CN108823442A - A kind of printed electronic material and printing process - Google Patents
A kind of printed electronic material and printing process Download PDFInfo
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- CN108823442A CN108823442A CN201810693931.2A CN201810693931A CN108823442A CN 108823442 A CN108823442 A CN 108823442A CN 201810693931 A CN201810693931 A CN 201810693931A CN 108823442 A CN108823442 A CN 108823442A
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/0483—Alloys based on the low melting point metals Zn, Pb, Sn, Cd, In or Ga
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/04—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/04—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling
- B22F2009/041—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling by mechanical alloying, e.g. blending, milling
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Dispersion Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Conductive Materials (AREA)
Abstract
The present invention provides a kind of printed electronic material and printing process, is related to electronic technology field.Printed electronic material provided by the invention, by weight percentage, the printed electronic material is by 85%~92% low-melting-point metal, and 8%~15% high-melting metal powder end part alloying formed mixture, the low-melting-point metal has the first fusing point, first fusing point is at 300 DEG C or less, the fusing point of the high-melting-point powder is at 500 DEG C or more, the printed electronic material therein progress alloy can react to form the electronic material with the second fusing point at room temperature, and second fusing point is higher than first fusing point.Technical solution of the present invention can make printed electronic material have preferable electric conductivity, and cost is relatively low.
Description
Technical field
The present invention relates to electronic technology field more particularly to a kind of printed electronic material and printing processes.
Background technique
Printed electronics are the science and technologies using traditional printing technology manufacture electronic device and system.It is making
The printed electronic material used when printed electronic product needs to have the performances such as conductive, dielectric or semiconductor.It studies and answers at present
It is mainly made of conductive filler, link stuff, solvent, additive etc. with the printed electronic material of more conductive energy.Its
In, link stuff, solvent, additive etc. are all non-conductive, so that the electric conductivity of printed electronic material is bad.In addition, when conduction is filled out
When material is the metals such as gold, silver, copper, nickel, aluminium and its compound, the higher cost of printed electronic material, when conductive filler is conduction
The electric conductivity of macromolecule and small molecule, graphite, graphene, carbon nanotube, carbon fiber etc., printed electronic material is worse.
Summary of the invention
The present invention provides a kind of printed electronic material and printing process, printed electronic material can be made to have preferable conductive
Performance, and cost is relatively low.
In a first aspect, the present invention provides a kind of printed electronic material, adopt the following technical scheme that：
By weight percentage, the printed electronic material be by 85%~92% low-melting-point metal and 8%~
The mixture that 15% high-melting metal powder end part alloying is formed, the low-melting-point metal have the first fusing point, and described the
For one fusing point at 300 DEG C hereinafter, the fusing point of the high-melting-point powder is at 500 DEG C or more, the printed electronic material can be at room temperature
Therein carries out alloy and reacts to form the electronic material with the second fusing point, and second fusing point is higher than first fusing point.
Optionally, the low-melting-point metal is gallium simple substance or gallium-indium alloy.
Optionally, the low-melting-point metal is gallium-indium alloy, by weight percentage, the gallium-indium alloy by 75%~
85% gallium and 15%~25% indium composition.
Optionally, the high-melting-point powder is refractory metal powder, and the refractory metal powder includes nickel powder, iron powder
One or both of.
Optionally, the refractory metal powder is nickel powder, and by weight percentage, the printed electronic material is by 88%
Low-melting-point metal and 12% the partially-alloyed formation of nickel powder.
Optionally, the partial size of the refractory metal powder is 100nm~15 μm.
Second aspect, the embodiment of the present invention provide a kind of printing process, adopt the following technical scheme that：
The printing process includes：
Step S1,85%~92% low-melting-point metal and 8%~15% Gao Rong by weight percentage, are weighed
Point powder, and the two is made to carry out partially-alloyed formation mixture, using as printed electronic material, the low-melting-point metal has
First fusing point, first fusing point is at 300 DEG C hereinafter, the fusing point of the high-melting-point powder is at 500 DEG C or more；
Step S2, a substrate is provided to be transferred to the printed electronic material by way of printing, printing or extrusion
On the substrate；
Step S3, the substrate is placed at room temperature, carries out the printed electronic material therein on the substrate
Alloy reacts to form the electronic material with the second fusing point, and second fusing point is higher than first fusing point.
Optionally, in step s3, by way of ultrasound, heating or logical DC current, accelerate alloy reaction.
Optionally, in step S2, the printed electronic material is printed to the substrate by circuit printing machine；Or
Person, will be on the printed electronic file printing to the substrate by circuit printer.
Optionally, in step S1, by will the low-melting-point metal and the high-melting-point powder mix after carry out ball milling or
The mode of the vertical kneading of person makes the two carry out partially-alloyed formation mixture.
The present invention provides a kind of printed electronic material and printing processes, wherein by weight percentage, printed electronic material
Material is by 85%~92% low-melting-point metal and 8%~15% partially-alloyed formation of high-melting-point powder, wherein eutectic
The fusing point of point metal at 300 DEG C hereinafter, the fusing point of high-melting-point powder is at 500 DEG C or more, the low melting point in the printed electronic material
Metal is conductive, so that the electric conductivity of printed electronic material is preferable, and cost is relatively low for low-melting-point metal, above-mentioned printing
The cost of electronic material is relatively low.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is this hair
Bright some embodiments for those of ordinary skill in the art without any creative labor, can be with
It obtains other drawings based on these drawings.
Fig. 1 is the flow chart of printing process provided in an embodiment of the present invention.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art
Every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
It should be noted that each technical characteristic in the embodiment of the present invention can be tied mutually in the absence of conflict
It closes.
The embodiment of the present invention provides a kind of printed electronic material, and specifically, by weight percentage, printed electronic material is
By 85%~92% low-melting-point metal and the mixture of 8%~15% partially-alloyed formation of high-melting-point powder, eutectic
Point metal has the first fusing point, the first fusing point at 300 DEG C hereinafter, the fusing point of high-melting-point powder is at 500 DEG C or more, printed electronic material
Material therein progress alloy can react to form the electronic material with the second fusing point at room temperature, and it is molten that the second fusing point is higher than first
Point.
Containing there are three types of ingredients, the i.e. alloy of low-melting-point metal, high-melting-point powder and the two in above-mentioned printed electronic material
Reactant.Therein progress alloy reacts to form the electronic material with the second fusing point above-mentioned printed electronic material at room temperature
Principle it is as follows：In above-mentioned three kinds of ingredients, alloy reactant can induce remaining low-melting-point metal and remaining high-melting-point powder
Alloy reaction gradually occurs at room temperature, so that alloy reactant accounting in printed electronic material is gradually increased, so that
The fusing point of printed electronic material changes, and becomes electronic material.
Illustratively, the weight percent of low-melting-point metal can be：86%, 87%, 88%, 89%, 90% or
91%；The weight percent of high-melting-point powder can be：9%, 10%, 11%, 12%, 13% or 14%.
Low-melting-point metal in the printed electronic material is conductive so that the electric conductivity of printed electronic material compared with
It is good, and cost is relatively low for low-melting-point metal, the cost of above-mentioned printed electronic material is relatively low.
Common conductive silver paste is compared, the good conductivity of the printed electronic material in the embodiment of the present invention (same to conditioned measurement,
Resistance value is the 40% of conductive silver paste), and the substances such as organic solvent-free, dispersing agent.
Optionally, in the embodiment of the present invention, the first fusing point is lower than room temperature, so that printed electronic material is in viscous at room temperature
Thick liquid can be used directly, alternatively, the first fusing point is 80 DEG C hereinafter, printed electronic material is i.e. usable after slightly heat,
Alternatively, the first fusing point is 300 DEG C hereinafter, the selection of low-melting-point metal and high-melting-point powder is relatively more.Optionally, the second fusing point is high
In room temperature, so that electronic material is in solid-state at room temperature, so that the structure using the electronic material has stable knot
Structure and performance.Preferably, the second fusing point is at 180 DEG C or more, is being used with the structure for further avoiding using the electronic material
Structure and the unstable situation of performance occur caused by increasing in journey because of temperature.
Preferably, the first fusing point is lower than room temperature, and the second fusing point is higher than room temperature, i.e. printed electronic material is in sticky at room temperature
Liquid, at room temperature therein carry out alloy reaction and be solidified into solid electronic material.When being held in electronic equipment
When the substrate for carrying electronic material is organic film (such as PET film, PVC film, PI film etc.), electronic equipment has flexible
Bent, frivolous feature can not only reduce the volume and weight of electronic equipment, can also be suitble to requirement of various shapes.It is based on
This, when making electrode using printed electronic material in the embodiment of the present invention, it is right in electronic material solidification process to avoid
The influence of organic film keeps the structure of electronic equipment and performance more stable.
Above-mentioned printed electronic material realizes that the principle of room temperature self-curing is as follows：In above-mentioned three kinds of ingredients, alloy reactant can
Inducing remaining low-melting-point metal, gradually generation alloy reacts at room temperature with remaining high-melting-point powder, so that alloy reactant
Accounting is gradually increased in printed electronic material, so that printed electronic material is solid by thick variation, becomes electronics
Material.
Wherein, the alloying level of low-melting-point metal and high-melting-point powder is higher, the viscosity of the printed electronic material of formation
Bigger, the self-curing time is shorter.The viscosity of printed electronic material specifically can selection by low-melting-point metal, high-melting-point powder
Selection, the ratio between low-melting-point metal and high-melting-point powder, one or more of factors such as partial size of high-melting-point powder
It is adjusted, there is suitable viscosity with finally obtained printed electronic material, printing or printing can be suitable for.
Optionally, fusing point includes in 300 DEG C of low-melting-point metals below：Fusing point is in 300 DEG C of low-melting-point metal lists below
Matter, low-melting point metal alloy or by low-melting-point metal simple substance/low-melting point metal alloy and metal nanoparticle and fluid dispersion
The electrical-conductive nanometer fluid being mixed to form.More specifically, when selecting electrical-conductive nanometer fluid, fluid dispersion be preferably ethyl alcohol,
Propylene glycol, glycerine, polyvinylpyrrolidone, dimethyl silicone polymer, polyethylene glycol, one in polymethyl methacrylate
Kind.
In some embodiments, low-melting point metal alloy ingredient may include gallium, indium, tin, zinc, bismuth, lead, cadmium, mercury, silver, copper,
One of sodium, potassium, magnesium, aluminium, iron, nickel, cobalt, manganese, titanium, vanadium, boron, carbon, silicon, cesium element etc. are a variety of.
Preferably, fusing point includes in 300 DEG C of specific ranges of choice of low-melting-point metal below：Mercury simple substance, gallium simple substance, caesium
Simple substance, indium simple substance, tin simple substance, potassium simple substance, gallium-indium alloy, gallium-indium-tin alloy, gallium tin alloy, gallium kirsite, gallium indium kirsite, gallium
Red brass, gallium indium red brass, gallium tin cadmium alloy, gallium Zn-Cd alloy, bismuth indium alloy, bismuth tin alloy, bismuth indium stannum alloy, bismuth indium
Kirsite, bismuth red brass, bismuth indium red brass, leypewter, gun-metal, tin pltine, Tin Silver Copper Alloy, bismuth slicker solder
One or more of alloy.
Optionally, low-melting-point metal is gallium simple substance, gallium-indium alloy, gallium tin alloy, gallium-indium-tin alloy etc..Further selection,
Low-melting-point metal is gallium-indium alloy, and by weight percentage, gallium-indium alloy is made of 75%~85% gallium and 15%~25% indium.
For example, by weight percentage, low-melting-point metal is made of 78.6% gallium and 21.4% indium, alternatively, low-melting-point metal is by 75%
Gallium and 25% indium composition.
Optionally, in the embodiment of the present invention high-melting-point powder be refractory metal powder, alternatively, refractory metal powder and
Its hopcalite.
When high-melting-point powder is refractory metal powder, the refractory metal powder in the embodiment of the present invention may include zinc
The combination of one or more of powder, copper powder, iron powder, nickel powder.Preferably, it in order to form higher melting-point alloy reactant, improves
Refractory metal powder of the fusing point at 1000 DEG C or more, such as copper can be selected in the embodiment of the present invention for the temperature tolerance of electronic material
The combination of one or more of powder, iron powder, nickel powder.Preferably, Gao Rong of the fusing point in the embodiment of the present invention at 1000 DEG C or more
Point metal powder selects pure copper powder, iron powder or nickel powder, to avoid influence of the impurity to alloying reaction as far as possible.
Fusing point in certain embodiment of the present invention can also select fusing point 1000 in 1000 DEG C or more of high-melting-point powder
DEG C or more include one or more of copper powder, copper powder, iron powder, nickel powder metal alloy or metal mixture.
Optionally, high-melting-point powder is refractory metal powder, and refractory metal powder includes one of nickel powder, iron powder
Or two kinds.By taking low-melting-point metal is gallium simple substance or gallium-base alloy as an example, when refractory metal powder is iron powder, with gallium simple substance or
Gallium in gallium-base alloy occurs alloy reaction and generates FeGa3, when refractory metal powder is nickel powder, closed with gallium simple substance or gallium base
Gallium in gold occurs alloy reaction and generates NiGa4。
Further, it being selected in the embodiment of the present invention, refractory metal powder is nickel powder, by weight percentage, printing
Electronic material is by 88% low-melting-point metal and the partially-alloyed formation of 12% nickel powder.
In one example, low-melting-point metal selects gallium simple substance, and refractory metal powder selects iron powder, alloy reactant
For FeGa3。
In another example, low-melting-point metal selects gallium-indium alloy, and refractory metal powder selects nickel powder, and alloy is anti-
Answering object is Ni2Ga3、NiGa4、NiGa5、Ni3Ga7And InNi3One of or it is a variety of.
In another example, low-melting-point metal selects gallium-indium alloy, and refractory metal powder selects nickel powder and iron powder,
Alloy reactant is FeGa3、Ni2Ga3、NiGa4、NiGa5、Ni3Ga7And InNi3One of or it is a variety of.
In another example, low-melting-point metal select gallium-indium-tin alloy, refractory metal powder select nickel powder, iron powder and
Zinc powder, alloy reactant are FeGa3、Ni2Ga3、NiGa4、NiGa5、Ni3Ga7、InNi3, one of Sn-Zn or a variety of.
In another example, low-melting-point metal selects gallium-indium alloy, and refractory metal powder selects iron powder and copper powder,
Alloy reactant is FeGa3With one of Cu-In or a variety of.
Here, the present invention provides the assembled scheme of a variety of low-melting-point metals and refractory metal powder, art technology
It should be understood that in addition to the assembled scheme that the example above illustrates, other assembled schemes also can be used, details are not described herein.
Inventors have found that electric conductivity, printed electronic material of the partial size of refractory metal powder to printed electronic material
Viscosity (being determined by refractory metal powder and low-melting point metal alloy degree), self-curing time of printed electronic material etc.
All have an impact.Optionally, the partial size of refractory metal powder be 100nm~15 μm, further preferably 0.5 μm~2 μm so that
Not only there is printed electronic material suitable viscosity to be printed or be printed, and also has preferable electric conductivity, in addition can also make
Printed electronic material has the suitable self-curing time.Wherein, when certain physical characteristic or physical behavio(u)r of tested particle and certain
As soon as the homogenous spheres (or combination) of diameter are most close, using the diameter (or combination) of the sphere as the partial size of tested particle
(or size distribution).
In addition, the embodiment of the present invention provides a kind of printing process, specifically, as shown in FIG. 1, FIG. 1 is the embodiment of the present invention
The flow chart of the printing process of offer, the printing process include：
Step S1,85%~92% low-melting-point metal and 8%~15% Gao Rong by weight percentage, are weighed
Point powder, and the two is made to carry out partially-alloyed formation mixture, using as printed electronic material, low-melting-point metal has first
Fusing point, the first fusing point is at 300 DEG C hereinafter, the fusing point of high-melting-point powder is at 500 DEG C or more.
Above-mentioned partially-alloyed process can be realized by traditional heating, high-voltage electric shock, ball milling or vertical kneading.Its
In, since in mechanical milling process or in vertical kneading process, Energy distribution is uneven, it is more suitable for that the alloy reaction of part occurs,
Prepare the printed electronic material in the embodiment of the present invention.
Optionally, in step sl, by will low-melting-point metal and high-melting-point powder mix after carry out ball milling or vertical
The mode of kneading makes the two carry out partially-alloyed formation mixture.Low-melting-point metal and high-melting-point powder are partially-alloyed
Process is as follows：Low-melting-point metal and high-melting-point powder are uniformly mixed into a period of time, during mixing by ball milling or
The mode of vertical kneading provides energy, makes low-melting-point metal that alloy occur with the part in high-melting-point powder and reacts (i.e. part conjunction
Aurification).
In one example, the method for production printed electronic material includes：Under to room temperature for liquid low-melting-point metal in,
High-melting-point powder is added in proportion, and the mixture of low-melting-point metal and high-melting-point powder is placed in ball grinder, carries out ball milling mixing,
Rotational speed of ball-mill be 600~800 revs/min, Ball-milling Time be 60 minutes~180 minutes, preferably 90 minutes~120 minutes,
It should be argon gas or vacuum environment in mechanical milling process, in ball grinder, until low-melting-point metal and high-melting-point powder are uniformly mixed, specifically
Ground, if ar gas environment, the ar pressure in ball grinder should be remained greater than ambient atmosphere pressure, if vacuum environment, ball milling
Air pressure in tank should be not more than 1 kPa.
In another example, the method for production printed electronic material includes：It is the low-melting-point metal of liquid under to room temperature
In, high-melting-point powder is added in proportion, and the mixture of low-melting-point metal and high-melting-point powder merging vertical kneading mixer is pinched
It closes, is heated to 150~200 DEG C, preferably 200 DEG C, mediating revolving speed is 60~84 revs/min, and kneading time is 120 minutes~300
Minute, preferably 120 minutes~300 minutes, it should be argon gas or vacuum environment in vertical kneading process, in vertical kneading mixer,
Until low-melting-point metal and high-melting-point powder are uniformly mixed, specifically, the ar pressure if ar gas environment, in vertical kneading mixer
It should remain greater than ambient atmosphere pressure, if vacuum environment, the air pressure in vertical kneading mixer should be not more than 1 kPa.
It should be noted that if preparing resulting printed electronic material without using immediately, then -20 should be stored in
DEG C and following temperature under, under preferably -30 DEG C and following temperature, when use places it in becomes viscous liquid at room temperature,
Or heating becomes i.e. usable after viscous liquid.
Step S2, it provides a substrate and printed electronic material is transferred to substrate by way of printing, printing or extrusion
On.
Above-mentioned substrate can be any substrate that can be used for printing, for example, the hard such as metal plate, plank, plastic plate, glass
Substrate, alternatively, the flexible parent metals such as organic film (such as PET film, PVC film, PI film etc.).
Optionally, in step S2, printed electronic material is printed to substrate by circuit printing machine；Alternatively, passing through electricity
Road printer will be on printed electronic file printing to substrate.It is of course also possible to by printed electronic material by way of brushing by hand
Material is brushed to substrate.
Step S3, place substrate makes the printed electronic material therein on substrate carry out alloy reaction at room temperature
The electronic material with the second fusing point is formed, the second fusing point is higher than first fusing point.
The alloy reaction time of printed electronic material on substrate is about 10~18 hours.Optionally, in step s3, may be used
In a manner of through ultrasound, heating or logical DC current, accelerate alloy reaction.It wherein, can be by substrate by way of ultrasound
On printed electronic material the alloy reaction time shorten 1 hour, can be by the print on substrate by way of being heated to 60 DEG C
The alloy reaction time of brush electronic material shortens 2 hours, can be by the print on substrate by way of leading to the current DC of 10A
The alloy reaction time of brush electronic material shortens 2 hours.
Above-mentioned printing process can prepare the cabling for being electrically connected between different electronic components.Currently, these are walked
Line generallys use the production such as copper foil or silver paste, copper foil complex manufacturing technology and at high cost, and silver paste is at high cost and containing organic molten
The substances such as agent, dispersing agent, in addition conductivity is lower, and not only at low cost using cabling prepared by above-mentioned printing process, but also leads
Good electrical property, and do not need to add the substances such as any organic solvent, dispersing agent.
It should be noted that the related content of printed electronic material is suitable for printing process in the embodiment of the present invention, this
Place is no longer repeated.
The present invention provides a kind of printed electronic material and printing processes, wherein by weight percentage, printed electronic material
Material is by 85%~92% low-melting-point metal and 8%~15% partially-alloyed formation of high-melting-point powder, wherein eutectic
For the fusing point of point metal at 30 DEG C hereinafter, the fusing point of high-melting-point powder is at 500 DEG C or more, the low melting point in the printed electronic material is golden
Accessory is conductive, so that the electric conductivity of printed electronic material is preferable, and cost is relatively low for low-melting-point metal, above-mentioned printing electricity
The cost of sub- material is relatively low.
Finally it should be noted that：The above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Present invention has been described in detail with reference to the aforementioned embodiments for pipe, those skilled in the art should understand that：Its according to
So be possible to modify the technical solutions described in the foregoing embodiments, or to some or all of the technical features into
Row equivalent replacement；And these are modified or replaceed, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution
The range of scheme.
Claims (10)
1. a kind of printed electronic material, which is characterized in that by weight percentage, the printed electronic material be by 85%~
92% low-melting-point metal and 8%~15% high-melting metal powder end part alloying formed mixture, the eutectic
Point metal has the first fusing point, first fusing point at 300 DEG C hereinafter, the fusing point of the high-melting-point powder is at 500 DEG C or more, institute
State printed electronic material therein can carry out alloy and react to form the electronic material with the second fusing point at room temperature, and described the
Two fusing points are higher than first fusing point.
2. printed electronic material according to claim 1, which is characterized in that the low-melting-point metal is gallium simple substance or gallium
Indium alloy.
3. printed electronic material according to claim 2, which is characterized in that the low-melting-point metal is gallium-indium alloy, is pressed
Weight percent meter, the gallium-indium alloy are made of 75%~85% gallium and 15%~25% indium.
4. printed electronic material according to claim 1, which is characterized in that the high-melting-point powder is high-melting metal powder
End, the refractory metal powder include one or both of nickel powder, iron powder.
5. printed electronic material according to claim 4, which is characterized in that the refractory metal powder is nickel powder, is pressed
Weight percent meter, the printed electronic material is by 88% low-melting-point metal and the partially-alloyed formation of 12% nickel powder.
6. printed electronic material according to claim 4, which is characterized in that the partial size of the refractory metal powder is
100nm~15 μm.
7. a kind of printing process, which is characterized in that the printing process includes：
Step S1,85%~92% low-melting-point metal and 8%~15% high-melting-point powder by weight percentage, are weighed
End, and the two is made to carry out partially-alloyed formation mixture, using as printed electronic material, the low-melting-point metal has first
Fusing point, first fusing point is at 300 DEG C hereinafter, the fusing point of the high-melting-point powder is at 500 DEG C or more；
Step S2, a substrate is provided, by way of printing, printing or extrusion, the printed electronic material is transferred to described
On substrate；
Step S3, place the substrate makes the printed electronic material therein on the substrate carry out alloy at room temperature
Reaction forms the electronic material with the second fusing point, and second fusing point is higher than first fusing point.
8. printing process according to claim 7, which is characterized in that in step s3, pass through ultrasound, heating or logical direct current
The mode of electric current accelerates alloy reaction.
9. printing process according to claim 7, which is characterized in that in step S2, by circuit printing machine by the print
Brush electronic material is printed to the substrate；Alternatively, passing through circuit printer for the printed electronic file printing to the base
On material.
10. printing process according to claim 7, which is characterized in that in step S1, by by the low-melting-point metal and
The mode that ball milling or vertical kneading are carried out after the high-melting-point powder mixing makes the two carry out partially-alloyed formation mixing
Object.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810693931.2A CN108823442A (en) | 2018-06-29 | 2018-06-29 | A kind of printed electronic material and printing process |
Applications Claiming Priority (1)
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111462934A (en) * | 2019-01-18 | 2020-07-28 | 北京梦之墨科技有限公司 | Conductive paste, preparation method thereof, wearable electronic circuit and DIY (digital image processing) suite thereof |
| CN111590232A (en) * | 2019-02-20 | 2020-08-28 | 北京梦之墨科技有限公司 | Welding material and preparation method thereof |
| CN114574039A (en) * | 2020-11-30 | 2022-06-03 | 北京梦之墨科技有限公司 | Cylindrical ink and printing ink tube |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104108248A (en) * | 2013-04-19 | 2014-10-22 | 中国科学院理化技术研究所 | Liquid metal ink-jet printing equipment and printing method |
| CN104992742A (en) * | 2015-07-08 | 2015-10-21 | 北京依米康科技发展有限公司 | High-viscosity and low-melting-point metal conductive paste and preparation method and application thereof |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104108248A (en) * | 2013-04-19 | 2014-10-22 | 中国科学院理化技术研究所 | Liquid metal ink-jet printing equipment and printing method |
| CN104992742A (en) * | 2015-07-08 | 2015-10-21 | 北京依米康科技发展有限公司 | High-viscosity and low-melting-point metal conductive paste and preparation method and application thereof |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111462934A (en) * | 2019-01-18 | 2020-07-28 | 北京梦之墨科技有限公司 | Conductive paste, preparation method thereof, wearable electronic circuit and DIY (digital image processing) suite thereof |
| CN111462934B (en) * | 2019-01-18 | 2021-06-01 | 北京梦之墨科技有限公司 | Conductive paste, preparation method thereof, wearable electronic circuit and DIY (digital image processing) suite thereof |
| CN111590232A (en) * | 2019-02-20 | 2020-08-28 | 北京梦之墨科技有限公司 | Welding material and preparation method thereof |
| CN114574039A (en) * | 2020-11-30 | 2022-06-03 | 北京梦之墨科技有限公司 | Cylindrical ink and printing ink tube |
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