CN108321306A - A kind of Frit encapsulation cover plates and preparation method thereof - Google Patents
A kind of Frit encapsulation cover plates and preparation method thereof Download PDFInfo
- Publication number
- CN108321306A CN108321306A CN201810248944.9A CN201810248944A CN108321306A CN 108321306 A CN108321306 A CN 108321306A CN 201810248944 A CN201810248944 A CN 201810248944A CN 108321306 A CN108321306 A CN 108321306A
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- China
- Prior art keywords
- frit
- metal layer
- layers
- layer
- plate
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Links
- 238000005538 encapsulation Methods 0.000 title claims abstract description 31
- 238000002360 preparation method Methods 0.000 title description 2
- 239000002184 metal Substances 0.000 claims abstract description 67
- 229910052751 metal Inorganic materials 0.000 claims abstract description 67
- 239000011521 glass Substances 0.000 claims abstract description 32
- 238000004806 packaging method and process Methods 0.000 claims abstract description 15
- 238000004519 manufacturing process Methods 0.000 claims abstract description 6
- 239000010410 layer Substances 0.000 claims description 123
- 229920002120 photoresistant polymer Polymers 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 239000011229 interlayer Substances 0.000 claims description 2
- 150000002739 metals Chemical class 0.000 claims 1
- 230000002708 enhancing effect Effects 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 12
- 239000000758 substrate Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a kind of encapsulation cover plates and production method of enhancing Frit encapsulation performances.It is equipped with metal layer in the Frit packaging areas of glass cover-plate, layer on surface of metal has micro-structure.The invention also discloses a kind of production methods of the encapsulation cover plate.
Description
Technical field
The present invention relates to field of semiconductor package, in particular, being related to a kind of encapsulation cover plate of enhancing Frit encapsulation performances
And production method.
Background technology
Frit encapsulating materials have been used on a large scale on semiconductor and OLED screen packaging technology at present, and Frit materials with
The bonding force and stability of glass substrate are the important indicators for embodying OLED device product reliability.Due to current OLED caps
The bonding effect of plate and Frit materials is poor, therefore reduces the reliability of OLED products.
Invention content
The present invention provides a kind of encapsulation cover plate of enhancing Frit encapsulation performances, by adding between glass cover-plate and Frit layers
Enter microstructure design special on one layer of metal layer and metal layer, enhances the Frit layers of adhesion strength on glass cover-plate, in turn
Enhance stability, while metal layer can also be adsorbed or reacted to penetrating into the water oxygen in Frit layers.
The present invention provides a kind of Frit encapsulation cover plates, including glass cover-plate, metal layer, Frit layer, the metal layer with
The Frit layers of packaging area for being located at glass cover-plate.
The metal layer has concaveconvex structure in the contact surface with Frit layers.
The metal layer and the Frit layers of chi structure with interlayer.
Metal layer can be used as the sacrificial layer in Frit, is adsorbed or is reacted to penetrating into the water oxygen in Frit layers.
Further, the concaveconvex structure is multiple raised micro-structures.
Further, the section of the raised micro-structure is the geometric figure that upper bottom surface width is more than bottom surface width.
Further, the raised micro-structure includes coronal and support portion, and the cross-sectional width of coronal structure, which is more than, to be supported
Portion's cross-sectional width
Further, the section of the raised micro-structure is the geometric figure that upper bottom surface width is more than bottom surface width.This
Kind end face of the metal layer far from glass cover-plate can preferably make gold than metal layer and the big structure design in glass cover-plate bed boundary
Belong to the transmission that adhesive force is realized between layer and Frit layers, meanwhile, the toughness of metal layer stress is better than Frit materials, can be effective
The stress inside Frit layers and deformation are sponged, Frit layers of internal the case where generating slight crack are substantially improved.
Further, the cross section geometric figure is " T " font or inverted trapezoidal or " mushroom-shaped ".
Further, the thickness of the metal layer is in 1-4um.
Further, the thickness of Frit layers is 6-8um.
Further, the metal layer is materials and its composite layers such as Al, Mo, Cu, Cr.
The present invention also provides a kind of production methods of Frit encapsulation cover plates, include the following steps：
S1：The packaging area deposited metal layer on glass cover-plate；
S2：Patterned process is carried out to metal layer and forms concaveconvex structure；
S3：Frit layers are coated in layer on surface of metal；
Optionally, there is step S0 before step S1 deposited metal layers：To the glass of packaging area on glass cover-plate
Surface is roughened.
Further, there is step S0 before step S1 deposited metal layers：Packaging area forms one on glass cover-plate
The thickness of the photoresist layer of pattern layers, photoresist layer is less than metal layer thickness.
Further, further include removing the photoresist layer below metal layer in the step S2, to which Formation cross-section is upper
Bottom width is more than the bulge-structure of bottom surface width.
One layer of metal layer is prepared on glass cover-plate, can preferably make to realize adhesive force between metal layer and Frit layers
It transmits, meanwhile, metal layer stress performance is better than Frit materials, can effectively sponge stress and the deformation inside Frit layers, greatly
It is big to improve Frit layers of internal the case where generating slight crack.The thermal property of metal layer is better than Frit materials, can be quickly by part
Heat transfer scatter, encapsulated layer internal stress caused by avoiding local heating's imbalance.And the micro- knot of metal layer of inverted trapezoidal
Structure can increase metal layer and Frit layers of chimeric effect, increase the adhesion strength between encapsulation cover plate and frit, effectively
Improve the stability and reliability of packaging effect and packed device.
Description of the drawings
Fig. 1 is encapsulation cover plate schematic diagram of the present invention；
Fig. 2 is the encapsulation region structural schematic diagram of encapsulation cover plate of the present invention；
Fig. 3 is the structural schematic diagram of one embodiment of the invention；
Fig. 4 is sectional views of the Fig. 3 along dotted line A-A '；
Fig. 5 is the structural schematic diagram of another embodiment of the present invention；
Fig. 6 is sectional views of the Fig. 5 along dotted line A-A '；
Fig. 7 is the making step of encapsulation cover plate of the present invention.
Icon：100- encapsulation cover plates；1- glass substrates；2- metal layers；3-Frit encapsulated layers；4- micro-structures；A-A ' sections
Position.
Specific implementation mode
Below in conjunction with the drawings and specific embodiments, the invention will be further described.
Embodiment one
As shown in Figure 1, the present invention provides a kind of encapsulation cover plate 100, in conjunction with Fig. 2, metal layer 2 and Frit layers 3 sequentially form
On glass substrate 1, metal layer 2 and Frit layers 3 are located at the packaging area of glass cover-plate, and packaging area is located at 1 side of glass substrate
Edge.
In conjunction with Fig. 3 and Fig. 4, the deposited metal layer 2 on glass substrate 1 carries out gridding processing to metal layer 2 and forms micro- knot
Structure 4 coats Frit encapsulated layers 3 on latticed metal layer.
The height of prepared metal layer 2 is in 1-3um, and the thickness of Frit layers 3 is in 6-8um.The metal layer 2 be Al, Mo,
The materials such as Cu, Cr and its composite layer are constituted.
Embodiment two
With reference to Fig. 5, metal layer 2 is made on cover board 1, prepares convex micro-structure 4, cross section structure tool on the metal layer
Body can be structure as shown in FIG. 6, and there is coronal structure 41 and support sector 42, the cross-sectional width of coronal structure to be cut more than support sector
Face width, shown cross section structure are preferably " T " font.Frit seal is carried out between cover board 1 and substrate 4.The protrusion micro-structure 4
Section be upper bottom surface width be more than bottom surface width geometric figure.
It end face of this metal layer far from glass cover-plate, can be with than metal layer and the big structure design in glass cover-plate bed boundary
Preferably make the transmission that adhesive force is realized between metal layer and Frit layers, meanwhile, the toughness of metal material stress is better than Frit materials
Material, can effectively sponge stress and the deformation inside Frit layers, substantially improve Frit layers of internal the case where generating slight crack, as
Reinforcing bar is added in concrete, greatly promotes its various performance.Wherein prepared metal layer height is sealed in 2-4um, Frit
Layer thickness is filled in 6-8um.
Embodiment three
The present invention also provides a kind of production methods of Frit encapsulation cover plates, include the following steps：
S1：The packaging area deposited metal layer on glass cover-plate；
S2：Patterned process is carried out to metal layer and forms concaveconvex structure；
S3：Frit layers are coated in layer on surface of metal；
Further, also have before step S1 deposited metal layers：
Step S0：Packaging area forms the photoresist layer of a pattern layers on glass cover-plate, and the thickness of photoresist layer is small
In metal layer thickness.
Further, further include step S2 ' in the step S2 when there are S0 steps：
The photoresist layer below metal layer is removed, to which Formation cross-section is the protrusion that upper bottom surface width is more than bottom surface width
Structure.
Optionally, there is step S0 before step S1 deposited metal layers：To the glass of packaging area on glass cover-plate
Surface is roughened.
The present invention prepares one layer of metal layer on glass cover-plate, can preferably make to realize between metal layer and Frit layers attached
The transmission puted forth effort, meanwhile, metal layer stress performance is better than Frit materials, can effectively sponge the stress and shape inside Frit layers
Become, substantially improves Frit layers of internal the case where generating slight crack.The thermal property of metal layer is better than Frit materials, can be quickly by office
The heat transfer in portion scatter, encapsulated layer internal stress caused by avoiding local heating's imbalance.And the metal layer of inverted trapezoidal
Micro-structure can increase metal layer and Frit layers of chimeric effect, increase the adhesion strength between encapsulation cover plate and frit,
Effectively improve the stability and reliability of packaging effect and packed device.
The basic principles, main features and advantages of the present invention have been shown and described above.To the technology of industry
Personnel should for, the present invention is not limited to the above embodiments, and what is described in the above embodiment and the description is only in order to say
Bright the principle of the present invention is both fallen within for the changes and improvements of the present invention without departing from the spirit and scope of the present invention
In scope of the claimed invention.
Claims (10)
1. a kind of Frit encapsulation cover plates, including glass cover-plate and Frit layers, it is characterised in that the glass cover-plate and the Frit
Be additionally provided with metal layer between layer, the metal layer and it is described Frit layer to be stacked, positioned at the encapsulation of the glass cover-plate
Region.
2. encapsulation cover plate according to claim 1, which is characterized in that the metal layer has micro-structure, makes the metal
Layer and the described Frit layers chi structure with interlayer.
3. encapsulation cover plate according to claim 2, which is characterized in that the section of the micro-structure is that upper bottom surface width is more than
The geometric figure of bottom surface width.
4. encapsulation cover plate according to claim 3, which is characterized in that under the section upper bottom surface width of the micro-structure is more than
The geometric figure of bottom width is " T " font or inverted trapezoidal.
5. encapsulation cover plate according to claim 1, which is characterized in that the thickness of the metal layer is in 1-4um.
6. encapsulation cover plate according to claim 1, which is characterized in that Frit layers of the thickness is 6-8um.
7. a kind of production method of the Frit encapsulation cover plates of at least one of claim 1-6, which is characterized in that including walking as follows
Suddenly：
S1：The packaging area deposited metal layer on glass cover-plate；
S2：Patterned process is carried out to metal layer and forms concaveconvex structure；
S3：Frit layers are coated in layer on surface of metal.
8. the method according to claim 7 for making Frit encapsulation cover plates, which is characterized in that in step S1 deposited metal layers
There is step S0 before：Packaging area forms the photoresist layer of a pattern layers on glass cover-plate, and the thickness of photoresist layer is small
In metal layer thickness.
9. the method according to claim 8 for making Frit encapsulation cover plates, which is characterized in that further include removing in step S2
Remove to extend to the photoresist layer below partial metal layers, Formation cross-section is the protrusion knot that upper bottom surface width is more than bottom surface width
Structure.
10. the method according to claim 7 for making Frit encapsulation cover plates, which is characterized in that in step S1 deposited metals
There is step S0 before layer：The glass surface of packaging area is roughened on glass cover-plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810248944.9A CN108321306A (en) | 2018-03-26 | 2018-03-26 | A kind of Frit encapsulation cover plates and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810248944.9A CN108321306A (en) | 2018-03-26 | 2018-03-26 | A kind of Frit encapsulation cover plates and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108321306A true CN108321306A (en) | 2018-07-24 |
Family
ID=62899127
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810248944.9A Pending CN108321306A (en) | 2018-03-26 | 2018-03-26 | A kind of Frit encapsulation cover plates and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108321306A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11937445B2 (en) | 2019-05-29 | 2024-03-19 | Kunshan Go-Visionox Opto-Electronics Co., Ltd | Display panel and display device |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103885249A (en) * | 2012-12-19 | 2014-06-25 | 索尼公司 | Moisture-proof structure and display device |
| CN104332484A (en) * | 2013-07-22 | 2015-02-04 | 三星显示有限公司 | ORGANIC LIGHT EMITTING DISPLAY DEVICE and method for manufacture same |
| CN104362256A (en) * | 2014-10-13 | 2015-02-18 | 上海和辉光电有限公司 | Packaging structure and manufacturing method thereof and display panel |
| CN104867960A (en) * | 2015-04-21 | 2015-08-26 | 京东方科技集团股份有限公司 | Display panel and packaging method thereof, and display apparatus |
| CN106025096A (en) * | 2016-07-28 | 2016-10-12 | 昆山国显光电有限公司 | Packaging structure and packaging method |
| CN106876606A (en) * | 2017-03-16 | 2017-06-20 | 京东方科技集团股份有限公司 | Display panel and display device |
| CN208225915U (en) * | 2018-03-26 | 2018-12-11 | 苏州福莱威封装技术有限公司 | A kind of Frit encapsulation cover plate |
-
2018
- 2018-03-26 CN CN201810248944.9A patent/CN108321306A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103885249A (en) * | 2012-12-19 | 2014-06-25 | 索尼公司 | Moisture-proof structure and display device |
| CN104332484A (en) * | 2013-07-22 | 2015-02-04 | 三星显示有限公司 | ORGANIC LIGHT EMITTING DISPLAY DEVICE and method for manufacture same |
| CN104362256A (en) * | 2014-10-13 | 2015-02-18 | 上海和辉光电有限公司 | Packaging structure and manufacturing method thereof and display panel |
| CN104867960A (en) * | 2015-04-21 | 2015-08-26 | 京东方科技集团股份有限公司 | Display panel and packaging method thereof, and display apparatus |
| CN106025096A (en) * | 2016-07-28 | 2016-10-12 | 昆山国显光电有限公司 | Packaging structure and packaging method |
| CN106876606A (en) * | 2017-03-16 | 2017-06-20 | 京东方科技集团股份有限公司 | Display panel and display device |
| CN208225915U (en) * | 2018-03-26 | 2018-12-11 | 苏州福莱威封装技术有限公司 | A kind of Frit encapsulation cover plate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11937445B2 (en) | 2019-05-29 | 2024-03-19 | Kunshan Go-Visionox Opto-Electronics Co., Ltd | Display panel and display device |
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| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180724 |
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| WD01 | Invention patent application deemed withdrawn after publication |