CN108288593A - A kind of automation equipment and its detection method of the LED Thickness sensitivities of more size compatibilities - Google Patents
A kind of automation equipment and its detection method of the LED Thickness sensitivities of more size compatibilities Download PDFInfo
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- CN108288593A CN108288593A CN201810321347.4A CN201810321347A CN108288593A CN 108288593 A CN108288593 A CN 108288593A CN 201810321347 A CN201810321347 A CN 201810321347A CN 108288593 A CN108288593 A CN 108288593A
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- 230000035945 sensitivity Effects 0.000 title claims abstract description 23
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- 238000000034 method Methods 0.000 claims abstract description 11
- 230000033001 locomotion Effects 0.000 claims description 24
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 10
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- 238000006243 chemical reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
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Abstract
The invention discloses a kind of automation equipments of the LED Thickness sensitivities of more size compatibilities, including wafer cassette library, manipulator, prealignment platform and marble air floating table, the side of the manipulator is provided with wafer cassette library, the other side of the manipulator and the position of 90 degree of wafer cassette Kucheng is provided with prealignment platform；The present invention is as a result of 12 wafer valuts, and the method by manipulator crawl and placing wafer, and compared with artificial placement wafer before, the mode of monolithic detection, detection efficiency substantially increases；The present invention is due to before final detection, being added to prealignment terrace part so that the placement positioning precision of wafer is placed far above by hand so that accuracy of detection greatly improves；The present invention is compared to traditional mechanical detection platform since monitor station uses marble air floating platform, and more excellent platform property makes accuracy of detection greatly improve.
Description
Technical field
The invention belongs to LED thickness detecting equipment technical fields, and in particular to a kind of LED thickness inspection of more size compatibilities
The automation equipment and its detection method of survey.
Background technology
With the fast development of recent year semicon industry, the demand of wafer also greatly improves, and wafer refers to
Silicon wafer used in silicon semiconductor production of integrated circuits, size can be divided into 2 inches by diameter, 4 inches, 6 inches, 8 inches,
12 inches etc.；In the production process of wafer, the series of processes such as cutting, grinding, polishing can be passed through, the thickness of wafer is to it
Later processing and production has important influence, so carrying out Thickness sensitivity to wafer after each procedure of production is
Very necessary.
In current industry, detection device be it is artificial upper piece, detection efficiency is low, cannot be satisfied growing
Wafer throughput, so a kind of equipment of automatic detection wafer thickness has seemed particularly necessary to meet yield.
Invention content
To solve the problems mentioned above in the background art.The present invention provides a kind of inspections of the LED thickness of more size compatibilities
The automation equipment and its detection method of survey have the wafer, accuracy of detection height, detection efficiency of detectable different size substantially
The characteristics of degree improves.
Another object of the present invention is to provide a kind of detection side of the automation equipment of the LED Thickness sensitivities of more size compatibilities
Method.
To achieve the above object, the present invention provides the following technical solutions：A kind of LED Thickness sensitivities of more size compatibilities from
Dynamicization equipment, including wafer cassette library, manipulator, prealignment platform and marble air floating table, the side of the manipulator are provided with
Wafer cassette library, the other side of the manipulator and is provided with prealignment platform, the machine with the position of 90 degree of wafer cassette Kucheng
Side of the tool hand far from wafer cassette library is provided with marble air floating table；
The wafer cassette library is internally provided with wafer cassette adapter, and the wafer cassette adapter is provided with 12 altogether,
12 wafer cassette adapters are divided into upper layer and lower layer, and a side of the wafer cassette adapter is provided with the second sensing
Device, the second sensor are provided with first sensor close to the bottom of wafer cassette adapter, the wafer cassette adapter it is upper
Side is provided with 2 inch wafer boxes or 4 inch wafer boxes；
The side of the manipulator is provided with manipulator L armshafts, and the other side of manipulator is provided with manipulator R armshafts,
The side of the manipulator R armshafts and L armshafts is both provided with crawl hand, and manipulator R armshafts and the common other side of L armshafts
It is provided with manipulator Z axis arm, the tail end of the manipulator L armshafts is provided with 3rd sensor；
The side of the prealignment platform is provided with CCD detectors, and the other side of prealignment platform is provided with adjustment platform；
The centre position of the marble air floating table is provided with thickness detecting sensor, totally two up and down, is arranged concentrically, institute
The centre position for stating two thickness detecting sensors is provided with compatible 2,4 cun of detection loading sports platform.
Further in the present invention, the wafer cassette library, prealignment platform and marble air floating table are installed in machine
Tool hand Z axis arm is on the circle of the different radii in the center of circle.
Further in the present invention, the wafer cassette adapter is compatible with 2 inches of wafer cassette and 4 inches of wafer cassette.
Further in the present invention, the adjustment platform is made of three kinematic axis, and three kinematic axis are respectively water
Square to linear motion axis X, vertical direction linear motion axis Z and rotary shaft form R.
Further in the present invention, described two thickness detecting sensors can be finely adjusted in vertical direction.
Further in the present invention, the detection objective table can do X, Y two-dimensional motions in the horizontal plane.
It is further in the present invention, a kind of inspection of the automation equipment of the LED Thickness sensitivities of more size compatibilities
Survey method, mainly includes the following steps that：
(1) wafer cassette is placed：2 inch wafer boxes or 4 inch wafer boxes are put into wafer cassette library by operating personnel
In wafer cassette adapter；
(2) whether there is or not wafer cassette detections：First sensor is housed in wafer cassette adapter, can automatically detect in library and whether deposit
In 2 inch wafer boxes or 4 inch wafer boxes, and can automatic identification distinguishes that operating personnel are put into is 2 inch wafer boxes
Or 4 inch wafer boxes, and only when first sensor detects 2 inch wafer boxes or 4 inch wafer box, this is opposite
The wafer cassette adapter answered can just devote oneself to work；
(3) wafer lug detects：Second sensor is capable of detecting when the wafer in wafer cassette, and whether there is or not lug phenomenons, such as
Lug phenomenon occurs, then system can send out alarm, and operating personnel is reminded correctly to place 2 inch wafer boxes or 4 inch wafer boxes
In wafer, can just continue detection operation；
(4) wafer position number detects：Before grasping silicon wafer piece, manipulator is sensed using the third of itself installation
Device is scanned the wafer cassette in wafer cassette adapter, records and exists in current 2 inch wafer box or 4 inch wafer boxes
The position number of wafer is directly skipped, to save the time as detected piece of falling vacant when then capturing；
(5) wafer transports for the first time：After the completion of scanning, according to scanning result, using crawl hand grasping silicon wafer piece, and will
It is transmitted on the adjustment platform of prealignment platform, prepares the alignment work that the center of circle and scarce side are carried out to wafer；
(6) wafer is aligned：Adjustment platform first lives wafer using vacuum suction, and rotary shaft R is rotated, at this time
CCD detectors are scanned detection to the edge of wafer, judge the error in the center of circle and scarce side of the wafer, obtain margin of error
It according to rear, is matched with Z axis using the X-axis of adjustment platform, the center of circle of wafer is adjusted to the rotation center of adjustment platform, make it together
The heart, and so that it is lacked side and rotate to the same predetermined angle；
(7) second of transport of wafer：Manipulator is taken away using crawl hand completes the wafer that the center of circle adjusts work with scarce side
Piece is passed on the detection objective table of marble air floating table, carries out Thickness sensitivity；
(8) wafer Thickness sensitivity：Detect loading sports platform can according to the preset program of operating personnel, carry wafer by
X is carried out according to scheduled movement locus, the two dimensional motion in two directions Y, thickness detecting sensor can be to detecting loading in the process
Wafer on platform carries out array scanning, obtains data, show that TTV, BOW, WARP, LTV etc. are a series of heavy finally by analysis
Want result；
(9) wafer third time is transported：After the completion of detection, manipulator sends the wafer detected back to crystalline substance using crawl hand
In 2 inch wafer boxes or 4 inch wafer boxes inside circle box library；
(10) step is repeated：Aforementioned four step is repeated, until the wafer to be checked in whole wafer box library is all detected
It finishes.
Further in the present invention, the wafer cassette library, prealignment platform and marble air floating table are installed in machine
Tool hand Z axis arm is on the circle of the different radii in the center of circle；The wafer cassette adapter is compatible with 2 inches of wafer cassette and 4 inches of crystalline substance
Circle box；The adjustment platform is made of three kinematic axis, and three kinematic axis are respectively the linear motion axis X of horizontal direction, erect
Histogram to linear motion axis Z and rotary shaft form R；Two detection objective tables match, and two detections carry
Object platform can be finely adjusted in vertical direction；The detection objective table can do X, Y two-dimensional motions in the horizontal plane.
Compared with prior art, the beneficial effects of the invention are as follows：
1, the present invention is as a result of 12 wafer valuts, and the method by manipulator crawl and placing wafer,
Compared with artificial placement wafer before, the mode of monolithic detection, detection efficiency substantially increases.
2, the present invention is due to before final detection, being added to prealignment terrace part so that the placement positioning precision of wafer
Far above manual placement so that accuracy of detection greatly improves.
3, of the invention since monitor station uses marble air floating platform, it is compared to traditional mechanical detection platform, more
Add excellent platform property that accuracy of detection is greatly improved.
4, the perfect wafer for being compatible with 2 inches and 4 inches of the present invention, in the later stage without making any change to equipment itself
In the case of, the wafer of 2 kinds of specifications can be detected, cost is greatly saved.
Description of the drawings
Fig. 1 is the structural schematic diagram of present device overall construction；
Fig. 2 is the structural schematic diagram in wafer cassette library of the present invention；
Fig. 3-1 is the structural schematic diagram of wafer cassette adapter of the present invention (state for placing 2 inch wafer boxes)；
Fig. 3-2 is the structural schematic diagram of wafer cassette adapter of the present invention (state for placing 4 inch wafer boxes)；
Fig. 4 is the structural schematic diagram of manipulator of the present invention；
Fig. 5 is the structural schematic diagram of prealignment platform of the present invention；
Fig. 6 is the structural schematic diagram of marble air floating table of the present invention；
In figure：1, wafer cassette library；11, wafer cassette adapter；12,4 inch wafer box；13, first sensor；14, second
Sensor；15,2 inch wafer boxes 2, manipulator；21, hand is captured；22, manipulator L armshafts；23,3rd sensor；24, mechanical
Hand Z axis arm；25, manipulator R armshafts；3, prealignment platform；31, CCD detectors；32, platform is adjusted；4, marble air floating table；41、
Thickness detecting sensor；42, objective table is detected.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Embodiment 1
- 6 are please referred to Fig.1, the present invention provides following technical scheme：A kind of LED Thickness sensitivities of more size compatibilities it is automatic
Change equipment, including wafer cassette library 1, manipulator 2, prealignment platform 3 and marble air floating table 4, the side of manipulator 2 are provided with
Wafer cassette library 1, the other side of manipulator 2 and is provided with prealignment platform 3, manipulator 2 with wafer cassette library 1 at 90 degree of position
Side far from wafer cassette library 1 is provided with marble air floating table 4；
Wafer cassette library 1 is internally provided with wafer cassette adapter 11, and wafer cassette adapter 11 is provided with 12 altogether, and 12
A wafer cassette adapter 11 is divided into upper layer and lower layer, and a side of wafer cassette adapter 11 is provided with second sensor 14, and second
Sensor 14 is provided with first sensor 13 close to the side of wafer cassette adapter 11, and the top of wafer cassette adapter 11 is provided with
2 inch wafer boxes 15 or 4 inch wafer boxes 12；
The side of manipulator 2 is provided with manipulator L armshafts 22, and the other side of manipulator 2 is provided with manipulator R armshafts
The side of 25, manipulator R armshaft 25 is provided with crawl hand 21, and the other side of manipulator R armshafts 25 is provided with manipulator Z axis
The tail end of arm 24, manipulator L armshafts 22 is provided with 3rd sensor 23；
The side of prealignment platform 3 is provided with CCD detectors 31, and the other side of prealignment platform 3 is provided with adjustment platform
32；
The centre position of marble air floating table 4 is provided with thickness detecting sensor 41, thickness detecting sensor 41 up and down
Both sides have been symmetrically arranged detection objective table 42.
In the present embodiment, wafer cassette library 1, prealignment platform 3 and marble air floating table 4 are installed in manipulator Z axis arm
On 24 circle for the different radii in the center of circle.
In the present embodiment, wafer cassette adapter 11 is compatible with 2 inches of wafer cassette 15 and 4 inches of wafer cassette 12.
In the present embodiment, adjustment platform 32 is made of three kinematic axis, and three kinematic axis are respectively the straight line fortune of horizontal direction
Moving axis X, the linear motion axis Z of vertical direction and rotary shaft form R.
In the present embodiment, described two thickness detecting sensors can be finely adjusted in vertical direction.
In the present embodiment, detection objective table 42 can do X, Y two-dimensional motions in the horizontal plane.
In the present embodiment, a kind of detection method of the automation equipment of the LED Thickness sensitivities of more size compatibilities is main
Include the following steps：
(1) wafer cassette is placed：2 inch wafer boxes 15 or 4 inch wafer boxes 12 are put into wafer cassette library by operating personnel
In wafer cassette adapter 11 in 1；
(2) whether there is or not wafer cassette detections：First sensor 13 is housed, can detect in library automatically is in wafer cassette adapter 11
It is no there are 2 inch wafer boxes 15 or 4 inch wafer boxes 12, and can automatic identification distinguishes that operating personnel are put into is 2 English
Very little wafer cassette 15 or 4 inches of wafer cassette 12, and only when first sensor 13 detect 2 inches wafer cassette 15 or
When 4 inch wafer box 12, which can just devote oneself to work；
(3) wafer lug detects：Second sensor 14 is capable of detecting when the wafer in wafer cassette 12, and whether there is or not lugs to show
As lug phenomenon such as occurring, then system can send out alarm, and operating personnel is reminded correctly to place 2 inch wafer boxes 15 or 4 inches
Wafer in wafer cassette 12 can just continue detection operation；
(4) wafer position number detects：Before grasping silicon wafer piece, manipulator 2 is sensed using the third of itself installation
Device 23, in wafer cassette adapter 11 2 inch wafer boxes 15 or 4 inch wafer boxes 12 be scanned, record current 2 inches
There are the position numbers of wafer in wafer cassette 15 or 4 inch wafer boxes 12 directly jumps as detected piece of falling vacant when then capturing
It crosses, to save the time；
(5) wafer transports for the first time：After the completion of scanning, according to scanning result, using crawl 21 grasping silicon wafer piece of hand,
And transmit it on the adjustment platform 32 of prealignment platform 3, prepare the alignment work that the center of circle and scarce side are carried out to wafer；
(6) wafer is aligned：Adjustment platform 32 first lives wafer using vacuum suction, and rotary shaft R is rotated, this
When CCD detectors 31 detection is scanned to the edge of wafer, judge the error in the center of circle and scarce side of the wafer, missed
It after difference data, is matched with Z axis using the X-axis of adjustment platform 32, the center of circle of wafer is adjusted to the rotation center of adjustment platform 32
On, make it with one heart, and so that it is lacked side and rotate to the same predetermined angle；
(7) second of transport of wafer：Manipulator 2 is taken away using crawl hand 21 completes the crystalline substance that the center of circle adjusts work with scarce side
Disk is passed on the detection objective table 42 of marble air floating table 4, carries out Thickness sensitivity；
(8) wafer Thickness sensitivity：Wafer can be carried according to the preset program of operating personnel by detecting loading sports platform 42
X is carried out according to scheduled movement locus, the two dimensional motion in two directions Y, thickness detecting sensor 41 can be to detection in the process
Wafer on objective table 42 carries out array scanning, obtains data, TTV, BOW, WARP, LTV etc. one are obtained finally by analysis
Serial important results；
(9) wafer third time is transported：After the completion of detection, manipulator 2 is sent the wafer detected using crawl hand 21
It returns in the 2 inch wafer boxes 15 or 4 inch wafer boxes 12 of 1 the inside of wafer cassette library；
(10) step is repeated：Aforementioned four step is repeated, until the wafer to be checked in whole wafer box library 1 is all detected
It finishes.
In the present embodiment, wafer cassette library 1, prealignment platform 3 and marble air floating table 4 are installed in manipulator Z axis arm
On 24 circle for the different radii in the center of circle；Wafer cassette adapter 11 is compatible with 2 inches of wafer cassette 15 and 4 inches of wafer cassette 12；
Adjustment platform 32 is made of three kinematic axis, and three kinematic axis are respectively the straight line of the linear motion axis X of horizontal direction, vertical direction
Kinematic axis Z and rotary shaft form R；Described two thickness detecting sensors can be finely adjusted in vertical direction；Detect loading
Platform 42 can do X, Y two-dimensional motions in the horizontal plane.
CCD detectors 31 are the known technology of the extensive utilization and daily life that have disclosed, its work in the present invention
Principle：The signal charge that charge coupling device storage is generated by light or electric excitation, when applying the pulse of specific time sequence to it,
The signal charge of storage just can make directional transmissions in CCD, and the main problem of the CCD courses of work is the generation of signal charge, is deposited
Storage, transmission, and detection.
Thickness detecting sensor 41 is the known technology of the extensive utilization and daily life that have disclosed in the present invention, it
Operation principle：Laser displacement sensor is used, using laser beam as mechanical probes when contact measurement, utilizes charge-coupled device
Part realizes opto-electronic conversion.
The operation principle of the present embodiment：2 inch wafer boxes 15 or 4 inch wafer boxes 12 are put into crystalline substance by operating personnel
In wafer cassette adapter 11 in circle box library 1, first sensor 13 is housed in wafer cassette adapter 11, can be detected in library automatically
With the presence or absence of 2 inch wafer boxes 15 or 4 inch wafer boxes 12, and can automatic identification distinguishes that operating personnel are put into is 2
Inch wafer box or 4 inch wafer boxes 12, and only when first sensor 13 detects 2 inch wafer boxes 15 or 4 English
When very little wafer cassette 12, which can just devote oneself to work, and second sensor 14 is capable of detecting when 2 inches
Whether there is or not lug phenomenons for wafer in wafer cassette 15 or 4 inch wafer boxes 12, lug phenomenon such as occur, then system can send out police
Report reminds operating personnel correctly to place the wafer in 2 inch wafer boxes 15 or 4 inch wafer boxes 12, can just continue to examine
Survey operation；Before grasping silicon wafer piece, the 3rd sensor 23 that manipulator 2 is installed using itself, in wafer cassette adapter 11
2 inch wafer boxes 15 either 4 inch wafer boxes 12 are scanned and record current 2 inch wafer box 15 or 4 inch wafer boxes
There are the position numbers of wafer in 12 directly skips if detected piece of falling vacant when then capturing, to save the time, after the completion of scanning,
According to scanning result, using crawl 21 grasping silicon wafer piece of hand, and transmits it on the adjustment platform 32 of prealignment platform 3, prepare
The alignment work in the center of circle and scarce side is carried out to wafer；Adjustment platform 32 lives wafer using vacuum suction first, rotary shaft R into
Row rotation, CCD detectors 31 are scanned detection to the edge of wafer at this time, judge the center of circle of the wafer and scarce side
Error after obtaining error information, is matched using the X-axis of adjustment platform 32 with Z axis, and the center of circle of wafer is adjusted to adjustment platform 32
Rotation center on, make it with one heart, and so that it is lacked side and rotate to the same predetermined angle, last manipulator 2 utilizes crawl hand 21
It takes the wafer for completing the center of circle and the adjustment work of scarce side away, is passed on the detection objective table 42 of marble air floating table 4, carries out
Thickness sensitivity；Wafer can be carried according to scheduled movement rail according to the preset program of operating personnel by detecting loading sports platform 42
Mark carries out X, and the two dimensional motion in two directions Y, thickness detecting sensor 41 can be to the wafer on detection objective table 42 in the process
Piece carries out array scanning, obtains data, and TTV, BOW, WARP, a series of important results such as LTV, detection are obtained finally by analysis
After the completion, manipulator 2 using crawl hand 21 by the wafer detected send back to the inside of wafer cassette library 12 inch wafer boxes 15 or
In 4 inch wafer box 12 of person；Aforementioned four step is repeated, until the wafer to be checked in whole wafer box library 1 has all been detected
Finish.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
Understanding without departing from the principles and spirit of the present invention can carry out these embodiments a variety of variations, modification, replace
And modification, the scope of the present invention is defined by the appended.
Claims (8)
1. a kind of automation equipment of the LED Thickness sensitivities of more size compatibilities, including wafer cassette library (1), manipulator (2), pre- right
Quasi- platform (3) and marble air floating table (4), it is characterised in that：The side of the manipulator (2) is provided with wafer cassette library (1), institute
It states the other side of manipulator (2) and 90 degree of position is provided with prealignment platform (3), the machinery with wafer cassette library (1)
Side of the hand (2) far from wafer cassette library (1) is provided with marble air floating table (4)；
The wafer cassette library (1) is internally provided with wafer cassette adapter (11), and the wafer cassette adapter (11) is provided with more
A, multiple wafer cassette adapters (11) are divided into upper layer and lower layer, and the front end of the wafer cassette adapter (11) is provided with
Two sensors (14), the second sensor (14) are provided with first sensor close to the bottom of wafer cassette adapter (11)
(13), 2 inch wafer boxes (15) or 4 inch wafer boxes (12) are provided with above the wafer cassette adapter (11)；
The side of the manipulator (2) is provided with manipulator L armshafts (22), and the other side of manipulator (2) is provided with manipulator R
The side of armshaft (25), the manipulator R armshafts (25) and L armshafts (22) is both provided with crawl hand (21), and manipulator R armshafts
(25) the common other side of L armshafts (22) is provided with manipulator Z axis arm (24), the tail end of the manipulator L armshafts (22) is set
It is equipped with 3rd sensor (23)；
The side of the prealignment platform (3) is provided with CCD detectors (31), and the other side of prealignment platform (3) is provided with
Adjust platform (32)；
The centre position of the marble air floating table (4) is provided with thickness detecting sensor (41), totally two up and down, sets with one heart
It sets, the centre position of described two thickness detecting sensors (41) is provided with compatible 2,4 cun of detection loading sports platform (42).
2. a kind of automation equipment of the LED Thickness sensitivities of more size compatibilities according to claim 1, it is characterised in that：
The wafer cassette library (1), prealignment platform (3) and marble air floating table (4) are installed in manipulator Z axis arm (24) as the center of circle
Different radii circle on.
3. a kind of automation equipment of the LED Thickness sensitivities of more size compatibilities according to claim 1, it is characterised in that：
Compatible 2 inches of the wafer cassette (15) of the wafer cassette adapter (11) and 4 inches of wafer cassette (12).
4. a kind of automation equipment of the LED Thickness sensitivities of more size compatibilities according to claim 1, it is characterised in that：
The adjustment platform (32) is made of three kinematic axis, and three kinematic axis are respectively the linear motion axis X, vertical of horizontal direction
The linear motion axis Z and rotary shaft R compositions in direction.
5. a kind of automation equipment of the LED Thickness sensitivities of more size compatibilities according to claim 1, it is characterised in that：
Described two thickness detecting sensors (41) can be finely adjusted in vertical direction.
6. a kind of automation equipment of the LED Thickness sensitivities of more size compatibilities according to claim 1, it is characterised in that：
The detection loading sports platform (42) can do X, Y two-dimensional motions in the horizontal plane.
7. according to a kind of inspection of the automation equipment of the LED Thickness sensitivities of more size compatibilities of claim 1-6 any one of them
Survey method, mainly includes the following steps that：
(1) wafer cassette is placed：2 inch wafer boxes (15) or 4 inch wafer boxes (12) are put into wafer cassette library by operating personnel
(1) in inner wafer cassette adapter (11)；
(2) whether there is or not wafer cassette detections：First sensor (13) is housed, can detect in library automatically is in wafer cassette adapter (11)
It is no there are 2 inch wafer boxes (15) or 4 inch wafer boxes (12), and can automatic identification distinguish that operating personnel are put into be
2 inch wafer boxes (15) or 4 inch wafer boxes (12), and only when first sensor (13) detects 2 inch wafer boxes
(15) or when 4 inch wafer box (12), which can just devote oneself to work；
(3) wafer lug detects：Second sensor (14) is capable of detecting when 2 inch wafer boxes (15) or 4 inch wafer boxes
(12) whether there is or not lug phenomenons for the wafer in, and lug phenomenon such as occurs, then system can send out alarm, and operating personnel is reminded correctly to pacify
The wafer in 2 inch wafer boxes (15) or 4 inch wafer boxes (12) is put, detection operation can be just continued；
(4) wafer position number detects：Before grasping silicon wafer piece, manipulator (2) utilizes the 3rd sensor of itself installation
(23), in wafer cassette adapter (11) 2 inch wafer boxes (15) or 4 inch wafer boxes (12) be scanned, record is worked as
There are the position numbers of wafer in preceding 2 inch wafer box (15) or 4 inch wafer boxes (12) then grabs as detected piece of falling vacant
It is directly skipped when taking, to save the time；
(5) wafer transports for the first time：After the completion of scanning, according to scanning result, using crawl hand (21) grasping silicon wafer piece, and will
It is transmitted on the adjustment platform (32) of prealignment platform (3), prepares the alignment work that the center of circle and scarce side are carried out to wafer；
(6) wafer is aligned：Adjustment platform (32) lives wafer using vacuum suction first, and rotary shaft R is rotated, at this time
CCD detectors (31) are scanned detection to the edge of wafer, judge the error in the center of circle and scarce side of the wafer, are missed
It after difference data, is matched with Z axis using the X-axis of adjustment platform (32), the center of circle of wafer is adjusted to the rotation of adjustment platform (32)
On the center of circle, make it with one heart, and so that it is lacked side and rotate to the same predetermined angle；
(7) second of transport of wafer：Manipulator (2) takes the crystalline substance for completing the center of circle and the adjustment work of scarce side away using crawl hand (21)
Disk is passed on the detection objective table (42) of marble air floating table (4), carries out Thickness sensitivity；
(8) wafer Thickness sensitivity：Detect loading sports platform (42) can according to the preset program of operating personnel, carry wafer by
X is carried out according to scheduled movement locus, the two dimensional motion in two directions Y, thickness detecting sensor (41) can be to detection in the process
Wafer on objective table (42) carries out array scanning, obtains data, TTV, BOW, WARP, LTV etc. are obtained finally by analysis
A series of important results；
(9) wafer third time is transported：After the completion of detection, manipulator (2) is sent the wafer detected using crawl hand (21)
It returns in 2 inch wafer boxes (15) or 4 inch wafer boxes (12) inside wafer cassette library (1)；
(10) step is repeated：Aforementioned four step is repeated, until the wafer to be checked in whole wafer box library (1) has all been detected
Finish.
8. detection method according to claim 7, which is characterized in that the wafer cassette library (1), prealignment platform (3) and
Marble air floating table (4) is installed in on the circle for the different radii that manipulator Z axis arm (24) is the center of circle；The wafer cassette adaptation
Compatible 2 inches of the wafer cassette (15) of device (11) and 4 inches of wafer cassette (12)；The adjustment platform (32) is by three kinematic axis groups
At three kinematic axis are respectively the linear motion axis X of horizontal direction, the linear motion axis Z of vertical direction and rotary shaft R
Composition；Described two thickness detecting sensors (41) can be finely adjusted in vertical direction；The detection objective table (42) can
X, Y two-dimensional motions are done in the horizontal plane.
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