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CN107867670A - Folded spring is coupled in MEMS (MEMS) device - Google Patents

Folded spring is coupled in MEMS (MEMS) device Download PDF

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Publication number
CN107867670A
CN107867670A CN201710885349.1A CN201710885349A CN107867670A CN 107867670 A CN107867670 A CN 107867670A CN 201710885349 A CN201710885349 A CN 201710885349A CN 107867670 A CN107867670 A CN 107867670A
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CN
China
Prior art keywords
folded spring
folded
spring
mass
mems
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Pending
Application number
CN201710885349.1A
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Chinese (zh)
Inventor
张谦
杨光隆
顾磊
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Analog Devices Inc
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Analog Devices Inc
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Publication date
Application filed by Analog Devices Inc filed Critical Analog Devices Inc
Priority to CN202310644600.0A priority Critical patent/CN116605828A/en
Publication of CN107867670A publication Critical patent/CN107867670A/en
Pending legal-status Critical Current

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F03MACHINES OR ENGINES FOR LIQUIDS; WIND, SPRING, OR WEIGHT MOTORS; PRODUCING MECHANICAL POWER OR A REACTIVE PROPULSIVE THRUST, NOT OTHERWISE PROVIDED FOR
    • F03GSPRING, WEIGHT, INERTIA OR LIKE MOTORS; MECHANICAL-POWER PRODUCING DEVICES OR MECHANISMS, NOT OTHERWISE PROVIDED FOR OR USING ENERGY SOURCES NOT OTHERWISE PROVIDED FOR
    • F03G7/00Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for
    • F03G7/08Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for recovering energy derived from swinging, rolling, pitching or like movements, e.g. from the vibrations of a machine
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0035Constitution or structural means for controlling the movement of the flexible or deformable elements
    • B81B3/0037For increasing stroke, i.e. achieve large displacement of actuated parts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00Basic microelectromechanical structures
    • B81B2203/01Suspended structures, i.e. structures allowing a movement
    • B81B2203/0145Flexible holders
    • B81B2203/0163Spring holders
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/18Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0805Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
    • G01P2015/0822Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
    • G01P2015/084Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Micromachines (AREA)

Abstract

The present invention relates to couple folded spring in MEMS (MEMS) device.MEMS (MEMS) device is described, including:Mass, substrate is removably couplable to by the folded spring being arranged on the opposite side of mass, two in folded spring are coupled by wherein coupler.In some embodiments, coupler is rod and can be rigid.Therefore, the motion of coupler limitation folded spring relative to each other.In this manner it is achieved that the motion of mass may be limited in preferable type and frequency.

Description

Folded spring is coupled in MEMS (MEMS) device
Technical field
This disclosure relates to mass is coupled to the spring of substrate in MEMS (MEMS) device.
Background technology
A variety of MEMS (MEMS) devices include the mass for being movably coupled substrate.This device, which uses, makes matter Gauge block couples a series of coupled structures of substrate, such as straight beam coupler, T-shaped anchor, helical spring or folded spring.
The content of the invention
MEMS (MEMS) device is described, including:Mass, pass through the folding being arranged on the opposite side of mass Stacking spring is removably couplable to substrate, and two in folded spring are coupled by wherein coupler.In some embodiment party In formula, coupler is rod and can be rigid.Therefore, the motion of coupler limitation folded spring relative to each other.According to This mode, the motion of mass may be limited in preferable type and frequency.
In certain embodiments, there is provided MEMS (MEMS) device, including:Substrate;Pass through the first and second foldings Stacking spring is movably coupled the mass of the substrate, and wherein mass is along first folded spring and/or described The compression direction of eighty percent discount stacking spring is arranged between first and second folded spring;With couple first folded spring The rod of second folded spring.
In certain embodiments, there is provided MEMS (MEMS) device, including:Substrate;Pass through the first and second foldings Stacking spring is movably coupled the mass of the substrate, and wherein mass is along first folded spring and/or described The compression direction of eighty percent discount stacking spring is arranged between first and second folded spring;With for make the first folded spring couple The component of second folded spring.
In certain embodiments, there is provided be built in the system of collecting energy.The system includes:Energy storage device;With Energy collecting device, coupled tank device and be configured to the energy storage device deliver electric power.Energy collecting device includes:Substrate; The mass of the substrate is movably coupled by the first and second folded springs, wherein mass folds along described first The compression direction of spring and/or second folded spring is arranged between first and second folded spring;Described in making First folded spring couples the rod of second folded spring.
Brief description of the drawings
The various aspects and embodiment of the application will be described with reference to the following drawings.It should be appreciated that accompanying drawing is not necessarily to scale Draw.The project appeared in multiple figures is indicated by the same numbers in its all figure occurred.
Figure 1A is according to the perspective view of MEMS (MEMS) inertial device of embodiment of the present invention, and it has logical The mass that folded spring spring is connected to substrate is crossed, two folded springs are coupled by wherein rod.
Figure 1B is the top view of Figure 1A MEMS inertial devices.
Fig. 1 C, 1D and 1E Figure 1A -1B MEMS inertial devices three kinds of different operation modes.
Fig. 2A is that it, which has, passes through folded spring bullet according to the perspective view of the MEMS inertial devices of embodiment of the present invention Spring formula is connected to the mass of substrate, and multiple foldings of two in folded spring are coupled by plurality of rod.
Fig. 2 B are the top views of Fig. 2A MEMS inertial devices.
Fig. 2 C, 2D and 2E describe three kinds of different operation modes of Fig. 2A -2B MEMS inertial devices.
Fig. 2 F are the top views for the MEMS device for including the alternative form for folded spring compared with shown in Figure 1A.
Fig. 3 is the system for the MEMS inertial devices for introducing type described herein.
Fig. 4 has the automobile of the sensing system of Fig. 3 shown types according to the non-limiting embodiments description of the present invention.
Embodiment
The aspect of the present invention provides a kind of MEMS (MEMS) device, and it has the phase by being coupling in mass Two folded springs on offside are coupled to the removable mass of substrate, and mass is coupled by coupler.Two Spring can be the folded spring for having serpentine shaped, extend along the direction of motion of mass, and the coupler can be with It is along from one of spring to the rod of another direction of motion extension.Rod can be rigid, so as to limit two spring phases For mutual motion.In this manner it is achieved that folded spring may be suppressed not under the normal operating condition of MEMS device Desired vibration mode.
In some embodiments, spring can include multiple foldings.One spring can be coupled to by multiple couplers Another spring, such as by the way that the respective folded of a spring is connected into another spring.In certain embodiments, coupler can Can all be rigid rod.
In some embodiments, MEMS device is a kind of energy that energy can be obtained from the motion of removable mass Harvester.In at least some embodiments, desired qualities block is big from the displacement of its equilbrium position, and it is micro- to be greater than 200 Rice.Displacement is bigger, and the energy that may be harvested is more.Two folded springs are linked together and can had by coupler described herein Help use of this spring in MEMS device, wherein mass is intended to undergo big displacement.Coupler can allow Big displacement under the preferred vibration mode of MEMS device, while suppress the displacement associated with undesired vibration mode.
Figure 1A is the perspective view of the MEMS device with the mass that substrate is elastically connected to by folded spring, according to Embodiment of the present invention, two folded springs are linked together.MEMS device 100 includes mass 102, has cavity 105 substrate 104, with each anchor point 108a, 108b, 108c and 108d four folded springs 106a, 106b, 106c and 106d and two coupler 110a and 110b.Figure 1B is the top view of Figure 1A structure, eliminates substrate for convenience of description 104。
Mass 102 can have any right dimensions and shapes, and can be formed by any suitable material.Make For example, mass 102 can be rectangle (for example, square), and can be formed by silicon.In some embodiments, matter Gauge block 102 with the identical material of substrate 104 by forming.For example, substrate 104 can be silicon substrate, and mass 102 can lead to Suitable micro-processing technology (for example, photoetching and etching) is crossed to be formed from substrate 104.As non-limiting example, mass 102 can With with any value or scope in the value in the range of the thickness T1 between 0.3mm and 3mm or this.Show as non-limiting Example, mass 102 can be with any values or scope in the value in the range of 3mm to the length L1 between 20mm or this.
As non-limiting examples, substrate 104 can be silicon substrate or can be formed by other semi-conducting materials.One In a little embodiments, substrate 104 forms a part for chip so that can use the wafer scale manufacturing technology shape on chip simultaneously Into multiple examples of MEMS device 100.In such embodiments, each MEMS device can be cut from chip.Cavity 105 can To be formed using suitable micro-processing technology in substrate 104 so that mass 102 is suspended on the top of cavity 105.It should manage Solution, alternate embodiment do not include the cavity in substrate, because in the presence of the alternative that removable mass is realized relative to substrate 104 Formula.
Folded spring 106a-106d can referred to herein as " concertina spring ", " folding spring ", " folding Tether " or other similar terms, are substantially identical in the non-limiting example, and each include single folding. In alternative embodiments, folded spring can include more than one folding, and its example shows and enters one below in fig. 2 Step description.A pair of folded springs are can be seen that from Figure 1A and 1B to be included on the opposite side of mass 102.Including folded spring The first of 106a and 106b is pointed to the side of removable mass 102, include folded spring 106c and 106d the second contraposition In on the opposite side of the object so that mass 102 is between folded spring pair.
Folded spring 106a-106d can stretch (or compression) (Fig. 2) along y-axis, it is allowed to which mass 102 moves in the direction It is dynamic.Spring 106a-106d is connected to substrate 104 at corresponding fixing point 108a-108d, and fixing point 108a-108d is fixed 's.Anchor point can correspond to respective folded spring 106a-106d end.In one embodiment, anchor point can represent downward Extend to the post on the surface of substrate.Alternative configuration is possible.For example, in certain embodiments, represented by anchor point 108a-108d The end of folded spring alternately terminate on the side (or side wall) of substrate 104.
Folded spring 106a-106d can have any suitably sized.For example, with reference to figure 1A, folded spring can have There are any value or scope in the value at 10 microns to the thickness T2 between 2mm or in the range of this, as non-limiting example. With reference to figure 1B, they can have in the length L2 on 200 microns to the y directions between 3mm or the value in the range of this Any value or scope, and total meander length will be longer.Length LS can determine the possible displacement of mass, and therefore may be used To provide the displacement of the desired amount of mass with appropriate value, such as at 150 microns between 2mm.Folded spring is provided The length LD of fragment of fold distance mass can be the only about half of of length LS.Folded spring 106a-106d is put down in x-y Width W1 in face can be along length change.For example, width near mass 102 may be bigger, close to anchor point distance compared with It is small.Alternative configuration is possible.Width can be selected as W1 value to provide the desired resonant frequency of MEMS device.In some realities Apply in scheme, width W1 can between 1 micron to 300 microns either should in the range of value in any value or scope.
The size of folded spring can be selected to allow the big displacement of mass in y-direction.For example, it can select to roll over The length of stacking spring and anchor point relative to mass positioning, to allow folded spring between 0.3mm and 5mm, in 1mm and Expansion and compression in any value or scope in value between 3mm or within the range, therefore, in certain embodiments, matter The range of movement of gauge block 102 can be in the range of these or in bigger distance.This big displacement in various applications may It is beneficial, such as when MEMS device 100 is to collect the energy collecting device of energy from the motion of mass 102.
MEMS device can include the folded spring different from 106a-106d.That is, folded spring 106a-106d Shape be nonrestrictive example.Other example shows and is further described below in fig. 2f.
As shown in figures 1 a-1d, the folded spring on the opposite side of mass 102 is connected to one by coupler 110a and 110b Rise.In this example, folded spring 106a and 106c are coupled by coupler 110a, and coupler 110b is by folded spring 106b and 106d are coupled.In this example, coupler 110a and 110b is substantially straight.They can have any It is suitably sized to provide desired degree of rigidity.For example, they can have with folded spring identical thickness T2, but can With with the width W2 more than width W1.In some embodiments, width W2 more than 2 to 20 times of W1,2 to 10 more than W1 Times or should in the range of value in any value or scope.Width W2 can be selected for be substantially enough to resist coupler 110a and Bendings of the 110b on x or z directions, and stretching can be resisted in y-direction under the typical operation conditions of MEMS device 100 Or compression.For example, width W2 can between 50 and 500 microns or should in the range of value in any value or scope.Coupling Device 110a and 110b can be more than width W2 in the width W3 being coupled at the Coupling point of folded spring.In some embodiments In, width W3 is between 1.5 to 5 times of W2, although there is other selections.Coupler 110a and 110b length L3 are enough to surround Mass 102 extends.For example, length L3 can be between 1.25 to 3 times of the length L1 of mass 102.In coupler and folding At the Coupling point of stacking spring, length L4 may be enough to provide powerful mechanical couplings between spring and coupler.In some realities Apply in scheme, L4 is between 300 microns to 1.5 millimeters, while it may be possible to using alternative solution.
It should be appreciated that at least some embodiments, MEMS device is not dramatically increased comprising coupler 110a and 110b 100 size.As described above, in certain embodiments, the width of coupler can be between 50 microns and 500 microns.Come from The skew D1 of coupler on the x directions of mass 102 can be between 20 microns to 300 microns or any in the range of this Value.Therefore, at least some embodiments, coupler 110a and 110b presence can be less than to device addition in the x direction The 30% of length L1.In some embodiments, by including coupler 110a and 110b, adding in the x direction than length L1 Small 20% or small 10%.Therefore, the benefit of coupler can be realized by relatively small increase plant bulk.
As illustrated, in certain embodiments, there is provided couple the coupler of the exterior surface of folded spring.However, simultaneously Not all embodiment is all restricted in this respect because coupler can be configured as with folded spring inward against The alternative configuration of part connection.An example is shown in Fig. 2A, and is further described below.
Coupler 110a and 110b can be formed by any suitable material, and in certain embodiments by with their couplings The folded spring identical material of conjunction is formed.For example, they can be patterned by identical and etch process is formed.
Fig. 1 C, 1D and 1E show three kinds of different operator schemes of Figure 1A -1B MEMS device 100.In order to simplify Bright, these figures eliminate substrate 104.
Fig. 1 C show the displacement of the MEMS device 100 associated with the basic vibration mode of mass-spring system.At this In example, mass moves along y-axis, more specifically, Fig. 1 C show mass 102 in negative y-direction from its equilbrium position The state of displacement.In this state, folded spring 106a and 106b compresses along y directions, and folded spring 106c and 106d is along y Direction expands.As can be seen that coupler 110a and 110b not expansion or shrinkage so that the coupling of folded spring fold between away from It is identical from holding.That is, the distance between folded spring 106a Coupling point and folded spring 106c Coupling point with The poised state of MEMS device 100 keeps constant.Similarly, the coupling of folded spring 106b Coupling point and folded spring 106d The distance between point keeps constant with poised state.
In some embodiments, the desired motion of the movement representation MEMS device 100 shown in Fig. 1 C.For example, in response to Experience vibration, acceleration or other some conditions interested, mass may want to undergo big displacement along y directions. In some embodiments, displacement is produced by suitable electrode detection and the electric signal that is captured and stored by suitable circuit.Therefore, The motion of mass can be converted to the electric energy of harvest.In alternative embodiments, MEMS device 100 can be such as accelerometer Or the sensor of gyroscope, and mass 102 can be in response to the concern condition of acceleration or the rotation of such as MEMS device 100 And shift.Displacement can be detected, so as to provide the instruction of experienced situation.In other embodiments, MEMS device can be Actuator.In some embodiments, system can include multiple such MEMS devices, and it is configured as from harvester, passed The different types of device selected in sensor and actuator.
Fig. 1 D show the vibration mode that mass 102 is moved along the z-axis.Especially, Fig. 1 D show mass 102 just From the state of its equilbrium position displacement on z directions.Coupler 110a and 110b can prevent folded spring 106a-106d in response to This motion of mass and freely reverse, and therefore can suppress the vibration mode shown.
Fig. 1 E show that mass 102 surrounds the vibration mode of y-axis rotation.Especially, Fig. 1 E show mass 102 from Its state around the equilbrium position rotate counterclockwise of y-axis.Coupler 110a and 110b can prevent folded spring 106a-106d Freely reversed in response to this motion of mass, and therefore can suppress the vibration mode shown.
Fig. 1 D and 1E show to be probably undesirable motion at least some embodiments, therefore shown vibration mould Formula is considered spurious patterns.Again, in certain embodiments, mass 102 may expect to show Fig. 1 C institutes along y-axis The motion shown.In this case, it is probably beneficial to suppress motion shown in Fig. 1 D and 1E.Coupler 110a and 110b The resonant frequency of the vibration mode shown in Fig. 1 D and 1E can be caused in a frequency domain from the resonance frequency of the vibration mode shown in Fig. 1 C Rate fully shifts so that during the typical operation that they are unlikely to occur in MEMS device 100.In other words, coupler 110a and 110b can be rigidly connected to suppress or fully prevent shown in Fig. 1 D and 1E by being provided between folded spring Displacement type.In some embodiments, the resonant frequency related to the vibration mode shown in Fig. 1 C and Fig. 1 is apparently higher than Fig. 1 C The resonant frequency of shown vibration mode.For example, Fig. 1 D and 1E vibration mode can have the humorous of the vibration mode than Fig. 1 C Big 200Hz to the 3kHz of vibration frequency or should in the range of value in any value or scope resonant frequency.In some embodiments, Second and higher order vibration mode of mass-spring system may have big 2 to 20 times of the resonant frequency than single order vibration mode Resonant frequency.
As it was previously stated, mass is coupled to the folded spring of substrate can include more than one folding.In such reality Apply in example, one or more folding articles of two folded springs can be connected to by one or more couplers of type described herein Together.Fig. 2A and 2B show non-limiting example.
MEMS device 200 includes many identical parts described above in conjunction with Figure 1A and 1B, so no longer detailed herein Those parts are carefully described.However, difference is, there is provided multiple folding spring 206a, 206b, 206c and 206d is with by quality Block 102 is coupled to substrate 104.In addition, MEMS device 200 include six couplers 210a, 210b, 210c, 210d, 210e and 210f。
In this example, the single lap folded spring with Figure 1A is on the contrary, each in folded spring 206a-206d has Three foldings.Coupler 210a-210f links together the corresponding fold of relative folded spring.That is, coupler 210a-210c links together folded spring 206a and 206c respective folded, and coupler 210d-210f is by folded spring 206b and 206d each folding is coupled.Coupler can have any suitably sized to provide desired rigid journey Degree.For example, what coupler 210a-210f length, thickness and width can be listed previously with respect to coupler 110a and 110b In the range of or it is any other suitably sized.
The shape that coupler 210b, 210c, 210e and 210f are can be seen that from Fig. 2A and 2B can mutually substantially phase Together, but 210b and 210e can have the length different from 210c and 210f, to allow the coupling folded spring of different foldings. Coupler 210a and 210d have the shape different from other couplers, because they are by the surface facing with each other of folded spring Coupling.In other words, coupler 210a and 210d has the circular section around folded spring.For example, coupler 210a includes ring Around section 212a and 212b, coupler 210d is included around section 212c and 212d.Therefore, coupling folding is provided in certain embodiments The folding of stacking spring, folded spring different directions to each other.For example, coupler 210b is coupled to by section 211c, 211d With 211e form folded spring 206c folded portion, part 211c, 211d and 211e towards with by be segmented 211a, 211b The direction different with the folded spring 206c of the coupler 210a couplings of 211c compositions folding direction.
It should be appreciated that in certain embodiments from Fig. 2A and 2B, there is provided couple each folding of spring folded against Coupler.However, not all embodiment is all restricted in this respect.For example, MEMS device shown in Fig. 2A and 2B Alternative structure can have two couplers or four couplers, rather than six.Coupling can be omitted in alternative embodiments Device 210b and 210e.
Fig. 2 C, 2D and 2E show three kinds of different operator schemes of Fig. 2A -2B MEMS device.Fig. 2 C show mass The vibration mode of the mass-spring system moved in y-direction.Especially, Fig. 2 C show mass 102 in negative y-direction from The state of its equilbrium position displacement.Folded spring 206a and 206b compress, folded spring 206c and 206d expansion.Coupler 210a-210f will not expand or compress, therefore the distance between each folding of coupling spring is constant.In some embodiments In, the vibration mode shown in Fig. 2 C represents the basic vibration mode of MEMS device 200.
Fig. 2 D show the operator scheme that mass 102 moves in a z-direction.Especially, Fig. 2 D show mass 102 From the state of its equilbrium position displacement in positive z direction.Here, coupler 210a-210f resistances are related to this vibration mode The torsion of the folded spring of connection, so as to suppress the pattern of vibration.
Fig. 2 E show that mass 102 surrounds the vibration mode of y-axis rotation.Especially, Fig. 2 E show that mass surrounds y The state of axle rotate counterclockwise.Coupler 210a-210f also resists this operator scheme.
As the coupler 110a and 110b of MEMS device 100, coupler 210a-210f can influence some vibration moulds The resonant frequency of formula.For example, the resonant frequency of the vibration mode shown in Fig. 2 D and 2E is substantially higher than the pattern shown in Fig. 2 C Resonant frequency so that they are unlikely to occur during the typical operation of MEMS device 200.In this manner it is achieved that coupling Device 210a-210f can completely inhibit or prevent this vibration mode.It is as an example, associated with Fig. 2 D and 2E vibration mode Resonant frequency can be more associated than with Fig. 2 C vibration mode high 200Hz to the 3kHz of resonant frequency.In some embodiments In, second and higher order vibration mode of mass-spring system may have bigger by 2 to 20 than the resonant frequency of single order vibration mode Resonant frequency again.Therefore, during the typical operation of MEMS device 200, this undesirable vibration mode can be suppressed.
As it was previously stated, the shape of the folded spring in Figure 1A -1D and 2A-2E is non-limiting examples.Folded spring may Different shapes is presented.Another non-limiting example is shown in Fig. 2 F, Fig. 2 F are the top views of MEMS device 220.MEMS Device 220 includes mass 222, the first folded spring (first folding formed by being segmented 224a, 224b, 224c and 224d Mass 222 is connected to anchor point 226 by spring) and the second folded spring for being formed by section 228a, 228b, 228c and 228d (mass 222 is coupled to anchor point 230 by second folded spring).Folded spring is coupling in one by the 232a and 232b of coupler Rise.The other shapes of folded spring can realize that it includes two or more folded springs being coupling in one in MEMS device The coupler risen.
The MEMS device of type described herein can be used for such as energy collecting system, sensing system, tunable capacitor In the various systems such as device system and control system.Fig. 3 is the system of the MEMS inertial devices comprising type described herein.System 300 be the sensing for including MEMS sensor 302, power cell 304, sensing circuit 306 and input/output (I/O) interface 308 Device system.MEMS sensor 302 can be mems accelerometer, pressure sensor, gyroscope or other kinds of sensor, with Sense feature interested.Power cell 304 can include electricity energy harvester 310, for example previously described and be used as energy The MEMS device 100 or 200 of harvester operation, and energy storage device 312.Energy storage device can be used to store to be adopted by energy Battery, ultracapacitor or other the suitable structures for the energy that acquisition means 310 are collected.The energy of collection can be used for control The power detection for the signal that the sensing circuit 306 of the operation of MEMS sensor 302 and/or processing are exported by MEMS sensor 302 Circuit 306.I/O interfaces 308 can be wired for being communicated with such as computer, server or the external module of other systems Or wave point.
The system of MEMS device comprising type described herein can be realized in various settings.It is as an example, such System can use in industrial setting.For example, there may be the energy that can be harvested by MEMS device as described herein for industrial machinery The vibration of amount.The energy of collection can be used for the place for the performance of Sensor monitoring industrial machine and/or the operation of control machine Manage device.
Alternatively, system as shown in Figure 3 can be realized in such as vehicle of automobile, ship or aircraft.Fig. 4 shows Having gone out wherein automobile 400 includes the example of sensor unit 401 and car-mounted computer 402.Sensor unit 401 can be for example System shown in Fig. 3, including MEMS sensor, have type described herein energy collecting device power cell, sensor electricity Road and interface circuit.Sensor unit 401 can include the packaging or shell for being attached to the desired part of automobile 400.As showing Example, sensor unit can sense acceleration along driving direction and/or perpendicular to driving direction.Additionally or altematively, pass Sensor cell 401 can be configured as sensing normal acceleration, so as to monitor such as halted state.The energy of sensor unit 401 Amount collector can collect energy from the motion of automobile.Sensor unit 401 can communicate with car-mounted computer 402, and can Transducing signal is provided to car-mounted computer.
Self-test can be carried out at least some embodiments according to the MEMS device in terms of the present invention.For example, with herein The MEMS energy collecting devices of the coupling folded spring of the type can carry out self-test by the suitable drive signal of application, and And it can be moved with the gained of quality of evaluation block.Oneself of the other kinds of MEMS device with coupling folded spring can also be carried out Inspection, rather than just energy collecting device.
Term " about " can be used for representing in ± the 20% of desired value in some embodiments, in some embodiments may be used For representing desired value ± 10% in, in some embodiments can be used for represent desired value ± 5% in, some implementation In example still in ± the 2% of desired value.Term " about " can include desired value.

Claims (20)

  1. MEMS 1. (MEMS) device, including:
    Substrate;
    The mass of the substrate is movably coupled by the first and second folded springs, wherein the mass is along described The compression direction of first folded spring and/or second folded spring is arranged between first and second folded spring; With
    First folded spring is set to couple the rod of second folded spring.
  2. 2. the MEMS device described in claim 1, wherein each in first and second folded spring includes multiple foldings It is folded, wherein the rod is the first leg and makes the first of first folded spring to fold to couple the of second folded spring One folds, and wherein described MEMS device also includes making the second of first folded spring to fold coupling second folding The second rod that the second of spring folds.
  3. 3. the MEMS device described in claim 2, wherein the first of first folded spring folds towards the described first folding The opposite direction that the second of spring folds.
  4. 4. the MEMS device described in claim 3, wherein the first leg is centered around at least one of first folded spring Around point.
  5. 5. the MEMS device described in claim 1, folded wherein the rod has from first folded spring to described second The length of spring and the width vertical with the length, and the width of wherein described rod is than the width of first folded spring It is big 2 to 10 times.
  6. 6. the MEMS device described in claim 1, in addition to the 3rd folded spring and the 4th folded spring, make the mass coupling The substrate is closed, and is positioned so as to the mass between third and fourth folded spring, wherein described in coupling The rod of first folded spring and second folded spring is the first leg, and wherein described MEMS device is also included described in coupling Second rod of the third and fourth folded spring.
  7. 7. the MEMS device described in claim 1, wherein being respectively provided with the mass and the rod substantially perpendicular to described The width in the direction of the compression direction of the first folded spring and/or second folded spring, and the width of wherein described rod It is smaller than the width of the mass by 10%.
  8. 8. the MEMS device described in claim 1, wherein the rod is centered around at least a portion week of first folded spring Enclose.
  9. MEMS 9. (MEMS) device, including:
    Substrate;
    The mass of the substrate is movably coupled by the first and second folded springs, wherein the mass is along described The compression direction of first folded spring and/or second folded spring is arranged between first and second folded spring; With
    For making first folded spring couple the component of second folded spring.
  10. 10. the MEMS device described in claim 9, wherein for making first folded spring couple second folded spring Component multiple foldings for including being used to make first folded spring couple second folded spring multiple foldings structure Part.
  11. 11. the MEMS device described in claim 10, wherein multiple foldings of first folded spring include side opposite each other To in face of first fold and second fold.
  12. 12. the MEMS device described in claim 9, wherein for making first folded spring couple second folded spring Component include be used for produce make what the first mode of the mass separated with the second mode resonant frequency of the mass Component, wherein the second mode has the resonant frequency than big 2 to 20 times of the first mode.
  13. 13. the MEMS device described in claim 9, in addition to the 3rd folded spring and the 4th folded spring, make the mass The substrate is coupled, and is positioned so as to the mass between third and fourth folded spring, and is also included For making the 3rd folded spring couple the component of the 4th folded spring.
  14. 14. the system of collecting energy is configured to, including:
    Energy storage device;With
    Energy collecting device, couple the energy storage device and be configured to deliver electric power, the energy acquisition to the energy storage device Device includes:
    Substrate;
    The mass of the substrate is movably coupled by the first and second folded springs, wherein the mass is along described The compression direction of first folded spring and/or second folded spring is arranged between first and second folded spring; With
    First folded spring is set to couple the rod of second folded spring.
  15. 15. the system described in claim 14, in addition to sensor or actuator, couple the energy collecting device and be configured to Electric power is received from the energy collecting device.
  16. 16. the system described in claim 15, wherein the sensor or actuator are MEMS (MEMS) sensors, bag Include:
    Substrate;
    The mass of the substrate is movably coupled by the first and second folded springs, wherein the mass is along described The compression direction of first folded spring and/or second folded spring is arranged between first and second folded spring; With
    First folded spring is set to couple the rod of second folded spring.
  17. 17. the system described in claim 14, wherein each in first and second folded spring includes multiple foldings, Wherein described rod is the first leg and makes the first of first folded spring to fold the first of coupling second folded spring Fold, and wherein described energy collecting device also includes making the second of first folded spring to fold coupling second folding The second rod that the second of spring folds.
  18. 18. the system described in claim 17, wherein the first of first folded spring folds towards first folded ammunition The opposite direction that the second of spring folds.
  19. 19. the system described in claim 14, wherein the energy collecting device also includes the 3rd folded spring and the 4th folded ammunition Spring, the mass is coupled the substrate, and be positioned so as to the mass in third and fourth folded spring Between, wherein the rod for coupling first folded spring and second folded spring is the first leg, and wherein described energy Collector also includes the second rod for coupling third and fourth folded spring.
  20. 20. the system described in claim 14, wherein the rod is centered around around at least a portion of first folded spring.
CN201710885349.1A 2016-09-27 2017-09-27 Folded spring is coupled in MEMS (MEMS) device Pending CN107867670A (en)

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Application publication date: 20180403