CN108641610A - A kind of self-adhesive and high-strength conductive and heat-conductive film and preparation method thereof - Google Patents
A kind of self-adhesive and high-strength conductive and heat-conductive film and preparation method thereof Download PDFInfo
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- CN108641610A CN108641610A CN201810380518.0A CN201810380518A CN108641610A CN 108641610 A CN108641610 A CN 108641610A CN 201810380518 A CN201810380518 A CN 201810380518A CN 108641610 A CN108641610 A CN 108641610A
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- conductive film
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- 239000000853 adhesive Substances 0.000 title claims abstract description 14
- 238000002360 preparation method Methods 0.000 title abstract description 6
- 229920005989 resin Polymers 0.000 claims abstract description 37
- 239000011347 resin Substances 0.000 claims abstract description 37
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 34
- 239000002671 adjuvant Substances 0.000 claims abstract description 16
- 239000010439 graphite Substances 0.000 claims abstract description 15
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 15
- 229910052751 metal Inorganic materials 0.000 claims abstract description 15
- 239000002184 metal Substances 0.000 claims abstract description 15
- 239000011231 conductive filler Substances 0.000 claims abstract description 14
- 229920002521 macromolecule Polymers 0.000 claims abstract description 11
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000005011 phenolic resin Substances 0.000 claims abstract description 9
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 9
- 239000002270 dispersing agent Substances 0.000 claims abstract description 8
- 239000000843 powder Substances 0.000 claims abstract description 8
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229920002367 Polyisobutene Polymers 0.000 claims abstract description 7
- 239000000945 filler Substances 0.000 claims abstract description 7
- 229920000058 polyacrylate Polymers 0.000 claims abstract description 7
- 239000004575 stone Substances 0.000 claims abstract description 7
- 235000014113 dietary fatty acids Nutrition 0.000 claims abstract description 4
- 229930195729 fatty acid Natural products 0.000 claims abstract description 4
- 239000000194 fatty acid Substances 0.000 claims abstract description 4
- 150000004665 fatty acids Chemical class 0.000 claims abstract description 4
- -1 Petropols Chemical compound 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 238000005253 cladding Methods 0.000 claims description 4
- 238000007731 hot pressing Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims description 2
- 239000002994 raw material Substances 0.000 claims description 2
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 claims 1
- IAQRGUVFOMOMEM-UHFFFAOYSA-N butene Natural products CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 claims 1
- 238000011017 operating method Methods 0.000 abstract description 3
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 15
- 238000002156 mixing Methods 0.000 description 9
- 239000011230 binding agent Substances 0.000 description 8
- 229920006272 aromatic hydrocarbon resin Polymers 0.000 description 5
- 229910052788 barium Inorganic materials 0.000 description 5
- 239000002253 acid Substances 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 239000007770 graphite material Substances 0.000 description 2
- 239000011859 microparticle Substances 0.000 description 2
- 239000003595 mist Substances 0.000 description 2
- 239000006243 Fine Thermal Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000006258 conductive agent Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
- C09J123/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
- C09J123/22—Copolymers of isobutene; Butyl rubber ; Homo- or copolymers of other iso-olefines
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
Abstract
The present invention relates to a kind of self-adhesive and high-strength conductive and heat-conductive films and preparation method thereof, including conductive filler, macromolecule polyisobutylene resin and other adjuvant resins, the conductive filler is the graphite mixed fillers for coating metal stone ink powder, soft graphite powder and high purity graphite powder；Other described adjuvant resins are phenolic resin, polyacrylate, Petropols, at least one of the saponified class dispersant of metal of N phenyl maleimide resins and higher fatty acids.Operating procedure of the present invention is simple, easily operated, and the thermal conductivity film of preparation has superhigh intensity, good cementability while there is good conductive and heat conductive effect, thickness 0.1mm, width 20mm samples thermal coefficient are up to 4.5W/mK, and conductivity is up to 2.95S/cm, and tensile strength is up to 10.1MPa.
Description
Technical field
The present invention relates to conductive and heat-conductive graphite, graphite coat material and macromolecule resin material field, graphite has fine
Thermal conductivity, electric conductivity, light weight the advantages that, select metal-coated graphite powder, soft graphite and high purity graphite powder by certain ratio
Example mixing is used as conductive, heat filling, and dispersible good and guarantee good conductive heat-conducting effect uses macromolecule resinous wood
Material, adjuvant resin are mixed with graphite-like conductive material, and variously-shaped, size, thickness are prepared using simple easily operated technique
The conductive and heat-conductive film of degree.The tack conductive film electrical and thermal conductivity performance is good, and intensity is high, has tack, and production cost is low, prepares
The advantages that method is simple, easy to use.There is good application prospect in high-tech areas such as precision instrument, electronic products.
Background technology
Compound-type conducting Heat Conduction Material, be by high molecular material and conductive and heat-conductive agent by different combination process is processed
At material, it was both conductive, thermal conductivity, at the same again with high molecular material many excellent specific properties, easy processing is at each
Kind of complicated shape, the features such as chemical stability is good and resistivity can be adjusted in wide range and most practicality valence
Value, conductive polymeric composite is in petrochemical industry, health care, live daily, electronics industry, aviation, military affairs in recent years
It is used widely in equal fields.Such as US, temp auto-controlled exothermic material is made by Texas equipment Co., Ltd of the U.S. in 5256857 [P]
Heater is heated for main cabin, not only good economy performance, but also safe and reliable.Graphite itself has excellent thermal conductivity,
Upper to there is such as intensity low, insufficient formability, stability poor and being difficult to interface in application for traditional graphite sheet or coiled material
Fitting realizes that the functions such as its heat conduction, conduction, the present invention are based on above application inconvenience, propose new solution, pass through height
Molecular material, adjuvant resin and graphite are compound, and the performance for playing high molecular material, adjuvant resin and graphite material respectively is excellent
Gesture, if the intensity, excellent mouldability, stability of high molecular material are good and different materials interface is convenient for be bonded, graphite material
Thermal conductivity.
Invention content
Present invention aims at a kind of operating procedures of proposition simply, be easy to fitting, of low cost, thermal conductivity is excellent
Good tack conductive and heat-conductive film with superhigh intensity and preparation method thereof.The tack conductive and heat-conductive film have it is flexible, it is close
Degree is light, and intensity is big, the advantages that being easily processed into various demand thickness and geomery.
The technical scheme is that：
A kind of self-adhesive and high-strength conductive and heat-conductive film, including conductive filler, macromolecule polyisobutylene resin and other are auxiliary
Expect that resin, the conductive filler are the graphite mixed fillers for coating metal stone ink powder, soft graphite powder and high purity graphite powder；Institute
Other adjuvant resins stated are phenolic resin, polyacrylate, Petropols, N-phenylmaleimide resin and higher aliphatic
At least one of the saponified class dispersant of metal of acid.
Preferably：In the conductive filler, the addition of metal stone ink powder, soft graphite powder, high purity graphite powder is coated
Mass ratio is 2-5:1-6：3-5.
Preferably：The described cladding metal stone ink powder be copper facing, nickel plating, silvering graphite powder at least one, particle is
200-300 mesh.
Preferably：The soft graphite powder and high purity graphite powder purity is higher than 99.9%.
Preferably：The phenolic resin is barium phenolic aldehyde.
Preferably：The Petropols are C9 resins.
Preferably：Conductive filler is 2-3 with the mass ratio of macromolecule polyisobutylene resin and adjuvant resin:1：0.5-
1。
Preferably：The thickness of conductive and heat-conductive film is 0.02mm-1mm, and shape is die cut according to specifically used requirement.
The present invention also provides the method for preparing above-mentioned self-adhesive and high-strength conductive and heat-conductive film, using mill mixing 2-5 times,
Melting temperature is 120-230 DEG C, and each raw material is uniformly mixed；Hot press molding temperature is 180-240 DEG C, operating pressure 12-
25MPa, hot pressing time are -3 hours 0.5 hour, are cold-pressed time 0.5-3 hour.
Operating procedure of the present invention is simple, easily operated, and the thermal conductivity film of preparation has superhigh intensity, good bonding
Property at the same there is good conductive and heat conductive effect, thickness 0.1mm, width 20mm samples thermal coefficient are up to 4.5W/mK, electricity
Conductance is up to 2.95S/cm, and tensile strength is up to 10.1MPa.
Specific implementation mode：
Embodiment 1
Conductive and heat-conductive filler is：300 mesh copper coated graphite powders, 99.9% high-purity soft graphite micro mist of purity, 99.9% is high-purity
Graphite microparticles, proportion of filler 1:4:5；Resin binder is macromolecule polyisobutene B200 (BASF), other auxiliary material trees
Fat is phenolic resin (barium phenolic aldehyde), polyacrylate, Petropols (C9 resins), N-phenylmaleimide resin and advanced fat
The saponified class dispersant of metal of fat acid, B200：Adjuvant resin is 8:2, dispersant accounts for the 2% of binder, conductive and heat-conductive mixing
The ratio of filler, resin binder and adjuvant resin is 3:1：0.5.First by resin binder macromolecule polyisobutene B200,
Adjuvant resin phenolic resin (barium phenolic aldehyde), Petropols (C9 resins), polyacrylate, N-phenylmaleimide resin are being opened
Then 180-200 DEG C of mixing in mill the saponified class dispersant of the metal of conductive and heat-conductive filler and higher fatty acids is added,
180-200 DEG C of mixing 0.5-1h of temperature, until being uniformly mixed, mill is at the mixing tablet that thickness is 5-10mm.By hot press work
210 DEG C are adjusted to as temperature, it is 1.5h that operating pressure, which is adjusted to 15MPa. hot pressing times, is cold-pressed time 1.5h.It is conductive that tack is made
Heat conduction film thickness is 0.1mm, width 20mm samples thermal coefficient 4.5W/mK, conductivity 2.95S/cm, tensile strength
10.1MPa, peeling force are more than 15N/25mm.
Embodiment 2
Conductive and heat-conductive filler is：300 mesh silvering graphite powder, 99.9% high-purity soft graphite micro mist of purity, 99.9% is high-purity
Graphite microparticles, proportion of filler 1.5:4:4.5；Resin binder is macromolecule polyisobutene B150 (BASF), other are auxiliary
Material resin is phenolic resin (barium phenolic aldehyde), polyacrylate, Petropols (C9 resins), N-phenylmaleimide resin and height
The saponified class dispersant of metal of grade aliphatic acid, B150：Adjuvant resin is 8.5:1.5, dispersant accounts for the 3% of binder, conductive
The ratio of heat conduction mixed fillers, resin binder and adjuvant resin is 3:1:0.5.First by the poly- isobutyl of resin binder macromolecule
Alkene B150, adjuvant resin phenolic resin (barium phenolic aldehyde), Petropols (C9 resins), polyacrylate, N-phenylmaleimide
Resin 170-190 DEG C of mixing on a mill, then disperses the saponified class of the metal of conductive and heat-conductive filler and higher fatty acids
Agent is added, and in 170-190 DEG C of mixing 1-2h of temperature, until being uniformly mixed, mill is at the mixing tablet that thickness is 5-10mm.It will be hot
Compressor operation temperature is adjusted to 200 DEG C, and it is 2h that operating pressure, which is adjusted to 13MPa. hot pressing times, is cold-pressed time 2h.Obtained tack is led
Conductance hotting mask thickness is 0.15mm, width 20mm samples thermal coefficient 5.5W/mK, conductivity 3.25S/cm, tensile strength
9.3MPa, peeling force are more than 15.5N/25mm..
The foregoing is merely presently preferred embodiments of the present invention, is not intended to limit the invention, it is all the present invention spirit and
Within principle, any modification, equivalent replacement, improvement and so on should all be included in the protection scope of the present invention.
Claims (9)
1. a kind of self-adhesive and high-strength conductive and heat-conductive film, it is characterised in that：Including conductive filler, macromolecule polyisobutylene resin
With other adjuvant resins, the conductive filler is that the graphite of cladding metal stone ink powder, soft graphite powder and high purity graphite powder is mixed
Close filler；Other described adjuvant resins are phenolic resin, polyacrylate, Petropols, N-phenylmaleimide resin
And at least one of the saponified class dispersant of metal of higher fatty acids.
2. the self-adhesive and high-strength conductive and heat-conductive film according to right 1, it is characterised in that：In the conductive filler, cladding
Metal stone ink powder, soft graphite powder, high purity graphite powder addition mass ratio be 2-5:1-6：3-5.
3. the self-adhesive and high-strength conductive and heat-conductive film according to right 1, it is characterised in that：The cladding metal stone ink powder is
Copper facing, nickel plating, silvering graphite powder at least one, particle be 200-300 mesh.
4. the self-adhesive and high-strength conductive and heat-conductive film according to right 1, it is characterised in that：The soft graphite powder and high-purity
Graphite powder purity is higher than 99.9%.
5. the self-adhesive and high-strength conductive and heat-conductive film according to right 1, it is characterised in that：The phenolic resin is barium phenol
Aldehyde.
6. the self-adhesive and high-strength conductive and heat-conductive film according to right 1, it is characterised in that：The Petropols are C9 trees
Fat.
7. the self-adhesive and high-strength conductive and heat-conductive film according to right 1, it is characterised in that：Conductive filler gathers different with macromolecule
The mass ratio of butene resins and adjuvant resin is 2-3:1：0.5-1.
8. the self-adhesive and high-strength conductive and heat-conductive film according to right 1, it is characterised in that：The thickness of conductive and heat-conductive film is
0.02mm-1mm, shape are die cut according to specifically used requirement.
9. the method for preparing the self-adhesive and high-strength conductive and heat-conductive film as described in right 1-8 is any, it is characterised in that：Use mill
Machine is kneaded 2-5 times, and melting temperature is 120-230 DEG C, and each raw material is uniformly mixed；Hot press molding temperature is 180-240 DEG C, work
It is 12-25MPa to make pressure, and hot pressing time is -3 hours 0.5 hour, is cold-pressed time 0.5-3 hour.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810380518.0A CN108641610A (en) | 2018-04-25 | 2018-04-25 | A kind of self-adhesive and high-strength conductive and heat-conductive film and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810380518.0A CN108641610A (en) | 2018-04-25 | 2018-04-25 | A kind of self-adhesive and high-strength conductive and heat-conductive film and preparation method thereof |
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| Publication Number | Publication Date |
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| CN108641610A true CN108641610A (en) | 2018-10-12 |
Family
ID=63747767
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810380518.0A Pending CN108641610A (en) | 2018-04-25 | 2018-04-25 | A kind of self-adhesive and high-strength conductive and heat-conductive film and preparation method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN108641610A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112322246A (en) * | 2020-12-02 | 2021-02-05 | 句容市双诚电子有限公司 | Low-consumption temperature-resistant conductive adhesive for sensor and preparation method thereof |
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Application publication date: 20181012 |