CN108912810A - A kind of flexible electric circuit board ink, preparation method and its coating method - Google Patents
A kind of flexible electric circuit board ink, preparation method and its coating method Download PDFInfo
- Publication number
- CN108912810A CN108912810A CN201810693399.4A CN201810693399A CN108912810A CN 108912810 A CN108912810 A CN 108912810A CN 201810693399 A CN201810693399 A CN 201810693399A CN 108912810 A CN108912810 A CN 108912810A
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- CN
- China
- Prior art keywords
- circuit board
- thermosetting resin
- resin
- electric circuit
- flexible electric
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C09D11/107—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds from unsaturated acids or derivatives thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/0023—Digital printing methods characterised by the inks used
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/0041—Digital printing on surfaces other than ordinary paper
- B41M5/0047—Digital printing on surfaces other than ordinary paper by ink-jet printing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The present invention provides a kind of flexible electric circuit board ink, preparation method and its coating method, the ink and is made of the weight percent of following each component：Lower layer thermosetting resin 10-30%, intermediate layer resin 20-40%, upper layer thermosetting resin 5-15%, curing agent 5-10%, diluent 5-20%, filler 0-20%；Wherein, the density of the intermediate layer resin is greater than the density of lower layer's thermosetting resin, and less than the density of the upper layer thermosetting resin, the intermediate layer resin, lower layer's thermosetting resin and the upper layer thermosetting resin are immiscible.The advantages that flexible electric circuit board ink according to an embodiment of the present invention has adherence excellent, energy rapid curing, improves coating efficiency.
Description
Technical field
The present invention relates to flexible electric circuit board technical fields, more particularly to a kind of flexible electric circuit board ink and the flexible circuit
The coating method of the preparation method of plate ink and the flexible electric circuit board ink.
Background technique
Electronic product is quickly grown, and the requirement of circuit-board industry is also higher and higher, and circuit board can not only be fabricated to single side,
Two-sided or multilayered structure can also be manufactured into, flexible poor after the ink film forming of circuit board currently on the market, attachment degree is low, gas
Taste is big, and with the maturation of industrial automation technology, the efficiency needs of ink solidification is greatly improved, existing circuit board
Slow with the curing rate of ink, solidification needs temperature high, greatly reduces packaging efficiency, improves production cost, extends life
Time required for producing line.
Summary of the invention
In view of this, one aspect of the present invention provides a kind of flexible electric circuit board ink.
Another aspect of the invention provides a kind of preparation method of flexible electric circuit board ink.
Another aspect of the invention provides a kind of coating method of flexible electric circuit board ink.
In order to solve the above technical problems, the present invention uses following technical scheme：
The flexible electric circuit board ink of embodiment according to a first aspect of the present invention, is made of the weight percent of following each component：
Lower layer thermosetting resin 10-30%, intermediate layer resin 20-40%, upper layer thermosetting resin 5-15%, curing agent 5-10%, diluent
5-20%, filler 0-20%；Wherein, the density of the intermediate layer resin is greater than the density of lower layer's thermosetting resin, is less than institute
State the density of upper layer thermosetting resin, the intermediate layer resin, lower layer's thermosetting resin and the upper layer thermosetting resin
It is immiscible.
Preferably, lower layer's thermosetting resin is a kind of chemical combination of polycarboxylic acid resin group containing unsaturated group
Object.
Preferably, the intermediate layer resin is the compound that a kind of end group contains epoxy group.
Preferably, the intermediate layer resin is a kind of end group also containing the compound of hydroxy functional group.
Preferably, the upper layer thermosetting resin is the compound that a kind of end group contains carboxyl.
Preferably, the curing agent is with the polycarboxy curing agent that can make the cured reactive group of carboxyl.
Preferably, the diluent is or mixtures thereof lipoid substance or ether compound.
Preferably, the filler includes carbon particle, at least one of defoaming agent and resist, the upper layer thermosetting property tree
Rouge and/or lower layer's thermosetting resin are photoresist compound.
The preparation method of the flexible electric circuit board ink of embodiment includes the following steps according to a second aspect of the present invention：
Step S1, by lower layer's thermosetting resin, intermediate layer resin and upper layer thermosetting resin are separately added into diluent and surpass respectively
Acoustic shock is swung, then by after dilution upper layer thermosetting resin and lower layer's thermosetting resin simultaneously be added dilution after intermediate layer resin
In, rate of addition 3-8mL/min；
Mixture, is centrifuged by step S2 after being added dropwise, and diluent is added and is stirred, curing agent is added after stirring 5-10h,
Continue to stir 1-2h；
Step S3 is slowly added to filler into the mixture after step S2, stirs 1-2h, and the mixing speed in step S3 is big
Mixing speed in step S2.
The coating method of the flexible electric circuit board ink of embodiment includes the following steps according to a third aspect of the present invention：
Step A1 wipes circuit board surface completely by cold blowing wind；
The ink is loaded into spray gun by step A2, and the nozzle of spray gun is flat, and the ink is sprayed onto institute by the nozzle
The surface of circuit board is stated, the angle between the nozzle and the surface of the circuit board is 5-30 °；
Step A3 will be radiated in radiation environment with radioactivity after the coated ink standing 1-3min.
Above-mentioned technical proposal of the present invention has the beneficial effect that：
The ink that flexible electric circuit board according to an embodiment of the present invention is prepared with ink is with good performance, manufactured printing
Circuit board not only has the advantages that pliability, adhesion-tight, glossiness is high, and smell is small, the property such as also conductive, anticorrosive
Matter, and curing rate is further improved, improve coating efficiency.
Detailed description of the invention
Fig. 1 is the flow diagram according to the preparation method of the flexible electric circuit board ink of the embodiment of the present invention；
Fig. 2 is the flow diagram according to the coating method of the flexible electric circuit board ink of the embodiment of the present invention.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
Attached drawing, the technical solution of the embodiment of the present invention is clearly and completely described.Obviously, described embodiment is this hair
Bright a part of the embodiment, instead of all the embodiments.Based on described the embodiment of the present invention, ordinary skill
Personnel's every other embodiment obtained, shall fall within the protection scope of the present invention.
The preparation side of flexible electric circuit board ink according to an embodiment of the present invention, the ink is specifically described with reference to the accompanying drawing
Method and its coating method.
The flexible electric circuit board ink of embodiment is by lower layer's thermosetting resin, middle layer tree according to a first aspect of the present invention
Rouge, upper layer thermosetting resin, curing agent, diluent and condiment composition.
Specifically, weight percent group of the flexible electric circuit board ink according to an embodiment of the present invention by following each component
At：Lower layer thermosetting resin 10-30%, intermediate layer resin 20-40%, upper layer thermosetting resin 5-15%, curing agent 5-10%, dilution
Agent 5-20%, filler 0-20%；Wherein, the density of the intermediate layer resin is greater than the density of lower layer's thermosetting resin, is less than
The density of the upper layer thermosetting resin, the intermediate layer resin, lower layer's thermosetting resin and the upper layer thermosetting property tree
Rouge is immiscible.
Flexible electric circuit board ink according to an embodiment of the present invention can be broadly divided into three layers and be adhered to substrate etc. as a result,
On, hardened coating film has pliability, also has many advantages, such as that curing rate is fast, improves coating efficiency and coating effect.
According to one embodiment of present invention, lower layer's thermosetting resin is a kind of polycarboxylic acid containing unsaturated group
The compound of resin group.
Further, the intermediate layer resin is the compound that a kind of end group contains epoxy group.
Further, the intermediate layer resin is a kind of end group also containing the compound of hydroxy functional group.
Further, the upper layer thermosetting resin is the compound that a kind of end group contains carboxyl.
In some specific embodiments of the inventionly, the curing agent is with can make the cured reactive group of carboxyl
Polycarboxy curing agent.
According to one embodiment of present invention, the diluent is or mixtures thereof lipoid substance or ether compound.
Optionally, the filler includes carbon particle, it can be achieved that conduction.
Further, the filler further includes defoaming agent and resist, anticorrosive etc..
In certain specific embodiments of the invention, the upper layer thermosetting resin and/or lower layer's thermosetting property tree
Rouge is photoresist compound.
In order to further illustrate the present invention, flexible electric circuit board provided by the invention is carried out with ink combined with specific embodiments below
Detailed description.
Embodiment 1
Flexible electric circuit board is made of with ink the weight percent of following each component：
Lower layer's thermosetting resin 10%；
Intermediate layer resin 20%；
Upper layer thermosetting resin 5%；
Curing agent 5%；And
Diluent 5%.
Wherein, the density of the intermediate layer resin is greater than the density of lower layer's thermosetting resin, is less than the upper layer heat
The density of thermosetting resin, the intermediate layer resin, lower layer's thermosetting resin and the upper layer thermosetting resin are immiscible.
The ink being prepared in proportion by said components is with good performance, and manufactured printed circuit board has can
Flexibility, adhesion-tight, glossiness is high, and smell is small.
Embodiment 2
Flexible electric circuit board is made of with ink the weight percent of following each component：
Lower layer's thermosetting resin 30%；
Intermediate layer resin 40%；
Upper layer thermosetting resin 15%；
Curing agent 10%；
Diluent 20%；
Filler 20%.
Wherein, the density of the intermediate layer resin is greater than the density of lower layer's thermosetting resin, is less than the upper layer heat
The density of thermosetting resin, the intermediate layer resin, lower layer's thermosetting resin and the upper layer thermosetting resin are immiscible.
The ink being prepared in proportion by said components is with good performance, and manufactured printed circuit board has can
Flexibility, adhesion-tight, glossiness is high, and smell is small, but also has many advantages, such as that curing rate is fast, improves coating efficiency.
Embodiment 3
Flexible electric circuit board is made of with ink the weight percent of following each component：
Lower layer's thermosetting resin 20%；
Intermediate layer resin 30%；
Upper layer thermosetting resin 10%；
Curing agent 7%；
Diluent 10%；
Filler 10%；
Wherein, the density of the intermediate layer resin is greater than the density of lower layer's thermosetting resin, is less than the upper layer thermosetting property
The density of resin, the intermediate layer resin, lower layer's thermosetting resin and the upper layer thermosetting resin are immiscible.
The ink being prepared in proportion by said components is with good performance, and manufactured printed circuit board has can
Flexibility, adhesion-tight, glossiness is high, and smell is small, but also has many advantages, such as that curing rate is fast, improves coating efficiency.
Embodiment 4
Flexible electric circuit board is made of with ink the weight percent of following each component：
Lower layer's thermosetting resin 20%；
Intermediate layer resin 30%；
Upper layer thermosetting resin 10%；
Curing agent 7%；
Diluent 10%；
Filler 10%；
Wherein, the density of the intermediate layer resin is greater than the density of lower layer's thermosetting resin, is less than the upper layer thermosetting property
The density of resin, the intermediate layer resin, lower layer's thermosetting resin and the upper layer thermosetting resin are immiscible.
Meanwhile the filler includes carbon particle, defoaming agent and resist, the upper layer thermosetting resin and/or it is described under
Layer thermosetting resin is photoresist compound.
The ink being prepared in proportion by said components is with good performance, and manufactured printed circuit board not only has
There is a pliability, the advantages that adhesion-tight, glossiness is high, and smell is small, the properties such as also conductive, anticorrosive, and it is further
Curing rate is improved, coating efficiency is improved.
As shown in Figure 1, the preparation method of the flexible electric circuit board ink of embodiment according to a second aspect of the present invention, including walk as follows
Suddenly：
Step S1, by lower layer's thermosetting resin, intermediate layer resin and upper layer thermosetting resin are separately added into diluent and surpass respectively
Acoustic shock is swung, then by after dilution upper layer thermosetting resin and lower layer's thermosetting resin simultaneously be added dilution after intermediate layer resin
In, rate of addition 3-8mL/min；
Mixture, is centrifuged by step S2 after being added dropwise, and diluent is added and is stirred, curing agent is added after stirring 5-10h,
Continue to stir 1-2h；
Step S3 is slowly added to filler into the mixture after step S2, stirs 1-2h, and the mixing speed in step S3 is big
Mixing speed in step S2.
The preparation method of flexible electric circuit board ink described in embodiment is available according to a second aspect of the present invention as a result,
The ink with good nature, the obtained ink smell is small, and adhesion-tight, rapid-drying properties are good, convenient for improving production effect
Rate reduces production cost.
As shown in Fig. 2, the coating method of the flexible electric circuit board ink of embodiment includes following step according to a third aspect of the present invention
Suddenly：
Step A1 wipes circuit board surface completely by cold blowing wind；
The ink is loaded into spray gun by step A2, and the nozzle of spray gun is flat, and the ink is sprayed onto institute by the nozzle
The surface of circuit board is stated, the angle between the nozzle and the surface of the circuit board is 5-30 °；
Step A3 will be radiated in radiation environment with radioactivity after the coated ink standing 1-3min.
It, can will that is, the coating method of the flexible electric circuit board ink of embodiment according to a third aspect of the present invention
The above-mentioned ink of preparation is quickly coated in circuit board surface, not only shortens the time required for coating, but also also assure institute
State the superperformance of ink, manufactured printed circuit board not only has pliability, and adhesion-tight, glossiness is high, and it is excellent that smell is small etc.
Point, the properties such as also conductive, anticorrosive.
The above is a preferred embodiment of the present invention, it is noted that for those skilled in the art,
Without departing from the principles of the present invention, it can also make several improvements and retouch, these improvements and modifications should also regard
For protection scope of the present invention.
Claims (10)
1. a kind of flexible electric circuit board ink, which is characterized in that be made of the weight percent of following each component：Lower layer's thermosetting property
Resin 10-30%, intermediate layer resin 20-40%, upper layer thermosetting resin 5-15%, curing agent 5-10%, diluent 5-20%, filler
0-20%；Wherein, the density of the intermediate layer resin is greater than the density of lower layer's thermosetting resin, is less than the upper layer thermosetting
The density of property resin, the intermediate layer resin, lower layer's thermosetting resin and the upper layer thermosetting resin are immiscible.
2. flexible electric circuit board ink according to claim 1, which is characterized in that lower layer's thermosetting resin is one kind
The compound of polycarboxylic acid resin group containing unsaturated group.
3. flexible electric circuit board ink according to claim 2, which is characterized in that the intermediate layer resin is a kind of end group
Compound containing epoxy group.
4. flexible electric circuit board ink according to claim 3, which is characterized in that the intermediate layer resin is a kind of end group
Also containing the compound of hydroxy functional group.
5. flexible electric circuit board ink according to claim 4, which is characterized in that the upper layer thermosetting resin is one kind
End group contains the compound of carboxyl.
6. flexible electric circuit board ink according to claim 1, which is characterized in that the curing agent is with can make carboxyl
The polycarboxy curing agent of cured reactive group.
7. flexible electric circuit board ink according to claim 1, which is characterized in that the diluent be lipoid substance or
Or mixtures thereof ether compound, the filler include carbon particle, at least one of defoaming agent and resist.
8. flexible electric circuit board ink according to claim 1, which is characterized in that the upper layer thermosetting resin and/or
Lower layer's thermosetting resin is photoresist compound.
9. a kind of preparation method of flexible electric circuit board ink is used for flexible electric circuit board described in any one of claims 1-8
Ink, which is characterized in that include the following steps：
Step S1, by lower layer's thermosetting resin, intermediate layer resin and upper layer thermosetting resin are separately added into diluent and surpass respectively
Acoustic shock is swung, then by after dilution upper layer thermosetting resin and lower layer's thermosetting resin simultaneously be added dilution after intermediate layer resin
In, rate of addition 3-8mL/min；
Mixture, is centrifuged by step S2 after being added dropwise, and diluent is added and is stirred, curing agent is added after stirring 5-10h,
Continue to stir 1-2h；
Step S3 is slowly added to filler into the mixture after step S2, stirs 1-2h, and the mixing speed in step S3 is big
Mixing speed in step S2.
10. a kind of coating method of flexible electric circuit board ink is used for flexible electric circuit board described in any one of claims 1-8
Ink, which is characterized in that include the following steps：
Step A1 wipes circuit board surface completely by cold blowing wind；
The ink is loaded into spray gun by step A2, and the nozzle of spray gun is flat, and the ink is sprayed onto institute by the nozzle
The surface of circuit board is stated, the angle between the nozzle and the surface of the circuit board is 5-30 °；
Step A3 will be radiated in radiation environment with radioactivity after the coated ink standing 1-3min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810693399.4A CN108912810A (en) | 2018-06-29 | 2018-06-29 | A kind of flexible electric circuit board ink, preparation method and its coating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810693399.4A CN108912810A (en) | 2018-06-29 | 2018-06-29 | A kind of flexible electric circuit board ink, preparation method and its coating method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108912810A true CN108912810A (en) | 2018-11-30 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810693399.4A Pending CN108912810A (en) | 2018-06-29 | 2018-06-29 | A kind of flexible electric circuit board ink, preparation method and its coating method |
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102046691A (en) * | 2008-06-09 | 2011-05-04 | 互应化学工业株式会社 | Carboxyl group-containing resin, curable composition containing carboxyl group-containing resin, and cured product of the composition |
-
2018
- 2018-06-29 CN CN201810693399.4A patent/CN108912810A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102046691A (en) * | 2008-06-09 | 2011-05-04 | 互应化学工业株式会社 | Carboxyl group-containing resin, curable composition containing carboxyl group-containing resin, and cured product of the composition |
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Application publication date: 20181130 |