CN108551753A - A fully enclosed power quality comprehensive control device - Google Patents

Abstract

The invention relates to a fully enclosed power quality comprehensive treatment device. The device includes a chassis, a converter unit, a control unit, a power supply module and a built-in heat dissipation module. A temperature sensor is arranged on the converter unit. The first heat conduction layer, the semiconductor refrigeration element, and the second heat conduction layer are arranged in sequence at the bottom of the chassis. The second heat conduction layer is arranged on the inner surface of the chassis. The position of the semiconductor refrigeration element close to the first heat conduction layer is the cooling surface. The semiconductor refrigeration element The position of the cooling element close to the second heat conduction layer is the heating surface, the built-in heat dissipation module is hermetically arranged in the case, and the flow conversion unit is fixedly arranged inside the case by tightly pressing the built-in heat dissipation module. The device does not need to install a heat dissipation fan or a cooling fan, but directly integrates an internal heat dissipation device inside the integrated power management device. Without increasing the overall volume of the device, there is no need to set air holes on the surface of the device, ensuring The sealing effect inside and outside the device improves the stability and reliability of the equipment operation process.

Description

A fully enclosed power quality comprehensive control device

technical field

The invention relates to the field of comprehensive control of power quality, in particular to a fully-sealed comprehensive control device for power quality.

Background technique

An ideal power system should provide power to users at a specified voltage level (nominal voltage) at a constant frequency and sinusoidal waveform. In a three-phase AC power system, the voltage and current of each phase should be in a symmetrical state with equal amplitude and 120 ^° phase difference. Due to the fact that the parameters of each component of the system (generator, transformer, line, etc.) are not ideally linear or symmetrical, the nature of the load varies and changes randomly, coupled with the imperfect control means, operation, external interference and various faults, etc., This ideal state does not exist in reality, and various problems in grid operation, electrical equipment and electricity consumption have arisen from it, and the concept of power quality has also arisen.

The power quality problems of the distribution network are mainly reflected in several aspects: 1) unbalanced three-phase load; 2) unqualified power factor; 3) excessive harmonic content. The power quality comprehensive treatment device is based on power electronic conversion technology, and comprehensively applies power electronic technology and automatic control technology such as high-frequency active inverter, PWM rectification, adaptive coordination control, etc., with high compensation accuracy, good real-time performance, and self-adaptive coordination Control capability, integrating multiple functions such as dynamic reactive power optimization, three-phase unbalance control, and dynamic active filtering.

The sealing effect directly affects the stability and reliability of the operation of the comprehensive power management device. Since the electronic and electronic devices need to be dissipated during the operation of the device, the traditional comprehensive power management device usually adopts forced air cooling, such as Chinese patent ZL201520536488. In X, the cooling fan is used to dissipate heat through air flow. However, with this heat dissipation method, since the fan needs to form air flow inside and outside the device during the rotation process, it is necessary to install air holes on the device, and the external dust will enter the fan and the inside of the module chassis and adhere to the air outlet. Dust filter, after a long time of operation, because the fan and the dust filter are covered with dust, it will gradually affect the heat dissipation efficiency of the fan; at the same time, after dust, corrosive gas, moist gas or foreign matter enters the module chassis, it will also affect sensitive components. For example, the reliability of the pins of power electronic devices will be affected and the service life of the entire device will be reduced. At this time, the overall sealing effect of the power management comprehensive device is reduced, which affects the operation stability and reliability of the device. In addition, when the fan rotates at high speed, it will generate a lot of noise, which will have a certain impact on the work and life of people around.

Contents of the invention

In order to overcome the deficiencies of the prior art, the present invention provides a fully enclosed power quality comprehensive treatment device and its use method. The device does not need to install a cooling fan or a cooling fan, but is directly integrated inside the power management comprehensive device. An internal heat dissipation device, without increasing the overall volume of the device, does not need to set air holes on the surface of the device, which ensures the sealing effect inside and outside the device, and improves the stability and reliability of the equipment operation process. In order to solve the above technical problems, the technical solution adopted by the present invention is to provide a fully enclosed power quality comprehensive treatment device, including a chassis, a converter unit, a control unit and a power module, and is characterized in that it also includes a built-in heat dissipation module. A temperature sensor is arranged on the flow unit, and the built-in heat dissipation module is composed of a first heat conduction layer, a semiconductor cooling element, and a second heat conduction layer arranged in sequence at the bottom of the flow conversion unit, and the second heat conduction layer is arranged on the inner surface of the chassis, and the The position of the semiconductor refrigeration element close to the first heat conduction layer is the cooling surface, the position of the semiconductor refrigeration element close to the second heat conduction layer is the heating surface, the built-in heat dissipation module is sealed and arranged in the chassis, and the flow conversion unit is tightly pressed The built-in heat dissipation module is fixedly arranged inside the case.

Further, the chassis is a heat-dissipating chassis, including an upper cover and a lower cover, the upper and lower covers are detachably and fixedly connected, the joint edge of the upper cover and the lower cover has a U-shaped groove, and the groove is embedded Sealing rubber strips, the four sides of the upper cover and the lower cover are fastened by bolts to ensure smooth jointing of the contact surfaces, and the sealing rubber strips in the groove are tightly pressed to achieve dustproof and waterproof effects.

Furthermore, a waterproof and breathable valve is provided on one side of the case, and the waterproof and breathable valve can prevent the passage of dust and water, and the air passes through the waterproof and breathable valve to balance the stress of the inner and outer cavities of the sealed box.

Further, the first heat conduction layer and the second heat conduction layer are filled with ultra-high filling ceramic powder and 30 μm ultra-thin glass fiber composite material.

Further, the converter unit is composed of multiple converter devices with the same structure, the semiconductor cooling elements at the bottom of the converter devices are connected in parallel, and the power supply module provides DC power supply.

Further, the first heat conduction layer and the second heat conduction layer are made of heat conduction materials, and heat sinks are arranged outside the chassis.

Further, the inner surface of the case is processed by a milling process, and a grip handle is provided on the outside of the case.

The use method of the fully enclosed power quality comprehensive treatment device, the heat of the inverter unit is transferred to the cooling surface of the semiconductor refrigeration element through the first heat conduction layer; The element starts to work, and conducts the heat from its cooling surface to the heating surface, reducing the temperature of the cooling surface. Through the temperature difference between the inverter unit and the cooling surface of the semiconductor refrigeration element, the heat of the inverter unit can be released quickly to semiconductor cooling elements.

Further, the outer surface of the chassis is provided with cooling fins, and the heat from the heating surface of the semiconductor refrigeration element is conducted to the heat dissipation chassis through the second heat conduction layer, and is conducted to the heat dissipation fins on the outer surface of the heat dissipation chassis through the box wall, and then passed through the outer surface. The natural air convection removes the heat.

Compared with prior art, the beneficial effect of the present invention is:

Improve the problems of poor sealing and reliability in the traditional power quality comprehensive management device in the prior art. Through the internal integrated heat dissipation, the entire chassis can adopt a fully sealed design, which improves the stability of the internal components during use and reduces The noise generated during the operation of the small setting; according to the application, when the power quality comprehensive treatment device is used in the field environment, it can better prevent dust, impurities and water from entering the inside of the chassis, improve the service life of the equipment, and reduce the workload of manual maintenance; compared with traditional The heat dissipation method of the fully enclosed power quality integrated device of the present invention is more efficient and the effect is better, and at the same time, the heat dissipation area of the traditional device outside the chassis can be reduced, the volume and weight of the entire device are reduced, and the structure of the device is more efficient. Compact, small and flexible appearance.

Description of drawings

Fig. 1 is a three-dimensional view of the appearance and structure of the heat dissipation cabinet of the fully enclosed power quality comprehensive control device of the present invention.

Fig. 2 is a diagram of the internal structure of the box of the fully enclosed power quality comprehensive treatment device of the present invention.

Fig. 3 is a longitudinal sectional view and a partially enlarged view of the lower cover of the cooling case of the fully enclosed power quality comprehensive treatment device of the present invention.

1—converter unit, 2—fastening screw, 3—heat sink, 4—second heat conduction layer, 5—first heat conduction layer, 6—power module, 7—control unit, 8—semiconductor cooling element, 9—bolt , 10—upper cover, 11—lower cover, 12—filter unit, 13—temperature sensor, 14—heat dissipation chassis, 15-U-shaped groove, 16-grip handle, 17-pre-charging resistor, 18-filtering resistor, 19-cooling surface of semiconductor refrigeration element, 20-heating surface of semiconductor refrigeration element.

Detailed ways

In order to illustrate the technical solution of the present invention more clearly, the present invention will be specifically described below in conjunction with the accompanying drawings, but the embodiments of the present invention are not limited thereto.

Embodiment Referring to accompanying drawings 1 and 2, a fully-sealed power quality comprehensive treatment device includes a cooling case 14, a converter unit 1, a filter unit 12, a temperature sensor 13, a control unit 7 and a power module 6. Referring to accompanying drawing 3, a temperature sensor is arranged on the flow conversion unit 1, and the bottom of the flow conversion unit 1 is provided with a first heat conduction layer 5, a semiconductor refrigeration element 8, and a second heat conduction layer 4 in sequence, and the second heat conduction layer 4 is arranged on the inner surface of the chassis , and the converter unit 1 is fixedly installed on the inner surface of the heat dissipation chassis 14, and the outer surface of the chassis is correspondingly provided with external heat dissipation elements.

Preferably, the flow conversion unit 1 includes three flow conversion devices, the three flow conversion devices have the same structure, the first heat conduction layer 5 and the second heat conduction layer 4 are set as heat conduction materials, and the three semiconductor cooling elements at the bottom of the three flow conversion devices 8 are connected in parallel, and the DC power supply is provided by the power supply module 6. A switch control circuit is provided between the semiconductor cooling element 8 and the power module 6 .

Preferably, the heat-conducting materials of the first heat-conducting layer 5 and the second heat-conducting layer 4 are ultra-highly filled ceramic powder and 30 μm ultra-thin glass fiber composite material.

In another embodiment, the cooling case 14 is formed by combining the upper cover 10 and the lower cover 11, and the inner surface is processed by milling. The joint edge of the upper cover 10 and the lower cover 11 is provided with a U-shaped groove 15. A sealing rubber strip is embedded in the groove. The four sides of the upper cover 10 and the lower cover 11 are fastened by eight bolts 9 to ensure that the contact surfaces are evenly joined, and the sealing rubber strips in the grooves are tightly pressed to achieve dustproof and waterproof effects.

The converter unit 1 is fixedly installed on the inner surface of the heat dissipation case 14 through fastening screws 2 at four corners. After fixing, the semiconductor refrigeration element 8 is pressed against the inner surface of the converter unit 1 and the heat sink case 14 between.

The filter unit 12 of the fully enclosed power quality comprehensive treatment device adopts the potting process, and the filter unit 12 is potted in a rectangular metal box, and is fixedly installed with the inner surface of the cooling case 14 . The filter resistor 18 is installed close to the inner surface of the upper cover of the heat dissipation chassis 14 , and the pre-charging resistor 17 is installed close to the upper inner surface of the lower cover of the heat dissipation chassis 14 . A grip handle 16 is also provided on the outside of the cooling case 14 .

Preferably, a waterproof and breathable valve is provided on the side of the chassis 14, the waterproof and breathable valve can prevent dust and water from passing through, and air can pass through to balance the stress of the sealed inner and outer cavities of the box.

The method of using the fully enclosed power quality comprehensive treatment device is as follows: the heat of the converter unit 1 is transferred to the cooling surface of the semiconductor refrigeration element 8 through the first heat conduction layer 5; , the semiconductor refrigeration element 8 starts to work, conducts the heat of its cooling surface to the heating surface, and reduces the temperature of the cooling surface. At this time, there is a temperature difference between the inverter unit 1 and the cooling surface of the semiconductor refrigeration element 8. The heat can be quickly released to the semiconductor cooling element 8.

The heat on the heating surface of the semiconductor refrigeration element 8 passes through the second heat-conducting layer 4, conducts to the heat dissipation chassis 14, conducts to the heat sink 3 on the outer surface of the heat dissipation chassis 14 through the box wall, and then passes the external natural air convection to carry the heat away. Walk.

The above-mentioned embodiments are only to illustrate the technical conception, principle and characteristics of the present invention. The purpose is to enable those familiar with this technology to understand the content of the present invention and implement it accordingly, and cannot limit the protection scope of the present invention. All equivalent changes or modifications made according to the spirit of the main technical solutions of the present invention shall fall within the protection scope of the present invention.

Claims (9)

1. A fully enclosed power quality comprehensive management device, comprising a chassis, a converter unit, a control unit and a power module, characterized in that: it also includes a built-in heat dissipation module, a temperature sensor is set on the converter unit, and the built-in heat dissipation module is composed of The bottom of the flow conversion unit is composed of a first heat conduction layer, a semiconductor refrigeration element, and a second heat conduction layer arranged in sequence. The second heat conduction layer is arranged on the inner surface of the chassis, and the position of the semiconductor refrigeration element close to the first heat conduction layer is the cooling surface. The position of the semiconductor refrigeration element close to the second heat conduction layer is the heating surface, the built-in heat dissipation module is sealed and arranged in the case, and the flow conversion unit is fixedly arranged inside the case by tightly pressing the built-in heat dissipation module. 2. A fully enclosed power quality comprehensive treatment device as claimed in claim 1, characterized in that: the chassis is a heat dissipation chassis, including an upper cover and a lower cover, the upper and lower covers are detachably fixedly connected, the upper There is a U-shaped groove on the joint edge of the cover and the lower cover, and a sealing rubber strip is embedded in the groove. The four sides of the upper cover and the lower cover are fastened by bolts to ensure that the contact surfaces are evenly joined and pressed tightly into the groove. The sealing rubber strip achieves the effect of dustproof and waterproof. 3. A fully enclosed power quality comprehensive management device as claimed in claim 1, characterized in that: a waterproof and breathable valve is arranged on one side of the chassis, and the waterproof and breathable valve can prevent the passage of dust and water, and the air passes through the The waterproof and breathable valve is used to balance the stress of the inner and outer cavities of the sealed box. 4. A fully-sealed power quality comprehensive treatment device as claimed in claim 1, characterized in that: the first heat conduction layer and the second heat conduction layer are filled with ultra-high filling ceramic powder and 30 μm ultra-thin glass fiber composite material. 5. A fully enclosed power quality comprehensive treatment device as claimed in claim 1, characterized in that: said flow conversion unit is composed of a plurality of flow conversion devices with the same structure, and the semiconductor refrigeration element at the bottom of said flow conversion device Connected in parallel, the DC power supply is provided by the power module. 6. A fully-sealed power quality comprehensive control device as claimed in claim 1, characterized in that: the first heat conduction layer and the second heat conduction layer are made of heat conduction materials, and the outer side of the chassis is provided with heat sinks. 7. A fully enclosed power quality comprehensive control device as claimed in claim 2, characterized in that: the inner surface of the case is processed by milling and flattening process, and the outer side of the case is provided with a grip handle. 8. A method of using the fully enclosed power quality comprehensive treatment device as claimed in claim 1, characterized in that: the heat of the converter unit is transferred to the cooling surface of the semiconductor refrigeration element through the first heat conducting layer; the control unit according to After the temperature sensor monitors the temperature information of the inverter unit and sends out a heat dissipation command, the semiconductor refrigeration element starts to work, and conducts the heat from its cooling surface to the heating surface to reduce the temperature of the cooling surface. Due to the temperature difference between the surfaces, the heat of the flow conversion unit can be quickly released to the semiconductor refrigeration element. 9. A method of using the fully enclosed power quality comprehensive treatment device as claimed in claim 8, characterized in that: the outer surface of the chassis is provided with cooling fins, the heat of the heating surface of the semiconductor refrigeration element passes through the second heat conducting layer, The heat is conducted to the cooling case, and then to the cooling fins on the outer surface of the cooling case through the case wall, and then the heat is taken away by the external natural air convection.