CN108988625A - Integrated structure of drive controller, drive controller and air conditioner - Google Patents
Integrated structure of drive controller, drive controller and air conditioner Download PDFInfo
- Publication number
- CN108988625A CN108988625A CN201810640360.6A CN201810640360A CN108988625A CN 108988625 A CN108988625 A CN 108988625A CN 201810640360 A CN201810640360 A CN 201810640360A CN 108988625 A CN108988625 A CN 108988625A
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- pin
- module
- pfc
- control device
- drive control
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- 239000000758 substrate Substances 0.000 claims abstract description 26
- 239000000463 material Substances 0.000 claims description 12
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 12
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 12
- 238000001514 detection method Methods 0.000 claims description 10
- 229910017083 AlN Inorganic materials 0.000 claims description 9
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 9
- 238000001914 filtration Methods 0.000 claims description 9
- 239000003990 capacitor Substances 0.000 claims description 8
- 238000004378 air conditioning Methods 0.000 claims description 7
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 239000013078 crystal Substances 0.000 claims 1
- 238000012937 correction Methods 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 229910052593 corundum Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012806 monitoring device Methods 0.000 description 2
- 229910001845 yogo sapphire Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 229910003978 SiClx Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/42—Circuits or arrangements for compensating for or adjusting power factor in converters or inverters
- H02M1/4208—Arrangements for improving power factor of AC input
- H02M1/4233—Arrangements for improving power factor of AC input using a bridge converter comprising active switches
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/89—Arrangement or mounting of control or safety devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B70/00—Technologies for an efficient end-user side electric power management and consumption
- Y02B70/10—Technologies improving the efficiency by using switched-mode power supplies [SMPS], i.e. efficient power electronics conversion e.g. power factor correction or reduction of losses in power supplies or efficient standby modes
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Rectifiers (AREA)
Abstract
The application relates to an integrated structure of a drive controller, the drive controller and an air conditioner, wherein the integrated structure comprises a substrate, a rectifier module, a Power Factor Correction (PFC) module and an Intelligent Power Module (IPM); the rectifier module, the PFC module and the IPM are all arranged on the substrate; the substrate comprises an alternating current power supply input pin, a direct current output pin, a PFC input pin, an alternating current power supply output pin, a PFC module driving pin and an IPM driving pin; the alternating current power supply input pin and the direct current output pin are respectively connected with the rectification module; the PFC input pin and the PFC module driving pin are respectively connected with the PFC module; the alternating current power supply output pin, the IPM driving pin and the PFC module are respectively connected with the IPM. By adopting the technical scheme, the size of the driving controller can be reduced.
Description
Technical field
This application involves frequency conversion control technique fields, and in particular to a kind of integrated morphology of drive control device, drive control
Device and air-conditioning.
Background technique
The drive control device of convertible frequency air-conditioner is inputted using AC power source, rectified, power factor correction (Power Factor
Correction, PFC), control compressor operation after inversion.There is bridge interleaved PFC drive control device to be most widely used at present,
It includes three rectification module, PFC module, intelligent power module (Intelligent Power Module, IPM) modules.
But need to be respectively set above three module in the drive control device, it is independent that setting is required in drive control device
Space so that above three module is arranged, and the volume of each module is relatively large, so that the volume of drive control device is larger.
Summary of the invention
To be overcome the problems, such as present in the relevant technologies at least to a certain extent, the application provides a kind of drive control device
Integrated morphology, drive control device and air-conditioning.
According to the embodiment of the present application in a first aspect, provide a kind of integrated morphology of drive control device, including substrate, rectification
Module, PFC PFC module and intelligent power module；
The rectification module, the PFC module and the IPM are respectively provided on the substrate；
The substrate include AC power source input pin, direct current output pin, PFC input pin, AC power source output draw
Foot, PFC module driving pin and IPM drive pin；
The AC power source input pin and the direct current output pin are connected with the rectification module respectively；
The PFC input pin and PFC module driving pin are connected with the PFC module respectively；
The AC power source output pin, IPM driving pin and the PFC module are connected with the IPM respectively.
Further, the integrated morphology of drive control device described above further includes temperature detecting module；The substrate is also
Including temperature detection pin；
The temperature detecting module is connected with the temperature detection pin.
Further, in the integrated morphology of drive control device described above, the temperature detecting module is using negative temperature
Coefficient NTC thermistor is spent to realize.
Further, in the integrated morphology of drive control device described above, the transistor in the PFC module uses carbon
SiClx SiC material is made.
Further, in the integrated morphology of drive control device described above, the transistor in the IPM uses silicon carbide
SiC material is made.
It further, further include radiating bottom plate in the integrated morphology of drive control device described above；
The substrate is arranged on the radiating bottom plate.
Further, in the integrated morphology of drive control device described above, the radiating bottom plate uses aluminium nitride AlN material
Material is made.
According to the second aspect of the embodiment of the present application, a kind of drive control device, including driving signal generating device, filter are provided
Wave device, storage capacitor and integrated morphology as described above；
The PFC module driving pin and IPM driving pin are connected with the driving signal generating device respectively；
The direct current output pin is connected with the filtering device；
The PFC module is connected by the filtering device with the IPM.
Further, drive control device described above, which is characterized in that the filtering device uses inductance and/or DC-
Link capacitor is realized.
According to the third aspect of the embodiment of the present application, a kind of air-conditioning, including compressor and driving control as described above are provided
Device processed；
The drive control device is connected with the compressor.
Integrated morphology, drive control device and the air-conditioning of the drive control device of the application, by the way that alternating current is arranged on substrate
Source input pin, direct current output pin, PFC input pin, AC power source output pin, PFC module driving pin and IPM driving
Pin, and rectification module, PFC module and IPM are arranged on substrate, make AC power source input pin and direct current output pin
It is connected respectively with rectification module, PFC input pin and PFC module driving pin are connected with PFC module respectively, AC power source output
Pin, IPM driving pin and PFC module are connected with IPM respectively, realize rectification module, PFC module and IPM is integrally disposed.
Using the technical solution of the application, the volume of drive control device can be reduced.
It should be understood that above general description and following detailed description be only it is exemplary and explanatory, not
The application can be limited.
Detailed description of the invention
The drawings herein are incorporated into the specification and forms part of this specification, and shows the implementation for meeting the application
Example, and together with specification it is used to explain the principle of the application.
Fig. 1 is the structural schematic diagram of the integrated morphology embodiment of the drive control device of the application；
Fig. 2 is the topological diagram of the integrated morphology of drive control device in Fig. 1；
Fig. 3 is the outside drawing of the integrated morphology of the drive control device of this implementation；
Fig. 4 is Al under identical calorific value2O3With AlN temperature rise comparison diagram；
Fig. 5 is SiC and the reversed turn-off power loss comparison diagram of Si.
Specific embodiment
Example embodiments are described in detail here, and the example is illustrated in the accompanying drawings.Following description is related to
When attached drawing, unless otherwise indicated, the same numbers in different drawings indicate the same or similar elements.Following exemplary embodiment
Described in embodiment do not represent all embodiments consistent with the application.On the contrary, they be only with it is such as appended
The example of the consistent device and method of some aspects be described in detail in claims, the application.
Fig. 1 is the structural schematic diagram of the integrated morphology embodiment of the drive control device of the application, and Fig. 2 is that control is driven in Fig. 1
The topological diagram of the integrated morphology of device processed.As depicted in figs. 1 and 2, the integrated morphology of the drive control device of the present embodiment includes substrate
10, rectification module 11, PFC (Power Factor Correction, PFC) module 12 and intelligent power module
(Intelligent Power Module, IPM) 13.Wherein, rectification module 11, PFC module 12 and IPM13 are arranged at substrate
On 10；Substrate 10 includes AC power source input pin 101, direct current output pin B, PFC input pin 102, AC power source output
Pin 103, PFC module driving pin 104 and IPM drive pin 105.In the present embodiment, AC power source input pin 101 and straight
Stream output pin B is connected with rectification module 11 respectively；PFC input pin 102 and PFC module driving pin 104 respectively with PFC mould
Block 12 is connected；AC power source output pin 103, IPM driving pin 105 and PFC module 12 are connected with IPM13 respectively.For example, handing over
Stream power input pin 101 may include the sub- pin L2 of the input of the sub- pin L1 of the first input and second；PFC input pin 102 can
To include that the first PFC inputs the sub- pin B2 of sub- pin B1 and the 2nd PFC input；AC power source output pin 103 may include
The sub- pin U of one output, the sub- pin V of the second output and third export sub- pin W；It may include first that PFC module, which drives pin 104,
The son driving of driving pin G1 and second pin G2；IPM driving pin 105 may include third driving pin G3, the 4th son
Drive pin G4, the 5th son driving pin G5, the 6th son driving pin G6, the 7th son driving pin of driving pin G7 and the 8th
G8。
It should be noted that the corresponding grounding pin of each module is additionally provided in the present embodiment on substrate 10.Such as, it rectifies
The grounding pin N of bridge, the two grounding pin NB1 and NB2, three grounding pins EU, EV and EW of IPM13 of PFC module 12.Figure
3 be the outside drawing of the integrated morphology of the drive control device of this implementation, and the position of each pin shown in Fig. 2 can be set with reference to such as Fig. 3
It sets.
In the present embodiment, AC power source input pin 101 is connected with power supply, and PFC module 12 and IPM13 module connect
After receiving driving signal, which enters working condition.Alternating current input rectifying module 11 is inputted by 11 Duis of rectification module
Alternating current rectified, direct current is exported after rectification and exports different direct currents after external switch power supply and supplies electricity to modules makes
With.Alternating current inputs PFC module by PFC input pin 102 after external charge circuit, carries out power by PFC module 12
Busbar voltage is obtained after factor correction, rectification, then passes through alternating current after completing alternating current required for inversion compressor as IPM13
Source output interface is powered compressor, to control compressor operation.In the present embodiment, rectification is set on same substrate 10
Module 11, PFC module 12 and IPM13 module, and the corresponding connection pin of required peripheral circuit is set in the substrate 10, so that whole
Flow module 11, PFC module 12 and IPM13 module can be integrally disposed, verified, the overall volume of the integrated morphology and original three
The total volume that the volume of a module obtains after being added is compared, and reduces 1/2 or so, and then reduce the whole body of drive control device
Product.
The integrated morphology of the drive control device of the present embodiment, by be arranged on the substrate 10 AC power source input pin 101,
Direct current output pin B, PFC input pin 102, AC power source output pin 103, PFC module driving pin 104 and IPM driving
Pin 105, and rectification module 11, PFC module 12 and IPM13 are respectively provided on the substrate 10, make AC power source input pin 101
Be connected respectively with rectification module 11 with direct current output pin B, PFC input pin 102 and PFC module driving pin 104 respectively with
PFC module 12 is connected, and AC power source output pin 103, IPM driving pin 105 and PFC module 12 are connected with IPM13 respectively, real
Show rectification module 11, PFC module 12 and IPM13 is integrally disposed.Using the technical solution of the application, driving control can be reduced
The volume of device processed.
In practical applications, each module during the work time, can generate heat, so that the integrated morphology temperature of drive control device
Degree improves, if the integrated morphology temperature of drive control device is excessively high, will affect the use of drive control device, or even cause drive control
Phenomena such as device is burnt out.Therefore, as depicted in figs. 1 and 2, the integrated morphology of the drive control device of the present embodiment can also include temperature
Detection module 14；The substrate 10 further includes temperature detection pin 106；Temperature detecting module 14 is connected with temperature detection pin 106,
And the temperature that will test is sent to peripheral monitoring device, so that peripheral monitoring device takes corresponding measure.Wherein, which examines
Survey temperature coefficient (Negative Temperature CoeffiCient, NTC) thermistor that module 14 is preferably negative, temperature
Detection pin 106 may include the first son detection of detection pin T1 and first pin T2.
In the present embodiment, the integrated morphology temperature of drive control device is excessively high in order to prevent, can also be in drive control device
Radiating bottom plate (no longer showing in figure) is set in integrated morphology, and substrate 10 is arranged on radiating bottom plate, on such substrate 10
Heat can conduct to radiating bottom plate, and then can radiate.
Fig. 4 is Al under identical calorific value2O3With AlN temperature rise comparison diagram.As shown in figure 4, in the present embodiment, in identical fever
Measure Al2O3Temperature be 59.7 DEG C, and AlN temperature rise be 51.3 DEG C, it can thus be seen that the heat dissipation effect of AlN is better than Al2O3
Heat dissipation effect, therefore, the radiating bottom plate in the present embodiment can choose AlN material and be made, so as to drive control device
Integrated morphology radiate.
During a specific implementation, rectification module 11, PFC module 12 and IPM13 are using transistor design
Circuit is formed, for example, PFC module 12 and IPM13 can be by opening as shown in Fig. 2, rectification module 11 can be formed by diode
It closes pipe and diode is formed, wherein switching tube is preferably insulated gate bipolar transistor (Insulated Gate Bipolar
Transistor, IGBT).Since the loss height of transistor has larger impact to the performance of module, it is each in order to improve
The performance of module, the transistor in the present embodiment are preferably lost lower material and are made.
Fig. 5 is SiC and the reversed turn-off power loss comparison diagram of Si, as shown in figure 5, abscissa is the time, ordinate is current damage
Consumption, can be at TJ=25 DEG C, 50 DEG C, 100 DEG C and 150 DEG C by Fig. 5, and the reversed turn-off power loss of SiC is basically unchanged, and Si's is anti-
It is sequentially increased to turn-off power loss, and the reversed turn-off power loss of SiC is significantly less than the reversed turn-off power loss of Si, there is one therebetween
A energy waste section (Wasted Energy).Therefore, in the present embodiment, preferably SiC is as transistor in each module
Making material.
The application also provides a kind of drive control device, the drive control device include driving signal generating device, filtering device,
The integrated morphology of storage capacitor and the driver of embodiment as above.Wherein, PFC module driving pin 104 and IPM drive pin
105 are connected with driving signal generating device respectively；Direct current output pin B is connected with filtering device, with the mould of the power supply to needs
Block is powered；PFC module is connected by storage capacitor with IPM.For example, the filtering device in the present embodiment can use inductance
And/or DC-link capacitor is realized.
The present embodiment also provides a kind of air-conditioning, which includes the drive control device of compressor and above-described embodiment, the drive
Movement controller is connected with compressor.
It is understood that same or similar part can mutually refer in the various embodiments described above, in some embodiments
Unspecified content may refer to the same or similar content in other embodiments.
It should be noted that term " first ", " second " etc. are used for description purposes only in the description of the present application, without
It can be interpreted as indication or suggestion relative importance.In addition, in the description of the present application, unless otherwise indicated, the meaning of " multiple "
Refer at least two.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is contained at least one embodiment or example of the application.In the present specification, schematic expression of the above terms are not
Centainly refer to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be any
One or more embodiment or examples in can be combined in any suitable manner.
Although embodiments herein has been shown and described above, it is to be understood that above-described embodiment is example
Property, it should not be understood as the limitation to the application, those skilled in the art within the scope of application can be to above-mentioned
Embodiment is changed, modifies, replacement and variant.
Claims (10)
1. a kind of integrated morphology of drive control device, which is characterized in that including substrate, rectification module, PFC PFC mould
Block and intelligent power module；
The rectification module, the PFC module and the IPM are respectively provided on the substrate；
The substrate include AC power source input pin, direct current output pin, PFC input pin, AC power source output pin,
PFC module drives pin and IPM to drive pin；
The AC power source input pin and the direct current output pin are connected with the rectification module respectively；
The PFC input pin and PFC module driving pin are connected with the PFC module respectively；
The AC power source output pin, IPM driving pin and the PFC module are connected with the IPM respectively.
2. the integrated morphology of drive control device according to claim 1, which is characterized in that further include temperature detecting module；
The substrate further includes temperature detection pin；
The temperature detecting module is connected with the temperature detection pin.
3. the integrated morphology of drive control device according to claim 2, which is characterized in that the temperature detecting module uses
Negative temperature coefficient NTC thermistor is realized.
4. the integrated morphology of drive control device according to claim 1, which is characterized in that the crystal in the PFC module
Pipe is made of silicon carbide SiC material.
5. the integrated morphology of drive control device according to claim 1, which is characterized in that the transistor in the IPM is adopted
It is made of silicon carbide SiC material.
6. the integrated morphology of drive control device according to claim 1-5, which is characterized in that further include heat dissipation bottom
Plate；
The substrate is arranged on the radiating bottom plate.
7. the integrated morphology of drive control device according to claim 6, which is characterized in that
The radiating bottom plate is made of aluminium nitride AlN material.
8. a kind of drive control device, which is characterized in that including driving signal generating device, filtering device, storage capacitor and such as power
Benefit requires the described in any item integrated morphologies of 1-7；
The PFC module driving pin and IPM driving pin are connected with the driving signal generating device respectively；
The direct current output pin is connected with the filtering device；
The PFC module is connected by the storage capacitor with the IPM.
9. drive control device according to claim 8, which is characterized in that the filtering device uses inductance and/or DC-
Link capacitor is realized.
10. a kind of air-conditioning, which is characterized in that including compressor and drive control device as claimed in claim 9；
The drive control device is connected with the compressor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810640360.6A CN108988625A (en) | 2018-06-19 | 2018-06-19 | Integrated structure of drive controller, drive controller and air conditioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810640360.6A CN108988625A (en) | 2018-06-19 | 2018-06-19 | Integrated structure of drive controller, drive controller and air conditioner |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108988625A true CN108988625A (en) | 2018-12-11 |
Family
ID=64541558
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810640360.6A Pending CN108988625A (en) | 2018-06-19 | 2018-06-19 | Integrated structure of drive controller, drive controller and air conditioner |
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| CN (1) | CN108988625A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114649319A (en) * | 2022-02-11 | 2022-06-21 | 广东汇芯半导体有限公司 | Module of combinable semiconductor circuit |
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Application publication date: 20181211 |