CN108767127A - A kind of production method of display panel, display panel and display device - Google Patents
A kind of production method of display panel, display panel and display device Download PDFInfo
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- CN108767127A CN108767127A CN201810524710.2A CN201810524710A CN108767127A CN 108767127 A CN108767127 A CN 108767127A CN 201810524710 A CN201810524710 A CN 201810524710A CN 108767127 A CN108767127 A CN 108767127A
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- display panel
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- base board
- flexible base
- adhesive
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
This application discloses a kind of production method of display panel, display panel and display device, which includes the backboard being stacked, flexible base board, buffer layer, polysilicon layer and thin-film encapsulation layer, and backboard is pasted with flexible base board by adhesive；Wherein, flexible base board is titanium alloy layer.By the above-mentioned means, the application can improve the bending performance of display panel, while reducing the thickness of display panel.
Description
Technical field
This application involves display technology fields, and in particular to a kind of production method of display panel, display panel and display
Device.
Background technology
As (Active-matrix organic light emitting diode, active matrix have rigid AMOLED
Machine light emitting diode) turn to flexibility AMOLED technologies promotion, global OLED industrial circles formed flexible AMOLED be technology send out
Open up the common recognition in direction.Meanwhile from the point of view of the developing direction of end product, flexible AMOLED display screens are consumers to intelligent hand
The demand orientation of the products such as machine, wearable device, VR, and to the revolutionary change of display mode.
But the bent characteristic of flexible screen has each structure very high requirement, and mainstream flexibility AMOLED manufacturers adopt at present
It is that PI (polyimides) does flexible base board.Compared to glass, PI has preferable mechanical property, resistant to chemical etching and height exhausted
Edge can allow display screen to be realized flexible.But that there are coefficient of thermal expansion is big for traditional PI substrate, heat resistance is bad, do not allow easy cleaning,
Easy ting produce particle and bubble, processing procedure can lead to breaking bad phenomenon and block water, the shortcomings of oxygen barrier is poor below, be terrible
To the flexible display screen of more excellent performance, how to obtain flexible base board seems most important.
Invention content
The application mainly solves the problems, such as to be to provide a kind of production method of display panel, display panel and display device,
The bending performance of display panel can be improved, while reducing the thickness of display panel.
In order to solve the above technical problems, the application is the technical solution adopted is that provide a kind of display panel, the display panel
Including backboard, flexible base board, buffer layer, polysilicon layer and the thin-film encapsulation layer being stacked, backboard passes through viscous with flexible base board
Mixture is pasted；Wherein, flexible base board is titanium alloy layer.
In order to solve the above technical problems, another technical solution that the application uses is to provide a kind of making side of display panel
Method, this method include：One substrate and flexible base board are provided；Flexible base board is bonded with substrate using adhesive；In flexibility
Buffer layer, polysilicon layer and thin-film encapsulation layer are made on substrate successively；Substrate is removed from flexible base board, and by flexible base board
With backplane；Wherein, flexible base board is titanium alloy layer.
Through the above scheme, the advantageous effect of the application is：The display panel includes the backboard being stacked, flexible base
Plate, buffer layer, polysilicon layer and thin-film encapsulation layer；Backboard is pasted with flexible base board by adhesive；Flexible base board is titanium
Alloy-layer, therefore flexible base board has preferable flexibility and high temperature resistance, to improve the bending performance of display panel, by
In having used relatively thin titanium alloy layer, as flexible base board, the thickness of display panel reduces, while improving the resistance to of display panel
It is hot and block water, oxygen resistance.
Description of the drawings
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for
For those of ordinary skill in the art, without creative efforts, other are can also be obtained according to these attached drawings
Attached drawing.Wherein：
Fig. 1 is the structural schematic diagram of flexible base board in the prior art；
Fig. 2 is the structural schematic diagram of one embodiment of display panel provided by the present application；
Fig. 3 is the structural schematic diagram of another embodiment of display panel provided by the present application；
Fig. 4 is the structural schematic diagram of Optical transparent adhesive in another embodiment of display panel provided by the present application；
Fig. 5 is the flow diagram of one embodiment of production method of display panel provided by the present application；
Fig. 6 be display panel provided by the present application one embodiment of production method in display panel structural schematic diagram；
Fig. 7 is the structural schematic diagram of one embodiment of display device provided by the present application.
Specific implementation mode
Below in conjunction with the attached drawing in the embodiment of the present application, technical solutions in the embodiments of the present application carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of embodiments of the present application, rather than whole embodiments.Based on this
Embodiment in application, those of ordinary skill in the art are obtained every other under the premise of not making performing creative labour
Embodiment shall fall in the protection scope of this application.
Since PI has the characteristics that flexible, good toughness, can not make as bearing substrate in display device manufacturing process
With, need by PI be coated in carrier glass substrate on, complete display device make after, then with laser lift-off technique by PI substrates from
It is detached on glass substrate, to obtain flexible display apparatus.When carrying out laser lift-off, the high-energy of laser easily influences display panel
TFT device electrics, reduce product yield.Therefore there are the double-deck PI structures, increase inorganic barrier layer between two layers of PI, with
Conduction of the energy to TFT devices when slowing down laser lift-off, but this requires inorganic layer thickness thicker, just reduces the soft of flexible base board
Toughness.
Refering to fig. 1, Fig. 1 is the structural schematic diagram of flexible base board in the prior art, which includes support plate 11,
One flexible layer 12, inorganic barrier layer 13 and the second flexible layer 14.
First flexible layer 12 is coated on 11 side of support plate；Inorganic barrier layer 13 is made of the film of plane SH wave, is formed
In the first flexible layer 12 side different with support plate 11；Second flexible layer 14 is coated on inorganic barrier layer 13 and the first flexible layer
12 different sides, and form with the first flexible layer 12 structure of coated inorganic barrier layer 13.
Support plate 11 is glass support plate；First flexible layer 12 and the second flexible layer 14 are that identical high light transmission can high temperature resistant
Material, can be PI；The thickness of first flexible layer 12 and the second flexible layer 14 can be 10 μm, the thickness of inorganic barrier layer 13
Degree can be 500nm.
The flexible OLED display panel of the prior art, the inorganic barrier layer thickness in flexible base board is larger, affects soft
The flexibility of property OLED display panel, causes flexible OLED display panel to be difficult to reach ideal bending effect.
Referring to Fig.2, Fig. 2 is the structural schematic diagram of one embodiment of display panel provided by the present application, which includes
Backboard 21, flexible base board 22, buffer layer 23, polysilicon layer 24 and the thin-film encapsulation layer 25 being stacked；Flexible base board 22 is titanium
Alloy-layer.
Backboard 21 is pasted with flexible base board 22 by adhesive；The material of adhesive is epoxy resin, organosilicon rubber
The one of which of glue, acrylic type resin and unsaturated polyester (UP) and polyurethane etc..
Titanium alloy has excellent flexibility, and the elongation percentage of PI is more than 15%, and the elongation percentage of titanium alloy is more than 50%；Titanium
Also there is alloy high temperature resistance, the highest processing temperature of PI to be less than 550 DEG C, and the highest processing temperature of titanium alloy is at least 1000
DEG C or more, to be significantly larger than the highest processing temperature of PI；The surface roughness Ra of titanium alloy can be less than 1nm, make display
Screen more planarizes.Meanwhile titanium alloy belongs to memory metal, has memory function, is conducive to the bending restorability of device, it can be with
Largely improve the bending performance of display panel.
Traditional PI flexible base board is three using the first flexible layer 12, inorganic barrier layer 13 and third flexible layer 14
Layer structure, thickness are 20.5 μm, and the application replaces traditional PI flexible base board using titanium alloy, and the thickness of titanium alloy layer is 10 μ
M makes the thickness of flexible base board 22 be thinned using titanium alloy layer as the flexible substrates of flexibility AMOLED, while improving soft
The flexibility of property substrate 22, and improve the heat resistance of flexible base board 22 and block water, oxygen resistance.
Display panel is exposed in vapor or oxygen may be to the organic material and structural detail in display panel
It is harmful；For the organic material in display panel, it is exposed to and may be decreased shining for display panel in vapor and oxygen
The luminous power of material itself；For the structural detail in display panel, for example, the work usually used in display panel
Property metallic cathode is exposed in these pollutants, be will produce dark color spots area as time goes by, is shortened the use of display panel
Service life.It is therefore prevented that the constituent element and material of display panel are exposed to environmental pollution (such as：Vapor and oxygen) it is beneficial
's.
It is different from the prior art, present embodiments provides a kind of display panel, which includes the back of the body being stacked
Plate 21, flexible base board 22, buffer layer 23, polysilicon layer 24 and thin-film encapsulation layer 25；Backboard 21 passes through bonding with flexible base board 22
Agent is pasted；Flexible base board 22 is titanium alloy layer, therefore flexible base board 22 has preferable flexibility and high temperature resistance, from
And the bending performance of display panel is improved, due to the use of relatively thin titanium alloy layer as flexible base board, the thickness of display panel
Reduce, while improving the heat resistance of display panel and blocking water, oxygen resistance.
It is the structural schematic diagram of one embodiment of display panel provided by the present application, the display panel refering to Fig. 3 and Fig. 4, Fig. 3
Including backboard 31, flexible base board 32, buffer layer 33, polysilicon layer 34 and the thin-film encapsulation layer 35 being stacked.
Wherein, the material of backboard 31 is polyethylene terephthalate (PET), and the thickness of backboard 31 is 50 μm；Backboard
31 are pasted with flexible base board 32 by adhesive 36.
Adhesive 36 is Optical transparent adhesive (OCA, Optically Clear Adhesive) 40, and thickness is 25 μm；Light
The advantages that transparent adhesive tape 40 can cure at normal temperatures since high with light transmission rate, adhesion strength is big, and cure shrinkage is smaller,
It is therefore widely used in the fitting of flexible base board 32 and backboard 31.
The structural schematic diagram of Optical transparent adhesive 40 is as shown in figure 4, Optical transparent adhesive 40 includes optical clear glue-line 42, first
Release film 41 and the second release film 43, the first release film 41 and the second release film 43 are pressed on the two of optical clear glue-line 42 respectively
Side first removes the first release film 41 during the fitting of flexible base board 32 and backboard 31 from optical clear glue-line 42, then
Backboard 31 and optical clear glue-line 42 are bonded, then removed the second release film 43 from optical clear glue-line 42, then will be soft
Property substrate 32 and optical clear glue-line 42 bond so that flexible base board 32 and backboard 31 are bonded by optical clear glue-line 42.
Flexible base board 32 is titanium alloy layer, and the thickness of titanium alloy layer is 10 μm, therefore the thickness of flexible base board 32 is less than now
There is the thickness of flexible base board in technology；The thickness of buffer layer 33 is 500nm.
Thin-film encapsulation layer 35 includes at least one organic encapsulation layer and at least one inorganic encapsulated layer；Polysilicon layer 34 and thin
It includes anode layer 371, the luminescent material being stacked to have an organic luminous layer 37, organic luminous layer 37 between film encapsulated layer 35
372 and cathode layer 373；Cathode layer 373 uses the material preparation of high conductivity and the high grade of transparency；In the upper table of cathode layer 373
Face may be used thin film encapsulation technology when forming thin-film encapsulation layer 35 and be packaged.
Display panel also has a cover board 38, and the upper surface of thin-film encapsulation layer 35 is fitted in by optical film.
It is different from the prior art, present embodiments provides a kind of display panel, which includes the back of the body being stacked
Plate 31, flexible base board 32, buffer layer 33, polysilicon layer 34, organic luminous layer 37, thin-film encapsulation layer 35 and cover board 38；Backboard 31
It is pasted by Optical transparent adhesive with flexible base board 32；Flexible base board 32 be titanium alloy layer, therefore flexible base board 32 have compared with
Good flexibility and high temperature resistance, to improve the bending performance of display panel, while improve the heat resistance of display panel with
And it blocks water, oxygen resistance；And the thickness of flexible base board 32 reduces, so that the thickness of display panel is reduced.
It is the flow diagram of one embodiment of production method of display panel provided by the present application refering to Fig. 5 and Fig. 6, Fig. 5,
This method includes：
Step 51：One substrate 61 and flexible base board 62 are provided.
Wherein, substrate 61 can be glass substrate；Flexible base board 62 is titanium alloy layer, can be obtained using the micro- casting of photoetching
10 μm of titanium alloy layer.
Step 52：Flexible base board 62 is bonded with substrate 61 using adhesive 63.
In order to which flexible base board 62 is bonded with substrate 61 using adhesive 63, it is necessary first to be applied in 61 upper surface of substrate
Cloth adhesive 63；The material of adhesive 63 is epoxy resin, organic silicon rubber, acrylic type resin and unsaturated polyester (UP) and poly- ammonia
Ester etc.；Preferably, adhesive 63 is Optical transparent adhesive, and thickness is 25 μm.
Step 53：Make buffer layer 64, polysilicon layer 65 and thin-film encapsulation layer 66 successively on flexible base board 62.
Step 54：Substrate 61 is removed from flexible base board 62, and by flexible base board 62 and backplane.
The bonding of titanium alloy layer and substrate 61 be weak cohesive force binder, in order to by substrate 61 from flexible base board 62
Upper stripping directly can be removed directly using physics mode, without using laser lift-off technique by flexible base board 62 from substrate 61
Upper stripping.
62 note of flexible base board is overlayed on substrate 61 using binder in the prior art, after having prepared display panel,
The method that its back side uses superlaser beam scanning so that aging occurs for binder, and adhesive performance declines, so that flexible base
Plate 62 can be stripped down from substrate 61, but this method due to need use superlaser beam scanning, production efficiency compared with
It is low, and the uniformity removed is poor, but also the device of display panel can be impacted；However use titanium alloy layer as soft
Property substrate 62, then can be to avoid influence of the high-energy to display panel device of laser.
After removing substrate 61 from flexible base board 62, flexible base board 62 is bonded with backboard.
It is different from the prior art, present embodiments provides a kind of production method of display panel, a substrate 61 is provided first
With flexible base board 62；Secondly flexible base board 62 is bonded with substrate 61 using adhesive 63；Then on flexible base board 62
Buffer layer 64, polysilicon layer 65 and thin-film encapsulation layer 66 are made successively；Finally substrate 61 is stripped down from flexible base board 62,
And by flexible base board 62 and backplane；Due to the use of titanium alloy layer as flexible base board 62, thus flexible base board 62 have compared with
Good flexibility and high temperature resistance, to improve the bending performance of display panel, and the thickness of flexible base board 62 reduces, from
And the thickness of display panel is reduced.
It is the structural schematic diagram of one embodiment of display device provided by the present application, the display device 70 packet refering to Fig. 7, Fig. 7
It includes the display panel 71 in above-described embodiment or uses the prepared display panel of method in above-described embodiment；The display fills
It can be mobile phone, display, tablet computer etc. to set, and be only situation in wherein one shown in Fig. 7.
It these are only embodiments herein, be not intended to limit the scope of the claims of the application, it is every to be said using the application
Equivalent structure or equivalent flow shift made by bright book and accompanying drawing content is applied directly or indirectly in other relevant technology necks
Domain includes similarly in the scope of patent protection of the application.
Claims (10)
1. a kind of display panel, which is characterized in that including backboard, flexible base board, buffer layer, the polysilicon layer and thin being stacked
Film encapsulated layer, the backboard are pasted with the flexible base board by adhesive；Wherein, the flexible base board is titanium alloy
Layer.
2. display panel according to claim 1, which is characterized in that
The thickness of the titanium alloy layer is 10 μm, and the thickness of the buffer layer is 500nm.
3. display panel according to claim 1, which is characterized in that
It includes that stacking is set to have an organic luminous layer, the organic luminous layer between the polysilicon layer and the thin-film encapsulation layer
Anode layer, luminescent material and the cathode layer set.
4. display panel according to claim 1, which is characterized in that
The display panel also has a cover board, and the upper surface of the thin-film encapsulation layer is fitted in by optical film.
5. display panel according to claim 1, which is characterized in that
The material of the backboard is polyethylene terephthalate, and the thickness of the backboard is 50 μm.
6. display panel according to claim 1, which is characterized in that
Described adhesive is Optical transparent adhesive, and thickness is 25 μm.
7. display panel according to claim 6, which is characterized in that
The material of described adhesive is epoxy resin, organic silicon rubber, acrylic type resin and unsaturated polyester (UP) and polyurethane.
8. a kind of production method of display panel, which is characterized in that including：
One substrate and flexible base board are provided；
The flexible base board is bonded with the substrate using adhesive；
Make buffer layer, polysilicon layer and thin-film encapsulation layer successively on the flexible base board；
The substrate is removed from the flexible base board, and by the flexible base board and backplane；
Wherein, the flexible base board is titanium alloy layer.
9. the production method of display panel according to claim 8, which is characterized in that
Before described the step of being bonded the flexible base board using adhesive with the substrate, including：
Surface is coated with described adhesive over the substrate；Wherein, described adhesive is Optical transparent adhesive, and thickness is 25 μm.
10. a kind of display device, which is characterized in that the display device includes as claim 1-7 any one of them is shown
Panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201810524710.2A CN108767127A (en) | 2018-05-28 | 2018-05-28 | A kind of production method of display panel, display panel and display device |
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| CN201810524710.2A CN108767127A (en) | 2018-05-28 | 2018-05-28 | A kind of production method of display panel, display panel and display device |
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Cited By (3)
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|---|---|---|---|---|
| CN109873015A (en) * | 2019-02-27 | 2019-06-11 | 武汉华星光电半导体显示技术有限公司 | Organic LED panel and its manufacturing method |
| CN110164310A (en) * | 2019-05-27 | 2019-08-23 | 武汉华星光电半导体显示技术有限公司 | Flexible display panels and display device |
| WO2021120429A1 (en) * | 2019-12-17 | 2021-06-24 | 武汉华星光电半导体显示技术有限公司 | Back plate and display panel |
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