CN108769879B - Back sound cavity subassembly and electronic equipment - Google Patents
Back sound cavity subassembly and electronic equipment Download PDFInfo
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- CN108769879B CN108769879B CN201810623594.XA CN201810623594A CN108769879B CN 108769879 B CN108769879 B CN 108769879B CN 201810623594 A CN201810623594 A CN 201810623594A CN 108769879 B CN108769879 B CN 108769879B
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- 230000002093 peripheral effect Effects 0.000 claims abstract description 5
- 238000007789 sealing Methods 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 16
- 239000006260 foam Substances 0.000 claims description 5
- 210000001503 joint Anatomy 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 230000009977 dual effect Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 238000004891 communication Methods 0.000 description 3
- 230000002452 interceptive effect Effects 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/06—Loudspeakers
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only
- H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
- H04R1/2807—Enclosures comprising vibrating or resonating arrangements
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Health & Medical Sciences (AREA)
- Otolaryngology (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
Abstract
The application provides a back tone chamber subassembly and electronic equipment, this back tone chamber subassembly includes the base plate and stands in the first tone chamber enclosure component of base plate homonymy, second tone chamber enclosure component sets up in first tone chamber enclosure component peripheral residual space department, and be connected with first tone chamber enclosure component, first tone chamber enclosure component centers on the first space that forms and second tone chamber enclosure component centers on the second space intercommunication that forms, make first space and second space intercommunication form a bigger space through this kind of mode, the volume in back tone chamber has been increased to a certain extent, can improve the low frequency characteristic of sound, thereby make sound feel more pleasing to the ear, simultaneously, under the circumstances of keeping the compact arrangement of present electronic equipment internal element, the space in back tone chamber has been enlarged.
Description
Technical Field
The application relates to the technical field of electronic equipment, in particular to a rear sound cavity assembly and electronic equipment.
Background
As consumers increasingly emphasize the sound quality of electronic devices, especially the bass effect, dual-cavity speakers have become an increasingly mainstream design in electronic devices. The sound cavity of the double-sound-cavity loudspeaker is divided into a front sound cavity and a rear sound cavity, and the front sound cavity and the rear sound cavity are completely separated; the back tone chamber directly influences the audio of two tone chamber speakers, theoretically, if the back tone chamber is completely sealed, and the volume is bigger, then the bass effect is better.
However, the electronic devices are becoming thinner and thinner, and the space occupied by each component is extremely limited, which makes the design of the rear sound cavity more and more difficult.
Disclosure of Invention
An aspect of the present application provides a rear sound cavity assembly, where the rear sound cavity assembly includes a substrate, and a first sound cavity enclosure member and a second sound cavity enclosure member standing on the same side of the substrate, the second sound cavity enclosure member is disposed at a peripheral remaining space of the first sound cavity enclosure member and connected to the first sound cavity enclosure member, and the first sound cavity enclosure member is communicated with a second space formed around the first space and the second sound cavity enclosure member.
Another aspect of the embodiments of the present application further provides an electronic device, where the electronic device includes a rear sound cavity assembly and a speaker assembly, the rear sound cavity assembly includes a substrate, and a first sound cavity wall member and a second sound cavity wall member standing on the same side of the substrate, the second sound cavity wall member is disposed at a peripheral residual space of the first sound cavity wall member and connected to the first sound cavity wall member, the first sound cavity wall member is communicated with a second space formed by surrounding the first space and the second sound cavity wall member, the first sound cavity wall member is provided with a sound outlet, the speaker assembly is located in the first space, and the sound outlet of the speaker assembly is in butt joint with the sound outlet of the first sound cavity wall member.
The beneficial effect of this application is: be different from prior art's condition, the back sound chamber subassembly that this application provided includes the base plate and stands in the first sound chamber enclosure component of base plate homonymy, second sound chamber enclosure component sets up in first sound chamber enclosure component peripheral residual space department, and be connected with first sound chamber enclosure component, first sound chamber enclosure component surrounds the first space that forms and second sound chamber enclosure component second space intercommunication that forms that surrounds, make first space and second space intercommunication form a bigger space through this kind of mode, the volume in back sound chamber has been increased to a certain extent, can improve the low frequency characteristic of sound, thereby make sound feel more pleasing to the ear, simultaneously, under the circumstances of keeping the compact arrangement of present electronic equipment inner member, the space in back sound chamber has been enlarged.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic diagram of a dual tone cavity speaker in an electronic device;
FIG. 2 is a schematic structural diagram of an embodiment of a rear sound cavity assembly provided herein;
FIG. 3 is a schematic view showing a structure in which the first space and the second space of FIG. 2 communicate;
FIG. 4 is a schematic cross-sectional view of the bridge member of FIG. 3;
FIG. 5 is a schematic view of the seal of FIG. 2;
FIG. 6 is a schematic structural diagram of an embodiment of an electronic device provided herein;
FIG. 7 is a schematic cross-sectional view of the cover plate of FIG. 6 covering the rear sound chamber assembly;
FIG. 8 is a schematic view of the cover plate of FIG. 6 interfering with another element;
FIG. 9 is a schematic cross-sectional view of the cover plate and another element of FIG. 6 covering the rear sound chamber assembly;
FIG. 10 is a schematic cross-sectional view of the bridge member sealing gap of FIG. 6.
Detailed Description
The present application will be described in further detail with reference to the following drawings and examples. It is to be noted that the following examples are only illustrative of the present application, and do not limit the scope of the present application. Likewise, the following examples are only some examples and not all examples of the present application, and all other examples obtained by a person of ordinary skill in the art without any inventive step are within the scope of the present application.
The terms "first", "second" and "third" in this application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any indication of the number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of the feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless explicitly specifically limited otherwise. All directional indications (such as up, down, left, right, front, and rear … …) in the embodiments of the present application are only used to explain the relative positional relationship between the components, the movement, and the like in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indication is changed accordingly. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
As consumers increasingly emphasize the sound quality of electronic devices, especially the bass effect, dual-cavity speakers have become an increasingly mainstream design in electronic devices. The sound cavity of the double-sound-cavity loudspeaker is divided into a front sound cavity and a rear sound cavity, and the front sound cavity and the rear sound cavity are completely separated; the back sound cavity directly influences the sound effect of the dual-sound-cavity loudspeaker, and theoretically, if the back sound cavity is completely sealed and the volume is larger, the bass effect is better; however, the electronic devices are becoming thinner and thinner, and the space occupied by each component is extremely limited, which makes the design of the rear sound cavity more and more difficult. The present application provides embodiments of a rear sound cavity assembly that can increase the volume of the rear sound cavity, thereby improving the low frequency characteristics of the sound and making the sound more pleasant to hear.
Referring to fig. 1, fig. 1 is a schematic diagram of a dual-tone-cavity speaker in an electronic device. The dual-cavity speaker 10 includes a speaker 11 and a cavity wall 12.
The speaker 11 is accommodated in a space surrounded by the sound cavity enclosing wall 12, and the space is divided into two spaces, wherein the space with a larger volume is the rear sound cavity 13, wherein the space with a smaller volume is the front sound cavity 14, and the rear sound cavity 13 is completely separated from the front sound cavity 14, so as to avoid the mutual interference and offset of front and rear sounds to cause small sound, meanwhile, the rear sound cavity 13 is completely sealed as far as possible, so as to avoid the occurrence of leakage to cause low-frequency attenuation, and the part of the sound cavity enclosing wall 12 corresponding to the front sound cavity 14 is provided with a front sound cavity sound outlet 15, so as to transmit the sound generated by the speaker 11.
Taking the musical sound as an example, the rear cavity 13 mainly affects the low frequency part of the musical sound, and the front cavity 14 mainly affects the high frequency part of the musical sound; the low frequency part of the music sound has a great influence on the sound quality, and generally, the lower frequency peak in a frequency response curve is more left, the more prominent the bass is, so that the music sound is subjectively perceived to be relatively pleasant. Theoretically, when designing the back cavity 13 of the dual cavity speaker 10, the volume of the back cavity 13 should be as large as possible, so that the low frequency wave peak in the frequency response curve is continuously shifted to the left, thereby continuously improving the low frequency characteristic of the music sound and making the music sound more pleasant to hear.
It can be understood that, when the dual chamber speaker 10 is applied to an electronic device, on one hand, since the size of the electronic device is fixed, the dual chamber speaker 10 contained therein cannot be infinite, that is, the volume of the back sound chamber 13 of the dual chamber speaker 10 cannot be infinite, and on the other hand, various components, such as a battery, a processor, an antenna, a speaker, etc., need to be contained inside the electronic device to achieve its rich functional applications, so that the inside of the electronic device is often "crowded", and the space left for the dual chamber speaker 10 is limited.
Therefore, when designing the dual-cavity speaker 10, it is necessary to fully utilize the limited space in the electronic device to increase the volume of the rear sound cavity 13 as much as possible, and simultaneously consider and avoid the influence of other elements on the sealing performance of the rear sound cavity 13, so as to improve the sound quality of the dual-cavity speaker 10, and further improve the experience effect of the user in terms of sound quality when using the electronic device.
Referring to fig. 2, fig. 2 is a schematic structural diagram of an embodiment of a rear sound cavity assembly provided in the present application. The rear cavity assembly 20 of the present embodiment includes a substrate 21, a first cavity wall member 22 and a second cavity wall member 23.
It should be understood that the enclosing wall member in this embodiment refers to a solid member with a certain thickness and height, two opposite sides of which are open, and a certain space inside, for example, it may be an annular member such as a circular ring, a square ring, etc., or it may be another solid member with an irregular shape, and is not limited herein.
The first and second sound cavity enclosing wall members 22 and 23 stand on the same side of the substrate 21. In the present embodiment, the first cavity wall member 22 and the second cavity wall member 23 are integrated with the substrate 21, for example, they may be injection molded into a single piece, so that the places where the first cavity wall member 22 and the second cavity wall member 23 are connected with the substrate 21 are completely sealed.
Alternatively, the first and second cavity wall members 22 and 23 and the substrate 21 may be separate members, for example, they may be separately injection-molded members, and then the first and second cavity wall members 22 and 23 and the substrate 21 are connected by a sealing member such as sealing foam.
Alternatively, the end surfaces of the first and second cavity enclosure members 22 and 23 remote from the base plate 21 are flush, that is, the first and second cavity enclosure members 22 and 23 are as high as the base plate 21.
The second sonic chamber enclosure member 23 is connected to the first sonic chamber enclosure member 22.
It is understood that some gaps, i.e. remaining spaces, are formed between the components inside the electronic device, and some of the remaining spaces are located near the rear sound cavity, in this embodiment, the remaining spaces are incorporated into the original rear sound cavity by disposing the second sound cavity enclosing member 23 around the first sound cavity enclosing member 22 and connecting the first sound cavity enclosing member 22 and the second sound cavity enclosing member 23.
Optionally, the first and second cavity enclosure members 22 and 23 are at least partially directly connected, but may be indirectly connected through other intermediate members, which is not limited herein.
Further, a first space 24 surrounded by the first cavity wall member 22 communicates with a second space 25 surrounded by the second cavity wall member 23.
In this embodiment, the first sound cavity enclosing member 22 includes a rectangular enclosing wall with one side partially opened, the second sound cavity enclosing member 23 includes a rectangular enclosing wall with one side opened, and the opened side of the second sound cavity enclosing member 23 is butted with the opening of the first sound cavity enclosing member 22, so that the first space 24 is communicated with the second space 25, as shown in fig. 3, thereby enlarging the volume of the rear sound cavity, further improving the low frequency characteristic of the sound, and making the sound more pleasant to hear.
It is to be understood that the rectangular bounding wall in the present embodiment may not be a strict rectangle whose four sides are all straight sides and perpendicular to each other, but may be a rectangle in general shape, in other words, the rectangular bounding wall may be provided according to the remaining space inside the electronic device, and may be an irregular shape such as a bent shape.
Optionally, there is a communication between the first and second sound cavity enclosure members 22 and 23, so that the first space 24 is communicated with the second space 25, that is, the first space 24 is indirectly communicated with the second space 25, although other communication manners are also possible, and the present invention is not limited thereto.
Optionally, the first space 24 has a volume greater than the volume of the second space 25 and is used to house a speaker assembly of the electronic device.
Referring collectively to fig. 2-4, fig. 4 is a cross-sectional schematic view of bridge member 26 of fig. 3.
The rear sound cavity assembly 20 further includes a bridge member 26, wherein the bridge member 26 includes two bridge abutments 261 standing on the substrate and a bridge 262 bridging the top ends of the two bridge abutments 261, and the bridge 262 is flush with the first sound cavity enclosing wall member 22 and the second sound cavity enclosing wall member 23.
Optionally, the bridge member 26 stands on the first space 24 in the first sonic chamber enclosure member 22, or the second space 25 in the second sonic chamber enclosure member 23, or the communication of the first space 24 and the second space 25.
In this embodiment, the bridge member 26 is located at one side of the second sound cavity wall member 23, and two ends of the bridge member are respectively connected to two opposite sidewalls of the second sound cavity wall member 23.
Specifically, the bridge member 26 stands in the second space 25 at a position close to the first space 24, and two bridge abutments 261 thereof are respectively connected to two opposite side walls of the second sound cavity enclosure member 23, and the first space 24 and the second space 25 are communicated at the bridge member 26.
Alternatively, bridge member 26 may lack two piers 261, i.e., bridge 262 directly bridges two opposite sidewalls of second sound cavity enclosure member 23.
Optionally, the bridge member 26 is of unitary construction with the second sound cavity enclosure member 23.
Referring collectively to fig. 2-5, fig. 5 is a schematic structural view of the sealing member 27 of fig. 2.
The rear sound cavity assembly 20 further includes a sealing member 27, and the sealing member 27 is attached to end surfaces of the first sound cavity enclosing wall member 22, the second sound cavity enclosing wall member 23, and the bridge member 26 away from the substrate 21.
Optionally, the sealing member 27 is a sealing foam, and the sealing foam is provided with openings 271 corresponding to the first space 24 and the second space 25.
Referring to fig. 2 to 6 together, fig. 6 is a schematic structural diagram of an embodiment of an electronic device provided in the present application. The electronic device 30 of the present embodiment may be any device having a sound output function, for example: mobile phones, tablet computers, Personal Computers (PCs), notebook computers, in-vehicle devices, network televisions, wearable devices, and the like.
The electronic device 30 provided by the present application includes the rear sound cavity assembly 20 and the speaker assembly 31 described above in the embodiments of the present application.
The specific structure of the back sound cavity assembly 20 can refer to the description of the above embodiments, and is not described herein again.
In this embodiment, the first sound cavity enclosing wall member 22 is provided with a sound outlet (not shown), the speaker assembly 31 is located in the first space 24, and the sound outlet (not shown) of the speaker assembly 31 is abutted with the opening of the first sound cavity enclosing wall member 22 to transmit the sound generated by the speaker assembly 31, and the surrounding of the joint of the two is completely sealed, so that the first space 24 is completely separated from the front sound cavity (not shown) of the dual-sound-cavity speaker at the sound outlet, thereby preventing the front and rear sounds from interfering and canceling each other to cause a small sound.
The electronic device 30 further includes a cover plate 32, and the cover plate 32 covers an end surface of the sealing member 27 away from the substrate 21 to seal the first space 24 and the second space 25, as shown in fig. 7.
Further, the bridge member 26 is disposed along a gap 34 between the cover plate 32 and another component 33 in the electronic device, and the sealing member 27 is further attached to an end surface of the bridge member 26 away from the base plate 21 to seal the first space 24 and the second space 25 at the gap 34.
It is understood that, because the electronic device 30 has a limited internal space and needs to arrange and accommodate a large number of components, there is inevitably a situation where the components overlap and interfere with each other, and if the back sound cavity assembly 20 or its cover plate 32 interferes with another component 33, the sealing performance of the back sound cavity assembly 20 may not be sufficient.
For example, in the above embodiment, the second sound cavity enclosing wall member 23 is disposed around the first sound cavity enclosing wall member 22, so that the volume of the rear sound cavity assembly 20 is increased, but other elements disposed in the space where the second sound cavity enclosing wall member 23 is located need to be considered, as shown in fig. 8, a gap 34 is generated at the joint between the cover plate 32 and the other element 33, and when the cover plate 32 is attached to the end surface of the sealing member 27 far from the substrate 21 to seal the first space 24 and the second space 25, the gap 34 may cause the sealing performance of the first space 24 and the second space 25 to be poor, as shown in fig. 9.
In the present embodiment, when the bridge member 26 is used in the case shown in fig. 9, the bridge member abuts against the seal 27 corresponding to the slit 34 to ensure the sealing performance of the first space 24 and the second space 25, as shown in fig. 10.
Be different from prior art's condition, the back tone chamber subassembly that this application provided includes the base plate and stands on the first tone chamber enclosure component of base plate homonymy, second tone chamber enclosure component, first tone chamber enclosure component and second tone chamber enclosure component are connected, and first tone chamber enclosure component centers on the first space that forms and second tone chamber enclosure component centers on the second space intercommunication that forms, make first space and second space intercommunication form a bigger space through this kind of mode, the volume in back tone chamber has been increased to a certain extent, can improve the bass effect of sound, thereby make sound feel more pleasing to the ear, simultaneously, under the condition that keeps current electronic equipment inner member compact arrangement, the space in back tone chamber has been enlarged.
The above description is only a part of the embodiments of the present application, and not intended to limit the scope of the present application, and all equivalent devices or equivalent processes performed by the content of the present application and the attached drawings, or directly or indirectly applied to other related technical fields, are also included in the scope of the present application.
Claims (3)
1. An electronic device, comprising a rear sound cavity assembly and a speaker assembly, wherein the rear sound cavity assembly comprises a base plate, a first sound cavity enclosing member, a second sound cavity enclosing member, a bridge member, a sealing member and a cover plate which are integrally formed, the first sound cavity enclosing member, the second sound cavity enclosing member and the bridge member are located on the same side of the base plate, the second sound cavity enclosing member is disposed at a peripheral residual space of the first sound cavity enclosing member and connected with the first sound cavity enclosing member, a first space surrounded by the first sound cavity enclosing member is communicated with a second space surrounded by the second sound cavity enclosing member, the cover plate is provided with another element of the electronic device at a position corresponding to the second sound cavity enclosing member, and a gap is generated at a joint of the cover plate and the another element, the bridge member comprises two bridge piers standing on the substrate and a bridge bridged at the top ends of the two bridge piers, two ends of the bridge are respectively connected with two opposite side walls of the second sound cavity enclosing wall member, and is arranged along the gap, the bridge is flush with the first sound cavity enclosing wall component and the second sound cavity enclosing wall component, the first sound cavity enclosing wall component is provided with a sound outlet, the loudspeaker component is positioned in the first space, and the sound outlet of the horn component is butted with the sound outlet of the first sound cavity enclosing wall component, and the first space is separated from the sound outlet, the sealing member is arranged on the end surfaces of the first sound cavity wall member, the second sound cavity wall member and the bridge member far away from the substrate, the cover plate and the other element are covered on the end face, far away from the base plate, of the sealing element, so that a rear sound cavity formed by the first space and the second space is sealed;
the second sound cavity enclosing wall member comprises a rectangular enclosing wall with one side being open, the first sound cavity enclosing wall member comprises a rectangular enclosing wall with one side being partially open, so that the first sound cavity enclosing wall member forms the bridge member, and the open side of the second sound cavity enclosing wall member is in butt joint with the opening of the first sound cavity enclosing wall member, so that the first space is communicated with the second space.
2. The electronic device of claim 1, wherein a volume of the first space is greater than a volume of the second space.
3. The electronic device according to claim 1, wherein the sealing member is a foam sealing member, and the foam sealing member is provided with openings corresponding to the first space and the second space, respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810623594.XA CN108769879B (en) | 2018-06-15 | 2018-06-15 | Back sound cavity subassembly and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810623594.XA CN108769879B (en) | 2018-06-15 | 2018-06-15 | Back sound cavity subassembly and electronic equipment |
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| CN108769879A CN108769879A (en) | 2018-11-06 |
| CN108769879B true CN108769879B (en) | 2021-10-15 |
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| CN201810623594.XA Active CN108769879B (en) | 2018-06-15 | 2018-06-15 | Back sound cavity subassembly and electronic equipment |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN209390357U (en) * | 2018-12-30 | 2019-09-13 | 瑞声科技(新加坡)有限公司 | Microphone device and electronic equipment |
| CN109889932A (en) * | 2019-02-25 | 2019-06-14 | 上海摩软通讯技术有限公司 | A kind of loudspeaker cavity |
| CN111064834B (en) * | 2019-12-26 | 2021-06-22 | 重庆蓝岸通讯技术有限公司 | Sound cavity structure of electronic equipment |
| CN114070913A (en) * | 2020-08-07 | 2022-02-18 | Oppo广东移动通信有限公司 | Electroacoustic component and electronic equipment |
| CN112153500B (en) * | 2020-08-27 | 2022-03-29 | 瑞声新能源发展(常州)有限公司科教城分公司 | Loudspeaker box |
| CN112629455B (en) * | 2020-12-15 | 2022-08-26 | 广东小天才科技有限公司 | Battery deformation detection method and device, detection equipment and storage medium |
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| CN204681568U (en) * | 2015-06-05 | 2015-09-30 | 歌尔声学股份有限公司 | A kind of loud speaker module assembly structure |
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| US8594351B2 (en) * | 2006-06-30 | 2013-11-26 | Bose Corporation | Equalized earphones |
| CN101222784B (en) * | 2007-01-12 | 2011-08-24 | 富准精密工业(深圳)有限公司 | Loudspeaker box structure and mobile electronic equipments adopting the same |
| CN101742376A (en) * | 2008-11-24 | 2010-06-16 | 苏州佳世达电通有限公司 | Tunable rear sound cavity mechanism and electronic device with rear sound cavity |
| CN201657237U (en) * | 2009-12-07 | 2010-11-24 | 联想移动通信科技有限公司 | Portable communication terminal with extensible audio cavity |
| CN102413406B (en) * | 2011-11-16 | 2014-05-21 | 瑞声声学科技(深圳)有限公司 | Sound production device |
| CN204069237U (en) * | 2014-07-01 | 2014-12-31 | 深圳市金立通信设备有限公司 | Audio cavity structure and there is the terminal of this audio cavity structure |
| US9654863B2 (en) * | 2014-12-08 | 2017-05-16 | Apple Inc. | Main logic board with mounted speaker and integrated acoustic cavity |
| CN204425611U (en) * | 2015-02-02 | 2015-06-24 | 瑞声光电科技(常州)有限公司 | Loudspeaker enclosure |
| CN104811857B (en) * | 2015-04-30 | 2018-09-07 | 歌尔股份有限公司 | Loud speaker module |
| CN105592390A (en) * | 2016-03-15 | 2016-05-18 | 歌尔声学股份有限公司 | Loudspeaker module group housing loudspeaker module group |
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| CN204681568U (en) * | 2015-06-05 | 2015-09-30 | 歌尔声学股份有限公司 | A kind of loud speaker module assembly structure |
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