CN108342174A - A kind of thermostable epoxy resin adhesive and preparation method thereof - Google Patents
A kind of thermostable epoxy resin adhesive and preparation method thereof Download PDFInfo
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- CN108342174A CN108342174A CN201810122305.8A CN201810122305A CN108342174A CN 108342174 A CN108342174 A CN 108342174A CN 201810122305 A CN201810122305 A CN 201810122305A CN 108342174 A CN108342174 A CN 108342174A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
- C08G59/1455—Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
- C08G59/623—Aminophenols
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
- C08K5/101—Esters; Ether-esters of monocarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
- C08K5/101—Esters; Ether-esters of monocarboxylic acids
- C08K5/103—Esters; Ether-esters of monocarboxylic acids with polyalcohols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Emergency Medicine (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
Abstract
The invention belongs to field of adhesive technology, and in particular to a kind of thermostable epoxy resin adhesive and preparation method thereof；The present invention includes 5 10 parts of modified 35 50 parts of glycidyl amine type epoxy resin, 20 40 parts of thiocarbamide contracting amine, 5 10 parts of line style phenolic aldehyde polyglycidyl ether, 30 5 15 parts of DMP, 5 10 parts of IPDI, 5 10 parts of octyl dodecanol myristinate and monoglyceride；Not only cohesive force is strong but also heat-resist for the adhesive of the present invention；And preparation method is simple and easy to control, shortens the production cycle.
Description
Technical field
The invention belongs to field of adhesive technology, and in particular to a kind of thermostable epoxy resin adhesive and its preparation side
Method.
Background technology
Aluminium alloy, not only density is low, intensity relatively high (near or above high-quality steel), plasticity are good, can be processed into various types
Material, and there is excellent electric conductivity, thermal conductivity and corrosion stability, to industrially be widely used, usage amount is only second to steel.
With aesthetics, safety and the requirement used, aluminium alloy is with specifically in use, according to actually generally requiring aluminium
It is attached between alloy, connection method is mainly fixed with connector and connected with binder, wherein binder and traditional riveting
It connects, weld, being threadedly coupled and compare, either improving stressing conditions, improving structural behaviour, mitigate matter part quality, or
Modified technique operation reduces cost etc. and all has incontrovertible superiority；But due to its cohesive force and not weather-proof enough,
It is especially heat-resisting not enough to limit its use.
Invention content
To solve the above-mentioned problems, the purpose of the present invention is to provide a kind of thermostable epoxy resin adhesives that cohesive force is big.
The second object of the present invention is to provide the preparation method of the thermostable epoxy resin adhesive.
The present invention is achieved through the following technical solutions：
A kind of thermostable epoxy resin adhesive, including the following raw material calculated in parts by mass：
Wherein, the modified glycidyl amine type epoxy resin is by 70-85 parts of glycidyl amine type epoxy resin, monoglyceride
5-10 parts and described DMP-30 10-20 parts are prepared.
Preferably, the modified glycidyl amine type epoxy resin is calculated according to mass parts, by following material composition：
70-85 parts of glycidyl amine type epoxy resin
5-10 parts of monoglyceride
10-20 parts of DMP-30.
The preparation method of the thermostable epoxy resin adhesive, specially：
A. the modified contracting is added in the reaction kettle for filling into mouth equipped with blender, thermometer, gas inlet and outlet and material
Water glyceramine type epoxy resin, DMP-30, octyl dodecanol myristinate and monoglyceride agitating and heating, are warming up in 30 minutes
50-60℃；
B. when temperature is to 80 ± 2 DEG C, by material fill into mouth be added IPDI, shrinking thiocarbamide contracting amine and line style phenolic aldehyde more it is sweet
Oily ether, stirring heat preservation 2 hours；
C. stop heating after being warming up to 130 ± 2 DEG C after keeping the temperature 2 hours, keep the temperature 2 hours；
It when being D. cooled to 120 ± 2 DEG C, reduces pressure to 0.05MPa, continues 110 ± 2 DEG C of cooling and cure 5 hours, institute is made
State thermostable epoxy resin adhesive.
Preferably, being passed through inert gas in the step A.Experiment proves that low pressure is passed through inert gas, keeps end reaction equal
Even, hardening time shortens, and increases cohesive force.
Wherein, the preparation method of the modified glycidyl amine type epoxy resin is specially：
A. it is sweet that the shrink is added in the reaction kettle for filling into mouth equipped with blender, thermometer, gas inlet and outlet and material
Oleyl amine type epoxy resin, monoglyceride, which heated in 30 minutes, is warming up to 50-60 DEG C；
B. when temperature is to 65 ± 2 DEG C, mouth is filled by material, the DMP-30, stirring heat preservation 2 hours is added；
C. stop heating after being warming up to 80 ± 2 DEG C after keeping the temperature 2 hours, keep the temperature 2 hours；
It when being D. cooled to 70 ± 2 DEG C, reduces pressure to 0.05MPa, continues 55 ± 2 DEG C of cooling solidification 5 hours and be made described
Modified glycidyl amine type epoxy resin.
Preferably, being passed through inert gas in the step A.
The present invention include epoxy resin, thiocarbamide contracting amine, line style phenolic aldehyde polyglycidyl ether, DMP-30, IPDI1-5 parts, it is pungent
Base lauryl alcohol myristinate part and monoglyceride；(3- isocyanates methylenes -3,5,5- trimethylcyclohexyls are different by wherein IPDI
Cyanate) contain cis-isomer 75% and transisomer 25%, chlorine≤200mg/kg, total chlorine≤400mg/kg are hydrolyzed, is sticked
Spend (25 DEG C) about 10mPa.s.The reactivity of 2 NCO groups is different in IPDI molecules because in IPDI molecules primary NCO by
The steric hindrance of cyclohexane ring and a- substituent methyls so that be connected in the primary NCO's of reactivity ratio of the secondary NCO group on hexamethylene
It is 1.3-2.5 times high；Under the preparation process condition of the present invention, the double bond caused in DMP-30 is copolymerized friendship with epoxy resin
Connection；Coordinate other raw materials that adhesive is made to have excellent stability and chemical resistance.Octyl dodecanol myristinate
The compound mixed by octyl dodecanol (thickening agent) and myristic acid, while increasing the present invention transparency, enhancing is each
Lubrication between raw material, plays the role of coupling agent, its adhesion strength is made to greatly improve.It is preferred that Japan THB/ Chinese mugworts are than part, viscosity
The octyl dodecanol myristinate of 28 (Mpa.s, 25 degree).Monoglyceride usually as the emulsifier in food, but other contains
It is (excellent with octyl dodecanol myristinate, tartaric acid in the present invention there are one the chain alkyl and two hydrophilic hydroxyls of oleophylic
Select D types tartaric acid) it combines, thus there is good surface-active so that the adhesive being prepared is not easy to be layered, cohesive force
Enhance while using extended shelf-life.
The preparation method of the present invention uses preparation method same as main component modified epoxy in raw material, middle ring
What oxygen resin was prepared for cooling method directly is mixed in material in the past, by melting down processing again
Its heat resistance of adhesive and strong cohesive force are adequately improved, adhesive of the invention not only cohesive force it is strong but also
Heat-resist, the present invention is modified glycidyl amine type epoxy resin using monoglyceride and DMP-30, it is made not only to bond
Intensity high solidification shrinking percentage is low, while improving the weather-proof and heat safe characteristic of glycidyl amine type epoxy resin.Sulphur simultaneously
Urea contracting amine further increases the toughness of product, caking property, and raw material of the present invention generates synergistic effect, greatly improves the anti-of binder
Ageing properties, the Acclimation temperature range for improving binder, ranging from -80~350 DEG C of Acclimation temperature.Aluminium alloy gluing of surfaces
Need not strictly handle just has higher adhesive strength, by the adhesive of the present invention for being bonded aluminium test piece, the aluminium examination being cured
The shear strength of piece has preferable impact strength and antifatigue effect, after use up to 75.2MPa, conservation rate up to 97.2%
Waterproof effect is good, especially suitable between Al-alloy products.This method not only simplifies flow, it is only necessary to several same anti-
Answer kettle is several to be carried out at the same time flow line production.
Specific embodiment
The present invention is described in further detail With reference to embodiment, is managed to help those skilled in the art
The solution present invention.
Embodiment 1
A kind of thermostable epoxy resin adhesive, including the following raw material calculated in parts by mass：
Modified glycidyl amine type epoxy resin (70 parts of glycidyl amine type epoxy resin, 10 parts of monoglyceride, DMP-30
20 parts) 35 kilograms, 40 kilograms of thiocarbamide contracting amine, 5 kilograms of line style phenolic aldehyde polyglycidyl ether, 5 kilograms of DMP-30,5 kilograms of IPDI,
5 kilograms of 5 kilograms of the public glycol myristinate of octyl ten and monoglyceride.
Preparation method：
(1) preparation method of modified glycidyl amine type epoxy resin is specially：
A. it is sweet that the shrink is added in the reaction kettle for filling into mouth equipped with blender, thermometer, gas inlet and outlet and material
Oleyl amine type epoxy resin, monoglyceride, which heated in 30 minutes, is warming up to 50-60 DEG C；
B. when temperature is to 65 ± 2 DEG C, mouth is filled by material, the DMP-30, stirring heat preservation 2 hours is added；
C. stop heating after being warming up to 80 ± 2 DEG C after keeping the temperature 2 hours, keep the temperature 2 hours；
It when being D. cooled to 70 ± 2 DEG C, reduces pressure to 0.05MPa, continues 55 ± 2 DEG C of cooling solidification 5 hours and be made described
Modified glycidyl amine type epoxy resin.
(2) preparation of thermostable epoxy resin adhesive：
A. the modified contracting is added in the reaction kettle for filling into mouth equipped with blender, thermometer, gas inlet and outlet and material
Water glyceramine type epoxy resin, DMP-30, octyl dodecanol myristinate and monoglyceride agitating and heating, are warming up in 30 minutes
50-60℃；It is passed through inert gas simultaneously.
B. when temperature is to 80 ± 2 DEG C, by material fill into mouth be added IPDI, shrinking thiocarbamide contracting amine and line style phenolic aldehyde more it is sweet
Oily ether, stirring heat preservation 2 hours；
C. stop heating after being warming up to 130 ± 2 DEG C after keeping the temperature 2 hours, keep the temperature 2 hours；
It when being D. cooled to 120 ± 2 DEG C, reduces pressure to 0.05MPa, continues 110 ± 2 DEG C of cooling and cure 5 hours, institute is made
State thermostable epoxy resin adhesive.
Embodiment 2
A kind of thermostable epoxy resin adhesive, including the following raw material calculated in parts by mass：
Modified glycidyl amine type epoxy resin (85 parts of glycidyl amine type epoxy resin, 5 parts of monoglyceride, DMP-30 15
Part) 50 kilograms, 20 kilograms of thiocarbamide contracting amine, 10 kilograms of line style phenolic aldehyde polyglycidyl ether, 5 kilograms of DMP-30,5 kilograms of IPDI,
5 kilograms of 5 kilograms of the public glycol myristinate of octyl ten and monoglyceride.
Preparation method：With embodiment 1.
Embodiment 3
A kind of thermostable epoxy resin adhesive, including the following raw material calculated in parts by mass：
Modified glycidyl amine type epoxy resin (80 parts of glycidyl amine type epoxy resin, 8 parts of monoglyceride, DMP-30 12
Part) 40 kilograms, 25 kilograms of thiocarbamide contracting amine, 6 kilograms of line style phenolic aldehyde polyglycidyl ether, 4 kilograms of DMP-30,10 kilograms of IPDI,
5 kilograms of 10 kilograms of the public glycol myristinate of octyl ten and monoglyceride.
Preparation method：With embodiment 1.
Embodiment 4
A kind of thermostable epoxy resin adhesive, including the following raw material calculated in parts by mass：
Modified glycidyl amine type epoxy resin (82 parts of glycidyl amine type epoxy resin, 7 parts of monoglyceride, DMP-30 11
Part) 35 kilograms, 20 kilograms of thiocarbamide contracting amine, 5 kilograms of line style phenolic aldehyde polyglycidyl ether, 15 kilograms of DMP-30,8 kilograms of IPDI,
10 kilograms of 7 kilograms of the public glycol myristinate of octyl ten and monoglyceride.
Preparation method：With embodiment 1.
Above-described embodiment, only presently preferred embodiments of the present invention, is not used for limiting the scope of the present invention, therefore all with this
The equivalent change or modification that feature and principle described in invention claim are done, should all be included in scope of the invention as claimed
Within.
Contrast test：
Comparative example 1, in formula other than being free of IPDI, remaining composition and preparation method are identical as the present invention.
Comparative example 2, in formula other than being free of octyl dodecanol myristinate, remaining composition and preparation method and this hair
It is bright identical.
Comparative example 3, in formula other than being free of monoglyceride, remaining composition and preparation method are identical as the present invention.
Comparative example 4, formula is identical, and in preparation method other than not being passed through inert gas, remaining is identical.
The present invention is compared with the shear strength of comparative example 1,2,3,4 at different temperatures, comparing result is shown in Table 1.
Table 1
Note：The unit of shearing force intensity is MPa in table 1.
By table 1 as it can be seen that adding IPDI, octyl dodecanol myristinate, monoglyceride in epoxy resin all to final gluing
The cohesive force and heat resistance of agent are influenced.Wherein, IPDI, octyl dodecanol myristinate and monoglyceride synergistic effect,
Being far longer than cohesive force and heat resistance individually influences；The shearing force of binder has nearly reached the tensile strength of aluminium alloy.It is former
When expecting that identical preparation method is identical, it is passed through the cohesive force of the adhesive of inert gas preparation and heat resistance is far longer than and is not passed through
The adhesive that method is prepared.
Claims (6)
1. a kind of thermostable epoxy resin adhesive, which is characterized in that including the following raw material calculated in parts by mass：
Wherein, the modified glycidyl amine type epoxy resin is by 70-85 parts of glycidyl amine type epoxy resin, monoglyceride 5-10
Part is prepared with described DMP-30 10-20 parts.
2. thermostable epoxy resin adhesive as described in claim 1, which is characterized in that the modified glycidyl amine epoxy
Resin is calculated according to mass parts, by following material composition：
70-85 parts of glycidyl amine type epoxy resin
5-10 parts of monoglyceride
10-20 parts of DMP-30.
3. the preparation method of thermostable epoxy resin adhesive described in claim 1, which is characterized in that be specially：
A. it is sweet that the modified shrink is added in the reaction kettle for filling into mouth equipped with blender, thermometer, gas inlet and outlet and material
Oleyl amine type epoxy resin, DMP-30, octyl dodecanol myristinate and monoglyceride agitating and heating, 50- is warming up in 30 minutes
60℃；
B. when temperature is to 80 ± 2 DEG C, mouth is filled by material, IPDI, thiocarbamide contracting amine and the more glycidols of line style phenolic aldehyde is added
Ether, stirring heat preservation 2 hours；
C. stop heating after being warming up to 130 ± 2 DEG C after keeping the temperature 2 hours, keep the temperature 2 hours；
It when being D. cooled to 120 ± 2 DEG C, reduces pressure to 0.05MPa, continues 110 ± 2 DEG C of cooling and cure 5 hours, be made described resistance to
High temperature epoxy resins adhesive.
4. the preparation method of thermostable epoxy resin adhesive as claimed in claim 3, which is characterized in that lead in the step A
Enter inert gas.
5. the preparation method of thermostable epoxy resin adhesive as claimed in claim 3, which is characterized in that the modified shrink is sweet
The preparation method of oleyl amine type epoxy resin is specially：
A. the glycidyl amine is added in the reaction kettle for filling into mouth equipped with blender, thermometer, gas inlet and outlet and material
Type epoxy resin, monoglyceride, which heated in 30 minutes, is warming up to 50-60 DEG C；
B. when temperature is to 65 ± 2 DEG C, mouth is filled by material, the DMP-30, stirring heat preservation 2 hours is added；
C. stop heating after being warming up to 80 ± 2 DEG C after keeping the temperature 2 hours, keep the temperature 2 hours；
It when being D. cooled to 70 ± 2 DEG C, reduces pressure to 0.05MPa, continues 55 ± 2 DEG C of cooling solidification 5 hours and the modification is made
Glycidyl amine type epoxy resin.
6. the preparation method of thermostable epoxy resin adhesive as claimed in claim 5, which is characterized in that lead in the step A
Enter inert gas.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810122305.8A CN108342174A (en) | 2018-02-07 | 2018-02-07 | A kind of thermostable epoxy resin adhesive and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810122305.8A CN108342174A (en) | 2018-02-07 | 2018-02-07 | A kind of thermostable epoxy resin adhesive and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108342174A true CN108342174A (en) | 2018-07-31 |
Family
ID=62958594
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810122305.8A Withdrawn CN108342174A (en) | 2018-02-07 | 2018-02-07 | A kind of thermostable epoxy resin adhesive and preparation method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN108342174A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102417808A (en) * | 2011-09-29 | 2012-04-18 | 西北工业大学 | High-temperature-resistant adhesive and preparation method thereof |
| CN102850978A (en) * | 2011-06-28 | 2013-01-02 | 上海市合成树脂研究所 | Room temperature cured high-temperature resistant epoxy adhesive |
| CN104531024A (en) * | 2014-12-22 | 2015-04-22 | 阳新宏洋电子有限公司 | Epoxy resin adhesive, flexible copper-clad plate prepared from epoxy resin adhesive and preparation method of flexible copper-clad plate |
| CN105331317A (en) * | 2015-11-24 | 2016-02-17 | 太仓市金锚新材料科技有限公司 | High-temperature-resistant adhesive capable of being cured at room temperature and preparation method of adhesive |
-
2018
- 2018-02-07 CN CN201810122305.8A patent/CN108342174A/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102850978A (en) * | 2011-06-28 | 2013-01-02 | 上海市合成树脂研究所 | Room temperature cured high-temperature resistant epoxy adhesive |
| CN102417808A (en) * | 2011-09-29 | 2012-04-18 | 西北工业大学 | High-temperature-resistant adhesive and preparation method thereof |
| CN104531024A (en) * | 2014-12-22 | 2015-04-22 | 阳新宏洋电子有限公司 | Epoxy resin adhesive, flexible copper-clad plate prepared from epoxy resin adhesive and preparation method of flexible copper-clad plate |
| CN105331317A (en) * | 2015-11-24 | 2016-02-17 | 太仓市金锚新材料科技有限公司 | High-temperature-resistant adhesive capable of being cured at room temperature and preparation method of adhesive |
Non-Patent Citations (1)
| Title |
|---|
| 王德中: "《环氧树脂生产与应用》", 30 June 2001, 化学工业出版社 * |
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Application publication date: 20180731 |