.1mm, the metal foil
With a thickness of 0.1-0.6mm.
Further, in the step S6, electric thick gold finger technique includes that lead is stamped to choosing plating oil, and 75 DEG C pre-baked
10min, then with the development of 6.0m/min speed；Whole plate pastes blue glue, will be printed on choosing plating ink placement indigo plant glue and is cut open with blade, this position
It is gold-plated to be set to golden finger position；Normal electric thick gold finger tears blue glue, and moves back in internal layer and select carburetion black.
Further, the thick golden finger with a thickness of 32-102U ".
Further, in the step S7, the erosion gold finger lead technique includes golden finger position windowing, other positions lid
Dry film protection, exposure guide rule 6-9 lattice, developing powder 3.5-5.2m/min；Alkali etching striping, etching speed: 3.2-4.8m/min,
Normally move back film 3.2-4.8m/min；It is anti-welding, and polish-brush is not opened in anti-pre-welding treatment.
Further, in the step S8, immersion process includes: character silk printing；Golden finger position lid choosingization dry film is plated,
In, pad pasting speed is 1.5-2.2m/min, and exposure energy presses exposure guide rule 5-9 lattice, developing powder 2.6-3.2m/min, 4 after development
Text is golden by converting after 100-130 DEG C of roasting 15-22min in hour.
The PCB with double electric thick gold finger obtained after present invention processing, has the following characteristics that
1. heat resistance: thermal shock after pressing is blistered without layering for Reflow Soldering 6 times, and heat resistance quality meets quality requirements；
2. plate is stuck up: slab warping degree requires≤0.75%；
3. quality in hole: PTH need to do plasma treatment, and plasma removes glue rate requirement 0.2-0.4mg/cm2, hole is thick, Kong Tongfu
It closes and requires, the bad phenomenons such as imperforate wall separation；
4. impedance: this material DK 3.6, impedance Data Design press 3.6, and production plate impedance value meets the requirements of the customers；
5. electric thick gold finger: the thick golden finger gold of double power-off is thick to be required: 32-102U ", survey golden thickness 33.62-41.13U " qualification.
The production method of the double electric thick gold finger of PCB of the invention can effectively improve the layer of PCB inner layers after pressing
Between heat resistance, the generation for effectively avoiding plate from sticking up has quality in excellent hole, and impedance can satisfy the need of a variety of electronic products
It asks, can effectively ensure that the gold of electric thick gold finger is thick.
Specific embodiment
Technical solution of the present invention is clearly and completely described below in conjunction with embodiment, it is clear that described reality
Applying example is only a part of the embodiment of the present invention, instead of all the embodiments.
Embodiment 1
A kind of production method of the double electric thick gold finger of PCB, which comprises the following steps:
S1. metal foil and core plate arrange according to setting；
S2. it is pressed by way of segmentation pressing；
S3. the copper that sinks removes glue: including using plasma process, utilizing N2, temperature 75 DEG C of times of setting, 40min, except glue speed is
0.3mg/cm2；
S4. plate face residue glue, asterism residue glue situation are checked, and carries out grinding process residue glue；
S5. detection pressing quality: 288 DEG C thermal shock 6 times, every time 10 seconds without plate bursting phenomenon, without copper area without starved, core thickness is
0.05±0.025mm；
S6. electric thick gold finger；
S7. gold finger lead is lost；
S8. change gold.
Further, the PCB includes at least 2 layers of metal foil, 1 layer of core plate.
Further, the inside arrangement of the PCB is successively are as follows: metal foil, core plate, metal foil, PP layers, metal
Foil, core plate, metal foil, PP layers, metal foil, core plate, metal foil.
Further, it is described segmentation pressing technique be using temperature-gradient method: 140 DEG C, 150 DEG C, 175 DEG C, 190 DEG C,
190 DEG C, 210 DEG C, 210 DEG C, 200 DEG C, 200 DEG C, 140 DEG C, every section of corresponding tonnage are 50 PSI, 100 PSI, 150
PSI, 380 PSI, 400 PSI, 400 PSI, 400 PSI, 400 PSI, 200 PSI, 200 PSI, every section of temperature is corresponding to be added
It is 2 min, 5 min, 3 min, 4 min, 8 min, 10 min, 83 min, 30 min, 40 min, 20 min between working hour.
Further, the core plate with a thickness of 0.05mm, described PP layers with a thickness of 0.75mm, the thickness of the metal foil
Degree is 0.3mm.
Further, in the step S6, electric thick gold finger technique includes that lead is stamped to choosing plating oil, and 75 DEG C pre-baked
10min, then with the development of 6.0m/min speed；Whole plate pastes blue glue, will be printed on choosing plating ink placement indigo plant glue and is cut open with blade, this position
It is gold-plated to be set to golden finger position；Normal electric thick gold finger tears blue glue, and moves back in internal layer and select carburetion black.
Further, the thick golden finger with a thickness of 62U ".
Further, in the step S7, the erosion gold finger lead technique includes golden finger position windowing, other positions lid
Dry film protection, 8 lattice of exposure guide rule, developing powder 4.2m/min；Alkali etching striping, etching speed: 4.0m/min normally moves back film
4.0m/min；It is anti-welding, and polish-brush is not opened in anti-pre-welding treatment.
Further, in the step S8, immersion process includes: character silk printing；Golden finger position lid choosingization dry film is plated,
In, pad pasting speed is 2m/min, and exposure energy presses 7 lattice of exposure guide rule, and developing powder 2.8m/min, text is pressed in 4 hours after development
Gold is converted after 120 DEG C of roasting 20min.
The PCB with double electric thick gold finger obtained after present invention processing, has the following characteristics that
1. heat resistance: thermal shock after pressing is blistered without layering for Reflow Soldering 6 times, and heat resistance quality meets quality requirements；
2. plate is stuck up: slab warping degree requires≤0.75%；
3. quality in hole: PTH need to do plasma treatment, and plasma removes glue rate requirement 0.2-0.4mg/cm2, hole is thick, Kong Tongfu
It closes and requires, the bad phenomenons such as imperforate wall separation；
4. impedance: this material DK 3.6, impedance Data Design press 3.6, and production plate impedance value meets the requirements of the customers；
5. electric thick gold finger: the thick golden finger gold of double power-off is thick to be required: 32-102U ", survey golden thickness 33.62-41.13U " qualification.
The production method of the double electric thick gold finger of PCB of the invention can effectively improve the layer of PCB inner layers after pressing
Between heat resistance, the generation for effectively avoiding plate from sticking up has quality in excellent hole, and impedance can satisfy the need of a variety of electronic products
It asks, can effectively ensure that the gold of electric thick gold finger is thick.
Embodiment 2
A kind of production method of the double electric thick gold finger of PCB, which comprises the following steps:
S1. metal foil and core plate arrange according to setting；
S2. it is pressed by way of segmentation pressing；
S3. the copper that sinks removes glue: including using plasma process, utilizing CF4, temperature 60 DEG C of times of setting, 35min removes glue speed
For 0.2mg/cm2；
S4. plate face residue glue, asterism residue glue situation are checked, and carries out grinding process residue glue；
S5. detection pressing quality: 288 DEG C thermal shock 6 times, every time 10 seconds without plate bursting phenomenon, without copper area without starved, core thickness is
0.05±0.025mm；
S6. electric thick gold finger；
S7. gold finger lead is lost；
S8. change gold.
Further, the PCB includes at least 2 layers of metal foil, 1 layer of core plate.
Further, the inside arrangement of the PCB is successively are as follows: metal foil, core plate, metal foil.
Further, the core plate with a thickness of 0.05mm, described PP layers with a thickness of 0.05mm, the thickness of the metal foil
Degree is 0.1mm.
Further, in the step S6, electric thick gold finger technique includes that lead is stamped to choosing plating oil, and 75 DEG C pre-baked
10min, then with the development of 6.0m/min speed；Whole plate pastes blue glue, will be printed on choosing plating ink placement indigo plant glue and is cut open with blade, this position
It is gold-plated to be set to golden finger position；Normal electric thick gold finger tears blue glue, and moves back in internal layer and select carburetion black.
Further, the thick golden finger with a thickness of 32U ".
Further, in the step S7, the erosion gold finger lead technique includes golden finger position windowing, other positions lid
Dry film protection, 6 lattice of exposure guide rule, developing powder 3.5m/min；Alkali etching striping, etching speed: 3.2m/min normally moves back film
3.2m/min；It is anti-welding, and polish-brush is not opened in anti-pre-welding treatment.
Further, in the step S8, immersion process includes: character silk printing；Golden finger position lid choosingization dry film is plated,
In, pad pasting speed is 1.5m/min, and exposure energy presses 5 lattice of exposure guide rule, developing powder 2.6m/min, text in 4 hours after development
It is golden by being converted after 100 DEG C of roasting 15min.
Embodiment 3
A kind of production method of the double electric thick gold finger of PCB, which comprises the following steps:
S1. metal foil and core plate arrange according to setting；
S2. it is pressed by way of segmentation pressing；
S3. the copper that sinks removes glue: including using plasma process, utilizing O2, temperature 90 DEG C of times of setting, 55min removes glue speed
For 0.4mg/cm2；
S4. plate face residue glue, asterism residue glue situation are checked, and carries out grinding process residue glue；
S5. detection pressing quality: 288 DEG C thermal shock 6 times, every time 10 seconds without plate bursting phenomenon, without copper area without starved, core thickness is
0.05±0.025mm；
S6. electric thick gold finger；
S7. gold finger lead is lost；
S8. change gold.
Further, the PCB includes at least 2 layers of metal foil, 1 layer of core plate.
Further, the inside arrangement of the PCB is successively are as follows: metal foil, core plate, metal foil, PP layers, metal
Foil, core plate, metal foil.
Further, the core plate with a thickness of 0.05mm, described PP layers with a thickness of 0.1mm, the thickness of the metal foil
Degree is 0.6mm.
Further, in the step S6, electric thick gold finger technique includes that lead is stamped to choosing plating oil, and 75 DEG C pre-baked
10min, then with the development of 6.0m/min speed；Whole plate pastes blue glue, will be printed on choosing plating ink placement indigo plant glue and is cut open with blade, this position
It is gold-plated to be set to golden finger position；Normal electric thick gold finger tears blue glue, and moves back in internal layer and select carburetion black.
Further, the thick golden finger with a thickness of 102U ".
Further, in the step S7, the erosion gold finger lead technique includes golden finger position windowing, other positions lid
Dry film protection, 9 lattice of exposure guide rule, developing powder 5.2m/min；Alkali etching striping, etching speed: 4.8m/min normally moves back film
4.8m/min；It is anti-welding, and polish-brush is not opened in anti-pre-welding treatment.
Further, in the step S8, immersion process includes: character silk printing；Golden finger position lid choosingization dry film is plated,
In, pad pasting speed is 2.2m/min, and exposure energy presses 9 lattice of exposure guide rule, developing powder 3.2m/min, text in 4 hours after development
It is golden by being converted after 130 DEG C of roasting 22min.
Experimental example
Interfacial bonding strength test.It is strong to metal foil and the combination of core plate, metal foil and PP interlayer using GB/T 5270-2005
Degree is tested, and steel ball burnishing experiment is carried out, and the results are shown in Table 1, carries out thermal shock experiment (300 DEG C) to PCB monomer,
Configuration of surface is observed, the results are shown in Table 2.
Table 1
| Experimental group | Embodiment 1 | Embodiment 2 | Embodiment 3 |
| Appearance | Surfacing, without bubbling | Surfacing, without bubbling | Surfacing, without bubbling |
Table 2
| Experimental group | Embodiment 1 | Embodiment 2 | Embodiment 3 |
| Appearance | Surfacing is removed, clast without bubbling, sheet | Surfacing is removed, clast without bubbling, sheet | Surfacing is removed, clast without bubbling, sheet |
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, and do not carrying on the back
In the case where from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter from which
From the point of view of a bit, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is wanted by appended right
Ask rather than above description limit, it is intended that by all changes that come within the meaning and range of equivalency of the claims
It is included within the present invention.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.It is noted that the technical characteristic being not described in detail in the present invention, can pass through this
Field any prior art is realized.
Claims (10)
1. a kind of production method of the double electric thick gold finger of PCB, which comprises the following steps:
S1. metal foil and core plate arrange according to setting；
S2. it is pressed by way of segmentation pressing；
S3. the copper that sinks removes glue: including using plasma process, utilizing N2、CF4、O2Any one of three kinds of gas, temperature setting
60-90 DEG C of time, 35-55min, except glue speed is 0.2-0.4mg/cm2；
S4. plate face residue glue, asterism residue glue situation are checked, and carries out grinding process residue glue；
S5. detection pressing quality: 288 DEG C thermal shock 6 times, every time 10 seconds without plate bursting phenomenon, without copper area without starved, core thickness is
0.05±0.025mm；
S6. electric thick gold finger；
S7. gold finger lead is lost；
S8. change gold.
2. a kind of production method of the double electric thick gold finger of PCB according to claim 1, which is characterized in that the PCB packet
Include at least 2 layers of metal foil, 1 layer of core plate.
3. a kind of production method of the double electric thick gold finger of PCB according to claim 2, which is characterized in that the PCB's
Internal arrangement is successively are as follows: metal foil, core plate, metal foil.
4. a kind of production method of the double electric thick gold finger of PCB according to claim 2, which is characterized in that the PCB's
Internal arrangement is successively are as follows: metal foil, core plate, metal foil, PP layers, metal foil, core plate, metal foil.
5. a kind of production method of the double electric thick gold finger of PCB according to claim 2, which is characterized in that the PCB's
Internal arrangement is successively are as follows: metal foil, core plate, metal foil, PP layers, metal foil, core plate, metal foil, PP layers, metal foil, core
Plate, metal foil.
6. a kind of production method of the double electric thick gold finger of PCB according to claim 5, which is characterized in that the segmentation
The technique of pressing is using temperature-gradient method: 140 DEG C, 150 DEG C, 175 DEG C, 190 DEG C, 190 DEG C, 210 DEG C, 210 DEG C, 200 DEG C, 200
DEG C, 140 DEG C, every section of corresponding tonnage is 50 PSI, 100 PSI, 150 PSI, 380 PSI, 400 PSI, 400 PSI,
400 PSI, 400 PSI, 200 PSI, 200 PSI, every section of temperature corresponding process time are 2 min, 5 min, 3 min, 4
min、8 min、10 min、83 min、30 min、40 min、20 min。
7. according to a kind of described in any item production methods of the double electric thick gold finger of PCB of claim 4-6, which is characterized in that
The core plate with a thickness of 0.05mm, described PP layers with a thickness of 0.05-0.1mm, the metal foil with a thickness of 0.1-
0.6mm。
8. a kind of production method of the double electric thick gold finger of PCB according to claim 1, which is characterized in that the step
In S6, electric thick gold finger technique includes that lead is stamped to choosing plating oil, 75 DEG C of pre-baked 10min, then with the development of 6.0m/min speed；
Whole plate pastes blue glue, will be printed on choosing plating ink placement indigo plant glue and is cut open with blade, this position is that golden finger position is gold-plated；Normal electric thick gold hand
Refer to, tears blue glue, and move back in internal layer and select carburetion black.
9. a kind of production method of the double electric thick gold finger of PCB according to claim 1, which is characterized in that the step
In S7, the erosion gold finger lead technique includes golden finger position windowing, the protection of other positions lid dry film, exposure guide rule 6-9 lattice, development
Speed 3.5-5.2m/min；Alkali etching striping, etching speed: 3.2-4.8m/min normally moves back film 3.2-4.8m/min；It is anti-
Weldering, and polish-brush is not opened in anti-pre-welding treatment.
10. a kind of production method of the double electric thick gold finger of PCB according to claim 1, which is characterized in that the step
In S8, immersion process includes: character silk printing；Plate golden finger position lid choosingization dry film, wherein pad pasting speed is 1.5-2.2m/min,
Exposure energy presses exposure guide rule 5-9 lattice, and developing powder 2.6-3.2m/min, text presses 100-130 DEG C of roasting 15- in 4 hours after development
Gold is converted after 22min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811003191.1A CN109005645A (en) | 2018-08-30 | 2018-08-30 | A kind of production method of the double electric thick gold finger of PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811003191.1A CN109005645A (en) | 2018-08-30 | 2018-08-30 | A kind of production method of the double electric thick gold finger of PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109005645A true CN109005645A (en) | 2018-12-14 |
Family
ID=64592613
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811003191.1A Pending CN109005645A (en) | 2018-08-30 | 2018-08-30 | A kind of production method of the double electric thick gold finger of PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109005645A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111065210A (en) * | 2019-12-25 | 2020-04-24 | 上海嘉捷通电路科技股份有限公司 | Method for replacing manual PCB (printed circuit board) process lead wire picking |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090308647A1 (en) * | 2008-06-11 | 2009-12-17 | Advanced Semiconductor Engineering, Inc. | Circuit board with buried conductive trace formed thereon and method for manufacturing the same |
| CN102497736A (en) * | 2011-12-07 | 2012-06-13 | 苏州日月明微电子科技有限公司 | Manufacturing process for printed circuit board |
| CN102802367A (en) * | 2012-08-06 | 2012-11-28 | 深圳崇达多层线路板有限公司 | Multilayer board manufacturing method for improving bonding force of hole wall of PTH slot |
| CN104812157A (en) * | 2014-01-23 | 2015-07-29 | 深圳崇达多层线路板有限公司 | Power supply printed circuit board and processing method thereof |
| CN107278062A (en) * | 2017-07-20 | 2017-10-20 | 胜宏科技（惠州）股份有限公司 | A kind of high frequency board manufacturing method of different plate mixed pressures |
| CN107318231A (en) * | 2017-07-20 | 2017-11-03 | 深圳明阳电路科技股份有限公司 | A kind of preparation method of golden finger, printed wiring board |
| CN107666775A (en) * | 2017-10-09 | 2018-02-06 | 台山市精诚达电路有限公司 | The preparation method of multilayer soft board |
| CN108200736A (en) * | 2017-12-04 | 2018-06-22 | 深圳崇达多层线路板有限公司 | A kind of production method that pressing is avoided to fill not full PCB |
| CN108323011A (en) * | 2018-01-25 | 2018-07-24 | 深圳崇达多层线路板有限公司 | A kind of production method of multilayer Teflon wiring board |
| CN108401381A (en) * | 2018-02-27 | 2018-08-14 | 深圳崇达多层线路板有限公司 | A kind of production method of disconnecting golden finger class printed circuit board |
-
2018
- 2018-08-30 CN CN201811003191.1A patent/CN109005645A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090308647A1 (en) * | 2008-06-11 | 2009-12-17 | Advanced Semiconductor Engineering, Inc. | Circuit board with buried conductive trace formed thereon and method for manufacturing the same |
| CN102497736A (en) * | 2011-12-07 | 2012-06-13 | 苏州日月明微电子科技有限公司 | Manufacturing process for printed circuit board |
| CN102802367A (en) * | 2012-08-06 | 2012-11-28 | 深圳崇达多层线路板有限公司 | Multilayer board manufacturing method for improving bonding force of hole wall of PTH slot |
| CN104812157A (en) * | 2014-01-23 | 2015-07-29 | 深圳崇达多层线路板有限公司 | Power supply printed circuit board and processing method thereof |
| CN107278062A (en) * | 2017-07-20 | 2017-10-20 | 胜宏科技（惠州）股份有限公司 | A kind of high frequency board manufacturing method of different plate mixed pressures |
| CN107318231A (en) * | 2017-07-20 | 2017-11-03 | 深圳明阳电路科技股份有限公司 | A kind of preparation method of golden finger, printed wiring board |
| CN107666775A (en) * | 2017-10-09 | 2018-02-06 | 台山市精诚达电路有限公司 | The preparation method of multilayer soft board |
| CN108200736A (en) * | 2017-12-04 | 2018-06-22 | 深圳崇达多层线路板有限公司 | A kind of production method that pressing is avoided to fill not full PCB |
| CN108323011A (en) * | 2018-01-25 | 2018-07-24 | 深圳崇达多层线路板有限公司 | A kind of production method of multilayer Teflon wiring board |
| CN108401381A (en) * | 2018-02-27 | 2018-08-14 | 深圳崇达多层线路板有限公司 | A kind of production method of disconnecting golden finger class printed circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111065210A (en) * | 2019-12-25 | 2020-04-24 | 上海嘉捷通电路科技股份有限公司 | Method for replacing manual PCB (printed circuit board) process lead wire picking |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104244612B (en) | A kind of method that plated through-hole is made on PTFE circuit boards | |
| WO2013097480A1 (en) | Fabrication process of stepped circuit board | |
| CN104284520B (en) | A kind of PCB surface processing method | |
| WO2018006527A1 (en) | Method for manufacturing a cover film-protected, gold-electroplated and component-inbuilt pcb board | |
| KR20070052965A (en) | High density printed circuit board and manufacturing method thereof | |
| CN104185377A (en) | Fine-line PCB manufacturing method | |
| CN106993378A (en) | A kind of pcb board selective surface handling process | |
| CN107660069A (en) | A kind of PCB plate production method with half bore | |
| CN102673053A (en) | Copper-clad plate, printed circuit plate and manufacturing method thereof | |
| CN101938885A (en) | The manufacture method of printed circuit board (PCB) and the printed circuit board (PCB) that utilizes this method to make | |
| CN104302110A (en) | Method for producing keyboard circuit board | |
| CN111212528A (en) | Method for manufacturing multilayer printed circuit board | |
| CN101494957A (en) | Method and substrate for producing multi-layer circuit board | |
| CN109005645A (en) | A kind of production method of the double electric thick gold finger of PCB | |
| CN104159392A (en) | Printed circuit board and preparation method thereof | |
| CN105307425A (en) | Blind and buried via rigid-flex board production process | |
| CN103857176A (en) | Circuit board and manufacture method for the same | |
| TWI656819B (en) | Flexible circuit board manufacturing method | |
| CN112752443A (en) | Processing method of printed circuit board with step position containing bonding structure | |
| CN103144378A (en) | Copper-clad plate (CCL) and printed circuit board (PCB) of phenol novolac (PN) curing system and manufacturing method thereof | |
| CN106793588A (en) | Wiring board and preparation method thereof | |
| CN111343790B (en) | PCB soft and hard combination process | |
| CN106793581B (en) | Multilayer N+N folds structure circuit board pressing localization method | |
| CN100459828C (en) | Printing circuit board | |
| KR100993318B1 (en) | Method for manufacturi ng flying tail type rigid-flexible printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 510000 No. 22, Ying Ying Road, Guangzhou Free Trade Zone, Guangdong Applicant after: Guangzhou Guanghe Technology Co., Ltd Address before: 510000 No. 22, Ying Ying Road, Guangzhou Free Trade Zone, Guangdong Applicant before: DELTON TECHNOLOGY (GUANGZHOU) Inc. |
|
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181214 |