CN108093561A - A kind of production method of thermoelectricity separation printed circuit board - Google Patents
A kind of production method of thermoelectricity separation printed circuit board Download PDFInfo
- Publication number
- CN108093561A CN108093561A CN201711406672.2A CN201711406672A CN108093561A CN 108093561 A CN108093561 A CN 108093561A CN 201711406672 A CN201711406672 A CN 201711406672A CN 108093561 A CN108093561 A CN 108093561A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- bottom substrate
- heat conduction
- production method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The invention discloses a kind of production methods of thermoelectricity separation printed circuit board, and the position of heat conduction boss on bottom substrate is determined using pattern transfer, etches heat conduction boss on bottom substrate using method for chemially etching；With resin ink coated on bottom substrate, the gap between heat conduction boss is filled and led up, baking drying is carried out to resin ink and forms insulating layer；Interconnection metal layer is plated in surface of insulating layer；The etching conducting circuit on interconnection metal layer；Common FR4 materials are substituted using resin ink to insulate to bottom substrate and interconnection metal layer, need not carry out Drilling operation, and simpler easy to operate, technological process is simplified, and rejection rate declines, and cost of manufacture declines, and efficiency greatly promotes.
Description
Technical field
The present invention relates to printed-board technology field more particularly to a kind of making sides of thermoelectricity separation printed circuit board
Method.
Background technology
Printed circuit board (PCB) (Printed Circuit Board, PCB) is one of important component of electronics industry.PCB can be
Electronic component provides fixed, assembling mechanical support, it can be achieved that electrical connection between electronic component, and almost each electronics is set
It is standby, it is small to electronic watch, calculator, greatly to computer, communication electronic device, military issue weapons system, as long as there is integrated circuit etc.
Electronic component for the electric interconnection between them, will use printed circuit board (PCB).
Its structure of the printed circuit board of thermoelectricity separation function is mostly that heat conduction boss is etched on bottom substrate at present, in bottom
Base material be equipped with thermally conductive insulating layer and line layout layer, common manufacture craft it needs to be determined that on bottom substrate heat conduction boss position
It puts, then etches heat conduction boss, then thermally conductive insulating layer and the hole position of heat conduction boss cooperation will be emptied by the way of cutting, most
Each layer is bonded together by the way of pressing afterwards.Though such method can realize production, flow is numerous and diverse changeable, and into
This consumption is higher, inefficiency, it is not easy to manipulate, with the more and more mass productions of product, it will can not reach slowly
To the demand of production.
The content of the invention
In order to overcome the above-mentioned deficiencies of the prior art, the present invention provides it is a kind of operation it is more simple and convenient, technological process obtains
To simplification, cost of manufacture declines, the production method for the thermoelectricity separation printed circuit board that efficiency greatly promotes.
To achieve these goals, the technical solution adopted by the present invention is：
A kind of production method of thermoelectricity separation printed circuit board, comprises the following steps,
The position of heat conduction boss on bottom substrate is determined using pattern transfer, using method for chemially etching on bottom substrate
Etch heat conduction boss；
With resin ink coated on bottom substrate, the gap between heat conduction boss is filled and led up, resin ink is toasted
Drying forms insulating layer；
Interconnection metal layer is plated in surface of insulating layer；
The etching conducting circuit on interconnection metal layer；
Surface treatment is carried out to printed circuit board to process with shape molding；
The printed circuit board machined carries out Function detection and visual examination.
As being further improved for said program, the coated with resins ink by the way of vacuum screen printing, the thickness of resin ink
Degree is consistent with heat conduction boss height.
As being further improved for said program, surface of insulating layer is roughened using surface plasma processing method, shape
Into surface-treated layer.
As being further improved for said program, plated using electroless copper plating and the method for electro-coppering on surface-treated layer
Interconnection metal layer.
As being further improved for said program, turn on and leave insulation distance between circuit and heat conduction boss.
As being further improved for said program, the bottom substrate is 5052 alloy aluminium sheets or copper plate.
Beneficial effects of the present invention：
A kind of production method of thermoelectricity separation printed circuit board of the present invention, common FR4 materials are substituted using resin ink
It insulate to bottom substrate and interconnection metal layer, Drilling operation need not be carried out, simpler easy to operate, technological process obtains
Simplify, rejection rate declines, and cost of manufacture declines, and efficiency greatly promotes；And it is bonded more between resin ink and bottom substrate
Closely, the less insulation performance in gap is more preferable.
Description of the drawings
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment
Attached drawing is briefly described.Obviously, described attached drawing is the part of the embodiment of the present invention rather than all implements
Example, without creative efforts, other that can also be obtained according to these attached drawings are set those skilled in the art
Meter scheme and attached drawing：
Fig. 1 is present pre-ferred embodiments structure diagram.
Specific embodiment
The technique effect of the design of the present invention, concrete structure and generation is carried out below with reference to embodiment and attached drawing clear
Chu is fully described by, to be completely understood by the purpose of the present invention, feature and effect.Obviously, described embodiment is this hair
Bright part of the embodiment rather than whole embodiments, based on the embodiment of the present invention, those skilled in the art is not paying
The other embodiment obtained on the premise of creative work, belongs to the scope of protection of the invention.
With reference to Fig. 1, a kind of production method of thermoelectricity separation printed circuit board comprises the following steps,
The position of heat conduction boss 2 on bottom substrate 1 is determined using pattern transfer, using method for chemially etching in bottom substrate
Etch heat conduction boss 2 on 1, the bottom substrate 1 is 5052 alloy aluminium sheets or copper plate, 1 energy of bottom substrate of metal material
It is enough more preferably to distribute the heat of circuit board, improve the heat dissipation performance of circuit board；
With resin ink 3 coated on bottom substrate 1, the gap between heat conduction boss 2 is filled and led up, resin ink 3 is carried out
Baking drying forms insulating layer；The coated with resins ink 3 by the way of vacuum screen printing, thickness and the heat conduction boss 2 of resin ink 3
It is highly consistent.
Surface of insulating layer is roughened using surface plasma processing method, forms surface-treated layer 5, surface-treated layer 5
Adhesive ability it is strong, can so that metal be easier plating, plated using electroless copper plating and the method for electro-coppering on surface-treated layer 5
Interconnection metal layer 4,
The etching conducting circuit on interconnection metal layer 4, turns on and leaves insulation distance between circuit and heat conduction boss 2；
Surface treatment is carried out to printed circuit board to process with shape molding；
The printed circuit board machined carries out Function detection and visual examination.
Common FR4 materials are substituted using resin ink 3 to insulate to bottom substrate 1 and interconnection metal layer 4, it need not
Drilling operation, simpler easy processing are carried out, technological process is simplified, and rejection rate declines, and cost of manufacture declines, and efficiency is significantly
It is promoted；And it is bonded even closer between resin ink 3 and bottom substrate 1, the less insulation performance in gap is more preferable.
The above are being illustrated to presently preferred embodiments of the present invention, but the invention is not limited to the implementation
Example, those skilled in the art can also make a variety of equivalent modifications on the premise of without prejudice to spirit of the invention or replace
It changes, these equivalent modifications or replacement are all contained in the application claim limited range.
Claims (6)
1. a kind of production method of thermoelectricity separation printed circuit board, it is characterised in that：Comprise the following steps,
The position of heat conduction boss on bottom substrate is determined using pattern transfer, is etched using method for chemially etching on bottom substrate
Go out heat conduction boss；
With resin ink coated on bottom substrate, the gap between heat conduction boss is filled and led up, baking drying is carried out to resin ink
Form insulating layer；
Interconnection metal layer is plated in surface of insulating layer；
The etching conducting circuit on interconnection metal layer；
Surface treatment is carried out to printed circuit board to process with shape molding；
The printed circuit board machined carries out Function detection and visual examination.
2. the production method of thermoelectricity separation printed circuit board according to claim 1, it is characterised in that：Using vacuum screen printing
Mode coated with resins ink, the thickness of resin ink is consistent with heat conduction boss height.
3. the production method of thermoelectricity separation printed circuit board according to claim 1, it is characterised in that：Using surface etc. from
Surface of insulating layer is roughened by subprocessing method, forms surface-treated layer.
4. the production method of thermoelectricity separation printed circuit board according to claim 3, it is characterised in that：Using electroless copper plating
Interconnection metal layer is plated on surface-treated layer with the method for electro-coppering.
5. the production method of thermoelectricity separation printed circuit board according to claim 1, it is characterised in that：Circuit is turned on leading
Insulation distance is left between hot boss.
6. the production method of thermoelectricity separation printed circuit board according to claim 1, it is characterised in that：The bottom substrate
For 5052 alloy aluminium sheets or copper plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711406672.2A CN108093561A (en) | 2017-12-22 | 2017-12-22 | A kind of production method of thermoelectricity separation printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711406672.2A CN108093561A (en) | 2017-12-22 | 2017-12-22 | A kind of production method of thermoelectricity separation printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108093561A true CN108093561A (en) | 2018-05-29 |
Family
ID=62178728
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711406672.2A Pending CN108093561A (en) | 2017-12-22 | 2017-12-22 | A kind of production method of thermoelectricity separation printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108093561A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108848615A (en) * | 2018-07-27 | 2018-11-20 | 胜宏科技（惠州）股份有限公司 | A kind of production method of thermoelectricity split circuit plate |
| CN109587955A (en) * | 2018-12-13 | 2019-04-05 | 珠海精路电子有限公司 | A kind of manufacture craft of bilateral circuit base plate |
| CN110112280A (en) * | 2019-05-21 | 2019-08-09 | 安捷利（番禺）电子实业有限公司 | A kind of manufacture craft of thermoelectricity separate circuit boards |
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| CN1384144A (en) * | 2001-02-16 | 2002-12-11 | 太阳油墨制造株式会社 | Thermosetting epoxy resin composition and its formed body and multilayered printed circuit board |
| CN1980541A (en) * | 2005-12-07 | 2007-06-13 | 新光电气工业株式会社 | Method of manufacturing wiring substrate and method of manufacturing electronic component mounting structure |
| CN101608053A (en) * | 2008-06-20 | 2009-12-23 | 太阳油墨制造株式会社 | Hot curing resin composition |
| CN103037628A (en) * | 2011-09-30 | 2013-04-10 | 株式会社东芝 | Apparatus for manufacturing flexible printed wiring board, apparatus for manufacturing wiring board, and applying device |
| CN103947307A (en) * | 2012-02-10 | 2014-07-23 | 太阳油墨制造株式会社 | Wiring circuit, wiring board, and method for manufacturing wiring board |
| CN104904328A (en) * | 2012-11-07 | 2015-09-09 | 印可得株式会社 | Method for manufacturing metal printed circuit board |
| CN205611056U (en) * | 2016-05-12 | 2016-09-28 | 深圳市可瑞电子实业有限公司 | Thermoelectric separation composite metal circuit board |
| CN107278030A (en) * | 2017-06-26 | 2017-10-20 | 胜宏科技（惠州）股份有限公司 | The preparation method that a kind of thermoelectricity separates LED board |
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2017
- 2017-12-22 CN CN201711406672.2A patent/CN108093561A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1384144A (en) * | 2001-02-16 | 2002-12-11 | 太阳油墨制造株式会社 | Thermosetting epoxy resin composition and its formed body and multilayered printed circuit board |
| CN1980541A (en) * | 2005-12-07 | 2007-06-13 | 新光电气工业株式会社 | Method of manufacturing wiring substrate and method of manufacturing electronic component mounting structure |
| CN101608053A (en) * | 2008-06-20 | 2009-12-23 | 太阳油墨制造株式会社 | Hot curing resin composition |
| CN103037628A (en) * | 2011-09-30 | 2013-04-10 | 株式会社东芝 | Apparatus for manufacturing flexible printed wiring board, apparatus for manufacturing wiring board, and applying device |
| CN103947307A (en) * | 2012-02-10 | 2014-07-23 | 太阳油墨制造株式会社 | Wiring circuit, wiring board, and method for manufacturing wiring board |
| CN104904328A (en) * | 2012-11-07 | 2015-09-09 | 印可得株式会社 | Method for manufacturing metal printed circuit board |
| CN205611056U (en) * | 2016-05-12 | 2016-09-28 | 深圳市可瑞电子实业有限公司 | Thermoelectric separation composite metal circuit board |
| CN107278030A (en) * | 2017-06-26 | 2017-10-20 | 胜宏科技（惠州）股份有限公司 | The preparation method that a kind of thermoelectricity separates LED board |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108848615A (en) * | 2018-07-27 | 2018-11-20 | 胜宏科技（惠州）股份有限公司 | A kind of production method of thermoelectricity split circuit plate |
| CN109587955A (en) * | 2018-12-13 | 2019-04-05 | 珠海精路电子有限公司 | A kind of manufacture craft of bilateral circuit base plate |
| CN110112280A (en) * | 2019-05-21 | 2019-08-09 | 安捷利（番禺）电子实业有限公司 | A kind of manufacture craft of thermoelectricity separate circuit boards |
| CN110112280B (en) * | 2019-05-21 | 2020-09-01 | 安捷利（番禺）电子实业有限公司 | Manufacturing process of thermoelectric separation circuit board |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180529 |
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| RJ01 | Rejection of invention patent application after publication |