CN108583977A - The instantaneously heated bundling device of direct current safe voltage and its transient heating control circuit - Google Patents
The instantaneously heated bundling device of direct current safe voltage and its transient heating control circuit Download PDFInfo
- Publication number
- CN108583977A CN108583977A CN201810690289.2A CN201810690289A CN108583977A CN 108583977 A CN108583977 A CN 108583977A CN 201810690289 A CN201810690289 A CN 201810690289A CN 108583977 A CN108583977 A CN 108583977A
- Authority
- CN
- China
- Prior art keywords
- triode
- bundling device
- hole
- direct current
- signal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 32
- 230000001052 transient effect Effects 0.000 title claims abstract description 14
- 230000005669 field effect Effects 0.000 claims abstract description 20
- 238000009835 boiling Methods 0.000 claims abstract description 18
- 239000004065 semiconductor Substances 0.000 claims abstract description 18
- 230000009466 transformation Effects 0.000 claims abstract description 11
- 238000007493 shaping process Methods 0.000 claims abstract description 8
- 238000006243 chemical reaction Methods 0.000 claims description 10
- 238000001514 detection method Methods 0.000 claims description 5
- 101150090280 MOS1 gene Proteins 0.000 claims description 3
- 101100401568 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) MIC10 gene Proteins 0.000 claims description 3
- 230000008054 signal transmission Effects 0.000 claims description 3
- 238000010521 absorption reaction Methods 0.000 claims 1
- 230000005611 electricity Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 4
- 238000009434 installation Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 3
- 230000003796 beauty Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 206010053615 Thermal burn Diseases 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000000686 essence Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B27/00—Bundling particular articles presenting special problems using string, wire, or narrow tape or band; Baling fibrous material, e.g. peat, not otherwise provided for
- B65B27/08—Bundling paper sheets, envelopes, bags, newspapers, or other thin flat articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B13/00—Bundling articles
- B65B13/18—Details of, or auxiliary devices used in, bundling machines or bundling tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B13/00—Bundling articles
- B65B13/18—Details of, or auxiliary devices used in, bundling machines or bundling tools
- B65B13/24—Securing ends of binding material
- B65B13/32—Securing ends of binding material by welding, soldering, or heat-sealing; by applying adhesive
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Control Of Resistance Heating (AREA)
Abstract
The present invention relates to a kind of instantaneously heated bundling devices of direct current safe voltage, including rack, it is equipped in rack and cuts boiling hot system, it includes microcontroller to cut boiling hot system, DC power-supply system, it perms instant heating system, temperature data collecting system and device of perming, instant heating system of perming includes the modulated pulse signal input interface connected for modulated pulse signal, the signal transformation circuit of shaping is carried out according to the adjustment signal of pulse-modulated signal input interface and by the metal-oxide-semiconductor field effect transistor of the pulse-modulated signal triggering after signal transformation circuit shaping, metal-oxide-semiconductor field effect transistor is electrically connected with heater strip.Advantageous effect is：Simple in its structure of the design, easy for installation, reliable working operation is stablized, and using bundling device transient heating control system, eliminates safe hidden trouble, and is controlled instead of traditional low and high level, and structure is made more to stablize, safe；Using safe dc power supply power supply, direct current safe voltage need not do 3C certifications.
Description
Technical field
The present invention relates to a kind of instantaneously heated bundling device of direct current safe voltage, the transient heatings of safe dc voltage power supply
Bundling device.
Background technology
Bundling device is to use micro computer control technology, and banknote, which is directly placed into clamping plate machine, starts to work, full-automatic quick
Paper tape tied note is electromechanical integration high-tech product, easy to operate, ties up beauty, efficient, at low cost, be financial department and
Emporium is used for the ideal equipment of tied note.
Bundling device is mainly characterized by present：1, full-automatic quick binding；2, micro computer control, use are easy to operate；
3, pressure type binding securely, beauty of affixing one's seal；4, paper tape binding position is adjustable；5, elastic, temperature is adjustable；6, add up the bundle of bundle money
Number.
Bundling device is using electric main power supply mode, since ac commercial power voltage is relatively high, generally 110V- at present
Between 220V, it is known that the bundling device using which is not safe enough, there are security risks, and the binding of Alternating Current Power Supply at present
Machine needs country to carry out 3C certifications, it is known that it is used in upper and processing cost, uneconomical of high cost, uses exchange way
It is bigger in its volume of bundling device, be primarily due to high voltage 110V-220V access need transformer to convert, need by
A transformer is added inside bundling device and converts it into low-voltage for bundling device work, leads to the inner space portion of its bundling device
Part increases, and affects overall volume, it appears volume is bigger；Also current bundling device, due to not conforming to for internal structure distribution
Reason, also causing in its volume can be bigger, component this block of especially perming, more complicated cumbersome in structure, also affects complete machine
Volume.
Invention content
The present invention proposes a kind of instantaneously heated bundling device of direct current safe voltage, during solving use in the prior art
The existing above problem.
The technical proposal of the invention is realized in this way：
A kind of instantaneously heated bundling device of direct current safe voltage, including rack, fixed frame is equipped in rack, and fixed frame has paper
Coin places mouth, it is characterised in that：It is equipped in rack and cuts boiling hot component, cut boiling hot component and be installed on fixed frame avris, cut boiling hot component packet
Fixed seat and fixing bracket are included, fixing bracket is fixedly mounted with fixed seat, and fixed frame is equipped with stroke channel, and fixed seat is placed in row
Back and forth movement is done on Cheng Tongdao, there is fixing bracket upper mounting post and lower mounting post, upper mounting post to be provided with through-hole, lower mounting post
It is provided with lower through-hole, is equipped with top guide bar, upper installing hole, lower guide rod and lower mounting hole in fixed frame, top guide bar one end is fixed on
In the upper installing hole for determining frame, the other end coordinates with upper through-hole, and lower guide rod one end is fixed in the lower mounting hole of fixed frame, the other end
Coordinating with lower through-hole, elastic component is equipped in upper installing hole, lower mounting hole, the elastic component of upper installing hole is sleeved on top guide bar, under
The elastic component of mounting hole is sleeved on lower guide rod.
Preferably, upper mounting post is set to fixing bracket both sides with the lower symmetrical mode of mounting post.
Preferably, the top guide bar being placed in through-hole has the first free end region, is provided in first in the first free end region
Groove is embedded with the first position-arresting ring on the first inner groovy, and be placed in lower through-hole has the second free end region in lower guide rod, certainly second
Second inner groovy is provided with by petiolarea, the second position-arresting ring is embedded on the second inner groovy.
Preferably, abutment is installed in fixed seat, abutment includes bearing and screw, and bearing is fixed by screw
In fixed seat end face outside.
Preferably, elastic component uses spring.
A kind of bundling device transient heating control system, it is characterised in that：It further includes microcontroller, direct current supply system to cut boiling hot system
It unites, instant heating system of perming, temperature data collecting system and device of perming, device of perming include heater strip, temperature data
Acquisition system, instant heating system of perming are connect with microcontroller；Temperature data collecting system includes being adopted in real time to heater strip temperature
The acquisition module of collection and the analog-to-digital conversion module analyzed and converted according to acquisition module gathered data, microcontroller have root
The feedback module being compared according to the temperature value of analog-to-digital conversion module and the signal conduct obtained according to feedback module
The modulated pulse signal of signal transmission source；
Instant heating system of perming includes the modulated pulse signal input interface connected for modulated pulse signal, according to pulse tune
The adjustment signal of signal input interface processed carries out the signal transformation circuit of shaping and by the pulse after signal transformation circuit shaping
The metal-oxide-semiconductor field effect transistor of modulated signal triggering, metal-oxide-semiconductor field effect transistor are electrically connected with heater strip.
Preferably, acquisition module is temperature detection sensor.
Preferably, the signal transformation circuit includes triode Q8, triode Q9 and triode Q10, three poles
Pipe Q10 is connect by resistance R12 with modulated pulse signal input interface, and the triode Q9 passes through resistance R39 and triode
Q10 connections, the triode Q8 are connect by resistance R14 with computer heating control port HEAT, the triode Q9 and three poles
It is connect with heater strip equipped with resistance R15, the field-effect tube MOS1 between pipe Q8.
Preferably, it is also associated with anti-interference absorbing circuit, anti-interference absorbing circuit includes being connected to triode Q8 and MOS
Resistance R40 between effect pipe and capacitance C9.
Preferably, DC power-supply system is 24V DC power supplies.
In conclusion the beneficial effects of the present invention are：
1, reasonably optimizing on complete machine structure, reliable working operation are stablized, and boiling hot component is such as cut in the reasonable in internal structure distribution of bundling device
It rationally designs, reduces production cost, optimize complete machine structure, keep its compacter.
2, it using bundling device transient heating control system, eliminates safe hidden trouble, is controlled instead of traditional low and high level, make knot
Structure is more stablized, safe；Using safe dc power supply power supply, direct current safe voltage need not do 3C certifications.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention without having to pay creative labor, may be used also for those of ordinary skill in the art
With obtain other attached drawings according to these attached drawings.
Fig. 1 is the whole structural schematic diagram of the present invention；
Fig. 2 is the right side schematic view of Fig. 1；
Fig. 3 is support bracket fastened structural schematic diagram；
Fig. 4 is the schematic diagram of bundling device transient heating control system；
Fig. 5 is the schematic diagram of temperature data collecting system;
Fig. 6 is the schematic block diagram of bundling device transient heating control system.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention 1-5, technical solution in the embodiment of the present invention carry out it is clear,
It is fully described by, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Base
Embodiment in the present invention, those of ordinary skill in the art obtained without creative efforts it is all its
His embodiment, shall fall within the protection scope of the present invention.
Embodiment
As shown in Figure 1 to Figure 3, the invention discloses a kind of instantaneously heated bundling devices of direct current safe voltage, including rack
1, fixed frame 2 is installed, there is bank note to place mouth, be equipped in rack and cut boiling hot component for fixed frame, cut boiling hot component installation in rack 1
In fixed frame avris, cut boiling hot component include fixed seat 4, fixing bracket 3, perm component and cutter, wherein cutter, which is mounted on, scalds
The top of head assembly, component of perming are mounted on fixed seat 4, and fixing bracket is fixedly mounted with fixed seat, and fixed frame 2 is logical equipped with stroke
Road, stroke channel are the space for allowing fixed seat to move, and specifically with fixed seat shape adaptation, in general use rectangular, fixed seat 4
It is placed on stroke channel and does back and forth movement, there is fixing bracket 3 upper mounting post 6 and lower mounting post 5, upper mounting post 6 to be provided with logical
Hole 62, lower mounting post 5 are provided with lower through-hole 52, and top guide bar 8, upper installing hole 12, lower guide rod 7 and lower installation are equipped in fixed frame 2
Hole 13,8 one end of top guide bar are fixed on the upper installing hole 12 on fixed frame, and the two is mainly threadedly coupled, the other end and upper through-hole
Cooperation, lower guide rod one end are fixed in the lower mounting hole 13 on fixed frame, and the two is also mainly to be threadedly coupled, and the other end leads to lower
Hole coordinates, and elastic component 9 is placed in upper installing hole, lower mounting hole, and elastic component 9 uses spring, and the both ends circle of spring is more than upper
The diameter of through-hole 62 and lower through-hole 52.
In order to improve the precision of work and the stability of operation, upper mounting post 6 is set to 5 symmetrical mode of lower mounting post
3 both sides of fixing bracket, symmetric mode setting, ensure that in operational process unstable problem occur, it is ensured that cut boiling hot component and be in same
One horizontal direction moves.
The top guide bar 8 being placed in through-hole has the first free end region, and the first inner groovy is provided in the first free end region,
The first position-arresting ring 81 is embedded on first inner groovy.Be placed in lower through-hole has the second free end region in lower guide rod 7, in the second free end
Area is provided with the second inner groovy, and the second position-arresting ring 82 is embedded on the second inner groovy.First position-arresting ring 81 and the second position-arresting ring are set
There are two 82 main purposes, when it is easy for installation, on the other hand it is exactly in dismounting also to prevent fixed seat from falling, it is only necessary to
Gasket is removed, so that it may entire fixed seat be removed, design is very reasonable, avoids other cumbersome components and dismounting journey
Sequence.
For the reliability for allowing driving mechanism that fixed seat 4 is promoted to move, abutment 41 is installed in fixed seat 4, is kept out
Part includes bearing and screw, and bearing is fixed by screws in fixed seat end face outside.Here use bearing primarily to
Driving mechanism（Existing market upper drive mechanism is all to use cam drive mode）When pushing bearing, bearing can turn,
First, the stable operation of work can allow, on the other hand in order to reduce component contact friction, if abutment be it is fixed not
It is dynamic to result in upper variant with its surface worn when long-time, cause operation unstable.
A kind of bundling device transient heating control system cuts boiling hot system and further includes microcontroller, DC power-supply system, perms moment
Heating system, temperature data collecting system and device of perming, it is preferable that DC power-supply system is 24V DC power supplies, is scalded
Head device includes heater strip, and temperature data collecting system, instant heating system of perming are connect with microcontroller；Temperature data acquisition system
System includes the acquisition module to heater strip temperature acquisition and according to acquisition module gathered data being analyzed and being converted in real time
Analog-to-digital conversion module, that is, AD conversion, microcontroller have the feedback mould being compared according to the temperature value of analog-to-digital conversion module
The modulated pulse signal of block and the signal that is obtained according to feedback module as signal transmission source；
Instant heating system of perming includes the modulated pulse signal input interface connected for modulated pulse signal, according to pulse tune
The adjustment signal of signal input interface processed carries out the signal transformation circuit of shaping and by the pulse after signal transformation circuit shaping
The metal-oxide-semiconductor field effect transistor of modulated signal triggering, metal-oxide-semiconductor field effect transistor are electrically connected with heater strip.
Acquisition module is temperature detection sensor, and temperature detection sensor is connected with thermistor R11.
The signal transformation circuit includes triode Q8, triode Q9 and triode Q10, the triode Q10's
Emitting stage is connect by resistance R12 with modulated pulse signal input interface, and the emitting stage of the triode Q9 passes through resistance R39
It is connect with the collector of triode Q10, and the ground level of triode Q9 is connected between the collector of triode Q10 and resistance R39,
The ground level of the triode Q8 is connect by resistance R14 with computer heating control port HEAT, the collector of the triode Q9
It is connected by connecting resistance R15 between the collector of triode Q8, the metal-oxide-semiconductor field effect transistor is connect with heater strip, MOS
The grid of effect pipe is connect with the one end resistance R15, the drain electrode of metal-oxide-semiconductor field effect transistor is connect with heating wire, wherein metal-oxide-semiconductor field effect transistor
Source electrode is grounded, and triode Q8 and triode Q10 uses 8050 type triodes, as NPN type crystal；Triode Q9 uses 8550 types
Triode, i.e. positive-negative-positive silicon triode, connection can see attached drawing 4 and Fig. 5 in detail for other.
It is also associated with anti-interference absorbing circuit, anti-interference absorbing circuit includes being connected to triode Q8 and metal-oxide-semiconductor field effect transistor
Between resistance R40 and capacitance C9.Wherein but not limited thereto using following scheme numerical value for this programme：510 Europe may be used in R39
Nurse, R15 are 51 ohm, and R12 is 2200 ohm, and R14 is 1500 ohm, and R40 is 10000 ohm, and capacitance C9 uses 101uf.
With reference to figure 4 and Fig. 5, this programme working method is：
The microcontroller of the design uses MQ6821, but is not limited to, due to being provided with temperature detection sensor and thermistor,
Become smaller as temperature increases resistance value, collected signal can be sent to the analog-to-digital conversion module of microcontroller, i.e. the AD mouths of microcontroller,
Analog-to-digital conversion, and then the temperature data after being quantified are carried out, microcontroller is according to obtained temperature data to modulated pulse signal
Input interface HEAT sends quantitative pulse signal, when modulated pulse signal input interface HEAT is high level, MOS field-effects
Pipe is in cut-off state, and high level gives triode Q8 mono- forward bias voltage by resistance R14, the grid of metal-oxide-semiconductor field effect transistor
Drag down, metal-oxide-semiconductor field effect transistor made to end, when computer heating control port HEAT is low level, triode Q10 conducting, triode Q9 with
Triode Q10 is in parallel, is also switched on, and at this moment triode Q8 is in cut-off state, and when triode Q9 is connected, there are one 12V's
Voltage triggers metal-oxide-semiconductor field effect transistor by resistance R15, gives one bias voltage of metal-oxide-semiconductor grid, so that MOS1 pipes is connected, makes heating wire
Fever.
By above-mentioned setting, the present invention is using microcontroller output pulse-modulated signal control, the heated condition of heater strip
Intermittent heating, and metal-oxide-semiconductor field effect transistor internal resistance is small, more traditional continuous heating, power reduces, and has energy-saving effect, and use
Be the power supply of direct current safe voltage, safety coefficient is high.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
With within principle, any modification, equivalent replacement, improvement and so on should all be included in the protection scope of the present invention god.
Claims (10)
1. a kind of instantaneously heated bundling device of direct current safe voltage, including rack, it is equipped in rack and cuts boiling hot system, feature exists
In：It cuts boiling hot system to include rack-mounted fixed frame and cut boiling hot component, there is bank note to place mouth, cut boiling hot component for fixed frame
It is installed on fixed frame avris, it includes fixed seat and fixing bracket to cut boiling hot component, and fixing bracket is fixedly mounted with fixed seat, fixed
Frame is equipped with stroke channel, and fixed seat, which is placed on stroke channel, does back and forth movement, and fixing bracket has upper mounting post and lower mounting post,
Upper mounting post is provided with through-hole, and lower mounting post is provided with lower through-hole, fixed frame be equipped with top guide bar, upper installing hole, lower guide rod and
Lower mounting hole, top guide bar one end are fixed in the upper installing hole of fixed frame, and the other end coordinates with upper through-hole, and lower guide rod one end is fixed
In the lower mounting hole of fixed frame, the other end coordinates with lower through-hole, and elastic component, upper peace are equipped in upper installing hole, lower mounting hole
The elastic component in dress hole is sleeved on top guide bar, and the elastic component of lower mounting hole is sleeved on lower guide rod.
2. the instantaneously heated bundling device of direct current safe voltage according to claim 1, it is characterised in that：Upper mounting post and lower peace
The mode for filling column symmetry is set to fixing bracket both sides.
3. a kind of instantaneously heated bundling device of direct current safe voltage according to claim 2, it is characterised in that：It is placed in through-hole
In top guide bar there is the first free end region, the first inner groovy is provided in the first free end region, embedded with the on the first inner groovy
One position-arresting ring, be placed in lower through-hole has the second free end region in lower guide rod, the second inner groovy is provided in the second free end region, the
The second position-arresting ring is embedded on two inner groovies.
4. a kind of instantaneously heated bundling device of direct current safe voltage according to claim 1, it is characterised in that：In fixed seat
Abutment is installed, abutment includes bearing and screw, and bearing is fixed by screws in fixed seat end face outside.
5. a kind of instantaneously heated bundling device of direct current safe voltage according to claim 1, it is characterised in that：Elastic component uses
Spring.
6. a kind of bundling device transient heating control system according to claim 1 to 5 any one, it is characterised in that：It cuts
Boiling hot system further includes microcontroller, DC power-supply system, instant heating system of perming, temperature data collecting system and dress of perming
It sets, device of perming includes heater strip, and temperature data collecting system, instant heating system of perming are connect with microcontroller；Temperature data
Acquisition system includes the acquisition module to heater strip temperature acquisition and being analyzed simultaneously according to acquisition module gathered data in real time
The analog-to-digital conversion module of conversion, microcontroller have the feedback module being compared according to the temperature value of analog-to-digital conversion module
And modulated pulse signal of the signal obtained according to feedback module as signal transmission source；
Instant heating system of perming includes the modulated pulse signal input interface connected for modulated pulse signal, according to pulse tune
The adjustment signal of signal input interface processed carries out the signal transformation circuit of shaping and by the pulse after signal transformation circuit shaping
The metal-oxide-semiconductor field effect transistor of modulated signal triggering, metal-oxide-semiconductor field effect transistor are electrically connected with heater strip.
7. bundling device transient heating control system according to claim 6, it is characterised in that：Acquisition module passes for temperature detection
Sensor.
8. bundling device transient heating control system according to claim 6, it is characterised in that：The signal transformation circuit packet
Triode Q8, triode Q9 and triode Q10, the triode Q10 is included to connect by resistance R12 and modulated pulse signal input
Mouth connection, the triode Q9 are connect by resistance R39 with triode Q10, and the triode Q8 is by resistance R14 and adds
The HEAT connections of thermal control port are equipped with resistance R15, the field-effect tube MOS1 between the triode Q9 and triode Q8
It is connect with heater strip.
9. bundling device transient heating control system according to claim 8, it is characterised in that：It is also associated with anti-interference absorption electricity
Road, anti-interference absorbing circuit include the resistance R40 being connected between triode Q8 and metal-oxide-semiconductor field effect transistor and capacitance C9.
10. bundling device transient heating control system according to claim 8, it is characterised in that：DC power-supply system is direct current
Power supply.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810690289.2A CN108583977A (en) | 2018-06-28 | 2018-06-28 | The instantaneously heated bundling device of direct current safe voltage and its transient heating control circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810690289.2A CN108583977A (en) | 2018-06-28 | 2018-06-28 | The instantaneously heated bundling device of direct current safe voltage and its transient heating control circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108583977A true CN108583977A (en) | 2018-09-28 |
Family
ID=63635011
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810690289.2A Pending CN108583977A (en) | 2018-06-28 | 2018-06-28 | The instantaneously heated bundling device of direct current safe voltage and its transient heating control circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108583977A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109383874A (en) * | 2018-10-29 | 2019-02-26 | 上海古鳌电子科技股份有限公司 | A kind of bundling device control circuit |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200950662Y (en) * | 2006-08-21 | 2007-09-19 | 黄庆霖 | Controller for electro-thermal article |
| CN201439005U (en) * | 2009-07-24 | 2010-04-21 | 北京联合大学 | Heating device for medical infusion device |
| CN101751052A (en) * | 2008-12-17 | 2010-06-23 | 比亚迪股份有限公司 | Microheater |
| CN102442559A (en) * | 2011-09-21 | 2012-05-09 | 广州广电运通金融电子股份有限公司 | Sheet medium stacking and bundling device and self service equipment |
| CN103309373A (en) * | 2013-07-02 | 2013-09-18 | 黑龙江大学 | Low-temperature single chip microcomputer starting and working method and low-temperature running single chip microcomputer system for achieving method |
| CN103407527A (en) * | 2013-08-23 | 2013-11-27 | 深圳市汇川技术股份有限公司 | Information acquisition circuit of low-voltage electric vehicle |
| US20140083311A1 (en) * | 2012-09-24 | 2014-03-27 | Siat.S.P.A. | Mobile strapping device |
| CN204003548U (en) * | 2014-07-04 | 2014-12-10 | 深圳市金威源科技股份有限公司 | A kind of fan control circuitry of temperature regulate speed |
| CN105033393A (en) * | 2015-08-06 | 2015-11-11 | 深圳市尚进电子科技有限公司 | Direct-current heating circuit and electric soldering iron formed by same |
| CN207440882U (en) * | 2017-10-13 | 2018-06-01 | 瑞安市总正电子机具有限公司 | Bundling device equipped with no paper detecting apparatus |
| CN208498870U (en) * | 2018-06-28 | 2019-02-15 | 温州赤焰科技有限公司 | The instantaneously heated bundling device of direct current safe voltage |
-
2018
- 2018-06-28 CN CN201810690289.2A patent/CN108583977A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200950662Y (en) * | 2006-08-21 | 2007-09-19 | 黄庆霖 | Controller for electro-thermal article |
| CN101751052A (en) * | 2008-12-17 | 2010-06-23 | 比亚迪股份有限公司 | Microheater |
| CN201439005U (en) * | 2009-07-24 | 2010-04-21 | 北京联合大学 | Heating device for medical infusion device |
| CN102442559A (en) * | 2011-09-21 | 2012-05-09 | 广州广电运通金融电子股份有限公司 | Sheet medium stacking and bundling device and self service equipment |
| US20140083311A1 (en) * | 2012-09-24 | 2014-03-27 | Siat.S.P.A. | Mobile strapping device |
| CN103309373A (en) * | 2013-07-02 | 2013-09-18 | 黑龙江大学 | Low-temperature single chip microcomputer starting and working method and low-temperature running single chip microcomputer system for achieving method |
| CN103407527A (en) * | 2013-08-23 | 2013-11-27 | 深圳市汇川技术股份有限公司 | Information acquisition circuit of low-voltage electric vehicle |
| CN204003548U (en) * | 2014-07-04 | 2014-12-10 | 深圳市金威源科技股份有限公司 | A kind of fan control circuitry of temperature regulate speed |
| CN105033393A (en) * | 2015-08-06 | 2015-11-11 | 深圳市尚进电子科技有限公司 | Direct-current heating circuit and electric soldering iron formed by same |
| CN207440882U (en) * | 2017-10-13 | 2018-06-01 | 瑞安市总正电子机具有限公司 | Bundling device equipped with no paper detecting apparatus |
| CN208498870U (en) * | 2018-06-28 | 2019-02-15 | 温州赤焰科技有限公司 | The instantaneously heated bundling device of direct current safe voltage |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109383874A (en) * | 2018-10-29 | 2019-02-26 | 上海古鳌电子科技股份有限公司 | A kind of bundling device control circuit |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108583977A (en) | The instantaneously heated bundling device of direct current safe voltage and its transient heating control circuit | |
| CN203704543U (en) | Instant-cooling and quick-heating water dispenser | |
| CN208498870U (en) | The instantaneously heated bundling device of direct current safe voltage | |
| CN204309257U (en) | A kind of heat melting device | |
| CN207927531U (en) | A kind of device convenient for users to pickup egg | |
| CN206496503U (en) | A kind of cleaning wound heater | |
| CN212727849U (en) | Self-heat-dissipation servo driver | |
| CN208043758U (en) | A kind of chromatographic column constant temperature heating device | |
| CN205139825U (en) | Calculate high -efficient radiating host computer | |
| CN203482434U (en) | Water pump of mesh water pool and induction heating circuit of water pump of mesh water pool | |
| CN210534188U (en) | Cable on-line monitoring device | |
| CN209671906U (en) | Framework equipment with oracle database environment | |
| CN209335800U (en) | A kind of door-plate Heat sealer | |
| CN209263123U (en) | A kind of novel PTC ceramics body electric heating skirting | |
| CN214621161U (en) | Protection device of remote sensing hydrology monitoring terminal | |
| CN213077533U (en) | Rectification device convenient to sample | |
| CN204880087U (en) | Heating element sleeve pipe | |
| CN202726451U (en) | Automatic pushing mechanism of heat radiator assembling machine | |
| CN210345623U (en) | Wall is warm with adjustable high heat dissipation | |
| CN212763432U (en) | Marking device for insulated mounting wire | |
| CN221240650U (en) | Sensor intelligent acquisition terminal | |
| CN109259407B (en) | Thing allies oneself with energy-conserving shampoo bed control system of frequency conversion integral type | |
| CN220337808U (en) | Explosion-proof petroleum pipeline heater | |
| CN216148329U (en) | Arm fracture auxiliary recovery device | |
| CN202521886U (en) | Network water boiler |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |