CN108254309B - Automatic bonding force detection device and method for excimer laser micromachining device - Google Patents
Automatic bonding force detection device and method for excimer laser micromachining device Download PDFInfo
- Publication number
- CN108254309B CN108254309B CN201810197403.8A CN201810197403A CN108254309B CN 108254309 B CN108254309 B CN 108254309B CN 201810197403 A CN201810197403 A CN 201810197403A CN 108254309 B CN108254309 B CN 108254309B
- Authority
- CN
- China
- Prior art keywords
- pin
- module
- stepping motor
- tension
- excimer laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N19/00—Investigating materials by mechanical methods
- G01N19/04—Measuring adhesive force between materials, e.g. of sealing tape, of coating
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
Abstract
The invention discloses an automatic bonding force detection device and method for an excimer laser micromachining device, and belongs to the field of physics and mechanics detection. The device utilizes an electronic tension sensor technology and a machine vision technology, and adopts an embedded microcontroller to test the bonding strength of the material, so as to obtain a relationship curve trend chart of tension and displacement, which takes the separation distance of the bonding material as a horizontal coordinate and takes mechanical data as a vertical coordinate. When the transparent adhesive is used, different microscopic images under the separation of adhesive and material are obtained, and original data information of the continuous process of the experiment is provided for researching the regularity of the excimer laser pretreatment on the bonding strength of various materials and the laser micromachining mechanism. The invention is mainly suitable for testing the change regularity explanation of multiple physical quantities of various non-brittle bonding materials processed by excimer laser under the condition that the bonding materials are bonded by the same or different adhesives.
Description
Technical Field
The invention relates to an automatic detection and analysis device for adhesion force, belongs to the field of physics and mechanics detection, and particularly relates to adhesion.
Background
The phenomenon of sticking is associated with many areas of science and technology and has become an important area of research in recent years. The proper surface treatment method that the bonding material can apply to has a great effect on the quality and quantity of the adhesive. To obtain excellent durability and adhesive strength of various adhesive materials, preparation of the surface before bonding (pretreatment of the adhesive member) is necessary. Surface treatment removes weak edge layers, cleans the surface, alters the surface energy (primarily through oxidation), and improves the microscopic morphological features of the surface. The net effect of these changes is to enhance the surface bonding, mechanical interlocking of the adhesive and the ability to resist moisture and moisture induced degradation.
Since the invention of excimer laser in 1975, excimer laser has been widely used in the industrial field with the progress of technology. Lasers are used to modify the characteristics of the surface of materials to accommodate a variety of industrial applications including adhesive properties. Laser processing is efficient for many materials and is very precise to control, only the surface is affected and there is no adverse effect on the bulk. Laser-treated polymers have high localisation and accuracy, where the adhesive article can be left for a long time between treatment and adhesive or coating application, and treated at room temperature and in air, without the need for special circumstances. Excimer laser Ultraviolet (UV) irradiation provides a new pre-bond surface treatment and surface modification technique that can treat a variety of materials and bonds, which can replace the conventional chemical etching and grinding treatments that are not eco-friendly. Many experimental results show that uv laser surface treatment and modification greatly improve the shear, tensile and peel strength of the bond, as well as the strength, wear, conductivity and appearance.
Electromagnetic waves from 200-150nm are defined as extreme ultraviolet radiation. The narrow band (from 200-180nm) is a feasible and efficient area for photochemical modification of the polymer; the energy of the light exceeds the strength of the chemical bonds of most typical organic polymers and is therefore very efficient in generating photochemical reactions. Almost all organic compounds (except saturated aliphatic hydrocarbons and fluorocarbons) have strong absorption in this region. It has been determined that this radiation has an absorption intensity of 95% at about 300nm through the organic polymer. The absorption of photons by polymers obeys beer's law. The results show that there is a large number of chemical bond breaks in the irradiation range. Typically, the organic molecule irradiation lifetime is on the order of one millionth of a second over this wavelength range. The breaking of the polymer chains is often accompanied by a recombination process, thus reflecting the degradation resulting from the loss of small gas molecules (CO, CO2, H2) and the breaking of the linear structure of the polymer as a final result. The surface of the material is modified by UV laser, and a targeted cementing tension test needs to be carried out to obtain the optimal adhesive force laser processing parameters.
At present, a tensile testing machine, also known as a universal material testing machine, is used for physical and mechanical tensile tests. The universal tester is a mechanical stress tester for testing mechanical properties such as static load, stretching, compression, bending, shearing, tearing, peeling and the like of instruments and equipment aiming at various materials, is suitable for testing various physical and mechanical properties of materials such as plastic plates, pipes, profiled bars, plastic films, rubber, electric wires, cables, steel, glass fibers and the like, is material development, and is indispensable detection equipment for physical tests, teaching research, quality control and the like.
However, on the premise of studying the influence regularity of excimer laser pretreatment on the bonding strength and the laser micromachining mechanism of various materials, the following disadvantages are encountered in the experiment of the universal material testing machine described above:
1. during the experiment of the universal material testing machine, only single separation moment mechanics data can be obtained, and no detailed data record is available for the process. Particularly, when the separation distance and the separation time of the bonding material are abscissa, continuous process data with mechanical data as ordinate cannot be obtained, so that the study on the influence regularity of excimer laser pretreatment on the bonding strength and the laser micromachining mechanism of various materials is seriously hindered.
2. When the material is bonded by using transparent glue and then a bonding force test is carried out, the difference and the difference of the glue and the material separation state cannot be microscopically and visually seen. This also hinders the study of the regularity of the influence of excimer laser pretreatment of various materials on the bonding strength and the laser micromachining mechanism from the viewpoint of image microscopy.
The optimum UV laser processing parameters (intensity, cycling rate, number of pulses) are related to the substrate material and its chemical properties. In order to realize microscopic observation in the process of bond failure and provide visual data by qualitative analysis of UV laser processing parameters, the experimental device adopts a machine vision technology.
Machine vision combines computer image processing technology with modern light sensing technology, applies light-sensitive microscopic image processing technology to aspects of color identification, contour extraction, position measurement, image microscopy and the like, and is an advanced technology in the field of artificial intelligence. In order to solve the problems, the invention provides a brand-new microscopic adhesion experimental device based on machine vision. The device utilizes machine vision technology on the basis of using an electronic tension sensor and an embedded microprocessor, can overcome the defects of the general tension tester, provides original data and a regularity curve of a continuous process of an experiment and microscopic image data of a bonding separation mode for researching the influence regularity of excimer laser pretreatment of various materials on bonding strength and a laser micromachining mechanism, and further promotes the modernized advanced development of a bonding force experimental device.
Disclosure of Invention
The invention aims to solve the problem that in an experiment, excimer laser carries out micro-processing on the surface of a device, and the bonding force of the device needs to be detected and analyzed in a targeted mode. The device utilizes an electronic tension sensor technology and a machine vision technology, and adopts an embedded microcontroller to test the bonding strength of the material, so as to obtain a relationship curve trend chart of tension and displacement, which takes the separation distance of the bonding material as a horizontal coordinate and takes mechanical data as a vertical coordinate. When the transparent adhesive is used, different microscopic images under the separation of adhesive and material are obtained, and original data information of the continuous process of the experiment is provided for researching the regularity of the excimer laser pretreatment on the bonding strength of various materials and the laser micromachining mechanism.
The invention is mainly suitable for testing the bonding strength of various non-brittle bonding materials processed by excimer laser under the condition that the same or different adhesives are bonded, and performing multiple physical quantity change regularity explanation on the bonding strength, including the detection of the interdependence relation between the displacement and the tension of the bonding materials in the process of pulling the bonding materials apart, the bonding strength and the micro process of the damage of the bonding materials.
In order to achieve the above object, the present invention adopts the following technical solutions.
Automatic detection device for binding power of excimer laser micromachining device, which is characterized in that: the device comprises a tensile machine (3), a stepping motor driver module (10), a controller module (7), a communication module (8) and an image microscopic module, wherein the stepping motor driver module (10) comprises a stepping motor driver (4) and an L298 driving module (5). The power supply lines and the control lines of the stepping motors (2-13) of the tensile machine (3) are connected with a stepping motor driver (4); a control line of the stepping motor driver (4) is connected with the L298 driving module (5); the control line of the controller module (7) is connected with the L298 driving module (5); a serial communication line of the controller module (7) is connected with the communication module (8); the communication module (8) is connected with 232 communication lines of the PH tension meters (2-4); the image microscopic module comprises a computer (1) and a CCD camera (2), and the computer (1) is connected with the CCD camera (2) through a data line. The CCD camera (2) corresponds to the reflecting mirrors (2-17). The middle of the controller module (7) is provided with a TFT liquid crystal screen (6).
The tensile machine (3) comprises a steel plate base (2-1), a material clamp A (2-2), a material clamp B (2-3) and a PH tension meter (2-4); the material clamp A (2-2) is arranged on the steel plate base (2-1), and the material clamp B (2-3) is arranged on the PH tension meter (2-4); the PH tension meter (2-4) is arranged on the fixed transverse beam (2-9), the cylindrical beam A (2-6) and the cylindrical beam B (2-8) are both arranged on the steel plate base (2-1), and the through holes of the cylindrical beam A (2-6), the cylindrical beam B (2-8) and the fixed transverse beam (2-9) can slide; the stepping motors (2-13) are communicated with the couplers (2-5) to drive the screw rods in the screw rod sleeve sets (2-7) to rotate; the upper platform steel plate A (2-12) is fixed on the upper platform steel plate B (2-24) through four small pillars (2-10), the upper platform steel plate B (2-24) is fixed on the top cross beam (2-11), and the top cross beam (2-11) is fixedly connected with the cylindrical beam A (2-6) and the cylindrical beam B (2-8). When a stepping motor with large force distance and high precision is adopted to rotate, a lead screw in a lead screw sleeve set (2-7) can be driven to rotate, the lead screw rotates to drive a fixed transverse beam (2-9) to move, and then a PH tension meter (2-4) is driven to integrally move, so that electric constant-speed power is provided for a bonding force separation experiment, manpower can be replaced, and instability of the manpower can be compensated. The iron bars (2-14) are fixed on the upper platform steel plate B (2-24), and the upper travel limit switches (2-15) and the lower travel limit switches (2-16) are arranged on the iron bars (2-14) to prevent the PH tension meter (2-4) from generating mechanical collision when the screw rod rotates to the end of a travel, so that the safe operation of the adhesion testing device is ensured.
A PA8 pin of the MCU of the controller module (7) outputs PWM, experiments show that when the parameter of the PWM is 8K, the frequency duty ratio is 50%, the separation speed effect is the best and the loss condition cannot occur, and the PA8 pin is connected with an IN1 pin of the L298 driving module (5); the controller module (7) outputs signals for controlling the forward and reverse rotation of the stepping motors (2-13) and is controlled by a PA4 pin and a PA5 pin, and the PA4 pin and the PA5 pin are respectively connected with an IN2 pin and an IN3 pin of the L298 driving module (5); the L298 driving module (5) realizes level amplification and driving current amplification, so that the control signal levels of the stepping motor driver (4) and the controller module (7) are matched; an OUT1 pin of the L298 drive module (5) is connected with a PUL-pin of the stepping motor driver (4), a PUL + pin of the stepping motor driver (4) is connected with a high level, a DIR + pin of the stepping motor driver (4) is connected with an OUT2 pin of the L298 drive module (5), and a DIR-pin of the stepping motor driver (4) is connected with an OUT3 pin of the L298 drive module (5); then, the stepping motor driver (4) and the control signals of the stepping motors (2-13) are connected with the four-phase signal wire.
The stepping motor (3) is a 86 full-closed loop high-speed constant-torque stepping servo motor.
The MCU of the controller module (7) is STM32F103RCT 6;
the stepper motor driver (4) is a closed loop driver HBS 86H.
The communication module (8) is an RS232 to TTL module.
The communication module (8) can realize bidirectional communication between the controller module (7) and the PH tension meter (2-4), a PA9 pin of an MCU of the controller module (7) is connected with an RXD pin of the communication module (8), a PA10 pin of the MCU is connected with a TXD pin of the communication module (8), and the other end of the communication module (8) is connected with a nine-pin male port and then connected with the PH tension meter (2-4).
The image microscopic module adopts one continuous zoom objective lens (2-18), and the adjusting range of the continuous zoom objective lens (2-18) is 3-30 x; the gear ring A (2-19) is fixed on the continuous zoom objective lens (2-18), a gear B (2-23) is fixed on a rotating shaft of the direct current micro-control motor (2-22), and automatic zooming is realized by controlling the direct current micro-control motor (2-22) to rotate. The separation process of the bonding materials by the continuous variable-magnification objective lens (2-18) and the CCD camera (2-20) can be subjected to micro-imaging through a reflector (2-17) arranged at 45 degrees; the CCD camera (2-20) and the direct current micro control motor (2-22) are fixed on the support plate (2-21). The CCD cameras (2-20) and the direct current micro-control motors (2-22) are transmitted to the computer (1) through data lines to be displayed so as to be observed and analyzed, the computer (1) analyzes the obtained information and feeds the focusing information back to the controller module (7), and the controller module (7) controls the direct current micro-control motors (2-22) to rotate and focus to form a closed-loop automatic focusing function.
The working distance of the continuous variable-power objective lens (2-18) is 293mm, and the magnification is 0.7 x.
The method for automatically detecting the binding force of the excimer laser micromachining-oriented device is characterized by comprising the following steps of:
firstly, initializing the embedded chip function of a tension meter, when a tension test is to be carried out, controlling the rotation of a screw rod through a manual key to move to a starting position, clamping a material to be tested by a material clamp A (2-2) and a material clamp B ((2-3) to carry out the tension test, then inputting the parameters of laser processing of the material to be tested, including the scanning speed of laser, the pulse number of excimer laser and the laser irradiation energy intensity, outputting the recommended rotating speed of a stepping motor according to the information, and changing the rotating speed of the stepping motor according to the test condition to obtain the best test effect, then, reaching a main program limit switch or reaching the peak tension, namely closing a timer to interrupt, then obtaining the focusing information of a computer about an objective lens by using a serial port in a cycle, and then controlling a direct current micro-control motor to focus, and forming closed-loop adjustment zoom objective focusing. The timer interrupt is then a 20ms once interrupt response service. In the interruption response service, the embedded chip reads the data of the PH tension meter, performs data format processing on the communication content, extracts key information of the tension value, draws the extracted tension value and the pull-apart distance obtained by calculation according to the driving frequency on a TFT (thin film transistor) liquid crystal display screen in real time to form a curve trend graph, outputs the real-time transformation ratio of the tension and the laser parameters, and provides reference for the adhesion separation experiment. And finally, PWM is configured in an embedded chip STM32F103RCT6 to enable a pin PA8 to output PWM, so that pulse frequency is provided for an HBS86H all-digital closed-loop stepping driver, and the motor is driven to work. And repeating the steps for each tensile test.
The computer (1) collects the separation process of the tested material by using the CCD lens in real time to obtain a process microscopic image, then the image is subjected to noise removal, enhancement, restoration, segmentation, feature extraction and the like by the computer, and finally required various detection data and microscopic images are obtained to provide analysis data for the adhesion force test.
The device can overcome the defects of a general tensile testing machine, provides original data and regularity curves of the continuous process of the experiment and microscopic image data of a bonding separation mode for researching the influence regularity of excimer laser pretreatment of various materials on bonding strength and a laser micromachining mechanism, and promotes the modernized advanced development of a bonding force experimental device.
Compared with the prior art, the design clearly records the test process and the result of the bonding strength, can observe and shoot the drawing instant picture, analyze the microscopic change of the material and the glue during separation, and can record the numerical change of the tension in the drawing process;
2. the device can also be used for testing the bonding strength of different adhesives or the bonding strength of materials under different bonding surface treatment technologies, recording the experimental process, and measuring the tensile force and the pulling degree in real time.
3. Powerful original data are provided for analyzing and obtaining the corresponding relation between the processing parameters (strength, circulation rate and pulse number) of the optimal excimer laser surface treatment and the bonding force of the modified base material.
Drawings
FIG. 1 is a view showing the structure of the whole apparatus of the present invention.
Fig. 2 is a tension meter of the present invention.
Fig. 3 is a flow chart of the operation of the present invention.
In the figure: 1. a computer, 2, a CCD camera, 3, a tensile machine, 4, a stepping motor driver, 5, an L298 driving module, 6, a TFT liquid crystal screen, 7, a controller module, 8, an RS 232-TTL module, 9, a tension meter, 10, a stepping motor driver module, 2-1, a steel plate base, 2-2, material clamps A, 2-3, material clamps B, 2-4, a PH tension meter, 2-5, a coupler, 2-6, a cylindrical beam A, 2-7, a lead screw sleeve group, 2-8, a cylindrical beam B, 2-9, a fixed transverse beam, 2-10, a small strut, 2-11, a top beam, 2-12, an upper platform steel plate A, 2-13, a stepping motor, 2-14, an iron bar, 2-15, an upper stroke limit switch, 2-16 and a lower stroke limit switch, 2-17 parts of a reflector, 2-18 parts of a continuous zoom objective lens, 2-19 parts of a gear ring A, 2-20 parts of a CCD camera, 2-21 parts of a support plate, 2-22 parts of a direct current micro-control motor, 2-23 parts of a gear B, 2-24 parts of a gear B and a platform steel plate B.
Detailed Description
The following describes embodiments of the present invention in detail with reference to the accompanying drawings, and fig. 1 is a structural diagram of an overall apparatus of a tensile machine.
As shown in fig. 1 and fig. 2, the device for automatically detecting the bonding force of the excimer laser micromachining device comprises a tensile machine (3), a stepping motor driver module (10), a controller module (7), a communication module (8) and an image microscopy module, wherein the stepping motor driver module (10) comprises a stepping motor driver (4) and an L298 driving module (5). The power supply lines and the control lines of the stepping motors (2-13) of the tensile machine (3) are connected with a stepping motor driver (4); a control line of the stepping motor driver (4) is connected with the L298 driving module (5); the control line of the controller module (7) is connected with the L298 driving module (5); a serial communication line of the controller module (7) is connected with the communication module (8); the communication module (8) is connected with 232 communication lines of the PH tension meters (2-4); the image microscopic module comprises a computer (1) and a CCD camera (2), and the computer (1) is connected with the CCD camera (2) through a data line. The CCD camera (2) corresponds to the reflecting mirrors (2-17). The middle of the controller module (7) is provided with a TFT liquid crystal screen (6).
The tensile machine (3) comprises a steel plate base (2-1), a material clamp A (2-2), a material clamp B (2-3) and a PH tension meter (2-4); the material clamp A (2-2) is arranged on the steel plate base (2-1), and the material clamp B (2-3) is arranged on the PH tension meter (2-4); the PH tension meter (2-4) is arranged on the fixed transverse beam (2-9), the cylindrical beam A (2-6) and the cylindrical beam B (2-8) are both arranged on the steel plate base (2-1), and the through holes of the cylindrical beam A (2-6), the cylindrical beam B (2-8) and the fixed transverse beam (2-9) can slide; the stepping motors (2-13) are communicated with the couplers (2-5) to drive the screw rods in the screw rod sleeve sets (2-7) to rotate; the upper platform steel plate A (2-12) is fixed on the upper platform steel plate B (2-24) through four small pillars (2-10), the upper platform steel plate B (2-24) is fixed on the top cross beam (2-11), and the top cross beam (2-11) is fixedly connected with the cylindrical beam A (2-6) and the cylindrical beam B (2-8). When a stepping motor with large force distance and high precision is adopted to rotate, a lead screw in a lead screw sleeve set (2-7) can be driven to rotate, the lead screw rotates to drive a fixed transverse beam (2-9) to move, and then a PH tension meter (2-4) is driven to integrally move, so that electric constant-speed power is provided for a bonding force separation experiment, manpower can be replaced, and instability of the manpower can be compensated. The iron bars (2-14) are fixed on the upper platform steel plate B (2-24), and the upper travel limit switches (2-15) and the lower travel limit switches (2-16) are arranged on the iron bars (2-14) to prevent the PH tension meter (2-4) from generating mechanical collision when the screw rod rotates to the end of a travel, so that the safe operation of the adhesion testing device is ensured.
A PA8 pin of the MCU of the controller module (7) outputs PWM, experiments show that when the parameter of the PWM is 8K, the frequency duty ratio is 50%, the separation speed effect is the best and the loss condition cannot occur, and the PA8 pin is connected with an IN1 pin of the L298 driving module (5); the controller module (7) outputs signals for controlling the forward and reverse rotation of the stepping motors (2-13) and is controlled by a PA4 pin and a PA5 pin, and the PA4 pin and the PA5 pin are respectively connected with an IN2 pin and an IN3 pin of the L298 driving module (5); the L298 driving module (5) realizes level amplification and driving current amplification, so that the control signal levels of the stepping motor driver (4) and the controller module (7) are matched; an OUT1 pin of the L298 drive module (5) is connected with a PUL-pin of the stepping motor driver (4), a PUL + pin of the stepping motor driver (4) is connected with a high level, a DIR + pin of the stepping motor driver (4) is connected with an OUT2 pin of the L298 drive module (5), and a DIR-pin of the stepping motor driver (4) is connected with an OUT3 pin of the L298 drive module (5); then, the stepping motor driver (4) and the control signals of the stepping motors (2-13) are connected with the four-phase signal wire.
The stepping motor (3) is a 86 full-closed loop high-speed constant-torque stepping servo motor.
The MCU of the controller module (7) is STM32F103RCT 6;
the stepper motor driver (4) is a closed loop driver HBS 86H.
The communication module (8) is an RS232 to TTL module.
The communication module (8) can realize bidirectional communication between the controller module (7) and the PH tension meter (2-4), a PA9 pin of an MCU of the controller module (7) is connected with an RXD pin of the communication module (8), a PA10 pin of the MCU is connected with a TXD pin of the communication module (8), and the other end of the communication module (8) is connected with a nine-pin male port and then connected with the PH tension meter (2-4).
The image microscopic module adopts one continuous zoom objective lens (2-18), and the adjusting range of the continuous zoom objective lens (2-18) is 3-30 x; the gear ring A (2-19) is fixed on the continuous zoom objective lens (2-18), a gear B (2-23) is fixed on a rotating shaft of the direct current micro-control motor (2-22), and automatic zooming is realized by controlling the direct current micro-control motor (2-22) to rotate. The separation process of the bonding materials by the continuous variable-magnification objective lens (2-18) and the CCD camera (2-20) can be subjected to micro-imaging through a reflector (2-17) arranged at 45 degrees; the CCD camera (2-20) and the direct current micro control motor (2-22) are fixed on the support plate (2-21). The CCD cameras (2-20) and the direct current micro-control motors (2-22) are transmitted to the computer (1) through data lines to be displayed so as to be observed and analyzed, the computer (1) analyzes the obtained information and feeds the focusing information back to the controller module (7), and the controller module (7) controls the direct current micro-control motors (2-22) to rotate and focus to form a closed-loop automatic focusing function.
The working distance of the continuous variable-power objective lens (2-18) is 293mm, and the magnification is 0.7 x.
As shown in figure 3, firstly, the embedded chip function of the tension meter is initialized and configured, when a tension test is to be carried out, the rotation of a screw rod is controlled by a manual key to move to a starting position, a material clamp A (2-2) and a material clamp B ((2-3) are used for clamping a tested material to carry out the tension test, then the parameter parameters of laser processing of the tested material including the scanning speed of laser, the pulse number of excimer laser and the laser irradiation energy intensity are input, the recommended rotating speed of a stepping motor is output according to information, and the rotating speed of the stepping motor can be changed according to the test condition so as to obtain the best test effect, then the motor tension test is carried out when a limit switch is reached or the peak tension is reached, namely a timer is closed to be interrupted, then in the main program cycle, the focusing information of an objective lens of a computer is obtained by a serial port, and then controlling a direct current micro-control motor to focus to form closed-loop adjustment zoom objective lens focusing. The timer interrupt is then a 20ms once interrupt response service. In the interruption response service, the embedded chip reads the data of the PH tension meter, performs data format processing on the communication content, extracts key information of the tension value, draws the extracted tension value and the pull-apart distance obtained by calculation according to the driving frequency on a TFT (thin film transistor) liquid crystal display screen in real time to form a curve trend graph, outputs the real-time transformation ratio of the tension and the laser parameters, and provides reference for the adhesion separation experiment. And finally, PWM is configured in an embedded chip STM32F103RCT6 to enable a pin PA8 to output PWM, so that pulse frequency is provided for an HBS86H all-digital closed-loop stepping driver, and the motor is driven to work. And circulating the steps to perform tension testing work.
The computer (1) collects the separation process of the tested material by using the CCD lens in real time to obtain a process microscopic image, then the image is subjected to noise removal, enhancement, restoration, segmentation, feature extraction and the like by the computer, and finally required various detection data and microscopic images are obtained to provide analysis data for the adhesion force test.
The device can overcome the defects of a general tensile testing machine, provides original data and regularity curves of the continuous process of the experiment and microscopic image data of a bonding separation mode for researching the influence regularity of excimer laser pretreatment of various materials on bonding strength and a laser micromachining mechanism, and promotes the modernized advanced development of a bonding force experimental device.
Claims (7)
1. The device for realizing the method comprises a tensile machine (3), a stepping motor driver module (10), a controller module (7), a communication module (8) and an image microscopic module, wherein the stepping motor driver module (10) comprises a stepping motor driver (4) and an L298 driving module (5); the power supply lines and the control lines of the stepping motors (2-13) of the tensile machine (3) are connected with a stepping motor driver (4); a control line of the stepping motor driver (4) is connected with the L298 driving module (5); the control line of the controller module (7) is connected with the L298 driving module (5); a serial communication line of the controller module (7) is connected with the communication module (8); the communication module (8) is connected with 232 communication lines of the PH tension meters (2-4); the image microscopic module comprises a computer (1) and a CCD camera (2), and the computer (1) is connected with the CCD camera (2) through a data line; the CCD camera (2) corresponds to the reflecting mirrors (2-17); a TFT liquid crystal screen (6) is arranged in the middle of the controller module (7);
the tensile machine (3) comprises a steel plate base (2-1), a material clamp A (2-2), a material clamp B (2-3) and a PH tension meter (2-4); the material clamp A (2-2) is arranged on the steel plate base (2-1), and the material clamp B (2-3) is arranged on the PH tension meter (2-4); the PH tension meter (2-4) is arranged on the fixed transverse beam (2-9), the cylindrical beam A (2-6) and the cylindrical beam B (2-8) are both arranged on the steel plate base (2-1), and the fixed transverse beam (2-9) can slide along the cylindrical beam A (2-6) and the cylindrical beam B (2-8); the stepping motors (2-13) are communicated with the couplers (2-5) to drive the screw rods in the screw rod sleeve sets (2-7) to rotate; an upper platform steel plate A (2-12) is fixed on an upper platform steel plate B (2-24) through four small pillars (2-10), the upper platform steel plate B (2-24) is fixed on a top cross beam (2-11), and the top cross beam (2-11) is respectively connected and fixed with a cylindrical beam A (2-6) and a cylindrical beam B (2-8); when a large-torque high-precision stepping motor is adopted to rotate, a lead screw in a lead screw sleeve set (2-7) can be driven to rotate, the lead screw rotates to drive a fixed transverse beam (2-9) to move, and further, a PH tension meter (2-4) is driven to integrally move, so that electric uniform power is provided for a bonding force separation experiment; the iron bars (2-14) are fixed on the upper platform steel plate B (2-24), and the upper travel limit switches (2-15) and the lower travel limit switches (2-16) are arranged on the iron bars (2-14);
a PA8 pin of the MCU of the controller module (7) outputs PWM, and experiments show that when the parameter of the PWM is 8K, the frequency duty ratio is 50%, the separation speed effect is optimal, and no step loss occurs, and the PA8 pin is connected with an IN1 pin of the L298 driving module (5); the controller module (7) outputs signals for controlling the forward and reverse rotation of the stepping motors (2-13) and is controlled by a PA4 pin and a PA5 pin, and the PA4 pin and the PA5 pin are respectively connected with an IN2 pin and an IN3 pin of the L298 driving module (5); the L298 driving module (5) realizes level amplification and driving current amplification, so that the control signal levels of the stepping motor driver (4) and the controller module (7) are matched; an OUT1 pin of the L298 drive module (5) is connected with a PUL-pin of the stepping motor driver (4), a PUL + pin of the stepping motor driver (4) is connected with a high level, a DIR + pin of the stepping motor driver (4) is connected with an OUT2 pin of the L298 drive module (5), and a DIR-pin of the stepping motor driver (4) is connected with an OUT3 pin of the L298 drive module (5); then, the stepping motor driver (4) and the control signals of the stepping motors (2-13) are connected with the four-phase signal wire;
the image microscopic module adopts one continuous zoom objective lens (2-18), and the adjusting range of the continuous zoom objective lens (2-18) is 3-30 x; the gear ring A (2-19) is fixed on the continuous zoom objective lens (2-18), a gear B (2-23) is fixed on a rotating shaft of the direct current micro-control motor (2-22), and automatic zooming is realized by controlling the direct current micro-control motor (2-22) to rotate; the separation process of the bonding materials by the continuous variable-magnification objective lens (2-18) and the CCD camera (2-20) can be subjected to micro-imaging through a reflector (2-17) arranged at 45 degrees; the CCD camera (2-20) and the direct current micro control motor (2-22) are fixed on the support plate (2-21); the CCD cameras (2-20) and the direct current micro-control motors (2-22) are transmitted to the computer (1) through data lines to be displayed so as to be observed and analyzed, the computer (1) analyzes the obtained information and feeds the focusing information back to the controller module (7), and the controller module (7) controls the direct current micro-control motors (2-22) to rotate and focus to form a closed-loop automatic focusing function;
the method is characterized in that:
firstly, initializing the embedded chip function of a tension meter, when a tension test is to be carried out, controlling the rotation of a lead screw through a manual key to move to a starting position, clamping a material to be tested by a material clamp A (2-2) and a material clamp B ((2-3) to carry out the tension test, then inputting laser processing parameters of the material to be tested, wherein the parameters comprise the scanning speed of laser, the pulse number of excimer laser and the laser irradiation energy intensity, outputting the recommended rotating speed of a stepping motor according to the information, and the rotating speed of the stepping motor can be changed according to the test condition, then, when a limit switch is reached or the peak tension is reached, the motor tension test is closed, a timer is interrupted, then, in a main program cycle, obtaining the focusing information of a computer about an objective lens by using a serial port, then controlling a direct-current micro-control motor to form closed-loop adjustment variable-time objective focusing, and then, timer interrupts are 20ms once interrupt response services; in the interruption response service, the embedded chip reads the data of the PH tension meter, performs data format processing on the communication content, extracts key information of the tension value, draws the extracted tension value and the pull-apart distance obtained by calculation according to the driving frequency on a TFT (thin film transistor) liquid crystal display screen in real time to form a curve trend graph, outputs the real-time transformation ratio of the tension and the laser parameters, and provides reference for a bonding force separation experiment; finally, PWM is configured in an embedded chip STM32F103RCT6 to enable a pin PA8 to output PWM, pulse frequency is provided for an HBS86H all-digital closed-loop stepping driver, and a driving motor works; the tensile test is carried out in such a circulating way;
the computer (1) collects the separation process of the tested material by using the CCD lens in real time to obtain a process microscopic image, then the image is subjected to noise removal, enhancement, restoration, segmentation and feature extraction through the computer, and finally required various detection data and microscopic images are obtained to provide analysis data for the adhesion force test.
2. The method for automatically detecting the bonding force of the excimer laser micro-machining device as claimed in claim 1, wherein: the stepping motors (2-13) are 86 full-closed-loop high-speed constant-torque stepping servo motors.
3. The method for automatically detecting the bonding force of the excimer laser micro-machining device as claimed in claim 1, wherein: the MCU of the controller module (7) is STM32F103RCT 6.
4. The method for automatically detecting the bonding force of the excimer laser micro-machining device as claimed in claim 1, wherein: the stepper motor driver (4) is a closed loop driver HBS 86H.
5. The method for automatically detecting the bonding force of the excimer laser micro-machining device as claimed in claim 1, wherein: the communication module (8) is an RS232 to TTL module.
6. The method for automatically detecting the bonding force of the excimer laser micro-machining device as claimed in claim 1, wherein: the communication module (8) can realize bidirectional communication between the controller module (7) and the PH tension meter (2-4), a PA9 pin of an MCU of the controller module (7) is connected with an RXD pin of the communication module (8), a PA10 pin of the MCU is connected with a TXD pin of the communication module (8), and the other end of the communication module (8) is connected with a nine-pin male port and then connected with the PH tension meter (2-4).
7. The method for automatically detecting the bonding force of the excimer laser micro-machining device as claimed in claim 1, wherein: the working distance of the continuous variable-power objective lens (2-18) is 293mm, and the magnification is 0.7 x.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810197403.8A CN108254309B (en) | 2018-03-11 | 2018-03-11 | Automatic bonding force detection device and method for excimer laser micromachining device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810197403.8A CN108254309B (en) | 2018-03-11 | 2018-03-11 | Automatic bonding force detection device and method for excimer laser micromachining device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108254309A CN108254309A (en) | 2018-07-06 |
| CN108254309B true CN108254309B (en) | 2020-11-20 |
Family
ID=62746516
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810197403.8A Active CN108254309B (en) | 2018-03-11 | 2018-03-11 | Automatic bonding force detection device and method for excimer laser micromachining device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108254309B (en) |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2519268Y (en) * | 2001-11-30 | 2002-10-30 | 江苏大学 | Interface bonding strength laser impact quantitative determination device |
| JP4684958B2 (en) * | 2006-06-28 | 2011-05-18 | キヤノン株式会社 | Sheet material information detection apparatus and sheet material processing apparatus |
| CN101441154B (en) * | 2008-12-23 | 2011-05-25 | 华东理工大学 | High precision microscopic fatigue tester |
| CN103728183B (en) * | 2013-10-08 | 2016-02-10 | 广东石油化工学院 | A kind of fragmentation test device based on machine vision and control method thereof |
| CN103512804B (en) * | 2013-10-18 | 2015-09-23 | 徐州工程学院 | Compact tensile testing machine autocontrol method |
| CN204116156U (en) * | 2014-06-05 | 2015-01-21 | 中国建材检验认证集团股份有限公司 | The at the uniform velocity even afterburning tensile and compression testing machine of plane multiple spot |
| CN205091243U (en) * | 2015-11-19 | 2016-03-16 | 哈尔滨理工大学 | Ice of simply taking counter shaft function adheres strength test device |
| CN207036654U (en) * | 2017-04-28 | 2018-02-23 | 华侨大学 | A kind of interface bond strength measurement apparatus of ultra-fine abrasive material and matrix material |
| CN106970022A (en) * | 2017-04-28 | 2017-07-21 | 华侨大学 | A kind of interface bond strength measurement apparatus of ultra-fine abrasive material and matrix material |
| CN107238541B (en) * | 2017-05-08 | 2019-12-10 | 华南理工大学 | accelerated loading device and method for indoor test of pavement materials |
-
2018
- 2018-03-11 CN CN201810197403.8A patent/CN108254309B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN108254309A (en) | 2018-07-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111160158B (en) | Rock image intelligent identification system and method under polarizing microscope | |
| CN104792869B (en) | The Ultrasonic Nondestructive system of low-voltage electrical apparatus electrical contact brazing quality | |
| CN109365998A (en) | Laser soldering device and vision positioning method based on machine vision positioning | |
| CN103868847A (en) | Pressing and tearing device and pressing and tearing method for delaminating rate test | |
| CN108254309B (en) | Automatic bonding force detection device and method for excimer laser micromachining device | |
| CN106363300B (en) | The control method of away rust by laser equipment | |
| CN202928905U (en) | Polymer film material stretching device for in-situ structure detection | |
| WO2013174112A1 (en) | Polarizing plate attachment precision detection device and method | |
| CN107413772A (en) | A kind of laser focal adaptive cleaning line | |
| CN103091181A (en) | Miniature stretching rheological device for in-situ structure detection of polymer film material, and experimental method thereof | |
| CN107030379A (en) | Laser processing head, laser processing device and processing method thereof | |
| CN106623511B (en) | A kind of hydraulic flattening equipment and system | |
| CN1287972C (en) | Tenter device | |
| CN109702332A (en) | The laser processing and laser-processing system of polaroid | |
| CN104639894A (en) | Image focusing method and device for surveillance camera | |
| CN107297945A (en) | A kind of eyeglass coat peeling unit | |
| CN104807570A (en) | Device and method for measuring internal stress of plastic sheet products on basis of ultrasonic lamb waves | |
| CN107065244A (en) | A kind of polarizer sheet sticking method and apparatus | |
| CN203479762U (en) | A-B axis motorized fine adjustment mechanism of six-degree-of-freedom ultrasonic imaging device | |
| CN108031499A (en) | A kind of photoinduction microlayer model that lithium niobate crystal interlayer body chip is cut based on polymethyl methacrylate and C is continuously generated transfer method | |
| US8570471B2 (en) | OCB liquid crystal panel and manufacturing method thereof, and OCB liquid crystal display | |
| CN108195769B (en) | Method and device for evaluating cavitation intensity by metal wire fracture | |
| CN101051107A (en) | Automatic alignment method for coupling light cone and CCD | |
| CN102012552B (en) | Light path automatic adjusting system for multi-window multi-wavelength laser | |
| CN211454156U (en) | Panel repairing device with corona type inner dirt |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |