CN108962435A - patterned transparent electrode manufacturing method - Google Patents
patterned transparent electrode manufacturing method Download PDFInfo
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- CN108962435A CN108962435A CN201810653453.2A CN201810653453A CN108962435A CN 108962435 A CN108962435 A CN 108962435A CN 201810653453 A CN201810653453 A CN 201810653453A CN 108962435 A CN108962435 A CN 108962435A
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- transparent electrode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0016—Apparatus or processes specially adapted for manufacturing conductors or cables for heat treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/30—Drying; Impregnating
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Abstract
The present invention is a kind of patterned transparent electrode manufacturing method with low surface roughness, in such a way that the quantity of ink and cooperation for controlling conductive ink precisely align, conductive ink can be made to be filled up completely in the groove of substrate, and it is not required to additionally remove the ink of non-recessed portion, therefore it can be reduced the time and reduce the surface roughness between transparent electrode and substrate, in addition it is handled using easy surface modification, it can improve under surface roughness to tens nanometer, can achieve the purpose that reduce cost and simplify technique.
Description
Technical field
The present invention is a kind of patterned transparent electrode manufacturing method, especially a kind of patterning that can reduce surface roughness
Transparent electrode manufacturing method.
Background technique
The range that transparent electrode uses is quite wide, such as can be applied to make various photoelectric cells, such as liquid crystal display panel, touching
Touch screen and solar battery etc..Transparent electrode can be made by a variety of different manufacturing methods, for example, halftone can be used
The mode of printing or ink jet printing inserts conductive ink on substrate in patterned ink container, however manufactured in this way
The bad problem of surface smoothness is usually had between transparent electrode and substrate.
For example, if the injection volume of electric ink cannot be controlled accurately, it can frequently result in that conductive ink is excessive or splash
To substrate surface, just needs to reuse scraper at this time and remove the conductive ink for remaining in substrate surface, or need to reuse
The absorption of ink roll web remains in the extra conductive ink of substrate surface, could maintain the flatness of substrate surface.
In summary, according to existing transparent electrode manufacturing method, even if forming patterning ink on the surface of the substrate
After water-bound, it is still necessary to for example be struck off using various post processing modes or the processing such as adsorption, base can be effectively reduced
The surface roughness of plate surface.However, these modes can not reach required surface smoothness in one-time process, for manufacture
It needs to expend considerable time and cost for the process of transparent electrode.
Summary of the invention
The present invention is a kind of patterned transparent electrode manufacturing method with low surface roughness, by controlling conductive ink
Quantity of ink and cooperate the mode that precisely aligns, conductive ink can be made to be filled up completely in the groove of substrate, and be not required to volume
The outer ink for removing non-recessed portion, therefore can be reduced the time and reduce the surface roughness between transparent electrode and substrate, in addition
It is handled, can be improved under surface roughness to tens nanometer using easy surface modification, can reach reduces cost and simplify technique
Purpose.
The present invention provides a kind of patterned transparent electrode manufacturing method with low surface roughness comprising following step
It is rapid: patterned substrate being provided, is constituted pattern with multiple grooves on patterned substrate；Patterned template, patterned template tool are provided
There are at least one pattern openings corresponding with pattern form；Conductive ink is inserted in those grooves, will be patterned into template placement
In in the pattern plane of patterned substrate and being aligned, importing conductive ink fills out conductive ink through at least one pattern openings
Enter in those grooves；And surface smoothness moditied processing is carried out, it is applied to pattern plane using hot-pressing technique or coating technique, with
Reduce the surface roughness for the transparent electrode that conductive ink is formed.
Preferably, inserting step of the conductive ink in those grooves is using blade coating technology, screen painting skill
Art or ink-jet printing technology are completely filled with the conductive ink in those grooves.
Preferably, which is light shield, inserts the conductive ink when those grooves, with blade coating technology or
At least one pattern openings that ink-jet printing technology makes the conductive ink pass through the light shield are inserted in those grooves.
Preferably, which is halftone, and the pattern openings of the halftone are made of multiple grids, insert this and lead
When those grooves, which inserts in those grooves electric ink through those grids.
Preferably, the material of the patterned substrate is flexible base plate, glass or Silicon Wafer.
Preferably, which is metal nanoparticle glue or metal nanoparticle ink.
Preferably, when the patterned template and the patterned substrate are aligned, the patterned substrate by vacuum suction in
On vacuum chuck, and it is provided with alignment device around the patterned substrate, to align with the patterned template.
Preferably, which is plate hot-pressing technique or idler wheel hot-pressing technique, and hot pressing is together in filled with the conduction
The patterned substrate of ink.
Preferably, the patterned substrate which will be filled with the conductive ink is placed in the upper of hot press
Between plate and lower plate.
Preferably, the patterned substrate which will be filled with the conductive ink is placed in heat pressure roller machine
Upper roller and bottom roller between.
Preferably, which is that spin-on techniques, bar coating technique or slot coating technique, use have
The high molecular material of electric conductivity and translucency is coated in the pattern plane.
One, implementation through the invention at least can reach following effect: conductive ink can be fully populated in patterning base
In the groove of plate, then hot-pressing technique or coating technique is cooperated to carry out easy surface modification processing, can further decreased transparent
Surface roughness between electrode and substrate；Two, it is not required to remove the extra conductive ink of non-recessed portion, the time can be shortened.
Detailed description of the invention
Fig. 1 is the front view of patterned substrate 10；
Fig. 2 is the side view of patterned substrate 10；
Fig. 3 is the partial view of patterned substrate 10；
Fig. 4 is the partial view of patterned substrate 10；
Fig. 5 is that patterned template is placed on the view aligned in the pattern plane of patterned substrate 10；
Fig. 6 is the view of conductive ink filling groove；
Fig. 7 is the view of conductive ink filling groove；
Fig. 8 A is the view of plate hot-pressing technique；
Fig. 8 B is the view of idler wheel hot-pressing technique.
Specific embodiment
The patterned transparent electrode manufacturing method with low surface roughness that the present embodiment provides a kind of comprising following step
It is rapid: patterned substrate is provided；Patterned template is provided；Conductive ink is inserted in groove；And carry out surface smoothness modification
Processing.
Patterned substrate is provided: as shown in Figures 1 and 2, being patterned substrate 10, exposure, development, erosion can be advanced with
Lithography forms multiple grooves 11 on substrate and constitutes pattern, or reaches on substrate using technologies such as laser or coinings
Form the purpose of groove 11.The material of patterned substrate 10 can select flexible base plate, glass or Silicon Wafer with the use of demand,
Wherein flexible base plate is, for example, PET, but is not limited only to this.
There is provided patterned template: patterned template has corresponding with the shape of pattern on patterned substrate 10 at least one
A pattern openings.As shown in figure 3, patterned template can be halftone 20, it is the halftone being generally used in screen printing technology
20.It in the pattern openings of halftone 20 is made of multiple grids 21.For example, if groove 11 on patterned substrate 10
It is to constitute such as honey comb like multiple hexagon-shaped patterns, also can be equally constituted with multiple grids 21 as honey comb like multiple on halftone 20
Hexagon-shaped pattern.
As shown in figure 4, patterned template is also possible to light shield 22, light shield 22 has the pattern corresponding to patterned substrate 10
Pattern openings 23.Cooperate different technical matters, halftone 20 can be selected or light shield 22 is used as patterned template.
Conductive ink is inserted in groove: conductive ink can be printed using blade coating technology, screen printing technology or ink-jet
Brush technology is completely filled with conductive ink in groove 11.
As shown in Fig. 4, Fig. 5 and Fig. 6, the patterned template with pattern openings 23 can be placed on patterned substrate 10
It in pattern plane and is aligned, then importing conductive ink 40 inserts conductive ink 40 in groove 11 through pattern openings 23.Figure
Vacuum chuck 30 can be used to reach in alignment mode between case template and patterned substrate 10, such as will be patterned into substrate 10
It is placed on the vacuum chuck 30 below patterned template, to utilize vacuum absorption device vacuum suction and fixed pattern substrate
10 position, and alignment device 31 is provided with around patterned substrate 10 on vacuum chuck 30, so that patterning mould
Plate can be placed in the pattern plane of patterned substrate 10, and be aligned with patterned substrate 10.
For example, alignment device 31 can be the locating rod that protrusion is arranged around patterned substrate 10, and scheme
Location hole (not shown) is set in the position for not influencing pattern in case template.When being positioned, it is only necessary to be inserted into locating rod
Location hole can be such that the pattern openings 23 of patterned template are aligned with the pattern on patterned substrate 10.
After the completion of contraposition, just conductive ink 40 can be imported in the top of patterned template, make conductive ink 40 through figure
Case opening 23 is completely filled in the groove 11 of patterned substrate 10.For example, available when patterned template is light shield 22
Blade coating technology or ink-jet printing technology make conductive ink 40 pass through the pattern openings 23 of light shield 22 and insert in groove 11.By
It in the volume of groove 11 can be precisely calculated, therefore can control the quantity of ink of conductive ink 40, and penetrate accurate technique of counterpoint,
It can reach and avoid conductive ink 40 excessive to outside groove 11.
As shown in FIG. 6 and 7, when patterned template is halftone 20, the pattern openings of halftone 20 are by multiple grids
21 constitute (as shown in Figure 3), due to making on pattern openings and the patterned substrate 10 on halftone 20 using alignment device
Pattern match, recycle the influence of surface tension and control scraper 50 lower pressure and technological parameter and cooperation control lead
The quantity of ink of electric ink 40 just can control conductive ink 40 through careful grid filling groove 11.In addition to groove 11 can be filled up
Outside, also avoidable conductive ink 40 is excessive or splashes out outside groove 11, therefore does not need to expend the ink for removing non-recessed 11 part
The time of residue, it is possible to reduce time.
Carry out surface smoothness moditied processing: surface smoothness moditied processing can use hot-pressing technique or coating technique is applied
It is added on the pattern plane of patterned substrate 10, to reduce the surface roughness that conductive ink 40 is formed by transparent electrode.Such as Fig. 8 A
And shown in Fig. 8 B, the patterned substrate 10 that hot-pressing technique hot pressing is filled with conductive ink 40 can use.When carrying out hot pressing, heat
Conductive ink 40 can be made dry and form transparent electrode at groove 11, at the same under be pressed on the pressure of patterned substrate 10 can
To reach the effect of reducing surface roughness.
Hot-pressing technique can be for example plate hot-pressing technique or idler wheel hot-pressing technique.As shown in Figure 8 A, plate hot-pressing technique is
The patterned substrate 10 for being filled with conductive ink 40 is placed between the upper flat plate 61 and lower plate 62 of hot press, then above flat
Plate 61 and 62 hot pressing of lower plate are in patterned substrate 10 to form transparent electrode.
Similarly, as shown in Figure 8 B, idler wheel hot-pressing technique is to place the patterned substrate 10 for being filled with conductive ink 40
Between the upper roller 71 and bottom roller 72 of heat pressure roller machine, when patterned substrate 10 is transported through upper roller 71 and bottom roller
When between 72, just with upper roller 71 and 72 hot pressing of bottom roller in patterned substrate 10 to form transparent electrode.
When carrying out surface smoothness moditied processing using coating technique, conductive and translucency can be used (such as
Light transmittance is 90% or more) high molecular material be coated on the entire pattern plane of patterned substrate 10, to utilize high molecular material
It is filled in rough structure on conductive ink and/or patterned substrate 10, is reduced with transparent electrode made of conductive ink
Surface roughness.Coating technique can select spin-on techniques, bar coating technique or slot coating technique.
More preferably, 11 width of groove on patterned substrate 10 can be designed and optimize, so that conductive ink 40 is complete
Full packing can improve the surface smoothness of patterned substrate 10 in groove 11.It, can after carrying out surface smoothness moditied processing
So that apparent height having the same between the conductive ink 40 in groove 11 and patterned substrate 10, and make surface roughness
Tens nanometer is reduced to hereinafter, surface roughness can be effectively reduced.
Metal nanoparticle glue or metal nanoparticle ink can be selected in conductive ink 40 above-mentioned.In addition it is appropriate to can be selected
Substrate material and conductive ink 40, transparent electrode 3D structure, or the transparent electrode with flexibility is made.Because can
The surface roughness that 10 surface of patterned substrate is reduced using hot-pressing technique or coating technique, so the table of substrate can be effectively improved
Surface evenness, to reach simplified technique, shorten the effect of time.
Claims (10)
1. a kind of patterned transparent electrode manufacturing method comprising the following steps: patterned substrate is provided, on the patterned substrate
Pattern is constituted with multiple grooves；There is provided patterned template, the patterned template have it is corresponding with the pattern form at least one
Pattern openings；Conductive ink is inserted in those grooves, which is placed in the pattern plane of the patterned substrate
And aligned, importing the conductive ink inserts the conductive ink in those grooves through at least one pattern openings；With
And surface smoothness moditied processing is carried out, it is applied to the pattern plane using hot-pressing technique or coating technique, to reduce the conductive ink
The surface roughness for the transparent electrode that water is formed.
2. patterned transparent electrode manufacturing method as described in claim 1, wherein inserting the conductive ink in those grooves
The step of be that so that the conductive ink is completely filled with those using blade coating technology, screen printing technology or ink-jet printing technology recessed
In slot.
3. patterned transparent electrode manufacturing method as described in claim 1, wherein the patterned template is light shield, inserts this and lead
Electric ink when those grooves, with blade coating technology or ink-jet printing technology make the conductive ink pass through the light shield this at least
One pattern openings is inserted in those grooves.
4. patterned transparent electrode manufacturing method as described in claim 1, wherein the patterned template is halftone, the halftone
The pattern openings are made of multiple grids, insert the conductive ink when those grooves, which penetrates those grids
It inserts in those grooves.
5. patterned transparent electrode manufacturing method as described in claim 1, wherein the material of the patterned substrate is pliability
Substrate, glass or Silicon Wafer.
6. patterned transparent electrode manufacturing method as described in claim 1, wherein the conductive ink is metal nanoparticle glue
Or metal nanoparticle ink.
7. such as patterned transparent electrode manufacturing method of any of claims 1-6, wherein the patterned template with should
When patterned substrate is aligned, the patterned substrate by vacuum suction on vacuum chuck, and week of the patterned substrate
It encloses and is provided with alignment device, to be aligned with the patterned template.
8. patterned transparent electrode manufacturing method as claimed in claim 7, wherein the hot-pressing technique be plate hot-pressing technique or
Idler wheel hot-pressing technique, hot pressing is together in the patterned substrate for being filled with the conductive ink.
9. patterned transparent electrode manufacturing method as claimed in claim 8, wherein the plate hot-pressing technique will be filled with this and lead
The patterned substrate of electric ink is placed between the upper flat plate and lower plate of hot press, which will be filled with this
The patterned substrate of conductive ink is placed between the upper roller and bottom roller of heat pressure roller machine.
10. patterned transparent electrode manufacturing method as claimed in claim 7, wherein the coating technique be spin-on techniques,
Bar coating technique or slot coating technique are coated on the pattern plane using conductive and translucency high molecular material
On.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810653453.2A CN108962435A (en) | 2018-06-22 | 2018-06-22 | patterned transparent electrode manufacturing method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810653453.2A CN108962435A (en) | 2018-06-22 | 2018-06-22 | patterned transparent electrode manufacturing method |
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| CN108962435A true CN108962435A (en) | 2018-12-07 |
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| CN201810653453.2A Pending CN108962435A (en) | 2018-06-22 | 2018-06-22 | patterned transparent electrode manufacturing method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114093574A (en) * | 2021-11-22 | 2022-02-25 | 无锡变格新材料科技有限公司 | Preparation method of conductive film and touch module |
| CN114115594A (en) * | 2021-11-22 | 2022-03-01 | 无锡变格新材料科技有限公司 | Manufacturing method of fine circuit of touch panel and electrode lead structure |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101447380A (en) * | 2008-12-11 | 2009-06-03 | 彩虹集团公司 | Method for manufacturing plane surface medium resistance discharging light source |
| CN103299448A (en) * | 2010-09-29 | 2013-09-11 | Posco公司 | Method for manufacturing a flexible electronic device using a roll-shaped motherboard, flexible electronic device, and flexible substrate |
| CN104134513A (en) * | 2013-05-02 | 2014-11-05 | 杨立章 | Soft-magnetic composite film and manufacturing method and application of soft-magnetic composite film in electronic equipment |
| CN104919572A (en) * | 2012-12-28 | 2015-09-16 | 印可得株式会社 | Method for forming conductive pattern, conductive film, conductive pattern, and transparent conductive film |
| CN107003787A (en) * | 2014-11-12 | 2017-08-01 | 株式会社东进世美肯 | Method for forming electrode pattern and electrode pattern |
-
2018
- 2018-06-22 CN CN201810653453.2A patent/CN108962435A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101447380A (en) * | 2008-12-11 | 2009-06-03 | 彩虹集团公司 | Method for manufacturing plane surface medium resistance discharging light source |
| CN103299448A (en) * | 2010-09-29 | 2013-09-11 | Posco公司 | Method for manufacturing a flexible electronic device using a roll-shaped motherboard, flexible electronic device, and flexible substrate |
| CN104919572A (en) * | 2012-12-28 | 2015-09-16 | 印可得株式会社 | Method for forming conductive pattern, conductive film, conductive pattern, and transparent conductive film |
| CN104134513A (en) * | 2013-05-02 | 2014-11-05 | 杨立章 | Soft-magnetic composite film and manufacturing method and application of soft-magnetic composite film in electronic equipment |
| CN107003787A (en) * | 2014-11-12 | 2017-08-01 | 株式会社东进世美肯 | Method for forming electrode pattern and electrode pattern |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114093574A (en) * | 2021-11-22 | 2022-02-25 | 无锡变格新材料科技有限公司 | Preparation method of conductive film and touch module |
| CN114115594A (en) * | 2021-11-22 | 2022-03-01 | 无锡变格新材料科技有限公司 | Manufacturing method of fine circuit of touch panel and electrode lead structure |
| CN114093574B (en) * | 2021-11-22 | 2024-03-05 | 无锡变格新材料科技有限公司 | Preparation method of conductive film and touch module |
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Application publication date: 20181207 |