CN108682474A - A kind of high flowing carrier band PC/PE alloy conductive plastics and preparation method thereof - Google Patents
A kind of high flowing carrier band PC/PE alloy conductive plastics and preparation method thereof Download PDFInfo
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- CN108682474A CN108682474A CN201810367890.8A CN201810367890A CN108682474A CN 108682474 A CN108682474 A CN 108682474A CN 201810367890 A CN201810367890 A CN 201810367890A CN 108682474 A CN108682474 A CN 108682474A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
- H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
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- H—ELECTRICITY
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
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Abstract
The invention discloses a kind of high flowing carrier band PC/PE alloy conductive plastics, including following components in percentage by weight：50 60% Conductive plastic masterbatch, 37 46% PC plastic matrix and 3 6% compatilizers, wherein the Conductive plastic masterbatch comprises the following raw materials by weight percent：38 48% conductive additive, 48 58% PE plastic substrates, 0.5 2% antioxidant and 0.5 4% dispersant.The carrier band of the present invention is good with PC/PE alloy conductive plastic flow properties, and lower than import conduction PC masterbatch processing temperatures, the requirement to process equipment is relatively low, easy to process, and can be added with large scale, while cost is relatively low, cost-effective, has good mechanical property.
Description
Technical field
The present invention relates to conductive plastic object technical fields, relate more specifically to a kind of high flowing carrier band PC/PE alloys
Conductive plastics and preparation method thereof.
Background technology
Conductive plastics is to mix resin and conductive materials, the functional macromolecule being processed with the processing method of plastics
Material.Conductive plastics is mainly used in the anti-electromagnetism screen of antisatic additive, computer, smart window, light emitting diode, solar energy
Fields, the application prospects such as battery, mobile phone, micro-television screen are very extensive.
The domestic conductive PC plastic processing temperature for being presently used for the electronic packaging materials of sheet material carrier band is high, melt viscosity
Greatly, production and processing is more difficult, and basic structure is：Plastic material+conductive black+auxiliary agent.Domestic conduction PC plastic, melt are viscous
Degree is high, and in production and processing, screw torque is big, and equipment loss is fast.In addition, external existing conductive PC plastic masterbatch generally cannot
It adds, is at high price and more demanding to process equipment and processing conditions.
Therefore, it is necessary to develop a kind of mobility is good, processing temperature is low, and the requirement to process equipment is relatively low, easy to process
Carrier band conductive plastics.
Invention content
That the object of the present invention is to provide a kind of mobility is good, processing temperature is low, the requirement to process equipment is relatively low, be easy to plus
The carrier band of work PC/PE alloy conductive plastics.
The technical solution adopted by the present invention is：A kind of high flowing carrier band PC/PE alloy conductive plastics, including following weight
The component of percentage：The Conductive plastic masterbatch of 50-60%, the PC plastic matrix of 37-46% and 3-6% compatilizers, wherein described
Conductive plastic masterbatch comprises the following raw materials by weight percent：The conductive additive of 38-48%, the PE plastics bases of 48-58%
The dispersant of body, the antioxidant of 0.5-2% and 0.5-4%.
Preferably, the PE plastic substrates are at least one of LDPE, MDPE, HDPE and LLDPE.
Preferably, the conductive additive is at least one of conductive black, electrically conductive graphite and conductive carbon fibres.It is preferred that
, conductive additive is selected from the conductive additive of Cabot, Degussa and Colombia's production, with excellent electric conductivity and
Mobility.
Preferably, the antioxidant be 1010,168,1076,242,626, at least one of B225 and B215.
Preferably, the dispersant is ethylene bis stearamide, PE waxes, EVA waxes, triethyl group hexyl phosphoric acid, dodecyl
At least one of sodium sulphate, silicone powder, methyl anyl alcohol, polyacrylamide, oxidized polyethylene wax and fatty acid polyethylene glycol ester.
Preferably, the compatilizer is SBS, SEBS, maleic anhydride-g-SBS, Maleic anhydride-containg polyethylene, MBS and height
At least one of rubber powder.Compatilizer can make each plastic fraction mixing of system mutual in the case where not reducing system electric conductivity
It is molten and reach preferable comprehensive mechanical property.
Preferably, the PC plastic matrix is at least one of injection grade PC and extrusion grade PC.
The present invention also provides the preparation methods of high flowing carrier band PC/PE alloy conductive plastics, include the following steps：
1) be warming up to 90-100 DEG C, by conductive additive and dispersant, add PE plastic substrates and antioxidant after
It is continuous to be mixed to get mixture, then by mixture melting extrusion, obtain Conductive plastic masterbatch；
2) Conductive plastic masterbatch is mixed with PC plastic matrix, compatilizer is added, remelted extruding pelletization flows to get to height
Dynamic load band PC/PE alloy conductive plastics.
Preferably, in step 1), conductive additive and dispersant are turned in high speed mixer with 500-800r/min
Speed mixing 5-6min；In step 2), by Conductive plastic masterbatch and PC plastic matrix with 200-400r/min in low speed batch mixer
Rotating speed mixing 5-10min.
Preferably, in step 1), control condition is when mixture melting extrusion：160 DEG C -200 DEG C of temperature, twin-screw extrusion
Engine speed is 350rpm；In step 2), control condition is when melting extrusion is granulated：210 DEG C -250 DEG C of temperature, twin-screw extrusion
Engine speed is 400rpm.
More specifically, the preparation method of high flowing carrier band PC/PE alloy conductive plastics, includes the following steps：
1) high mixer is warming up to 90-100 DEG C, it in proportion will be fully mixed in conductive additive, dispersant high speed mixer
5-6min is closed, adds PE plastic substrates, antioxidant continues to mix 5-6min, then mixture is placed in melt in extruder and is squeezed
Go out, obtains Conductive plastic masterbatch；
2) Conductive plastic masterbatch, PC plastic matrix and compatilizer are placed in low speed batch mixer to be uniformly mixed, then are placed in extrusion
Melting extrusion is granulated in machine.
Preparation process of the present invention be initially formed conductive plastic base particle (containing PE plastic substrates), then by conductive plastic base particle with
The mixing of PC plastic matrix prepares the functional composite material with island structure by double-screw extruding pelletizing；This island structure
Mainly conductive additive is preferentially scattered in PE matrixes and prepares conductive plastic base particle, conducting masterbatch is further walked as dispersed phase
It is scattered in PC plastic, forms island structure, this improves the content of conductive material, improves electric conductivity indirectly.
The preparation method can substantially reduce the additive amount of conductive filler and reach identical electric conductivity, while keep gained conductive
PC/PE alloy plastics are lower than conductive PC plastic good fluidity, processing temperature, to reduce processing cost.
The beneficial effects of the invention are as follows：The carrier band of the present invention is good with PC/PE alloy conductive plastic flow properties, than import conduction
PC masterbatch processing temperatures are low, and the requirement to process equipment is relatively low, easy to process, and can be added with large scale, while cost is relatively low,
It is cost-effective, there is good mechanical property.
Specific implementation mode
A kind of high flowing carrier band PC/PE alloy conductive plastics, including following components in percentage by weight：50-60%'s
Conductive plastic masterbatch, the PC plastic matrix of 37-46% and 3-6% compatilizers, wherein the Conductive plastic masterbatch is by following weight
The raw material of percentage forms：The conductive additive of 38-48%, the PE plastic substrates of 48-58%, 0.5-2% antioxidant and
The dispersant of 0.5-4%.
The preparation method of height flowing carrier band PC/PE alloy conductive plastics, includes the following steps：
1) be warming up to 90-100 DEG C, by conductive additive and dispersant, add PE plastic substrates and antioxidant after
It is continuous to be mixed to get mixture, then by mixture melting extrusion, obtain Conductive plastic masterbatch；
2) Conductive plastic masterbatch is mixed with PC plastic matrix, compatilizer is added, remelted extruding pelletization flows to get to height
Dynamic load band PC/PE alloy conductive plastics.
The formula of the present invention is described further with reference to specific embodiment.
Embodiment 1
A kind of high flowing carrier band PC/PE alloy conductive plastics, formula composition such as following table：
Table 1：The formula composition of carrier band PC/PE alloy conductive plastics
| Raw material | Mass percentage |
| Conductive plastic masterbatch | 60% |
| Injection grade PC plastic matrix | 37% |
| Compatilizer SEBS | 3% |
The formula composition of Conductive plastic masterbatch such as following table：
Table 2：The formula composition of conducting masterbatch
| Raw material | Mass percentage |
| Conductive black | 38% |
| LDPE plastic substrates | 58% |
| Antioxidant 1010 | 1% |
| Dispersant fatty acid polyethylene glycol ester | 3% |
The preparation method of height flowing carrier band PC/PE alloy conductive plastics, includes the following steps：
1) it is warming up to 90-100 DEG C, by conductive additive (conductive black) and dispersant (fatty acid polyethylene glycol ester) in height
With the rotating speed mixing 5-6min of 500-800r/min in fast batch mixer, PE plastic substrates (LDPE) and antioxidant (1010) are added
Continue to be mixed to get mixture, then by mixture melting extrusion, obtains Conductive plastic masterbatch；
2) by Conductive plastic masterbatch and PC plastic matrix in low speed batch mixer with the rotating speed mixing 5- of 200-400r/min
10min is mixed, and compatilizer (SEBS) is added, and remelted extruding pelletization is moulded to get to height flowing carrier band PC/PE alloy conductives
Material.
In step 1), control condition is when mixture melting extrusion：160 DEG C -200 DEG C of temperature, twin-screw extrusion host turn
Speed is 350rpm；In step 2), control condition is when melting extrusion is granulated：210 DEG C -250 DEG C of temperature, twin-screw extrusion host turn
Speed is 400rpm.
Embodiment 2
A kind of high flowing carrier band PC/PE alloy conductive plastics, formula composition such as following table：
Table 3：The formula composition of carrier band PC/PE alloy conductive plastics
The formula composition of Conductive plastic masterbatch such as following table：
Table 4：The formula composition of conducting masterbatch
| Raw material | Mass percentage |
| Electrically conductive graphite | 43.5% |
| MDPE plastic substrates | 55% |
| Antioxidant 1076 | 1% |
| Dispersant EVA waxes | 0.5% |
The preparation method of height flowing carrier band PC/PE alloy conductive plastics is identical as the preparation method of embodiment 1.
Embodiment 3
A kind of high flowing carrier band PC/PE alloy conductive plastics, formula composition such as following table：
Table 5：The formula composition of carrier band PC/PE alloy conductive plastics
| Raw material | Mass percentage |
| Conductive plastic masterbatch | 54% |
| Injection grade PC plastic matrix | 42.5% |
| Compatilizer SBS | 3.5% |
The formula composition of Conductive plastic masterbatch such as following table：
Table 6：The formula composition of conducting masterbatch
| Raw material | Mass percentage |
| Conductive black | 44.5% |
| LLDPE plastic substrates | 50% |
| Antioxidant B225 | 1.5% |
| Dispersant silicone powder | 4% |
The preparation method of height flowing carrier band PC/PE alloy conductive plastics is identical as the preparation method of embodiment 1.
Embodiment 4
A kind of high flowing carrier band PC/PE alloy conductive plastics, formula composition such as following table：
Table 7：The formula composition of carrier band PC/PE alloy conductive plastics
| Raw material | Mass percentage |
| Conductive plastic masterbatch | 52% |
| Extrusion grade PC plastic matrix | 42% |
| Compatilizer MBS | 6% |
The formula composition of Conductive plastic masterbatch such as following table：
Table 8：The formula composition of conducting masterbatch
The preparation method of height flowing carrier band PC/PE alloy conductive plastics is identical as the preparation method of embodiment 1.
Embodiment 5：
A kind of high flowing carrier band PC/PE alloy conductive plastics, formula composition such as following table：
Table 9：The formula composition of carrier band PC/PE alloy conductive plastics
| Raw material | Mass percentage |
| Conductive plastic masterbatch | 50% |
| Injection grade PC plastic matrix | 46% |
| Compatilizer SBS | 4% |
The formula composition of Conductive plastic masterbatch such as following table：
Table 10：The formula composition of conducting masterbatch
| Raw material | Mass percentage |
| Conductive black | 48% |
| HDPE plastic matrix | 51% |
| Antioxidant B215 | 0.5% |
| Dispersant oxidized polyethylene wax | 0.5% |
The preparation method of height flowing carrier band PC/PE alloy conductive plastics is identical as the preparation method of embodiment 1.
Comparative example 1
A kind of PC conductive plastics, formula composition such as following table：
Table 11：The formula composition of PC conductive plastics
| Raw material | Mass percentage |
| Conductive plastic masterbatch | 54% |
| Injection grade PC plastic matrix | 42.5% |
| Compatilizer SBS | 3.5% |
The formula composition of Conductive plastic masterbatch such as following table：
Table 12：The formula composition of conducting masterbatch
| Raw material | Mass percentage |
| Conductive black | 44.5% |
| Injection grade PC plastic matrix | 50% |
| Antioxidant B225 | 1.5% |
| Dispersant silicone powder | 4% |
The preparation method of PC conductive plastics, includes the following steps：
1) it is warming up to 90-100 DEG C, by conductive additive (conductive black) and dispersant (silicone powder) in high speed mixer
With the rotating speed mixing 5-6min of 500-800r/min, adds PC plastic matrix and antioxidant (B225) continues to be mixed to get mixing
Object, then by mixture melting extrusion, obtain Conductive plastic masterbatch；
2) by Conductive plastic masterbatch and PC plastic matrix in low speed batch mixer with the rotating speed mixing 5- of 200-400r/min
10min is mixed, and compatilizer (SBS) is added, remelted extruding pelletization is to get to PC conductive plastics.
In step 1), control condition is when mixture melting extrusion：160 DEG C -200 DEG C of temperature, twin-screw extrusion host turn
Speed is 350rpm；In step 2), control condition is when melting extrusion is granulated：210 DEG C -250 DEG C of temperature, twin-screw extrusion host turn
Speed is 400rpm.
Comparative example 2
A kind of PE conductive plastics, formula composition such as following table：
Table 13：The formula composition of PE conductive plastics
| Raw material | Mass percentage |
| Conductive plastic masterbatch | 54% |
| LLDPE plastic substrates | 42.5% |
| Compatilizer SBS | 3.5% |
The formula composition of Conductive plastic masterbatch such as following table：
Table 14：The formula composition of conducting masterbatch
| Raw material | Mass percentage |
| Conductive black | 44.5% |
| LLDPE plastic substrates | 50% |
| Antioxidant B225 | 1.5% |
| Dispersant silicone powder | 4% |
The preparation method of PE conductive plastics, includes the following steps：
1) it is warming up to 90-100 DEG C, by conductive additive (conductive black) and dispersant (silicone powder) in high speed mixer
With the rotating speed mixing 5-6min of 500-800r/min, adds PE plastic substrates (LLDPE) and antioxidant (B225) continues to mix
Mixture is obtained, then by mixture melting extrusion, obtains Conductive plastic masterbatch；
2) Conductive plastic masterbatch is mixed in low speed batch mixer with the rotating speed of 200-400r/min with LLDPE plastic substrates
5-10min mixing is closed, compatilizer (SBS) is added, remelted extruding pelletization is to get to PE conductive plastics.
In step 1), control condition is when mixture melting extrusion：160 DEG C -200 DEG C of temperature, twin-screw extrusion host turn
Speed is 350rpm；In step 2), control condition is when melting extrusion is granulated：210 DEG C -250 DEG C of temperature, twin-screw extrusion host turn
Speed is 400rpm.
Comparative example 3
A kind of PC/PE alloy conductives plastics, formula composition such as following table：
Table 15：The formula composition of PC/PE alloy conductive plastics
| Raw material | Mass percentage |
| Conductive plastic masterbatch | 54% |
| Injection grade PC plastic matrix | 42.5% |
| Compatilizer SBS | 3.5% |
The formula composition of Conductive plastic masterbatch such as following table：
Table 16：The formula composition of conducting masterbatch
| Raw material | Mass percentage |
| Conductive black | 44.5% |
| LLDPE plastic substrates | 50% |
| Antioxidant B225 | 1.5% |
| Dispersant silicone powder | 4% |
The preparation method of PC/PE alloy conductive plastics is：
Be warming up to 90-100 DEG C, by conductive additive (conductive black) and dispersant (silicone powder) in high speed mixer with
The rotating speed mixing 5-6min of 500-800r/min, adds PE plastic substrates (LLDPE) and antioxidant (B225) continues to mix, after
Continuous to be added PC plastic matrix and compatilizer (SBS) obtains mixture, melting extrusion is granulated to get to PC/PE alloy conductive plastics.
Wherein, control condition is when melting extrusion is granulated：210 DEG C -250 DEG C of temperature, twin-screw extrusion engine speed are
400rpm。
Conductive modeling prepared by the embodiment 1-5 high flowing carrier band PC/PE alloy conductives plastics prepared and comparative example 1-3
Material carries out performance detection, and acquired results are as shown in table 17.
The performance test results of the PC/PE alloy conductives plastics of 17 embodiment 1-5 of table and the conductive plastics of comparative example 1-3
| Mobility (230 DEG C/10kg) | Processing temperature | Resistance | Cantilever beam impact strength (J/M) | |
| Embodiment 1 | 1.65g/10min | 210℃-250℃ | 40-60Ω | 15 |
| Embodiment 2 | 1.22g/10min | 210℃-250℃ | 35-50Ω | 12 |
| Embodiment 3 | 1.31g/10min | 210℃-250℃ | 30-40Ω | 9 |
| Embodiment 4 | 1.05g/10min | 210℃-250℃ | 25-35Ω | 8 |
| Embodiment 5 | 1.16g/10min | 210℃-250℃ | 30-45Ω | 10 |
| Comparative example 1 | 0.1g/10min | 260℃-300℃ | 800-1000Ω | 2 |
| Comparative example 2 | 3.22g/10min | 160℃-200℃ | 10000-20000Ω | 80 |
| Comparative example 3 | 0.92g/10min | 230℃-255℃ | 60-80Ω | 7 |
The carrier band of embodiment 1-5 is carried with the PC conductions that the formula composition of PC/PE alloy conductive plastics respectively produces and is used
Particle measures products obtained therefrom after PC plastic materials production carrier sheet (thickness is between 0.25mm-0.4mm) for adding 15-30%
Sheet resistance 104-106Between Ω, the smooth non-crystal point in surface, good combination property, product effect is conductive close to import carrier band
PC can reduce 20-30% costs.
When carrier sheet produces, when than commercially available carrier band with conduction PC, temperature can be reduced to 210~250 DEG C；Same processing item
Under part (host 200RPM), the low 15~30A of electric current.
And the product of comparative example 1-3：
Comparative example 1：System melt viscosity is high, poor fluidity, and is difficult to disperse, poorly conductive.
Comparative example 2：Good fluidity, processing temperature is relatively low, and cantilever beam impact strength is also very high, but resistance is very big, uncomfortable
Share the conductive carrier band particle of work.
Comparative example 3：Mobility is poor than the present invention, and electric conductivity is also poorer than of the invention, and when processing will reach identical surface
Resistance, client need more addition more products, then system mobility and product impact strength can be caused to be deteriorated, influence the entirety of product
Performance.
Claims (10)
1. a kind of high flowing carrier band PC/PE alloy conductive plastics, which is characterized in that including following components in percentage by weight：
The Conductive plastic masterbatch of 50-60%, the PC plastic matrix of 37-46% and 3-6% compatilizers, wherein the Conductive plastic masterbatch
It comprises the following raw materials by weight percent：The conductive additive of 38-48%, the PE plastic substrates of 48-58%, 0.5-2%
The dispersant of antioxidant and 0.5-4%.
2. high flowing carrier band PC/PE alloy conductive plastics according to claim 1, which is characterized in that the PE plastics
Matrix is at least one of LDPE, MDPE, HDPE and LLDPE.
3. high flowing carrier band PC/PE alloy conductive plastics according to claim 1, which is characterized in that the conduction adds
It is at least one of conductive black, electrically conductive graphite and conductive carbon fibres to add agent.
4. high flowing carrier band PC/PE alloy conductive plastics according to claim 1, which is characterized in that the antioxidant
For 1010,168,1076,242,626, at least one of B225 and B215.
5. high flowing carrier band PC/PE alloy conductive plastics according to claim 1, which is characterized in that the dispersant
For ethylene bis stearamide, PE waxes, EVA waxes, triethyl group hexyl phosphoric acid, lauryl sodium sulfate, silicone powder, methyl anyl alcohol, gather
At least one of acrylamide, oxidized polyethylene wax and fatty acid polyethylene glycol ester.
6. high flowing carrier band PC/PE alloy conductive plastics according to claim 1, which is characterized in that the compatilizer
For at least one of SBS, SEBS, maleic anhydride-g-SBS, Maleic anhydride-containg polyethylene, MBS and high glue powder.
7. high flowing carrier band PC/PE alloy conductive plastics according to claim 1, which is characterized in that the PC plastic
Matrix is at least one of injection grade PC and extrusion grade PC.
8. the preparation method of the high flowing carrier band PC/PE alloy conductive plastics described in any one of claim 1-7, feature
It is, includes the following steps：
1) it is warming up to 90-100 DEG C, by conductive additive and dispersant, PE plastic substrates is added and antioxidant continues to mix
Conjunction obtains mixture, then by mixture melting extrusion, obtains Conductive plastic masterbatch；
2) Conductive plastic masterbatch is mixed with PC plastic matrix, compatilizer is added, remelted extruding pelletization carries to get to height flowing
Band PC/PE alloy conductive plastics.
9. preparation method according to claim 8, which is characterized in that in step 1), conductive additive and dispersant are existed
With the rotating speed mixing 5-6min of 500-800r/min in high speed mixer；In step 2), by Conductive plastic masterbatch and PC plastic base
Body is in low speed batch mixer with the rotating speed mixing 5-10min of 200-400r/min.
10. preparation method according to claim 8, which is characterized in that in step 1), control strip when mixture melting extrusion
Part is：160 DEG C -200 DEG C of temperature, twin-screw extrusion engine speed are 350rpm；In step 2), control strip when melting extrusion is granulated
Part is：210 DEG C -250 DEG C of temperature, twin-screw extrusion engine speed are 400rpm.
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| CN113308104A (en) * | 2021-06-01 | 2021-08-27 | 江苏天奈科技股份有限公司 | High-conductivity plastic master batch, preparation method thereof and conductive plastic particles |
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