Nothing Special   »   [go: up one dir, main page]

CN108307094B - Circuit board, molded photosensitive assembly, manufacturing method of molded photosensitive assembly, camera module and electronic equipment - Google Patents

Circuit board, molded photosensitive assembly, manufacturing method of molded photosensitive assembly, camera module and electronic equipment Download PDF

Info

Publication number
CN108307094B
CN108307094B CN201710018364.6A CN201710018364A CN108307094B CN 108307094 B CN108307094 B CN 108307094B CN 201710018364 A CN201710018364 A CN 201710018364A CN 108307094 B CN108307094 B CN 108307094B
Authority
CN
China
Prior art keywords
circuit
substrate
photosensitive element
circuit board
photosensitive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201710018364.6A
Other languages
Chinese (zh)
Other versions
CN108307094A (en
Inventor
王明珠
陈振宇
程端良
田中武彦
赵波杰
郭楠
王雅菲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo Sunny Opotech Co Ltd
Original Assignee
Ningbo Sunny Opotech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ningbo Sunny Opotech Co Ltd filed Critical Ningbo Sunny Opotech Co Ltd
Priority to CN201710018364.6A priority Critical patent/CN108307094B/en
Priority to EP18738901.0A priority patent/EP3570651A4/en
Priority to US16/472,032 priority patent/US11032454B2/en
Priority to PCT/CN2018/072198 priority patent/WO2018130172A1/en
Priority to JP2019555542A priority patent/JP6831477B2/en
Priority to KR1020197021472A priority patent/KR102291747B1/en
Publication of CN108307094A publication Critical patent/CN108307094A/en
Application granted granted Critical
Publication of CN108307094B publication Critical patent/CN108307094B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/40—Circuit details for pick-up tubes
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Studio Devices (AREA)

Abstract

The invention provides a circuit board, a molded photosensitive assembly, a manufacturing method of the molded photosensitive assembly, a camera module and electronic equipment, wherein the circuit board comprises a substrate and at least one circuit part formed on the substrate, the photosensitive element and the circuit part are conductively connected, the circuit part forms an annular circuit in the edge area of the substrate, and the annular circuit surrounds the photosensitive element so as to protect the photosensitive element by the annular circuit during the molding process.

Description

Circuit board, molded photosensitive assembly, manufacturing method of circuit board and molded photosensitive assembly, camera module and electronic equipment
Technical Field
The invention relates to the field of optical imaging, in particular to a circuit board, a molded photosensitive assembly, a manufacturing method of the molded photosensitive assembly, a camera module and electronic equipment.
Background
In recent years, electronic products and intelligent devices are increasingly developed towards light weight, thinness and high performance, which puts more severe requirements on the volume and the imaging quality of a camera module which is one of standard configurations of the electronic products and the intelligent devices.
In order to reduce the volume of the camera module and improve the imaging quality of the camera module, the packaging mode of the camera module is changed to be more important when the camera module is provided with a photosensitive element with a larger photosensitive area and a larger volume and a larger number of passive electronic components. The traditional camera module adopts a Chip On Board (COB) packaging process, wherein a Chip and electronic components which are separately manufactured are respectively attached to a circuit Board, a lens base is attached to the circuit Board by using glue, and after an optical filter is attached to the lens base, a lens barrel or a motor assembled with an optical lens is attached to the lens base, so that the optical lens is kept in a photosensitive path of the Chip, and the camera module is large in size and low in yield due to the packaging mode. In order to overcome the problems, a molding process is introduced in the packaging process of the camera module at present, specifically, after the chip and each electronic component are respectively attached to the circuit board, the circuit board is placed into a forming mold, wherein the pressing surface of the forming mold presses the surface of the circuit board, then a fluid-shaped forming material is added to form a base which is integrally combined with the circuit board after the forming material is solidified. However, the current molding process has many drawbacks.
Fig. 1 shows a circuit board of a camera module, wherein the circuit board is formed by plating or printing on a substrate surface, which makes the circuit protrude from the substrate surface, and since the COB packaging process attaches the molded lens holder to the circuit board by glue, the flatness of the circuit board is not a major consideration in the conventional COB packaging process. However, in the molding process, the pressing surface of the forming mold directly presses the surface of the circuit board, and the circuit protrudes from the surface of the substrate, so that a lot of gaps are generated between the pressing surface of the forming mold and the surface of the substrate, and after the fluid-shaped forming material is added into the forming mold, the fluid-shaped forming material easily enters the middle portion of the circuit board from the outside of the circuit board through the gaps to pollute the photosensitive element, thereby reducing the product yield of the camera module.
Disclosure of Invention
An object of the present invention is to provide a circuit board and a molded photosensitive member, a method of manufacturing the same, a camera module and an electronic apparatus, wherein the circuit board includes a substrate and at least one circuit portion, wherein the circuit portion forms a ring-shaped circuit in an edge region of the substrate, and the ring-shaped circuit surrounds a photosensitive element to protect the photosensitive element.
An object of the present invention is to provide a circuit board, a molded photosensitive device, a method for manufacturing the same, a camera module, and an electronic apparatus, wherein the annular circuit prevents a fluid molding material from flowing from an edge region of the substrate to a region where the photosensitive device is located during a molding process, thereby preventing the molding material from entering the region where the photosensitive device is located and contaminating the photosensitive device, and avoiding undesirable phenomena such as contamination and damage.
An object of the present invention is to provide a circuit board, a molded photosensitive component, a method for manufacturing the same, a camera module and an electronic device, wherein the annular circuit prevents the molding material from contacting the photosensitive element, so as to avoid the undesirable phenomenon that the molding material with a higher temperature conducts the temperature to the photosensitive element, which leads to the deformation of the photosensitive element due to heating.
An object of the present invention is to provide a circuit board and a molded photosensitive member, a method of manufacturing the same, a camera module and an electronic apparatus, in which the loop circuit is located away from the photosensitive element, i.e., a safety distance is reserved between the loop circuit and the photosensitive element, in such a manner that the molding material having a relatively high temperature can be further prevented from conducting the temperature to the photosensitive element.
An object of the present invention is to provide a circuit board, a molded photosensitive element, a method of manufacturing the same, a camera module, and an electronic apparatus, in which a press-fit surface of a molding die presses the annular circuit during a molding process to prevent the molding material from flowing from an edge region of the substrate to a region where the photosensitive element is located through between the annular circuit and the press-fit surface of the molding die.
An object of the present invention is to provide a circuit board and a molded photosensitive member, a method of manufacturing the same, a camera module and an electronic apparatus, in which the annular circuit can be formed into a complete ring shape to prevent a gap from being generated between the annular circuit and a press-fit surface of the molding die when the press-fit surface of the molding die presses the annular circuit.
An object of the present invention is to provide a circuit board, a molded photosensitive component, a method for manufacturing the same, a camera module and an electronic device, wherein the annular circuit includes at least one first circuit unit and at least one second circuit unit, the first circuit unit extends annularly around the photosensitive component but is not sealed, the second circuit unit is disposed at the unsealed position of the first circuit unit, so that the second circuit unit increases the resistance of the molding material at the unsealed position of the first circuit unit, and further prevents the molding material from entering the area where the photosensitive component is located from the edge area of the substrate.
An object of the present invention is to provide a circuit board and a molded photosensitive member, a method of manufacturing the same, a camera module and an electronic apparatus, wherein when the molding material enters the unclosed position of the first circuit unit, the second circuit unit can rapidly reduce the ability of the molding material to flow in the unclosed position.
An object of the present invention is to provide a wiring board and a molded photosensitive member, a method of manufacturing the same, an image pickup module and an electronic apparatus, wherein the second circuit unit is provided in a fan shape at the unclosed position of the first circuit unit to change a flow direction of the molding material at the unclosed position, so that the inclined flow direction of the molding material restricts a vertical flow distance of the molding material.
An object of the present invention is to provide a wiring board and a molded photosensitive member, a method of manufacturing the same, and an image pickup module and an electronic apparatus, in which at least one slit is formed between the first circuit unit and the second circuit unit, the slit having an elongated shape, so that the molding material can be prevented from entering the region where the photosensitive element is located from the edge region of the substrate through the slits.
An object of the present invention is to provide a circuit board and a molded photosensitive member, a method of manufacturing the same, a camera module, and an electronic apparatus, wherein at least one of the first circuit unit and the second circuit unit may be formed with at least a blocking protrusion that extends into the slit to reduce the size of the slit, thereby preventing the molding material from entering the region where the photosensitive element is located from the edge region of the substrate via the slits.
An object of the present invention is to provide a circuit board, a molded photosensitive component, a method of manufacturing the same, an image pickup module, and an electronic apparatus, in which a portion of the first circuit unit and the second circuit unit is widened along an edge direction of the molding die to form the blocking protrusion, thereby increasing resistance of the molding material to flow from an edge area of the substrate to an area where the photosensitive element is located, while the molding material is confined in the smaller gap, thereby reducing a distance and an amount of the molding material entering the gap to prevent the molding material from entering the area where the photosensitive element is located.
An object of the present invention is to provide a circuit board and a molded photosensitive module, a method for manufacturing the same, a camera module and an electronic device, wherein the circuit board includes at least one set of circuit board connectors, and the circuit board connectors can be electrically connected to the annular circuit nearby, so that the cost of wiring can be saved, and the reliability of signal transmission can be ensured.
An object of the present invention is to provide a wiring board and a molded photosensitive element, a method of manufacturing the same, a camera module and an electronic apparatus, in which an opening of the slit toward an edge area of the substrate corresponds to the wiring board connector to prevent the molding material from directly entering the slit by the wiring board connector.
An object of the present invention is to provide a wiring board and a molded photosensitive element, a method of manufacturing the same, a camera module, and an electronic apparatus, in which the wiring board connector can be electrically connected to the annular circuit in close proximity, thereby enabling faster signal transmission, and in this way, the response speed of the camera module can be improved.
An object of the present invention is to provide a circuit board, a molded photosensitive assembly, a method for manufacturing the same, a camera module and an electronic device, wherein the annular circuit surrounds the photosensitive element, so that the photosensitive element is in a magnetic field closed environment, thereby preventing the photosensitive element from being interfered by external electromagnetic waves, and reducing the interference of the electromagnetic waves generated by the photosensitive element to the external environment, i.e., the annular circuit can form an electromagnetic field shielding part to ensure the reliability of the camera module during imaging.
According to an aspect of the present invention, a circuit board is provided, wherein at least one photosensitive element is respectively conductively connected to the circuit board, wherein the circuit board includes:
a substrate, wherein the substrate has an edge region; and
at least one circuit part, wherein the circuit part is formed on the substrate, the photosensitive element and the circuit part are conductively connected, wherein the circuit part forms a ring-shaped circuit at the edge area of the substrate, and the ring-shaped circuit surrounds the photosensitive element.
According to an embodiment of the present invention, the substrate has at least one chip mounting region, the edge region and the chip mounting region are integrally formed, wherein the photosensitive element is mounted on the chip mounting region such that the annular circuit surrounds the photosensitive element.
According to one embodiment of the present invention, the substrate has at least one accommodating space, and the edge region surrounds the accommodating space, wherein the photosensitive element is accommodated in the accommodating space, so that the annular circuit surrounds the photosensitive element.
According to one embodiment of the invention, the edge region of the substrate has a substrate inner side and a substrate outer side, and the substrate inner side and the substrate outer side are located inside and outside the annular circuit, respectively.
According to an embodiment of the present invention, the circuit board further includes at least one set of circuit board connectors, wherein the circuit board connectors are provided on the substrate, wherein the circuit portion includes at least one set of connection circuits, the connection circuits being connected to the loop circuit and the circuit board connectors.
According to one embodiment of the invention, the range of the outer diameter of the circuit board connecting piece is 0.005 mm-0.8 mm.
According to one embodiment of the invention, the range of the outer diameter of the circuit board connecting piece is 0.1 mm-0.5 mm.
According to an embodiment of the present invention, a width dimension of the circuit portion ranges from 0.001mm to 0.5mm.
According to an embodiment of the invention, the width dimension of the connection circuit ranges from 0.001mm to 0.5mm.
According to an embodiment of the invention, the width dimension of the annular circuit ranges from 0.001mm to 0.5mm.
According to an embodiment of the present invention, a width dimension of the circuit portion ranges from 0.02mm to 0.1mm.
According to an embodiment of the invention, the width of the connection circuit ranges from 0.02mm to 0.1mm.
According to an embodiment of the invention, the width of the annular circuit ranges from 0.02mm to 0.1mm.
According to an embodiment of the present invention, a pitch between adjacent circuit portions ranges from 0.001mm to 0.5mm.
According to an embodiment of the present invention, a pitch between adjacent connection circuits ranges from 0.001mm to 0.5mm.
According to an embodiment of the invention, the distance between adjacent ring circuits ranges from 0.001mm to 0.5mm.
According to an embodiment of the present invention, a pitch between adjacent circuit portions ranges from 0.02mm to 0.1mm.
According to an embodiment of the present invention, a pitch between adjacent connection circuits ranges from 0.02mm to 0.1mm.
According to one embodiment of the invention, the distance between adjacent annular circuits ranges from 0.02mm to 0.1mm.
According to an embodiment of the invention, the annular circuit protrudes from the surface of the substrate.
According to an embodiment of the present invention, the circuit portion is formed on the surface of the substrate by plating or printing, so that the annular circuit formed by the circuit portion protrudes from the surface of the substrate.
According to an embodiment of the present invention, the ring circuit includes a first circuit unit, wherein the first circuit unit is in a complete ring shape, such that the first circuit unit surrounds the photosensitive element.
According to an embodiment of the present invention, the annular circuit includes at least one first circuit unit and at least one second circuit unit, wherein the first circuit unit extends annularly around the photosensitive element, and the first circuit unit forms at least one opening, and the second circuit unit is formed at the opening to form at least one gap between the first circuit unit and the second circuit unit.
According to an embodiment of the present invention, the slit has an elongated shape, and the slit extends from the inside to the outside of the substrate.
According to an embodiment of the present invention, an end portion of the first circuit unit forms a barrier circuit, and the second circuit unit includes at least one extension circuit, wherein an extension direction of the barrier circuit and an extension direction of the extension circuit are substantially the same to form the gap between the barrier circuit and the extension circuit and between adjacent extension circuits.
According to an embodiment of the present invention, at least a portion of the extension circuit extends curvedly to curvedly extend the gaps formed between the barrier circuit and the extension circuit and between adjacent ones of the extension circuits.
According to an embodiment of the present invention, at least one of the first circuit unit and the second circuit unit forms at least one blocking protrusion extending to the slit to reduce a size of the slit.
According to one embodiment of the present invention, at least a portion of an outer edge of a nip portion of a forming die is pressed against at least a portion of the annular circuit during a molding process.
According to another aspect of the present invention, the present invention further provides a circuit board, wherein at least one photosensitive element is respectively conductively connected to the circuit board, wherein the circuit board comprises:
a substrate, wherein the substrate has an edge region; and
at least one circuit part, wherein the circuit part is formed on the substrate, the photosensitive element and the circuit part are conductively connected, wherein the circuit part forms an annular electromagnetic field shielding part in the edge area of the substrate, and the electromagnetic field shielding part surrounds the photosensitive element so as to prevent external electromagnetic waves from interfering with the photosensitive element by the electromagnetic field shielding part.
In another aspect of the present invention, the present invention further provides a method for manufacturing a wiring board, wherein the method for manufacturing includes the steps of:
(A) Providing a substrate; and
(B) At least one circuit part is formed on at least one edge area of the substrate, wherein the circuit part forms at least one annular blocking part on the edge area, so that after a photosensitive element and the circuit board are conductively connected together, the blocking part surrounds the photosensitive element.
According to an embodiment of the present invention, the blocking portion is an electromagnetic field shielding portion to prevent an external electromagnetic force from interfering with the photosensitive element.
According to an embodiment of the present invention, in the step (B), the circuit part is formed at least in the edge area of the substrate by plating or printing so that the circuit part protrudes from the surface of the substrate.
According to an embodiment of the present invention, in the step (B), after the circuit part forms the blocking part in the edge region of the substrate, the blocking part blocks the edge region to form a substrate inner side part and a substrate outer side part, wherein the substrate inner side part is used for electrically connecting the photosensitive element and the circuit board, and the substrate outer side part is used for mounting an electronic component.
According to another aspect of the present invention, the present invention further provides a molded photosensitive element, comprising:
a molding base, wherein the molding base has at least one light window;
at least one photosensitive element; and
at least one circuit board, wherein the circuit board further comprises:
a substrate, wherein the substrate has an edge region; and
at least one circuit part, wherein the circuit part is formed on the substrate, the light sensing element and the circuit part are conductively connected, wherein the circuit part forms a ring-shaped circuit at the edge region of the substrate, the ring-shaped circuit surrounds the light sensing element, wherein the mold base is integrally combined with a portion of the edge region and a portion of the ring-shaped circuit, and the light sensing region of the light sensing element corresponds to the light window.
According to an embodiment of the invention, the edge region of the substrate has a substrate inner side and a substrate outer side, and the substrate inner side and the substrate outer side are located inside and outside the annular circuit, respectively, wherein the mold base is integrated with the substrate outer side and the outer side of the annular circuit.
According to an embodiment of the present invention, the molded photosensitive assembly further includes at least one electronic component, wherein the circuit board includes at least one circuit board connector disposed at an outer side portion of the substrate, wherein the circuit portion includes at least one connection circuit connecting the circuit board connector and the ring circuit, and the electronic component is mounted on the circuit board connector, wherein the mold base covers at least one of the electronic components.
According to an embodiment of the present invention, the ring circuit includes a first circuit unit, wherein the first circuit unit is in a complete ring shape, such that the first circuit unit surrounds the photosensitive element.
According to an embodiment of the present invention, the annular circuit includes at least one first circuit unit and at least one second circuit unit, wherein the first circuit unit extends annularly around the photosensitive element, and the first circuit unit forms at least one opening, and the second circuit unit is formed at the opening to form at least one gap between the first circuit unit and the second circuit unit.
According to an embodiment of the invention, the slit is elongated and extends between the baseplate inner side and the baseplate outer side.
According to an embodiment of the present invention, an end portion of the first circuit unit forms a barrier circuit, and the second circuit unit includes at least one extension circuit, wherein an extension direction of the barrier circuit and an extension direction of the extension circuit are substantially the same to form the gap between the barrier circuit and the extension circuit and between adjacent extension circuits.
According to an embodiment of the present invention, at least a portion of the extension circuit extends curvedly to curvedly extend the gaps formed between the barrier circuit and the extension circuit and between adjacent ones of the extension circuits.
According to an embodiment of the present invention, at least one of the first circuit unit and the second circuit unit forms at least one blocking protrusion extending to the slit to reduce a size of the slit.
According to one embodiment of the present invention, the opening of the slit at the outer side portion of the substrate corresponds to the wiring board connector.
According to another aspect of the present invention, the present invention further provides a molded photosensitive element, comprising:
a molding base, wherein the molding base has at least one light window;
at least one photosensitive element;
at least one annular blocking part; and
a circuit board, wherein photosensitive element with the circuit board is connected conductively, the separation portion is located the edge region of circuit board, and the separation portion surrounds photosensitive element, wherein the separation portion prevents the shaping material that is used for forming the moulding base from the edge region entering of circuit board photosensitive element place's region, with form after the shaping material solidifies with the circuit board some of edge region and some of separation portion integrated the moulding base, wherein photosensitive element's photosensitive region corresponds to the light window.
According to an embodiment of the present invention, the circuit board further includes at least one substrate and at least one circuit portion formed on the substrate, wherein the photosensitive element is conductively connected to the circuit portion, and the circuit portion forms the blocking portion in the edge region of the circuit board.
According to an embodiment of the present invention, the circuit portion is formed on the substrate by plating or printing, so that the blocking portion formed by the circuit portion protrudes from the surface of the substrate.
According to another aspect of the present invention, the present invention further provides a method for manufacturing a molded photosensitive element, wherein the method comprises the steps of:
(a) Forming an annular barrier portion on an edge region of a substrate by a circuit portion, wherein the edge region forms a substrate outer portion outside the barrier portion;
(b) Conductively connecting a photosensitive element and the circuit portion, wherein the blocking portion surrounds the photosensitive element;
(c) Pressing a pressing surface of a forming mold on the blocking part to isolate the photosensitive element from the substrate outer side part of the edge area, wherein the photosensitive element corresponds to a pressure-proof space of the forming mold, and the substrate outer side part corresponds to a base forming space of the forming mold; and
(d) The blocking part prevents the fluid forming material added into the base forming space from flowing to the pressure-proof space from the base forming space, so that the forming material is formed on a molding base which is formed by integrally combining the outer side part of the substrate and a part of the blocking part and is provided with an optical window after being solidified in the base forming space, wherein a light sensing area of the light sensing element corresponds to the optical window.
According to one embodiment of the present invention, in the step (a), a safety distance is reserved between the blocking portion and the photosensitive element to prevent the molding material with high temperature from conducting temperature to the photosensitive element to cause a bad phenomenon that the photosensitive element is deformed in the step (d).
According to an embodiment of the present invention, in the above method, a substrate inner side portion is formed inside the edge area to reserve a safety distance between the barrier portion and the photosensitive element.
According to an embodiment of the present invention, in the above method, a plurality of electronic components are mounted on the outer side of the substrate at intervals, respectively, so that in the step (d), the mold base covers the electronic components.
According to an embodiment of the present invention, in the step (a), the blocking portion is formed by forming a loop circuit by the circuit portion in the edge area.
According to an embodiment of the present invention, the annular circuit is a complete ring, so that in the step (d), the blocking portion formed by the annular circuit prevents the molding material from flowing from the base molding space to the pressure-proof space.
According to an embodiment of the present invention, the annular circuit forms at least one elongated slit to communicate a substrate inside portion and the substrate outside portion of the substrate, wherein when the molding material flows into the slit from the base molding space, a flow rate of the molding material rapidly decreases to prevent the molding material from entering the substrate inside portion.
According to an embodiment of the present invention, in the above method, the slit is extended curvedly so that a flow rate of the molding material is rapidly decreased to prevent the molding material from entering the substrate inside portion when the molding material flows into the slit from the base molding space.
According to an embodiment of the present invention, in the above method, a circuit board connecting portion is provided at an opening of the slit toward the substrate outer side portion to prevent the molding material from directly entering the slit from the base molding space.
According to an embodiment of the present invention, in the step (c), a cover film is disposed between the press-fit surface and the blocking portion to increase sealability between the press-fit surface and the blocking portion, so that in the step (d), the molding material is prevented from flowing from the base molding space to the pressure-proof space.
According to an embodiment of the present invention, the step (d) is prior to the step (b), thereby first forming the mold base integrally combined with the base outer side portion and a part of the blocking portion, and then conductively connecting the photosensitive element and the circuit portion so that the photosensitive element corresponds to the light window.
According to another aspect of the present invention, the present invention further provides a camera module, which includes:
at least one optical lens;
at least one photosensitive element;
at least one annular blocking part; and
at least one circuit board, wherein the photosensitive element and the circuit board are conductively connected, the blocking portion is formed on the circuit board and surrounds the photosensitive element, and the optical lens is arranged on a photosensitive path of the photosensitive element.
According to an embodiment of the present invention, the image capturing module further includes a molding base, wherein the molding base has at least one light window, and the blocking portion prevents a molding material used to form the molding base from entering a region where the photosensitive element is located from an edge region of the circuit board, so as to form the molding base in which a portion of the edge region of the circuit board and a portion of the blocking portion are integrally combined after the molding material is solidified, wherein the photosensitive element corresponds to the light window, and a light path is provided for the photosensitive element and the optical lens through the light window.
According to an embodiment of the present invention, the circuit board includes a substrate and at least one circuit portion formed on the substrate, wherein the circuit portion forms a loop circuit on the edge area of the substrate of the circuit board, and wherein the loop circuit forms the blocking portion.
According to an embodiment of the present invention, the circuit board includes a substrate and at least one circuit portion formed on the substrate, wherein the circuit portion forms an annular electromagnetic field shielding portion in the edge region of the substrate of the circuit board to prevent external electromagnetic force from interfering with the photosensitive element, and wherein the electromagnetic field shielding portion forms the blocking portion.
According to an embodiment of the present invention, the edge region of the substrate has a substrate inner side portion and a substrate outer side portion, the substrate inner side portion and the substrate outer side portion being located at both sides of the annular circuit, respectively, wherein the mold base is integrally combined with the substrate outer side portion and the outer side portion of the annular circuit.
According to an embodiment of the present invention, the camera module further includes at least one electronic component, wherein the electronic component is disposed at an outer side portion of the substrate, and the molding base covers the electronic component.
According to an embodiment of the present invention, the camera module further includes at least one driver, wherein the optical lens is assembled to the driver, and the driver is assembled to the top surface of the molding base, so that the optical lens is held in the photosensitive path of the photosensitive element by the driver.
According to an embodiment of the present invention, the camera module further includes at least one lens barrel, wherein the optical lens is disposed on the lens barrel, and the lens barrel is assembled on the top surface of the molding base, so that the optical lens is held on the photosensitive path of the photosensitive element by the lens barrel.
According to an embodiment of the present invention, the camera module further includes at least one lens barrel, wherein the optical lens is disposed on the lens barrel, and the lens barrel integrally extends to a top surface of the mold base, so that the optical lens is held in a photosensitive path of the photosensitive element by the lens barrel.
According to an embodiment of the present invention, the image pickup module further includes at least one filter element, wherein the filter element is held between the optical lens and the photosensitive element.
According to an embodiment of the present invention, the image pickup module further includes at least one filter element, wherein the filter element is held between the optical lens and the photosensitive element.
According to an embodiment of the present invention, the filter element is assembled to a top surface of the mold base such that the filter element is held between the optical lens and the photosensitive element.
According to an embodiment of the present invention, the top surface of the mold base has at least an inner side surface and an outer side surface, the filter element is assembled to the inner side surface, and the driver is assembled to the outer side surface.
According to an embodiment of the invention, the inner side surface and the outer side surface have a height difference to form at least one recess of the mold base, wherein the recess communicates with the light window, the filter element being assembled to the recess.
According to an embodiment of the present invention, the circuit board includes a substrate and at least one circuit portion formed on the substrate, wherein the circuit portion forms an annular electromagnetic field shielding portion at an edge region of the substrate to prevent an external electromagnetic force from interfering with the photosensitive element, and wherein the electromagnetic field shielding portion forms the blocking portion.
According to an embodiment of the present invention, the image capturing module further includes a lens holder, wherein the lens holder has at least one light passing hole, and the lens holder is assembled to the edge region such that the photosensitive region of the photosensitive element corresponds to the light passing hole, thereby providing a light path for the photosensitive element and the optical lens through the light passing hole.
According to an embodiment of the present invention, the image capturing module further comprises at least one filter element, wherein the filter element is assembled to the lens holder such that the filter element is held between the optical lens and the photosensitive element.
According to an embodiment of the present invention, the camera module further includes at least one driver, wherein the optical lens is assembled to the driver, and the driver is assembled to the lens holder, so that the optical lens is held on a photosensitive path of the photosensitive element by the driver.
According to an embodiment of the present invention, the camera module further includes at least one lens barrel, wherein the optical lens is assembled to the lens barrel, and the lens barrel is assembled to the lens base, so that the optical lens is held in the photosensitive path of the photosensitive element by the lens base.
According to another aspect of the present invention, the present invention further provides an electronic device, comprising:
an electronic device body; and
at least one camera module, wherein the camera module is set up in the electronic equipment body for obtain the image, wherein the camera module includes:
at least one optical lens;
at least one photosensitive element;
at least one annular blocking part; and
a circuit board, wherein the photosensitive element and the circuit board are conductively connected, the blocking portion is formed on the circuit board, the blocking portion surrounds the photosensitive element, and the optical lens is disposed in a photosensitive path of the photosensitive element.
Drawings
Fig. 1 is a schematic top view of a prior art wiring board.
Fig. 2 is a schematic top view of a circuit board according to a preferred embodiment of the invention.
Fig. 3 is a partially enlarged schematic view of fig. 2 at position a.
Fig. 4 is a partially enlarged schematic view of fig. 2 at position B.
Fig. 5 is a schematic cross-sectional view of one of the manufacturing steps of a camera module according to a preferred embodiment of the invention.
Fig. 6 is a schematic cross-sectional view of a second manufacturing step of the camera module according to the above preferred embodiment of the invention.
Fig. 7 is a schematic cross-sectional view of a third manufacturing step of the camera module according to the above preferred embodiment of the invention.
Fig. 8 is a schematic cross-sectional view of four manufacturing steps of the camera module according to the above preferred embodiment of the invention.
Fig. 9 is a schematic cross-sectional view of five manufacturing steps of the camera module according to the above preferred embodiment of the invention.
Fig. 10 is a schematic cross-sectional view of six steps of manufacturing the camera module according to the above preferred embodiment of the invention.
FIG. 11A is a cross-sectional view of one embodiment of one step in the manufacture of a camera module according to another preferred embodiment of the present invention.
FIG. 11B is a cross-sectional view of another embodiment of one of the manufacturing steps of a camera module according to another preferred embodiment of the present invention.
FIG. 11C is a cross-sectional view of another embodiment of one of the manufacturing steps of a camera module according to another preferred embodiment of the present invention.
FIG. 12 is a sectional view of a second step in the manufacture of a camera module according to another preferred embodiment of the present invention.
Fig. 13 is a cross-sectional view of a third step in the manufacture of a camera module according to another preferred embodiment of the present invention.
FIG. 14 is a sectional view of four steps in the manufacture of a camera module according to another preferred embodiment of the invention.
FIG. 15 is a cross-sectional view of five steps in the manufacture of a camera module according to another preferred embodiment of the invention.
FIG. 16 is a sectional view of six steps in the manufacture of a camera module according to another preferred embodiment of the invention.
Fig. 17 is a schematic cross-sectional view of a first variant of the camera module according to the above preferred embodiment of the invention.
Fig. 18 is a schematic cross-sectional view of a second variant of the camera module according to the above preferred embodiment of the invention.
Fig. 19 is a schematic cross-sectional view of a third variant of the camera module according to the above preferred embodiment of the invention.
Fig. 20 is a schematic cross-sectional view of a fourth variant of the camera module according to the above preferred embodiment of the invention.
Fig. 21 is a schematic cross-sectional view of a fifth variant of the camera module according to the above preferred embodiment of the invention.
Fig. 22 is a schematic cross-sectional view of a sixth modified embodiment of the camera module according to the above preferred embodiment of the invention.
Fig. 23 is a schematic cross-sectional view of a seventh modified implementation of the image capturing module according to the above preferred embodiment of the invention.
Fig. 24 is a schematic cross-sectional view of a camera module according to another preferred embodiment of the invention.
Fig. 25 is a schematic cross-sectional view of a modified embodiment of the camera module according to the above preferred embodiment of the invention.
FIG. 26 is a schematic diagram of an electronic device.
Detailed Description
The following description is provided to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.
It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced devices or components must be constructed and operated in a particular orientation and thus are not to be considered limiting.
It is understood that the terms "a" and "an" should be interpreted as meaning that a number of one element or element is one in one embodiment, while a number of other elements is one in another embodiment, and the terms "a" and "an" should not be interpreted as limiting the number.
Referring to fig. 2 to 10 of the drawings of the present specification, a camera module 1 according to a preferred embodiment of the present invention is illustrated, wherein the camera module 1 includes at least one optical lens 10, at least one photosensitive element 20 and a circuit board 30.
Referring to fig. 2 to 4, the circuit board 30 includes a substrate 31 and at least one circuit portion 32, wherein the substrate 31 has an edge region 311, the circuit portion 32 forms a ring-shaped circuit 321 on the edge region 311 of the substrate 31, the photosensitive element 20 and the circuit portion 32 are conducted, and the ring-shaped circuit 321 surrounds the photosensitive element 20, so that the ring-shaped circuit 321 can protect the photosensitive element 20 from contamination in a subsequent molding process. The optical lens 10 is disposed on a light sensing path of the light sensing element 20. The light reflected by the object enters the inside of the camera module from the optical lens 10 to be subsequently received and photoelectrically converted by the photosensitive element 20, so as to obtain an image associated with the object.
It should be noted that although the camera module implemented as a dual-lens camera module is illustrated in fig. 2 to 10 and described in the following description to illustrate the features and advantages of the present invention, it will be understood by those skilled in the art that the camera module 1 may be configured with fewer or more optical lenses 10 to form a single-lens camera module or an array camera module, and the present invention is not limited in this respect.
In this example, the substrate 31 further includes at least one flat die-attach region 312, wherein the edge region 311 and each of the die-attach regions 312 are integrally formed, and the edge region 311 is located outside each of the die-attach regions 312, wherein each of the photosensitive elements 20 is attached to each of the die-attach regions 312 of the substrate 31, respectively, and each of the photosensitive elements 20 and each of the circuit sections 32 are conducted, respectively. It is understood that when the substrate 31 of the wiring board 30 has only one die attach region 312, the die attach region 312 may be located in the middle of the substrate 31.
Further, each of the circuit portions 32 of each of the photosensitive elements 20 and the wiring board 30 is respectively conducted through a set of leads 40, wherein each of the leads 40 extends, and both ends of each of the leads 32 are respectively bent to be connected to each of the circuit portions 32 of each of the photosensitive elements 20 and the wiring board 30.
It will be understood by those skilled in the art that the process of using the lead 40 to conduct the photosensitive element 20 and the circuit portion 32 of the circuit board 30 can be a wire bonding process, i.e., forming the lead 40 between the photosensitive element 20 and the circuit portion 32 of the circuit board 30 by the wire bonding process to conduct the photosensitive element 20 and the circuit board 30 through the lead 40. It should be noted that the bonding direction of the lead 40 can be unlimited, for example, in one example, the bonding direction of the lead 40 can be from the photosensitive element 20 to the circuit board 30, and in another example, the bonding direction of the lead 40 can also be from the circuit board 30 to the photosensitive element 20. The lead 40 may be a gold wire, or may be any material capable of transmitting an electric signal between the photosensitive element 20 and the circuit board 22, such as a silver wire or a copper wire.
In addition, a set of connectors may be provided on the non-photosensitive region of the photosensitive element 20 and the substrate 31 of the circuit board 30, respectively, wherein the connectors provided on the substrate 31 are electrically connected to the circuit portion 32, and both ends of the lead wire 40 are connected to the connectors of the photosensitive element 20 and the connectors of the circuit board 30, respectively, so that the photosensitive element 20 and the circuit board 30 can be electrically connected. It is worth mentioning that the type of the connecting parts provided on the non-photosensitive region of the photosensitive element 20 and the substrate 31 of the wiring board 30 may not be limited, for example, the connecting parts provided on the non-photosensitive region of the photosensitive element 20 and the substrate 31 of the wiring board 30 may be a connecting pad or the like.
The circuit portion 32 forms the ring circuit 321 in the edge region 311 of the substrate 31, so that the edge region 311 of the substrate 31 is divided into a substrate inner portion 3111 and a substrate outer portion 3112 by the ring circuit 321, wherein the substrate inner portion 3111 and the substrate outer portion 3112 are respectively located at both sides of the ring circuit 321, wherein the connecting member provided on the substrate 31 is located at the substrate inner portion 3111 of the substrate 31, that is, the ring circuit 321 is located outside the lead wire 40, so that the ring circuit 321 can protect not only the photosensitive element 20 but also the lead wire 40 when a subsequent molding process is performed.
As will be understood by those skilled in the art, the circuit portion 32 is formed on the surface of the substrate 31 by plating or printing, so that after the circuit portion 32 is formed on the surface of the substrate 31, the circuit portion 32 protrudes from the surface of the substrate 31, and further the annular circuit 321 protrudes from the surface of the substrate 31, thereby forming an annular blocking portion 322. That is, the circuit portion 32 may form the blocking portion 322 in a ring shape at the edge region 311 of the substrate 31, wherein the blocking portion 322 surrounds the photosensitive element 20, so that the blocking portion 322 can protect the photosensitive element 20 when a molding process is performed. Preferably, the dam 322 is located outside the lead 40, so that the dam 322 can protect the lead 40 when a molding process is performed. That is, the blocking portion 322 may divide the edge region 311 of the substrate 31 into the substrate inner portion 3111 and the substrate outer portion 3112.
It can be further understood by those skilled in the art that when the annular circuit 321 of the circuit portion 32 is grounded or appropriately powered on, an annular electromagnetic field shielding portion 323 can be formed, wherein the electromagnetic field shielding portion 323 surrounds the photosensitive element 20, so that the photosensitive element 20 is in an electromagnetic field closed environment, thereby preventing the photosensitive element 20 from being interfered by external electromagnetic waves, and reducing the interference of the electromagnetic waves generated by the photosensitive element 20 to the external environment, thereby ensuring the reliability of the camera module 1 in imaging.
The circuit board 30 further includes at least one set of circuit board connectors 33, each of the circuit board connectors 33 is disposed at the edge region 311 of the substrate 31 in a spaced manner, for example, but not limited to, each of the circuit board connectors 33 may be disposed at the substrate outer side portion 3112 of the substrate 31. The wiring board connector 33 is used for connecting circuits of the multilayer substrate forming the wiring board 30. Preferably, the cross section of the circuit board connector 33 may be implemented as, but not limited to, a circle. The circuit portion 32 further includes at least one set of connection circuits 324, and the connection circuits 324 are conductively connected to the circuit board connectors 33 and the ring circuit 321.
It can be understood that, compared with the conventional circuit board, the annular circuit 321 of the circuit board 33 of the present invention is annular and surrounds the photosensitive element 20, so that each circuit board connector 33 using the same definition can be conducted through the connecting circuit 324 and the annular circuit 321 nearby, and in this way, the electrical signal can be transmitted more quickly, and the response speed of the camera module 1 can be effectively improved.
In one example of the present invention, the outer diameter dimension of the wiring board connector 33 is larger than the width dimension of the annular circuit 321. However, in some specific examples, it is possible that the outer diameter of the circuit board connector 33 is smaller than the width of the annular circuit 321. Let a be a parameter of the outer diameter of the circuit board connector 33, b be a parameter of the width of the annular circuit 321, and c be a parameter of the distance between adjacent circuits of the annular circuit 321, where the range of the parameter a is 0.005mm to 0.8mm, preferably 0.1mm to 0.5mm, the range of the parameter b is 0.001mm to 0.5mm, preferably 0.02mm to 0.1mm, and the range of the parameter c is 0.001mm to 0.5mm, preferably 0.02mm to 0.1mm. Accordingly, the width dimension of the connection circuit 324 is also a parameter b. Preferably, the spacing between adjacent ones of the connecting circuits 324 is also the parameter c. It will be understood by those skilled in the art that the width dimension of the circuit portion 32 is a parameter b, and the pitch between adjacent circuits of the circuit portion 32 is also a parameter c.
In addition, the camera module 1 includes a mold base 50, wherein the mold base 50 has at least one light window 51, and the mold base 50 is integrally combined with a portion of the edge region 311 of the circuit board 30 and a portion of the annular circuit 321 to form a mold photosensitive assembly 200, and the photosensitive region of the photosensitive element 20 corresponds to the light window 51, so as to provide a light path for the optical lens 10 and the photosensitive element 20 through the light window 51. Preferably, the mold base 50 is integrally combined with the substrate outer side portion 3112 of the wiring board 30 and an outer side portion of the annular circuit 321.
That is, the molding photosensitive assembly 200 includes at least one of the photosensitive element 20, one of the circuit boards 30, and one of the molding bases 50, wherein the photosensitive element 20 is attached to the circuit board 30, the molding base 50 is integrally combined with a portion of the circuit board 30 to cover a portion of the circuit board 30 by the molding base 50, and a photosensitive area of the photosensitive element 20 corresponds to the optical window 51 of the molding base 50. It is understood that the photosensitive element 20 may be attached to the circuit board 30 first, and then the molding base 50 and a portion of the circuit board 30 are integrated, or the molding base 50 and a portion of the circuit board 30 are integrated first, and then the photosensitive element 20 is attached to the circuit board 30, which is not limited in this respect.
The camera module 1 further includes a set of electronic components 60, wherein the electronic components 60 can be mounted on the edge region 311 of the circuit board 30 by Surface Mount Technology (SMT), and after the electronic components 60 are mounted on the edge region 311 of the circuit board 30, the electronic components 60 and the circuit board connectors 33 are conducted. Preferably, the electronic component 60 can be directly attached to the circuit board connector 33, so as to connect the electronic component 60 and the circuit board connector 33.
It should be noted that the electronic component 60 and the photosensitive element 20 may be located on the same side or opposite sides of the circuit board 30, and in this embodiment, the electronic component 60 and the photosensitive element 20 are located on the same side of the circuit board 30, so that after the molding base 50 is formed, the molding base 50 covers at least one of the electronic components 60. Preferably, the mold base 50 covers each electronic component 60, so as to isolate each adjacent electronic component 60 and isolate the electronic component 60 and the light-sensing element 20 by the mold base 50, so that even when the adjacent electronic components 60 are close to each other, the mold base 50 can prevent the adjacent electronic components 60 from contacting or interfering with each other, and the mold base 50 covers the electronic components 60, so as to prevent contaminants generated on the surface of the electronic components 60 from contaminating the light-sensing area of the light-sensing element 20. In addition, the way that the molding base 50 covers the electronic component 50 can also enable a small area of the circuit board 30 to be attached with more electronic components 60, so as to improve the imaging quality of the camera module 1. It is worth mentioning that the types of the electronic components 60 may include, but are not limited to, resistors, capacitors, drivers, and the like.
The camera module 1 further includes at least one filter element 70, wherein the filter element 70 is disposed between the optical lens 10 and the photosensitive element 20, so that light entering the camera module 1 from the optical lens 10 is filtered by the filter element 70 and then received by the photosensitive element 20 to form an image. The filter element 70 may be assembled to the top surface of the mold base 50 such that the filter element 70 is held between the photosensitive element 20 and the optical lens 10.
It should be noted that the filter element 70 may be directly assembled on the top surface of the module base 50, or the filter element 70 may be assembled on a support member first, and then the support member is assembled on the top surface of the mold base 50, so that the area of the filter element 70 can be reduced, and the manufacturing cost of the camera module 1 can be reduced.
It will be understood by those skilled in the art that, in different examples of the camera module 1, the filter element 70 can be implemented in different types, for example, the filter element 70 can be implemented as an infrared cut filter, a full-transmission spectrum filter, and other filters or a combination of filters, for example, the filter element 70 can be implemented as a combination of an infrared cut filter and a full-transmission spectrum filter, that is, the infrared cut filter and the full-transmission spectrum filter can be switched to be selectively located on the light sensing path of the light sensing element 20, for example, when the camera module 1 is used in an environment with sufficient light such as daytime, the infrared cut filter can be switched to the light sensing path of the light sensing element 20 to filter the infrared rays entering the camera module 1 in the light reflected by the object, and when the camera module 1 is used in an environment with dark light such as night, the full-transmission spectrum filter can be switched to the light sensing path of the light sensing element 20 to allow the infrared rays entering the camera module 1 in the light reflected by the object to partially pass through.
The camera module 1 can be a fixed-focus camera module or a zoom camera module. It is understood that when the camera module 1 is implemented as a zoom camera module 1, the camera module 1 further includes at least one driver 80, wherein each of the optical lenses 10 is assembled on the driver 80, and then the driver 80 is assembled on the top surface of the module base 50 to keep the optical lens 10 on the photosensitive path of the photosensitive element 20 by the driver 80, wherein the driver 80 can drive the optical lens 10 to move along the photosensitive path of the photosensitive element 20 to adjust the focal length of the camera module 1. That is, the optical lens 10 is drivably provided to the driver 80.
It should be noted that the type of the driver 80 is not limited in the camera module 1 of the present invention, for example, in a specific example, the driver 80 may be implemented as any driver, such as a voice coil motor, capable of driving the optical lens 10 to displace along the photosensitive path of the photosensitive element 20, wherein the driver 80 is capable of receiving power and control signals to be in an operating state.
Further, the camera module 1 includes a bracket 400, wherein the bracket 400 has at least one mounting space 401, and the driver 80 is mounted in the mounting space 401 of the bracket 400, so as to ensure the coaxiality of each optical lens 10 by the bracket 400, thereby improving the imaging quality of the camera module 1. Preferably, a filler is filled between the inner wall of the holder 400 and the outer wall of the driver 80 to prevent a gap from being generated between the inner wall of the holder 400 and the outer wall of the driver 80, so that the relationship of each of the optical lenses 10 is not changed when the camera module 1 is assembled or is used, to ensure the reliability of the camera module 1. More preferably, the filler may be any material that is fluid and capable of being solidified, such as glue.
Fig. 5 to 10 show a manufacturing process of the camera module 1.
Specifically, referring to fig. 5, the photosensitive element 20 is attached to the chip attachment region 312 of the substrate 31 of the circuit board 30, the photosensitive element 20 and the circuit portion 32 of the circuit board 30 are electrically connected through the lead 40, and the electronic component 60 is attached to the circuit board connector 33 of the circuit board 30, so that the electronic component 60 and the photosensitive element 20 are electrically connected through the circuit portion 32.
Referring to fig. 6, the circuit board 30 with the photosensitive element 20 and the electronic component 60 mounted thereon is placed in a molding die 100 to perform a molding process to form the molding base 60 integrally combined with a portion of the edge region 311 of the circuit board 30 and a portion of the annular circuit 321, thereby manufacturing the molded photosensitive assembly 200.
Specifically, the molding die 100 includes an upper die 101 and a lower die 102, wherein at least one of the upper die 101 and the lower die 102 can be moved to allow the upper die 101 and the lower die 102 to be clamped or drawn, and at least a base molding space 103 and a pressure-proof space 104 are formed between the upper die 101 and the lower die 102. The upper mold 101 has a base forming groove 1011, a pressure-proof groove 1012 and an annular pressure-proof part 1013, wherein the pressure-proof part 1013 integrally extends from one side of the upper mold 101 to separate the base forming groove 1011 and the pressure-proof groove 1012 by the pressure-proof part 1013, when the upper mold 101 and the lower mold 102 are subjected to mold closing operation and mold closing operation, the lower mold 102 closes the openings of the base forming groove 1011 and the pressure-proof groove 1012, so that the base forming groove 1011 forms the base forming space 103, and the pressure-proof groove 1012 forms the pressure-proof space 104.
It is worth mentioning that in one embodiment, the lower mold 102 may be fixed, the upper mold 101 is capable of moving relative to the lower mold 102 along guide posts to clamp when the upper mold 101 is moved toward the lower mold 102 and to draw when the upper mold 101 is moved away from the lower mold 102, and the base forming space 103 and the crush relief 104 are formed between the upper mold 101 and the lower mold 102, respectively, when the upper mold 101 and the lower mold 102 are clamped.
In another embodiment, the upper mold 101 may be fixed, and the lower mold 102 may be movable relative to the upper mold 101 along guide posts to clamp the mold when the lower mold 102 is moved in a direction toward the upper mold 101 and to draw the mold when the lower mold 102 is moved away from the lower mold 101.
In addition, the molding die 100 further includes a cover film 105, wherein the cover film 105 is overlappingly disposed on the inner surface of the upper die 101 to enhance sealability between the molding die 100 and the circuit board 30 when the upper die 101 and the lower die 102 of the molding die 100 are clamped, and to facilitate demolding after the molding process is finished.
After the circuit board 30 with the photosensitive element 20 and the electronic component 60 mounted thereon is placed in the upper mold 101 and/or the lower mold 102, the upper mold 101 and the lower mold 102 are operated to close the mold so that the circuit board 30 with the photosensitive element 20 and the electronic component 60 mounted thereon is positioned between the upper mold 101 and the lower mold 102, wherein the press-fit surface of the press-fit part 1013 is pressed against the annular circuit 321, the substrate inside part 3111 of the photosensitive element 20 and the circuit board 30 is positioned in the pressure-proof space 104 formed between the upper mold 101 and the lower mold 102, the substrate outside part 3112 of the circuit board 30 is positioned in the base molding space 103 formed between the upper mold 101 and the lower mold 102, and the electronic component 60 mounted on the substrate outside part 3112 of the circuit board 30 is positioned in the base molding space 103.
It should be noted that, because the photosensitive element 20 and the substrate inner side portion 3111 of the circuit board 30 are located in the pressure-proof space 104, the inner surface of the upper mold 101 can be prevented from directly contacting the lead 40, so as to avoid the lead 40 from being deformed due to stress during the molding process, thereby ensuring good electrical property of the lead 40 and further ensuring the imaging quality of the camera module 1.
The cover film 105 is located between the pressing surface of the pressing part 1013 and the annular circuit 321 of the circuit board 30 to increase the sealing performance between the pressing part 1013 and the annular circuit 321 of the circuit board 30, so that the molding material can be prevented from flowing from the base molding space 103 to the pressure-proof space 104 to contaminate the photosensitive element 20 through the space between the pressing part 1013 and the annular circuit 321 of the circuit board 30 during the subsequent molding process. Preferably, the cover film 105 is overlappingly disposed on the inner surface of the upper mold 101 for forming the base molding groove 1011 to facilitate the mold drawing after the molding process is finished to form the mold base 50. In addition, the cover film 105 can also absorb the impact force of the nip 1013 on the ring circuit 321 of the circuit board 30 when the upper mold 101 and the lower mold 102 are clamped, thereby preventing the ring circuit 321 from being damaged when the molding mold 100 is clamped.
Referring to fig. 7 and 8, the fluid-shaped molding material is added into the base molding space 103, wherein the annular circuit 321 can prevent the molding material from flowing from the base molding space 103 to the pressure-proof space 104 through the gap between the press part 1013 and the annular circuit 321, so that the molding material is solidified and molded in the base molding space 103 to form the molding base 50, wherein the press part 1013 and the pressure-proof space 104 form the light window 51 of the molding base 50. It is understood that, when the mold base 50 is molded, the mold base 50 covers the substrate outer side portion 3112 of the circuit board 30, the outer side portion of the ring circuit 321 and the electronic component 50, and the light sensing area of the light sensing element 20 corresponds to the light window 51.
It is worth mentioning that the fluid-like molding material according to the present invention may be a liquid material or a solid particulate material or a mixture of liquid and solid particulate materials, and it is understood that the molding material, whether implemented as a liquid material or as a solid particulate material or as a mixture of liquid and solid particulate materials, can be consolidated to form the molding base 50 after being introduced into the base molding space 103 of the molding die 100. For example, in this specific example of the present invention, the molding material in a fluid state is implemented as a thermosetting material such as a liquid state, wherein the molding material is solidified to form the molding base 50 after being introduced into the base molding space 103 of the molding die 100. It should be noted that, after the fluid-shaped molding material is added into the base molding space 103 of the molding die 100, the manner of solidifying the fluid-shaped molding material does not limit the content and scope of the present invention.
Additionally, the top surface of the mold base 50 may have at least an inside surface 52 and an outside surface 53. In one example, the inner side surface 52 and the outer side surface 53 of the mold base 50 are in the same plane, so that the filter element 70 is assembled to the inner side surface 52 of the mold base 50 and the driver 80 assembled with the optical lens 10 is assembled to the outer side surface 53 of the mold base 50 subsequently.
In another example, the inner side surfaces 52 of the mold base 50 are lower than the outer side surface 53 such that there is a height difference between the inner side surface 52 and the outer side surface 53 to form a groove 54 of the mold base 50, wherein the groove 54 communicates with the light window 51. It is worth mentioning that the groove 54 of the mold base 50 is formed in synchronization with the light window 51 of the mold base 50.
Referring to fig. 9 and 10, the optical filter element 70 is assembled to the inner side surface 52 of the mold base 50, and the driver 80 with the optical lens 10 assembled thereto is assembled to the outer side surface 53 of the module base 50, so that the optical lens 10 is held in the photosensitive path of the photosensitive element 20, and the optical filter element 70 is held between the optical lens 10 and the photosensitive element 20, and after the driver 80 is mounted to the mounting space 401 of the holder 400, glue is filled between the inner wall of the holder 400 and the outer wall of the driver 80, thereby manufacturing the camera module 1.
Fig. 11A to 16 show another manufacturing process of the camera module 1.
Specifically, referring to fig. 11A to 11C, after the electronic component 60 is attached to the circuit board connector 33 of the circuit board 30, the circuit board 30 with the electronic component 60 is placed in the molding die 100. It is understood that when the upper mold 101 and the lower mold 102 of the molding die 100 are subjected to a mold clamping operation, the outer edge of the nip 1013 of the upper mold 101 presses at least a part of the annular circuit 321 of the wiring board 30. For example, in this example shown in fig. 11A, the outer edge of the nip 1013 of the upper mold 101 may be pressed on all positions of the top surface of the annular circuit 321, and the nip 1013 does not protrude from the outer side surface of the annular circuit 321; in this example shown in fig. 11B, the outer edge of the bonded part 1013 of the upper mold 101 can be bonded to the whole position of the top surface of the annular circuit 321, and the bonded part 1013 protrudes from the outer side of the annular circuit 321; in this example shown in fig. 11C, the outer edge of the nip 1013 of the upper mold 101 presses a part of the top surface of the annular circuit 321.
It will be understood by those skilled in the art that after the upper mold 101 and the lower mold 102 are clamped, the lower mold 102 closes the base molding groove 1011 of the upper mold 101, so that the base molding groove 1011 forms the base molding space 103, wherein the edge position of the circuit board 30 may correspond to the base molding space 103, so as to form the mold base 50 at the edge position of the circuit board 30 during the subsequent molding process. In another preferred example, a central position of the circuit board 30 may correspond to the base forming space 103, so that a portion of the base forming space 103 may be formed at the central position of the circuit board 30 during a subsequent molding process. It is worth mentioning that at least one electronic component 60 may be located in the base forming space 103 after the base forming space 103. Preferably, all of the electronic components 60 may be located in the base forming space 103, so that when the molding base 50 is formed by a subsequent molding process, the molding base 50 covers all of the electronic components 60 and isolates adjacent electronic components 60.
It is understood that, after the upper mold 101 and the lower mold 102 are subjected to the mold clamping operation, the cover film 105 overlappingly disposed on the inner surface of the upper mold 101 is positioned between the inner surface of the upper mold 101 and the annular circuit 321 to enhance the sealing between the molding mold 100 and the wiring board 30, and the demolding is facilitated after the molding process is finished.
The cover film 105 is located between the pressing surface of the pressing part 1013 and the annular circuit 321 of the circuit board 30 to enhance the sealing performance between the pressing part 1013 and the annular circuit 321 of the circuit board 30, so that the molding material can be prevented from flowing from the edge region 311 of the circuit board 30 to the chip mounting region 312 through the space between the pressing part 1013 and the annular circuit 321 of the circuit board 30 during the subsequent molding process, so as to ensure the smoothness of the chip mounting region 312, thereby facilitating the subsequent mounting of the photosensitive element 20.
The cover film 105 is overlappingly disposed on the inner surface of the upper mold 101 for forming the base molding groove 1011 to facilitate the mold drawing after the molding process receives and forms the molded base 50. In addition, the cover film 105 can also absorb the impact force of the press-fit part 1013 on the annular circuit 321 of the circuit board 30 when the upper mold 101 and the lower mold 102 are subjected to the mold operation, thereby preventing the annular circuit 321 from being damaged when the molding mold 100 is clamped.
Referring to fig. 12 and 13, the fluid-shaped molding material is added into the base molding space 103, wherein the annular circuit 321 is capable of preventing the molding material from flowing from the edge region 311 of the base 31 to the die attach region 312 via between the pressing part 1013 and the annular circuit 321 to ensure the flatness of the die attach region 312, and the molding material is solidified and molded in the base molding space 103 to form the mold base 50, wherein the light window 51 of the mold base 50 is formed at a position corresponding to the pressing part 1013. It is understood that, after the mold base 50 is molded, the mold base 50 covers the substrate outer side portion 3112 of the circuit board 30, the outer side portion of the annular circuit 321, and the electronic component 60.
In the step shown in fig. 14, the photosensitive element 20 is mounted on the chip mounting region 312 of the wiring board 30, and the photosensitive element 20 and the wiring board 30 are electrically connected by the leads 40 to form a molded photosensitive element.
Additionally, in fig. 15, the top surface of the mold base 50 may have at least an inner side surface 52 and an outer side surface 53. In one example, the inner side surface 52 and the outer side surface 53 of the mold base 50 are in the same plane, so that the filter element 70 is assembled to the inner side surface 52 of the mold base 50 and the driver 80 assembled with the optical lens 10 is assembled to the outer side surface 53 of the mold base 50 subsequently.
In another example, the inner side surfaces 52 of the mold base 50 are lower than the outer side surface 53 such that there is a height difference between the inner side surface 52 and the outer side surface 53 to form a groove 54 of the mold base 50, wherein the groove 54 communicates with the light window 51. It is worth mentioning that the groove 54 of the mold base 50 is formed in synchronization with the light window 51 of the mold base 50.
Referring to fig. 16, the optical filter element 70 is assembled to the inner side surface 52 of the mold base 50, and the driver 80 with the optical lens 10 assembled thereto is assembled to the outer side surface 53 of the module base 50, so that the optical lens 10 is held in the photosensitive path of the photosensitive element 20, and the optical filter element 70 is held between the optical lens 10 and the photosensitive element 20, and after the driver 80 is mounted to the mounting space 401 of the holder 400, glue is filled between the inner wall of the holder 400 and the outer wall of the driver 80, thereby manufacturing the camera module 1.
In another aspect of the present invention, the present invention further provides a method for manufacturing a wiring board 30, wherein the manufacturing method comprises the steps of:
(A) Providing a substrate 31; and
(B) At least one circuit portion 32 is formed on at least one edge region 311 of the substrate 31, wherein the circuit portion 32 forms at least one annular blocking portion 322 on the edge region 311, so that after a photosensitive element 20 and the circuit board 30 are conductively connected together, the blocking portion 322 surrounds the photosensitive element 20.
According to another aspect of the present invention, the present invention further provides a method for manufacturing a molded photosensitive element 200, wherein the method comprises the steps of:
(a) Forming an annular barrier portion 322 on an edge region 311 of a substrate 31 by a circuit portion 32, wherein the edge region 311 forms a substrate outer portion 3112 outside the barrier portion 322;
(b) A photosensitive element 20 and the circuit portion 32 are conductively connected, wherein the blocking portion 322 surrounds the photosensitive element 20;
(c) Pressing the pressing surface of a forming mold 100 against the blocking portion 322 to separate the photosensitive element 20 from the substrate outer side portion 3112 of the edge region 311, wherein the photosensitive element 20 corresponds to a pressure-proof space 104 of the forming mold 100, and the substrate outer side portion 3112 corresponds to a base forming space 103 of the forming mold 100; and
(d) The blocking portion 322 prevents the fluid molding material added to the base molding space 103 from flowing from the base molding space 103 to the pressure-proof space 104, so that the molding material is solidified in the base molding space 103 and forms a molding base 50 having a light window 51 integrally combined with the substrate outer side portion 3112 and a portion of the blocking portion 322, wherein a light-sensing area of the light-sensing element 20 corresponds to the light window 51.
It should be noted that, the step (d) may be performed before the step (b), that is, the module base 50 and the circuit board 30 are integrally combined, and then the photosensitive element 20 and the circuit portion 32 are conducted, and the blocking portion 322 is made to surround the photosensitive element 20.
In addition, referring to the left side portion of the top view of the circuit board 30 shown in fig. 2, the annular circuit 321 of the circuit board 30 may form a complete ring shape, so as to prevent a gap from being generated between the annular circuit 321 and the pressing surface of the pressing part 1013 when the pressing surface of the pressing part 1013 of the molding die 100 presses the annular circuit 321, so that the molding material added to the base molding space 103 can be prevented from entering the pressure-proof space 104 from the base molding space 103 via between the annular circuit 321 and the pressing surface of the pressing part 1013 during the molding process, so as to protect the photosensitive element 20 from being contaminated and protect the lead 40 from being damaged, thereby preventing the occurrence of undesirable phenomena such as a contamination point and ensuring good electrical properties of the lead 40, and further improving the product yield of the image pickup module 1.
Referring to a right portion of the top view of the circuit board 30 shown in fig. 2, the loop circuit 321 of the circuit board 30 further includes at least one first circuit unit 3211 and at least one second circuit unit 3212. The first circuit unit 3211 extends annularly around the photosensitive element 20 in the edge region 311 of the substrate 31, but is not closed, that is, the first circuit unit 3211 forms at least one opening 32110, wherein the second circuit unit 3212 is disposed in the opening 32110 of the first circuit unit 3211. That is, the second circuit unit 3212 is disposed at an unsealed position of the first circuit unit 3211, so that when a molding process is performed, resistance of the molding material is increased by the second circuit unit 3212 when the opening 32110 of the first circuit unit 3211 enters the protective space 104 from the base molding space 103, thereby preventing the molding material from entering the pressure-proof space 104, and in this way, the photosensitive element 20 can be protected from being contaminated and damaged.
Specifically, when the fluid molding material is added into the base molding space 103, the molding material tends to enter the pressure-proof space 104 from the base molding space 103 through the opening 32110 of the first circuit unit 3211, and the second circuit unit 3212 can rapidly decrease the flow rate of the molding material at the position of the opening 32110 to prevent the molding material from entering the pressure-proof space 104 from the base molding space 103 through the opening 32110 of the first circuit unit 3211.
Preferably, referring to fig. 2 and 3, the second circuit unit 3212 is fan-shaped and disposed at the opening 32110 of the first circuit unit 3211, so that the flow direction of the molding material at the position of the opening 32110 is changed, and thus the inclined flow direction of the molding material limits the vertical flow distance of the molding material. In addition, at least one slit 3213 is formed between the first circuit unit 3211 and the second circuit unit 3212, wherein the slit 3213 is elongated, so that the molding material is further prevented from flowing from the base molding space 103 to the pressure-proof space 104 through the slits 3213.
More specifically, the second circuit unit 3212 includes at least one extending circuit 32121, wherein an extending direction of each extending circuit 32121 is substantially perpendicular to an extending direction of the first circuit unit 3211, and a gap 3213 is formed at each of two ends of each extending circuit 32121 and the first circuit unit 3211. Preferably, the end of the first circuit unit 3211 turns approximately 90 degrees to form a blocking circuit 32111, wherein the extending direction of the blocking circuit 32111 is approximately the same as the extending direction of the extending circuit 32121, so as to form an elongated gap 3213 between the circuit 32111 and the extending circuit 32121, thereby preventing the molding material from flowing from the base molding space 103 to the pressure-proof space 104 through the gaps 3213.
In fig. 2 and 3, the second circuit unit 3213 is implemented to include three extension circuits 32121, wherein outer ends of the extension circuits 32121 at both sides extend obliquely toward the extension circuit 32121 at the center in principle, so that the gap 3213 formed between the extension circuit 32121 and the blocking circuit 32111 is bent, thereby increasing the resistance of the fluid-shaped molding in the gap 3213 to prevent the molding material from flowing from the base molding space 103 to the pressure-proof space 104 through the gaps 3213.
In addition, the circuit board connecting piece 33 is disposed in the edge region 311 of the substrate 31, and the slits 3213 correspond to the circuit board connecting piece 33, so that after the electronic component 60 is attached to the position of the circuit board connecting piece 33, the electronic component 60 can prevent the slits 3213 from directly communicating with the substrate inner side portion 3111 and the substrate outer side portion 3112 of the substrate 31, so that the electronic component 60 can prevent the molding material added to the base molding space 103 from directly entering the slits 3213, so as to prevent the molding material from entering the pressure-proof space 104, thereby improving the product yield of the camera module 1.
Referring to fig. 2 and 4, at least one of the first circuit unit 3211 and the second circuit unit 3212 may form a blocking protrusion 3214 to reduce the size of the slits 3213, thereby preventing the molding material from entering the pressure-proof space 104 from the base molding space 103 through the slits 3213. That is, a portion of at least one of the first and second circuit units 3211 and 3212 widens in the edge direction of the pressed part 1013 to form the blocking protrusion 3214, thereby increasing the resistance of the molding material to flow from the base molding space 103 to the pressure preventing space 104, and at the same time, the molding material is also confined in the smaller gap 3213, thereby reducing the distance and amount of the molding material entering the gap 3213 to prevent the molding material from entering the pressure preventing space 104.
It should be noted that after the camera module 1 is manufactured, the photosensitive element 20 is located in the middle of the electromagnetic shielding portion 323 formed by the annular circuit 321, so that the electromagnetic shielding portion 323 prevents the external electromagnetic force of the camera module 1 from interfering with the photosensitive element 20, and the electromagnetic force generated by the photosensitive element 20 from interfering with the external environment, thereby improving the imaging quality of the camera module 1.
Fig. 17 shows a first modified embodiment of the camera module 1, which is different from the above embodiment, in that the camera module 1 includes at least one driver 80 and at least one lens barrel 90, wherein the driver 80 and the lens barrel 90 are respectively assembled at different positions on the top surface of the module base 50, and each optical lens 10 is respectively assembled to the driver 80 and the lens barrel 90, so that the optical lens 10 is held in the photosensitive path of each photosensitive element 20 by the driver 80 and the lens barrel 90. It is to be understood that although the lens barrel 90 shown in fig. 17 is a non-threaded lens barrel, in other examples, the lens barrel 90 may be implemented as a threaded lens barrel 90 so that the lens barrel 90 can be screwed with the optical lens 10 to assemble the optical lens 10 to the lens barrel 90.
Fig. 18 shows a first modified embodiment of the camera module 1, in which the lens barrel 90 integrally extends to the top surface of the mold base 50, the driver 80 is assembled to the top surface of the mold base 50, and each optical lens 10 is assembled to the lens barrel 90 and the driver 80 respectively, so that each optical lens 10 is held in the photosensitive path of each photosensitive element 20 by the driver 80 and the lens barrel 90 respectively.
Fig. 19 to 21 show a third, a fourth and a fifth modified embodiments of the camera module 1, respectively, different from the above embodiment, the camera module 1 is not provided with the driver 80, specifically, the camera module 1 may only include the lens barrel 90, wherein the optical lens 10 is assembled to the lens barrel 90, the lens barrel 90 is assembled to the top surface of the mold base 50 or the lens barrel 90 integrally extends to the top surface of the mold base 50, so that the optical lens 10 is held at the photosensitive path of the photosensitive element 20 by the lens barrel 90. For example, in the specific example shown in fig. 19, two lens barrels 90 are assembled on the top surface of the mold base 50, and in the specific example shown in fig. 20, two lens barrels 90 extend integrally on the top surface of the mold base 50, and in the specific example shown in fig. 21, one lens barrel 90 is assembled on the top surface of the mold base 50, and the other lens barrel 90 extends integrally on the top surface of the mold base 50, which is beneficial to correct the coaxiality of each optical lens 10 during the process of packaging the camera module 1, so as to ensure the imaging quality of the camera module 1 and improve the yield of the camera module 1.
Fig. 22 and 23 respectively show a sixth and a seventh modified embodiments of the camera module 1, wherein the substrate 31 of the circuit board 30 has a receiving space 313 for receiving the photosensitive element 20, so as to reduce the height difference between the top surface of the photosensitive element 20 and the top surface of the substrate 31, and even make the top surface of the photosensitive element 20 and the top surface of the substrate 31 in the same plane, in this way, the height dimension of the camera module 1 can be further reduced, so that the camera module 1 is particularly suitable for being applied to electronic devices which seek to be light and thin. In the specific example shown in fig. 22, the accommodating space 313 is implemented as an accommodating groove, and in the specific example shown in fig. 23, the accommodating space 313 is implemented as a through hole.
Referring to fig. 24, the camera module 1A according to another preferred embodiment of the invention is illustrated, wherein the camera module 1A includes at least one optical lens 10A, at least one photosensitive element 20A and a circuit board 30A.
The circuit board 30A includes a substrate 31A and at least one circuit portion 32A, wherein the substrate 31A has an edge region 311A and at least one flat die attach region 312A, the edge region 311A and the die attach region 312A are integrally formed, and the edge region 311A surrounds the die attach region 312A.
The circuit section 32A is formed on the substrate 31A, and the circuit section 32A forms an annular electromagnetic field shielding section 323A in the edge region 311A of the substrate 31A around the chip mounting region 312A. The photosensitive element 20A is mounted on the chip mounting region 312A of the circuit board 30A, and the photosensitive element 20A and the circuit portion 32A of the circuit board 30A can be conducted through a set of leads 40A, wherein the electromagnetic field shielding portion 323A surrounds the photosensitive element 20A to prevent the external electromagnetic force from interfering with the photosensitive element 20A, thereby facilitating improvement of the imaging quality of the camera module 1A. The optical lens 10A is disposed in a light sensing path of the light sensing element 20A. The light reflected by the object enters the inside of the camera module 1A from the optical lens 10A to be subsequently received by the photosensitive element 20A and photoelectrically converted to form an image.
The camera module 1A further includes a lens holder 300A, wherein the lens holder 300A has at least one light-passing hole 301A, wherein the lens holder 300A is assembled to the edge region 311A of the circuit board 30A, and the light-sensing element 20A corresponds to the light-passing hole 301A of the lens holder 300A, so as to provide a light path for the optical lens 10A and the light-sensing element 20A through the light-passing hole 301A.
The camera module 1A can be implemented as a zoom camera module, referring to fig. 24, wherein the camera module 1A further includes at least one driver 80A, each driver 80A is assembled to the lens holder 300A, each optical lens 10A is drivably disposed on each driver 80A, so that the optical lens 10A is held on the photosensitive path of the photosensitive element 20A by the driver 80A, and the driver 80A can drive the optical lens 10A to move along the photosensitive path of the photosensitive element 20A to adjust the focal length of the camera module 1A.
Preferably, the camera module 1A further includes at least one filter element 70A, wherein the filter element 70A is disposed between the optical lens 10A and the photosensitive element 20A, so that light reflected by an object enters the camera module 1A from the optical lens 10A, and then can be filtered by the filter element 70A, so as to be subsequently received by the photosensitive element 20A and undergo photoelectric conversion to form an image.
In the modified embodiment of the camera module 1A shown in fig. 25, the camera module 1A may also be a fixed focus camera module, that is, the camera module 1A further includes at least one lens barrel 90A, wherein the lens barrel 90A may be integrally formed with the lens base 300A, or the lens barrel 90 may be attached to the lens base 300A, wherein the optical lens 10A is assembled to the lens barrel 90A, so that the optical lens 10A is held in the photosensitive path of the photosensitive element 20A by the lens barrel 90A.
Fig. 26 shows an electronic device, wherein the electronic device includes at least one camera module 1 and an electronic device body 2, wherein the camera module 1 is disposed on the electronic device body 2 for obtaining an image, wherein the type of the electronic device body 2 may not be limited, for example, the electronic device body 2 may be a smart phone, a tablet computer, a personal digital assistant, an MP3/4/5, an electronic book, or the like.
It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention.
The objects of the invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the examples, and any variations or modifications of the embodiments of the present invention may be made without departing from the principles.

Claims (75)

1. A circuit board, wherein at least one photosensitive element is conductively connected with the circuit board respectively, characterized in that the circuit board comprises:
a substrate, wherein the substrate has an edge region;
at least one circuit portion, wherein the circuit portion is formed on the substrate, and the photosensitive element and the circuit portion are conductively connected, wherein the circuit portion forms a ring-shaped circuit in the edge region of the substrate, and the ring-shaped circuit surrounds the photosensitive element; and
at least one set of circuit board connectors, wherein the circuit board connectors are disposed on the substrate, wherein the circuit portion includes at least one set of connection circuits, which are connected to the loop circuit and the circuit board connectors.
2. The wiring board of claim 1, wherein the substrate has at least one chip mounting region, the edge region and the chip mounting region are integrally formed, and wherein the photosensitive element is mounted on the chip mounting region such that the annular circuit surrounds the photosensitive element.
3. The circuit board of claim 1, wherein the substrate has at least one receiving space, and the edge region surrounds the receiving space, wherein the photosensitive element is received in the receiving space, so that the annular circuit surrounds the photosensitive element.
4. The wiring board defined in claim 1, wherein the edge region of the substrate has a substrate inner side and a substrate outer side, and the substrate inner side and the substrate outer side are respectively located inside and outside the annular circuit.
5. A circuit board according to claim 1, wherein the outer diameter of the circuit board connector ranges from 0.005mm to 0.8mm.
6. A circuit board according to claim 5, wherein the outside diameter of the circuit board connector ranges from 0.1mm to 0.5mm.
7. The wiring board according to any one of claims 1 to 6, wherein a width dimension of the circuit section ranges from 0.001mm to 0.5mm.
8. A wiring board according to claim 7, wherein the width dimension of the circuit portion ranges from 0.02mm to 0.1mm.
9. A wiring board according to any one of claims 1 to 6, wherein the pitch between adjacent circuit portions ranges from 0.001mm to 0.5mm.
10. A wiring board according to claim 8, wherein the pitch between adjacent circuit portions ranges from 0.001mm to 0.5mm.
11. A wiring board according to claim 10, wherein the pitch between adjacent ones of the circuit portions ranges from 0.02mm to 0.1mm.
12. The wiring board defined in claim 1, wherein the annular circuit protrudes from the surface of the substrate.
13. The wiring board according to claim 5, wherein the circuit portion is formed on the surface of the substrate by plating or printing so that the loop circuit formed by the circuit portion protrudes from the surface of the substrate.
14. The wiring board according to any one of claims 1 to 6, 12 and 13, wherein the annular circuit includes a first circuit unit, wherein the first circuit unit is in a complete annular shape such that the first circuit unit surrounds the photosensitive element.
15. The wiring board according to any one of claims 1 to 6, 12 and 13, wherein the annular circuit includes at least a first circuit unit and at least a second circuit unit, wherein the first circuit unit extends annularly around the photosensitive element, and the first circuit unit forms at least an opening, and the second circuit unit forms at the opening to form at least a gap between the first circuit unit and the second circuit unit.
16. The wiring board defined in claim 15, wherein the slot is elongate and extends from the interior to the exterior of the substrate.
17. The wiring board defined in claim 15, wherein the end portion of the first circuit unit forms a blocking circuit and the second circuit unit includes at least one extension circuit, wherein the direction of extension of the blocking circuit and the direction of extension of the extension circuit are substantially the same to form the gap between the blocking circuit and the extension circuit and between adjacent ones of the extension circuits.
18. The wiring board defined in claim 17, wherein at least a portion of the extension circuits extend curvedly to cause the gaps formed between the barrier circuits and the extension circuits and between adjacent ones of the extension circuits to extend curvedly.
19. The wiring board defined in claim 15, wherein at least one of the first and second circuit units forms at least one blocking protrusion that extends into the slot to reduce the size of the slot.
20. The circuit board according to any one of claims 1 to 6, 12 and 13, wherein at least a part of an outer edge of a press-fit portion of a molding die is press-fitted to at least a part of the annular circuit at the time of molding process.
21. A circuit board, wherein at least one photosensitive element is conductively connected with the circuit board respectively, characterized in that the circuit board comprises:
a substrate, wherein the substrate has an edge region;
at least one circuit part, wherein the circuit part is formed on the substrate, the photosensitive element and the circuit part are conductively connected, the circuit part forms an annular electromagnetic field shielding part in the edge region of the substrate, the electromagnetic field shielding part surrounds the photosensitive element, so that the electromagnetic field shielding part can prevent external electromagnetic waves from interfering with the photosensitive element; and
at least one group of circuit board connecting pieces, wherein the circuit board connecting pieces are arranged on the substrate, wherein the circuit part comprises at least one group of connecting circuits, and the connecting circuits are connected with a ring circuit and the circuit board connecting pieces.
22. A method of manufacturing a circuit board, said method comprising the steps of:
(A) Providing a substrate; and
(B) At least one circuit part is formed at least on one edge area of the substrate, wherein the circuit part forms at least one annular blocking part at the edge area so as to surround the periphery of a photosensitive element after the photosensitive element and the circuit board are conductively connected together, the circuit board further comprises at least one group of circuit board connecting parts, the circuit board connecting parts are arranged on the substrate, and the circuit part comprises at least one group of connecting circuits which are connected with an annular circuit and the circuit board connecting parts.
23. The manufacturing method according to claim 22, wherein the blocking portion is an electromagnetic field shielding portion to prevent an external electromagnetic force from interfering with the photosensitive element.
24. The manufacturing method according to claim 22, wherein in the step (B), the circuit part is formed at least in the edge area of the substrate by plating or printing so that the circuit part protrudes from a surface of the substrate.
25. The manufacturing method according to claim 22, wherein in the step (B), after the circuit part forms the dam part in the edge region of the substrate, the dam part partitions the edge region to form a substrate inner side part and a substrate outer side part, wherein the substrate inner side part is used for electrically connecting the photosensitive element and the circuit board, and the substrate outer side part is used for mounting at least one electronic component.
26. A molded photosensitive assembly, comprising:
a molding base, wherein the molding base has at least one light window;
at least one photosensitive element; and
at least one wiring board, wherein the wiring board further comprises:
a substrate, wherein the substrate has an edge region; and
at least one circuit part, wherein the circuit part is formed on the substrate, the photosensitive element and the circuit part are conductively connected, wherein the circuit part forms a ring-shaped circuit at the edge region of the substrate, the ring-shaped circuit surrounds the photosensitive element, wherein the mold base is integrally combined with a portion of the edge region and a portion of the ring-shaped circuit, and the photosensitive region of the photosensitive element corresponds to the optical window, wherein the edge region of the substrate has a substrate inner side and a substrate outer side, and the substrate inner side and the substrate outer side are respectively located at the inner side and the outer side of the ring-shaped circuit, and wherein the mold base is integrally combined with the substrate outer side and the outer side of the ring-shaped circuit.
27. The molded photosensitive assembly of claim 26 further comprising at least one electronic component, wherein said circuit board includes at least one circuit board connector disposed on said substrate outer side portion, wherein said circuit portion includes at least one connecting circuit connecting said circuit board connector and said annular circuit, said electronic component being attached to said circuit board connector, wherein said mold base encases at least one of said electronic components.
28. The molding photosensitive assembly of claim 27, wherein the annular circuit includes a first circuit unit, wherein the first circuit unit is in a complete annular shape such that the first circuit unit surrounds the photosensitive element.
29. The molding photosensitive assembly of claim 27, wherein the annular circuit includes at least a first circuit unit and at least a second circuit unit, wherein the first circuit unit extends annularly around the photosensitive element, and the first circuit unit forms at least one opening, and the second circuit unit forms at least one gap between the first circuit unit and the second circuit unit.
30. The molding photosensitive assembly of claim 29, wherein the slit is elongated and extends between the inboard side of the substrate and the outboard side of the substrate.
31. The molded photosensitive assembly of claim 30, wherein an end of the first circuit unit forms a blocking circuit and the second circuit unit includes at least one extending circuit, wherein an extending direction of the blocking circuit and an extending direction of the extending circuit are substantially the same to form the gap between the blocking circuit and the extending circuit and between adjacent ones of the extending circuits.
32. The molding photosensitive assembly of claim 31, wherein at least a portion of the extension circuit extends curvedly to cause the gaps formed between the blocking circuit and the extension circuit and between adjacent ones of the extension circuits to extend curvedly.
33. The molding photosensitive assembly according to claim 29, wherein at least one of the first circuit unit and the second circuit unit forms at least one blocking protrusion extending to the slit to reduce a size of the slit.
34. The molded photosensitive assembly of any one of claims 29 to 33, wherein an opening of the slit at the substrate outer side portion corresponds to the wiring board connector.
35. The molded photosensitive component of any of claims 27 to 33, wherein an outer diameter dimension of the wiring board connector ranges from 0.005mm to 0.8mm.
36. The molded photosensitive assembly of claim 35, wherein the circuit board connector has an outer diameter ranging from 0.1mm to 0.5mm.
37. The molded photosensitive assembly of claim 35, wherein the width dimension of the circuit portion ranges from 0.001mm to 0.5mm.
38. The molded photosensitive assembly of claim 37, wherein the width dimension of the circuit portion ranges from 0.02mm to 0.1mm.
39. The molded photosensitive assembly of claim 35 wherein a pitch of adjacent ones of the circuit portions ranges from 0.001mm to 0.5mm.
40. The molded photosensitive assembly of claim 38, wherein a pitch between adjacent ones of the circuit portions ranges from 0.001mm to 0.5mm.
41. The molded photosensitive assembly of claim 39, wherein a pitch between adjacent ones of the circuit portions ranges from 0.02mm to 0.1mm.
42. The molded photosensitive assembly of claim 40 wherein a pitch of adjacent ones of said circuit portions ranges from 0.02mm to 0.1mm.
43. A molded photosensitive assembly, comprising:
a molding base, wherein the molding base has at least one light window;
at least one photosensitive element;
at least one annular blocking part; and
a circuit board, wherein photosensitive element with the circuit board is connected conductively, the separation portion is located the edge region of circuit board, and the separation portion surrounds photosensitive element, wherein the separation portion prevents the shaping material that is used for forming the moulding base from the edge region entering of circuit board photosensitive element place's region, with form after the shaping material solidifies with the circuit board some of edge region and some of separation portion integrated the moulding base, wherein photosensitive element's photosensitive region corresponds to the light window.
44. The molding photosensitive assembly of claim 43, wherein the wiring board further comprises at least one substrate and at least one circuit portion formed on the substrate, wherein the photosensitive element is conductively connected to the circuit portion, and the circuit portion forms the blocking portion at the edge region of the wiring board.
45. The molded photosensitive assembly of claim 44, wherein the circuit portion is formed on the substrate by plating or printing, so that the blocking portion formed by the circuit portion protrudes from the surface of the substrate.
46. A method of manufacturing a molded photosensitive assembly, said method comprising the steps of:
(a) Forming an annular barrier portion on an edge region of a substrate by a circuit portion, wherein the edge region forms a substrate outer portion outside the barrier portion;
(b) Conductively connecting a photosensitive element and the circuit portion, wherein the blocking portion surrounds the photosensitive element;
(c) Pressing a pressing surface of a forming mold on the blocking part to isolate the photosensitive element from the substrate outer side part of the edge area, wherein the photosensitive element corresponds to an anti-pressing space of the forming mold, and the substrate outer side part corresponds to a base forming space of the forming mold; and
(d) The blocking part prevents the fluid forming material added into the base forming space from flowing to the pressure-proof space from the base forming space, so that the forming material is solidified in the base forming space to form a molding base which is integrally combined with the outer side part of the substrate and one part of the blocking part and is provided with an optical window, wherein the light sensing area of the light sensing element corresponds to the optical window.
47. The manufacturing method according to claim 46, wherein in the step (a), a safety distance is reserved between the blocking portion and the photosensitive element to prevent an undesirable phenomenon that the molding material of high temperature conducts temperature to the photosensitive element to cause deformation of the photosensitive element in the step (d).
48. A method of manufacturing as claimed in claim 47, wherein in the method a substrate inner side portion is formed inside the edge region to reserve a safety distance between the barrier portion and the photosensitive element.
49. A method of manufacturing according to claim 46, wherein in the method, a plurality of electronic components are mounted on the outer side portions of the substrates, respectively, at intervals from each other, so that in the step (d), the mold base covers the electronic components.
50. The manufacturing method according to claim 46, wherein in the step (a), the blocking portion is formed by the circuit portion forming a loop circuit in the edge region.
51. The method of manufacturing according to claim 50, wherein the annular circuit is a complete ring, such that in step (d), the blocking portion formed by the annular circuit prevents the molding material from flowing from the base molding space to the crush space.
52. The manufacturing method according to claim 51, wherein the annular circuit forms at least one elongated slit to communicate a substrate inside portion and a substrate outside portion of the substrate, wherein a flow rate of the molding material is rapidly decreased to prevent the molding material from entering the substrate inside portion when the molding material flows into the slit from the base molding space.
53. The manufacturing method according to claim 52, wherein in the above method, the slit is extended curvedly so that when the molding material flows into the slit from the base molding space, a flow rate of the molding material is rapidly decreased to prevent the molding material from entering the substrate inside portion.
54. The manufacturing method according to claim 52, wherein in the above method, a wiring board connection portion is provided at an opening of the slit toward the substrate outer side portion to prevent the molding material from directly entering the slit from the base molding space.
55. The production method according to any one of claims 46 to 54, wherein in the step (c), a cover film is provided between the press-fit surface and the barrier portion to increase sealability between the press-fit surface and the barrier portion, thereby preventing the molding material from flowing from the base molding space to the pressure-proof space in the step (d).
56. The manufacturing method according to any one of claims 46 to 54, wherein the step (d) is preceded by the step (b) of first forming the mold base integrally combined with the base outside part and a part of the dam part, and then conductively connecting the photosensitive element and the circuit part so that the photosensitive element corresponds to the light window.
57. A camera module, comprising:
at least one optical lens;
at least one photosensitive element;
at least one annular blocking part; and
the optical lens comprises a circuit board, a photosensitive element, an optical lens, a molding base and at least one light window, wherein the photosensitive element is connected with the circuit board in a conduction mode, the blocking part is formed on the circuit board and surrounds the photosensitive element, the optical lens is arranged on a photosensitive path of the photosensitive element, the molding base is provided with the at least one light window, the blocking part prevents a molding material for forming the molding base from entering an area where the photosensitive element is located from an edge area of the circuit board, the molding base is integrally combined with a part of the edge area of the circuit board and a part of the blocking part after the molding material is solidified, and the photosensitive element corresponds to the light window so as to provide a light path for the photosensitive element and the optical lens through the light window.
58. The camera module of claim 57, wherein the circuit board includes a substrate and at least one circuit portion formed on the substrate, wherein the circuit portion forms a loop circuit in the edge region of the substrate of the circuit board, wherein the loop circuit forms the dam.
59. The camera module of claim 57, wherein the circuit board comprises a substrate and at least one circuit portion formed on the substrate, wherein the circuit portion forms an annular electromagnetic field shielding portion at the edge region of the substrate of the circuit board to prevent external electromagnetic force from interfering with the photosensitive element, wherein the electromagnetic field shielding portion forms the blocking portion.
60. The camera module of claim 58, wherein the edge region of the substrate has a substrate inner side and a substrate outer side, the substrate inner side and the substrate outer side being located on opposite sides of the annular circuit, respectively, wherein the mold base is integrally bonded to the substrate outer side and the outer side of the annular circuit.
61. The camera module of claim 60, further comprising at least one electronic component, wherein the electronic component is disposed on an outer side of the substrate, and the mold base encapsulates the electronic component.
62. The camera module of any of claims 57-61, further comprising at least one driver, wherein the optical lens is assembled to the driver, and the driver is assembled to a top surface of the mold base such that the optical lens is held in a photosensitive path of the photosensitive element by the driver.
63. The camera module according to any one of claims 57-61, further comprising at least one lens barrel, wherein the optical lens is disposed on the lens barrel, the lens barrel is assembled to a top surface of the mold base, such that the optical lens is held in a photosensitive path of the photosensitive element by the lens barrel.
64. The camera module according to any one of claims 57-61, further comprising at least one lens barrel, wherein the optical lens is disposed on the lens barrel, the lens barrel integrally extends to a top surface of the mold base, so that the optical lens is held on a photosensitive path of the photosensitive element by the lens barrel.
65. The camera module of any of claims 57-61, further comprising at least one filter element, wherein the filter element is held between the optical lens and the photosensitive element.
66. The camera module of claim 62, further comprising at least one filter element, wherein the filter element is held between the optical lens and the photosensitive element.
67. The camera module of claim 66, wherein the filter element is assembled to a top surface of the mold base such that the filter element is held between the optical lens and the photosensitive element.
68. The camera module of claim 67, wherein the top surface of the mold base has at least an inner surface and an outer surface, the filter element being assembled to the inner surface, the actuator being assembled to the outer surface.
69. The camera module according to claim 68, wherein the inner side surface and the outer side surface have a height difference to form at least one recess of the mold base, wherein the recess communicates with the optical window, and the filter element is assembled to the recess.
70. The camera module according to claim 57, wherein the circuit board comprises a substrate and at least one circuit portion formed on the substrate, wherein the circuit portion forms an annular electromagnetic field shielding portion in an edge region of the substrate to prevent external electromagnetic force from interfering with the photosensitive element, and wherein the electromagnetic field shielding portion forms the blocking portion.
71. The camera module according to claim 70, further comprising a lens holder, wherein the lens holder has at least one light-passing hole, and the lens holder is assembled to the edge region such that the photosensitive region of the photosensitive element corresponds to the light-passing hole, thereby providing a light path for the photosensitive element and the optical lens through the light-passing hole.
72. The camera module of claim 71, further comprising at least one filter element, wherein the filter element is assembled to the mount such that the filter element is held between the optical lens and the photosensitive element.
73. The camera module of claim 72, further comprising at least one driver, wherein the optical lens is assembled to the driver, and the driver is assembled to the lens holder, such that the optical lens is held in a photosensitive path of the photosensitive element by the driver.
74. The camera module according to claim 72, further comprising at least one lens barrel, wherein the optical lens is assembled to the lens barrel, and the lens barrel is assembled to the lens base, so that the optical lens is held in a photosensitive path of the photosensitive element by the lens base.
75. An electronic device, comprising:
an electronic device body; and
the at least one camera module of any one of claims 57-74, wherein the camera module is disposed on the electronic device body for capturing images.
CN201710018364.6A 2017-01-11 2017-01-11 Circuit board, molded photosensitive assembly, manufacturing method of molded photosensitive assembly, camera module and electronic equipment Active CN108307094B (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
CN201710018364.6A CN108307094B (en) 2017-01-11 2017-01-11 Circuit board, molded photosensitive assembly, manufacturing method of molded photosensitive assembly, camera module and electronic equipment
EP18738901.0A EP3570651A4 (en) 2017-01-11 2018-01-11 Circuit board, molded photosensitive assembly and manufacturing method therefor, photographing module, and electronic device
US16/472,032 US11032454B2 (en) 2017-01-11 2018-01-11 Circuit board, molded photosensitive assembly and manufacturing method therefor, photographing module, and electronic device
PCT/CN2018/072198 WO2018130172A1 (en) 2017-01-11 2018-01-11 Circuit board, molded photosensitive assembly and manufacturing method therefor, photographing module, and electronic device
JP2019555542A JP6831477B2 (en) 2017-01-11 2018-01-11 Circuit boards and molded photosensitive modules and their manufacturing methods, as well as camera modules and electronic devices
KR1020197021472A KR102291747B1 (en) 2017-01-11 2018-01-11 Circuit board, modeling photosensitive assembly and manufacturing method thereof, imaging module and electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710018364.6A CN108307094B (en) 2017-01-11 2017-01-11 Circuit board, molded photosensitive assembly, manufacturing method of molded photosensitive assembly, camera module and electronic equipment

Publications (2)

Publication Number Publication Date
CN108307094A CN108307094A (en) 2018-07-20
CN108307094B true CN108307094B (en) 2022-10-11

Family

ID=62871396

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710018364.6A Active CN108307094B (en) 2017-01-11 2017-01-11 Circuit board, molded photosensitive assembly, manufacturing method of molded photosensitive assembly, camera module and electronic equipment

Country Status (1)

Country Link
CN (1) CN108307094B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220279094A1 (en) * 2019-07-31 2022-09-01 Ningbo Sunny Opotech Co., Ltd. Molded circuit board and camera module, and manufacturing method thereof and electronic device
CN112449082B (en) * 2019-08-15 2024-10-29 宁波舜宇光电信息有限公司 Preparation method of photosensitive assembly, photosensitive assembly and camera module
CN115473978B (en) * 2021-06-11 2024-03-12 宁波舜宇光电信息有限公司 Lens assembly, camera module and assembly method thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN206674061U (en) * 2017-01-11 2017-11-24 宁波舜宇光电信息有限公司 Wiring board and molding photosensory assembly and camera module and electronic equipment

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3207319B2 (en) * 1993-05-28 2001-09-10 株式会社東芝 Photoelectric conversion device and method of manufacturing the same
US6953891B2 (en) * 2003-09-16 2005-10-11 Micron Technology, Inc. Moisture-resistant electronic device package and methods of assembly
GB0920946D0 (en) * 2009-11-30 2010-01-13 St Microelectronics Res & Dev Electromagnetic shielding for camera modules
JP6502731B2 (en) * 2015-04-13 2019-04-17 キヤノン株式会社 Radiation imaging apparatus and radiation imaging system
CN105681637B (en) * 2016-03-15 2019-12-31 宁波舜宇光电信息有限公司 Array camera module and photosensitive assembly and manufacturing method thereof
CN111193852B (en) * 2016-03-28 2021-10-15 宁波舜宇光电信息有限公司 Camera module and manufacturing method thereof

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN206674061U (en) * 2017-01-11 2017-11-24 宁波舜宇光电信息有限公司 Wiring board and molding photosensory assembly and camera module and electronic equipment

Also Published As

Publication number Publication date
CN108307094A (en) 2018-07-20

Similar Documents

Publication Publication Date Title
US12041335B2 (en) Camera module, circuit board assembly and manufacturing method thereof, and electronic device with camera module
US20210203818A1 (en) Camera module, molding photosensitive assembly thereof, manufacturing method and electronic device
US20220375978A1 (en) Camera module and molded photosensitive assembly and manufacturing method thereof, and electronic device
CN105681640B (en) Camera module and manufacturing method thereof
US11451693B2 (en) Camera module and molding circuit board assembly, circuit board and application thereof
TWI657306B (en) Array camera module and molded photosensitive component thereof, circuit board assembly and manufacturing method, and electronic device
CN115134490B (en) Sinking camera module, sinking photosensitive assembly and manufacturing method thereof
US10749046B2 (en) Encapsulation structure for image sensor chip and method for manufacturing the same
CN108307094B (en) Circuit board, molded photosensitive assembly, manufacturing method of molded photosensitive assembly, camera module and electronic equipment
US20230317747A1 (en) Camera module having circuit board, photosensitive element, optical lens, and filter element
EP3562136A2 (en) Image-capturing module, circuit board assembly, manufacturing method, and electronic device provided with image-capturing module
CN107734215B (en) Image pickup module, molded photosensitive assembly thereof, manufacturing method of molded photosensitive assembly and electronic equipment
CN107734216B (en) Array camera module, molding photosensitive assembly and manufacturing method thereof and electronic equipment with array camera module
CN108401089B (en) Camera module, molded circuit board assembly of camera module, manufacturing method of molded circuit board assembly and electronic equipment with camera module
US11032454B2 (en) Circuit board, molded photosensitive assembly and manufacturing method therefor, photographing module, and electronic device
CN110855854B (en) Image pickup module, molded photosensitive member, method of manufacturing the same, and electronic apparatus

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant