CN108650798A - A kind of production method of the thick copper coin of acid etching - Google Patents
A kind of production method of the thick copper coin of acid etching Download PDFInfo
- Publication number
- CN108650798A CN108650798A CN201810695167.2A CN201810695167A CN108650798A CN 108650798 A CN108650798 A CN 108650798A CN 201810695167 A CN201810695167 A CN 201810695167A CN 108650798 A CN108650798 A CN 108650798A
- Authority
- CN
- China
- Prior art keywords
- acid etching
- copper coin
- thick copper
- production method
- thick
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/067—Etchants
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a kind of production methods of the thick copper coin of acid etching.This method comprises the following steps：（1）Copper facing is carried out to semi-finished product PCB, obtains thick copper coin；（2）Acid etching is performed under heating conditions to obtained thick copper coin, obtains the thick copper coin of acid etching.The method of the present invention realizes the stability of thick copper coin acid etching, the thick copper coin yield height of the acid etching of production scraps few, effective reduction PCB production costs by effectively controlling copper facing uniformity, etch uniformity, etching factor and acid etching technique.
Description
Technical field
The present invention relates to PCB production technical fields, and in particular to a kind of production method of the thick copper coin of acid etching.
Background technology
Printed circuit board（PCB）It is the final products of PCB industrial chains, is influenced to compare by upstream materials price ups and downs
Greatly.Currently, plate, copper valence, the chemical products prices of raw materials rise steadily, up-trend, PCB is also presented in other prices of raw materials
Product cost pressure is increasing.In addition by influence of market economy, PCB prices are constantly being lowered, and profit is constantly being compressed, drop
Low cost, promotion quality are imperative.
Acid etching flow production process is few, and Material Cost is low, has become the project of each PCB enterprise developments.However it is sour
Property be etched to etching face copper, thick copper coin face copper reaches 2OZ even 3OZ, and etching difficulty is big, and quality scraps height, and is susceptible to benefit
Rear spacing deficiency problem is repaid, how to solve the problems, such as that thick copper coin acid etching has become one of each PCB enterprises primary study project.
Invention content
In view of the above-mentioned deficiencies in the prior art, it is an object of the present invention to provide a kind of producer of the thick copper coin of acid etching
Method.This method realizes thick copper by effectively controlling copper facing uniformity, etch uniformity, etching factor and acid etching technique
The stability of plate acid etching, the thick copper coin yield height of the acid etching of production are scrapped less.
The purpose of the present invention is achieved through the following technical solutions.
A kind of production method of the thick copper coin of acid etching, includes the following steps：
（1）Copper facing is carried out to semi-finished product PCB, obtains thick copper coin；
（2）Acid etching is performed under heating conditions to obtained thick copper coin, obtains the thick copper coin of acid etching.
Preferably, step（1）In, the copper facing is electroplated using vertical continuous plating lines.
Preferably, step（1）In, the copper-plated uniformity is very poor≤5um.
Preferably, step（1）In, the hole copper thickness upper limit in the thickness copper coin is up to the copper thickness+1um of semi-finished product PCB.
Preferably, step（1）In, etching factor >=4.0 of the thickness copper coin.
Preferably, step（2）In, the heating is heated to 48 ~ 52 DEG C.
Preferably, step（2）In, in the etching solution of the acid etching, NaClO3Content control it is dense in 28 ~ 36 equivalents
The content of degree, HCl is controlled in 2.3 ~ 2.7 equivalent concentration, Cu2+Concentration control in 130 ~ 140g/L.
Preferably, step（2）In, the pressure of the acid etching controls：Upper pressure is 2.7 ~ 3.1kg/cm2, it is 2.3 to push
~2.7kg/cm2。
Preferably, step（2）In, the etch uniformity up and down of the acid etching is >=93%.
Compared with prior art, the invention has the advantages that and advantageous effect：
The method of the present invention is realized by effectively controlling copper facing uniformity, etch uniformity, etching factor and acid etching technique
The stability of thick copper coin acid etching, the thick copper coin yield height of the acid etching of production are scrapped less, and PCB productions are effectively reduced
Cost economizes on resources.
Specific implementation mode
Technical scheme of the present invention is described in further detail below in conjunction with specific embodiment, but the protection of the present invention
Range and embodiment are without being limited thereto.
Embodiment 1
A kind of production method of the thick copper coin of acid etching, specifically comprises the following steps：
（1）Copper facing is carried out using vertical continuous plating lines plating to the semi-finished product PCB of copper thickness 21um, copper-plated uniformity is very poor to be
4.5um obtains the thick copper coin that hole copper thickness is 21.5um, etching factor 4.6；
（2）Under 52 DEG C of heating conditions, acid etching is carried out to obtained thick copper coin；Wherein, in etching solution, NaClO3Content
Control is 32 equivalent concentration, and the content control of HCl is 2.7 equivalent concentration, Cu2+Concentration control be 136g/L；The pressure of etching
Control：Upper pressure is 3.1kg/cm2, push as 2.3kg/cm2；Upper and lower etch uniformity difference 93.5%, 95%, obtains acid etching
Thick copper coin.
Embodiment 2
A kind of production method of the thick copper coin of acid etching, specifically comprises the following steps：
（1）Copper facing is carried out using vertical continuous plating lines plating to the semi-finished product PCB of copper thickness 20um, copper-plated uniformity is very poor to be
5um obtains the thick copper coin that hole copper thickness is 21um, etching factor 4.0；
（2）Under 50 DEG C of heating conditions, acid etching is carried out to obtained thick copper coin；Wherein, in etching solution, NaClO3Content
Control is 36 equivalent concentration, and the content control of HCl is 2.3 equivalent concentration, Cu2+Concentration control be 130g/L；The pressure of etching
Control：Upper pressure is 2.7kg/cm2, push as 2.5kg/cm2；Upper and lower etch uniformity is 94%, obtains the thick copper of acid etching
Plate.
Embodiment 3
A kind of production method of the thick copper coin of acid etching, specifically comprises the following steps：
（1）Copper facing is carried out using vertical continuous plating lines plating to the semi-finished product PCB of copper thickness 21um, copper-plated uniformity is very poor to be
3um obtains the thick copper coin that hole copper thickness is 22um, etching factor 5.2；
（2）Under 48 DEG C of heating conditions, acid etching is carried out to obtained thick copper coin；Wherein, in etching solution, NaClO3Content
Control is 28 equivalent concentration, and the content control of HCl is 2.5 equivalent concentration, Cu2+Concentration control be 140g/L；The pressure of etching
Control：Upper pressure is 2.8kg/cm2, push as 2.7kg/cm2；Upper and lower etch uniformity is respectively 95%, 93.6%, obtains acid erosion
The thick copper coin at quarter.
According to traditional thick copper coin etching management and control can cause yield it is low, etching it is not clean or directly can not production loss order,
Because traditional thick copper coin extremely caused by scrappage be about 0.13%, and cause to lose order monthly 10 because thick copper coin can not be produced
It is single.And by using the method for embodiment 1 ~ 3 not only avoid compensation after spacing deficiency problem, and scrappage be 0.According to monthly
11000m2Production capacity, can monthly reduce and scrap 143m2, about 143m2*600 members/m2=85800 yuan can be that company saves every year
85800*12=1029600 yuan.
Above example is only the preferred embodiment of the present invention, is only that further detailed to technical scheme of the present invention work
Description, but do not limit the scope of the invention, any change done without departing from spirit of the invention, combination, deletion,
Modifications or substitutions etc. are included in protection scope of the present invention.
Claims (9)
1. a kind of production method of the thick copper coin of acid etching, which is characterized in that include the following steps：
（1）Copper facing is carried out to semi-finished product PCB, obtains thick copper coin；
（2）Acid etching is performed under heating conditions to obtained thick copper coin, obtains the thick copper coin of acid etching.
2. a kind of production method of the thick copper coin of acid etching according to claim 1, which is characterized in that step（1）In,
The copper facing is electroplated using vertical continuous plating lines.
3. a kind of production method of the thick copper coin of acid etching according to claim 1 or 2, which is characterized in that step（1）
In, the copper-plated uniformity is very poor≤5um.
4. a kind of production method of the thick copper coin of acid etching according to claim 1, which is characterized in that step（1）In,
The hole copper thickness upper limit in the thickness copper coin is up to the copper thickness+1um of semi-finished product PCB.
5. a kind of production method of the thick copper coin of acid etching according to claim 1, which is characterized in that step（1）In,
Etching factor >=4.0 of the thickness copper coin.
6. a kind of production method of the thick copper coin of acid etching according to claim 1, which is characterized in that step（2）In,
The heating is heated to 48 ~ 52 DEG C.
7. a kind of production method of the thick copper coin of acid etching according to claim 1, which is characterized in that step（2）In,
In the etching solution of the acid etching, NaClO3Content control in 28 ~ 36 equivalent concentration, the content of HCl is controlled 2.3 ~ 2.7
Equivalent concentration, Cu2+Concentration control in 130 ~ 140g/L.
8. a kind of production method of the thick copper coin of acid etching according to claim 1, which is characterized in that step（2）In,
The pressure of the acid etching controls：Upper pressure is 2.7 ~ 3.1kg/cm2, push as 2.3 ~ 2.7kg/cm2。
9. a kind of production method of the thick copper coin of acid etching according to claim 1, which is characterized in that step（2）In,
The etch uniformity up and down of the acid etching is >=93%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810695167.2A CN108650798A (en) | 2018-06-29 | 2018-06-29 | A kind of production method of the thick copper coin of acid etching |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810695167.2A CN108650798A (en) | 2018-06-29 | 2018-06-29 | A kind of production method of the thick copper coin of acid etching |
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| Publication Number | Publication Date |
|---|---|
| CN108650798A true CN108650798A (en) | 2018-10-12 |
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ID=63749889
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810695167.2A Pending CN108650798A (en) | 2018-06-29 | 2018-06-29 | A kind of production method of the thick copper coin of acid etching |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110191596A (en) * | 2019-04-18 | 2019-08-30 | 奥士康精密电路（惠州）有限公司 | A kind of PCB production method of BGA welding roundlet PAD |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03222392A (en) * | 1990-01-29 | 1991-10-01 | Hitachi Ltd | Formation of printed wiring pattern |
| CN103208401A (en) * | 2013-04-01 | 2013-07-17 | Aem科技(苏州)股份有限公司 | Circuit protection device and manufacturing method thereof |
| CN104762620A (en) * | 2014-06-13 | 2015-07-08 | 叶涛 | High-efficient high-quality acidic copper chloride circuit board etching solution |
| CN105072810A (en) * | 2015-07-15 | 2015-11-18 | 恩达电路(深圳)有限公司 | Method for producing double-surface thick copper flexible working board |
| CN105407645A (en) * | 2015-10-29 | 2016-03-16 | 深圳市五株科技股份有限公司 | Etching method of thick-copper circuit board |
| CN106961800A (en) * | 2017-03-21 | 2017-07-18 | 奥士康精密电路（惠州）有限公司 | Double IC clamps preparation method on a kind of PCB |
| CN107872921A (en) * | 2017-08-30 | 2018-04-03 | 奥士康精密电路（惠州）有限公司 | A kind of design method of characteristic impedance |
-
2018
- 2018-06-29 CN CN201810695167.2A patent/CN108650798A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03222392A (en) * | 1990-01-29 | 1991-10-01 | Hitachi Ltd | Formation of printed wiring pattern |
| CN103208401A (en) * | 2013-04-01 | 2013-07-17 | Aem科技(苏州)股份有限公司 | Circuit protection device and manufacturing method thereof |
| CN104762620A (en) * | 2014-06-13 | 2015-07-08 | 叶涛 | High-efficient high-quality acidic copper chloride circuit board etching solution |
| CN105072810A (en) * | 2015-07-15 | 2015-11-18 | 恩达电路(深圳)有限公司 | Method for producing double-surface thick copper flexible working board |
| CN105407645A (en) * | 2015-10-29 | 2016-03-16 | 深圳市五株科技股份有限公司 | Etching method of thick-copper circuit board |
| CN106961800A (en) * | 2017-03-21 | 2017-07-18 | 奥士康精密电路（惠州）有限公司 | Double IC clamps preparation method on a kind of PCB |
| CN107872921A (en) * | 2017-08-30 | 2018-04-03 | 奥士康精密电路（惠州）有限公司 | A kind of design method of characteristic impedance |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110191596A (en) * | 2019-04-18 | 2019-08-30 | 奥士康精密电路（惠州）有限公司 | A kind of PCB production method of BGA welding roundlet PAD |
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Application publication date: 20181012 |
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