CN108254309B - Adhesive force automatic detection device and method for excimer laser micromachining device - Google Patents

Abstract

The invention discloses a cohesive force automatic detection device and method for excimer laser micro-processing devices, and belongs to the fields of physics and mechanics detection. The device uses electronic tension sensor technology and machine vision technology, and adopts embedded microcontroller to test the bonding strength of materials, and obtains the tensile force and displacement with the separation distance of the bonding material as the abscissa and the mechanical data as the ordinate. Relationship curve chart. When using transparent glue, different microscopic images under the separation of glue and material can be obtained, in order to study the regularity of bonding strength and laser micromachining mechanism by excimer laser pretreatment of various materials, and provide the original data of the continuous process of the experiment material. The invention is mainly suitable for the test of the regularity interpretation of the multi-physical quantity change of the bonding strength of various non-brittle bonding materials after excimer laser processing under the same or different adhesives.

Description

Adhesive force automatic detection device and method for excimer laser micromachining device

technical field

The invention relates to an automatic detection and analysis device for bonding force, belonging to the field of physical and mechanical detection, and in particular to bonding.

Background technique

The adhesion phenomenon is related to many fields of science and technology and has become an important research field in recent years. Appropriate surface treatment to which the bonding material can be applied has a large effect on the quality and quantity of the adhesive. To obtain excellent durability and bond strength of various bonding materials, surface preparation before bonding (bonding part pretreatment) is necessary. Surface treatment removes weak edge layers, cleans the surface, alters the surface energy (mainly through oxidation), and improves the characteristics of the surface microscopic morphology. The net effect of these changes is enhanced surface bonding, mechanical interlocking of bonds, and resistance to moisture and humidity-induced degradation.

Since the invention of the excimer laser in 1975, with the advancement of technology, the excimer laser has been widely used in the industrial field. Lasers are used to alter the characteristics of material surfaces for a variety of industrial applications including bonding properties. Laser processing is efficient for many materials and the control is so precise that only the surface is affected, with no detrimental effects on the bulk. Laser-treated polymers are highly localized and precise, where the bond can be placed for long periods of time between handling and bonding or coating applications, and can be processed at room temperature and in air without special environments. Excimer laser ultraviolet (UV) irradiation offers a new pre-bonding surface treatment and surface modification technology capable of processing a wide variety of materials and bonded parts, an alternative to conventional eco-friendly chemical etching and Grinding method. Numerous experimental results showed that UV laser surface treatment and modification greatly improved the shear, tensile and peel strength of the bond, as well as improved strength, wear, conductivity and appearance.

Electromagnetic waves from 200-150nm are defined as far ultraviolet radiation. The narrow wavelength band (from 200-180 nm) is the region where photochemical modification of polymers is feasible and efficient; the energy of light exceeds the strength of chemical bonds in most typical organic polymers, and thus can generate photochemical reactions very efficiently. Almost all organic compounds (except saturated aliphatic hydrocarbons and fluorocarbons) have strong absorption in this region. It has been determined that this radiation absorbs 95% of the intensity when it penetrates organic polymers at about 300 nm. The absorption of photons by polymers obeys Beer's law. The results show that a large number of chemical bonds are broken in the irradiation range. Generally, the irradiation lifetime of organic molecules in this wavelength range is on the order of one trillionth of a second. The scission of polymer chains is often accompanied by a recombination process, thus reflecting the net result is the loss of small gas molecules (CO, CO2, H2) and degradation resulting from the scission of the linear structure of the polymer. The surface modification of the material by UV laser, in order to obtain the best cohesive force laser treatment parameters, it is necessary to carry out a targeted adhesive tension test.

At present, the tensile testing machine, also known as the universal material testing machine, is used in the physical and mechanical tensile tests. The universal testing machine is a mechanical force testing machine used to perform static load, tensile, compressive, bending, shearing, tearing, peeling and other mechanical properties tests for various materials. It is suitable for plastic sheets, pipes, Various physical and mechanical properties testing of profiled material, plastic film, rubber, wire and cable, steel, glass fiber and other materials is an indispensable testing equipment for material development, physical testing, teaching research and quality control.

However, under the premise of studying the regularity of the influence of the excimer laser pretreatment of various materials on the bonding strength and the laser micromachining mechanism, the above-mentioned universal material testing machine experiment has the following shortcomings:

1. During the above-mentioned experiment of the universal material testing machine, only a single data of the instantaneous mechanics of separation can be obtained, and there is no detailed data record of the process. Especially when the separation distance and separation time of the bonding materials are the abscissa, the continuous process data with the mechanical data as the ordinate cannot be obtained. Therefore, this seriously hinders the study of the effect of excimer laser pretreatment on the bonding strength of various materials. Influence regularity and laser micromachining mechanism.

2. When the adhesive force is tested after the material is bonded with transparent glue, the difference and difference between the separation state of the glue and the material cannot be visually observed. This also hinders the study of the regularity of the effect of excimer laser pretreatment on bonding strength of various materials and the mechanism of laser micromachining from the perspective of image microscopy.

The optimal UV laser treatment process parameters (intensity, cycle rate, number of pulses) are related to the matrix material and its chemical properties. In order to realize the microscopic observation in the process of bond failure, and to provide visual data for the qualitative analysis of UV laser processing parameters, machine vision technology was adopted in this experimental device.

Machine vision is a combination of computer image processing technology and modern photosensitive technology, and photosensitive microscopic image processing technology is used for color recognition, contour extraction, position measurement and image microscopy. It is a kind of advanced technology in the field of artificial intelligence. In order to solve the above problems, the present invention proposes a brand-new machine vision-based microscopic adhesive force experiment device. Based on the use of electronic tension sensors and embedded microprocessors, the device can overcome the shortcomings of the above-mentioned general-purpose tensile testing machines by using machine vision technology, and can provide the regularity of the influence of excimer laser pretreatment of various materials on the bonding strength and the laser microstructure. The research on processing mechanism provides the original data and regular curve of the continuous process of the experiment and the microscopic image data of the bonding separation mode, thus promoting the modern and advanced development of the bonding force experimental device.

SUMMARY OF THE INVENTION

The purpose of the present invention is to solve the need for targeted detection and analysis of the cohesive force of the device when the excimer laser performs micromachining on the surface of the device in the experiment. The device uses electronic tension sensor technology and machine vision technology, and adopts embedded microcontroller to test the bonding strength of materials, and obtains the tensile force and displacement with the separation distance of the bonding material as the abscissa and the mechanical data as the ordinate. Relationship curve chart. When using transparent glue, different microscopic images under the separation of glue and material can be obtained, in order to study the regularity of bonding strength and laser micromachining mechanism by excimer laser pretreatment of various materials, and provide the original data of the continuous process of the experiment material.

The invention is mainly suitable for the test of the regularity of the multi-physical quantity change of the bonding strength of various non-brittle bonding materials after excimer laser processing under the same or different adhesive bonding, including the bonding material being pulled Detection of the interdependence between the displacement and tensile force of the bonding material during the separation process, the bond strength, and the microscopic process of its failure.

In order to achieve the above objects, the technical solutions adopted in the present invention are as follows.

An automatic detection device for adhesion force of excimer laser microfabricated devices, characterized in that: the device comprises a tension machine (3), a stepping motor driver module (10), a controller module (7), a communication module (8) and an image Microscopic module, the stepping motor driver module (10) includes a stepping motor driver (4) and an L298 driving module (5). The power supply line and the control line of the stepper motor (2-13) of the tension machine (3) are connected with the stepper motor driver (4); the control line of the stepper motor driver (4) is connected with the L298 drive module (5); the control line The control line of the controller module (7) is connected to the L298 drive module (5); the serial communication line of the controller module (7) is connected to the communication module (8); the communication module (8) is connected to the PH tension gauge (2-4) 232 communication line connection; the image microscope module includes a computer (1) and a CCD camera (2), and the computer (1) and the CCD camera (2) are connected through a data line. The CCD camera (2) corresponds to the reflector (2-17). A TFT liquid crystal screen (6) is installed in the middle of the controller module (7).

The tension machine (3) includes a steel plate base (2-1), a material fixture A (2-2), a material fixture B (2-3) and a PH tension gauge (2-4); the material fixture A (2-2) is installed On the steel plate base (2-1), the material fixture B (2-3) is installed on the PH tension gauge (2-4); the PH tension gauge (2-4) is installed on the fixed transverse beam (2-9), Cylindrical beam A (2-6) and cylindrical beam B (2-8) are installed on the steel plate base (2-1), cylindrical beam A (2-6) and cylindrical beam B (2-8) and fixed transverse beam (2-9) The through hole can slide; the stepping motor (2-13) communicates with the coupling (2-5) to drive the lead screw in the lead screw set (2-7) to rotate; the upper platform steel plate A (2- 12) Fix on the upper platform steel plate B (2-24) through four small pillars (2-10), the upper platform steel plate B (2-24) is fixed on the top beam (2-11), the top beam (2-11) ) and cylindrical beam A (2-6) and cylindrical beam B (2-8) are connected and fixed. When the stepping motor with high force and high precision is used to rotate, it can drive the lead screw in the lead screw set (2-7) to rotate, and the lead screw rotates to drive the movement of the fixed transverse beam (2-9), which in turn drives the PH tension gauge. (2-4) The overall movement provides electric uniform power for the cohesive force separation experiment, which can replace the manpower and make up for the instability of the manpower. The iron bar (2-14) is fixed on the upper platform steel plate B (2-24), and the upper travel limit switch (2-15) and the lower travel limit switch (2-16) are placed on the iron bar (2-14) to prevent the mechanical collision of the PH tension gauge (2-4) when the lead screw rotates to the end of its stroke, so as to ensure the safe operation of the adhesive force testing device.

The PA8 pin of the MCU of the controller module (7) outputs PWM. Through experiments, it is found that when the PWM parameter is 8K and the frequency duty cycle is 50%, the separation speed is the best and there will be no loss of steps. The PA8 pin and The IN1 pin of the L298 driver module (5) is connected; the output of the controller module (7) controls the stepper motor (2-13) The forward and reverse signals are controlled by the PA4 pin and the PA5 pin, and the PA4 pin and the PA5 pin are respectively It is connected with the IN2 and IN3 pins of the L298 driver module (5); the L298 driver module (5) realizes level amplification and driving current amplification, so that the control signals of the stepper motor driver (4) and the controller module (7) are electrically Flat matching; the OUT1 pin of the L298 driver module (5) is connected to the PUL- pin of the stepper motor driver (4), the PUL+ pin of the stepper motor driver (4) is connected to a high level, and the stepper motor driver (4) ) of the DIR+ pin is connected to the OUT2 pin of the L298 driver module (5), and the DIR- pin of the stepper motor driver (4) is connected to the OUT3 pin of the L298 driver module (5); then connect the stepper motor driver (4) Connect with the stepper motor (2-13) control signal and four-phase signal line.

The stepping motor (3) is an 86 full-closed-loop high-speed constant-torque stepping servo motor.

The MCU of the controller module (7) is STM32F103RCT6;

The stepper motor driver (4) is a closed loop driver HBS86H.

The communication module (8) is an RS232 to TTL module.

The communication module (8) can realize two-way communication between the controller module (7) and the PH force gauge (2-4), and the PA9 pin of the MCU of the controller module (7) is connected to the RXD pin of the communication module (8), The PA10 pin of the MCU is connected to the TXD pin of the communication module (8), the other end of the communication module (8) is connected to the nine-pin male port, and then connected to the PH tension gauge (2-4).

The image microscope module adopts a continuous zoom objective (2-18), and the adjustment range of the continuous zoom objective (2-18) is 3 to 30×; the gear ring A (2-19) is fixed on the continuous zoom objective (2-19). 2-18), and fix a gear B (2-23) on the rotating shaft of the DC micro-control motor (2-22), and realize automatic zooming by controlling the rotation of the DC micro-control motor (2-22). The continuously variable magnification objective (2-18) and CCD camera (2-20) can image the separation process of the bonding material through a mirror (2-17) placed at 45 degrees; CCD camera (2-20) and DC The micro-control motor (2-22) is fixed on the support plate (2-21). The CCD camera (2-20) and the DC micro-control motor (2-22) are then transmitted to the computer (1) through the data line for observation and analysis. The computer (1) analyzes the obtained information and feeds back the focusing information to the A controller module (7), the controller module (7) controls the DC micro-control motor (2-22) to rotate and focus to form a closed-loop automatic focus function.

The working distance of the continuously variable magnification objective lens (2-18) is 293mm, and the magnification is 0.7×.

An automatic detection method for the adhesion force of excimer laser micromachining devices, characterized in that:

First, initialize and configure the embedded chip function of the tension meter. When the tension test is to be performed, control the rotation of the screw by the manual button, move to the starting position, and use the material fixture A (2-2) and material fixture B ((2- 3) Clamp the material to be tested for tensile test; then input the parameters of the laser processing of the material to be tested, including the scanning speed of the laser, the number of pulses of the excimer laser, and the energy intensity of the laser irradiation, and output the recommended stepping motor according to the information The rotation speed of the stepper motor can be changed according to the test situation, so as to obtain the best test effect. Then, when the limit switch is reached or the peak pulling force is reached, the motor pull test is to close the timer interrupt. Then in the main program In the loop, use the serial port to obtain the focusing information of the objective lens from the computer, and then control the DC micro-control motor to adjust the focus to form a closed-loop adjustment of the zoom objective lens. Then, the timer interrupt is an interrupt response service every 20ms. In the interrupt response service, the The job is to complete the reading of the PH tension meter data by the embedded chip, process the data format of the communication content and extract the key information of the tension value, and then extract the extracted tension value and the distance calculated according to the driving frequency, in real time. Draw it on the TFT LCD screen to form a curve chart, and then output the real-time ratio of tensile force and laser parameters, which provides a reference for the adhesive force separation experiment. Finally, configure PWM in the embedded chip STM32F103RCT6 to let pin PA8 output PWM, which is the full output of HBS86H. The digital closed-loop stepper driver provides pulse frequency to drive the motor to work. This cycle is performed for each tensile test work.

The computer (1) uses the CCD lens to collect the separation process of the tested material in real time, and obtains its process microscopic image, and then uses the computer to remove noise, enhance, restore, segment, and extract features from the image, and finally obtain the required inspection data. and micrographs to provide analytical data for adhesion testing.

The device can overcome the shortcomings of the general tensile testing machine, and provide the original data and regularity curve of the continuous process of the experiment and the bond separation for the study of the influence of excimer laser pretreatment on the bond strength of various materials and the mechanism of laser micromachining. The microscopic image data of the mode, thus promoting the modern and advanced development of the adhesive force experimental device.

Compared with the prior art, 1. This design clearly records the test process and results of the bond strength, not only can observe and take pictures of the moment of pulling apart, analyze the microscopic changes when the material is separated from the glue, but also record the pulling apart. The numerical change of the tensile force during the process;

2. The device can also be used to test the bonding strength of different adhesives or the bonding strength of materials under different bonding surface treatment technologies, record the experimental process, and measure the pulling force and the degree of pulling apart in real time.

3. Provide powerful raw data for analyzing the relationship between the treatment parameters (intensity, cycle rate, pulse number) of the optimal excimer laser surface treatment and the bonding force after the modification of the matrix material.

Description of drawings

FIG. 1 is an overall device configuration diagram of the present invention.

Fig. 2 is a tension meter of the present invention.

Figure 3 is a flow chart of the work of the present invention.

In the picture: 1. Computer, 2. CCD camera, 3. Tensile machine, 4. Stepper motor driver, 5. L298 driver module, 6. TFT LCD screen, 7. Controller module, 8. RS232 to TTL module, 9 , Tensile force meter, 10, Stepper motor driver module, 2-1, Steel plate base, 2-2, Material fixture A, 2-3, Material fixture B, 2-4, PH force meter, 2-5, Coupling , 2-6, cylindrical beam A, 2-7, screw set, 2-8, cylindrical beam B, 2-9, fixed transverse beam, 2-10, small pillar, 2-11, top beam, 2- 12. Upper platform steel plate A, 2-13, stepper motor, 2-14, iron bar, 2-15, upper travel limit switch, 2-16, lower travel limit switch, 2-17, mirror, 2 -18. Continuous zoom objective lens, 2-19, gear ring A, 2-20, CCD camera, 2-21, bracket plate, 2-22, DC micro-control motor, 2-23, gear B, 2-24, Platform steel plate B.

Detailed ways

Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. FIG. 1 is a structural diagram of an overall device of a tensile machine.

As shown in FIG. 1 and FIG. 2 , an automatic detection device for adhesive force of excimer laser microfabricated devices, the device includes a tension machine (3), a stepping motor driver module (10), a controller module (7), and a communication module (8) and the image microscope module, the stepping motor driver module (10) includes a stepping motor driver (4) and an L298 driving module (5). The power supply line and the control line of the stepper motor (2-13) of the tension machine (3) are connected with the stepper motor driver (4); the control line of the stepper motor driver (4) is connected with the L298 drive module (5); the control line The control line of the controller module (7) is connected to the L298 drive module (5); the serial communication line of the controller module (7) is connected to the communication module (8); the communication module (8) is connected to the PH tension gauge (2-4) 232 communication line connection; the image microscope module includes a computer (1) and a CCD camera (2), and the computer (1) and the CCD camera (2) are connected through a data line. The CCD camera (2) corresponds to the reflector (2-17). A TFT liquid crystal screen (6) is installed in the middle of the controller module (7).

The tension machine (3) includes a steel plate base (2-1), a material fixture A (2-2), a material fixture B (2-3) and a PH tension gauge (2-4); the material fixture A (2-2) is installed On the steel plate base (2-1), the material fixture B (2-3) is installed on the PH tension gauge (2-4); the PH tension gauge (2-4) is installed on the fixed transverse beam (2-9), Cylindrical beam A (2-6) and cylindrical beam B (2-8) are installed on the steel plate base (2-1), cylindrical beam A (2-6) and cylindrical beam B (2-8) and fixed transverse beam (2-9) The through hole can slide; the stepping motor (2-13) communicates with the coupling (2-5) to drive the lead screw in the lead screw set (2-7) to rotate; the upper platform steel plate A (2- 12) Fix on the upper platform steel plate B (2-24) through four small pillars (2-10), the upper platform steel plate B (2-24) is fixed on the top beam (2-11), the top beam (2-11) ) and cylindrical beam A (2-6) and cylindrical beam B (2-8) are connected and fixed. When the stepping motor with high force and high precision is used to rotate, it can drive the lead screw in the lead screw set (2-7) to rotate, and the lead screw rotates to drive the movement of the fixed transverse beam (2-9), which in turn drives the PH tension gauge. (2-4) The overall movement provides electric uniform power for the cohesive force separation experiment, which can replace the manpower and make up for the instability of the manpower. The iron bar (2-14) is fixed on the upper platform steel plate B (2-24), and the upper travel limit switch (2-15) and the lower travel limit switch (2-16) are placed on the iron bar (2-14) to prevent the mechanical collision of the PH tension gauge (2-4) when the lead screw rotates to the end of its stroke, so as to ensure the safe operation of the adhesive force testing device.

The PA8 pin of the MCU of the controller module (7) outputs PWM. Through experiments, it is found that when the PWM parameter is 8K and the frequency duty cycle is 50%, the separation speed is the best and there will be no loss of steps. The PA8 pin and The IN1 pin of the L298 driver module (5) is connected; the output of the controller module (7) controls the stepper motor (2-13) The forward and reverse signals are controlled by the PA4 pin and the PA5 pin, and the PA4 pin and the PA5 pin are respectively It is connected with the IN2 and IN3 pins of the L298 driver module (5); the L298 driver module (5) realizes level amplification and driving current amplification, so that the control signals of the stepper motor driver (4) and the controller module (7) are electrically Flat matching; the OUT1 pin of the L298 driver module (5) is connected to the PUL- pin of the stepper motor driver (4), the PUL+ pin of the stepper motor driver (4) is connected to a high level, and the stepper motor driver (4) ) of the DIR+ pin is connected to the OUT2 pin of the L298 driver module (5), and the DIR- pin of the stepper motor driver (4) is connected to the OUT3 pin of the L298 driver module (5); then connect the stepper motor driver (4) Connect with the stepper motor (2-13) control signal and four-phase signal line.

The stepping motor (3) is an 86 full-closed-loop high-speed constant-torque stepping servo motor.

The MCU of the controller module (7) is STM32F103RCT6;

The stepper motor driver (4) is a closed loop driver HBS86H.

The communication module (8) is an RS232 to TTL module.

The communication module (8) can realize two-way communication between the controller module (7) and the PH force gauge (2-4), and the PA9 pin of the MCU of the controller module (7) is connected to the RXD pin of the communication module (8), The PA10 pin of the MCU is connected to the TXD pin of the communication module (8), the other end of the communication module (8) is connected to the nine-pin male port, and then connected to the PH tension gauge (2-4).

The image microscope module adopts a continuous zoom objective (2-18), and the adjustment range of the continuous zoom objective (2-18) is 3 to 30×; the gear ring A (2-19) is fixed on the continuous zoom objective (2-19). 2-18), and fix a gear B (2-23) on the rotating shaft of the DC micro-control motor (2-22), and realize automatic zooming by controlling the rotation of the DC micro-control motor (2-22). The continuously variable magnification objective (2-18) and CCD camera (2-20) can image the separation process of the bonding material through a mirror (2-17) placed at 45 degrees; CCD camera (2-20) and DC The micro-control motor (2-22) is fixed on the support plate (2-21). The CCD camera (2-20) and the DC micro-control motor (2-22) are then transmitted to the computer (1) through the data line for observation and analysis. The computer (1) analyzes the obtained information and feeds back the focusing information to the A controller module (7), the controller module (7) controls the DC micro-control motor (2-22) to rotate and focus to form a closed-loop automatic focus function.

The working distance of the continuously variable magnification objective lens (2-18) is 293mm, and the magnification is 0.7×.

As shown in Figure 3, firstly, initialize and configure the embedded chip function of the tension meter. When the tension test is to be performed, control the rotation of the screw rod by the manual button, move it to the starting position, and use the material fixture A (2-2) and the material Fixture B ((2-3) clamps the material to be tested for tensile test; then input the parameters of the laser processing of the material to be tested, including the scanning speed of the laser, the number of pulses of the excimer laser, and the energy intensity of the laser irradiation, according to the information Output the recommended stepper motor speed, and the stepper motor speed can be changed according to the test situation, so as to obtain the best test effect. Then, when the limit switch or the peak pull force is reached, the motor pull force test is to close the timer. Interrupt. Then in the main program loop, use the serial port to obtain the focusing information of the objective lens from the computer, and then control the DC micro-control motor to adjust the focus to form a closed-loop adjustment of the zoom objective lens. Then, the timer interrupt is a 20ms interrupt response service. In In the interrupt response service, the work carried out is to complete the reading of the PH tension meter data by the embedded chip, process the data format of the communication content and extract the key information of the tension value, and then calculate the extracted tension value and the driving frequency according to the driving frequency. The distance is drawn, and it is drawn on the TFT LCD screen in real time to form a curve diagram, and then the real-time ratio of the pulling force and the laser parameters is output to provide a reference for the adhesion separation experiment. Finally, configure the PWM in the embedded chip STM32F103RCT6 to make the pin PA8 Output PWM, provide pulse frequency for HBS86H all-digital closed-loop stepper driver, and drive the motor to work. In this way, the tensile test work is carried out in a cycle.

The computer (1) uses the CCD lens to collect the separation process of the tested material in real time, and obtains its process microscopic image, and then uses the computer to remove noise, enhance, restore, segment, and extract features from the image, and finally obtain the required inspection data. and micrographs to provide analytical data for adhesion testing.

The device can overcome the shortcomings of the general tensile testing machine, and provide the original data and regularity curve of the continuous process of the experiment and the bond separation for the study of the influence of excimer laser pretreatment on the bond strength of various materials and the mechanism of laser micromachining. The microscopic image data of the mode, thus promoting the modern and advanced development of the adhesive force experimental device.

Claims (7)

1. The device for realizing the method comprises a tensile machine (3), a stepping motor driver module (10), a controller module (7), a communication module (8) and an image microscopic module, wherein the stepping motor driver module (10) comprises a stepping motor driver (4) and an L298 driving module (5); the power supply lines and the control lines of the stepping motors (2-13) of the tensile machine (3) are connected with a stepping motor driver (4); a control line of the stepping motor driver (4) is connected with the L298 driving module (5); the control line of the controller module (7) is connected with the L298 driving module (5); a serial communication line of the controller module (7) is connected with the communication module (8); the communication module (8) is connected with 232 communication lines of the PH tension meters (2-4); the image microscopic module comprises a computer (1) and a CCD camera (2), and the computer (1) is connected with the CCD camera (2) through a data line; the CCD camera (2) corresponds to the reflecting mirrors (2-17); a TFT liquid crystal screen (6) is arranged in the middle of the controller module (7);

the tensile machine (3) comprises a steel plate base (2-1), a material clamp A (2-2), a material clamp B (2-3) and a PH tension meter (2-4); the material clamp A (2-2) is arranged on the steel plate base (2-1), and the material clamp B (2-3) is arranged on the PH tension meter (2-4); the PH tension meter (2-4) is arranged on the fixed transverse beam (2-9), the cylindrical beam A (2-6) and the cylindrical beam B (2-8) are both arranged on the steel plate base (2-1), and the fixed transverse beam (2-9) can slide along the cylindrical beam A (2-6) and the cylindrical beam B (2-8); the stepping motors (2-13) are communicated with the couplers (2-5) to drive the screw rods in the screw rod sleeve sets (2-7) to rotate; an upper platform steel plate A (2-12) is fixed on an upper platform steel plate B (2-24) through four small pillars (2-10), the upper platform steel plate B (2-24) is fixed on a top cross beam (2-11), and the top cross beam (2-11) is respectively connected and fixed with a cylindrical beam A (2-6) and a cylindrical beam B (2-8); when a large-torque high-precision stepping motor is adopted to rotate, a lead screw in a lead screw sleeve set (2-7) can be driven to rotate, the lead screw rotates to drive a fixed transverse beam (2-9) to move, and further, a PH tension meter (2-4) is driven to integrally move, so that electric uniform power is provided for a bonding force separation experiment; the iron bars (2-14) are fixed on the upper platform steel plate B (2-24), and the upper travel limit switches (2-15) and the lower travel limit switches (2-16) are arranged on the iron bars (2-14);

a PA8 pin of the MCU of the controller module (7) outputs PWM, and experiments show that when the parameter of the PWM is 8K, the frequency duty ratio is 50%, the separation speed effect is optimal, and no step loss occurs, and the PA8 pin is connected with an IN1 pin of the L298 driving module (5); the controller module (7) outputs signals for controlling the forward and reverse rotation of the stepping motors (2-13) and is controlled by a PA4 pin and a PA5 pin, and the PA4 pin and the PA5 pin are respectively connected with an IN2 pin and an IN3 pin of the L298 driving module (5); the L298 driving module (5) realizes level amplification and driving current amplification, so that the control signal levels of the stepping motor driver (4) and the controller module (7) are matched; an OUT1 pin of the L298 drive module (5) is connected with a PUL-pin of the stepping motor driver (4), a PUL + pin of the stepping motor driver (4) is connected with a high level, a DIR + pin of the stepping motor driver (4) is connected with an OUT2 pin of the L298 drive module (5), and a DIR-pin of the stepping motor driver (4) is connected with an OUT3 pin of the L298 drive module (5); then, the stepping motor driver (4) and the control signals of the stepping motors (2-13) are connected with the four-phase signal wire;

the image microscopic module adopts one continuous zoom objective lens (2-18), and the adjusting range of the continuous zoom objective lens (2-18) is 3-30 x; the gear ring A (2-19) is fixed on the continuous zoom objective lens (2-18), a gear B (2-23) is fixed on a rotating shaft of the direct current micro-control motor (2-22), and automatic zooming is realized by controlling the direct current micro-control motor (2-22) to rotate; the separation process of the bonding materials by the continuous variable-magnification objective lens (2-18) and the CCD camera (2-20) can be subjected to micro-imaging through a reflector (2-17) arranged at 45 degrees; the CCD camera (2-20) and the direct current micro control motor (2-22) are fixed on the support plate (2-21); the CCD cameras (2-20) and the direct current micro-control motors (2-22) are transmitted to the computer (1) through data lines to be displayed so as to be observed and analyzed, the computer (1) analyzes the obtained information and feeds the focusing information back to the controller module (7), and the controller module (7) controls the direct current micro-control motors (2-22) to rotate and focus to form a closed-loop automatic focusing function;

the method is characterized in that:

firstly, initializing the embedded chip function of a tension meter, when a tension test is to be carried out, controlling the rotation of a lead screw through a manual key to move to a starting position, clamping a material to be tested by a material clamp A (2-2) and a material clamp B ((2-3) to carry out the tension test, then inputting laser processing parameters of the material to be tested, wherein the parameters comprise the scanning speed of laser, the pulse number of excimer laser and the laser irradiation energy intensity, outputting the recommended rotating speed of a stepping motor according to the information, and the rotating speed of the stepping motor can be changed according to the test condition, then, when a limit switch is reached or the peak tension is reached, the motor tension test is closed, a timer is interrupted, then, in a main program cycle, obtaining the focusing information of a computer about an objective lens by using a serial port, then controlling a direct-current micro-control motor to form closed-loop adjustment variable-time objective focusing, and then, timer interrupts are 20ms once interrupt response services; in the interruption response service, the embedded chip reads the data of the PH tension meter, performs data format processing on the communication content, extracts key information of the tension value, draws the extracted tension value and the pull-apart distance obtained by calculation according to the driving frequency on a TFT (thin film transistor) liquid crystal display screen in real time to form a curve trend graph, outputs the real-time transformation ratio of the tension and the laser parameters, and provides reference for a bonding force separation experiment; finally, PWM is configured in an embedded chip STM32F103RCT6 to enable a pin PA8 to output PWM, pulse frequency is provided for an HBS86H all-digital closed-loop stepping driver, and a driving motor works; the tensile test is carried out in such a circulating way;

the computer (1) collects the separation process of the tested material by using the CCD lens in real time to obtain a process microscopic image, then the image is subjected to noise removal, enhancement, restoration, segmentation and feature extraction through the computer, and finally required various detection data and microscopic images are obtained to provide analysis data for the adhesion force test.

2. The method for automatically detecting the bonding force of the excimer laser micro-machining device as claimed in claim 1, wherein: the stepping motors (2-13) are 86 full-closed-loop high-speed constant-torque stepping servo motors.

3. The method for automatically detecting the bonding force of the excimer laser micro-machining device as claimed in claim 1, wherein: the MCU of the controller module (7) is STM32F103RCT 6.

4. The method for automatically detecting the bonding force of the excimer laser micro-machining device as claimed in claim 1, wherein: the stepper motor driver (4) is a closed loop driver HBS 86H.

5. The method for automatically detecting the bonding force of the excimer laser micro-machining device as claimed in claim 1, wherein: the communication module (8) is an RS232 to TTL module.

6. The method for automatically detecting the bonding force of the excimer laser micro-machining device as claimed in claim 1, wherein: the communication module (8) can realize bidirectional communication between the controller module (7) and the PH tension meter (2-4), a PA9 pin of an MCU of the controller module (7) is connected with an RXD pin of the communication module (8), a PA10 pin of the MCU is connected with a TXD pin of the communication module (8), and the other end of the communication module (8) is connected with a nine-pin male port and then connected with the PH tension meter (2-4).

7. The method for automatically detecting the bonding force of the excimer laser micro-machining device as claimed in claim 1, wherein: the working distance of the continuous variable-power objective lens (2-18) is 293mm, and the magnification is 0.7 x.

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