CN108183082A - A kind of silicon chip load carrier - Google Patents
A kind of silicon chip load carrier Download PDFInfo
- Publication number
- CN108183082A CN108183082A CN201810159865.0A CN201810159865A CN108183082A CN 108183082 A CN108183082 A CN 108183082A CN 201810159865 A CN201810159865 A CN 201810159865A CN 108183082 A CN108183082 A CN 108183082A
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- Prior art keywords
- silicon chip
- card slot
- slot
- carrier
- chip card
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 365
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 364
- 239000010703 silicon Substances 0.000 title claims abstract description 364
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 31
- 239000000969 carrier Substances 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 6
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 3
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 claims description 3
- 229920002530 polyetherether ketone Polymers 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a kind of silicon chip load carriers, belong to wafer cleaning technical.The silicon chip load carrier includes pedestal, first silicon chip carrier and the second silicon chip carrier, first silicon chip carrier and the second silicon chip carrier are symmetricly set on the upper surface of pedestal, the top of first silicon chip carrier is equipped with multiple tracks the first silicon chip card slot, the distance between two neighboring first silicon chip card slot is equal, the top of second silicon chip carrier is equipped with multiple tracks the second silicon chip card slot, the distance between two neighboring second silicon chip card slot is equal, first silicon chip card slot and the second silicon chip card slot correspond, the slot bottom of the slot bottom of first silicon chip card slot and the second silicon chip card slot is in same cambered surface, the radius of cambered surface is equal with the radius for the silicon chip that the load carrier is carried, central angle alpha between first silicon chip card slot and the second silicon chip card slot is less than 180 °.The load carrier is used to jack up the silicon chip in silicon wafer bearing flower basket, works convenient for subsequent Wafer Cleaning.
Description
Technical field
The invention belongs to silicon chip production technical field, more particularly to a kind of silicon chip load carrier.
Background technology
It in silicon chip production process, needs to clean silicon chip, is to be placed on silicon chip in traditional cleaning
It is cleaned in silicon wafer bearing flower basket, in cleaning process, due to blocking for silicon wafer bearing flower basket surrounding side wall, causing cannot
Rapidly and thoroughly silicon chip is cleaned.
Invention content
For the deficiencies in the prior art, the object of the present invention is to provide a kind of silicon chip load carrier, for by silicon
Piece is held up from silicon wafer bearing flower basket, to carry out subsequent cleaning to silicon chip.
The purpose of the present invention is what is be achieved through the following technical solutions：
A kind of silicon chip load carrier, including pedestal, the first silicon chip carrier and the second silicon chip carrier, the first silicon chip carrying
Frame and the second silicon chip carrier are symmetricly set on the upper surface of pedestal, and the top of the first silicon chip carrier is equipped with multiple tracks the
The distance between one silicon chip card slot, adjacent two the first silicon chip card slots are equal, and the top of the second silicon chip carrier is equipped with
Equal, the first silicon chip card slot and second of the distance between multiple tracks the second silicon chip card slot, adjacent two the second silicon chip card slots
Silicon chip card slot corresponds, and the slot bottom of the slot bottom of the first silicon chip card slot and the second silicon chip card slot is in same cambered surface,
What the radius of cambered surface residing for the slot bottom of the slot bottom of the first silicon chip card slot and the second silicon chip card slot was carried with the load carrier
The radius of silicon chip is equal, and the central angle alpha between the first silicon chip card slot and the second silicon chip card slot is less than 180 °.
Corresponding first silicon chip card slot and the second silicon chip card slot can place a silicon chip, the first silicon chip card slot and second
The slot bottom of silicon chip card slot is in same cambered surface, and the radius of silicon chip of the radius of the cambered surface with being placed is equal, so as to
It can effectively be contacted with the outer edge of silicon chip with the slot bottom for ensureing the first silicon chip card slot and the second silicon chip card slot, silicon chip is formed
Effectively support.
Because the load carrier is to jack up silicon chip from silicon wafer bearing flower basket when in use, convenient for silicon chip clamping jaw to silicon chip
Clamping is held up, and the central angle alpha between the first silicon chip card slot and the second silicon chip card slot is less than 180 °.Cause the first silicon chip card slot
Only the lower part of silicon chip is formed with the second silicon chip card slot and is carried, avoids the first silicon chip carrier and the second silicon chip carrier to silicon chip
Clamping jaw, which causes to block, causes silicon chip clamping jaw that can not be held up to silicon chip clamping.
Preferably, the upper surface of the pedestal be equipped with the first locating slot and the second locating slot, first locating slot and
Second locating slot is parallel, and the lower surface of the first silicon chip carrier is equipped with the first convex to match with the first locating slot
Item, first positioning convex strip are stretched in the first locating slot, and the lower surface of the second silicon chip carrier is equipped with determines with second
The second positioning convex strip that position slot matches, second positioning convex strip are stretched in the second locating slot.
First locating slot and the second locating slot, the lower surface of the first silicon chip carrier are set on the upper surface of pedestal
Equipped with the first positioning convex strip to match with the first locating slot, the lower surface of the second silicon chip carrier is equipped with and the second positioning
The second positioning convex strip that slot matches accurately is mounted on the upper table of pedestal convenient for the first silicon chip carrier and the second silicon chip carrier
On face, avoid the occurrence of the first silicon chip carrier and the positioning of the second silicon chip carrier is not allowed and leads to the first silicon chip card slot and the second silicon
Piece card slot can not be effectively matched, so as to cause the first silicon chip card slot and the second silicon chip card slot that cannot accurately carry support to silicon chip
It rises.
Preferably, the first silicon chip card slot and the second silicon chip card slot have 25 or 26.
Preferably, which further includes third silicon chip carrier, and the third silicon chip carrying is erected at the upper of pedestal
On surface, the third silicon chip carrying is erected between the first silicon chip carrier and the second silicon chip carrier, the third silicon chip
Carrier is parallel with the first silicon chip carrier, and the top of the third silicon chip carrier is equipped with multiple tracks third silicon chip card slot, institute
It states third silicon chip card slot and the first silicon chip card slot corresponds.
Preferably, the slot bottom of the third silicon chip card slot is on same plane, and the slot of the third silicon chip card slot
Plane where bottom and the cambered surface where the slot bottom of the first silicon chip card slot are tangent.
The slot bottom of the third silicon chip card slot is on same plane, and where the slot bottom of the third silicon chip card slot
Plane and the cambered surface where the slot bottom of the first silicon chip card slot are tangent, it is ensured that the first silicon chip card slot and the second silicon chip card slot are to silicon
When piece forms picking-up, the slot bottom of third silicon chip card slot, which can also be formed silicon chip, to be held up, and is increased the forced area of silicon chip, is avoided silicon
Piece leads to stress concentration phenomenon occur due to unbalance stress.
Preferably, the slot bottom of the third silicon chip card slot is in same cambered surface, and the slot of the third silicon chip card slot
Cambered surface where bottom is overlapped with the cambered surface where the slot bottom of the first silicon chip card slot.
The slot bottom of the third silicon chip card slot is in same cambered surface, and where the slot bottom of the third silicon chip card slot
Cambered surface is overlapped with the cambered surface where the slot bottom of the first silicon chip card slot, it is ensured that the first silicon chip card slot and the second silicon chip card slot are to silicon
When piece is held up, the slot bottom of third silicon chip card slot can also form silicon chip and hold up, and increase the forced area of silicon chip, avoid silicon chip because
Unbalance stress and lead to stress concentration phenomenon occur.
Preferably, the upper surface of the pedestal is equipped with third locating slot, the third locating slot and the first locating slot phase
Parallel, the lower end of the third silicon chip carrier is stretched in third locating slot.
Preferably, the first silicon chip carrier, the second silicon chip carrier and third silicon chip carrier pass through with pedestal
It is bolted.
Preferably, the first silicon chip carrier, the second silicon chip carrier, third silicon chip carrier and pedestal are U-PVC materials
Matter or PEEK materials.
Preferably, the pedestal is equipped with multiple mounting holes.
Preferably, the groove width of the first silicon chip card slot and the groove width of the second silicon chip card slot with the thickness of the silicon chip carried
It spends equal.
The thickness of the silicon chip of the groove width of the first silicon chip card slot and the groove width of the second silicon chip card slot with being carried is equal,
It can effectively prevent carried silicon chip run-off the straight phenomenon.
Preferably, the thickness of silicon chip of the groove width of the third silicon chip card slot with being carried is equal.
The thickness of silicon chip of the groove width of the third silicon chip card slot with being carried is equal, can effectively prevent what is carried
Silicon chip run-off the straight phenomenon.
Preferably, chamfered is passed through in the notch both sides of the first silicon chip card slot and the second silicon chip card slot.
The notch both sides of the first silicon chip card slot and the second silicon chip card slot by chamfered, make the first silicon chip card slot
It is more than the thickness of silicon chip with the width of rebate of the second silicon chip card slot, the first silicon chip card slot and the second silicon chip card is stretched to convenient for silicon chip
In slot.
Preferably, chamfered is passed through in the notch both sides of the third silicon chip card slot.
The notch both sides of the third silicon chip card slot by chamfered, are more than the width of rebate of third silicon chip card slot
The thickness of silicon chip is stretched to convenient for silicon chip in third silicon chip card slot.
The beneficial effects of the invention are as follows：In silicon chip cleaning device, silicon chip can be held from silicon chip using the load carrier
It carries and is jacked up in the gaily decorated basket, subsequent cleaning is carried out so that subsequent silicon chip clamping jaw holds up silicon chip clamping.Utilize the carrying machine
Structure can improve the efficiency of Wafer Cleaning and improve Wafer Cleaning effect.
Description of the drawings
Fig. 1 is silicon chip load carrier overall structure diagram of the present invention.
Fig. 2 is silicon chip load carrier front view of the present invention.
Fig. 3 is silicon chip load carrier left view of the present invention.
Fig. 4 is silicon chip load carrier vertical view of the present invention.
Fig. 5 is silicon chip load carrier bottom view of the present invention.
Fig. 6 is one of silicon chip load carrier use state reference chart of the present invention.
Fig. 7 is the two of silicon chip load carrier use state reference chart of the present invention.
In Fig. 1 to Fig. 7：1 is pedestal, and 2 be the first silicon chip carrier, and 3 be the second silicon chip carrier, and 4 be the first silicon chip card
Slot, 5 be the second silicon chip card slot, and 6 be third silicon chip carrier, and 7 be third silicon chip card slot, and 8 be mounting hole, and 9 be bolt hole, and 10 are
Silicon chip.
Specific embodiment
Silicon chip load carrier of the present invention is further elaborated with specific case study on implementation below in conjunction with the accompanying drawings,
The structure feature and concrete application of the present invention in the hope of being more fully apparent from is expressed, but the protection of the present invention cannot be limited with this
Range.
Embodiment：As shown in Figures 1 to 7, a kind of silicon chip load carrier, including pedestal 1, the first silicon chip carrier 2 and
Two silicon chip carriers 3, the first silicon chip carrier 2 and the second silicon chip carrier 3 are symmetricly set on the upper surface of pedestal 1,
The top of the first silicon chip carrier 2 is equipped with the first silicon chip of multiple tracks card slot 4, between adjacent two the first silicon chip card slots 4
Apart from equal, the top of the second silicon chip carrier 3 is equipped with the second silicon chip of multiple tracks card slot 5, adjacent two the second silicon chip cards
The distance between slot 5 is equal, and the first silicon chip card slot 4 and the second silicon chip card slot 5 correspond, the first silicon chip card slot 4
Slot bottom and the slot bottom of the second silicon chip card slot 5 be in same cambered surface, the slot bottom and the second silicon chip of the first silicon chip card slot 4
The radius of cambered surface residing for the slot bottom of card slot 5 is equal with the radius of silicon chip 10 that the load carrier is carried, the first silicon chip card
Central angle alpha between 4 and second silicon chip card slot 5 of slot is less than 180 °.
In the present embodiment, the upper surface of the pedestal 1 is equipped with the first locating slot and the second locating slot, first positioning
Slot and the second locating slot are parallel, and the lower surface of the first silicon chip carrier 2 is equipped with match with the first locating slot first
Positioning convex strip, first positioning convex strip are stretched in the first locating slot, the lower surface of the second silicon chip carrier 3 be equipped with
The second positioning convex strip that second locating slot matches, second positioning convex strip are stretched in the second locating slot.
The load carrier further includes third silicon chip carrier 6, and the third silicon chip carrier 6 is located at the upper surface of pedestal 1
On, the third silicon chip carrier 6 is located between the first silicon chip carrier 2 and the second silicon chip carrier 3, and the third silicon chip is held
Carrier 6 is parallel with the first silicon chip carrier 2, and the top of the third silicon chip carrier 6 is equipped with multiple tracks third silicon chip card slot 7,
The third silicon chip card slot 7 is corresponded with the first silicon chip card slot 4.
Central angle alpha between the first silicon chip card slot 4 and the second silicon chip card slot 5 is 60 degree to 65 degree.
Corresponding first silicon chip card slot 4, the second silicon chip card slot 5 and third silicon chip card slot 7 form one group of silicon chip card slot.Institute
Stating the first silicon chip card slot 4, the second silicon chip card slot 5 and third silicon chip card slot 7 has 25 or 26.The load carrier can place 25
A silicon chip 10 when the first silicon chip card slot 4, the second silicon chip card slot 5 and third silicon chip card slot 7 have 25, then has 25 groups
Silicon chip card slot, every group of silicon chip card slot place a silicon chip 10.When the first silicon chip card slot 4, the second silicon chip card slot 5 and third silicon
When piece card slot 7 there are 26, then there are 26 groups of silicon chip card slots, there is one group of silicon chip card slot to keep in 26 groups of silicon chip card slots spare, remaining
Every group of silicon chip card slot places a silicon chip 10 in 25 groups of silicon chip card slots.In figure 6 and figure 7, it is clear in order to show, only in one group of silicon
It placed a silicon chip 10 in piece card slot.
The slot bottom of the third silicon chip card slot 7 is on same plane, and where the slot bottom of the third silicon chip card slot 7
Plane and the cambered surface where the slot bottom of the first silicon chip card slot 4 it is tangent.The slot bottom of the third silicon chip card slot 7 is in same flat
On face, and the plane where the slot bottom of the third silicon chip card slot 7 and the cambered surface where the slot bottom of the first silicon chip card slot 4 are tangent,
When can ensure that the first silicon chip card slot 4 and the second silicon chip card slot 5 form picking-up to silicon chip 10, the slot bottom of third silicon chip card slot 7
Silicon chip 10 can be formed and held up, increased the forced area of silicon chip 10, silicon chip 10 is avoided to lead to stress occur due to unbalance stress
Concentration phenomenon.
The upper surface of the pedestal 1 is equipped with third locating slot, and the third locating slot is parallel with the first locating slot, institute
The lower end for stating third silicon chip carrier 6 is stretched in third locating slot.
The first silicon chip carrier 2, the second silicon chip carrier 3 and third silicon chip carrier 6 pass through bolt with pedestal 1
Connection.The pedestal 1 is equipped with three row bolts hole 9, and three row bolts hole 9 correspond respectively to the first locating slot, the second locating slot
At third locating slot, and each column bolt hole 9 includes four bolts hole 9.
First silicon chip carrier 2, the second silicon chip carrier 3, third silicon chip carrier 6 and pedestal 1 be U-PVC materials or
PEEK materials.
Mounting hole 8 there are four being set on the pedestal 1.The load carrier can be mounted on by the mounting hole 8 on pedestal 1
The top of cylinder jacks up the load carrier convenient for cylinder, so as to allow the load carrier by the silicon in silicon wafer bearing flower basket
Piece 10 is held up.
The thickness of silicon chip 10 of the groove width of the first silicon chip card slot 4 and the groove width of the second silicon chip card slot 5 with being carried
It is equal.The groove width of the first silicon chip card slot 4 and the groove width of the second silicon chip card slot 5 with the thickness phase of the silicon chip 10 carried
Deng carried 10 run-off the straight phenomenon of silicon chip can be effectively prevent.
The groove width of the third silicon chip card slot 7 is equal with the thickness of silicon chip 10 carried.The third silicon chip card slot 7
Groove width it is equal with the thickness of silicon chip 10 carried, carried 10 run-off the straight phenomenon of silicon chip can be effectively prevent.
Chamfered is passed through in the notch both sides of the first silicon chip card slot 4 and the second silicon chip card slot 5.First silicon chip
The notch both sides of 4 and second silicon chip card slot 5 of card slot make the first silicon chip card slot 4 and the second silicon chip card slot 5 by chamfered
Width of rebate is more than the thickness of silicon chip 10, is stretched in the first silicon chip card slot 4 and the second silicon chip card slot 5 convenient for silicon chip 10.
Chamfered is passed through in the notch both sides of the third silicon chip card slot 7.The notch both sides of the third silicon chip card slot 7
By chamfered, the width of rebate of third silicon chip card slot 7 is made to be more than the thickness of silicon chip 10, third is stretched to convenient for silicon chip 10
In silicon chip card slot 7.
Embodiment 2, as a kind of improvement project of embodiment 1, the slot bottom of the third silicon chip card slot 7 is in same arc
On face, and the cambered surface where the slot bottom of the third silicon chip card slot 7 is overlapped with the cambered surface where the slot bottom of the first silicon chip card slot 4.
Compared with Example 1, the slot bottom of the third silicon chip card slot 7 is in same cambered surface, and the third silicon chip
Cambered surface where the slot bottom of card slot 7 is overlapped with the cambered surface where the slot bottom of the first silicon chip card slot 4, can further increase silicon chip 10
The contact area at edge and 7 slot bottom of third silicon chip card slot, 7 slot bottom of increase third silicon chip card slot act on the carrying of silicon chip 10, increase
Add the forced area of silicon chip 10, silicon chip 10 is avoided to occur stress concentration phenomenon due to unbalance stress.
Claims (10)
1. a kind of silicon chip load carrier, which is characterized in that the load carrier includes pedestal（1）, the first silicon chip carrier（2）With
Two silicon chip carriers（3）, the first silicon chip carrier（2）With the second silicon chip carrier（3）It is symmetricly set on pedestal（1）It is upper
On surface, the first silicon chip carrier（2）Top be equipped with multiple tracks the first silicon chip card slot（4）, adjacent two the first silicon chips
Card slot（4）The distance between equal, the second silicon chip carrier（3）Top be equipped with multiple tracks the second silicon chip card slot（5）, it is adjacent
Two the second silicon chip card slots（5）The distance between equal, the first silicon chip card slot（4）With the second silicon chip card slot（5）One by one
It is corresponding, the first silicon chip card slot（4）Slot bottom and the second silicon chip card slot（5）Slot bottom be in same cambered surface, described
One silicon chip card slot（4）Slot bottom and the second silicon chip card slot（5）Slot bottom residing for radius and the load carrier of cambered surface carried
Silicon chip（10）Radius it is equal, the first silicon chip card slot（4）With the second silicon chip card slot（5）Between central angle alpha be less than 180 °.
A kind of 2. silicon chip load carrier according to claim 1, which is characterized in that the pedestal（1）Upper surface on set
There are the first locating slot and the second locating slot, first locating slot and the second locating slot are parallel, the first silicon chip carrier
（2）Lower surface be equipped with the first positioning convex strip for matching with the first locating slot, it is fixed that first positioning convex strip stretches to first
In the slot of position, the second silicon chip carrier（3）Lower surface be equipped with the second positioning convex strip for matching with the second locating slot, it is described
Second positioning convex strip is stretched in the second locating slot.
A kind of 3. silicon chip load carrier according to claim 1, which is characterized in that the first silicon chip card slot（4）With
Two silicon chip card slots（5）There are 25 or 26.
4. a kind of silicon chip load carrier according to claim 1, which is characterized in that the load carrier further includes third silicon chip
Carrier（6）, the third silicon chip carrier（6）It is located at pedestal（1）Upper surface on, the third silicon chip carrier（6）If
In the first silicon chip carrier（2）With the second silicon chip carrier（3）Between, the third silicon chip carrier（6）It is held with the first silicon chip
Carrier（2）It is parallel, the third silicon chip carrier（6）Top be equipped with multiple tracks third silicon chip card slot（7）, the third silicon chip
Card slot（7）With the first silicon chip card slot（4）It corresponds.
A kind of 5. silicon chip load carrier according to claim 4, which is characterized in that the third silicon chip card slot（7）Slot
Bottom is on same plane, and the third silicon chip card slot（7）Slot bottom where plane and the first silicon chip card slot（4）Slot
Cambered surface where bottom is tangent.
A kind of 6. silicon chip load carrier according to claim 4, which is characterized in that the third silicon chip card slot（7）Slot
Bottom is in same cambered surface, and the third silicon chip card slot（7）Slot bottom where cambered surface and the first silicon chip card slot（4）Slot
Cambered surface where bottom overlaps.
A kind of 7. silicon chip load carrier according to claim 4, which is characterized in that the pedestal（1）Upper surface on set
There is third locating slot, the third locating slot is parallel with the first locating slot, the third silicon chip carrier（6）Lower end stretch into
To third locating slot.
A kind of 8. silicon chip load carrier according to claim 4, which is characterized in that the first silicon chip carrier（2）,
Two silicon chip carriers（3）With third silicon chip carrier（6）And pedestal（1）It is bolted.
A kind of 9. silicon chip load carrier according to claim 4, which is characterized in that the first silicon chip carrier（2）, the second silicon
Piece carrier（3）, third silicon chip carrier（6）And pedestal（1）It is U-PVC materials or PEEK materials.
A kind of 10. silicon chip load carrier according to claim 1, which is characterized in that the pedestal（1）It is equipped with multiple peaces
Fill hole（8）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810159865.0A CN108183082B (en) | 2018-02-26 | 2018-02-26 | Silicon wafer bearing mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810159865.0A CN108183082B (en) | 2018-02-26 | 2018-02-26 | Silicon wafer bearing mechanism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108183082A true CN108183082A (en) | 2018-06-19 |
| CN108183082B CN108183082B (en) | 2024-07-30 |
Family
ID=62553004
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810159865.0A Active CN108183082B (en) | 2018-02-26 | 2018-02-26 | Silicon wafer bearing mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108183082B (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108568427A (en) * | 2018-06-22 | 2018-09-25 | 中国振华集团永光电子有限公司（国营第八七三厂） | A kind of ultrasonic cleaning equipment of silicon chip |
| CN110176390A (en) * | 2019-05-31 | 2019-08-27 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | In no film magazine cleaning equipment batch-wafer fix, driving device and application method |
| CN110634779A (en) * | 2019-09-19 | 2019-12-31 | 上海提牛机电设备有限公司 | Wafer grabbing mechanism |
| CN110752175A (en) * | 2019-09-19 | 2020-02-04 | 上海提牛机电设备有限公司 | Wafer supporting mechanism |
| CN110993544A (en) * | 2019-11-08 | 2020-04-10 | 上海至纯洁净系统科技股份有限公司 | Wafer mounting seat capable of preventing wafer from shaking and shifting and wafer lifting device |
| CN111834271A (en) * | 2020-09-15 | 2020-10-27 | 北京京仪自动化装备技术有限公司 | Wafer batch conveying mechanism |
| CN113611642A (en) * | 2021-10-11 | 2021-11-05 | 西安奕斯伟硅片技术有限公司 | Silicon wafer bearing device and separation equipment |
| CN114177332A (en) * | 2022-01-24 | 2022-03-15 | 中山大学附属第一医院 | Sterilizing device |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1622308A (en) * | 2004-12-17 | 2005-06-01 | 北京市塑料研究所 | Silicon wafer carrier |
| CN101667551A (en) * | 2008-09-03 | 2010-03-10 | 上海华虹Nec电子有限公司 | Silicon slice bearing boat and method for manufacturing same |
| CN103904016A (en) * | 2014-04-04 | 2014-07-02 | 株洲南车时代电气股份有限公司 | Silicon wafer bearing device |
| CN203882983U (en) * | 2014-05-16 | 2014-10-15 | 南通皋鑫电子股份有限公司 | Basket for silicon chip chemical cleaning |
| CN205231025U (en) * | 2015-12-03 | 2016-05-11 | 钧石(中国)能源有限公司 | A integral type basket of flowers for bearing weight of silicon chip |
| CN106057714A (en) * | 2016-08-17 | 2016-10-26 | 常州亿晶光电科技有限公司 | Silicon chip bearing basket |
| CN207572345U (en) * | 2018-02-26 | 2018-07-03 | 上海提牛机电设备有限公司 | A kind of silicon chip load carrier |
-
2018
- 2018-02-26 CN CN201810159865.0A patent/CN108183082B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1622308A (en) * | 2004-12-17 | 2005-06-01 | 北京市塑料研究所 | Silicon wafer carrier |
| CN101667551A (en) * | 2008-09-03 | 2010-03-10 | 上海华虹Nec电子有限公司 | Silicon slice bearing boat and method for manufacturing same |
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| CN205231025U (en) * | 2015-12-03 | 2016-05-11 | 钧石(中国)能源有限公司 | A integral type basket of flowers for bearing weight of silicon chip |
| CN106057714A (en) * | 2016-08-17 | 2016-10-26 | 常州亿晶光电科技有限公司 | Silicon chip bearing basket |
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| CN108568427A (en) * | 2018-06-22 | 2018-09-25 | 中国振华集团永光电子有限公司（国营第八七三厂） | A kind of ultrasonic cleaning equipment of silicon chip |
| CN110176390A (en) * | 2019-05-31 | 2019-08-27 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | In no film magazine cleaning equipment batch-wafer fix, driving device and application method |
| CN110634779A (en) * | 2019-09-19 | 2019-12-31 | 上海提牛机电设备有限公司 | Wafer grabbing mechanism |
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| CN110993544B (en) * | 2019-11-08 | 2022-10-21 | 上海至纯洁净系统科技股份有限公司 | Wafer mounting seat capable of preventing wafer from shaking and shifting and wafer lifting device |
| CN111834271A (en) * | 2020-09-15 | 2020-10-27 | 北京京仪自动化装备技术有限公司 | Wafer batch conveying mechanism |
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| CN113611642A (en) * | 2021-10-11 | 2021-11-05 | 西安奕斯伟硅片技术有限公司 | Silicon wafer bearing device and separation equipment |
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| CN114177332A (en) * | 2022-01-24 | 2022-03-15 | 中山大学附属第一医院 | Sterilizing device |
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