CN108014421A - Heat radiator for through cranium stimulation appearance handle - Google Patents
Heat radiator for through cranium stimulation appearance handle Download PDFInfo
- Publication number
- CN108014421A CN108014421A CN201610945183.3A CN201610945183A CN108014421A CN 108014421 A CN108014421 A CN 108014421A CN 201610945183 A CN201610945183 A CN 201610945183A CN 108014421 A CN108014421 A CN 108014421A
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- Prior art keywords
- radiator
- coil
- heat
- handle
- heat dissipation
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- 230000000638 stimulation Effects 0.000 title description 12
- 239000004065 semiconductor Substances 0.000 claims abstract description 74
- 230000017525 heat dissipation Effects 0.000 claims description 52
- 239000004020 conductor Substances 0.000 claims description 37
- 238000005057 refrigeration Methods 0.000 claims description 29
- 239000012212 insulator Substances 0.000 claims description 21
- 230000003750 conditioning effect Effects 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000004411 aluminium Substances 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 238000001514 detection method Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 9
- 239000000463 material Substances 0.000 abstract description 5
- 238000011491 transcranial magnetic stimulation Methods 0.000 description 8
- 238000001816 cooling Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 239000000956 alloy Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 230000004936 stimulating effect Effects 0.000 description 3
- 206010037660 Pyrexia Diseases 0.000 description 2
- 210000004556 brain Anatomy 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 230000005679 Peltier effect Effects 0.000 description 1
- 229910017629 Sb2Te3 Inorganic materials 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005842 biochemical reaction Methods 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 210000003169 central nervous system Anatomy 0.000 description 1
- 230000001054 cortical effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 210000003205 muscle Anatomy 0.000 description 1
- 230000001537 neural effect Effects 0.000 description 1
- 230000001272 neurogenic effect Effects 0.000 description 1
- 210000000578 peripheral nerve Anatomy 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- XSOKHXFFCGXDJZ-UHFFFAOYSA-N telluride(2-) Chemical compound [Te-2] XSOKHXFFCGXDJZ-UHFFFAOYSA-N 0.000 description 1
- 230000001225 therapeutic effect Effects 0.000 description 1
- 238000002560 therapeutic procedure Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N2/00—Magnetotherapy
- A61N2/02—Magnetotherapy using magnetic fields produced by coils, including single turn loops or electromagnets
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N2/00—Magnetotherapy
- A61N2/004—Magnetotherapy specially adapted for a specific therapy
- A61N2/006—Magnetotherapy specially adapted for a specific therapy for magnetic stimulation of nerve tissue
Landscapes
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Biomedical Technology (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Radiology & Medical Imaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Neurology (AREA)
- Magnetic Treatment Devices (AREA)
Abstract
The invention provides a heat radiating device of a handle of a magnetic stimulator, which is characterized in that a refrigerating semiconductor is adopted to cool a coil, the refrigerating power of the refrigerating semiconductor can be controlled according to the current power, the refrigerating effect is better, and because the semiconductor material has no mechanical moving part and is small in size, the thickness and thickness of a holding part of the handle cannot be increased, the refrigerating semiconductor can be directly arranged around the coil or on the upper side and the lower side of the coil and is closer to a heat source, the heat radiating effect is further improved, and meanwhile, the whole structure of the handle of the stimulator is optimized due to the adoption of the semiconductor heat radiating device.
Description
Technical field
The present invention relates to the heat dissipation dress of transcranial magnetic stimulation instrument technical field, more particularly to a kind of transcranial magnetic stimulation instrument handle
Put.
Background technology
Transcranial magnetic stimulation instrument is a kind of painless and noninvasive green therapeutic equipments, its by the pulsed magnetic field action of generation in
The central nervous system of patient（Mainly brain）, change the film potential of cortical neurogenic cell, be allowed to produce sensing electric current, influence
Intracerebral is metabolized and neural electrical activity, so as to cause a series of biochemical reactions.In practical applications, magnetic stimulator does not limit to
In the stimulation of brain in patients, human peripheral nerve, the stimulation of muscle can be also used for.
Carried out through cranium stimulation instrument in therapeutic process, because stimulating coil produces magnetic field during the work time, while in coil
Substantial amounts of heat is produced around and above, in order to make stimulating coil not overtemperature when in use, is just necessarily required to dissipate coil
Heat, the cooling means used at present are to install the mode of radiator fan, and the optimal position of installation radiator fan is mounted in line
Both sides above and below circle, because so closer to heat source.But radiator fan and relevant driving part volume are larger, if installation
In the both sides up and down of coil the thickness of handle can be caused to greatly increase, so that can not easily hold and influence operating experience,
Also, the posture actually used according to stimulation instrument, if above the coil of fan installation, hot-blast outlet is by direct alignment function
Person, such as medical staff, and if fan is installed on below coil, hot-blast outlet will be directed at treated patient, these all can
Cause undesirable usage experience.If radiator fan is installed on offline circle a place of a distance, for example, handle up and down
Surface, then must be above coil or an air passage is drawn in side, and air passage leads to fan mouth, by fan by the hot-air in air passage
Discharge, so that the air flow of around indirect belt moving winding or top, to realize the cooling of coil, but so there is also very
Big drawback, first has to ensure the efficiency of heat dissipation, fan cannot enclose too far offline, therefore air passage in itself can not be too long, if wind
The efficiency that road somewhat extends heat dissipation will drastically decline；Secondly, fan cannot enclose too remote offline, since handle cannot be done too
Slightly, therefore fan volume still cannot be too big, and if fan volume is too small, when stimulating coil uses, even if fan
All the time operate, for coil after using half an hour, the temperature of coil still reaches unacceptable degree；Next, if using
The larger fan of rotating speed, the noise of fan work is then larger, influences usage experience, also shortens the service life of fan；3rd, if
Residing environment temperature is just higher in itself for coil, such as is used in summer using or the hotter area of weather, fan cooling
Effect is just unable to reach requirement；4th, the heat dissipation capacity of fan does not reach requirement, and the heat of coil working zone-accumulation can gradually increase
Add, have to be stopped when reaching higher temperature to cool down, and when patient is relatively more, or single-character given name patient needs thorn for a long time
When swashing, stimulation instrument can be delayed the treatment of patient because overheat cannot work long hours, and influence the economic interests of hospital.
In addition, the space in magnetic stimulator handle is very limited amount of, selecting the mode of radiating efficiency higher will certainly increase
Add the quantity of middle handle piece, so that handle volume becomes larger thicker, and handle needs to be beneficial to operator to hold, therefore handle
It is too big or too thick being all detrimental to operation, when in face of above-mentioned deficiency, how the position of reasonable arrangement heat dissipation element and coil
Put and one of be also a problem to be solved.
The content of the invention
The present invention proposes a kind of semiconductor heat dissipation device, using the Peltier effects of semi-conducting material, when direct current passes through
During the galvanic couple that two kinds of different semi-conducting materials are connected into, heat can be absorbed respectively at the both ends of galvanic couple and release heat, absorbed
Semiconductor one end of heat is refrigeration end, and exothermic semiconductor one end is fever end, and refrigeration end is installed on stimulation instrument
Near coil, it is possible to achieve the purpose cooled down to coil.
Transcranial magnetic stimulation instrument handle of the present invention includes semiconductor heat dissipation device and coil, and the radiator has refrigeration half
Conductor, refrigeration semiconductor include N-type semiconductor and P-type semiconductor.The radiator also has electric conductor, DC power supply, institute
State DC power supply, electric conductor, refrigeration semiconductor composition current loop, the electric current outflow end of N-type semiconductor and the electricity of P-type semiconductor
Stream flows into the cold end that end forms refrigeration semiconductor, and correspondingly, the electric current of N-type semiconductor flows into the electric current stream of end and P-type semiconductor
Outlet forms the hot junction of refrigeration semiconductor.The cold end of the refrigeration semiconductor freezes the coil close to coil, described
The hot junction of refrigeration semiconductor is away from coil.The radiator also has heat carrier, and the heat carrier is described close to the hot junction
Heat carrier has the extension away from the hot junction, and the heat for the hot junction to be produced is transmitted to heat dissipation element, described to dissipate
Thermal element is arranged on not to be in same vertical direction with the coil, i.e., heat dissipation element be not arranged in coil top or under
Side.
Further, there is the structure for being used for expanding heat dissipation area on the heat dissipation element.
Further, heat dissipation element is set relative to the vertically or horizontally upper of coil.
Further, the radiator further includes fan, for accelerating the heat dissipation of heat dissipation element.
Further, the radiator can include multigroup refrigeration semiconductor.
Further, the radiator also has insulator, and the insulator is arranged between the cold end and coil
Or between the hot junction and heat carrier, it keeps between the cold end, electric conductor and coil and the hot junction, electric conductor are with leading
Electric insulation between hot body.
Further, the insulator uses thermal conductive ceramic.
Further, the electric conductor is made of copper, aluminium or electrically conductive graphite.
Further, the heat carrier and heat dissipation element can be combined into one, and be made of copper and aluminium.
Further, radiator also has temperature conditioning unit and temperature sensor, the temperature sensor detection coil
Operating temperature, is sent to temperature conditioning unit, temperature conditioning unit controls the rotating speed of fan according to the temperature value measured by temperature value.
The present invention also proposes a kind of magnetic stimulator handle, it includes above-mentioned radiator, and also has on handle casing
Thermovent, the heat dissipation element of the radiator is installed in thermovent, in favor of distributing for heat.Preferably, the heat dissipation
Mouth is arranged on leading flank or the two sides of handle casing.
Since the refrigeration work consumption of the handle radiator of the magnetic stimulation treatment instrument of the present invention can be carried out according to current power
Control, refrigeration effect is preferable, and because semi-conducting material does not have mechanical moving element, it is small, handle grip will not be increased
Partial thickness and thickness, therefore can be directly installed on around coil or upper and lower both sides, more close to heat source, further
Heat dissipation effect is improved, simultaneously because using semiconductor heat dissipation device, optimizes the structure of stimulation instrument handle entirety.Existing fan
Heat sink conception will ensure radiating efficiency, and heat dissipation wind channel cannot be too long, and fan is necessarily mounted near heating sources, and through cranium stimulation instrument
The coil of handle is just nearby the part that medical staff holds in treatment, and the hot-air of hot-blast outlet discharge will necessarily be to behaviour
Author and treated patient cause undesirable operating experience, handle even can because of holding part it is too hot and can not hold,
Provided in China's medical equipment safety code, the part of medical instrument and human contact are no more than 41 degrees Celsius.It is and of the invention
Semiconductor heat dissipation device fever end can be arranged far from the place of coil, and the heat for avoiding distributing is to operating personnel
And patient directly discharges and causes bad experience, also, due to eliminating fan and respective drive device near coil,
Saved this part of inner space of handle, reduced the thickness of handle, thus the shape of handle can design more refinement
It is long, and consider curve of the ergonomics by handle design into hand during fitting grip handle, these are that of the invention use partly is led
Body radiator reaches additional technical effect while improving radiating efficiency.
Brief description of the drawings
Fig. 1 is transcranial magnetic stimulation instrument handle radiator structure first embodiment side view of the present invention；
Fig. 2 is transcranial magnetic stimulation instrument handle radiator structure second embodiment side view of the present invention；
Fig. 3 is transcranial magnetic stimulation instrument handle appearance of the present invention；
Wherein, insulator 1, heat dissipation element 2, fan 3, DC power supply 4, electric conductor 5, coil 6, semiconductor 7, heat carrier 8.
Embodiment
The present invention is further described in a manner of specific embodiment below.
In one embodiment, transcranial magnetic stimulation instrument of the invention includes semiconductor heat dissipation device and coil 6, such as attached drawing 1
Shown, the radiator has a refrigeration semiconductor, and refrigeration semiconductor includes N-type semiconductor 7a and P-type semiconductor 7b, optional
Ground, semiconductor uses ternary solid solution alloy of the bismuth telluride for matrix, such as wherein p-type semiconductor material is Bi2Te3-
Sb2Te3, N-type semiconductor material are Bi2Te3-Bi2Se3.The radiator also has an electric conductor, including upper electric conductor 5a,
First time electric conductor 5b and second time electric conductor 5c.The radiator also has DC power supply 4, the DC power supply, conduction
Body, refrigeration semiconductor composition current loop, electric current pass through second time electric conductor 5c, N-type semiconductor successively from 4 cathode of DC power supply
7a, upper electric conductor 5a, P-type semiconductor 7b, first time electric conductor 5b flow back to DC power cathode, the electric current stream of N-type semiconductor 7a
The electric current of outlet and P-type semiconductor 7b flow into the cold end that end forms refrigeration semiconductor, correspondingly, the electric current stream of N-type semiconductor 7a
Enter end and the hot junction of the electric current outflow end composition refrigeration semiconductor of P-type semiconductor 7b.The cold end of the refrigeration semiconductor 7 is close to line
Circle 6, the cold end freezes coil 6, and the hot junction of the refrigeration semiconductor 7 is away from coil 6.The radiator also has
Heat carrier 8, the heat carrier 8 is close to the hot junction, and the extension 8a away from hot junction with one, for be produced from the hot junction
Raw heat is transmitted to heat dissipation element 2, and the heat dissipation element 2 is arranged on not to be in same vertical direction with the coil 6.Such as
Shown in Fig. 1, the heat carrier 8 is L-shaped, has the projection for being used for expanding heat dissipation area on the heat dissipation element 2.Due to heat dissipation member
Part 2 is not arranged in above or below coil, therefore magnetic stimulator can reduce the thickness of handle.Selectively, the heat dissipation
Device also has insulator, including upper insulator 1a and lower insulator 1b, the upper insulator 1a are arranged on coil 6 and upper conduction
Between body 5a, its upper and lower surface is bonded with coil 6 and upper electric conductor 5a respectively, and lower insulator 1b is arranged on first time electric conductor
Between 5b, second time electric conductor 5c and heat carrier 8, its upper surface is bonded with first time electric conductor 5b, second time electric conductor 5c, under
Surface is bonded with heat carrier 8.
In a preferred embodiment, heat dissipation element 2 is set up relative to the Vertical Square of coil, is had on heat dissipation element 2
The structure of increasing heat radiation area, such as projection, groove, as shown in Figure 1, can also be set in the protrusion side of heat dissipation element 2
Fan 3, further speeds up the heat dissipation of heat dissipation element 2.Meanwhile can be without considering the space limitation above or below coil, can be with
Select large-sized heat dissipation element 2 and powerful fan and be not concerned about the increase of handle thickness, increase heat dissipation effect.Further
Ground, if the heat radiation power of heat dissipation element 2 is sufficiently large, can cancel the setting of fan and realize complete mute, reach
Optimal user experience, this is the technique effect that the magnetic stimulator handle of existing radiating mode is unable to reach.
It is understood that in order to improve the efficiency of the area of thermo-contact and heat dissipation, the heat carrier and semiconductor hot junction
Between, should fully contact between heat carrier and insulator, between heat carrier and heat dissipation element.The electric conductor, insulator, lead
Hot body and heat dissipation element are made by the material of good heat conductivity.Preferably, the electric conductor uses the material system of electric conductivity
Into, such as can be made of copper, aluminium and its alloy, or electrically conductive graphite is made.Preferably, heat dissipation element 2 and heat carrier 8 are adopted
It is made of the good metal of heat conduction, for example, copper and aluminium and its alloy, in alternative embodiments, heat carrier 8 and heat dissipation element 2
It can be combined into one.Upper insulator 1a and lower insulator 1b is made of the insulating materials of good heat conductivity, is preferably heat conduction pottery
Tile, the ceramics are in addition to heat conductivility is excellent, it can also be ensured that between coil and electric conductor, heat carrier and electric conductor it
Between electric insulation.In another optional embodiment, heat carrier 8 and upper insulator 1a, lower insulator 1b are that ceramics are made, this
In the case of kind, heat carrier 8 and upper insulator 1a, lower insulator 1b can be structure as a whole.
As shown in Figure 1, after being powered, the cold end of semiconductor starts to freeze, insulator 1a（Upper potsherd）Coil is produced
Heat transfer give upper electric conductor 5a, then be transmitted to the cold end of semiconductor, the cold end will be transmitted the heat that comes and largely be absorbed, with up to
To the purpose of cooling coil.The hot junction of N-type semiconductor and P-type semiconductor begins paying out heat, and the heat is by leading under first
Electric body 5b, second time electric conductor 5c pass to lower insulator 1b（Lower potsherd）, then heat carrier 8 is passed to, then pass through heat carrier 8
The heat dissipation element of distal end is delivered to, the heat on 2 surface of heat dissipation element is taken away in the rotation of fan 3.
In one embodiment, the refrigeration semiconductor multigroup can be arranged side by side, as shown in Fig. 2, the radiator
Including two groups of refrigeration semiconductors, i.e. two N-type semiconductors and two P-type semiconductors.Electric current is flowed out from positive pole, is passed through successively
First time electric conductor 5e, the first N-type semiconductor 7d, electric conductor 5a on first, the first P-type semiconductor 7c, second time electric conductor 5d,
Second N-type semiconductor 7b, electric conductor 5b, the second P-type semiconductor 7a on second, then one circuit of power cathode and composition is flowed back to,
The electric current outflow end of the first N-type semiconductor 7d and the electric current of the first P-type semiconductor 7c flow into end and are arranged on conduction on first
On body 5a, the electric current of the electric current outflow end of the first P-type semiconductor 7c and the second N-type semiconductor 7b, which are flowed under end is arranged on second, leads
On electric body 5d, the electric current of the electric current outflow end of the second N-type semiconductor 7b and the second P-type semiconductor 7a flow into end and are arranged on second
On electric conductor 5b.It is arranged side by side it is understood that the present embodiment is two groups of refrigeration semiconductors, can sets as needed in practice
Multigroup refrigeration semiconductor series connection is put, improves heat radiation power and radiating efficiency.
As shown in Fig. 2, in one embodiment, heat dissipation element 2 is set up relative to previous level side, can so protect
Stimulation instrument handle integral thickness is demonstrate,proved than more uniform, situation about being significantly increased without coiler part thickness.
In one embodiment, magnetic stimulator handle of the invention includes above-mentioned radiator, and also has thermovent,
The heat dissipation element 2 of the radiator is installed on thermovent, in favor of distributing for heat.Preferably, the thermovent is arranged on
Position of the handle away from patient, avoids the thermovent of fan too near from patient and makes the patient feels uncomfortable, in more preferably embodiment
In, the thermovent is arranged on leading flank or the two sides of handle, to avoid discharge hot wind to patient or gripping handle
Medical staff causes discomfort.
In one embodiment, the radiator of the magnetic stimulator handle of the application also has temperature conditioning unit, such as temperature
Controller, can accurately control the rotating speed of fan, and to realize the Multistage Control of heat radiation power, while coil is nearby installed
There is temperature sensor, temperature sensor measures the operating temperature of coil, temperature value is sent to control unit, control unit will be surveyed
For the temperature value obtained with sending regulating command to fan after the progress computing of default temperature threshold, conventional operation method is to ask to measure
The size of the difference of temperature value and temperature threshold.In the algorithm more optimized, it can be combined according to the change rate for measuring temperature value
Above-mentioned difference judge the change direction of temperature, and corresponding regulating command is sent to fan.Set if the temperature value surveyed exceedes
Determine temperature threshold, or the temperature value that measures rises too fast, sends the instruction to rev up to correspondingly fan, it is on the contrary then send
Reduce the instruction of rotating speed.Adjusted by temperature feedback and the accurate of rotation speed of the fan, coil working can be made under temperature constant state, together
When fan need not full gear operating, further reduce energy consumption.
It these are only the preferred embodiments of the disclosure, but protection scope of the present invention is not limited thereto, it is any
Those familiar with the art the invention discloses technical scope in, it is contemplated that change or replacement should all cover this
Within the protection domain of invention.
Claims (10)
1. a kind of radiator of magnetic stimulator handle, it is characterised in that the radiator includes：One or more groups of refrigeration half
Conductor, electric conductor, DC power supply, heat carrier；
The refrigeration semiconductor includes N-type semiconductor and P-type semiconductor；
The DC power supply, electric conductor, refrigeration semiconductor composition current loop, the refrigeration semiconductor produced after being powered cold end and
Hot junction；The cold end of the refrigeration semiconductor freezes the coil, the refrigeration is partly close to the coil of magnetic stimulator handle
The hot junction of conductor has extension away from coil, the heat carrier close to the hot junction, the heat carrier, for by the hot junction
The heat of generation is transmitted to heat dissipation element, and the heat dissipation element is arranged on not to be in same vertical direction with the coil.
2. radiator as claimed in claim 1, it is characterised in that the heat dissipation element and heat carrier are made of copper, aluminium.
3. the radiator as described in claim 1-2, it is characterised in that the heat dissipation element and heat carrier are structure as a whole.
4. radiator as claimed in claim 1, it is characterised in that the radiator includes fan, for accelerating to radiate
The heat dissipation of element.
5. radiator as claimed in claim 1, it is characterised in that the radiator also has insulator, the insulation
Body is arranged between the cold end and coil or between the hot junction and heat carrier, it keeps cold end, electric conductor and the coil
Between and the electric insulation between the hot junction, electric conductor and heat carrier.
6. radiator as claimed in claim 1, it is characterised in that the electric conductor is made of copper, aluminium or electrically conductive graphite.
7. radiator as claimed in claim 1, it is characterised in that the insulator is made of thermal conductive ceramic.
8. radiator as claimed in claim 4, it is characterised in that radiator also has temperature conditioning unit and temperature sensing
Device, the operating temperature of the temperature sensor detection coil, temperature conditioning unit is sent to by temperature value, and temperature conditioning unit is according to measuring
Temperature value controls the rotating speed of fan.
9. a kind of magnetic stimulator handle, it includes any radiator of preceding claims, it is characterised in that outside handle
Also there is thermovent, the heat dissipation element of the radiator is installed in thermovent, in favor of distributing for heat on shell.
10. magnetic stimulator handle as claimed in claim 9, it is characterised in that before the thermovent is arranged on handle casing
Side or two sides.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610945183.3A CN108014421A (en) | 2016-11-02 | 2016-11-02 | Heat radiator for through cranium stimulation appearance handle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610945183.3A CN108014421A (en) | 2016-11-02 | 2016-11-02 | Heat radiator for through cranium stimulation appearance handle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108014421A true CN108014421A (en) | 2018-05-11 |
Family
ID=62070866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610945183.3A Pending CN108014421A (en) | 2016-11-02 | 2016-11-02 | Heat radiator for through cranium stimulation appearance handle |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108014421A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111803798A (en) * | 2020-06-29 | 2020-10-23 | 深圳市宗匠科技有限公司 | Red light wave energy system, depilator and control method thereof |
| CN115113463A (en) * | 2022-05-30 | 2022-09-27 | 歌尔光学科技有限公司 | Heat dissipation device for heat source module and electronic equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR20050111595A (en) * | 2005-08-18 | 2005-11-25 | 후지쯔 가부시끼가이샤 | Electronic component and radiating member, and method of manufacturing semiconductor device using the component and member |
| CN202822496U (en) * | 2012-05-14 | 2013-03-27 | 莫伟强 | Multipoint fine magnetic field cosmetic pen with active heat radiation function |
| CN103028193A (en) * | 2012-12-18 | 2013-04-10 | 深圳英智科技有限公司 | Semiconductor cooling device of transcranial magnetic stimulation coil |
| CN105763685A (en) * | 2016-04-22 | 2016-07-13 | 深圳市鼎智通讯有限公司 | Fan-type mobile phone heat dissipation structure and heat dissipation method thereof |
-
2016
- 2016-11-02 CN CN201610945183.3A patent/CN108014421A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20050111595A (en) * | 2005-08-18 | 2005-11-25 | 후지쯔 가부시끼가이샤 | Electronic component and radiating member, and method of manufacturing semiconductor device using the component and member |
| CN202822496U (en) * | 2012-05-14 | 2013-03-27 | 莫伟强 | Multipoint fine magnetic field cosmetic pen with active heat radiation function |
| CN103028193A (en) * | 2012-12-18 | 2013-04-10 | 深圳英智科技有限公司 | Semiconductor cooling device of transcranial magnetic stimulation coil |
| CN105763685A (en) * | 2016-04-22 | 2016-07-13 | 深圳市鼎智通讯有限公司 | Fan-type mobile phone heat dissipation structure and heat dissipation method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111803798A (en) * | 2020-06-29 | 2020-10-23 | 深圳市宗匠科技有限公司 | Red light wave energy system, depilator and control method thereof |
| CN115113463A (en) * | 2022-05-30 | 2022-09-27 | 歌尔光学科技有限公司 | Heat dissipation device for heat source module and electronic equipment |
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