CN108011051A - Organic light-emitting display panel and display device thereof - Google Patents
Organic light-emitting display panel and display device thereof Download PDFInfo
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- CN108011051A CN108011051A CN201711234889.XA CN201711234889A CN108011051A CN 108011051 A CN108011051 A CN 108011051A CN 201711234889 A CN201711234889 A CN 201711234889A CN 108011051 A CN108011051 A CN 108011051A
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- 239000000758 substrate Substances 0.000 claims abstract description 135
- 238000004806 packaging method and process Methods 0.000 claims abstract description 116
- 238000005538 encapsulation Methods 0.000 claims abstract description 14
- 239000003292 glue Substances 0.000 claims abstract 4
- 238000005401 electroluminescence Methods 0.000 claims description 55
- 229910052751 metal Inorganic materials 0.000 claims description 40
- 239000002184 metal Substances 0.000 claims description 40
- 150000002739 metals Chemical class 0.000 claims description 26
- 238000002955 isolation Methods 0.000 claims description 15
- 239000011800 void material Substances 0.000 claims description 10
- 239000004744 fabric Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 108
- 238000010586 diagram Methods 0.000 description 22
- 230000000694 effects Effects 0.000 description 13
- 239000000463 material Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 229910052750 molybdenum Inorganic materials 0.000 description 5
- 239000011733 molybdenum Substances 0.000 description 5
- 230000008054 signal transmission Effects 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 230000035882 stress Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 210000004209 hair Anatomy 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000013524 data verification Methods 0.000 description 1
- 238000004925 denaturation Methods 0.000 description 1
- 230000036425 denaturation Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The embodiment of the invention provides an organic light-emitting display panel and a display device thereof, relates to the technical field of display, and is used for reducing the frame width of the organic light-emitting display panel. Wherein the organic light emitting display panel includes: a first substrate including a display area and an encapsulation area surrounding the display area; a second substrate disposed opposite to the first substrate; the packaging glue is used for bonding the first substrate and the second substrate together, and the orthographic projection of the packaging glue on the first substrate is positioned in the orthographic projection of the packaging area on the first substrate; the first substrate further comprises a plurality of signal lines, the packaging area comprises a first area, and in the first area, orthographic projections of at least part of the signal lines on the first substrate are overlapped with orthographic projections of at least part of the packaging glue on the first substrate. The organic light emitting display panel is suitable for a display device.
Description
Technical field
The present invention relates to display technology field, more particularly to a kind of organic electroluminescence display panel and its display device.
Background technology
Compared with many display panels, OLED (Organic Light-Emitting Diode, hereinafter referred to as OLED) is aobvious
Show panel and have many advantages, such as actively to shine, high contrast, no angle limit etc. its.OLED display panel not only in volume more
Add it is frivolous, also below other display devices in power consumption, thus contribute to lifted display device cruising ability, therefore, OLED is shown
Show that panel is widely used in display technology field, by as the main product of display device from now on.
More and more with the function of display, the quantity of the various connecting lines being arranged in OLED display panel is also increasingly
More, these connecting lines are arranged in the frame of display device, and the frame size of display device can be caused larger.
With the arrival in comprehensive screen epoch, how to reduce the border width of OLED display panel, currently face in the industry
Main difficult technical.
The content of the invention
The embodiment of the present invention provides a kind of organic electroluminescence display panel and its display device, for reducing OLED display panel
Border width.
In a first aspect, the present invention provides a kind of organic electroluminescence display panel, organic electroluminescence display panel includes：
First substrate, the first substrate include display area and the packaging area around the display area；
The second substrate being oppositely arranged with the first substrate；
For the packaging plastic that the first substrate and the second substrate are bonded together, the packaging plastic is described
The orthographic projection of one substrate is located at the packaging area in the orthographic projection of the first substrate；
The first substrate further includes more signal lines, and the packaging area includes first area,
In the first area, at least partly the orthographic projection of more signal lines on the first substrate with least
Orthographic projection of the part packaging plastic on the first substrate overlaps.
Second aspect, the present invention provide a kind of display device, which is included involved by first aspect present invention
Organic electroluminescence display panel.
Aspect as described above has the beneficial effect that with any possible implementation：
In the present invention, in first area, at least partly more signal lines are set, and at least partly more signal lines are first
Orthographic projection of the orthographic projection with least part packaging plastic on the first substrate on substrate overlaps, that is to say, that this is at least partly more
Signal line is arranged in first area, and due to the part that the first area is packaging area, it will thus be appreciated that at least
Segment signal line is arranged in packaging area., can be by partial amt in the present embodiment for the signal wire of equivalent amount
Signal wire is arranged in packaging area, so as to reduce the width of routing region；Alternatively, for commensurateiy wide signal wire and
Say, the part of signal wire in itself can be arranged in the present embodiment in packaging area, and then reduce the signal wire and take
The width in line region.Above two mode can reduce the border width of organic electroluminescence display panel, and increasing this accordingly has
The width of display area in machine light emitting display panel.For compared with the prior art, the present embodiment can effectively reduce organic hair
The border width of light display panel, beneficial to the realization of narrow frame.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is attached drawing needed in technology description to be briefly described, it should be apparent that, drawings in the following description are this hairs
Some bright embodiments, for those of ordinary skill in the art, without having to pay creative labor, can be with
Other attached drawings are obtained according to these attached drawings.
A kind of structure diagram for the organic electroluminescence display panel that Fig. 1 is provided by the embodiment of the present invention；
Fig. 2 is provided a kind of structure diagram of first substrate by the embodiment of the present invention；
The profile of AA ' positions in Fig. 2 that Fig. 3 is provided by the embodiment of the present invention；
Another structure diagram for the first substrate that Fig. 4 is provided by the embodiment of the present invention；
The profile of BB ' positions in Fig. 4 that Fig. 5 is provided by the embodiment of the present invention；
Another structure diagram for the organic electroluminescence display panel that Fig. 6 is provided by the embodiment of the present invention；
Another structure diagram for the first substrate that Fig. 7 is provided by the embodiment of the present invention；
Another structure diagram for the first substrate that Fig. 8 is provided by the embodiment of the present invention；
Another structure diagram for the organic electroluminescence display panel that Fig. 9 is provided by the embodiment of the present invention；
Another structure diagram for the first substrate that Figure 10 is provided by the embodiment of the present invention；
The profile of CC ' positions in Figure 10 that Figure 11 embodiment of the present invention is provided
Another structure diagram for the first substrate that Figure 12 is provided by the embodiment of the present invention；
The profile of DD ' positions in Fig. 7 that Figure 13 is provided by the embodiment of the present invention；
Another structure diagram for the first substrate that Figure 14 is provided by the embodiment of the present invention；
A kind of profile of EE ' positions in Figure 14 that Figure 15 is provided by the embodiment of the present invention；
Another profile of EE ' positions in Figure 14 that Figure 16 embodiment of the present invention is provided；
Another structure diagram for the first substrate that Figure 17 is provided by the embodiment of the present invention；
Profile in Figure 17 that Figure 18 is provided by the embodiment of the present invention at FF ' positions；
Another profile in Figure 17 that Figure 19 is provided by the embodiment of the present invention at FF ' positions；
The structure diagram for the display device that Figure 20 embodiment of the present invention is provided.
Embodiment
To make the purpose, technical scheme and advantage of the embodiment of the present invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, the technical solution in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is
Part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art
All other embodiments obtained without making creative work, belong to the scope of protection of the invention.
The term used in embodiments of the present invention is only merely for the purpose of description specific embodiment, and is not intended to be limiting
The present invention.In the embodiment of the present invention and " one kind " of singulative used in the attached claims, " described " and "the"
It is also intended to including most forms, unless context clearly shows that other implications.
It should be appreciated that term "and/or" used herein is only a kind of incidence relation for describing affiliated partner, represent
There may be three kinds of relations, for example, A and/or B, can represent：Individualism A, while there are A and B, individualism B these three
Situation.In addition, character "/" herein, it is a kind of relation of "or" to typically represent forward-backward correlation object.
It will be appreciated that though substrate, but these may be described using term first, second etc. in embodiments of the present invention
Substrate should not necessarily be limited by these terms.These terms are only used for substrate being distinguished from each other out.For example, the embodiment of the present invention is not being departed from
In the case of scope, first substrate can also be referred to as second substrate, and similarly, second substrate can also be referred to as the first base
Plate.
It should be noted that the noun of locality such as described " on ", " under " of the embodiment of the present invention, "left", "right" is with attached drawing
Shown angle should not be construed as the restriction to the embodiment of the present invention come what is be described.In addition within a context, it is also necessary to manage
Solution, when mentioning an element and being formed on "above" or "below" another element, it can not only be formed directly into another
A element " on " either " under " can also be indirectly formed by intermediary element another element " on " or " under ".
The present embodiment provides a kind of organic electroluminescence display panel, as shown in Figure 1, it is had by what the embodiment of the present invention provided
A kind of structure diagram of machine light emitting display panel, the organic electroluminescence display panel 500 include first substrate 1 and first substrate 1
The second substrate 2 being oppositely arranged, and the packaging plastic 3 for first substrate 1 and second substrate 2 to be bonded together, it is inevitable, should
Packaging plastic 3 is arranged between first substrate 1 and second substrate 2.
Wherein, as shown in Fig. 2, it is provided a kind of structure diagram of first substrate by the embodiment of the present invention, this first
Substrate 1 includes display area 10 and the packaging area 30 around display area 10, and packaging area 30 is arranged on the side of first substrate 1
Frame surrounding.Packaging plastic 3 is located at packaging area 30 in the orthographic projection of first substrate 1 in the orthographic projection of first substrate 1, that is,
Say, on first direction shown by Fig. 2 100, the maximum of the width of orthographic projection on first substrate 1 of packaging plastic 3 is encapsulation region
The width b in domain 30.
With continued reference to Fig. 2, which further includes more signal lines 4, and packaging area 30 includes first area 301；
In first area 301, the orthographic projection of at least partly more signal lines 4 on first substrate 1 is with least part packaging plastic 3 first
Orthographic projection on substrate 1 overlaps.Packaging area 30 can be interpreted as to the region that packaging plastic 3 is covered in the present embodiment, that is,
The region that the orthographic projection of packaging plastic 3 on first substrate 1 is covered.At this time, " in first area 301, at least partly a plurality of letter
Number orthographic projection of line 4 on first substrate 1 is overlapped with the orthographic projection of at least part packaging plastic 3 on first substrate 1 ", at least may be used
Understand that the signal wire 4 is arranged in the first area 301 of packaging area 30, further there is the following two kinds understanding：
The first, as described in Figure 3, the profile of AA ' positions, a plurality of letter in its Fig. 2 provided by the embodiment of the present invention
The signal wire 4 of partial amt in number line 4 is arranged in first area 301.Signal wire 4 is also possible to be arranged in packaging area 30
The region outside first area 301 is removed, but this example is not particularly limited it.The present embodiment is due to by more bars
The signal wire 4 of a part of quantity in line 4 is arranged in packaging area 30, can reduce routing region (explain in detail and see below) width
Degree, and then reduce the border width of whole organic electroluminescence display panel 500.
Second, as shown in Figure 4 and Figure 5, Fig. 4 is shown by another structure for the first substrate that the embodiment of the present invention provides
It is intended to, the profile of BB ' positions, the part of of signal wire 4 itself are arranged in Fig. 4 that Fig. 5 is provided by the embodiment of the present invention
In first area 301.It is relatively reduced since by signal wire 4, the part of itself is arranged in first area 301 (packaging area)
Signal wire 4 accounts for the width of routing region (as detailed below), and the frame that can significantly reduce organic electroluminescence display panel 500 is wide
Degree.
Certainly, more signal lines 4 are may also comprise in display area 10, not to being arranged on display area 10 in the present embodiment
Place film layer, quantity and the width of signal wire 4 etc. make and being particularly limited to.
Light-emitting component in organic electroluminescence display panel is prepared by organic material, although its have actively shine,
The advantages such as contrast is higher, but the organic material in light-emitting component easily receives the intrusion of aqueous vapor and oxygen so that this shines
Aging and denaturation occur for element, so as to influence brightness and the service life of the light-emitting component.
It is to solve the above-mentioned problems, it is necessary to hermetically sealed to organic electroluminescence display panel progress, using molten in the present embodiment
Packaging technology is connect, i.e., packaging plastic 3 is heated using laser spot, it is molten into liquid, by the frame of first substrate 1 and
The frame of two substrates 2 is bonded together so that forms closed area between first substrate 1 and second substrate 2, obstructs the water in the external world
Invaded with oxygen from the side of the organic electroluminescence display panel 500, further prevent the hair in the organic electroluminescence display panel 500
Optical element contacts water and oxygen.Packaging plastic 3 in the present embodiment can be glass cement (Frit) material, be inhaled in this kind of material containing laser
The property received pigment, it is changed into molten condition after absorbing light, so as to can reach good adhesive effect, sealing effect is preferable.
In order to make the packaging plastic absorb more light, the present embodiment sets at least partly a plurality of letter in first area 301
Number line 4, the orthographic projection of at least partly more signal lines 4 on first substrate 1 with least part packaging plastic 3 on first substrate 1
Orthographic projection overlap, that is to say, that the more signal lines 4 of at least part are arranged in first area 301, and due to firstth area
Domain 301 is a part for packaging area 30, it will thus be appreciated that the signal wire is arranged in packaging area 30.Due to the signal wire
4 material can be metal, and exemplary is metal molybdenum so that the signal wire 4 can reflection laser spot, by the laser spot of reflection again
Secondary irradiation packaging plastic 3, improves irradiation temperature, promotes packaging plastic 3 to the absorbability of laser, reaches preferably fusing effect.
Organic electroluminescence display panel of the prior art includes display area, the routing region of display area periphery, and walks
Line region all around around packaging area.The orthographic projection of the routing region on the first substrate and packaging area are on the first substrate
Orthographic projection no overlap, that is to say, that the routing region and the packaging area around the routing region constitute organic light emission and show
Show the non-display area in panel.More signal lines of the prior art are arranged in the routing region on the outside of display area.Mesh
Before, with the gradual increase of display screen, the signal wire in scanning circuit is that quantity is consequently increased.However, corresponding specific ruler
For very little organic electroluminescence display panel, the quantity of signal wire increases, and will certainly increase the width of routing region, so that accordingly
The width of display area reduces.Furthermore border width increases, and is also disagreed with present fashion trend.
In the present embodiment, in first area 301, at least partly more signal lines 4, at least partly more signal lines are set
4 orthographic projection on first substrate 1 is overlapped with least part 3 orthographic projection on first substrate 1 of packaging plastic, that is to say, that should
At least partly more signal lines 4 are arranged in first area 301, and since the first area 301 is one of packaging area 30
Point, it will thus be appreciated that at least part signal wire is arranged in packaging area 30.For the signal wire of equivalent amount, this reality
Applying in example can be arranged on the signal wire of partial amt in packaging area, so as to reduce the width of routing region；Alternatively, for
For the signal wire of commensurateiy wide, the part of signal wire in itself can be arranged in the present embodiment in packaging area, and then subtract
The small signal wire takes the width of routing region.The frame that above two mode can reduce organic electroluminescence display panel is wide
Degree, increases the width of display area in the organic electroluminescence display panel accordingly.For compared with the prior art, the present embodiment
The border width of organic electroluminescence display panel can effectively be reduced, beneficial to the realization of narrow frame.
In a kind of feasible embodiment, as shown in fig. 6, its organic light emitting display for being provided by the embodiment of the present invention
Another structure diagram of panel, the organic electroluminescence display panel 500 further include area of isolation 20, and area of isolation 20 is arranged on
Between packaging area 30 and display area 10, from packaging area 30 to the direction of display area 10 on, direction as illustrated in FIG. 6
On 100, the width y of area of isolation is 45~55 millimeters.Cabling is also provided between display area 10 and area of isolation 20
Region 60, scanning element 9 can be set in the routing region 60, can be included and at least partly heated easily be burnt in scanning element 9
Device, the setting of area of isolation 20 is to protect device in routing region 60, avoid device from being heated and burn in the present embodiment.
This is because in encapsulation process, the temperature of laser spot is higher, so as to can be heated and burn in encapsulation process there are device
Situation.How to select the scope of the area of isolation, be a technological difficulties, inventor by test of many times, repeatedly conscientious grind
Show that the width of the area of isolation 20 is arranged between 45~55 millimeters after studying carefully, optionally, this can be isolated in the present embodiment
The width in region 20 is arranged to 50 millimeters.When the width of area of isolation 20 is less than 45 millimeters, the device that is arranged in routing region 60
Part distance packaged region 30 is relatively near easily heated and damages；When the width of area of isolation 20 is more than 55 millimeters, although routing region 60
Interior device is not easy to be excited the influence of hot spot, and still, the width increase of area of isolation 20, it is narrow to be unfavorable for organic electroluminescence display panel
The realization of frame, is disagreed with fashion trend.For the organic electroluminescence display panel of specific dimensions, the width of area of isolation
It is larger, then mean that the big width in display area is relatively small, be unfavorable for the realization of narrow frame.
It should be noted that the area of isolation 20 is only in the device for needing and being easily affected by temperature, there are ability during certain distance
It can set；If device and/or cabling (signal wire) high temperature resistant, when laser spot does not influence it significantly, can be not provided with this every
From region 20.
In a kind of feasible embodiment, as shown in fig. 7, its first substrate provided by the embodiment of the present invention is another
A kind of structure diagram, the packaging area 30 are first area 301.Embodiment with reference to shown in above-mentioned Fig. 2 and Fig. 4 can
Know, at least part signal wire 4 may be provided in the first area 301, at this time it is understood that in the present embodiment at least partly
More signal lines 4 are arranged in whole packaging area 30, i.e., relatively greater number of signal wire 4 is arranged in packaging area 30.
Greater number of signal wire 4 is arranged in packaging area 30, can be reduced the width of routing region, be reduced organic light emitting display
The border width of panel 500.Simultaneously as the material of the signal wire is metal molybdenum, in encapsulation process, more laser are reflected
Spot, and then preferable packaging effect.
In one embodiment, as shown in figure 8, another knot of its first substrate provided by the embodiment of the present invention
Structure schematic diagram, the display area 10 include：First display area 101 and at least two second display areas 102, two second aobvious
Show that region 102 is located at the same side of the first display area 101, and there is first area between two the second display areas 102
301.With reference to the embodiment of above-mentioned Fig. 2 and Fig. 4, in the present embodiment, which can be arranged in the first area 301,
That is, the signal wire 4 sets the indentation, there of the organic electroluminescence display panel, the area between two the second display areas 102
Domain can be regarded as the gap regions of the organic electroluminescence display panel.It should be noted that in other implementations, the first display
The quantity of 101 and second display area 102 of region can be multiple, and the quantity of gap regions can also be multiple, the application couple
This is not specifically limited.
In another embodiment, as shown in figure 9, its organic electroluminescence display panel for being provided by the embodiment of the present invention
Another structure diagram, organic electroluminescence display panel 500 it is two neighboring between by connecting while 501 connect, connect
The shape on side 501 is can be arc illustrated in fig. 9, or the shape on the connection side can also be straight line, 4 company of being arranged on of signal wire
In first area 301 at edge fit 501.
In one embodiment, as shown in Figure 10 and Figure 11, the first substrate that Figure 10 is provided by the embodiment of the present invention
Another structure diagram, the profile of CC ' positions, the first substrate in Figure 10 that Figure 11 is provided by the embodiment of the present invention
1 further includes the package metals layer 5 positioned at packaging area 30, the orthographic projection of package metals layer 5 on first substrate 1 and signal wire 4
Orthographic projection no overlap on first substrate 1, that is to say, that be separated from each other, do not have between package metals layer 5 and the signal wire 4
There is a situation where contact, covering.For 4 position of signal wire, it can be opposite for the position of the package metals layer 5
Closer to display area, or it can be relatively distant from display area.In the present embodiment, since the signal of signal wire 4 needs to transmit
Into display area 10 in corresponding circuit, therefore, it is remote that the package metals layer 5 in the present embodiment is arranged on more signal lines 4
The side of display area 10, as shown in Figure 8 and Figure 9.Those skilled in that art are it should be understood that in some realization sides of the application
In formula, the package metals layer and signal wire that are arranged in first area all play reflection laser so as to strengthen the work of packaging effect
With.In the first region in the case of presence signal line, encapsulation gold can not set by the region of signal wire covering in the region
Belong to layer 5, and cause the package metals layer 5 and neighbouring signal wire insulation or in electrical contact.Therefore the embodiment of the present application for
Package metals layer 5 is arranged at signal wire 4 and is relatively distant from display area closer to display area, or signal wire 4 and does not limit specifically
It is fixed, depending on being needed with specific reference to actual design.
It should be noted that the material of the package metals layer 5 in the present embodiment is metal, exemplary is metal molybdenum,
It is reflective it acts as in encapsulation process, being carried out to laser spot, and the laser spot of reflection is irradiated on packaging plastic again so that
Packaging plastic preferably melts, so as to preferably bond first substrate and second substrate.It is also, glutinous after being melted due to the packaging plastic
Degree is higher, after cooling cures, can produce certain stress, in order to which the stress release is fallen, in order to avoid influence sealing performance, this reality
Apply in example and the package metals layer is arranged to engraved structure, so that after the encapsulation adhesive curing, should by the stomata of the hollow out
Power discharges, and reaches good packaging effect.
In addition, package metals layer and signal wire can be located at different film layers, identical film layer may also be at, it is excellent in this example
Choosing, package metals layer is located at same layer with film layer where signal wire.On the one hand can reduce by a step prepares signal for such setting
The step of line or package metals layer, on the other hand in encapsulation process, distance and package metals of the signal wire apart from laser spot
Layer is identical apart from the distance of laser spot so that the amount of laser light reflected in packaging area at each position is balanced, easy to obtain compared with
Good packaging effect.
Further, as shown in figure 12, another structural representation of its first substrate provided by the embodiment of the present invention
Figure, inventor narrow frame and packaging effect in order to balance, have carried out the width of the package metals layer in packaging area deep
Research, draws after multiple data verification, from packaging area 30 to the direction 100 of display area 10, the width of package metals layer 5
To spend for a, the width of packaging area 30 is b, wherein, b/2≤a≤3b/4.Specifically, the width of package metals layer 5 is less than encapsulation
During the half of the width b in region 30, its packaging effect is poor, it is to be understood that the amount of the laser spot of package metals layer reflection
It is smaller, so as to extend the usage time of laser spot, the light-emitting component in display area may be impacted；Package metals layer
After 5 width is smaller, the stress that is also unfavorable for after release encapsulation adhesive curing influences packaging effect.The width of package metals layer is too
Greatly, after 3/4ths of the width of packaging area 30, although packaging effect is preferable, remaining width is smaller, is unfavorable for
Setting signal line, further, even if being provided with signal wire on remaining a quarter width, its border width reduced
It is very limited.The present embodiment is preferable, and the width a of the package metals layer is about 5/8ths of packaging area width.
With continued reference to Figure 10, from packaging area 30 to the direction 100 of display area 10, the width c of signal wire 4 for 20~
30 microns.How to determine the width of signal wire is a technological difficulties, and signal wire is too wide to influence organic electroluminescence display panel
Border width, signal wire is too narrow and signal transmission can be impacted.Inventor show that signal wire 4 exists after deeply studying intensively
From packaging area 30 to the direction 100 of display area 10, its width is 20~30 microns.This is because signal wire 4 is square herein
After being less than 20 microns to the width on 100, the resistance of signal wire 4 is relatively large, and the transmission to signal causes larger obstruction.Letter
After number width of the line 4 on above-mentioned direction 100 is more than 30 microns, although beneficial to the transmission of signal, organic light emission can be shown
Show that the border width of panel broadens, be unfavorable for the realization of narrow frame.This example is preferable, and the signal wire 4 is on above-mentioned direction 100
Width be 25 microns.
The film layer structure of first substrate 1 in the implementation of the application is simply introduced below：
As shown in figure 13, in its Fig. 7 provided by the embodiment of the present invention DD ' positions profile, from first substrate 1 to
On the direction 200 of second substrate 2, first substrate 1 includes substrate layer 50, active layer 11, grid layer 14, capacitance electrode layer 15.Its
In, said structure is arranged in display area 10, also, the first substrate 1 further includes the source electrode being electrically connected with active layer 11
18 are electrically connected with drain electrode 17, source electrode 18 or drain electrode 17 with anode (not shown), anode and luminescent layer (not shown)
It is electrically connected, is additionally provided with cathode (not shown) on luminescent layer, applies voltage between the anode and cathode, then luminescent layer is launched
Go out visible ray.
It is exemplary it is apparent that insulating layer can be set between each Rotating fields, with continued reference to Figure 13, active layer 11 with
Gate insulator 12 is provided between grid layer 14, the first interlayer insulating film is provided between grid layer 14 and capacitance electrode layer 15
13, the second interlayer insulating film 16 is provided between capacitance electrode layer 15 and source electrode 18 and/or drain electrode 17, and in source electrode 18
And/it is additionally provided with passivation layer 19 between drain electrode 17 and anode.
In addition, it is necessary to explanation, what said structure was for realizing the display function of display area and must prepare,
And in packaging area 30, since the packaging area 30 is not used in display, the film layer of needs is optionally prepared, no
All film layers must be prepared, so as to achieve the purpose that to save preparation time.
In a kind of feasible embodiment, as shown in figure 14, its first substrate provided by the embodiment of the present invention
Another structure diagram, first substrate 1 further include a plurality of connecting line 6, and a plurality of connecting line 6 is electrically connected with more signal lines 4；And
6 place film layer of connecting line is different from 4 place film layer of signal wire.With reference to above-described embodiment, a part for signal wire 4 or a plurality of letter
Partial amt signal wire 4 in number line 4 is arranged in packaging area 30, and the frame on the one hand reducing organic electroluminescence display panel is wide
Degree, is on the other hand alternatively arranged as reflecting metal during encapsulation, laser spot is reflected.When signal wire 4 is as reflecting metal, meeting
Irradiated be subject to laser spot, temperature rise, since the heat conductivility of metal is stronger, at this time, if by the reflecting metal (signal wire
4) directly it is connected with the scanning circuit unit in display area 10, then there can be the wind for burning the device in scanning circuit unit
Danger, therefore, avoids the presence of the above problem, i.e., by one end of signal wire 4 and connection by way of thread-changing in the present embodiment
Line 6 is electrically connected, and connecting line 6 is electrically connected with scanning circuit unit again.You need to add is that in the present embodiment, signal wire 4 is with being connected
As long as line 6 is not in same film layer and point connection each other, the present embodiment do not carry out both specific place film layer positions
It is special to limit.
Further, with continued reference to Figure 14, first substrate 1 further includes scanning element 9, and connecting line 6 is not electrically connected with signal wire 4
The one end connect is electrically connected to scanning element 9.It is understood that scanning element is used to provide unlatching scanning letter for each grid line
Number.Signal wire 4 in the present embodiment can provide signal for scanning element.Exemplary, the signal wire 4 arrived involved in the present embodiment
To be at least the one or more in clock cable, high level signal line, low level signal line, initial signal line.For example, should
Signal wire 4 can be clock cable, can be that the scanning element 9 provides clock signal；The signal wire 4 is high level signal line, can
High level signal is provided for the scanning element 9；The signal wire 4 is low level signal, can be that the scanning element 9 provides low level letter
Number；The signal 4 is initial signal, can be that the scanning element 9 provides initial open signal.
Exemplary, the film layer relation where signal wire 4 and connecting line 6 is introduced in the present embodiment：
In a kind of specific embodiment, one kind of EE ' positions in Figure 14 that Figure 15 is provided by the embodiment of the present invention
Profile, can be located at same layer in the present embodiment by 4 place film layer of signal wire and grid layer 14；6 place film layer of connecting line and electricity
Hold electrode layer 15 and be located at same layer.On the one hand, capacitance electrode layer 15 and grid layer are all metallic diaphragms, and the exemplary metal can
For metal molybdenum, at this time, signal wire 4 is identical with the material of connecting line 6, may be such that both signal transmission performances are consistent, can't
Transmission to signal impacts；On the other hand, signal wire 4 is located at same film layer, connecting line 6 and capacitance electrode with grid layer 14
Layer 15 is located at same film layer, since grid layer 14 (signal wire 4) is close with the film layer of capacitance electrode layer 15 (connecting line 6), is easy to
Signal wire 4 is electrically connected with connecting line 6.Exemplary, the present embodiment can be by way of punching by signal wire 4 and connecting line 6
It is electrically connected.It should be noted that this example of the concrete structure of scanning element 9 is not unfolded to discuss to it.
In another specific embodiment, EE ' positions is another in Figure 14 that Figure 16 is provided by the embodiment of the present invention
A kind of profile, 4 place film layer of signal wire are located at same layer with capacitance electrode layer 15；6 place film layer of connecting line and grid layer 14
Positioned at same film layer.On the one hand, capacitance electrode layer 15 and grid layer are all metallic diaphragms, and the exemplary metal can be metal
Molybdenum, at this time, signal wire 4 are identical with the material of connecting line 6, may be such that both signal transmission performances are consistent, can't be to signal
Transmission impact；On the other hand, signal wire 4 is located at same film layer, connecting line 6 and grid layer 14 with capacitance electrode layer 15
In same film layer, since grid layer 14 (connecting line 6) is close with the film layer of capacitance electrode layer 15 (signal wire 4), easy to signal wire 4
With being electrically connected for connecting line 6.
In one embodiment, as shown in Figure 17 and Figure 18, the first substrate that Figure 17 is provided by the embodiment of the present invention
Another structure diagram, a kind of profile in Figure 17 that Figure 18 is provided by the embodiment of the present invention at FF ' positions, first
Substrate 1 includes the substrate layer 50 and array layer 40 being stacked, and array layer 40 includes more signal lines 4, and array layer 40 is positioned at lining
Bottom 50 is close to the side of second substrate 2；Through hole 7 is provided with array layer 40, orthographic projection of the through hole 7 on substrate layer 50 is located at
In orthographic projection on substrate layer 50, packaging plastic 3 is filled in through hole 7 packaging plastic 3, and is contacted by through hole 7 with substrate layer 50.
It should be noted that since the orthographic projection of the through hole 7 on substrate layer 50 is located at packaging plastic 3 on substrate layer 50
In orthographic projection, it will be appreciated that be that the through hole 7 is located in packaging area 30.Also, the through hole 7 is engraved structure, that is to say, that logical
Film layer structure at 7 position of hole is removed.Further, since the adhesive power between packaging plastic 3 and glass is stronger, therefore this reality
Packaging plastic 3 is directly contacted with substrate layer 50 (substrate glass) by through hole 7 in applying, can effectively lift-off seal performance.
Rotating fields are prepared on the substrate glass (substrate layer 50), which can be referred to as array layer 40, also
It is to say, which may include the above-mentioned Rotating fields being related to, for example, active layer 11, grid layer 14 and capacitance electrode layer 15
Deng.
In a kind of specific embodiment, with continued reference to Figure 17 and Figure 18, from packaging area 30 to display area 10
On direction 100, a plurality of through hole 7 is intervally arranged with more signal lines 4；Orthographic projection of the signal wire 4 on substrate layer 50 exists with through hole 7
Orthographic projection no overlap on substrate layer.Signal wire 4 is spaced with through hole 7, it will be appreciated that is letter adjacent in packaging area 30
Region between number line 4 sets through hole 7, since through hole is without the extra region of additionally occupancy packaging area, will not increase
The width of packaging area 30；On the other hand, the viscosity of packaging plastic 3 itself is higher, some gas can be formed in its flow process
Bubble, these bubbles can play the role of discharging stress well after the curing of packaging plastic 3, and then lift packaging effect.Need
Bright, through hole 7 can be multiple discrete vias between signal wire 4 or more between signal wire 4
A via communicates with each other the groove to be formed, i.e. through hole 7 can be formed as the groove being arranged between any two signal line 4,
On the direction of first substrate, the film layer at groove location is removed the perforation knot to be formed from groove top to bottom
Structure.On the extending direction parallel to signal wire, the length of groove can be more than or equal to the length of each signal wire or by
The separate structure that multistage groove is formed.The specific set-up mode of the embodiment of the present application through hole 7 can have it is a variety of, specifically can be according to reality
Depending on border needs.
In another specific embodiment, as shown in figure 19, in its Figure 17 provided by the embodiment of the present invention
Another profile at FF ' positions, array layer 40 include the inorganic layer 401 close to 2 side of second substrate positioned at signal wire 4；
Void region 8 is provided with inorganic layer 401, orthographic projection of the void region 8 on substrate layer 50 is located at packaging plastic 3 in substrate layer 50
On orthographic projection in, packaging plastic 3 is filled in void region 8, and is contacted by void region 8 with signal wire 4.In the present embodiment
Film layer of the signal wire 4 close to 2 side of second substrate will be arranged on to remove, so that void region 8 is formed, due in the void region 8
Packaging plastic 3 can be filled, so as to add the amount of packaging plastic 3, improves packaging effect.Further, since the signal wire 4 can be used as reflection
Metal, signal wire is after the film layer structure of 2 side of second substrate removes, without screening of the film layer to signal wire 4 (reflective metals)
Gear, the reflecting effect of signal wire 4 are improved.
The present embodiment provides a kind of display device, as shown in figure 20, its display device provided by the embodiment of the present invention
Structure diagram, the display device 400 include the present embodiment involved by organic electroluminescence display panel 500.Need to illustrate
, Figure 20 using mobile phone as display device exemplified by carry out example, but display device is not limited to mobile phone, specifically, this is aobvious
Showing device can include but is not limited to personal computer (Personal Computer, PC), personal digital assistant (Personal
Digital Assistant, PDA), radio hand-held equipment, tablet computer (Tablet Computer), MP4 players or TV
Any electronic equipment with display function such as machine.
Organic electroluminescence display panel provided by the invention and its display device, in first area, are set at least partly more
Signal line, at least partly orthographic projection of more signal lines on the first substrate and at least part packaging plastic are on the first substrate
Orthographic projection overlaps, that is to say, that and the more signal lines of at least part are arranged in first area, and since the first area is envelope
The part in region is filled, it will thus be appreciated that at least part signal wire is arranged in packaging area.For the signal of equivalent amount
For line, the signal wire of partial amt can be arranged in the present embodiment in packaging area, so as to reduce the width of routing region
Degree；Alternatively, for the signal wire of commensurateiy wide, the part of signal wire in itself encapsulation region can be arranged in the present embodiment
In domain, and then reduce the width that the signal wire takes routing region.Above two mode can reduce organic light emitting display face
The border width of plate, increases the width of display area in the organic electroluminescence display panel accordingly.Compared with the prior art and
Speech, the present embodiment can effectively reduce the border width of organic electroluminescence display panel, beneficial to the realization of narrow frame.
Finally it should be noted that：The above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Pipe is described in detail the present invention with reference to foregoing embodiments, it will be understood by those of ordinary skill in the art that：Its according to
Can so modify to the technical solution described in foregoing embodiments, either to which part or all technical characteristic into
Row equivalent substitution；And these modifications or replacement, the essence of appropriate technical solution is departed from various embodiments of the present invention technology
The scope of scheme.
Claims (19)
- A kind of 1. organic electroluminescence display panel, it is characterised in that including：First substrate, the first substrate include display area and the packaging area around the display area；The second substrate being oppositely arranged with the first substrate；For the packaging plastic that the first substrate and the second substrate are bonded together, the packaging plastic is in first base The orthographic projection of plate is located at the packaging area in the orthographic projection of the first substrate；The first substrate further includes more signal lines, and the packaging area includes first area,In the first area, orthographic projection of at least partly described more signal lines on the first substrate and at least part Orthographic projection of the packaging plastic on the first substrate overlaps.
- 2. organic electroluminescence display panel according to claim 1, it is characterised in that the first substrate is further included positioned at institute The package metals layer of packaging area is stated, the package metals layer is arranged on one of more signal lines away from the display area Side.
- 3. organic electroluminescence display panel according to claim 2, it is characterised in that the package metals layer and the signal Film layer where line is located at same layer.
- 4. organic electroluminescence display panel according to claim 2, it is characterised in that from the packaging area to the display On the direction in region, the width of the package metals layer is a, and the width of the packaging area is b,Wherein, b/2≤a≤3b/4.
- 5. organic electroluminescence display panel according to claim 1, it is characterised in that the signal wire is believed to be at least clock One or more in number line, high level signal line, low level signal line, initial signal line.
- 6. organic electroluminescence display panel according to claim 5, it is characterised in that from the packaging area to the display On the direction in region, the width of the signal wire is 20~30 microns.
- 7. organic electroluminescence display panel according to claim 1, it is characterised in that from the first substrate to described second On the direction of substrate, the first substrate includes active layer, grid layer, capacitance electrode layer.
- 8. organic electroluminescence display panel according to claim 7, it is characterised in thatThe first substrate further includes a plurality of connecting line, and a plurality of connecting line is electrically connected with a plurality of signal wire；And film layer is different from film layer where the signal wire where the connecting line.
- 9. organic electroluminescence display panel according to claim 8, it is characterised in thatFilm layer is located at same layer with the grid layer where the signal wire；Film layer is located at same layer with the capacitance electrode layer where the connecting line.
- 10. organic electroluminescence display panel according to claim 8, it is characterised in thatFilm layer is located at same layer with the capacitance electrode layer where the signal wire；Film layer is located at same film layer with the grid layer where the connecting line.
- 11. organic electroluminescence display panel according to claim 8, it is characterised in thatThe first substrate further includes scanning element,One end that the connecting line is not electrically connected with the signal wire is electrically connected to the scanning element.
- 12. organic electroluminescence display panel according to claim 1, it is characterised in thatThe first substrate includes the substrate layer and array layer being stacked, and the array layer includes more signal lines, institute State array layer and be located at the substrate layer close to the side of the second substrate；Through hole is provided with the array layer, orthographic projection of the through hole on the substrate layer is located at the packaging plastic described In orthographic projection on substrate layer, the packaging plastic is filled in the through hole, and is contacted by the through hole with the substrate layer.
- 13. organic electroluminescence display panel according to claim 12, it is characterised in thatOn from the packaging area to the direction of the display area, a plurality of through hole is arranged with a plurality of signal wire interval Cloth；Orthographic projection of the signal wire on the substrate layer and orthographic projection no overlap of the through hole on the substrate layer.
- 14. organic electroluminescence display panel according to claim 12, it is characterised in thatThe array layer includes the inorganic layer close to the second substrate side positioned at the signal wire；Void region is provided with the inorganic layer, orthographic projection of the void region on the substrate layer is located at the encapsulation In orthographic projection on the substrate layer, the packaging plastic is filled in the void region glue, and passes through the void region Contacted with the signal wire.
- 15. organic electroluminescence display panel according to claim 1, it is characterised in that further include：Area of isolation, the area of isolation are arranged between the packaging area and the display area, from the packaging area To the direction of the display area, the width of the area of isolation is 45~55 millimeters.
- 16. organic electroluminescence display panel according to claim 1, it is characterised in that the display area includes：First display area and at least two second display areas, two second display areas are located at first viewing area The same side in domain, and there is first area between two second display areas.
- 17. organic electroluminescence display panel according to claim 1, it is characterised in that the organic electroluminescence display panel It is two neighboring between by connecting while connect, it is described connection side shape be arc or straight line, the signal wire is arranged on In first area at the connection side.
- 18. organic electroluminescence display panel according to claim 1, it is characterised in that the packaging area is described first Region.
- 19. a kind of display device, it is characterised in that including such as claim 1~18 any one of them organic light emitting display face Plate.
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| CN201711234889.XA CN108011051B (en) | 2017-11-30 | 2017-11-30 | Organic light-emitting display panel and display device thereof |
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