CN108010893A - Minitype radiator and its manufacture method based on lotus leaf microcosmic surface - Google Patents
Minitype radiator and its manufacture method based on lotus leaf microcosmic surface Download PDFInfo
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- CN108010893A CN108010893A CN201810007121.7A CN201810007121A CN108010893A CN 108010893 A CN108010893 A CN 108010893A CN 201810007121 A CN201810007121 A CN 201810007121A CN 108010893 A CN108010893 A CN 108010893A
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- lotus leaf
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- 240000002853 Nelumbo nucifera Species 0.000 title claims abstract description 50
- 235000006508 Nelumbo nucifera Nutrition 0.000 title claims abstract description 50
- 235000006510 Nelumbo pentapetala Nutrition 0.000 title claims abstract description 50
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 238000000034 method Methods 0.000 title claims abstract description 22
- 239000011664 nicotinic acid Substances 0.000 claims abstract description 11
- 238000012546 transfer Methods 0.000 claims abstract description 9
- 238000007639 printing Methods 0.000 claims abstract description 7
- 230000005855 radiation Effects 0.000 claims description 20
- 238000013461 design Methods 0.000 claims description 7
- 230000008676 import Effects 0.000 claims description 3
- 239000011159 matrix material Substances 0.000 claims description 3
- 238000012360 testing method Methods 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 9
- 238000005516 engineering process Methods 0.000 abstract description 6
- 238000010146 3D printing Methods 0.000 abstract description 4
- 238000004377 microelectronic Methods 0.000 abstract description 4
- 238000000605 extraction Methods 0.000 abstract description 3
- 238000007493 shaping process Methods 0.000 abstract description 3
- 238000000465 moulding Methods 0.000 abstract description 2
- 230000008859 change Effects 0.000 description 3
- 238000012795 verification Methods 0.000 description 3
- 235000001968 nicotinic acid Nutrition 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 241000196324 Embryophyta Species 0.000 description 1
- 241001465754 Metazoa Species 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000003416 augmentation Effects 0.000 description 1
- 230000003592 biomimetic effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention disclose a kind of minitype radiator and its manufacture method based on lotus leaf microcosmic surface, the heat sink of lotus leaf surface microstructure microelectronics radiator is prepared using 3D printing technique, can effective one-pass molding, especially closing space shaping complexity micro-structure.The fin surface manufactured by this method has the stronger coefficient of heat transfer, realizes that the heat sink prepared compared with classical production process has stronger heat exchange property.Manufacture method is simple, is suitable for the production of bionic surface structure product, according to the requirement of patent, first has to the microstructure data using Reverse Engineering Technology extraction lotus leaf surface, the data extracted is carried out three-dimensional modeling, input 3D printer carries out finished product printing.According to lotus leaf microscale surface features, lotus leaf appearance shape is designed on minitype radiator heat sink, adds radiating efficiency on unit heat dissipation area, there is obvious humidification to the heat dissipation performance of heat sink.
Description
Technical field
The present invention relates to heat transfer enhancement technology field, and in particular to a kind of minitype radiator based on lotus leaf microcosmic surface and
Its manufacture method.
Background technology
At present, electronics industry rapid development so that PCB circuit board on integrated component highly dense, complex circuit
Change, packaging density centralization, and then increase the heat flow density of the element in PCB circuit board, temperature rises.In addition, PCB circuits
The scantling and shape of element on plate constantly reduce, and also make the increase of its temperature even more serious.Particularly in PCB circuit board
CPU processor, its temperature can be with the continuous rise of the calculating speed of its handled data, heat release increases, if CPU processor exists
The heat produced in work cannot solve, and can not only allow the speed of service of CPU processor to become slow, but also can accelerate old
Change, can also CPU is failed when situation is serious, What is more can burn chip.Therefore the design of cpu heat just seems with manufacture
It is particularly important that.And with the continuous renewal of technology, common cpu heat is not enough to solve CPU heat dissipation problems now, so
It is urgent problem now to design new cpu heat or existing cpu heat is optimized.
At present, the reinforcing in the world to enhanced heat exchange surface is prepared growing, and many researchers study various one after another
Physics and chemistry manufacture, and such as photoetching process, interferometric method, fold method and electrical spinning method change original smooth surface.But these
In method there is stress variation involved in manufacturing process, being aligned of mould, standby maintenance expense is high the shortcomings of, and there are a pass
The factor of key is the requirement that required precision cannot reach biological surface microstructure, when preparing biological microcosmic surface, to biology
The size class on surface is high, and microscopic surface texture is prepared bionical there are reasons such as irregular shapes with these traditional methods
Surface.The feature of biosurface structure is not embodied preferably, thus, prepared product cannot show bionical well
Function.
The content of the invention
The present invention provides a kind of minitype radiator and its manufacture method based on lotus leaf microcosmic surface, it can not only increase scattered
The heat transfer area of hot device, reaches the effect of augmentation of heat transfer, and can reduce the volume and manufacture cost of radiator.
To solve the above problems, the present invention is achieved by the following technical solutions：
Based on the minitype radiator of lotus leaf microcosmic surface, including heat-dissipating frame and be arranged in heat-dissipating frame more than 2
Heat sink；Above-mentioned heat-dissipating frame is hollow rectangular cavities, opens on front and rear 2 opposite flanks of its heat-dissipating frame and sets respectively
There is heat emission hole；All heat sinks are vertically arranged in the internal cavities of heat-dissipating frame；These heat sinks are spaced and parallel
Set；Gap between every 2 heat sinks forms heat exchanger channels, and the both ends of the heat exchanger channels are communicated with heat emission hole respectively, exchanges heat
Medium is flowed into from the side heat emission hole of heat-dissipating frame, and after flowing through the heat exchanger channels between 2 heat sinks, from the another of heat-dissipating frame
Side heat emission hole outflow；Every heat sink is sheet, several convex columnar heat radiation points are provided with the surface of heat sink,
And these heat radiation points are in aligned transfer on the surface of heat sink.
In such scheme, heat transferring medium is air.
In such scheme, heat radiation point is cylinder.
In such scheme, all heat radiation points arrange on the surface of heat sink in regular matrix.
In such scheme, heat-dissipating frame, heat sink and heat radiation point are made by albronze.
The manufacture method of minitype radiator based on lotus leaf microcosmic surface, includes the manufacture of heat sink, the heat sink
It is as follows that manufacture specifically includes step：
Step 1, with reverse engineering software to lotus leaf microcosmic surface carry out 3-D scanning handle, therefrom extract lotus leaf
The characteristic point cloud of microscopic surface texture；
The characteristic point cloud of the lotus leaf microscopic surface texture extracted, is embedded into given design space coordinate by step 2
In, obtain vector parameter set；
Step 3, from vector parameter set randomly select indicatrix to build bionic curved surface；
Step 4, carry out slickness, continuity and error-detecting to bionic curved surface；When the testing result of bionic curved surface meets
It is required that when, then create heat sink threedimensional model；Otherwise, return to step 3；
Step 5, import the threedimensional model for creating heat sink in 3D printer system, and generates the stl file of heat sink；
Step 6, generate control print parameters according to the stl file of heat sink, and completes to be based on lotus leaf microcosmic surface accordingly
Minitype radiator heat sink printing.
Compared with prior art, the bionical air-cooled minitype radiator of the invention based on lotus leaf microcosmic surface, according to lotus leaf
Microscale surface features, lotus leaf appearance shape is designed on minitype radiator heat sink, this bionical microcosmic compared to smooth surface
Surface texture increases heat dissipation area 25%-50%, radiating efficiency on unit heat dissipation area is added, to the heat dissipation performance of heat sink
With obvious humidification, this bionical air-cooled minitype radiator based on lotus leaf microcosmic surface can be widely used for microelectronics
The fields such as chip, high-capacity LED.In addition, the present invention is based on bionics principle, by bionics principle, pass through reverse work
Journey technology applies to nature animals and plants microscopic surface texture on minitype radiator, and lotus leaf table is prepared using 3D printing technique
The heat sink of face microstructure microelectronics radiator, can effective one-pass molding, especially in the complicated small knot of the space of closing shaping
Structure.The fin surface manufactured by this method has the stronger coefficient of heat transfer, realizes and is dissipated compared with prepared by classical production process
Backing has stronger heat exchange property.Manufacture method is simple, is suitable for the production of bionic surface structure product, according to wanting for patent
Ask, first have to the microstructure data using Reverse Engineering Technology extraction lotus leaf surface, the data extracted are carried out three-dimensional
Modeling, preserves STL forms, inputs 3D printer, carries out finished product printing.
Brief description of the drawings
Fig. 1 is the dimensional structure diagram of the minitype radiator based on lotus leaf microcosmic surface.
Fig. 2 is the main view enlarged drawing of heat sink.
Fig. 3 is the left view enlarged drawing of heat sink.
Fig. 4 is the manufacture method flow chart of the minitype radiator based on lotus leaf microcosmic surface.
Figure label：1st, heat-dissipating frame；2nd, heat sink；3rd, heat radiation point；4、CPU
Embodiment
For the object, technical solutions and advantages of the present invention are more clearly understood, below in conjunction with instantiation, and with reference to attached
Figure, the present invention is described in more detail.It should be noted that the direction term mentioned in example, such as " on ", " under ",
" in ", " left side " " right side ", "front", "rear" etc., be only refer to the attached drawing direction.Therefore, the direction used is intended merely to explanation
For limiting the scope of the invention.
A kind of minitype radiator based on lotus leaf microcosmic surface, as shown in Figs. 1-3, including heat-dissipating frame 1 and be arranged on it is scattered
The heat sink 2 of more than 2 in hot frame 1.
Above-mentioned heat-dissipating frame 1 is hollow rectangular cavities, its overall dimension is 51mm × 50mm × 15mm.The heat-dissipating frame
Opened on 1 front and rear 2 opposite flanks and be respectively equipped with heat emission hole.The inside that all heat sinks 2 are vertically arranged in heat-dissipating frame 1 is empty
In chamber.These heat sinks 2 are spaced and are arranged in parallel.Gap between every 2 heat sinks 2 forms heat exchanger channels, the heat exchange
The both ends of passage are communicated with heat emission hole respectively, and heat transferring medium is flowed into from the side heat emission hole of heat-dissipating frame 1, and flows through 2 heat dissipations
After heat exchanger channels between piece 2, flowed out from the opposite side heat emission hole of heat-dissipating frame 1.In the present invention, heat transferring medium is according to reality
Application environment is selected, and such as can be refrigerant or air, in a preferred embodiment of the invention, the selected heat exchange changed is situated between
Matter is air.
Every heat sink 2 is sheet.The heat sink 2 is that have imitative lotus leaf microscale surface features, the i.e. table of heat sink 2
Several convex columnar heat radiation points 3 are provided with face, these heat radiation points 3 can be prism-shaped, or cylindric.At this
In invention preferred embodiment, all heat radiation points 3 are cylinder, its a diameter of 1mm, a height of 1mm.With on a piece of heat sink 2
All heat radiation points 3 are in aligned transfer on the surface of heat sink 2.In order to preferably drain and radiate, in the preferred embodiment of the present invention
In, all heat radiation points 3 arrange on the surface of heat sink 2 in regular matrix, and line-spacing and 2 row heat radiation points between 2 row heat radiation points 3
Row between 3 are 1mm away from equal.
In the present invention, heat-dissipating frame 1, heat sink 2 and heat radiation point 3 are made from a material that be thermally conductive.It is preferable to carry out in the present invention
In example, heat-dissipating frame 1, heat sink 2 and heat radiation point 3 are made by albronze, it is with enough hardness, cheap, weight
The advantages that amount is gently and heat conductivility is good.
The present invention is applied in air-cooled CPU4 radiators, in use, CPU4 to be arranged on to the upper surface of heat-dissipating frame 1.
When CPU4 works, substantial amounts of heat is produced with the continuous improvement of arithmetic speed, passes through the bottom of air-cooled CPU4 radiators
Face contacts with CPU4 and conducts heat on bottom surface, then is contacted by bottom surface with imitative lotus leaf microcosmic surface fan-cooled radiator heat sink 2
Heat transfer, the heat being transmitted to by bottom surface on heat sink 2 by exchanging heat again by the heat exchanger channels wall of heat sink 2, being finally situated between again
Mass flow is moved, and heat is seen off.And based on imitative lotus leaf microscopic surface texture design, compared to smooth surface, this bionical microcosmic surface
Structure increases heat dissipation area 25%-50%, adds radiating efficiency on unit heat dissipation area.The imitative lotus leaf microcosmic surface of the present invention
Air-cooled CPU4 radiator fins 2 are made by albronze, possess enough hardness, cheap, light-weight, thermal conductivity
Can be also not poor, there is provided economical and practical raw material, improve practicality.
Required in view of the size of the lotus leaf surface microstructure in 1mm.It is and same in lotus leaf surface microstructure
The anisotropy requirement large scale cylinder meets the hydrophobicity of lotus leaf surface in high 1mm or so, wide 1mm or so, its structure.
In order to reach this required precision, and the heat sink 2 that preferably imitative lotus leaf surface is microcosmic is prepared with this realize, enhancing is micro-
The heat exchange property of electronic heat sink, the present invention devise a kind of manufacture method of the minitype radiator based on lotus leaf microcosmic surface,
Include the manufacture of heat sink 2, as shown in figure 4, to specifically include step as follows for the manufacture of its heat sink 2：
Step 1, with reverse engineering software to lotus leaf microcosmic surface carry out 3-D scanning handle, therefrom extract lotus leaf
The characteristic point cloud of microscopic surface texture；
The characteristic point cloud of the lotus leaf microscopic surface texture extracted, is embedded into given design space coordinate by step 2
In, obtain vector parameter set；
Step 3, from vector parameter set randomly select indicatrix to build bionic curved surface；
Step 4, carry out slickness, continuity and error-detecting to bionic curved surface；When the testing result of bionic curved surface meets
It is required that when, then create heat sink 2 threedimensional model；Otherwise, return to step 3；
Step 5, by create heat sink 2 threedimensional model import 3D printer system in, and generate heat sink 2 STL text
Part；
Step 6, generate control print parameters according to the stl file of heat sink 2, and completes to be based on lotus leaf microcosmic surface accordingly
The heat sink 2 of minitype radiator print.
2 model of heat sink for a kind of lotus leaf surface structure microelectronics radiator established before manufacture, the surface of the model
Data it is identical with the lotus leaf surface data that extraction acquires, which is preserved and is saved in into STL forms and is input to 3D printing
In machine, designed parameter value should reach the manufacture method required precision.After importing model, the parameter that need to be printed
Value, is 0.2mm by the precision setting of printing, and then heat sink 2 carries out slicing treatment, sets level filling rate, the support of printing
Frame, floor height etc., the speed and temperature of nozzle will also be carried out afterwards by completing these.The design of these parameters influences whether shaping matter
Amount, is even more important for the surface quality of heat sink 2.3D printing can prepare the heat sink of radiator using PLA as raw material
2。
Contrast verification surface, by measuring instrument after amplification, whether the surface quality for contrasting finished product meets what is designed at first
Data, if do not met, it is necessary to readjusting parameter carries out printing verification, also need to contact water droplet on its surface after structure verification
Whether angle size and wetability are with being tested as lotus leaf surface, the final heat sink 2 for obtaining biomimetic features.
It should be noted that although embodiment of the present invention is illustrative above, but it is to the present invention that this, which is not,
Limitation, therefore the invention is not limited in above-mentioned embodiment.Without departing from the principles of the present invention, it is every
The other embodiment that those skilled in the art obtain under the enlightenment of the present invention, is accordingly to be regarded as within the protection of the present invention.
Claims (6)
1. based on the minitype radiator of lotus leaf microcosmic surface, it is characterized in that, including heat-dissipating frame (1) and it is arranged on heat-dissipating frame
(1) heat sink (2) of more than 2 in；
Above-mentioned heat-dissipating frame (1) is hollow rectangular cavities, and difference is opened on front and rear 2 opposite flanks of its heat-dissipating frame (1)
Equipped with heat emission hole；All heat sinks (2) are vertically arranged in the internal cavities of heat-dissipating frame (1)；These heat sinks (2) are mutual
Spaced, parallel is set；Gap between every 2 heat sinks (2) forms heat exchanger channels, and the both ends of the heat exchanger channels are respectively with dissipating
Hot hole communicates, and heat transferring medium is flowed into from the side heat emission hole of heat-dissipating frame (1), and the heat exchange flowed through between 2 heat sinks (2) is led to
Behind road, flowed out from the opposite side heat emission hole of heat-dissipating frame (1)；
Every heat sink (2) is sheet, several convex columnar heat radiation points (3) are provided with the surface of heat sink (2), and
These heat radiation points (3) are in aligned transfer on the surface of heat sink (2).
2. the minitype radiator according to claim 1 based on lotus leaf microcosmic surface, it is characterized in that, heat transferring medium is sky
Gas.
3. the minitype radiator according to claim 1 based on lotus leaf microcosmic surface, it is characterized in that, heat radiation point (3) is circle
Cylindricality.
4. the minitype radiator according to claim 1 based on lotus leaf microcosmic surface, it is characterized in that, all heat radiation points (3)
Arranged on the surface of heat sink (2) in regular matrix.
5. the minitype radiator according to claim 1 based on lotus leaf microcosmic surface, it is characterized in that, heat-dissipating frame (1), dissipate
Backing (2) and heat radiation point (3) are made by albronze.
6. the manufacture method of the minitype radiator based on lotus leaf microcosmic surface described in claim 1, includes the system of heat sink (2)
Make, it is characterised in that：It is as follows that the manufacture of the heat sink (2) specifically includes step：
Step 1, with reverse engineering software to lotus leaf microcosmic surface carry out 3-D scanning handle, therefrom extract lotus leaf it is microcosmic
The characteristic point cloud of surface texture；
The characteristic point cloud of the lotus leaf microscopic surface texture extracted, be embedded into given design space coordinate by step 2, obtains
To vector parameter set；
Step 3, from vector parameter set randomly select indicatrix to build bionic curved surface；
Step 4, carry out slickness, continuity and error-detecting to bionic curved surface；When the testing result of bionic curved surface meets the requirements
When, then create heat sink (2) threedimensional model；Otherwise, return to step 3；
Step 5, will create heat sink (2) threedimensional model import 3D printer system in, and generate heat sink (2) STL text
Part；
Step 6, generate control print parameters according to the stl file of heat sink (2), and completes accordingly based on lotus leaf microcosmic surface
Heat sink (2) printing of minitype radiator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810007121.7A CN108010893A (en) | 2018-01-04 | 2018-01-04 | Minitype radiator and its manufacture method based on lotus leaf microcosmic surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810007121.7A CN108010893A (en) | 2018-01-04 | 2018-01-04 | Minitype radiator and its manufacture method based on lotus leaf microcosmic surface |
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| Publication Number | Publication Date |
|---|---|
| CN108010893A true CN108010893A (en) | 2018-05-08 |
Family
ID=62049624
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810007121.7A Pending CN108010893A (en) | 2018-01-04 | 2018-01-04 | Minitype radiator and its manufacture method based on lotus leaf microcosmic surface |
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| Country | Link |
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| CN (1) | CN108010893A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112687641A (en) * | 2020-12-19 | 2021-04-20 | 复旦大学 | Method for preparing semiconductor power module heat dissipation water channel through 3D printing |
| CN114433874A (en) * | 2021-12-22 | 2022-05-06 | 首都航天机械有限公司 | Design and manufacturing method of leaf-tissue-imitated porous radiator |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1423838A (en) * | 2000-02-18 | 2003-06-11 | 英特尔公司 | Parallel-plate/pin-fin hybrid copper heat sink for coding high-powered microprocessor |
| US20090065174A1 (en) * | 2007-09-10 | 2009-03-12 | Yu-Jen Lai | Heat sink for an electrical device and method of manufacturing the same |
| CN201589547U (en) * | 2009-08-09 | 2010-09-22 | 隋秀华 | Novel air cooler |
| WO2013153486A1 (en) * | 2012-04-10 | 2013-10-17 | Koninklijke Philips N.V. | Heat sink |
| CN105877875A (en) * | 2016-05-27 | 2016-08-24 | 华南理工大学 | Personalized thyroid cartilage prosthesis and production method thereof |
-
2018
- 2018-01-04 CN CN201810007121.7A patent/CN108010893A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1423838A (en) * | 2000-02-18 | 2003-06-11 | 英特尔公司 | Parallel-plate/pin-fin hybrid copper heat sink for coding high-powered microprocessor |
| US20090065174A1 (en) * | 2007-09-10 | 2009-03-12 | Yu-Jen Lai | Heat sink for an electrical device and method of manufacturing the same |
| CN201589547U (en) * | 2009-08-09 | 2010-09-22 | 隋秀华 | Novel air cooler |
| WO2013153486A1 (en) * | 2012-04-10 | 2013-10-17 | Koninklijke Philips N.V. | Heat sink |
| CN105877875A (en) * | 2016-05-27 | 2016-08-24 | 华南理工大学 | Personalized thyroid cartilage prosthesis and production method thereof |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112687641A (en) * | 2020-12-19 | 2021-04-20 | 复旦大学 | Method for preparing semiconductor power module heat dissipation water channel through 3D printing |
| CN112687641B (en) * | 2020-12-19 | 2022-09-27 | 复旦大学 | Method for preparing semiconductor power module heat dissipation water channel through 3D printing |
| CN114433874A (en) * | 2021-12-22 | 2022-05-06 | 首都航天机械有限公司 | Design and manufacturing method of leaf-tissue-imitated porous radiator |
| CN114433874B (en) * | 2021-12-22 | 2023-08-29 | 首都航天机械有限公司 | Design and manufacturing method of leaf-like tissue porous radiator |
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Application publication date: 20180508 |