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CN107621245B - Automatic point position correction method and device for measuring machine - Google Patents

Automatic point position correction method and device for measuring machine Download PDF

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Publication number
CN107621245B
CN107621245B CN201710797166.4A CN201710797166A CN107621245B CN 107621245 B CN107621245 B CN 107621245B CN 201710797166 A CN201710797166 A CN 201710797166A CN 107621245 B CN107621245 B CN 107621245B
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point location
product
location information
point
measuring machine
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CN107621245A (en
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叶巧云
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Abstract

The invention provides a method and a device for automatically correcting point positions of a measuring machine. The method comprises the following steps: making the product to be measured enter a measuring machine table; calling a product parameter file to measure a product; completing product measurement to obtain the latest point location information; judging whether the point position difference meets a correction condition; if the point location difference meets the correction condition, backing up the parameter file and correcting the point location information; if the point position difference does not meet the correction condition, the product exits the measuring machine.

Description

Automatic point position correction method and device for measuring machine
Technical Field
The invention relates to the technical field of measurement, in particular to a point position automatic correction method and device for a measuring machine.
Background
The measurement point is the key point for the measurement machine to correctly measure and acquire data. The measurement point is coordinate information of measurement, including information of at least X, Y, Z three movement axes. The measurement point location changes with time, and due to the influence of changing factors such as mechanisms and manufacturing processes, the coordinate offset condition occurs, and the coordinate offset condition can lead to the extension of measurement time and even to measurement errors, and provides wrong parameter file monitoring information, thereby causing product abnormality.
The current mainstream point position correction technology depends on manual correction of personnel, belongs to a pure manual or semi-automatic state, and does not realize full automation. Fig. 1 shows a flow chart of the present implementation of point location correction. As shown in fig. 1, when it is confirmed that point location correction is required, first, a borrowing machine and a borrowing material need to be manufactured, that is, since point location correction takes time, a machine station needs to be borrowed, but the machine station cannot monitor the quality of a product when being borrowed, and the effect of point location correction needs to be confirmed, so that the material needs to be borrowed to confirm the effect. After the material enters the machine, manually confirming each point variation, updating point location information and storing a parameter file (recipe), starting automatic measurement and confirming whether the point location information is correct, if not, updating the point location information and storing the parameter file, and if so, completing manual correction, wherein the parameter file is a file for monitoring the product quality and contains information such as measuring point locations.
The point position correction technology relying on manual correction of an operator has the following defects:
1) and the operator needs to stop to confirm the point location difference and then corrects the point location difference, and the equipment cannot be used in the period and cannot obtain parameter file monitoring data.
2) The operator needs to spend time to confirm the point location variation and re-correct the point location.
3) The operator can have point position correction errors, which causes monitoring abnormity.
Therefore, a technique for automatically correcting the point of the metrology machine is needed.
Disclosure of Invention
In view of the above problems, the present invention provides an automatic correction method for point positions of a metrology machine, comprising:
making the product to be measured enter a measuring machine table;
calling a product parameter file to measure a product;
completing product measurement to obtain the latest point location information;
judging whether the point position difference meets a correction condition; and
if the point location difference meets the correction condition, backing up the parameter file and correcting the point location information; if the point position difference does not meet the correction condition, the product exits the measuring machine.
In one embodiment, the completing the product measurement to obtain the latest point location information includes:
and acquiring point location information of the geometric characteristics of the product.
In one embodiment, the determining whether the point location difference satisfies the correction condition includes:
and judging whether the difference of the point location information of the geometric features of the product is greater than a threshold value.
In one embodiment, the geometric feature of the product includes two edges of the product in one axial direction of the metrology machine.
In one embodiment, the determining whether the difference of the point location information of the geometric features of the product satisfies the correction condition includes:
and judging whether the difference between the current point location information and the previous point location information of at least one of the two edges is greater than a threshold value.
The invention also provides a point location automatic correction device of the measuring machine, which comprises:
the point location information acquisition module is used for acquiring the latest point location information when the measuring machine measures the product;
the judging module is used for judging whether the point position difference meets a correction condition; and
and the correction module is used for correcting the point location information when the point location difference meets the correction condition, and informing the product to exit the measuring machine table when the point location difference does not meet the correction condition.
In an embodiment, the point location information obtaining module is specifically configured to obtain the point location information of the geometric feature of the product when the measuring machine measures the product.
In an embodiment, the determination module is specifically configured to determine whether the difference of the point location information of the geometric features of the product is greater than a threshold.
In one embodiment, the geometric feature of the product includes two edges of the product in one axial direction of the metrology machine.
In an embodiment, the determining module is specifically configured to: and judging whether the difference between the current point location information and the previous point location information of at least one of the two edges is greater than a threshold value.
Compared with the prior art, the method and the device based on the invention can automatically correct the point location information of the measuring machine in the product measuring process without additionally preparing a reference object.
Additional features and advantages of the invention will be set forth in the description which follows. Also, some of the features and advantages of the invention will be apparent from the description, or may be learned by practice of the invention. The objectives and some of the advantages of the invention may be realized and attained by the process particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a flow chart of point location correction for a metrology machine of the prior art.
FIG. 2 is a flowchart illustrating an exemplary method for point location correction of a metrology machine.
Fig. 3 to 6 are schematic diagrams illustrating an automatic point position correction method applied to a probe type film thickness measuring machine according to an embodiment of the present invention.
Fig. 7 is a structural diagram of an automatic correction device for point positions of a measuring machine according to an embodiment of the present invention.
Detailed Description
The following detailed description will be provided for the embodiments of the present invention with reference to the accompanying drawings and examples, so that the practitioner of the present invention can fully understand how to apply the technical means to solve the technical problems, achieve the technical effects, and implement the present invention according to the implementation procedures. It should be noted that, as long as there is no conflict, the embodiments and the features of the embodiments of the present invention may be combined with each other, and the technical solutions formed are within the scope of the present invention.
As described above, in the conventional point correction method for metrology machine shown in fig. 1, it is necessary to confirm each point variation manually with the aid of a reference. Therefore, manufacturing costs, labor costs, and low productivity are increased.
The invention provides a point position automatic correction method and device of a measuring machine, which can realize point position automatic correction without other reference objects in the product measuring process, thereby improving the productivity, saving the labor and avoiding the manual operation error.
FIG. 2 is a flowchart illustrating a method for automatic correction of metrology machine site locations according to an embodiment of the present invention. As shown in fig. 2, the method for automatically correcting the position of a measuring machine according to the present invention first executes step S201 to make a product to be measured enter a measuring machine. As described above, the point location automatic correction method of the present invention can automatically correct point location information during product measurement, and the existing point location correction technology of the measuring machine needs to be stopped to correct point location when finding point location deviation during product measurement.
As shown in fig. 2, after step S201, step S202 is executed to call the product parameter file, measure the product, and step S203 is executed to complete the product measurement, so as to obtain the latest point location information.
After the current and previous latest point location information is obtained, it is necessary to determine whether the point location difference satisfies the correction condition S204. If the point location difference satisfies the correction condition, the parameter file is backed up and the point location information is corrected S205; if the point difference does not satisfy the correction condition, the product exits the measuring machine S206.
As described above, the point location automatic correction method of the measuring machine of the present invention does not need to prepare an additional reference, and can complete point location automatic correction in the process of product measurement, and the key step is to determine whether the point location difference satisfies the correction condition.
Hereinafter, with specific reference to fig. 3 to 6, how to determine whether or not the dot position difference satisfies the correction condition will be described with reference to a probe type film thickness measuring machine.
The probe type film thickness measuring machine is a mechanical contact measuring device, the core component is a probe measuring mechanism, and in the TFT-LCD industry, the probe measuring mechanism is generally used for measuring the film thickness value of a TFT or a color filter. In order to accurately measure a product to be measured, the probe type film thickness measuring machine needs to ensure that the point positions of a measuring head and a probe are not changed in the measuring process, however, in the actual use process, the point positions of the measuring head and the probe are easy to deviate, for example, an encoder is easy to cause data loss when power is tripped, and the position of the original point position is lost, namely, the point position deviation is possibly caused; the probe is also subjected to maintenance wiping, replacement, human error, or the like, which causes positional displacement of the probe.
For this, as shown in fig. 3, the probe passes through positions 1 to 5 from left to right in one axial direction of the film thickness measuring machine to measure the product P to be measured, thereby obtaining a waveform diagram. The length of the waveform diagram is, for example, 800 μm, which can be regarded as a standard waveform diagram. As shown in fig. 3, the waveform chart records the positions of the two sides a and B of the product P to be measured in the axial direction, i.e., 150 μm and 650 μm, which are set as the standard positions of the two sides a and B. At this time, the latest point a1 is obtained.
In the actual measurement process, if the position of the probe deviates, the positions of the two sides a and B of the product under test may be changed as shown in fig. 4 when the product under test continues to be measured, that is, the positions of a and B are at 50 μm and 550 μm, and a new point a2 is obtained. If the standard position deviation from a or B is 100 μm and is larger than a predetermined threshold value, for example, 10 μm, correction is required, that is, the point of updating a2 is a2 — a2+100 μm.
As shown in fig. 5, when the position of the probe is shifted, the position of the two sides a and B of the product to be measured may be shifted, that is, when the point at the side a is not present but only the point at the side B is present, and the point at which the side B is obtained is 490 μm, the point is shifted by 160 μm from the standard point at the side B of 650 μm and is greater than the set threshold, the new point a3 is corrected, that is, the point a3 at the side a3 is updated to a3 to 160 μm.
As shown in fig. 6, when the position of the probe is shifted, the positions of the two sides a and B of the product to be measured may be shifted to the position of the side a, and the position of the side B may not be shifted, and when the position of the side a is 330 μm, the position is shifted from the standard position of the side a by 180 μm from the standard position of the side a by 150 μm, and is greater than the set threshold value, the new position a4 is corrected, that is, the position of the side a4 is updated to a4 being a4+180 μm.
In practice, the required threshold value can be set according to the type of measuring machine and the measurement requirements.
In view of the above, the method for automatically correcting the point location of the measuring machine according to the present invention is implemented in the process of measuring the product without using an additional reference device by using the point location difference of the geometric features of the product to be measured to correct the position deviation of the measuring mechanism such as the measuring head or the probe of the measuring machine. In the automatic correction process, the equipment automatically stores the parameter files and backups the original parameter files, so that the phenomenon of unrecoverable caused by abnormal errors can be effectively prevented.
Although the above embodiments use two edges of the measured product in one axial direction of the measuring machine as the geometric features, the present invention is not limited thereto, and the point locations may be corrected according to different geometric features of different measured products and differences of the geometric features of the measured products in multiple axial directions of the measuring machine. Further, although the above embodiments have been exemplified by a probe type film thickness measuring machine, it should be understood that the point position automatic correction method of the present invention can be applied to any measuring apparatus.
Fig. 7 is a block diagram illustrating an apparatus for automatically correcting a position of a surveying instrument according to an embodiment of the present invention. As shown in fig. 7, the apparatus for automatically correcting a point location of a measuring machine according to an embodiment of the present invention includes a point location information obtaining module 701, configured to obtain latest point location information when the measuring machine 704 measures a product; a determining module 702, configured to determine whether the point location difference satisfies a correction condition; and a correction module 703 for correcting the point location information when the point location difference satisfies the correction condition, and notifying the product to exit the measuring machine when the point location difference does not satisfy the correction condition.
In summary, the present invention provides a method and an apparatus for automatically correcting a point location of a measuring machine, which can automatically correct a point location without using other references during a product measuring process, and does not need to stop a machine because the point location correction is completed during the product measuring process, thereby improving productivity. In addition, the operator does not need to spend time to confirm the deviation of the point positions, and the labor cost is saved. In addition, the point position is automatically corrected, so that the link of manual operation is omitted, and the error of an operator is avoided.
Although the embodiments of the present invention have been described above, the above description is only for the convenience of understanding the present invention, and is not intended to limit the present invention. There are various other embodiments of the method of the present invention. Various corresponding changes or modifications may be made by those skilled in the art without departing from the spirit of the invention, and these corresponding changes or modifications are intended to fall within the scope of the appended claims.

Claims (2)

1. An automatic correction method for point positions of a measuring machine is characterized by comprising the following steps:
making the product to be measured enter a measuring machine table;
calling a product parameter file to measure a product;
completing product measurement to obtain latest point location information, wherein the latest point location information comprises point location information of geometric characteristics of a product, and the geometric characteristics of the product comprise two edges of the product in one axial direction of the measuring machine;
judging whether the point position difference meets a correction condition; wherein judging whether the point location difference satisfies the correction condition includes: judging whether the difference of the point location information of the geometric features of the product is greater than a threshold value or not; judging whether the difference of the point location information of the geometric characteristics of the product meets the correction condition comprises the following steps: judging whether the difference between the current point location information and the previous point location information of at least one of the two edges is greater than a threshold value; and
if the point location difference meets the correction condition, backing up the parameter file and correcting the point location information; if the point position difference does not meet the correction condition, the product exits the measuring machine.
2. The utility model provides a machine point location automatic correction device measurers which characterized in that includes:
the point location information acquisition module is specifically used for acquiring point location information of geometric characteristics of a product when the product is measured by the measuring machine, wherein the geometric characteristics of the product comprise two edges of the product in one axial direction of the measuring machine;
the judging module is used for judging whether the point location difference meets a correction condition, and specifically, the judging module is used for judging whether the difference of the point location information of the geometric features of the product is greater than a threshold value; the determination module is specifically configured to: judging whether the difference between the current point location information and the previous point location information of at least one of the two edges is greater than a threshold value; and
and the correction module is used for correcting the point location information when the point location difference meets the correction condition, and informing the product to exit the measuring machine table when the point location difference does not meet the correction condition.
CN201710797166.4A 2017-09-06 2017-09-06 Automatic point position correction method and device for measuring machine Active CN107621245B (en)

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CN109751961A (en) * 2019-01-07 2019-05-14 成都中电熊猫显示科技有限公司 A kind of the point automatic adjusting method and thicknesses of layers measuring device of film thickness measuring instrument
CN109903708B (en) * 2019-03-21 2022-04-26 Tcl华星光电技术有限公司 Measurement system and measurement parameter setting method thereof

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Address after: 9-2 Tangming Avenue, Guangming New District, Shenzhen City, Guangdong Province

Patentee after: TCL China Star Optoelectronics Technology Co.,Ltd.

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