CN108530835A - A kind of high dielectric property hot-pressed material - Google Patents
A kind of high dielectric property hot-pressed material Download PDFInfo
- Publication number
- CN108530835A CN108530835A CN201810328331.6A CN201810328331A CN108530835A CN 108530835 A CN108530835 A CN 108530835A CN 201810328331 A CN201810328331 A CN 201810328331A CN 108530835 A CN108530835 A CN 108530835A
- Authority
- CN
- China
- Prior art keywords
- high dielectric
- minutes
- dielectric property
- pressed material
- hot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Inorganic Insulating Materials (AREA)
Abstract
The present invention relates to a kind of high dielectric property hot-pressed material, preparation includes that high dielectric filler is added in difunctional epoxy systems, and 130 DEG C are stirred 20 minutes, then at 95 DEG C, simple function group epoxy systems, nano alumina particles are added, stirs 130 minutes, obtains glue；It is 60% to adjust glue solid content with propylene glycol methyl ether acetate, then glass cloth is immersed in glue, then after heated drying, obtains high dielectric property hot-pressed material, is protruded with excellent flame retardant property, heat resistance, especially dielectric constant.
Description
Technical field
The invention belongs to electronics technical field of composite materials, and in particular to a kind of high dielectric property hot-pressed material.
Background technology
With the continuous development of science and technology, the application of polymer-based composite is more and more extensive.Meanwhile each application
Also to different materials, more stringent requirements are proposed accordingly in field, such as high temperature resistant, resistance to ablation, high dielectric etc..Due to for
Size is miniaturized and the further demand of high energy storage density, and huge dielectric constant material is always modern capacitor, filter
The hot spot of equal electronic devices research.With fire-retardant attention, it is desirable that product has flame retardant property, fire-retardant to have class requirement,
Respectively UL94 V-2, UL94 V-1 and UL94 V-0 ranks, wherein UL94 V-0 ranks are whether existing judgement substance hinders
The international standard of combustion.Equalization point is found between fire prevention and environmental protection, is the important node of the following flame retardant products development.Fire retardant exists
Importance in modern society can not be ignored, but as a series of environmental protection policies in Europe are put into effect, development and application is to some extent
It is restricted.How while support personnel and property are from fire threat, and fire retardant can be made to deposit human body and environment
Potential hazard be preferably minimized, be electrical domestic fire retardant manufacturing enterprise, research institution and downstream electronic, building materials, traffic and
The common focus of attention of the industries such as furniture.Using complex technique, the advantages of being not only to integrate organic-inorganic material, compatibility is also wanted not
Same organic component, is hopeful to prepare the material for meeting commercial Application.
Invention content
The object of the present invention is to provide a kind of high dielectric property hot-pressed materials, have excellent dielectric properties, excellent is resistance to
Hot, anti-flammability, processability and mechanical property；Our company has applied for multiple patents together simultaneously, illustrates from different directions
Central inventive point, it is especially longitudinal deep, it is expected that obtaining comprehensive protection.
To achieve the above object of the invention, the technical solution adopted by the present invention is：
The preparation method of a kind of high dielectric property hot-pressed material, the high dielectric property hot-pressed material includes the following steps：
(1) six water manganese nitrates, cobalt nitrate hexahydrate and iron chloride are scattered in deionized water, 45 is stirred at 110 DEG C
Minute, obtain presoma system；Then filtering presoma system obtains presoma；Then presoma passed through into drying, calcined
To high dielectric filler；The drying is the lower 105 DEG C of dryings of vacuum；The calcining is under hydrogen/argon gas mixed atmosphere, and 1150 DEG C are forged
It burns 3 hours；The volume ratio of the hydrogen/argon gas is 0.5: 10；
(2) at room temperature, 3,3 '-dithiodipropionic acids, dichloromethane, acetone are mixed；Then m-nitrobenzene sulfonic acid pyrrole is added
Methyl butynol is added in pyridine salt and diphenyl phosphate, stirring after ten minutes, and stirring adds 2,3- epoxies basic ring penta after 35 minutes
Benzylidene aniline is added after 50 minutes in cyclopentyl ether, stirring, continues stirring 5 minutes；Then N is added, N '-dicyclohexyls carbon two is sub-
Amine continues stirring 30 minutes, obtains simple function group epoxy systems；
(3) -2 propyl alcohol of 2- methyl is mixed to addition phthalic acid two after ten minutes to contract with isomery undecyl alcohol polyoxyethylene ether
In water glyceride, 125 DEG C are stirred 5 minutes, and polyetherimide is then added, and are continued stirring 45 minutes, are obtained difunctional epoxy
System；
(4) high dielectric filler is added in difunctional epoxy systems, 130 DEG C are stirred 20 minutes, then at 95 DEG C, are added
Enter simple function group epoxy systems, nano alumina particles, stirs 130 minutes, obtain glue；
(5) it is 60% to use solvent adjustment glue solid content, then reinforcing material is immersed in glue, then heated drying
Afterwards, prepreg is obtained；
(6) prepreg, hot pressing is taken to obtain high dielectric property hot-pressed material.
In above-mentioned technical proposal, in step (1), the six water manganese nitrate, cobalt nitrate hexahydrate, iron chloride mass ratio be 1:
1∶0.2。
In above-mentioned technical proposal, in step (2), 3,3 '-dithiodipropionic acids, dichloromethane, acetone, m-nitrobenzene sulfonic acid
Pyridiniujm, diphenyl phosphate, methyl butynol, 2,3- epoxy group cyclopenta rings amyl ether, benzylidene aniline, N, N '-dicyclohexyls
The mass ratio of carbodiimide is 0.005: 0.15: 1: 0.002: 0.2: 0.02: 1: 0.3: 0.05；Be added methyl butynol when
Between be 20 minutes.
In above-mentioned technical proposal, in step (3), -2 propyl alcohol of 2- methyl, isomery undecyl alcohol polyoxyethylene ether, phthalic acid
2-glycidyl ester, polyetherimide mass ratio be 0.2: 0.1: 1: 0.09.
In above-mentioned technical proposal, in step (4), high dielectric filler, difunctional epoxy systems, simple function group epoxy body
It is, the mass ratio of nano alumina particles is 0.09: 0.4: 1: 0.01.
In above-mentioned technical proposal, in step (5), in the high dielectric property hot-pressed material, the mass fraction of reinforcing material
It is 30%；The reinforcing material is electronic-grade glass fiber cloth；The heat drying is 130 DEG C/30s+160 DEG C/40s+190
℃/30s.Ensure the dispersibility and compatibility of filler, while ladder-elevating temperature and the effect of the compatilizer of small molecule, in turn avoids gas
The presence of bubble, pin hole, while the effect of the adjustment viscosity and compatibility provided using minute quantity nano alumina particles, are reached
Good dispersion effect.
In above-mentioned technical proposal, in step (5), solvent is propylene glycol methyl ether acetate.
In above-mentioned technical proposal, in step (6), condition when hot pressing is 5kg/cm2/150℃/15min+5kg/cm2/170
℃/50min+8kg/cm2/ 200 DEG C/40min+ Temperature falls；6 prepregs, hot pressing are taken to obtain high dielectric property hot pressing material
Material；This is critically important for the present invention, and the solidification process of thermosetting resin is very big on its follow-up performance influence, if curing process
It is improper, cause small molecule to form stress defect, is unable to reach heat-resisting, high dielectric demand.The present invention passes through whole compatibility and work
Skill designs, obtained epoxy material it is heat-resisting it is fine, fire-retardant very well, hydroscopicity it is low, especially dielectric constant performance is good.
Inventor develops cooperatively with school, and creative utilizes hydrogen argon gas mixed gas calcination processing so that in filler
Portion's Lacking oxygen increases, and produces more free electrons, and being directly used in resin compounded system in conjunction with micromolecular compound is conducive to ginseng
With the solidification process of resin, by several organic molecular species on the one hand adjust filler surface nature, prevent inorganic particulate its to tree
Fat generates the too fast influence of partial polymerization, in addition it can adjust crosslinked polymer network so that cured product crosslinking is reasonable, no
It is excessive as brittleness, to which conducive to processing, 1.5 millimeters of feed fishing sides reach 57 meters.The present invention is before being added epoxy, first
Several compound pre-reactions are mixed with, so as to access high polymer main chain with epoxy reaction, fire-retardant while will not reduce resistance to
Heat can also improve wet-heat resisting.The present invention simple function group epoxy and difunctional do not use conventional four-functional group ring
Oxygen, it is still heat-resisting good, also improve processability.
The present invention does not use fire retardant, by modified filler and compound effects, is imitated in combination with polymer reaction
Fruit, material can form finer and close protective layer in heated and burning, reach excellent hot oxygen screen effect, solid to assign
Body adhesives excellent heat resistance and anti-flammability, while mechanical property, adhesive property are good；Overcome the resistance of prior art filler
Mechanical properties decrease, the problem of heat-resisting decline that the bonding that combustion agent is brought declines and reactive flame retardant is brought.
Since above-mentioned technical proposal is used, the present invention has following advantages compared with prior art：
Compound system composition provided by the invention is reasonable, then prepares technique, inorganic nanoparticles in obtained base material
There is uniform dispersion degree, preparation process to belong to chemical process in system, the inorganic matter of formation is combined with the surface of interlaminar resin
Power is much stronger than the surface binding force of traditional physical mechanical blending.The material system composition that the present invention utilizes is reasonable, each to form
/ compatibility is good, and high dielectric property hot-pressed material has thus been prepared, and has good mechanical property, heat resistance, comprehensive
The shortcomings that the advantages of closing polymer, two component of inorganic particulate, two component of improvement, obtains the comprehensive performance of material to improve；Gu
Change effect is good, and cross-linked structure is uniform, on the one hand micromolecular compound can increase system as the compatilizer of macromolecule organic
On the other hand the compatibility of each component avoids forming crosslinking uneven defect when hot-press solidifying, ensures that resin system forms stabilization
Structure, especially improve heat-resisting, the wearability of conventional epoxy, and be free of fire retardant, pass through reasonable reaction, success
The hygroscopic defect of existing reactive phosphor-containing flame-proof molecule is avoided, unexpected effect is achieved.
Specific implementation mode
With reference to embodiment, the invention will be further described：
Embodiment one
A kind of high dielectric property hot-pressed material, preparation method includes the following steps：
(1) six water manganese nitrates, cobalt nitrate hexahydrate and iron chloride are scattered in deionized water, 45 is stirred at 110 DEG C
Minute, obtain presoma system；Then filtering presoma system obtains presoma；Then presoma passed through into drying, calcined
To high dielectric filler；The drying is the lower 105 DEG C of dryings of vacuum；The calcining is under hydrogen/argon gas mixed atmosphere, and 1150 DEG C are forged
It burns 3 hours；The volume ratio of the hydrogen/argon gas is 0.5: 10；
(2) at room temperature, 3,3 '-dithiodipropionic acids, dichloromethane, acetone are mixed；Then m-nitrobenzene sulfonic acid pyrrole is added
Methyl butynol is added in pyridine salt and diphenyl phosphate, stirring after ten minutes, and stirring adds 2,3- epoxies basic ring penta after 35 minutes
Benzylidene aniline is added after 50 minutes in cyclopentyl ether, stirring, continues stirring 5 minutes；Then N is added, N '-dicyclohexyls carbon two is sub-
Amine continues stirring 30 minutes, obtains simple function group epoxy systems；
(3) -2 propyl alcohol of 2- methyl is mixed to addition phthalic acid two after ten minutes to contract with isomery undecyl alcohol polyoxyethylene ether
In water glyceride, 125 DEG C are stirred 5 minutes, and polyetherimide is then added, and are continued stirring 45 minutes, are obtained difunctional epoxy
System；
(4) high dielectric filler is added in difunctional epoxy systems, 130 DEG C are stirred 20 minutes, then at 95 DEG C, are added
Enter simple function group epoxy systems, nano alumina particles, stirs 130 minutes, obtain glue；
(5) it is 60% to adjust glue solid content with propylene glycol methyl ether acetate, and then reinforcing material is immersed in glue,
Again after heated drying, prepreg is obtained, the mass fraction of reinforcing material is 30%, and heat drying technique is 130 DEG C/30s+
160 DEG C/40s+190 DEG C/30s, solve other dryings existing surface pores, crack problem；
(6) 6 prepregs are taken, hot pressing obtains high dielectric property hot-pressed material, and performance test is shown in Table 1, item when hot pressing
Part is 5kg/cm2/150℃/15min+5kg/cm2/170℃/50min+8kg/cm2/ 200 DEG C/40min+ Temperature falls.
In step (1), six water manganese nitrates, cobalt nitrate hexahydrate, iron chloride mass ratio be 1: 1: 0.2；In step (2), 3,
3 '-dithiodipropionic acids, dichloromethane, acetone, m-nitrobenzene sulfonic acid pyridiniujm, diphenyl phosphate, methyl butynol, 2,3- rings
The mass ratio of oxygroup cyclopenta ring amyl ether, benzylidene aniline, N, N '-dicyclohexylcarbodiimides are 0.005: 0.15: 1: 0.002
: 0.2: 0.02: 1: 0.3: 0.05: the time that methyl butynol is added is 20 minutes；In step (3), -2 propyl alcohol of 2- methyl, isomery
Undecyl alcohol polyoxyethylene ether, o-phthalic acid diglycidyl ester, polyetherimide mass ratio be 0.2: 0.1: 1: 0.09；
In step (4), high dielectric filler, difunctional epoxy systems, simple function group epoxy systems, nano alumina particles mass ratio
It is 0.09: 0.4: 1: 0.01.
Comparative example one
As embodiment one, the wherein calcining of step (1) is under argon gas atmosphere, and 1150 DEG C are calcined 3 hours.
Comparative example two
As embodiment one, wherein step (2) is added without diphenyl phosphate.
Comparative example three
As embodiment one, wherein step (3) is added without polyetherimide.
Comparative example four
As embodiment one, wherein step (4) is added without nano alumina particles.
To mechanical performance (unnotched impact strength, the Kj/m of the plank in above-described embodiment and comparative example2), mechanical property
Can (1.5 millimeters of feeds, rice), hot property, dielectric constant (1MHz), water absorption rate, it is fire-retardant be determined, as a result referring to table 1.
The performance of 1 high dielectric property hot-pressed material of table
| It is fire-retardant | Oxygen index (OI) | Drag for side | Dielectric constant | Tg/℃ | Hydroscopicity | Impact strength | |
| Embodiment one | V0 | 49 | 57 | 129 | 222 | 0.058% | 8.2 |
| Comparative example one | V0 | 41 | 55 | 56 | 221 | 0.059% | 8.1 |
| Comparative example two | V1 | 28 | 56 | 115 | 196 | 0.059% | 8.2 |
| Comparative example three | V0 | 38 | 39 | 92 | 190 | 0.065% | 8.1 |
| Comparative example four | V1 | 32 | 46 | 96 | 208 | 0.063% | 8.0 |
To sum up, high dielectric property hot-pressed material composition disclosed by the invention is reasonable, and compatibility is good between each component, thus
High dielectric property hot-pressed material has been prepared, there is good flame retardant property, excellent heat resistance, especially there is low suction
Wet rate and good dielectric properties.
Claims (10)
1. a kind of high dielectric property hot-pressed material, which is characterized in that the preparation method of the high dielectric property hot-pressed material includes
Following steps：
(1) six water manganese nitrates, cobalt nitrate hexahydrate and iron chloride are scattered in deionized water, are stirred 45 minutes at 110 DEG C,
Obtain presoma system；Then filtering presoma system obtains presoma；Then presoma is obtained into Gao Jie by dry, calcining
Electric filler；The drying is the lower 105 DEG C of dryings of vacuum；The calcining is under hydrogen/argon gas mixed atmosphere, and 1150 DEG C of calcinings 3 are small
When；The volume ratio of the hydrogen/argon gas is 0.5: 10；
(2) at room temperature, 3,3 '-dithiodipropionic acids, dichloromethane, acetone are mixed；Then m-nitrobenzene sulfonic acid pyridiniujm is added
With diphenyl phosphate, methyl butynol is added in stirring after ten minutes, and stirring adds 2,3- epoxy group cyclopenta rings after 35 minutes
Benzylidene aniline is added after 50 minutes in amyl ether, stirring, continues stirring 5 minutes；Then it is added N, N '-dicyclohexylcarbodiimides,
Continue stirring 30 minutes, obtains simple function group epoxy systems；
(3) -2 propyl alcohol of 2- methyl is mixed with isomery undecyl alcohol polyoxyethylene ether after ten minutes be added phthalic acid two shrink it is sweet
In grease, 125 DEG C are stirred 5 minutes, and polyetherimide is then added, and are continued stirring 45 minutes, are obtained difunctional epoxy systems；
(4) high dielectric filler is added in difunctional epoxy systems, 130 DEG C are stirred 20 minutes, then at 95 DEG C, are added single
Functional group's epoxy systems, nano alumina particles stir 130 minutes, obtain glue；
(5) it is 60% to use solvent adjustment glue solid content, then reinforcing material is immersed in glue, then after heated drying,
Obtain prepreg；
(6) prepreg, hot pressing is taken to obtain high dielectric property hot-pressed material.
2. high dielectric property hot-pressed material according to claim 1, it is characterised in that：In step (1), the six water nitric acid
Manganese, cobalt nitrate hexahydrate, iron chloride mass ratio be 1: 1: 0.2.
3. high dielectric property hot-pressed material according to claim 1, it is characterised in that：In step (2), 3,3 '-two thio two
Propionic acid, dichloromethane, acetone, m-nitrobenzene sulfonic acid pyridiniujm, diphenyl phosphate, methyl butynol, 2,3- epoxy cyclopentyls
The mass ratio of cyclopenta ether, benzylidene aniline, N, N '-dicyclohexylcarbodiimides are 0.005: 0.15: 1: 0.002: 0.2: 0.02:
1∶0.3∶0.05；The time that methyl butynol is added is 20 minutes.
4. high dielectric property hot-pressed material according to claim 1, it is characterised in that：In step (3), -2 propyl alcohol of 2- methyl,
Isomery undecyl alcohol polyoxyethylene ether, o-phthalic acid diglycidyl ester, polyetherimide mass ratio be 0.2: 0.1: 1:
0.09。
5. high dielectric property hot-pressed material according to claim 1, it is characterised in that：It is high dielectric filler, double in step (4)
Functional group's epoxy systems, simple function group epoxy systems, nano alumina particles mass ratio be 0.09: 0.4: 1: 0.01.
6. high dielectric property hot-pressed material according to claim 1, it is characterised in that：In step (5), the high dielectric property
In hot-pressed material, the mass fraction of reinforcing material is 30%；The reinforcing material is electronic-grade glass fiber cloth.
7. high dielectric property hot-pressed material according to claim 1, it is characterised in that：In step (5), the heat drying is
130℃/30s+160℃/40s+190℃/30s。
8. high dielectric property hot-pressed material according to claim 1, it is characterised in that：In step (5), solvent is propylene glycol first
Ether acetate.
9. high dielectric property hot-pressed material according to claim 1, it is characterised in that：In step (6), condition when hot pressing is
5kg/cm2/150℃/15min+5kg/cm2/170℃/50min+8kg/cm2/ 200 DEG C/40min+ Temperature falls.
10. high dielectric property hot-pressed material according to claim 1, it is characterised in that：In step (6), 6 semi-solid preparations are taken
Piece, hot pressing obtain high dielectric property hot-pressed material.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2018101166407 | 2018-01-27 | ||
| CN201810116640 | 2018-01-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108530835A true CN108530835A (en) | 2018-09-14 |
Family
ID=63480068
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810328331.6A Withdrawn CN108530835A (en) | 2018-01-27 | 2018-04-04 | A kind of high dielectric property hot-pressed material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108530835A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101037225A (en) * | 2007-02-06 | 2007-09-19 | 南京航空航天大学 | Titanium dioxide nano thread, belt and tube block array and preparation method thereof |
| CN101659805A (en) * | 2009-09-24 | 2010-03-03 | 同济大学 | Preparation method of composite wave absorbing powder with wide frequency band |
| CN104370285A (en) * | 2014-10-23 | 2015-02-25 | 北京大学 | Method for macroscopically preparing high-quality graphene by using bio-mineralized material |
| CN105086448A (en) * | 2015-08-31 | 2015-11-25 | 苏州凯欧曼新材料科技有限公司 | High-dielectric constant composite material |
| CN105172297A (en) * | 2015-09-02 | 2015-12-23 | 苏州益可泰电子材料有限公司 | Flame-resistant and heat-resistant copper clad laminate preparation method |
| CN106449145A (en) * | 2016-11-08 | 2017-02-22 | 铜陵市启动电子制造有限责任公司 | Supercapacitor electrode material added with manganese cobalt oxide foamed nickel composite material |
-
2018
- 2018-04-04 CN CN201810328331.6A patent/CN108530835A/en not_active Withdrawn
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101037225A (en) * | 2007-02-06 | 2007-09-19 | 南京航空航天大学 | Titanium dioxide nano thread, belt and tube block array and preparation method thereof |
| CN101659805A (en) * | 2009-09-24 | 2010-03-03 | 同济大学 | Preparation method of composite wave absorbing powder with wide frequency band |
| CN104370285A (en) * | 2014-10-23 | 2015-02-25 | 北京大学 | Method for macroscopically preparing high-quality graphene by using bio-mineralized material |
| CN105086448A (en) * | 2015-08-31 | 2015-11-25 | 苏州凯欧曼新材料科技有限公司 | High-dielectric constant composite material |
| CN105172297A (en) * | 2015-09-02 | 2015-12-23 | 苏州益可泰电子材料有限公司 | Flame-resistant and heat-resistant copper clad laminate preparation method |
| CN106449145A (en) * | 2016-11-08 | 2017-02-22 | 铜陵市启动电子制造有限责任公司 | Supercapacitor electrode material added with manganese cobalt oxide foamed nickel composite material |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108440907A (en) | A kind of preparation method of composite material with high dielectric property | |
| TWI598402B (en) | Halogen-free epoxy resin composition and prepreg, laminate and printed circuit board therewith | |
| TWI593746B (en) | Halogen-free epoxy resin composition and prepreg, laminate and printed circuit board therewith | |
| JP6514335B2 (en) | Silicone resin composition and prepreg using the same, laminate, copper clad laminate, and aluminum substrate | |
| CN105172297A (en) | Flame-resistant and heat-resistant copper clad laminate preparation method | |
| CN105176081A (en) | Preparation method for flame-retardant heat-resistant antenna radome base material | |
| CN106750260B (en) | A kind of modified polyphenylene ether resin and its application | |
| CN102585663A (en) | Halogen-free flame-retardant high-temperature-resistance insulation paint for motor | |
| CN103012790B (en) | Bisphthalonitrile-amino phenoxy phthalonitrile copolymer and condensate, and glass fiber composite material and preparation method thereof | |
| CN108440910A (en) | A kind of high dielectric property glue material | |
| CN108485195A (en) | A kind of preparation method of high dielectric property hot-pressed material | |
| CN108440909A (en) | A kind of preparation method of high dielectric property glue material | |
| CN108530835A (en) | A kind of high dielectric property hot-pressed material | |
| CN108440911A (en) | A kind of preparation method of high dielectric property mould material | |
| CN108485199A (en) | A kind of composite material with high dielectric property | |
| CN108485198A (en) | A kind of high dielectric property mould material | |
| CN110655903A (en) | Photo-curing conductive adhesive and preparation method thereof | |
| CN107759977A (en) | Modified epoxy resin-based prepreg for copper-clad plate and preparation method thereof | |
| CN108440908A (en) | A kind of poured with epoxy resin material | |
| CN103435988B (en) | High-temperature resistant unsaturated polyester resin system and preparation method thereof | |
| CN105062066B (en) | High-frequency electronic dielectric material | |
| CN108485197A (en) | A kind of preparation method of modified epoxy resin system | |
| CN108485200A (en) | A kind of modified epoxy resin composite | |
| CN108546389A (en) | A kind of modified epoxy resin system | |
| CN108485201A (en) | A kind of preparation method of modified epoxy resin composite |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180914 |