CN107995990A

CN107995990A - Drive circuit and display device in circuit board structure, face

Info

Publication number: CN107995990A
Application number: CN201680039410.4A
Authority: CN
Inventors: 赵继刚; 袁泽
Original assignee: Shenzhen Royole Technologies Co Ltd
Current assignee: Shenzhen Royole Technologies Co Ltd
Priority date: 2016-12-30
Filing date: 2016-12-30
Publication date: 2018-05-04
Also published as: WO2018120141A1

Abstract

A kind of circuit board structure (10), including basic unit (12) and the first line layer (14), the second line layer (16) and the insulating layer (18) that are arranged in basic unit (12).First line layer (14) includes spaced multiple first line (142).Second line layer (16) includes multiple second circuits (162).Insulating layer (18) coats multiple first line (142).Multiple second circuits (162) are spaced on insulating layer (18).In assist side structure (10), first line (142) and the second circuit (162) can use different materials to be made to respectively constitute different signal wires, and insulating layer (18) coats multiple first line (142) and is separated so that insulating between first line (142), so, it can prevent short circuit problem occur between adjacent circuit, and the circuit spacing with layer can be reduced.In addition, also disclose drive circuit and display device in a kind of face for including the circuit board structure (10).

Description

Drive circuit and display device in circuit board structure, face

Technical field

The present invention relates to display technology field, drive circuit and display device in more particularly to a kind of circuit board structure, face.

Background technology

In the related art, the signal wire of drive circuit is made up using same metal layer of semiconductor technology in face.By In foreign matter, photoetching is bad, after etching the problems such as metal residual, the short circuit be easy to causeing between signal wire.

The content of the invention

It is contemplated that at least solve one of technical problem present in correlation technique.For this reason, the present invention needs offer one Drive circuit and display device in kind circuit board structure, face.

The circuit board structure of embodiment of the present invention includes：

Basic unit；

First line layer, the second line layer and the insulating layer being arranged in the basic unit, between the first line layer includes Every multiple first line of setting, second line layer includes multiple second circuits, the insulating layer cladding the multiple the One circuit, is located on the insulating layer the multiple second line segregation.

In the circuit board structure of embodiment of the present invention, first line and the second circuit can be made of different materials To respectively constitute different signal wires, and insulating layer coats multiple first line and to insulate between first line to separate, in this way, It can prevent short circuit problem occur between adjacent circuit, and the circuit spacing with layer can be reduced.

In some embodiments, the first line is staggeredly arranged at intervals up and down with second circuit.

In some embodiments, the first line layer and second line layer are separated by the insulating layer.

In some embodiments, the multiple first line is parallel to each other, and the multiple second circuit is parallel to each other, institute State first line and second circuit is parallel to each other.

In some embodiments, orthographic projection of the first line in the basic unit with second circuit described Orthographic projection in basic unit separates.

In some embodiments, the resistivity of the first line is more than the resistivity of second circuit, and described the The width of one circuit is more than the width of second circuit；Or

The resistivity of the first line is less than the resistivity of second circuit, and the width of the first line is less than institute State the width of the second circuit；Or

The resistivity of the first line is equal to the resistivity of second circuit, and the width of the first line is equal to institute State the width of the second circuit.

In some embodiments, the first line and second circuit include the multistage wire jumper at interval, described The wire jumper of second circuit is electrically connected two wire jumpers of the adjacent first line, multiple institutes of the first line Wire jumper is stated to be separated by the insulating layer.

In some embodiments, orthographic projection of the wire jumper of a first line in the basic unit with it is corresponding Second circuit orthographic projection of the wire jumper in the basic unit it is overlapping.

In some embodiments, the wire jumper of second circuit be electrically connected by way of via it is adjacent described in Two wire jumpers of first line.

In some embodiments, the multistage wire jumper is along length direction of the first line or second circuit etc. Long distribution.

In some embodiments, the first line is gate metal, and second circuit is source electrode and drain metal.

Drive circuit includes in a kind of face of embodiment of the present invention：

Multiple drive power circuit unit；With

The circuit board structure of any of the above-described embodiment, every grade of drive circuit unit are electrically connected described the One circuit and second circuit.

In the face of embodiment of the present invention in drive circuit, first line and the second circuit can use different material systems Into to respectively constitute different signal wires, and insulating layer coats multiple first line and to insulate between first line to separate, such as This, can prevent short circuit problem occur between adjacent circuit, and can reduce the circuit spacing with layer.

A kind of display device of embodiment of the present invention, including drive circuit in above-mentioned face.

In the display device of embodiment of the present invention, first line and the second circuit different materials can be used to be made with Respectively constitute different signal wires, and insulating layer coats multiple first line and to insulate between first line to separate, in this way, can To prevent short circuit problem occur between adjacent circuit, and the circuit spacing with layer can be reduced.

The additional aspect and advantage of the present invention will be set forth in part in the description, and will partly become from the following description Obtain substantially, or recognized by the practice of the present invention.

Brief description of the drawings

The above-mentioned and/or additional aspect and advantage of the present invention can be from reference to description of the accompanying drawings below to embodiment It will be apparent and be readily appreciated that, wherein：

Fig. 1 is the schematic cross-section of the width along circuit of the circuit board structure of embodiment of the present invention.

Fig. 2 is the structure diagram of drive circuit in the face of embodiment of the present invention.

Fig. 3 is the high-level schematic functional block diagram of the display device of embodiment of the present invention.

Fig. 4 is the schematic cross-section of the width along circuit of the circuit board structure of another embodiment of the present invention.

Fig. 5 is the structure diagram of drive circuit in the face of another embodiment of the present invention.

Fig. 6 is schematic cross-section of the circuit board structure of further embodiment of the present invention along the length direction of circuit.

Fig. 7 is the structure diagram of drive circuit in the face of further embodiment of the present invention.

Fig. 8 is the process flow chart of the circuit board structure of embodiment of the present invention.

Main element and symbol description：

Circuit board structure 10, basic unit 12, first line layer 14, first line 142, the second line layer 16, the second circuit 162nd, insulating layer 18；

Drive circuit unit 20；

Drive circuit 100 in face；

Display device 1000.

Embodiment

Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the drawings, wherein, it is identical Or similar label represents same or similar element or has the function of same or like element from beginning to end.Below by ginseng The embodiment for examining attached drawing description is exemplary, and is only used for explaining embodiments of the present invention, and it is not intended that to this hair The limitation of bright embodiment.

In the description of embodiments of the present invention, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length Degree ", " width ", " thickness ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", The orientation or position relationship of the instruction such as " outer ", " clockwise ", " counterclockwise " are based on orientation shown in the drawings or position relationship, only It is to be described for the ease of description embodiments of the present invention with simplified, rather than indicates or imply that the device of meaning or element are necessary With specific orientation, with specific azimuth configuration and operation, therefore it is not intended that limitation to embodiments of the present invention. In addition, term " first ", " second " are only used for description purpose, and it is not intended that instruction or hint relative importance or implicit Indicate the quantity of indicated technical characteristic.Thus, " first " is defined, the feature of " second " can be expressed or impliedly wrap Include one or more feature.In the description of embodiments of the present invention, " multiple " are meant that two or two More than, unless otherwise specifically defined.

, it is necessary to illustrate in the description of embodiments of the present invention, unless otherwise clearly defined and limited, term " installation ", " connection ", " connection " should be interpreted broadly, for example, it may be fixedly connected or be detachably connected, or one Connect body；Can mechanically connect or be electrically connected or can mutually communicate；Can be directly connected to, can also lead to Cross intermediary to be indirectly connected with, can be the interaction relationship of connection inside two elements or two elements.For ability For the those of ordinary skill in domain, it can understand that above-mentioned term in embodiments of the present invention specific contains as the case may be Justice.

In embodiments of the present invention, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or it " under " can directly be contacted including the first and second features, it is not directly to connect that can also include the first and second features Touch but pass through the other characterisation contact between them.Moreover, fisrt feature second feature " on ", " top " and " on Face " includes fisrt feature directly over second feature and oblique upper, or to be merely representative of fisrt feature level height special higher than second Sign.Fisrt feature second feature " under ", " lower section " and " below " include fisrt feature immediately below second feature and obliquely downward Side, or be merely representative of fisrt feature level height and be less than second feature.

Following disclosure provides many different embodiments or example is used for realizing embodiments of the present invention not Same structure.In order to simplify the disclosure of embodiments of the present invention, hereinafter the component and setting of specific examples are described.When So, they are merely examples, and is not intended to limit the present invention.In addition, embodiments of the present invention can be in different examples Repeat reference numerals and/or reference letter in son, this repetition are for purposes of simplicity and clarity, itself not indicate to be begged for By the relation between various embodiments and/or setting.In addition, the various specific techniques that embodiments of the present invention provide With the example of material, but application and/or other materials those of ordinary skill in the art may realize that other techniques makes With.

Referring to Fig. 1, the circuit board structure 10 of embodiment of the present invention includes basic unit 12, first line layer 14, the second line Road floor 16 and insulating layer 18.First line layer 14, the second line layer 16 and insulating layer 18 are arranged in basic unit 12.First line layer 14 include spaced multiple first line 142.Second line layer 16 includes multiple second circuits 162.Insulating layer 18 coats Multiple first line 142.Multiple second circuits 162 are spaced on insulating layer 18.

In the circuit board structure 10 of embodiment of the present invention, 142 and second circuit 162 of first line can use different Material is made to respectively constitute different signal wires, and insulating layer 18 coat multiple first line 142 so that first line 142 it Between insulate and separate, in this way, occurring short circuit problem between can preventing adjacent circuit, and the circuit spacing with layer can be reduced.

Referring to Fig. 2, drive circuit 100 includes multiple drive power circuit unit 20 and circuit in the face of embodiment of the present invention Harden structure 10.142 and second circuit 162 of first line is electrically connected per stage drive circuit unit 20.

142 and second circuit 162 of first line can be used for providing clock signal for drive circuit unit 20, be driven in face Circuit 100 can be the pixel driver controls such as GOA (Gate Driver on Array) circuits or EOA (Emitter on Array) Circuit processed.

Drive circuit 100 is explained by taking GOA circuits as an example in the face of embodiment of the present invention.

Referring to Fig. 3, drive circuit 100 can be applied to the aobvious of embodiment of the present invention in the face of embodiment of the present invention Showing device 1000.

In some instances, display device 1000 can be LCD (Liquid Crystal Display, liquid crystal display) Or AMOLED (Active-matrix organic light emitting diode, active matrix organic light-emitting diode) etc. Electronic console.

In some embodiments, Fig. 1 and 4 please be join, 142 and second circuit of first line is staggeredly arranged at intervals about 162.

In other words, the second circuit 162 is located at the top of first line 142, and along 142 or second circuit of first line On 162 length direction or width, 142 and second circuit 162 of first line is staggeredly intervally arranged.

142 and second circuit 162 of first line can be used for forming more signal lines, to be carried for drive circuit in face 100 For clock signal.For the ease of illustrating, the circuit board structure 10 of embodiment of the present invention is by taking 4 signal lines as an example, respectively For signal wire CLK1, signal wire CLK2, signal wire CLK3, signal wire CLK4.Every grade of drive circuit unit 20 is connected respectively to Signal wire CLK1, signal wire CLK2, signal wire CLK3, signal wire CLK4.

Wherein, signal wire CLK1, signal wire CLK3 are two first line 142, and signal wire CLK2, signal wire CLK4 are two A second circuit 162.

In some embodiments, please join Fig. 1 and 4,14 and second line layer 16 of first line layer by insulating layer 18 every Open.

In this way, insulating layer 18 divides 14 and second line layer 16 of first line layer for upper and lower two layers, two layer lines can be prevented The spacing between adjacent circuit can be further reduced when occurring short circuit problem between road, and manufacturing, is conducive to wiring board The overall narrow side of structure 10.

Specifically, insulating layer 18 can use inorganic material (such as SiOx, SiNx, AlOx), or organic insulation, or Two layers of the inorganic material such as SiOx, SiNx, AlOx or MULTILAYER COMPOSITE (such as SiNx/SiOx).

In some embodiments, multiple first line 142 are parallel to each other, and multiple second circuits 162 are parallel to each other, and first 142 and second circuit 162 of circuit is parallel to each other.

In this way, be conducive to circuit board structure 10 manufacturing process and circuit board structure 10 shared by space it is smaller.

In some embodiments, orthographic projection of the first line 142 in basic unit 12 and the second circuit 162 are in basic unit 12 Orthographic projection separate.

In this way, be conducive to eliminate the capacitive coupling between the signal of 142 and second circuit 162 of first line.

When the second circuit 162 is located at the surface of first line 142, the entirety of circuit board structure 10 can be no doubt reduced Frame, but the easily capacitive coupling between increase signal.Thus it is preferred that first line 142 be located at the second circuit 162 it is oblique on Side, and orthographic projection of orthographic projection of the first line 142 in basic unit 12 with the second circuit 162 in basic unit 12 separates.

It is appreciated that the signal wire CLK1 and signal wire CLK3 of embodiment of the present invention are formed by first line 142, signal Line CLK2 and signal wire CLK4 is formed by the second circuit 162.

Fig. 4 and Fig. 5 is referred to, in some embodiments, the resistivity of first line 142 is more than the second circuit 162 Resistivity, the width of first line 142 are more than the width of the second circuit 162；Or the resistivity of first line 142 is less than the second line The resistivity on road 162, the width of first line 142 are less than the width of the second circuit 162；Or resistivity of first line 142 etc. In the resistivity of the second circuit 162, the width of first line 142 is equal to the width of the second circuit 162.

In this way, the restriction by resistivity and the relation of width to 142 and second circuit 162 of first line can The impedance of each signal wire is consistent, so as to eliminate delay or have an identical delay, to realize signal between each signal wire It is synchronous.

For example, by taking Fig. 4 and Fig. 5 as an example, the resistivity of first line 142 is more than the resistivity of the second circuit 162, in order to make The impedance for obtaining each signal wire is consistent, and the width of first line 142 could be provided as the width more than the second circuit 162.

Fig. 6 and Fig. 7 is referred to, in some embodiments, 142 and second circuit 162 of first line includes interval Multistage wire jumper, the wire jumper of the second circuit 162 are electrically connected two wire jumpers of adjacent first line 142, first line 142 it is multiple Wire jumper is separated by insulating layer 18.

In this way, the impedance of each signal wire can be caused to be consistent, so as to eliminate delay or there is identical delay, with reality Now between each signal wire signal synchronization.

It is appreciated that in the embodiment shown in Fig. 6 and Fig. 7, signal wire CLK1, signal wire CLK2, signal wire CLK3, Signal wire CLK4 is formed by connecting by the multistage wire jumper of first line 142 and the multistage wire jumper of the second circuit 162.

In some embodiments, orthographic projection of the wire jumper of a first line 142 in basic unit 12 with corresponding one The orthographic projection in basic unit 12 of the wire jumper of second circuit 162 is overlapping.

Specifically, the wire jumper of first line 142 can be connected by lap with the wire jumper of the second circuit 162.

The orthographic projection of first wire jumper 142 can intersect with the orthographic projection of the second circuit 162 it is angled overlapping, can also For the first wire jumper 142 orthographic projection and the second wire jumper 162 orthographic projection point-blank.

It is preferred that the orthographic projection of the first wire jumper 142 and the orthographic projection of the second wire jumper 162 are point-blank, in this way, favorably Arrangement and reduction line back gauge in signal wire, manufacture easy to process.

In some embodiments, the wire jumper of the second circuit 162 is electrically connected adjacent first line by way of via 142 two wire jumpers.

Specifically, insulating layer 18 can be patterned by via, that is, VIA techniques, the pre-determined bit on insulating layer 18 Put carry out perforate so that the wire jumper of the second circuit 162 is electrically connected two jumps of adjacent first line 142 by way of via Line.

It is appreciated that patterning can be by being realized by dry etching or wet etching.

In some embodiments, length direction isometric point of the multistage wire jumper along 142 or second circuit 162 of first line Cloth.

For example, the length of wire jumper a and the equal length of wire jumper b.

In some embodiments, the length of every section of wire jumper of first line 142 is equal to every section of wire jumper of the second circuit 162 Length.Every section of wire jumper corresponds to connection level-one drive circuit unit 20.

In this way, first line 142 is identical with the position of the corresponding segments of the second circuit 162, be conducive to signal wire and driving Horizontal line between circuit unit 20.

Specifically, by taking Fig. 7 as an example, wire jumper a, wire jumper c, the equal length of wire jumper d and wire jumper e, and corresponding (n+4) level Drive circuit unit 20.Drive circuit unit 20 distinguishes tie jumper a, wire jumper c, wire jumper d and wire jumper e, with for (n+4) level Drive circuit unit 20 provides clock signal.

In some embodiments, first line 142 is gate metal, and the second circuit 162 is source electrode and drain metal.

Specifically, gate metal, source metal and drain metal can be gold, silver, copper, iron, aluminium etc..During fabrication, may be used With by techniques such as deposition, photoetching, etchings with each signal wire of drive circuit in forming face 100.

Referring to Fig. 8, being formed for 14 and second line layer 16 of first line layer can be by the deposition of gate metal come real It is existing, using physical vapour deposition (PVD) (PVD, Physical VaporDeposition), such as sputter (sputtering) deposition side Method is realized.The formation of insulating layer 18 can be realized by deposition process such as chemical vapor depositions (PECVD/ALD).

For example, above method depositing first conductive layer can be utilized first in basic unit 12, then pattern etched first is conductive Layer forms first line layer 14, then forms insulating layer 18 using the above method on first line layer 14, is afterwards insulating The second conductive layer, then the second conductive layer of pattern etched are formed to form the second line layer 16 using the above method on layer 18.

In the description of this specification, reference term " embodiment ", " some embodiments ", " schematically implementation The description of mode ", " example ", " specific example " or " some examples " etc. means the tool with reference to the embodiment or example description Body characteristics, structure, material or feature are contained at least one embodiment or example of the present invention.In the present specification, Schematic expression of the above terms is not necessarily referring to identical embodiment or example.Moreover, the specific features of description, knot Structure, material or feature can combine in an appropriate manner in any one or more embodiments or example.

Any process or method described otherwise above description in flow chart or herein is construed as, and represents to include Module, fragment or the portion of the code of the executable instruction of one or more the step of being used for realization specific logical function or process Point, and the scope of the preferred embodiment of the present invention includes other realization, wherein can not press shown or discuss suitable Sequence, including according to involved function by it is basic at the same time in the way of or in the opposite order, carry out perform function, this should be of the invention Embodiment person of ordinary skill in the field understood.

Expression or logic and/or step described otherwise above herein in flow charts, for example, being considered use In the order list for the executable instruction for realizing logic function, may be embodied in any computer-readable medium, for Instruction execution system, device or equipment (such as computer based system including the system of processing module or other can be from instruction The system of execution system, device or equipment instruction fetch and execute instruction) use, or combine these instruction execution systems, device or Equipment and use.For the purpose of this specification, " computer-readable medium " can be it is any can include, store, communicating, propagating or Transmission program uses for instruction execution system, device or equipment or with reference to these instruction execution systems, device or equipment Device.The more specifically example (non-exhaustive list) of computer-readable medium includes following：With one or more wiring Electrical connection section (IPM current foldback circuits), portable computer diskette box (magnetic device), random access memory (RAM) are read-only to deposit Reservoir (ROM), erasable edit read-only storage (EPROM or flash memory), fiber device, and portable optic disk are only Read memory (CDROM).In addition, computer-readable medium can even is that the paper that can print described program on it or other conjunctions Suitable medium, because can be for example by carrying out optical scanner to paper or other media, then into edlin, interpretation or if necessary Handled electronically to obtain described program, be then stored in computer storage with other suitable methods.

It should be appreciated that each several part of embodiments of the present invention can be with hardware, software, firmware or combinations thereof come real It is existing.In the above-described embodiment, multiple steps or method can use storage in memory and by suitable instruction execution system The software or firmware of execution is realized.If for example, being realized with hardware, with another embodiment, ability can be used Any one of following technology known to domain or their combination are realized：With for realizing logic function to data-signal The discrete logic of logic gates, has the application-specific integrated circuit of suitable combinational logic gate circuit, programmable gate array (PGA), field programmable gate array (FPGA) etc..

Those skilled in the art are appreciated that to realize all or part of step that above-described embodiment method carries Suddenly it is that relevant hardware can be instructed to complete by program, the program can be stored in a kind of computer-readable storage medium In matter, the program upon execution, including one or a combination set of the step of embodiment of the method.

In addition, each functional unit in various embodiments of the present invention can be integrated in a processing module, also may be used To be that unit is individually physically present, can also two or more units be integrated in a module.It is above-mentioned integrated Module can both be realized in the form of hardware, can also be realized in the form of software function module.The integrated module If realized in the form of software function module and as independent production marketing or in use, a calculating can also be stored in In machine read/write memory medium.

Storage medium mentioned above can be read-only storage, disk or CD etc..

Although embodiments of the present invention have been shown and described above, it is to be understood that the above embodiment is Exemplary, it is impossible to limitation of the present invention is interpreted as, those of ordinary skill in the art within the scope of the invention can be right Above-mentioned implementation implements be changed, change, replacing and modification.

Claims

A kind of 1. circuit board structure, it is characterised in that including：

Basic unit；

First line layer, the second line layer and the insulating layer being arranged in the basic unit, the first line layer are set including interval The multiple first line put, second line layer include multiple second circuits, and the insulating layer coats the multiple First Line Road, is located on the insulating layer the multiple second line segregation.
2. circuit board structure as claimed in claim 1, it is characterised in that the first line is handed over up and down with second circuit Mistake is arranged at intervals.
3. circuit board structure as claimed in claim 1, it is characterised in that the first line layer and second line layer lead to The insulating layer is crossed to separate.
4. circuit board structure as claimed in claim 1, it is characterised in that the multiple first line is parallel to each other, described more A second circuit is parallel to each other, and the first line and second circuit are parallel to each other.
5. circuit board structure as claimed in claim 2, it is characterised in that orthographic projection of the first line in the basic unit Separated with orthographic projection of second circuit in the basic unit.
6. circuit board structure as claimed in claim 1, it is characterised in that the resistivity of the first line is more than described second The resistivity of circuit, the width of the first line are more than the width of second circuit；Or

The resistivity of the first line is less than the resistivity of second circuit, and the width of the first line is less than described the The width of two circuits；Or

The resistivity of the first line is equal to the resistivity of second circuit, and the width of the first line is equal to described the The width of two circuits.
7. circuit board structure as claimed in claim 1, it is characterised in that the first line and second circuit include The multistage wire jumper at interval, the wire jumper of second circuit are electrically connected two wire jumpers of the adjacent first line, Multiple wire jumpers of the first line are separated by the insulating layer.
8. circuit board structure as claimed in claim 7, it is characterised in that the wire jumper of a first line is described Orthographic projection of the orthographic projection with the wire jumper of corresponding one second circuit in the basic unit in basic unit is overlapping.
9. circuit board structure as claimed in claim 7, it is characterised in that the wire jumper of second circuit passes through via Mode is electrically connected two wire jumpers of the adjacent first line.
10. circuit board structure as claimed in claim 7, it is characterised in that the multistage wire jumper is along the first line or institute State the isometric distribution of length direction of the second circuit.
11. the circuit board structure as described in claims 1 to 10 any one, it is characterised in that the first line is grid Metal, second circuit are source electrode and drain metal.
A kind of 12. drive circuit in face, it is characterised in that including：

Multiple drive power circuit unit；With

Circuit board structure as described in claim 1-11 any one, every grade of drive circuit unit are electrically connected described the One circuit and second circuit.
13. a kind of display device, it is characterised in that including drive circuit in face as claimed in claim 12.