CN107627033A - A kind of Laser cutting equipment for light-guiding pillar - Google Patents
A kind of Laser cutting equipment for light-guiding pillar Download PDFInfo
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- CN107627033A CN107627033A CN201711051488.0A CN201711051488A CN107627033A CN 107627033 A CN107627033 A CN 107627033A CN 201711051488 A CN201711051488 A CN 201711051488A CN 107627033 A CN107627033 A CN 107627033A
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- light
- guiding pillar
- laser
- speculum
- laser cutting
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- 238000003698 laser cutting Methods 0.000 title claims abstract description 52
- 238000005520 cutting process Methods 0.000 claims abstract description 48
- 230000007246 mechanism Effects 0.000 claims abstract description 26
- 230000003028 elevating effect Effects 0.000 claims description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- 238000007493 shaping process Methods 0.000 claims description 6
- 238000002347 injection Methods 0.000 claims description 5
- 239000007924 injection Substances 0.000 claims description 5
- 230000003647 oxidation Effects 0.000 claims description 4
- 238000007254 oxidation reaction Methods 0.000 claims description 4
- 230000011514 reflex Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 4
- 238000005498 polishing Methods 0.000 abstract description 3
- 230000007306 turnover Effects 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000001965 increasing effect Effects 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 210000004709 eyebrow Anatomy 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Laser Beam Processing (AREA)
Abstract
The present invention relates to a kind of Laser cutting equipment for light-guiding pillar.A kind of Laser cutting equipment for light-guiding pillar, including Laser platform and cutting working platform；Laser platform is provided with laser, movable mechanism, moves forward and backward frame, left/right movement device, moves left and right frame, Diode laser cutting head, the first speculum, the second speculum；Laser is corresponding with the first speculum, and the first speculum is corresponding with the second speculum, and the second speculum is corresponding with Diode laser cutting head；Cutting working platform is provided with a row or multi-row light-guiding pillar flattening mechanism.A kind of Laser cutting equipment for light-guiding pillar of the present invention, cuts instead of saw blade；Light-guiding pillar cutting end face is smooth, good without polishing, translucent effect；Meet the uniformity of total travel cutting；Light-guiding pillar flattening device ensures the uniformity of Product processing；Manufacturing procedure is effectively reduced, is saved labour turnover, increases processing efficiency, scrap discharge is reduced, improves production safety.
Description
Technical field
The present invention relates to light-guiding pillar to cut field, more particularly to a kind of Laser cutting equipment for light-guiding pillar.
Background technology
Social automobile is to the appearance requirement more and more higher of automobile now, wherein acrylic LED light-guiding pillars be usually used in decorating in
The automotive luminaire such as lamp eyebrow, driving lamp, atmosphere lamp position, its dosage is big, and coverage is wide.Existing frequently-used processing cutting technique is adopted
Cut with saw blade, cause section coarse, translucency is poor, it is impossible to be directly used in leaded light, subsequently also need to polish and polish increasing
Add translucency, product integral manufacturing flow is cumbersome, wastes time and energy, and production environment can also produce a large amount of inflammable and explosive scrap.
The content of the invention
In order to solve the above technical problems, the invention provides a kind of Laser cutting equipment for light-guiding pillar, instead of
Saw blade is cut, and cutting end face is smooth, and without being processed by shot blasting again, translucent effect is good, and total travel cutting is consistent, improves processing
Efficiency.
The technical solution adopted for the present invention to solve the technical problems is：A kind of Laser cutting for light-guiding pillar is set
Standby, it includes the cutting working platform on the left of Laser platform and Laser platform；The position that the front end of the Laser platform is kept right
Install and be equipped with laser；The keep left position at end of the Laser platform is provided with movable mechanism；The movable slide rail
On be provided with movable frame；The movable flat upper right is provided with left/right movement device；Set on the left/right movement device
It is equipped with and moves left and right frame；The left end for moving left and right frame is provided with Diode laser cutting head；The movable flat upper right is located at
The first fixed mount is provided with rear side of left/right movement device, the right-hand member of the first fixed mount is fixed with the first speculum；The left and right
The left end rearward position of movable stand is provided with the second fixed mount, and the rear end of the second fixed mount is fixed with the second speculum；It is described
The beam shaping mirror of laser is corresponding with the first speculum, and the first speculum is corresponding with the second speculum, the second speculum and length
Depth of focus cutting head is corresponding；A row or multi-row light-guiding pillar flattening mechanism is provided with the cutting working platform；Multiple light-guiding pillars are whole
Flattening mechanism clamps light-guiding pillar jointly；The light-guiding pillar is located at the lower section of Diode laser cutting head.
Auxiliary gas injection apparatus is additionally provided with the Diode laser cutting head, for preventing light-guiding pillar oxidation from burning generation
Bubble.
The cutting working platform is double change-table, and it includes first level mobile work platform and the second lift is horizontal
Mobile work platform；Multiple lead is respectively arranged with the first level mobile work platform and the flat mobile work platform of the second elevating water
Light beam flattening mechanism；During processing, the right-hand member that first level mobile work platform moves to cutting working platform is extremely located at Diode laser cutting head
Lower section, during swap status, first level mobile work platform moves to the left end of cutting working platform；The translation of second elevating water is started building
Make platform and first move to the right-hand member of cutting working platform extremely positioned at the lower section of Diode laser cutting head, then rise to and former first level mobile working
The fair position of platform；When exchanging again, the flat mobile work platform of the second elevating water is first down to elemental height, then level moves to cutting
The left end of workbench, first level mobile work platform move to the right-hand member of cutting working platform to the lower section for being located at Diode laser cutting head,
For realizing continual continuous cutting.
The laser is CO lasers.
The light beam of the laser reflexes to Diode laser again after reflexing to the second speculum by the first speculum after projecting
Cutting head, flight light path is formed, for ensureing the processing uniformity during movement of Diode laser cutting head.
Holding tank is provided with the light-guiding pillar flattening mechanism, the holding tank of the light-guiding pillar flattening mechanism of a row is arranged to phase
Same size；The holding tank of the light-guiding pillar flattening mechanisms of difference row is different sizes or identical size, row's light-guiding pillar flattening mechanism
Corresponding holding tank clamp same light-guiding pillar and flatten.
Beneficial effects of the present invention：A kind of Laser cutting equipment for light-guiding pillar of the present invention, using using CO2
Laser cutting, cuts instead of saw blade；Cutting end face is smooth, and translucent effect is good；Diode laser cutting head cutting end face plane degree is good, nothing
Need polishing；Flight light path, beam shaping mirror, meet the uniformity that total travel is cut；Double change-table improves processing
Efficiency；Light-guiding pillar flattening device ensure that the uniformity of Product processing；Manufacturing procedure is effectively reduced, is saved labour turnover, is increased
Processing efficiency, scrap discharge is reduced, improves production safety.
Brief description of the drawings
Fig. 1 is a kind of schematic diagram of Laser cutting equipment for light-guiding pillar of embodiment；
Fig. 2 is a kind of schematic diagram of the Laser platform of Laser cutting equipment for light-guiding pillar of embodiment；
Fig. 3 is a kind of schematic diagram of the cutting working platform of Laser cutting equipment for light-guiding pillar of embodiment；
Fig. 4 is a kind of part amplification of the cutting working platform of Laser cutting equipment for light-guiding pillar of embodiment
Schematic diagram；
Fig. 5 is a kind of signal of the light-guiding pillar flattening mechanism of Laser cutting equipment for light-guiding pillar of embodiment
Figure.
Embodiment
In order to deepen the understanding of the present invention, the present invention is done below in conjunction with drawings and examples and further retouched in detail
State, the embodiment is only used for explaining the present invention, and protection scope of the present invention is not formed and limited.
Embodiment
As shown in Figures 1 to 5, a kind of Laser cutting equipment for light-guiding pillar is present embodiments provided, it includes
Laser platform 1 and the cutting working platform 2 in the left side of Laser platform 1；The position that the front end of the Laser platform 1 is kept right is set
There is laser 3；The keep left position at end of the Laser platform 1 is provided with movable mechanism 7；On the movable slide rail 7
It is provided with movable frame 6；Left/right movement device 5 is provided with the movable flat right side 6；On the left/right movement device 5
It is provided with and moves left and right frame 14；The left end for moving left and right frame 14 is provided with Diode laser cutting head 4；The movable flat right side
Rear side on 6 positioned at left/right movement device 5 is provided with the first fixed mount 16, and the right-hand member of the first fixed mount 16 is fixed with the first reflection
Mirror 8；The left end rearward position for moving left and right frame 14 is provided with the second fixed mount 15, and the rear end of the second fixed mount 15 is fixed
There is the second speculum 9；The beam shaping mirror of the laser 3 is corresponding with the first speculum 8, the first speculum 8 and the second reflection
The correspondence of mirror 9, the second speculum 9 are corresponding with Diode laser cutting head 4；Multiple light-guiding pillar levelings are provided with the cutting working platform 2
Mechanism 17；Multiple light-guiding pillar flattening mechanisms 17 clamp light-guiding pillar 11 jointly；The light-guiding pillar is located under Diode laser cutting head 4
Side；Auxiliary gas injection apparatus is additionally provided with the Diode laser cutting head 4, for preventing light-guiding pillar oxidation from burning generation gas
Bubble；The cutting working platform 2 is double change-table, and it includes the translation of the elevating water of first level mobile work platform 11 and second
Dynamic workbench 12；It is respectively arranged with the flat mobile work platform 12 of the elevating water of first level mobile work platform 11 and second more
Individual light-guiding pillar flattening mechanism 17；During processing, the right-hand member that first level mobile work platform 11 moves to cutting working platform 2 is extremely located at focal length
The lower section of deep cutting head 4, during swap status, first level mobile work platform 11 moves to the left end of cutting working platform 2；Second lifting
Formula moves horizontally workbench 12 and first moves to the right-hand member of cutting working platform 2 to being located at the lower section of Diode laser cutting head 4, then rise to it is former
The fair position of first level mobile work platform 11；When exchanging again, the flat mobile work platform 12 of the second elevating water is first down to just
Begin height, then the horizontal left end for moving to cutting working platform 2, first level mobile work platform 11 move to the right-hand member of cutting working platform 2
To the lower section for being located at Diode laser cutting head 4, for realizing continual continuous cutting；The laser 3 is CO2 lasers；Institute
State laser 3 light beam project after the second speculum 9 is reflexed to by the first speculum 8 after reflex to Diode laser cutting head 4 again,
Flight light path is formed, for ensureing the processing uniformity during movement of Diode laser cutting head 4；Set on the light-guiding pillar flattening mechanism 17
Holding tank is equipped with, the holding tank of the light-guiding pillar flattening mechanism 17 of a row is arranged to identical size；The light-guiding pillar evener of difference row
The holding tank of structure 17 is different sizes or identical size, and the corresponding holding tank clamping of row's light-guiding pillar flattening mechanism 17 is same to be led
Light beam 18 simultaneously flattens.
A kind of Laser cutting equipment for light-guiding pillar of the present embodiment, laser use CO2 lasers, laser energy
Amount is converged on light-guiding pillar and can absorbed well by material, and light-guiding pillar is heated to be melted, and high-pressure inert gas separate melted material,
Laser is formed from fluid in material surface after removing and solidified, and forms good flatness and translucency；Flight light path, beam shaping
Mirror, make spot size and the angles of divergence such as laser formation, realize the processing uniformity in stroke range；Diode laser cutting head ensures big
Caliber cuts the perpendicularity of end face；Double crossing over processing platform realizes continual continuous cutting；Light-guiding pillar apparatus for leveling keeps leading
The cutting uniformity of light beam；Control system is by parameters such as software design patterns Cutting Length and cutting powers, carrying out to whole
The processing of light-guiding pillar, auxiliary gas injection apparatus injection inert gas prevent material oxidation from burning generation bubble.
A kind of Laser cutting equipment for light-guiding pillar of the present embodiment, it is cut by laser using using CO2, instead of saw
Piece is cut；Cutting end face is smooth, and translucent effect is good；Diode laser cutting head cutting end face plane degree is good, without polishing；Flight
Light path, beam shaping mirror, meet the uniformity that total travel is cut；Double change-table improves processing efficiency；Light-guiding pillar is smooth
Device ensure that the uniformity of Product processing；Manufacturing procedure is effectively reduced, is saved labour turnover, increases processing efficiency, is reduced useless
Bits discharge, improves production safety.
Above-described embodiment should not in any way limit the present invention, all to be obtained by the way of equivalent substitution or equivalency transform
Technical scheme all fall within protection scope of the present invention.
Claims (6)
- A kind of 1. Laser cutting equipment for light-guiding pillar, it is characterised in that：It includes Laser platform and laser is put down Cutting working platform on the left of platform；The position that the front end of the Laser platform is kept right is provided with laser；The Laser platform The keep left position at end is provided with movable mechanism；Movable frame is provided with the movable slide rail；The front and rear shifting Move flat upper right and be provided with left/right movement device；It is provided with the left/right movement device and moves left and right frame；It is described to move left and right frame Left end be provided with Diode laser cutting head；It is described move forward and backward flat upper right be located on rear side of left/right movement device be provided with first consolidate Determine frame, the right-hand member of the first fixed mount is fixed with the first speculum；The left end rearward position for moving left and right frame is provided with Two fixed mounts, the rear end of the second fixed mount are fixed with the second speculum；The beam shaping mirror and the first speculum of the laser Corresponding, the first speculum is corresponding with the second speculum, and the second speculum is corresponding with Diode laser cutting head；On the cutting working platform It is provided with a row or multi-row light-guiding pillar flattening mechanism；Multiple light-guiding pillar flattening mechanisms clamp light-guiding pillar jointly；The light-guiding pillar Positioned at the lower section of Diode laser cutting head.
- A kind of 2. Laser cutting equipment for light-guiding pillar according to claim 1, it is characterised in that：The focal length Auxiliary gas injection apparatus is additionally provided with deep cutting head, for preventing light-guiding pillar oxidation from burning generation bubble.
- A kind of 3. Laser cutting equipment for light-guiding pillar according to claim 1, it is characterised in that：The cutting Workbench is double change-table, and it includes first level mobile work platform and the flat mobile work platform of the second elevating water；It is described Multiple light-guiding pillar flattening mechanisms are respectively arranged with first level mobile work platform and the flat mobile work platform of the second elevating water；Add Man-hour, first level mobile work platform move to the right-hand member of cutting working platform to positioned at the lower section of Diode laser cutting head, swap status When, first level mobile work platform moves to the left end of cutting working platform；The flat mobile work platform of second elevating water first moves to cutting The right-hand member of workbench is extremely located at the lower section of Diode laser cutting head, then rises to the position to maintain an equal level with former first level mobile work platform； When exchanging again, the flat mobile work platform of the second elevating water is first down to elemental height, then the horizontal left end for moving to cutting working platform, First level mobile work platform moves to the right-hand member of cutting working platform to the lower section for being located at Diode laser cutting head, uninterrupted for realizing Continuous cutting.
- A kind of 4. Laser cutting equipment for light-guiding pillar according to claim 1, it is characterised in that：The laser Device is CO lasers.
- A kind of 5. Laser cutting equipment for light-guiding pillar according to claim 1, it is characterised in that：The laser The light beam of device is reflexed to by the first speculum after projecting and reflexes to Diode laser cutting head after the second speculum again, forms flight light Road, for ensureing the processing uniformity during movement of Diode laser cutting head.
- A kind of 6. Laser cutting equipment for light-guiding pillar according to claim 1, it is characterised in that：The leaded light Holding tank is provided with post flattening mechanism, the holding tank of the light-guiding pillar flattening mechanism of a row is arranged to identical size；Difference row's The holding tank of light-guiding pillar flattening mechanism is different sizes or identical size, and the corresponding holding tank of row's light-guiding pillar flattening mechanism presss from both sides Hold same light-guiding pillar and flatten.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711051488.0A CN107627033A (en) | 2017-10-31 | 2017-10-31 | A kind of Laser cutting equipment for light-guiding pillar |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711051488.0A CN107627033A (en) | 2017-10-31 | 2017-10-31 | A kind of Laser cutting equipment for light-guiding pillar |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107627033A true CN107627033A (en) | 2018-01-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711051488.0A Pending CN107627033A (en) | 2017-10-31 | 2017-10-31 | A kind of Laser cutting equipment for light-guiding pillar |
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| Country | Link |
|---|---|
| CN (1) | CN107627033A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112496575A (en) * | 2021-02-04 | 2021-03-16 | 四川恒格光电科技有限公司 | Light guide column laser cutting device |
| CN112935526A (en) * | 2021-01-27 | 2021-06-11 | 四川恒格光电科技有限公司 | Light guide column curved surface machining device |
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|---|---|---|---|---|
| CN101537535A (en) * | 2009-04-17 | 2009-09-23 | 武汉法利莱切割系统工程有限责任公司 | Aplanatic light path control device of laser cutter |
| WO2009142607A1 (en) * | 2008-05-23 | 2009-11-26 | Durmazlar Makina Sanayi Ve Ticaret Anonim Sirketi | A laser cutting machine with moving mirror mechanism |
| CN203282048U (en) * | 2013-05-06 | 2013-11-13 | 蓝思科技（长沙）有限公司 | Cutting machine for laser cutting of PET thin film |
| CN106141455A (en) * | 2016-09-19 | 2016-11-23 | 东莞市力星激光科技有限公司 | A kind of high-speed, high precision laser cutting machine |
| CN107160034A (en) * | 2017-07-03 | 2017-09-15 | 大族激光科技产业集团股份有限公司 | A kind of dual stage face laser cutting machine and its cutting method |
| CN207642500U (en) * | 2017-10-31 | 2018-07-24 | 苏州天弘激光股份有限公司 | A kind of laser cutting process equipment for light-guiding pillar |
-
2017
- 2017-10-31 CN CN201711051488.0A patent/CN107627033A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009142607A1 (en) * | 2008-05-23 | 2009-11-26 | Durmazlar Makina Sanayi Ve Ticaret Anonim Sirketi | A laser cutting machine with moving mirror mechanism |
| CN101537535A (en) * | 2009-04-17 | 2009-09-23 | 武汉法利莱切割系统工程有限责任公司 | Aplanatic light path control device of laser cutter |
| CN203282048U (en) * | 2013-05-06 | 2013-11-13 | 蓝思科技（长沙）有限公司 | Cutting machine for laser cutting of PET thin film |
| CN106141455A (en) * | 2016-09-19 | 2016-11-23 | 东莞市力星激光科技有限公司 | A kind of high-speed, high precision laser cutting machine |
| CN107160034A (en) * | 2017-07-03 | 2017-09-15 | 大族激光科技产业集团股份有限公司 | A kind of dual stage face laser cutting machine and its cutting method |
| CN207642500U (en) * | 2017-10-31 | 2018-07-24 | 苏州天弘激光股份有限公司 | A kind of laser cutting process equipment for light-guiding pillar |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112935526A (en) * | 2021-01-27 | 2021-06-11 | 四川恒格光电科技有限公司 | Light guide column curved surface machining device |
| CN112496575A (en) * | 2021-02-04 | 2021-03-16 | 四川恒格光电科技有限公司 | Light guide column laser cutting device |
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