CN108566741A - A kind of high-new display module surface-mount type technique of LED and the technique using the module group assembling LED product - Google Patents

Abstract

The invention discloses the technique of a kind of high-new display module surface-mount type techniques of LED and use the module group assembling LED product, module Surface Mount technique is：1）Tin cream is printed on the faces IC of pcb board, then mounts component onto the PCB produced, then is mounted on power socket and toggle switch attachment to the faces IC of pcb board, is sent into reflow soldering after inspection attachment is good and carries out reflow soldering；2）The pcb board welded is taken out from reflow soldering, whether detection pcb board, component and solder joint are good, it is ensured that print tin cream on the faces LED of pcb board after good, then mount LED and be sent into reflow soldering again and welded；It can be obtained the high-new display module semi-finished product of LED.Obtained module repairs after tested；The faces IC brush three-proofing coating, bottom case assembling, the glue embedding of the faces LED and test, finally carries out mask assembling, aging, you can obtain full outdoor LED product.This product light emitting angle is big, and light extraction efficiency is high, has filled up the blank that paster LED is applied to outdoor high definition electronic display.

Description

A kind of high-new display module surface-mount type technique of LED and use the module group assembling LED product Technique

Technical field

The present invention relates to LED technology field, the high-new display module surface-mount type technique of specially a kind of LED and the module is used The technique for assembling LED product.

Background technology

LED display module is one of the critical piece for forming LED display finished product！Mainly by LED light, PCB circuit board, Drive IC, resistance, capacitance and plastics external member composition.

LED in traditional display screen module is using plug-in unit technique, low production efficiency, and unstable quality；And Bottom case and mask assembling are using the technique that screws, low production efficiency.

Invention content

It is an object of the invention to provide a kind of high-new display module surface-mount type techniques of LED and use the module group assembling LED product Technique, filled up the blank that paster LED is applied to outdoor high definition electronic display.

In order to solve the above technical problems, the technical solution adopted in the present invention is：A kind of high-new display module surface-mount types of LED Technique, it is characterised in that：Include the following steps：

1）Print tin cream on the faces IC of pcb board, then mount component on the PCB produced, then mount power socket and In toggle switch attachment to the faces IC of pcb board, check that good rear be sent into reflow soldering of attachment carries out reflow soldering；

2）The pcb board welded is taken out from reflow soldering, whether detection pcb board, component and solder joint are good, it is ensured that after good Tin cream is printed on the faces LED of pcb board, LED is then mounted and is sent into reflow soldering again and welded；It can be obtained LED High-new display module semi-finished product.

Further, the tin cream is low temperature tin cream, and component containing tin-lead-bismuth, weight ratio is 43% tin：43% lead：14% Bismuth.Due to the paster LED non-refractory characteristic of selection, i.e., when reflow soldering welding temperature is more than 200 DEG C, because different inside LED The factors such as material expand coefficient, can significantly promote LED fraction defectives does not influence LED using that should consider low-temperature welding when tin cream Fraction defective considers LED weld strengths, does not occur LED dropping situations, using the low temperature tin cream of tin-lead-bismuth, reflow soldering is most again High welding temperature is only 175 DEG C, and the reasoning that every LED is born still can reach 4.5Kg or more.And high temperature tin cream is used, reflux Brazier highest welding temperature is up to 245 DEG C or more, but the reasoning that LED is born still also can only achieve 4.5Kg or more, should with using It is suitable to be formulated tin cream effect.It when printing, needs to use steel mesh, the adjustment most quasi- pcb board in steel mesh hole that need to paste the position of component, with saturating Gelatin seals not corresponding steel mesh hole, and the tin cream being stirred is added and is placed on steel mesh, is finally printed on the faces IC of pcb board.

Further, when power socket mounts, power socket all around site error≤1mm, when toggle switch mounts, a front and back left side Error≤0.5mm that the right side is put.

The invention further relates to the high-new display modules of LED that the technique is prepared.

The invention further relates to the techniques of above-mentioned module group assembling LED product, include the following steps：

1）The high-new display modules of LED are tested, bad module is repaired；

2）To brush three-proofing coating in the faces pcb board IC, power socket screw and toggle switch contact pin position are avoided；

3）The pcb board for brushing three-proofing coating is assembled into bottom case component by way of rivet hot；

4）Glue embedding is carried out to the faces LED by glue pouring machine；

5）Module after encapsulating is tested, qualified module assembles mask by way of rivet hot；

6）Burn-in test is carried out to get to full outdoor module group assembling LED product to the assembled module of mask.

Further, step 3）Middle rivet hot temperature is 190-215 DEG C, time 3s, step 5）Middle rivet hot temperature is 200- 235 DEG C, time 8s.

Further, step 4）In, the glue used is A glue and B glue in mass ratio 10:1 glue prepared, wherein A glue For organic silica gel, B glue is curing agent, A glue is turned in 1500-2000 when preparation/min under conditions of stir 3-5min, then with B Encapsulating after glue mixing.

Further, when glue embedding, the glue quantity of individual module is 26-28g, is cured at normal temperatures after embedding.

The invention further relates to the techniques of above-mentioned module group assembling LED product, include the following steps：

1）The high-new display modules of LED are tested, bad module is repaired；

2）Step 1）Obtained module is disposably assembled bottom case and mask by way of rivet hot, you can obtains semi-outdoor Use LED product.

The invention has the advantages that：

Outdoor surface welded module provided by the invention uses convex lens type surface welded LED, and light emitting angle is big, can be expanded to by 120 degree 150 degree, light extraction efficiency it is high, 20% can be improved, packaging cost is low, can decline 50% or more, service life length extend 30% with On, leakproofness is strong, so that the display screen module using its production has same advantages.It has filled up paster LED and has been applied to outdoor height The blank of clear electronic display.

Using the display screen module of surface-mount type technique productions compared with traditional straight cutting display screen module, LED is using SMT Technique, production efficiency higher, quality are more stable；Bottom case and mask in traditional display screen module are assembled using the work that screws Skill, and the bottom case and mask in the present invention are assembled using hot riveting technique, 50% or more improving productivity.

Specific implementation mode

It is further illustrated the present invention with reference to embodiment, but the scope of protection of present invention is not limited to implement The range of example statement.

Embodiment 1：

A kind of high-new display module surface-mount type techniques of LED, it is characterised in that：Include the following steps：

1）Paste solder printing-IC：Tin cream is printed on the faces IC of pcb board；

Mount steel mesh needs patch component locations in equipment, arranging on steel mesh hole alignment pcb board, is used in combination transparent adhesive tape to seal not corresponding The steel mesh hole of production line and work number.The tin cream risen again and be stirred is added the IC for being placed on steel mesh and tin cream being printed on to pcb board On face.

2）Attachment-IC：It will be in component attachment to the PCB produced；

1. the material of production is indicated correct placement on feed frame according to the program set by SMT erect-position tables.

2. the size according to practical PCB adjusts placement equipment track width, blow-down position PIN after adjustment.

3. the positions positioning support PIN keep PCB holdings horizontal.

4. examination beats after initial workpiece and confirms whether the attachment of initial workpiece part is good；Whether part specifications model and position are correct.

5. fully-automatic production after FAA first article assurance OK needs timing to monitor production status in production.

3）Power socket, toggle switch attachment：Power socket and toggle switch are mounted on the faces pcb board IC；

Power socket attachment requires：

The longitudinal directions 1.PCB arrow is upward.

2. power socket pin is downward, left pin corresponds to the position of the left legs of PCB.

3. the position of corresponding PCB backhand welding feet in the middle part of power socket.

4. attachment must paste just, it cannot deviate and arch upward.

5. all around site error cannot be more than 1mm to power socket.

Simple ox seat attachment requires：

The longitudinal directions 1.PCB arrow is upward.

2. the opening direction of simple ox seat is towards a left side.

3. attachment must cannot deviate and arch upward to pasting just.

4. the error that simple ox seat is all around put cannot be more than 0.5mm.

4）Visual-the IC in stokehold：Whether the pcb board after hand inspection attachment is good；

5）Reflow soldering-IC：Tin cream solidification crystallization；

1. adjusting each warm area temperature according to the production technology of each product type and tin cream used/red glue regulation processing temperature；（Such as this 120-130 DEG C of 1 warm area in embodiment, 2 140-150 DEG C of warm areas, 3 150-160 DEG C of warm areas, 4 160-170 DEG C of warm areas, 5 warm area 170- 180 DEG C, 6. 180-190 DEG C of warm areas, 7 190-200 DEG C of warm areas, 8 200-210 DEG C of warm areas, 9 200-190 DEG C of warm areas, 10 warm area 190- 180℃）.

2. opening computer enters temperature, wind speed and flowing plate chain speed that Reflow Soldering master control system sets each warm area.

3. waiting for that each warm area actual temperature reaches set temperature, PROFILE is detected（Furnace temperature）It is whether normal, such as abnormal, weight Multiple 2-3 steps, until normal.

4. adjusting chain or guipure width starting flowing plate.

6）After stove visually：It estimates and repairs the pcb board after reflux：The pcb board for welding tin is taken out from Reflow Soldering, inspects PCB Plate whether there is or not it is damaged, be stained with glue, it is dirty, dew copper, fall phenomena such as painting；According to product BOM table or product initial workpiece inspect SMD components whether there is or not It floats high, crooked, missing part, fall the bad phenomenons such as part, more than one piece, wrong part, displacement；Whether good inspect solder joint, whether there is or not tin sweat(ing), scruff, Cold welding, few tin, the even bad phenomenons such as tin.

7）Paste solder printing-LED：Tin cream is printed on the faces LED of pcb board.

8）Attachment-LED：It will be in LED attachments to the pcb board for having produced tin cream；

1. opening machine power, 3 vibrators and computer image are opened successively.

2. recalling corresponding production routine, by reset key adjust automatically track width, tin cream then will have been produced Pcb board is positioned on feeding connection platform.

3. LED is poured into vibrating disk, loading and unloading connection platform is opened, starts to produce.

4. examination confirms whether material attachment is good, and whether lamp bead polarity and position are correct after beating initial workpiece.

5. fully-automatic production after FAA first article assurance OK needs timing to monitor production status in production.

It is welded 6. the pcb board for having mounted LED is sent into reflow soldering in time.

Embodiment 2：

Using the technique of above-mentioned module group assembling LED product, following steps are specifically included

1）The high-new display modules of LED are tested, bad module is repaired；

2）To brush three-proofing coating in the faces pcb board IC, power socket screw and toggle switch contact pin position are avoided；Its circuit and IC is set to reach anti- Mould, moisture-proof, anticorrosion and other effects.

3）The pcb board for brushing three-proofing coating is assembled into bottom case component by way of rivet hot；The temperature of rivet hot is 190-200 DEG C, when rivet hot, is 3 seconds a length of；

4）Glue embedding is carried out to the faces LED by glue pouring machine；The glue quantity of individual module is 26g, with room temperature vulcanization after embedding Mode is carried out from doing, and surface drying time is 30 minutes, and primary solidification is 2 hours, and it is 24 hours to be fully cured.

5）Module after encapsulating is tested, qualified module assembles mask by way of rivet hot, and rivet hot temperature is 200-215 DEG C, time 8s, you can obtain full outdoor LED product.

Embodiment 3：

Using the technique of above-mentioned module group assembling LED product, following steps are specifically included

1）The high-new display modules of LED are tested, bad module is repaired；

2）To brush three-proofing coating in the faces pcb board IC, power socket screw and toggle switch contact pin position are avoided；Its circuit and IC is set to reach anti- Mould, moisture-proof, anticorrosion and other effects.

3）The pcb board for brushing three-proofing coating is assembled into bottom case component by way of rivet hot；The temperature of rivet hot is 200-215 DEG C, when rivet hot, is 3 seconds a length of；

4）Glue embedding is carried out to the faces LED by glue pouring machine；The glue quantity of individual module is 27g, with room temperature vulcanization after embedding Mode is carried out from doing, and surface drying time is 30 minutes, and primary solidification is 2 hours, and it is 24 hours to be fully cured.The glue used is A Glue and B glue in mass ratio 10:1 glue prepared, wherein A glue are organic silica gel, and B glue is curing agent, and when preparation exists A glue 3-5min is stirred under conditions of 1500-2000 turns/min, encapsulating after then being mixed with B glue.

5）Module after encapsulating is tested, qualified module assembles mask by way of rivet hot, and rivet hot temperature is 215-235 DEG C, time 8s, you can obtain full outdoor LED product.

Embodiment 4：

Using the technique of above-mentioned module group assembling LED product, following steps are specifically included：

1）The high-new display modules of LED are tested, bad module is repaired；

2）Step 1）Obtained module passes through rivet hot, 190 ± 5 DEG C of rivet hot temperature, duration 8 seconds；Mode by bottom case and mask into The disposable assembling of row, you can obtain semi-outdoor LED product.

In addition during brush three-proofing coating, three-proofing coating palpus 100% covers PCB and component, simple ox seat contact pin and power socket Threaded portion is forbidden to cover three-proofing coating, to prevent poor contact during use.

During last test, product needs 100% to check, glue is needed after LED repairs, needs to mend three-proofing coating after IC repairs.

And it is for glue method in maintenance：1. glue .2. around the dead lamp of removal goes to remove lamp bead .3. and change newly with soldering iron Proportioned casting glue is mended around lamp bead and is dried by lamp bead .4..

The above embodiments are only the preferred technical solution of the present invention, and are not construed as the limitation for the present invention, this Shen Please in embodiment and embodiment in feature in the absence of conflict, mutually can arbitrarily combine.The protection model of the present invention Enclose the equivalent replacement side of technical characteristic in the technical solution that should be recorded with claim, including the technical solution of claim record Case is protection domain.Equivalent replacement i.e. within this range is improved, also within protection scope of the present invention.

Claims (10)

1. a kind of high-new display module surface-mount type techniques of LED, it is characterised in that：Include the following steps：

1）Print tin cream on the faces IC of pcb board, then mount component on the PCB produced, then mount power socket and In toggle switch attachment to the faces IC of pcb board, check that good rear be sent into reflow soldering of attachment carries out reflow soldering；

2）The pcb board welded is taken out from reflow soldering, whether detection pcb board, component and solder joint are good, it is ensured that after good Tin cream is printed on the faces LED of pcb board, LED is then mounted and is sent into reflow soldering again and welded；Obtain LED high New display module semi-finished product.

2. technique according to claim 1, it is characterised in that：When the tin cream is printed, needs to use steel mesh, adjust steel The most quasi- pcb board of mesh need to paste the position of component, seal not corresponding steel mesh hole with transparent adhesive tape, the tin cream being stirred is added and is placed in On steel mesh, finally it is printed on the faces IC of pcb board.

3. technique according to claim 1, it is characterised in that：When power socket mounts, power socket all around site error ≤ 1mm, when toggle switch mounts, error≤0.5mm for all around putting.

4. technique according to claim 1, it is characterised in that：The tin cream is low temperature tin cream, component containing tin-lead-bismuth, weight Amount is than being 43% tin：43% lead：14% bismuth.

5. the high-new display modules of LED being prepared according to technique described in claim 1-4 any one.

6. using technique described in module or claim 1-4 any one described in claim 5 that module group assembling is prepared The technique of LED product, it is characterised in that：

1）The high-new display modules of LED are tested, bad module is repaired；

2）To brush three-proofing coating in the faces pcb board IC, power socket screw and toggle switch contact pin position are avoided；

3）The pcb board for brushing three-proofing coating is assembled into bottom case component by way of rivet hot；

4）Glue embedding is carried out to the faces LED by glue pouring machine；

5）Module after encapsulating is tested, qualified module assembles mask by way of rivet hot；

6）Burn-in test is carried out to the assembled module of mask, obtains full outdoor module group assembling LED product.

7. technique according to claim 6, it is characterised in that：Step 3）Middle rivet hot temperature is 190-215 DEG C, and the time is 3s, step 5）Middle rivet hot temperature is 200-235 DEG C, time 8s.

8. technique according to claim 6, it is characterised in that：Step 4）In, the glue that uses is A glue and B glue by quality Than 10:1 glue prepared, wherein A glue are organic silica gel, and B glue is curing agent, turn A glue in 1500-2000 when preparation/min Under the conditions of stir 3-5min, encapsulating after then being mixed with B glue.

9. technique according to claim 8, it is characterised in that：When glue embedding, the glue quantity of individual module is 26- 28g cures at normal temperatures after embedding.

10. using technique described in module or claim 1-4 any one described in claim 5 that module group assembling is prepared The technique of LED product, it is characterised in that：

1）The high-new display modules of LED are tested, bad module is repaired；

2）Step 1）Obtained module is disposably assembled bottom case and mask by way of rivet hot, you can obtains semi-outdoor Use LED product.