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CN108132734B - Touch panel and touch device - Google Patents

Touch panel and touch device Download PDF

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Publication number
CN108132734B
CN108132734B CN201810089408.9A CN201810089408A CN108132734B CN 108132734 B CN108132734 B CN 108132734B CN 201810089408 A CN201810089408 A CN 201810089408A CN 108132734 B CN108132734 B CN 108132734B
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Prior art keywords
touch panel
substrate
layer
signal
sensing
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CN108132734A (en
Inventor
李炫运
李璟林
黄彦衡
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Interface Optoelectronics Shenzhen Co Ltd
Interface Technology Chengdu Co Ltd
General Interface Solution Ltd
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Interface Optoelectronics Shenzhen Co Ltd
Interface Technology Chengdu Co Ltd
General Interface Solution Ltd
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Priority to CN201810089408.9A priority Critical patent/CN108132734B/en
Priority to TW107104372A priority patent/TWI660300B/en
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416Control or interface arrangements specially adapted for digitisers
    • G06F3/0418Control or interface arrangements specially adapted for digitisers for error correction or compensation, e.g. based on parallax, calibration or alignment

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Position Input By Displaying (AREA)

Abstract

The touch panel comprises a lower substrate, a negative resistance adjusting layer and an upper substrate. The lower substrate comprises a first substrate, a first sensing layer and a first adhesion layer. The first sensing layer is located on the first substrate, and the first adhesion layer is located on the first sensing layer. The negative resistance adjusting layer is positioned on the first adhesion layer. The upper substrate comprises a second substrate and a second sensing layer, wherein the second substrate is positioned on the negative resistance adjustment layer, and the second sensing layer is positioned on the second substrate. The touch panel provided by the disclosure can reduce the variation value of the mutual capacitance at different temperatures. In addition, the touch device provided by the disclosure can improve the influence of temperature change on sensing accuracy.

Description

Touch panel and touch device
Technical Field
The present invention relates to a touch panel, and more particularly, to a capacitive touch panel.
Background
Since the electrical characteristics of the conventional touch panel and the touch device change with the temperature change, the phenomenon that the coordinate of the touch sensing changes with the temperature occurs. In an environment with a large temperature difference, the dielectric constant of the material of the touch device is easily changed due to the temperature. Due to the change of the dielectric constant, the capacitance of the capacitive touch device is not constant and changes with the temperature, which causes the deviation between the sensed touch position and the actual touch position to be too large.
This situation causes inconvenience in operation for the user, and thus a solution is required to improve the above-mentioned problems.
Disclosure of Invention
In one aspect of the present disclosure, a touch panel is provided, which includes a lower substrate, a negative resistance adjustment layer and an upper substrate. The lower substrate comprises a first substrate, a first sensing layer and a first adhesion layer. The first sensing layer is located on the first substrate, and the first adhesion layer is located on the first sensing layer. The negative resistance adjusting layer is positioned on the first adhesion layer. The upper substrate includes a second substrate and a second sensing layer. The second substrate is positioned on the negative resistance adjustment layer, and the second sensing layer is positioned on the second substrate.
According to one or more embodiments of the present disclosure, the negative resistance adjustment layer further includes a third adhesive layer and a third substrate, wherein the third adhesive layer is disposed on the third substrate.
According to one or more embodiments of the present disclosure, the thickness of the negative resistance adjustment layer is 10 μm to 200 μm.
In accordance with one or more embodiments of the present disclosure, the negative resistance adjustment layer further comprises a material having a Negative Temperature Coefficient (NTC) dielectric constant.
One aspect of the present disclosure provides a touch device, which includes a touch panel, a signal adjusting device and a driving chip. The touch panel is configured to output a first signal. The signal adjusting element is configured to adjust a first signal output by the touch panel. The driving chip is configured to receive the adjusted first signal.
According to one or more embodiments of the present disclosure, the resistance of the signal adjusting element is a negative temperature coefficient.
According to one or more embodiments of the present disclosure, the signal adjusting element includes a thermistor.
In one aspect of the present disclosure, a touch device is provided, which includes a touch panel, a temperature sensing device and a driving chip. The touch panel is configured to output a first signal. The temperature sensing element is configured to output a second signal with a temperature change. The driving chip is configured to receive the first signal and the second signal, and correct the first signal based on the second signal according to a correction rule to drive the touch panel.
According to one or more embodiments of the present disclosure, the calibration rule is to add different offset values to the first signal based on different second signals.
According to one or more embodiments of the present disclosure, the calibration rule is to multiply the first signal by different gain values based on different second signals.
The present disclosure provides a touch panel capable of reducing variation values of mutual capacitance at different temperatures. The present disclosure also provides a touch device capable of improving the influence of temperature change on sensing accuracy.
Drawings
The foregoing and other objects, features, advantages and embodiments of the disclosure will be more readily understood from the following detailed description taken in conjunction with the accompanying drawings in which:
FIG. 1 is a cross-sectional view of a conventional touch panel;
FIG. 2 is a cross-sectional view of a touch panel according to an embodiment of the disclosure;
FIG. 3 is a cross-sectional view of a touch panel according to an embodiment of the disclosure;
FIG. 4 is a schematic diagram illustrating a touch device according to an embodiment of the disclosure;
fig. 5 is a schematic view illustrating a touch device according to an embodiment of the disclosure.
Reference numerals:
100. 200, 300, 420, 520: touch panel
110. 210: first substrate
120. 220, and (2) a step of: first sensing layer
130. 230: a first adhesive layer
140. 240: second substrate
150. 250: second sensing layer
160. 260: the second adhesive layer
170. 270: covering layer
280. 330: negative resistance adjusting layer
290: lower substrate
295: upper substrate
310: third substrate
320: a third adhesive layer
400. 500: touch control device
410. 510: sensing pattern
430. 530: driving chip
440. 540: signal adjusting element
450. 550: the first signal
460: the adjusted first signal
Detailed Description
In order to make the description of the present disclosure more complete and complete, reference is made to the accompanying drawings and the following description of various embodiments or examples.
As used herein, the singular includes the plural unless the context clearly dictates otherwise. Reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present disclosure, and thus, in various instances, such a reference may be said to occur without necessarily referring to the same embodiment, even though particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
Fig. 1 is a cross-sectional view of a conventional touch panel 100, which is a GFF structure. The conventional touch panel 100 includes a first substrate 110, a first sensing layer 120, a first adhesive layer 130, a second substrate 140, a second sensing layer 150, a second adhesive layer 160, and a cover layer 170. As shown in fig. 1, the first sensing layer 120 is disposed on the first substrate 110, and the second sensing layer 150 is disposed on the second substrate 140. The second substrate 140 is attached to the first sensing layer 120 by the first adhesive layer 130. The thickness of the first adhesive layer 130 is typically about 100 μm.
Under the environment of temperature variation, the touch panel 100 of the conventional GFF structure shown in fig. 1 has the touch sensing offset. That is, when the ambient temperature changes, the touch panel 100 of the conventional GFF structure may generate a sensing error. Mainly because the first adhesive layer 130 is fluid in nature, the dielectric constant of the first adhesive layer can be greatly changed at different temperatures, and the touch panel can be caused to have a large change in the dielectric constantMutual capacitance (C) of 100M) The change is large, and the sensing accuracy is influenced.
The present disclosure provides a solution to improve the above-mentioned problems. The present disclosure provides a touch panel, which can greatly reduce the influence of temperature change on the touch panel.
Fig. 2 is a cross-sectional view of a touch panel 200 according to an embodiment of the disclosure. In some embodiments of the present disclosure, the touch panel 200 includes a lower substrate 290, a negative resistance adjustment layer 280, and an upper substrate 295. The lower substrate 290 includes a first substrate 210, a first sensing layer 220 and a first adhesive layer 230, wherein the first sensing layer 220 is disposed on the first substrate 210, and the first adhesive layer 230 is disposed on the first sensing layer 220. The upper substrate 295 includes a second substrate 240 and a second sensing layer 250. The material of the first substrate 210 and the second substrate 240 may be, for example, transparent plastic or transparent glass, wherein the transparent plastic may be, for example, polyethylene terephthalate (PET). The material of the first adhesive layer 230 may be, for example, Optical Clear Adhesive (OCA). In some embodiments, the touch panel 200 further includes a second adhesive layer 260 and a cover layer 270. The material of the second adhesive layer 260 may be the same as or different from the first adhesive layer 230. The cover layer 270 may be, for example, a glass cover plate. In some embodiments, the cover layer 270 and the second adhesive layer 260 may be omitted.
It is noted that the difference between the conventional touch panel 100 of fig. 1 is that the negative resistance adjustment layer 280 is disposed between the second substrate 240 and the first adhesive layer 230 in the embodiment shown in fig. 2. In some embodiments, the negative resistance adjustment layer 280 comprises a material having a dielectric constant that decreases with increasing temperature. In other words, the negative resistance adjustment layer 280 includes a material having a negative temperature coefficient of permittivity. In some embodiments, the material of the negative resistance adjustment layer 280 is a transparent material. The material of the negative resistance adjustment layer 280 may be, for example, polypropylene (polypropylene) or polystyrene (polystyrene), but not limited thereto. In some embodiments, the negative resistance adjustment layer 280 is about 10-200 μm thick. In some embodiments, the first adhesive layer 230 has a thickness of about 10-200 μm.
The negative resistance adjustment layer 280 is disposed between the first sensing layer 220 and the second sensing layer 250 to improve the mutual capacitance of the touch panel varying with temperature. In the embodiment where the negative resistance adjustment layer 280 comprises a material with a negative temperature coefficient of permittivity, due to the material properties of the negative resistance adjustment layer 280, when the ambient temperature increases, the capacitance of the first adhesive layer 230 and the second substrate 240 increases, but the capacitance of the negative resistance adjustment layer 280 decreases. Therefore, the negative impedance adjustment layer 280 can reduce the variation range of the mutual capacitance of the touch panel. Furthermore, the variation range of the Resistance Capacitance (RC) of the touch panel is also reduced. In addition, since the negative resistance adjustment layer 280 is disposed, the thickness of the first adhesive layer 230 can be reduced, and the material usage of the first adhesive layer 230 is reduced.
Example 1
Similar to the touch panel 200 of fig. 2, the negative impedance adjustment layer 280 of embodiment 1 includes a material having a negative temperature coefficient of permittivity characteristic, for example, the permittivity of 0 ℃ to 40 ℃ is changed from 4.7 to 3.5, that is, the permittivity is a negative temperature coefficient (smaller with increasing temperature and larger with decreasing temperature).
Table one is a comparison table of mutual capacitance and capacitance values of the touch panel in embodiment 1 and the conventional touch panel at different temperatures, wherein a is the area of the overlapping region of the upper and lower sensing electrodes.
Watch 1
Figure BDA0001563282610000041
As can be seen from the results in table one, the distance between the resistance and capacitance values of the touch panel of embodiment 1 at different temperatures is small, and the resistance and capacitance values of the conventional touch panel are greatly changed with the temperature. This result shows that the example 1 can indeed improve the situation of the conventional technology in which the variation of the RC value with the temperature is too large.
Fig. 3 is a cross-sectional view of a touch panel 300 according to an embodiment of the disclosure. The touch panel 300 includes a lower substrate 290, a negative resistance adjustment layer 330, and an upper substrate 295. The lower substrate 290 and the upper substrate 295 are similar to those described above and will not be described herein again. In this embodiment, the negative resistance adjustment layer 330 includes a third adhesive layer 320 and a third substrate 310. The third adhesive layer 320 is disposed on the third substrate 310. The material of the third adhesive layer 320 may be the same as or different from the material of the first adhesive layer 230 and the second adhesive layer 260. The material of the third substrate 310 may be the same as or different from the materials of the first substrate 210 and the second substrate 240. In some embodiments, the thickness of the negative resistance adjustment layer 330 is about 20-400 μm. In more detail, in some embodiments, the third adhesive layer 320 is about 10-200 μm, and the third substrate 310 is about 10-200 μm.
Since the mutual capacitance is obtained by serially connecting the capacitances generated by the layers between the first sensing layer 220 and the second sensing layer 250 of the touch panel, the negative impedance adjustment layer 330 can reduce the variation of the mutual capacitance of the touch panel 300 with different temperatures when it includes the third adhesive layer 320 and the third substrate 310. For example, in the prior art, only the second substrate and the first adhesion layer are disposed between the first sensing layer and the second sensing layer, wherein CsubstrateIs the capacitance of the second substrate, and CadhesiveThe capacitance of the first adhesive layer 230 is the mutual capacitance C of the conventional touch panelMThe method comprises the following steps:
CM=1/(1/Csubstrate+1/Cadhesive)。
in some embodiments of the present disclosure, the second substrate 240, the first adhesive layer 230, the third adhesive layer 320 and the third substrate 310 are disposed between the first sensing layer 220 and the second sensing layer 250, wherein CsubstrateIs the capacitance of the second substrate 240, CadhesiveIs the capacitance, C, of the first adhesive layer 230substrate2Is the capacitance, C, of the third substrate 310adhesive2The capacitance of the third adhesive layer 320 is the mutual capacitance C of the touch panel 300MThe method comprises the following steps:
CM=1/(1/Csubstrate+1/Csubstrate2+1/Cadhesive+1/Cadhesive2)。
example 2
Similar to the touch panel 300 of fig. 3, the negative resistance adjustment layer 330 of embodiment 2 includes a third adhesive layer 320 and a third substrate 310, wherein the material of the third adhesive layer 320 is the same as that of the first adhesive layer 230, and the third adhesive layer is an optical adhesive. The third substrate 310 is made of the same material as the second substrate 240, and is made of polyethylene terephthalate.
Table two is a comparison table of mutual capacitance and capacitance values of the touch panel in embodiment 2 and the conventional touch panel at different temperatures, wherein a is the area of the overlapping region of the upper and lower sensing electrodes.
Watch two
Figure BDA0001563282610000051
From the results in table two, it can be seen that the difference between the resistance-capacitance values of the touch panel of the embodiment 2 at different temperatures is smaller than that of the prior art, which shows that the embodiment 2 can indeed improve the situation that the resistance-capacitance value of the prior art varies too much with the temperature.
As can be seen from the above, the third adhesive layer 320 and the third substrate 310 are additionally disposed between the first sensing layer 220 and the second sensing layer 250, so that the mutual capacitance is less affected by the capacitance change of the first adhesive layer 230. In other words, the third adhesive layer 320 and the third substrate 310 are disposed between the first sensing layer 220 and the second sensing layer 250, which can improve the situation that the mutual capacitance of the conventional touch panel greatly changes along with the temperature change, thereby increasing the stability of the touch panel operation.
Table three shows the dielectric constant of the optical adhesive at different temperatures, the mutual capacitance of the conventional touch panel at different temperatures, and the mutual capacitance of the embodiments 1 and 2 at different temperatures. The conventional touch panel is the touch panel shown in fig. 1. In the conventional touch panel, the embodiment 1 and the embodiment 2, the first adhesive layer is an optical adhesive. In table three, a is the overlapping area of the upper and lower sensing electrodes.
Watch III
Figure BDA0001563282610000061
From the results of table three, it can be known that in the conventional touch panel, the main reason for the mutual capacitance of the touch panel greatly changing with the temperature is that the dielectric constant of the optical adhesive is easily changed by the temperature.
In embodiment 1, by using a material with a negative temperature coefficient as the negative resistance adjustment layer, when the dielectric constant of the optical adhesive increases due to a temperature increase, the dielectric constant of the negative resistance adjustment layer decreases with the temperature increase, so that the capacitance variation of the touch panel is reduced. The mutual capacitance measured at a temperature of 0 ℃ or 40 ℃ is very close to the mutual capacitance measured at a temperature of 25 ℃.
The negative resistance adjustment layer of embodiment 2 includes a third adhesion layer and a third substrate, and reduces the variation range of the mutual capacitance of the touch panel by using the series connection characteristic of the capacitors. It is noted that, due to the series connection of the capacitors, the mutual capacitance of the touch panel is smaller than that of the conventional touch panel at the three temperatures of the test. However, the variation of the mutual capacitance of the touch panel of embodiment 2 at different temperatures is smaller than that of the conventional touch panel, which shows that the touch panel of embodiment 2 can actually achieve the effect of reducing the variation of the mutual capacitance at different temperatures.
The present disclosure also provides a touch device, which can greatly reduce the influence of temperature change on the touch device.
Fig. 4 is a schematic diagram illustrating a touch device 400 according to an embodiment of the disclosure. The touch device 400 includes a touch panel 420, a signal adjusting element 440, and a driving chip 430, wherein the touch panel 420 includes a plurality of sensing patterns 410. The touch panel 420 outputs a first signal 450, wherein the first signal 450 includes capacitance and resistance information (RC) sensed by the sensing pattern 410. The signal adjusting device 440 is used for adjusting the first signal 450 output by the touch panel 420 and outputting the adjusted first signal 460. The driver chip 430 receives the adjusted first signal 460.
In some embodiments, the signal conditioning device 440 is connected in series between the driver chip 430 and the sensing pattern 410. Since the variation of the mutual capacitance of the touch panel 420 is too large due to the variation of the ambient temperature, the signal adjusting element 440 is required to correct the variation. The first signal 450 is transmitted to the signal adjusting device 440, and the signal adjusting device 440 adjusts the first signal 450 and transmits the adjusted first signal 460 to the driver chip 430. In some embodiments, the resistance of the signal conditioning element 440 is a negative temperature coefficient. In some embodiments, the signal conditioning element 440 may be a thermistor, for example.
Example 3
Similar to fig. 4, in the touch device 400 according to embodiment 3 of the disclosure, the signal adjusting element 440 is a thermistor. The thermistor has a resistance value that varies with temperature. Furthermore, the resistance value of the thermistor is a negative temperature coefficient. For example, the temperature is changed from 0 ℃ to 40 ℃, and the resistance value of the thermistor is changed from 25.3k omega to 21.3k omega. Table four shows the comparison of the resistance, mutual capacitance and capacitance of the touch panel in embodiment 3 of the present disclosure and the conventional touch panel, where a is the area of the overlapped region of the upper and lower sensing electrodes.
Watch four
Figure BDA0001563282610000071
As can be seen from the table iv, the use of the thermistor as the signal adjustment device 440 can greatly reduce the range of the resistance-capacitance value of the touch panel 400 varying with the temperature. When the touch panel 420 changes its mutual capacitance with temperature, the signal adjusting element 440 can properly adjust the resistance value to reduce the variation range of the resistance-capacitance value. It should be noted that, since the mutual capacitance of the conventional touch panel is higher and the capacitance resistance is higher as the temperature is higher, in some embodiments of the present disclosure, the signal adjusting device 440 is a device with a resistance having a negative temperature coefficient characteristic.
It should be understood that embodiment 3 is only an example, and the thermistor with a suitable resistance value can be selected according to the variation of the mutual capacitance of the touch panel itself.
Fig. 5 is a schematic diagram illustrating a touch device 500 according to an embodiment of the disclosure. The touch device 500 includes a touch panel 520, a signal adjusting element 540, and a driving chip 530, wherein the touch panel 520 includes a plurality of sensing patterns 510. The touch panel 520 outputs a first signal 550, wherein the first signal 550 includes capacitance and resistance information (RC) sensed by the sensing pattern 510, and is transmitted to the driving chip 530. The driving chip 530 may be a touch driving chip. The signal conditioning element 540 may output a second signal 560 based on the detected temperature. The driver chip 530 receives the first signal 550 and the second signal 560.
In some embodiments, the signal conditioning element 540 may be a temperature sensor, for example. After the temperature sensor detects the ambient temperature, it will send a second signal 560 to the driver chip 530. After receiving the second signal 560, the driver chip 530 adjusts the first signal 550 output by the touch panel 520 according to the information of the second signal 560.
In an embodiment using a temperature sensor as the signal adjusting device 540, the driving chip 530 can continuously adjust the first signal 550 according to the detected temperature, i.e. dynamically adjust the original data. In some embodiments, rules for adjusting the raw data may be established in the driver chip 530. The dynamic adjustment can be, for example, dynamic shift (dynamic shift) or dynamic gain (dynamic gain), wherein the dynamic shift is to add an offset value to the original data, and the dynamic gain is to multiply the original data by a gain value. The raw data refers to data obtained by converting the RC sensing value received by the driver chip 530 through an analog-to-digital converter (ADC) of the driver chip 530. When a touch is sensed, the original data is reduced because a part of the capacitance is taken away by the finger, and the original value is recovered after the original data is released. The raw data may be influenced by the amplification factor or sampling frequency of the amplification circuit in the touch device. Under the same environment, different parameter configurations will result in different raw data.
Example 4
In the embodiment 4 of the present disclosure, the signal adjusting device 540 is a temperature sensor, and the rule for adjusting the raw data is shown in table five, which is a dynamic translation.
Watch five
Adjusting rules
The measured temperature is not less than 40 DEG C Raw data-400
40℃>The measured temperature is not less than 30 DEG C Raw data-200
0℃<The measured temperature is less than or equal to 10 DEG C Raw data +700
The measured temperature is less than or equal to 0 DEG C Raw data +1000
Table six below shows the result of performing dynamic translation on the raw data measured when the center of the touch panel 520 is not touched at different temperatures according to the measured temperatures and the rule of table five in embodiment 4 of the present disclosure. In table six, the raw data is the value of the mutual capacitance value sensed by the touch driver IC (TP driver IC) and output by the circuit and algorithm. It should be noted that the value may be different due to different circuit designs or different algorithms. Therefore, the rule for adjusting the raw data shown in table five is only exemplary, and can be adjusted according to the actual raw data.
Watch six
Raw data Adjusted raw data
40℃ 3738 3338
25℃ 2977 2977
0℃ 1590 2590
From the results in Table six, it can be seen that the measured raw data values are higher in the environment with higher temperature. In a low temperature environment, the measured raw data value is low. The original data of example 4 was dynamically adjusted using the rules shown in table five, so that the difference between the adjusted original data of example 4 and 0 ℃ to 40 ℃ was less than 500. In this embodiment, a difference of less than 500 in the adjusted raw data at 0 ℃ to 40 ℃ is an acceptable range.
The rules for adjusting the raw data can be configured arbitrarily according to requirements, and suitable dynamic adjustment rules are designed according to the acceptable raw data difference in a certain temperature range. For example, in the case of 0 ℃ to 40 ℃, the difference in the acceptable raw data is 500.
In summary, the present disclosure provides a touch panel capable of reducing variation values of mutual capacitance at different temperatures. By adding the negative resistance adjustment layer between the first sensing layer and the second sensing layer, the variation of the mutual capacitance of the touch panel due to temperature change can be reduced. The present disclosure also provides a touch device capable of improving the influence of temperature change on sensing accuracy. By adding signal adjustment components, the signal sent by the touch panel is corrected, so as to achieve the purpose of reducing the sensing error caused by temperature difference. In addition, the driving chip can adjust the signal outputted by the touch panel according to the information provided by the signal adjusting device by adding the signal adjusting device.
The present disclosure has described some embodiments in detail, but other embodiments are possible. Therefore, the spirit and scope of the appended claims should not be limited to the description of the embodiments contained herein.
While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.

Claims (5)

1. A touch panel, comprising:
a lower substrate comprising:
a first substrate;
a first sensing layer on the first substrate; and
a first adhesive layer on the first sensing layer;
a negative resistance adjusting layer on the first adhesion layer; and
an upper substrate, comprising:
a second substrate on the negative resistance adjustment layer; and
a second sensing layer on the second substrate;
wherein the negative resistance adjustment layer comprises a third substrate on the first adhesive layer and a third adhesive layer on the third substrate, and the negative resistance adjustment layer further comprises a material having a negative temperature coefficient as a dielectric constant.
2. The touch panel of claim 1, wherein the negative resistance adjustment layer has a thickness of 10 μm to 200 μm.
3. A touch device, comprising:
touch panel according to claim 1, the touch panel being arranged to output a first signal;
a signal adjusting element connected in series with the touch panel and configured to adjust the first signal output by the touch panel; and
and the driving chip is connected with the touch panel in series, wherein the driving chip is configured to receive the adjusted first signal.
4. The touch device as defined in claim 3, wherein a resistance of the signal adjusting device is a negative temperature coefficient.
5. The touch device as defined in claim 4, wherein the signal conditioning element comprises a thermistor.
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TWI660300B (en) 2019-05-21
TW201933076A (en) 2019-08-16

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