CN107807317A - A kind of electronic component test device - Google Patents
A kind of electronic component test device Download PDFInfo
- Publication number
- CN107807317A CN107807317A CN201610796275.XA CN201610796275A CN107807317A CN 107807317 A CN107807317 A CN 107807317A CN 201610796275 A CN201610796275 A CN 201610796275A CN 107807317 A CN107807317 A CN 107807317A
- Authority
- CN
- China
- Prior art keywords
- electronic component
- pin
- measured
- heat sink
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 25
- 239000004020 conductor Substances 0.000 claims description 6
- 239000011148 porous material Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims 1
- 238000004891 communication Methods 0.000 abstract description 4
- 239000013536 elastomeric material Substances 0.000 abstract description 3
- 238000005259 measurement Methods 0.000 abstract description 2
- 238000005057 refrigeration Methods 0.000 description 5
- 238000011056 performance test Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000686 essence Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2607—Circuits therefor
- G01R31/2632—Circuits therefor for testing diodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention belongs to electronic component technical field of measurement and test, more particularly to a kind of electronic component test device, including electronic component to be measured and drive circuit board, the drive circuit board is provided with the multiple conductive holes to match with each pin of electronic component to be measured, the pin of the electronic component to be measured is inserted in conductive hole, and it is additionally provided with Flexible element between each pin and drive circuit board, Flexible element can tense pin, it is brought into close contact with conductive hole inwall, realize the electrical connection between electronic component and drive circuit board to be measured.The present invention abandons the test mode welded in conventional test, and the electrical communication of pcb board and electronic component pin is realized using pulling force caused by elastomeric material, convenient and swift, and does not have any damage to device.
Description
Technical field
The invention belongs to electronic component technical field of measurement and test, and in particular to a kind of electronic component test device.
Background technology
The device for being now widely used in single-photon detector is avalanche photodide (APD), and it is that detector field makes
Photovoltaic detector element, when the operating voltage of diode is higher than its avalanche breakdown voltage, incident to single photon it can produce
Raw response, produces the avalanche current pulse of macroscopic view, it is achieved thereby that the conversion output of photosignal, refrigeration mode InGaAs APD are
The device with refrigeration encapsulation of single-photon detector is specifically applied to, compared with commonly without refrigerating function APD TO-46 encapsulation
Structure is complex, and it uses TO-8 encapsulating structures.It is right in order to ensure the performance of detector, it is necessary to which APD is fixed on PCB
Its performance is tested, the most frequently used at present in order to ensure the reliability of performance test because refrigeration mode APD number of pins is 12
Fixed form be still to be soldered directly to be tested on pcb board using APD.
Existing technology is mainly that APD is fixed on to the performance test that APD is carried out on pcb board by way of welding, by
It it is 12 in the APD number of pins of refrigeration mode, and lead pin pitch only has several millimeters, and the mode of multiple welding not only results in PCB aperture
Obstruction, cause PCB waste, and the scolding tin intractability on the APD pins disassembled is also larger, is unfavorable for its installation
In normal production equipment.
The content of the invention
It is easy to dismount it is an object of the invention to provide one kind, and the electronic component that will not damage pin in disassembly process is surveyed
Trial assembly is put.
To achieve the above object, the invention provides following technical scheme：A kind of electronic component test device, including treat
Electronic component and drive circuit board are surveyed, the drive circuit board is provided with what is matched with each pin of electronic component to be measured
Multiple conductive holes, the pin of the electronic component to be measured is inserted in conductive hole, and is also set between each pin and drive circuit board
Flexible unit, Flexible element can tense pin, it is brought into close contact with conductive hole inwall, realize electronic component to be measured
Electrical connection between drive circuit board.
Preferably, it is additionally provided with made of highly heat-conductive material and radiates between the electronic component to be measured and drive circuit board
Plate, what the pin of the electronic component to be measured opened up from heat sink passes through with the one-to-one through hole of pin；The radiating
Neighbouring electronic component opening position to be measured is connected with fin on plate.
Preferably, pin isolating pad made of insulated heat material, institute are provided between the drive circuit board and heat sink
State that pin isolating pad includes protruding out setting in plate-like body, and plate-like body with each pin multiple separation sleeves correspondingly
Pipe, the pore of each disrance sleeve are set through plate-like body, and the plate-like body is clipped between heat sink and drive circuit board, respectively
Disrance sleeve is inserted in the through hole of the heat sink, and the pin of electronic component to be measured passes through from the pore of disrance sleeve, is made each
Insulated between pin and heat sink.
Preferably, heat conductive pad made of elastic heat conducting material, institute are provided between the electronic component to be measured and heat sink
Heat conductive pad both sides are stated to be brought into close contact with electronic component to be measured and heat sink respectively, for will caused by electronic component to be measured it is hot
Amount is conducted to heat sink.
Preferably, the heat sink and drive circuit board are bolted to connection, and the Flexible element is rubber band, bullet
Property unit both ends are respectively fitted on pin and bolt.
Preferably, the bottom of the electronic component to be measured is provided with threaded post, and the threaded post sequentially passes through heat conductive pad, radiating
The through hole opened up on plate and drive circuit board, and tightened using nut, make electronic component to be measured and heat sink and drive circuit
Plate is affixed.
Preferably, the heat sink is copper coin.
Preferably, the pin isolating pad is made up of insulating rubber or thermal insulation ceramicses；The heat conductive pad is by heat conductive rubber system
Into.
Preferably, it is fixedly connected between the fin and heat sink by screw.
Preferably, the pin top of the electronic component to be measured is additionally provided with limit casing, the limit casing and pin
Interference fit is formed, the frictional force between limit casing and pin can be such that limit casing is relatively fixed with pin, and as behaviour
Make personnel slightly firmly pull limit casing when, with regard to limit casing can be made to be come off from pin；On the outer ring surface of the limit casing
Provided with the annular groove for fixing rubber band.
The technical effects of the invention are that：The present invention abandons the test mode welded in conventional test, using elastomeric material
Caused pulling force realizes the electrical communication of pcb board and electronic component pin, convenient and swift, and does not have any damage to device
Wound.The elastomeric material of heat conductive pad in the present invention can adjust in real time according to electronic component pins contact situation, easy to control.
Pin isolating pad in the present invention efficiently avoid to be connected between device package and pin short circuit caused by possibility during heat sink contact
The problem of logical.The present invention can be commonly used to various electronic components, convenient device to be carried out into factory's performance test but not broken
Bad device itself.
Brief description of the drawings
Fig. 1 is the sectional view that embodiments of the invention are provided；
Fig. 2 is Fig. 1 I partial enlarged views；
Fig. 3 is the dimensional structure diagram that embodiments of the invention are provided；
Fig. 4 is the rearview that embodiments of the invention are provided.
Embodiment
The present invention is described in detail below in conjunction with accompanying drawing.
As shown in figures 1-4, the present embodiment is by taking the detection of avalanche diode (APD) 10 as an example, to technical scheme
It is described in detail.
A kind of electronic component test device, including APD10 and drive circuit board 11, the drive circuit board 11 are provided with
The multiple conductive holes to match with APD10 each pin 101, the pin 101 of the APD10 is inserted in conductive hole, and each pin
Flexible element is additionally provided between 101 and drive circuit board 11, Flexible element can tense pin 101, make its with conductive hole
Wall is brought into close contact, and realizes the electrical connection between APD10 and drive circuit board 11.The present invention abandons the test welded in conventional test
Mode, the electrical communication of drive circuit board 11 and APD10 pins 101 is realized using pulling force caused by Flexible element, it is convenient fast
Victory, and there is no any damage to device.
Preferably, heat sink 12 made of highly heat-conductive material are additionally provided between the APD10 and drive circuit board 11, it is described
What APD10 pin 101 opened up from heat sink 12 passes through with 101 one-to-one through hole of pin；It is adjacent on the heat sink 12
Nearly APD10 opening positions are connected with fin 19, and an exhaust fan 20 can also be installed on fin 19, improve radiating efficiency.Heat sink
12 APD10 can be freezed caused by heat in time conduction to fin 19, APD10 is worked at a lower temperature.
Preferably, isolate between the drive circuit board 11 and heat sink 12 provided with pin made of insulated heat material
Pad, the pin isolating pad include protruding out corresponding with each pin 101 for setting in plate-like body 13, and plate-like body 13
Multiple disrance sleeves 131, the pore of each disrance sleeve 131 sets through plate-like body 13, and the plate-like body 13 is clipped in scattered
Between hot plate 12 and drive circuit board 11, each disrance sleeve 131 is inserted in the through hole of the heat sink 12, APD10 pin 101
Passed through from the pore of disrance sleeve 131, make to insulate between each pin 101 and heat sink 12.Due to heat sink 12 be it is conductive,
APD10 pin 101, which directly contacts heat sink 12, can cause short circuit between pin 101, thus with the addition of in heat sink 12 by
The pin isolating pad that the material of insulated heat is made, the electrical communication characteristic that can be effectively isolated between each pin 101.
Preferably, heat conductive pad 14 made of elastic heat conducting material, the heat conduction are provided between the APD10 and heat sink 12
Pad 14 both sides to be brought into close contact with APD10 and heat sink 12 respectively, for heat caused by APD10 to be conducted to heat sink 12.By
Need to ensure the thermal conductivity that device is good when in use in refrigeration mode APD10, in order to ensure that tube shell bottom is closely pasted with heat sink 12
Close, ensure heat conductivity, APD10 and it is heat sink between increase heat conductive pad 14, the elasticity of heat conductive pad 14 can ensure the pipe of device
The thermal conductivity of shell bottom.
Preferably, the heat sink 12 is fixedly connected with drive circuit board 11 by bolt 16, and the Flexible element is rubber
Rubber band 15, Flexible element both ends are respectively fitted on pin 101 and bolt 16.APD10 bottom is provided with threaded post, the threaded post according to
It is secondary to be tightened through the through hole opened up on heat conductive pad 14, heat sink 12 and drive circuit board 11, and using nut 21, make APD10 with
Heat sink 12 and drive circuit board 11 are affixed.The base integral type machine-shaping of the threaded post and APD10.The spiral shell of the present embodiment
Mother 21 preferably using the larger copper post nut of length, makes nut 21 protrude the outer end of pin 101, when avoiding dismounting nut 21 and pin
101 produce interference.
Preferably, the heat sink 12 is copper coin, and the pin isolating pad is made up of insulating rubber or thermal insulation ceramicses；It is described
Heat conductive pad 14 is made up of heat conductive rubber, is fixedly connected between the fin 19 and heat sink 12 by screw 18.
Preferably, the top of pin 101 of the APD10 is additionally provided with limit casing 17, the limit casing 17 and pin 101
Interference fit is formed, the frictional force between limit casing 17 and pin 101 can make limit casing 17 relatively solid with pin 101
It is fixed, and when operating personnel slightly firmly pull limit casing 17, with regard to limit casing 17 can be made to be come off from pin 101；It is described
The outer ring surface of limit casing 17 is provided with the annular groove 171 for being used for fixing rubber band 15.
In use, first by heat sink 12, drive circuit board 11, pin isolating pad, fin 19 bolt 16 and screw
18 fix.Define APD10 is installed on test fixture according still further to the pin 101 of APD10 on drive circuit board 11, and pass through
APD10 is fixed nut 21, and ensures that APD10 tube shell bottom, heat conductive pad 14, heat sink 12 completely attach to.Fix
After APD10, then the pin 101 by the fixation of rubber band 15 APD10, rubber band 15 are individually fixed on pin 101 and bolt 16,
The purpose that pin 101 is connected with APD10 electrical connectivity is reached by the tensile force of rubber band 15.
During dismounting, need to only dismantle the nut 21 of rubber band 15 and fixed APD10 centre can directly take out APD10,
And pin 101 will not be damaged, so as to not interfere with APD10 performance and later stage in research and development and production process yet
Use.
Rubber band 15 can adjust in real time according to the contact situation of APD10 pins 101, easy to control.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
All any modification, equivalent and improvement made within refreshing and principle etc., should be included in the scope of the protection.
Claims (10)
- A kind of 1. electronic component test device, it is characterised in that：Including electronic component to be measured and drive circuit board, the drive Dynamic circuit board is provided with the multiple conductive holes to match with each pin of electronic component to be measured, the electronic component to be measured Pin is inserted in conductive hole, and Flexible element is additionally provided between each pin and drive circuit board, and Flexible element can draw pin Tightly, it is brought into close contact with conductive hole inwall, realize the electrical connection between electronic component and drive circuit board to be measured.
- 2. electronic component test device according to claim 1, it is characterised in that：The electronic component to be measured is with driving Heat sink made of highly heat-conductive material is additionally provided between dynamic circuit board, the pin of the electronic component to be measured is opened from heat sink If passed through with the one-to-one through hole of pin；Neighbouring electronic component opening position to be measured is connected with fin on the heat sink.
- 3. electronic component test device according to claim 2, it is characterised in that：The drive circuit board and heat sink Between be provided with pin isolating pad made of insulated heat material, the pin isolating pad includes plate-like body, and plate-like body On protrude out setting multiple disrance sleeves, the pore of each disrance sleeve are set through plate-like body correspondingly with each pin, The plate-like body is clipped between heat sink and drive circuit board, and each disrance sleeve is inserted in the through hole of the heat sink, to be measured The pin of electronic component passes through from the pore of disrance sleeve, makes to insulate between each pin and heat sink.
- 4. the electronic component test device according to Claims 2 or 3, it is characterised in that：The electronic component to be measured Be provided with heat conductive pad made of elastic heat conducting material between heat sink, the heat conductive pad both sides respectively with electronic component to be measured and Heat sink is brought into close contact, for heat caused by electronic component to be measured to be conducted to heat sink.
- 5. electronic component test device according to claim 4, it is characterised in that：The heat sink and drive circuit board It is bolted to connection, the Flexible element is rubber band, and Flexible element both ends are respectively fitted on pin and bolt.
- 6. electronic component test device according to claim 5, it is characterised in that：The bottom of the electronic component to be measured Portion is provided with threaded post, and the threaded post sequentially passes through the through hole opened up on heat conductive pad, heat sink and drive circuit board, and uses nut Tighten, make electronic component to be measured and heat sink and drive circuit board affixed.
- 7. electronic component test device according to claim 2, it is characterised in that：The heat sink is copper coin.
- 8. electronic component test device according to claim 4, it is characterised in that：The pin isolating pad is by heat-insulated rubber Glue or thermal insulation ceramicses are made；The heat conductive pad is made up of heat conductive rubber.
- 9. electronic component test device according to claim 2, it is characterised in that：Between the fin and heat sink It is fixedly connected by screw.
- 10. electronic component test device according to claim 5, it is characterised in that：The electronic component to be measured Pin top is additionally provided with limit casing, and the limit casing is formed with pin and is interference fitted, rubbing between limit casing and pin Wiping power can be such that limit casing is relatively fixed with pin, and when operating personnel slightly firmly pull limit casing, with regard to limit can be made Position sleeve pipe comes off from pin；The outer ring surface of the limit casing is provided with the annular groove for being used for fixing rubber band.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610796275.XA CN107807317B (en) | 2016-08-31 | 2016-08-31 | Electronic component testing device |
| CN202410412369.7A CN118362851A (en) | 2016-08-31 | 2016-08-31 | Electronic component testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610796275.XA CN107807317B (en) | 2016-08-31 | 2016-08-31 | Electronic component testing device |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410412369.7A Division CN118362851A (en) | 2016-08-31 | 2016-08-31 | Electronic component testing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107807317A true CN107807317A (en) | 2018-03-16 |
| CN107807317B CN107807317B (en) | 2024-05-28 |
Family
ID=61575910
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410412369.7A Pending CN118362851A (en) | 2016-08-31 | 2016-08-31 | Electronic component testing device |
| CN201610796275.XA Active CN107807317B (en) | 2016-08-31 | 2016-08-31 | Electronic component testing device |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410412369.7A Pending CN118362851A (en) | 2016-08-31 | 2016-08-31 | Electronic component testing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN118362851A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110618370A (en) * | 2018-06-04 | 2019-12-27 | 苏州能讯高能半导体有限公司 | Testing device |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1508859A (en) * | 2002-12-17 | 2004-06-30 | 丽台科技股份有限公司 | Integrated circuit testing device |
| CN2898575Y (en) * | 2006-04-28 | 2007-05-09 | 吴毅超 | High-density and directed-connected LED illuminating module |
| CN101629710A (en) * | 2008-07-18 | 2010-01-20 | 富士迈半导体精密工业（上海）有限公司 | Illuminating device |
| KR20100138348A (en) * | 2009-06-25 | 2010-12-31 | 이상경 | A variable box for pcb loading |
| JP2014006097A (en) * | 2012-06-22 | 2014-01-16 | Advantest Corp | Socket, tray, substrate assembly, and electronic part testing device |
| CN105445506A (en) * | 2015-12-24 | 2016-03-30 | 贵州航天计量测试技术研究所 | Welding-free self-clamping interconnection structure |
| CN206074755U (en) * | 2016-08-31 | 2017-04-05 | 科大国盾量子技术股份有限公司 | A kind of electronic devices and components test device |
-
2016
- 2016-08-31 CN CN202410412369.7A patent/CN118362851A/en active Pending
- 2016-08-31 CN CN201610796275.XA patent/CN107807317B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1508859A (en) * | 2002-12-17 | 2004-06-30 | 丽台科技股份有限公司 | Integrated circuit testing device |
| CN2898575Y (en) * | 2006-04-28 | 2007-05-09 | 吴毅超 | High-density and directed-connected LED illuminating module |
| CN101629710A (en) * | 2008-07-18 | 2010-01-20 | 富士迈半导体精密工业（上海）有限公司 | Illuminating device |
| KR20100138348A (en) * | 2009-06-25 | 2010-12-31 | 이상경 | A variable box for pcb loading |
| JP2014006097A (en) * | 2012-06-22 | 2014-01-16 | Advantest Corp | Socket, tray, substrate assembly, and electronic part testing device |
| CN105445506A (en) * | 2015-12-24 | 2016-03-30 | 贵州航天计量测试技术研究所 | Welding-free self-clamping interconnection structure |
| CN206074755U (en) * | 2016-08-31 | 2017-04-05 | 科大国盾量子技术股份有限公司 | A kind of electronic devices and components test device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110618370A (en) * | 2018-06-04 | 2019-12-27 | 苏州能讯高能半导体有限公司 | Testing device |
| CN110618370B (en) * | 2018-06-04 | 2022-02-01 | 苏州能讯高能半导体有限公司 | Testing device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN118362851A (en) | 2024-07-19 |
| CN107807317B (en) | 2024-05-28 |
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