CN108381002A - A kind of soldering tin jet device - Google Patents
A kind of soldering tin jet device Download PDFInfo
- Publication number
- CN108381002A CN108381002A CN201810397000.8A CN201810397000A CN108381002A CN 108381002 A CN108381002 A CN 108381002A CN 201810397000 A CN201810397000 A CN 201810397000A CN 108381002 A CN108381002 A CN 108381002A
- Authority
- CN
- China
- Prior art keywords
- storage chamber
- injection pipe
- injector head
- scolding tin
- movable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
- B23K3/047—Heating appliances electric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Nozzles (AREA)
Abstract
The present invention relates to a kind of soldering tin jet devices, belong to technical field of welding equipment.The scolding tin of thawing is placed in the storage chamber of box house by the present invention, electric heater unit persistently heats the scolding tin inside storage chamber, it prevents from solidifying, air pump is pumped into gas into storage chamber by gas pipeline, piston moves downward under pressure to apply pressure to the scolding tin inside storage chamber, scolding tin enters movable injector head through injection pipe under pressure, and the spray-hole opened up from movable injector head sprays.Movable injector head is provided in the present invention on the outside of injection pipe, it is provided with bayonet between movable injector head and injection pipe, movable injector head can be securely fixed on the outside of injection pipe by bayonet, different spray-holes is needed when being welded to different circuit boards, at this moment it can be replaced by replacement activity injector head, and movable injection nozzle structure is simple in the present invention, and it is convenient to replace, and effectively increases the operating efficiency of soldering.
Description
Technical field
The present invention relates to a kind of soldering tin jet devices, belong to technical field of welding equipment.
Background technology
With electronic product make rapid progress fast development, emerge a large amount of microelectronic product include mobile phone, Intelligent bracelet,
Ultra-thin notebook etc., it is higher and higher that they minimize, intelligence etc. so that the comprehensive performance of IC chip requires, not only
It is required that the more small thinner speed of service of chip is faster, and manufacturing cost is required to want low as possible, this is bound to cause its overall dimensions
It reduces, the density of input and output terminal increases, pitch becomes smaller, and is brought for techniques such as dispensing, welding, encapsulation unprecedented tired
It is difficult.
Currently, the common technique of soldered ball making includes：The photoetching of operating procedure complexity and etching need plurality of raw materials
The vapor deposition of chemical reaction, efficiency is low and needs the works such as the sputtering of nitrogen protection and plating of high cost, coating film thickness is uneven
Skill.These techniques are complex, time-consuming, production equipment is expensive, while photoetching and plating also need a large amount of chemical raw material pickling,
So it is extremely urgent to develop new soldered ball manufacture craft.With the fast development of China's electronic manufacturing industry, cause each in the world
Concern of the big electronics firm to Chinese electronics industry, has attracted a large amount of foreign traders to come to invest, therefore should seize the opportunity, and improves China
Electronic Packaging industry the degree of automation actively researches and develops new Electronic Encapsulating Technology, come substitute current process it is complicated, it is expensive,
And time-consuming packaging technology.
Scolding tin spraying technique is exactly a kind of new welding of formation, packaging technology in this context.Scolding tin injection manufacture
Technology can carry out non-contact, high-precision on on-plane surface and spray as new increasing material technique, have that cost is relatively low, environment is dirty
The advantages that dye is few.Therefore, scolding tin spraying technique can be utilized, to make small soldered ball, pin, connecting wire, is improved current
Chip package process situation.
Droplet ejection mode mainly has electromagnetic type, pneumatic type, mechanical, thermal bubble type, piezoelectric type, focus ultrasonic formula etc..Electricity
Magnetic-type need based jet is intercoupled with electric field and magnetic field, is generated driving force and is applied directly on the medium of device inner cavity, intracavitary medium
It is only conductive material, other non-conducting materials cannot be used；Pneumatic type need based jet is suitble to various nonmetallic and low-temperature metal, but
Air pressure driving impact force is larger, and the heated volume of gas easily expands, and causes drop size inconsistent；Mechanical type spraying technology relies on
There are impact wears for mechanical part interaction, but the larger suitable various high viscosity colloids of driving force spray；Thermal bubble type is usually used in
The injection for the low-viscosity media for having bubble formation can be heated, it is difficult to be applied to the higher liquid of viscosity and need the gold of high temperature melting
Belong to injection；Piezoelectric type can be used for continuous injection and the need based jet of the not high metal liquid of water-soluble glue and heating temperature, but press
Electric material non-refractory, driving force is small often to need enlarger to be amplified power；Focus ultrasonic formula energy need based jet generates ultrasound
Wave energy is smaller to need energy-gathering device, and circuit is complicated, cumbersome.
Invention content
Present invention mainly solves the technical issues of：It is easily blocked at the runner of soldering tin jet device cavity inner cavity, nozzle is torn open
Cumbersome problem is filled, the present invention provides a kind of soldering tin jet devices.
In order to solve the above-mentioned technical problem, the technical solution adopted in the present invention：
A kind of soldering tin jet device, including air pump, babinet and movable injector head, the air pump pass through gas pipeline and babinet
It is connected, the box house is storage chamber, and piston is provided in storage chamber, stores and is provided with electrical heating dress on cavity wall
It sets, is injection pipe below storage chamber, movable injector head is installed on the outside of injection pipe, injection is offered on movable injector head
Hole.
A kind of application process of soldering tin jet device is：The scolding tin of thawing is placed in the storage chamber of box house, electricity
Heating device persistently heats the scolding tin inside storage chamber, prevents from solidifying, and air pump is pumped by gas pipeline into storage chamber
Enter gas, piston moves downward under pressure to apply pressure to the scolding tin inside storage chamber, and scolding tin is acted in pressure
Lower to enter movable injector head through injection pipe, the spray-hole opened up from movable injector head sprays.
The electric heater unit is distributed on around injection pipe.
It is provided with bayonet between the movable injector head and injection pipe.
The beneficial effects of the invention are as follows：
（1）The form that is combined with mechanical type spraying is sprayed using pneumatic type in the present invention, by storage chamber by gas pipeline and
Air pump is connected, while piston is provided between scolding tin and gas, and gas is prevented to be in direct contact with scolding tin, and the heated volume of gas is easy
Expansion, causes drop size inconsistent, using this in two mode be combined and expand the scope of application of soldering tin jet device, improve
The efficiency of scolding tin injection.
Electric heater unit is evenly distributed in the present invention near injection pipe, electric heater unit can be to the weldering inside storage chamber
Tin carries out continuous heating, effectively prevent soldering tin binds that injection pipe is caused to block.
Movable injector head is provided in the present invention on the outside of injection pipe, is provided between movable injector head and injection pipe
Movable injector head can be securely fixed in by bayonet on the outside of injection pipe, be welded when to different circuit boards by bayonet
When need different spray-holes, at this moment can be replaced by replacement activity injector head, and movable injector head in the present invention
Simple in structure, it is convenient to replace, and effectively increases the operating efficiency of soldering.
Description of the drawings
Fig. 1 is the organigram of soldering tin jet device of the present invention.
Wherein, 1, gas pipeline；2, piston；3, storage chamber；4, babinet；5, injection pipe；6, spray-hole；7, air pump；8、
Electric heater unit；9, movable injector head.
Specific implementation mode
A kind of soldering tin jet device, including air pump 7, babinet 4 and movable injector head 9, the air pump 7 pass through flue
Road 1 is connected with babinet 4, and 4 inside of the babinet is storage chamber 3, is provided with piston 2 in storage chamber 3, on 3 inner wall of storage chamber
It is provided with electric heater unit 8,3 lower section of storage chamber is injection pipe 5, and 5 outside of injection pipe is equipped with movable injector head 9, activity
Spray-hole 6 is offered on injector head 9.A kind of application process of soldering tin jet device is：The scolding tin of thawing is placed in babinet 4
In the storage chamber 3 in portion, electric heater unit 8 persistently heats the scolding tin inside storage chamber 3, prevents from solidifying, and air pump 7 passes through gas
Body pipeline 1 is pumped into gas into storage chamber 3, and piston 2 moves downward to apply the scolding tin inside storage chamber 3 under pressure
Plus-pressure, scolding tin enter movable injector head 9, the spray-hole opened up from movable injector head 9 through injection pipe 5 under pressure
6 spray.The electric heater unit 8 is distributed on around injection pipe 5.It is set between the movable injector head 9 and injection pipe 5
It is equipped with bayonet.
Claims (4)
1. a kind of soldering tin jet device, including air pump（7）, babinet（4）And movable injector head（9）, the air pump（7）Pass through
Gas pipeline（1）With babinet（4）It is connected, the babinet（4）Inside is storage chamber（3）, storage chamber（3）Inside it is provided with piston
（2）, storage chamber（3）Electric heater unit is provided on inner wall（8）, storage chamber（3）Lower section is injection pipe（5）, injection pipe（5）
Outside is equipped with movable spray head（9）, movable spray head（9）On offer spray-hole（6）.
2. a kind of application process of soldering tin jet device according to claim 1 is：The scolding tin of thawing is placed on babinet
（4）Internal storage chamber（3）In, electric heater unit（8）Persistently to storage chamber（3）Internal scolding tin is heated, and prevents from solidifying,
Air pump（7）Pass through gas pipeline（1）To storage chamber（3）It is inside pumped into gas, under pressure piston（2）It moves downward to right
Storage chamber（3）Internal scolding tin applies pressure, and scolding tin is under pressure through injection pipe（5）Into movable spray head（9）, from work
Dynamic nozzle（9）On the spray-hole that opens up（6）It sprays.
3. a kind of soldering tin jet device according to claim 1, it is characterised in that：The electric heater unit（8）It is uniformly distributed
In injection pipe（5）Around.
4. a kind of soldering tin jet device according to claim 1, it is characterised in that：The movable spray head（9）With injection
Pipeline（5）Between be provided with bayonet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810397000.8A CN108381002A (en) | 2018-04-28 | 2018-04-28 | A kind of soldering tin jet device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810397000.8A CN108381002A (en) | 2018-04-28 | 2018-04-28 | A kind of soldering tin jet device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108381002A true CN108381002A (en) | 2018-08-10 |
Family
ID=63066234
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810397000.8A Withdrawn CN108381002A (en) | 2018-04-28 | 2018-04-28 | A kind of soldering tin jet device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108381002A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109794664A (en) * | 2019-03-05 | 2019-05-24 | 西北师范大学 | A kind of SCM Based scolding tin promotes, scolding tin draws multi-purpose device |
| CN110315165A (en) * | 2019-06-28 | 2019-10-11 | 中国航发南方工业有限公司 | Solder doses device and solder addition methods |
| CN113042845A (en) * | 2021-03-25 | 2021-06-29 | 重庆振多弱电工程有限公司 | Tin dispensing device for PCB in building automation equipment |
-
2018
- 2018-04-28 CN CN201810397000.8A patent/CN108381002A/en not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109794664A (en) * | 2019-03-05 | 2019-05-24 | 西北师范大学 | A kind of SCM Based scolding tin promotes, scolding tin draws multi-purpose device |
| CN109794664B (en) * | 2019-03-05 | 2024-06-14 | 西北师范大学 | Soldering tin propelling and sucking multipurpose device based on single chip microcomputer |
| CN110315165A (en) * | 2019-06-28 | 2019-10-11 | 中国航发南方工业有限公司 | Solder doses device and solder addition methods |
| CN113042845A (en) * | 2021-03-25 | 2021-06-29 | 重庆振多弱电工程有限公司 | Tin dispensing device for PCB in building automation equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180810 |
|
| WW01 | Invention patent application withdrawn after publication |