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CN107546229A - Semiconductor device and its manufacture method - Google Patents

Semiconductor device and its manufacture method Download PDF

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Publication number
CN107546229A
CN107546229A CN201611129796.6A CN201611129796A CN107546229A CN 107546229 A CN107546229 A CN 107546229A CN 201611129796 A CN201611129796 A CN 201611129796A CN 107546229 A CN107546229 A CN 107546229A
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CN
China
Prior art keywords
pad
line
drain selection
hierarchic
selection line
Prior art date
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Granted
Application number
CN201611129796.6A
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Chinese (zh)
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CN107546229B (en
Inventor
李南宰
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SK Hynix Inc
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Hynix Semiconductor Inc
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Filing date
Publication date
Application filed by Hynix Semiconductor Inc filed Critical Hynix Semiconductor Inc
Priority to CN202010623869.7A priority Critical patent/CN111952310A/en
Publication of CN107546229A publication Critical patent/CN107546229A/en
Application granted granted Critical
Publication of CN107546229B publication Critical patent/CN107546229B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B43/00—EEPROM devices comprising charge-trapping gate insulators
    • H10B43/20—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels
    • H10B43/23—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels
    • H10B43/27—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
    • H10B41/35—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region with a cell select transistor, e.g. NAND
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H10B41/40—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the peripheral circuit region
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76829—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing characterised by the formation of thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers
    • H01L21/76832—Multiple layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H01L21/76843—Barrier, adhesion or liner layers formed in openings in a dielectric
    • H01L21/76846—Layer combinations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
    • H01L21/76879—Filling of holes, grooves or trenches, e.g. vias, with conductive material by selective deposition of conductive material in the vias, e.g. selective C.V.D. on semiconductor material, plating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76895—Local interconnects; Local pads, as exemplified by patent document EP0896365
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Geometry or layout of the interconnection structure
    • H01L23/5283—Cross-sectional geometry
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H10B41/20—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional arrangements, e.g. with cells on different height levels
    • H10B41/23—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels
    • H10B41/27—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B43/00—EEPROM devices comprising charge-trapping gate insulators
    • H10B43/30—EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region
    • H10B43/35—EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region with cell select transistors, e.g. NAND
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B43/00—EEPROM devices comprising charge-trapping gate insulators
    • H10B43/40—EEPROM devices comprising charge-trapping gate insulators characterised by the peripheral circuit region
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B43/00—EEPROM devices comprising charge-trapping gate insulators
    • H10B43/50—EEPROM devices comprising charge-trapping gate insulators characterised by the boundary region between the core and peripheral circuit regions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H10B41/50—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the boundary region between the core region and the peripheral circuit region

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Semiconductor Memories (AREA)
  • Non-Volatile Memory (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)

Abstract

The present invention provides a kind of semiconductor device, and it may include first module structure, second unit structure, pad structure, circuit and one or more openings.Pad structure may be provided between first module structure and second unit structure, and may be electrically coupled to first module structure and second unit structure.Pad structure can have multiple hierarchic structures.Circuit may be provided at below pad structure.One or more opening may pass through pad structure and can exposed circuits.One or more opening may be provided between multiple hierarchic structures.

Description

Semiconductor device and its manufacture method
The cross reference of related application
This application claims the Application No. 10-2016- submitted on June 27th, 2016 to Korean Intellectual Property Office The priority of 0080257 korean patent application, the complete disclosure of this application are incorporated by reference into the application.
Technical field
The various embodiments of the disclosure relate in general to a kind of electronic installation and its manufacture method, and more specifically it relates to one Kind three-dimensional semiconductor memory devices and its manufacture method.
Background technology
No matter whether non-volatile memory device is connected to power supply, non-volatile memory device can retain storage Data.As two-dimentional non-volatile memory device technology reaches its physical zoom limit, some semiconductor makers pass through Memory cell is overlie one another to produce three-dimensional (3D) non-volatile memory device on substrate.
Three-dimensional storage device may include the gate electrode being alternately stacked with interlayer insulating film, and may also include through grid electricity Pole and the channel layer of interlayer insulating film.In this way, memory cell can be vertically arranged along channel layer.In order to improve this tool There is the reliability of the non-volatile memory device of three-dimensional structure, developing various structures and manufacture method.
The content of the invention
In embodiment of the disclosure, semiconductor device may include circuit, pad structure, the first opening, the second opening, the One interconnection structure and the second interconnection structure.Pad structure may be provided above circuit, and may include comprising first to overlie one another First hierarchic structure of pad, the second hierarchic structure comprising the second pad to overlie one another and comprising the 3rd to overlie one another 3rd hierarchic structure of pad.First opening may be provided between the first hierarchic structure and the second hierarchic structure, and may pass through weldering Dish structure and exposed circuits.Second opening may be provided between the second hierarchic structure and the 3rd hierarchic structure, and may pass through pad Structure and exposed circuits.First interconnection structure can electrically connect the first pad and the 3rd pad each other, and by first opening or First pad and the 3rd pad are commonly coupled to circuit by the second opening.Second interconnection structure can be by the second pad Electricity Federation each other Connect, and the second pad is connected to by circuit by the first opening or the second opening.
In embodiment of the disclosure, semiconductor device may include first module structure, second unit structure, pad knot Structure, circuit and one or more openings.Pad structure may be provided between first module structure and second unit structure, and can electricity It is connected to first module structure and second unit structure.Pad structure can have multiple hierarchic structures.Circuit may be provided at pad Below structure.One or more opening may pass through pad structure and exposed circuits.One or more opening may be provided at multiple ranks Between terraced structure.
In embodiment of the disclosure, a kind of manufacture method of semiconductor device may include the shape on the welding disking area of substrate Into circuit, wherein substrate includes first module region, welding disking area and the second unit region being sequentially arranged in a first direction. This method may include to be formed on to form stacked structure above the substrate of circuit, the stacked structure include overlieing one another the One group to n-th (n is greater than or equal to 3 natural number) group.This method may include the pad area of part pattern stacked structure Domain, and form the first module structure being arranged in first module region, the second unit being arranged in second unit region Structure and the pad structure being arranged in welding disking area.Pad structure may include multiple hierarchic structures, and may be electrically coupled to One cellular construction and second unit structure.This method may include that the one or more to be formed through pad structure and exposed circuits is opened Mouthful.One or more opening may be provided between multiple hierarchic structures.
Brief description of the drawings
Figure 1A to Fig. 1 D is the figure for the exemplary construction for showing semiconductor device in accordance with an embodiment of the present disclosure.
Fig. 2A and Fig. 2 B are the layouts for the exemplary construction that semiconductor device in accordance with an embodiment of the present disclosure is shown respectively And cross-sectional view.
Fig. 3 A to Fig. 3 C are the layouts for the exemplary construction for showing semiconductor device in accordance with an embodiment of the present disclosure.
Fig. 4 A to Fig. 8 A, Fig. 4 B to Fig. 8 B and Fig. 9 are that semiconductor device in accordance with an embodiment of the present disclosure is shown respectively The layout and cross-sectional view of manufacture method.
Figure 10 and Figure 11 is the figure for the example arrangement for showing accumulator system in accordance with an embodiment of the present disclosure.
Figure 12 and Figure 13 is the figure for the example for showing computing system in accordance with an embodiment of the present disclosure.
Embodiment
Example embodiment is described more fully hereinafter with now with reference to accompanying drawing；However, they can be real in different forms Apply, and should not be construed as limited to embodiments described herein.On the contrary, these embodiments are provided so that the disclosure will be It is comprehensively and complete, and the scope for example embodiment fully being passed on to those skilled in the art.
In the accompanying drawings, for clear explanation, size can be exaggerated.It will be appreciated that when element is referred to as in two elements " between " when, it can be the sole component between two elements, or one or more elements between also may be present.Phase Same reference represents identical element all the time.
Hereinafter, embodiment is more fully described with reference to the accompanying drawings.Embodiment is described herein by reference to cross-sectional view, wherein Cross-sectional view is the schematic diagram of embodiment (and intermediate structure).Accordingly, because such as manufacturing technology and/or tolerance, it is illustrated that shape Change will be expected.Therefore, embodiment should not be construed as limited to the given shape of regions illustrated herein, but can wrap Include the form variations for example as caused by manufacture.In the accompanying drawings, for clarity, the length and size in layer and region can be exaggerated.Accompanying drawing Middle identical reference marker represents identical element.
Such as term of " first " and " second " can be used for describing various parts, but they should not limit various portions Part.These terms are only used for distinguishing the purpose of a part and other parts.For example, spirit and scope of the present disclosure are not being departed from In the case of, first component is referred to alternatively as second component, and second component is referred to alternatively as first component, etc..In addition, "and/or" It may include any one in the part that is previously mentioned or combination.
As long as in addition, not having specifically mentioned in sentence, singulative may include plural form.In addition, make in this manual "comprises/comprising" or " include/include " represent there is or with the addition of one or more parts, step, operation and member Part.
In addition, unless otherwise defined, what is otherwise used in this manual includes all terms of technology and scientific terminology With the implication identical implication being generally understood that with those skilled in the relevant art.In the term defined in usually used dictionary The implication identical implication that should be interpreted as having and be explained under the background of association area, and unless in this specification In separately explicitly define, otherwise should not be interpreted as having idealization or excessively formal implication.
It should also be noted that in this manual, " connection/connection " refers not only to a part and directly couples another portion Part, and refer to and couple another part indirectly by intermediate member.On the other hand, " it is directly connected to/directly connection " and refers to one Individual part directly couples another part without intermediate member.
Hereinafter, each exemplary embodiment is described in detail with reference to the accompanying drawings.In the accompanying drawings, for purposes of illustration only, can Exaggerate the thickness and length of part.In the following description, it is simple and clear, correlation function and construction can be omitted specifically It is bright.In entire disclosure and accompanying drawing, identical reference marker refers to identical element.
Figure 1A to Fig. 1 D is the figure for the exemplary construction for showing semiconductor device in accordance with an embodiment of the present disclosure.Figure 1A and figure 1B is layout, and Fig. 1 C are along the cross-sectional view of Figure 1B line A-A' interceptions, and Fig. 1 D are along the transversal of Figure 1B line B-B' interceptions Face figure.
Reference picture 1A and Figure 1B, substrate, cellular construction CS1 and CS2, pad may include according to the semiconductor device of embodiment Structure PS and circuit.Substrate may include unit area CR1 and CR2 and welding disking area PR.For example, unit area CR1 and CR2 can Including first module region CR1 and second unit region CR2, and welding disking area PR can be located at first module region CR1 and the Between two unit area CR2.Therefore, first module structure C S1 and second unit structure C S2 is included in cellular construction CS1 and CS2 In the case of, first module structure C S1, pad structure PS and second unit structure can be sequentially arranged on I-I' in a first direction CS2.In addition, semiconductor device, which can be based on memory block, performs erasing operation.Each it may include first module area in memory block MB Domain CR1, second unit region CR2 and the welding disking area between first module region CR1 and second unit region CR2 PR.First module region CR1 and second unit region CR2 can share pad structure PS.
First module structure C S1 and second unit structure C S2 can be located at the first module region CR1 and second of substrate respectively In the CR2 of unit area.Cellular construction CS1 and CS2 may include the conductive layer and insulating layer of stacking alternating with each other.In other words, each Cellular construction CS1 and CS2 can have a series of conductive layers being staggeredly stacked with insulating barrier.In addition, cellular construction CS1 and CS2 can Including the channel layer CH by conductive layer and insulating layer.One or more conductive layers of bottom can be used as drain selection line.Most One or more conductive layers of top can be used as the selection line that drains.Other conductive layers can be used as wordline.Herein, it is coupled to one another in series One or more drain selection transistors, multiple memory cells and one or more drain electrode selection transistor can be formed it is single Memory string.Memory string can be set in vertical direction.
First module structure C S1 may include one or more first drain selection lines, multiple first wordline and one or Multiple first drain electrode selection lines.For example, multiple first wordline to overlie one another may be provided at one or more first drain selections On line, and the drain electrode of one or more first selection line may be provided in the first wordline of the top.Second unit structure C S2 can The second drain selection of one or more line, multiple second wordline and one or more second including overlieing one another successively drain Selection line.For example, multiple second wordline to overlie one another may be provided on one or more second drain selection lines, and one Or multiple second drain electrode selection lines may be provided in the second wordline of the top.In addition, first module structure C S1 may include first Vertical memory string, second unit structure C S2 may include the second vertical memory string.
Pad structure PS can be located in the welding disking area PR of substrate.For example, pad structure PS can be located at first module structure Between CS1 and second unit structure C S2.Pad structure PS can directly connect with first module structure C S1 and second unit structure C S2 Touch, and may be electrically coupled to first module structure C S1 and second unit structure C S2.In addition, circuit can be located under pad structure PS Side, and at least a portion of at least one opening OP exposed circuits through pad structure PS can be passed through.Opening OP can be filled with Insulating pattern IP.Embarked on journey in addition, multiple opening OP can arrange along center line CL, central parts of the center line CL in welding disking area PR I-I' extends along a first direction on point.Be open OP can be located at welding disking area PR core, and the quantity for the OP that is open and Its shape can be changed in a variety of ways.
Pad structure PS may include the conductive layer and insulating layer of stacking alternating with each other.For example, pad structure PS may include with A series of conductive layers that insulating barrier is staggeredly stacked.In pad structure PS conductive layer and first module structure C S1 and second unit Among structure C S2 conductive layer, the conductive layer being arranged in same level can electrically connect each other.In addition, part pattern Pad structure PS is to make it have the hierarchic structure of various height.In this way, pad P1 can be formed to P4, wherein passing through pad P1 to P4 can individually be biased the conductive layer stacked accordingly.In addition, non-patterned pad structure PS conductive layer can Wire (for example, interconnection) as the conductive layer that pad P1 to P4 is electrically coupled to cellular construction CS1 and CS2.
Pad structure PS may include the first hierarchic structure S1 and the second hierarchic structure S2.In embodiment, the first ladder knot Structure S1 and the second hierarchic structure S2 may be provided between each adjacent opening OP.First hierarchic structure S1 and the second hierarchic structure S2 can arrange along center line CL.For example, the first hierarchic structure S1 may be provided at center line CL side, the second hierarchic structure S2 can Centrally disposed line CL opposite side.In embodiment, the first hierarchic structure S1 and the second hierarchic structure S2 can be on centers Line CL is symmetrical.
First hierarchic structure S1 is arranged on I-I' in a first direction, and the first adjacent hierarchic structure S1 can be by corresponding Opening OP be isolated from each other.Second hierarchic structure S2 is arranged on I-I' in a first direction, and the second adjacent hierarchic structure S2 Also can be isolated from each other by the OP that is open accordingly.In addition, the first adjacent hierarchic structure S1 being arranged symmetrically on center line CL It can be isolated from each other with the second hierarchic structure S2 by the 3rd slit SL3A.
Pad structure PS may include the first cable architecture LS1 and the second cable architecture LS2.First cable architecture LS1 can be by the first weldering Disk P1 is electrically coupled to first module structure C S1 and second unit structure C S2.Second cable architecture LS2 can be by the second pad P2 Electricity Federations It is connected to first module structure C S1 and second unit structure C S2.First cable architecture LS1 may be provided at center line CL and the second slit Between SL2A.Second cable architecture LS2 may be provided between center line CL and the second slit SL2B.In the case, the first knot Structure LS1, the first hierarchic structure S1, the second hierarchic structure S2 and the second cable architecture LS2 can be sequentially arranged in second direction II-II' On.In addition, the first cable architecture LS1, opening OP and the second cable architecture LS2 can be sequentially arranged on second direction II-II'.
First cable architecture LS1 includes the First Line L1 to overlie one another.It is each by the first pad P1 Electricity Federations in First Line L1 It is connected to first module structure C S1 or second unit structure C S2.First pad P1 can be electrically coupled to by each in First Line L1 One cellular construction CS1 and second unit structure C S2.First cable architecture LS1 height is equal to or more than the first hierarchic structure S1's Highly.Second cable architecture LS2 includes the second line L2 to overlie one another.Second pad P2 is electrically coupled to by each in the second line L2 First module structure C S1 or second unit structure C S2.It is single that second pad P2 can be electrically coupled to first by each in the second line L2 Meta structure CS1 and second unit structure C S2.Second cable architecture LS2 height is equal to or more than the second hierarchic structure S2 height. First cable architecture LS1 may include to be arranged on the first virtual hierarchic structure DS1 on the First Line L1 of stacking.Second cable architecture LS2 may include to be arranged on the second virtual hierarchic structure DS2 on the second line L2 of stacking.
Pad structure PS may include with first module structure C S1 the 3rd hierarchic structure S3 contacted and with second unit structure The fourth order ladder structure S4 of CS2 contacts.3rd hierarchic structure S3 be arranged on first module structure C S1 and corresponding opening OP it Between, and the 3rd pad P3 including overlieing one another.Fourth order ladder structure S4 is arranged on second unit structure C S2 and corresponding opening Between OP, and the 4th pad P4 including overlieing one another.3rd pad P3 may be electrically coupled to first module structure C S1.For example, the Three pad P3 can directly contact with first module structure C S1.4th pad P4 may be electrically coupled to second unit structure C S2.For example, 4th pad P4 can directly contact with second unit structure C S2.
Semiconductor device may include in stacking direction (for example, first module structure C S1, pad structure PS and second unit The direction that structure C S2 each layer for including stacks) on through first module structure C S1, pad structure PS or second unit The first of structure C S2 is to the 5th slit SL1 to SL5.First to the 5th slit SL1 to SL5 can be separately filled with first to the 5th Slit insulating barrier.It is each with the depth for passing completely through corresponding stacked structure in first to the 5th slit SL1 to SL5.Can Selection of land, each depth with the corresponding stacked structure of partial penetration in the first to the 5th slit SL1 to SL5.
First slit SL1 can separate adjacent channel layer CH drain electrode selection line each other, and may be provided in memory block MB. Each in first slit SL1 can pass through second unit structure C S2 in the stacking direction, and can have through the second drain electrode selection The depth of line.First slit SL1 can extend with through fourth order ladder structure S4 on I-I' in a first direction.First slit SL1 can The 4th pad P4 for being attached to the second drain electrode selection line is set to be isolated from each other.Equally, it is single to be provided through first by the first slit SL1 Meta structure CS1 and the 3rd hierarchic structure S3.
Second slit SL2A and SL2B can electrically separated adjacent memory block MB, and may be provided between adjacent memory block MB Border on.In second slit SL2A and SL2B it is each have pass completely through first module structure C S1 in the stacking direction With second unit structure C S2 and pad structure PS depth.
3rd slit SL3A and SL3B is arranged in memory block MB, and each slit has and prolonged in a first direction on I-I' The wire shaped stretched.In 3rd slit SL3A and SL3B it is each have pass completely through first module structure in the stacking direction CS1 and second unit structure C S2 depth.3rd slit SL3A may extend into welding disking area PR, and overlapping with center line CL.The Three slit SL3A can cross multiple opening OP, and can be inserted between adjacent the first hierarchic structure S1 and the second hierarchic structure S2. Therefore, the first adjacent hierarchic structure S1 and the second hierarchic structure S2 can be isolated from each other by the 3rd slit SL3A.3rd slit SL3B may be provided between center line CL and the second slit SL2A and SL2B, and each 3rd slit SL3B can have through the One cellular construction CS1 and the 3rd hierarchic structure S3 or second unit structure C S2 and fourth order ladder structure S4 depth.
The wire that 4th slit SL4 and the 5th slit SL5 make to be arranged at phase same level is isolated from each other.4th slit SL4 It is may be provided at the 5th slit SL5 in pad structure PS.4th slit SL4 can extend on I-I' in a first direction, and can couple To the 3rd slit SL3B.5th slit SL5 can extend on second direction II-II', and can cross corresponding opening OP.5th Slit SL5 can be connected to the 4th slit SL4.Therefore, the 4th slit SL4 and the 5th slit SL5 can be coupled to each other with C-shaped.
It is each with the depth for extending only through the line for being connected to drain selection line in 4th slit SL4.5th slit SL5 In it is each have pass completely through pad structure PS depth.Be connected to the line of drain selection line by the second slit SL2A and SL2B, the 3rd slit SL3A, the 4th slit SL4 and the 5th slit SL5 are patterned.The line for being connected to wordline passes through the second slit SL2A and SL2B, the 3rd slit SL3A and the 5th slit SL5 are patterned.Therefore, drain selection line and wordline can pass through adjustment 4th slit SL4 depth is patterned in different shapes.
Reference picture 1C and Fig. 1 D, pad structure PS may be provided in the welding disking area PR of substrate 20, and circuit 21 may be provided at Below pad structure PS.Circuit 21 may include various parts, such as transistor, capacitor and resistor.In embodiment, electricity Road 21 can be X- decoders X-DEC.Pad structure PS may include the layer 1 to 16 stacked, and each layer in layer 1 to 16 can Including first layer A and second layer B.For example, first layer A can be conductive layer, second layer B can be insulating barrier.Alternatively, first Layer A can be insulating barrier, and second layer B can be conductive layer.
Each include the first pad P11 to P13 in first hierarchic structure S11 to S13.First pad P11 to P13 distinguishes First Line L11 is electrically coupled to L13.First pad P11 to P13 is electrically coupled to the first vertical storage by First Line L11 to L13 First drain selection line of device string and/or the second drain selection line of the second vertical memory string.
Each include the first pad P14 in first hierarchic structure S14.First pad P14 is electrically coupled to First Line respectively L14.First pad P14 is electrically coupled to the first wordline and the second vertical memory of the first vertical memory string by First Line L14 Second wordline of string.
The first hierarchic structure S11 to S14 and the second hierarchic structure S21 to S24 can be arranged symmetrically on center line CL.Can First Line L11 to L14 and the second line L21 to L24 are arranged symmetrically on center line CL.
3rd hierarchic structure S3 may include the 3rd weldering of the first drain electrode selection line for being electrically coupled to the first vertical memory string Disk P3.Fourth order ladder structure S4 may include the 4th pad of the second drain electrode selection line for being electrically coupled to the second vertical memory string P4.As reference, the 13rd layer 13 of the 3rd pad P3 may be electrically coupled to the first wordline of the first vertical memory string, and the 13rd 4th pad P4 of layer 13 may be electrically coupled to the second wordline of the second vertical memory string.
Herein, couple positioned opposites of the first module structure C S1 and second unit structure C S2 in pad structure PS.First is single Meta structure CS1 and second unit structure C S2 can share pad structure PS.Therefore, the side of unit area is provided only on circuit Situation compare, the distance between circuit 21 and cellular construction CS1 and CS2 can reduce half, thus can reduce RC retardation ratio.Cause This, can increase the program speed of semiconductor device.
In addition, circuit 21 and multiple opening OP may be provided at welding disking area PR core, and in multiple opening OP Between space in be distributed pad.Thus, welding disking area PR needs smaller area.In addition, because welded by part pattern Dish structure forms pad and non-patterned areas is used as wire (e.g., interconnection), so can simplify manufacturing process.
Fig. 2A and Fig. 2 B are the figures for the exemplary construction for showing semiconductor device in accordance with an embodiment of the present disclosure.Fig. 2A is mutual Link the layout of structure, Fig. 2 B are the cross-sectional views of the first hierarchic structure of the line interception of I-I' along a first direction.Fig. 2A and Same or analogous element in Fig. 2 B is marked with the reference symbol identical reference symbol in Figure 1A to Fig. 1 D, and will be saved Omit or simplify the detailed description of any repetition.
First hierarchic structure S11 the first pad P11 can be electrically coupled to by reference picture 2A and Fig. 2 B, the first interconnection structure C1 First hierarchic structure S13 the first pad P13.In addition, the first pad P11 and P13 can be connected to electricity by the first interconnection structure C1 Road 21.For example, the first interconnection structure C1 may include to be attached to respective first pad P11 the first contact plunger 31, be attached to Respective first pad P13 the second contact plunger 32, be arranged on corresponding to be coupled to the 3rd of circuit 21 and connect in opening OP Touch connector 33 and the wire that the first to the 3rd contact plunger 31 to 33 is electrically connected and extended in a first direction on I-I' each other 34。
Second interconnection structure C2 can electrically connect the first hierarchic structure S12 the first pad P12 each other, and can be by the first weldering Disk P12 is connected to circuit 21.For example, the second interconnection structure C2 may include the first contact for being connected to respective first pad P12 Connector 35, be arranged on corresponding to be connected in parallel to the second contact plunger 36 of circuit 21 and by the first contact plunger 35 in opening OP The wire 37 for electrically connecting with the second contact plunger 36 and extending in a first direction on I-I' each other.
Second hierarchic structure S21 the second pad P21 can be electrically coupled to the second hierarchic structure S23 by the 3rd interconnection structure C3 The second pad P23, and the first pad P21 and the second pad P23 are electrically coupled to circuit 21.4th interconnection structure C4 can be by Two hierarchic structure S22 the second pad P22 is connected to circuit.
5th interconnection structure C5 can be by the first hierarchic structure S14 adjacent to each other on second direction II-II' the first weldering Disk P14 and the second hierarchic structure S24 the second pad P24 is electrically connected each other.In the first pad P14 and the second pad P24, if Put the first pad P14 at phase same level and the second pad P24 is electrically connected each other.
3rd hierarchic structure S3 the 3rd pad P3 can be electrically coupled to fourth order ladder structure S4's by the 6th interconnection structure C6 4th pad P4.For example, the 6th interconnection structure C6 may include to be connected to respective 3rd pad P3 the 4th contact plunger 38, connection Be connected to respective 4th pad P4 the 5th contact plunger 39 and by the 4th contact plunger 38 and the 5th contact plunger 39 each other The wire 40 electrically connected.
As reference, selected according to the drain selection transistor included in single memory string, memory cell and drain electrode The respective quantity of transistor is selected, coupling method can be changed.In one example, the vertical memory shown in Fig. 2A and Fig. 2 B String includes three drain selection transistors, ten memory cells and three drain electrode selection transistors.Therefore, the first ladder knot Structure S11 the 4th layer 4 of the first pad P11 can be electrically coupled to the 4th of the second hierarchic structure S21 by the 5th interconnection structure C5 Second pad P21 of layer 4.In addition, the 13rd layer 13 of the 3rd hierarchic structure S3 adjacent to each other on second direction II-II' The 3rd pad P3 can be electrically connected each other by the 5th interconnection structure C5.Although Fig. 2A and Fig. 2 B are shown including three source electrodes The example of the vertical memory string of selection transistor, ten memory cells and three drain electrode selection transistors, but its only purport In the non-limiting present invention of explanation, and the coupling method of the quantity of stack layer or interconnection structure can change.
Fig. 3 A to Fig. 3 C are the layouts for the exemplary construction for showing semiconductor device in accordance with an embodiment of the present disclosure.Fig. 3 A It is to show to be connected to the wire of drain selection line and the layout of pad.Fig. 3 B are to show to be connected to the wire of wordline and pad Layout.Fig. 3 C are the layouts for showing to be connected to the pad of drain electrode selection line.
Reference picture 3A, first module structure C S1 include the first drain selection line SSL11 to SSL14, second unit structure CS2 includes the second drain selection line SSL21 to SSL24.Pad structure PS the first pad P11 to P13 and the second pad P21 is extremely P23 is electrically coupled to the first drain selection line SSL11 to SSL14 and the second drain selection line SSL21 to SSL24.
First pad P11 is electrically coupled to First Line L11.First pad P12 is electrically coupled to First Line L12.First pad P13 It is electrically coupled to First Line L13.The First Line L11 to L13 at phase same level is arranged on to be isolated from each other by slit SL.
First drain selection line SSL12 is electrically coupled to the first pad P11 by First Line L11.First Line L12 is commonly coupled to First drain selection line SSL11 and the second drain selection line SSL21.Therefore, First Line L12 is by the first drain selection line SSL11 The first pad P12 is electrically coupled to the second drain selection line SSL21.First Line L13 electrically connects the second drain selection line SSL22 To the first pad P13.
Second pad P21 is electrically coupled to the second line L21.Second pad P22 is electrically coupled to the second line L22.Second pad P23 It is electrically coupled to the second line L23.The second line L21 to L23 at phase same level is arranged on to be isolated from each other by slit SL.
First drain selection line SSL13 is electrically coupled to the second pad P21 by the second line L21.Second line L22 is commonly coupled to First drain selection line SSL14 and the second drain selection line SSL24.Therefore, the second line L22 is by the first drain selection line SSL14 The second pad P22 is electrically coupled to the second drain selection line SSL24.Second line L23 electrically connects the second drain selection line SSL23 To the second pad P23.
Therefore, the first drain selection line SSL11 to SSL14 included in first module structure C S1 can individually be controlled.This Outside, the second drain selection line SSL21 to SSL24 included in second unit structure C S2 can individually be controlled.
Reference picture 3B, first module structure C S1 include the first wordline WL11 to WL14, and second unit structure C S2 includes the Two wordline WL21 to WL24.Pad structure PS the first pad P14 and the second pad P24 is electrically coupled to the first wordline WL11 extremely WL14 and the second wordline WL21 to WL24.
First pad P14 is electrically coupled to First Line L14, the second pad P24 and is electrically coupled to the second line L24.In First Line L14 In the second line L24, the First Line L14 and the second line L24 that are arranged at phase same level are isolated from each other by slit SL.
First Line L14 is commonly coupled to the first wordline WL11 to WL12 and the second wordline WL21 to WL22.Therefore, First Line First wordline WL11 to WL12 and the second wordline WL21 to WL22 are electrically coupled to the first pad P14 by L14.Second line L24 is common It is connected to the first wordline WL13 to WL14 and the second wordline WL23 to WL24.Therefore, the second line L24 by the first wordline WL13 extremely WL14 and the second wordline WL23 to WL24 are electrically coupled to the second pad P24.
Reference picture 3C, first module structure C S1 include the first drain electrode selection line DSL11 to DSL18, second unit structure CS2 includes the second drain electrode selection line DSL21 to DSL28.In addition, pad structure PS the 3rd pad P31 to P38 is electrically connected respectively To the first drain electrode selection line DSL11 to DSL18.4th pad P41 to P48 is electrically coupled to the second drain electrode selection line DSL21 respectively To DSL28.3rd pad P31 to P38 can be contacted directly with the first drain electrode selection line DSL11 to DSL18 respectively.4th pad P41 to P48 can be contacted directly with the second drain electrode selection line DSL21 to DSL28 respectively.
Fig. 4 A to Fig. 9 are the layouts of the manufacture method for showing semiconductor device in accordance with an embodiment of the present disclosure and transversal Face figure.Fig. 4 A, Fig. 5 A, Fig. 6 A, Fig. 7 A, Fig. 8 A and Fig. 9 are layouts, and Fig. 4 B, Fig. 5 B, Fig. 6 B, Fig. 7 B and Fig. 8 B are cross sections Figure.Same or analogous element in Fig. 4 A to Fig. 9 is marked with the reference symbol identical reference symbol in foregoing figures, and And the detailed description that any repetition will be omitted or simplified.
Reference picture 4A and Fig. 4 B, including first module region CR1, second unit region CR2 and welding disking area PR lining Circuit 61 is formed on bottom 60.For example, forming X- decoders on the welding disking area PR of substrate 60, interlayer insulating film is then formed. Then, stack layer 41 to 44 is formed on the substrate 60.First module region CR1 in a manner of covering circuit 61 in substrate 60, Stack layer 41 to 44 is formed on welding disking area PR and second unit region CR2.
Then, although being not shown, but form the stack layer 41 through first module region CR1 and second unit region CR2 To 44 channel layer, and surround the data storage layer of the side wall of each channel layer.Each in data storage layer may include containing The floating boom of the materials such as silicon, charge-trapping material (such as nitride), phase-change material, nano dot.
Then, the first slit SL1 through stack layer 41 to 44 is formed, and the first slit is formed in the first slit SL1 Insulating barrier SLI1.First slit SL1 may be provided in welding disking area PR.Each first slit SL1 can have I- in a first direction The wire shaped extended on I'.First slit SL1 is on stacking direction (for example, direction that layer 41 to 44 stacks) through stack layer 41 To 44.First slit SL1 can be spaced apart from each other.First slit SL1 can have mutually the same length.Alternatively, the first slit SL1 can have different length.
For example, in the stacked structure that n groups stack is formed, first group of G1 is formed, then forms the first slit SL1 and first Slit insulating barrier SLI1.In this way, first group of G1 can have the pattern different from remaining second to n-th group pattern.This Place, n are greater than or equal to 3 natural number.
Reference picture 5A and Fig. 5 B, on first group of G1 stack layer 41 to 44 formed second to n-th group stack layer 45 to 56.In this way, stack layer 41 to 56 can form stacked structure ST.Stacked structure ST may include first module structure and second Cellular construction and pad structure.First module structure can be one of the stacked structure ST to form first module region CR1 Point.Second unit structure can be the part for the stacked structure ST to form second unit region CR2.Pad structure can be shape Into a welding disking area PR stacked structure ST part.That is, single stacked structure ST different piece can perform different functions.
Each in layer 41 to 56 may include first material layer C and second material layer D.For example, in the every of layer 41 to 56 In one, first material layer C can be arranged on second material layer D.Alternatively, second material layer D can be arranged on to the first material On bed of material C.
First material layer C is provided to form wordline, selection line, pad etc., there is provided second material layer D is so that the conduction stacked Layer is insulated from each other.For example, each in first material layer C can be formed by the sacrifice layer comprising nitride material etc., the second material Each can be formed by the insulating barrier comprising oxide material etc. in layer D.Alternatively, each in first material layer C can be by wrapping Conductive layer containing polysilicon, tungsten etc. is formed, and each in second material layer D can be by the insulating barrier shape comprising oxide material etc. Into.As a further alternative, each in first material layer C can be formed by the conductive layer comprising DOPOS doped polycrystalline silicon etc., and second Each in material layer D can be formed by the sacrifice layer comprising undoped polycrystalline silicon etc..
Stack layer 41 to 56 can be grouped according to the position etc. of the shape of line, pad.In showing shown in Fig. 5 A and Fig. 5 B In example, n 3, therefore stack layer 41 to 56 is divided into three groups, three groups are first group (41 to 44；G1), second group (45 to 52； ) and the 3rd group (53 to 56 G2；G3).Herein, the shape of the line in first group of G1 and the shape of second group of G2 or the 3rd group of G3 line The difference of shape is that first group of G1 is by the first slit insulating barrier SLI1 by extra pattern.In addition, in first group of G1 and In two groups of G2, pad is arranged on welding disking area PR core, and the 3rd group of G3 pad contacts with cellular construction.Stacked group Quantity and the quantity of each group of stack layer included can change.
Then, the first mask pattern 57 is formed on stacked structure ST.First mask pattern 57 includes the first opening OP1, It is each with the wire shaped extended on second direction II-II' in first opening OP1.Hereafter, using the first mask pattern 57 Part pattern n-th group, and therefore multiple hierarchic structures expose the layer of n-th group with predetermined pattern.
For example, in the case where n is 3, come using the first mask pattern 57 as etch stop layer (etch barrier) The 3rd group of G3 layer 56 is etched, then reduces the first mask pattern 57 so that the first opening OP1 prolongs on I-I' in a first direction Stretch.Hereafter, the 3rd group of G3 layer 55 and 56 is etched using the first mask pattern 57 of reduction as etch stop layer.With this side Formula, by repeating etching operation and reducing the operation of the first mask pattern 57, the 3rd group of G3 of each hierarchic structure layer 53 to 56 can be exposed with predetermined pattern.Thus, it is possible to form the First Line for including the virtual hierarchic structure DS1 of First Line L1 and first Structure LS1, and include the virtual hierarchic structure DS2 of the second line L2 and second the second cable architecture LS2.In addition, it can be formed and the 3rd hierarchic structure S3 of the one cellular construction CS1 contacts and fourth order ladder structure S4 contacted with second unit structure C S2.With Afterwards, the first mask pattern 57 is removed.
Reference picture 6A, Fig. 6 B, Fig. 7 A and Fig. 7 B, first group of part pattern stacked structure ST to (n-1) group, with Form multiple hierarchic structures to the layer of (n-1) group with predetermined pattern exposure first.For example, in the case where n is 3, can shape Into the multiple hierarchic structures for the layer that first group and second group is exposed with predetermined pattern.
First, the second mask pattern 58 for including the second opening OP2 is formed on stacked structure ST, is then covered using second Mould pattern 58 carrys out etching layer 50 to 53 as etch stop layer.Then, the second mask pattern 58 is removed.Hereafter, in stacked structure The 3rd mask pattern 59 for including the 3rd opening OP3 is formed on ST, is then used as etch stop layer using the 3rd mask pattern 59 Carry out etching layer 42 to 49.Thus, the first hierarchic structure S1 and the second ladder knot with predetermined pattern exposed surface 41 to 52 can be formed Structure S2.
The second mask pattern 58 and the 3rd mask pattern 59 are formed to cover the first cable architecture LS1 and the second cable architecture LS2 And the 3rd hierarchic structure S3 and fourth order ladder structure S4.Second mask pattern 58 and the 3rd mask pattern 59 include the second opening The openings of OP2 and the 3rd OP3, the second opening OP2 and the 3rd opening OP3 have island shape, and exposure will form the first hierarchic structure S1 With the second hierarchic structure S2 region.According to the quantity of stack layer, the second opening OP2 and the 3rd opening OP3 can be at least partly Overlap each other.Second opening OP2 and the 3rd opening OP3 can have mutually the same width.Alternatively, the second opening OP2 and the Three opening OP3 can have width different from each other.In addition, the quantity of etching layer can change.
Reference picture 8A and Fig. 8 B, interlayer insulating film 70 is formed on stacked structure ST, then with through interlayer insulating film 70 The 4th opening OP4 is formed with stacked structure ST mode.Hereafter, insulating pattern 71 is formed in the 4th opening OP4.For example, with Be through welding disking area PR stacked structure ST pad structure mode formed the 4th opening OP4.It is each in 4th opening OP4 With the depth for passing completely through pad structure and exposed circuits 61.
Reference picture 9, formed in a manner of through stacked structure ST second to the 5th slit SL2, SL3A, SL3B, SL4 and SL5.Second to the 4th slit SL2, SL3A, SL3B and SL4 extends on I-I' in a first direction, and the 5th slit SL5 is in second party Extend on to II-II'.In addition, the 3rd slit SL3A and the 5th slit SL5 intersect each other, and the 3rd slit SL3B and the 5th Slit SL5 and the first slit SL1 is coupled to each other with C-shaped.
The electrically separated adjacent memory block MB of second slit SL2, and on the border being arranged between adjacent memory block MB.The It is each with the depth for passing completely through stack layer 41 to 56 in two slit SL2.4th slit SL4 will be arranged at phase same level Drain electrode selection line separate each other, and each 4th slit SL4 have through be configured to be used as drain electrode selection line layer 54 To 56 depth.The 3rd separately positioned drain selection line at phase same level of slit SL3A and SL3B, it is separately positioned identical Drain electrode selection line at level, and with the depth for passing completely through stack layer 41 to 56.3rd slit SL3A is arranged on memory block Center, and cross it is multiple four opening OP4.In addition, the 5th separately positioned drain selections at phase same level of slit SL5 Line, and with the depth for passing completely through stacked structure 41 to 56.
In embodiment, be arranged on drain selection line at phase same level by the first slit SL1, the 3rd slit SL3A and SL3B and the 5th slit SL5 are separated each other.In addition, the drain electrode selection line being arranged at phase same level by the 3rd slit SL3A and SL3B and the 4th slit SL4 are separated each other.
Second to the 5th slit SL2, SL3A, SL3B, SL4 and SL5 can be formed simultaneously.Alternatively, it can be used two or more Multiple steps form second to the 5th slit SL2, SL3A, SL3B, SL4 and SL5.For example, form the second slit SL2, the 4th Slit SL4 and the 5th slit SL5, it is exhausted that the second slit insulating barrier, the 4th slit insulating barrier and the 5th slit are then formed wherein Edge layer.Then, the 3rd the slit SL3A and SL3B intersected with the 5th slit SL5 is formed, it is exhausted then to form the 3rd slit wherein Edge layer.
The narrow of supporter is configured for use as in addition, being formed in the second slit SL2, the 4th slit SL4 and the 5th slit SL5 After stitching insulating barrier, the additional process using the 3rd slit SL3A and SL3B can perform.For example, it is to sacrifice in first material layer C Layer and in the case that second material layer D is insulating barrier, first material layer C can be replaced with conductive layer.In another example, first Material layer C is conductive layer and in the case that second material layer D is insulating barrier, can be with silication first material layer C.In addition, first Material layer C is conductive layer and in the case that second material layer D is sacrifice layer, and first material layer C can be replaced with insulating barrier.
Figure 10 is the figure for the example arrangement for showing accumulator system in accordance with an embodiment of the present disclosure.
Reference picture 10, accumulator system 1000 according to an embodiment of the invention include storage arrangement 1200 and controller 1100。
Storage arrangement 1200 is used for the data for storing all kinds data with such as text, figure and software code Information.Storage arrangement 1200 can be nonvolatile memory, and the structure described by including reference picture 1A to Fig. 9.In addition, Storage arrangement 1200 may include that first module structure, second unit structure, pad structure, circuit and one or more are opened Mouthful.Pad structure may be provided between first module structure and second unit structure, and may be electrically coupled to first module structure and Second unit structure.Pad structure can have multiple hierarchic structures.Circuit may be provided at below pad structure.One or more is opened Mouth may pass through pad structure and exposed circuits.One or more opening may be provided between multiple hierarchic structures.Storage arrangement 1200 structure and its manufacture method is same as above, therefore by description is omitted.
Controller 1100 can be connected to main frame and storage arrangement 1200, and may be in response to the request access from main frame and deposit Reservoir device 1200.For example, controller 1100 can control reading, write-in, removal and the consistency operation of storage arrangement 1200.
Controller 1100 may include that random access memory (RAM) 1110, CPU (CPU) 1120, main frame connect Mouth 1130, error-correcting code (ECC) circuit 1140 and memory interface 1150 etc..
The speed buffering that RAM 1110 can be used as between CPU 1120 main storage, storage arrangement 1200 and main frame is deposited Buffer storage between reservoir, storage arrangement 1200 and main frame etc..As reference, RAM 1110 can use static random-access Memory (SRAM), read-only storage (ROM) etc. replace.
CPU 1120 can control the integrated operation of controller 1100.For example, CPU 1120 is operable to be stored in RAM 1110 In such as flash translation layer (FTL) (FTL) firmware.
HPI 1130 can engage with main frame.For example, controller 1100 can pass through such as following various interface protocols At least one of and main-machine communication：It is USB (USB) agreement, multimedia card (MMC) agreement, peripheral parts interconnected (PCI) agreement, PCI-express (PCI-E) agreement, Advanced Technology Attachment (ATA) agreement, Serial ATA protocol, Parallel ATA association View, minicom low profile interface (SCSI) agreement, enhanced minidisk interface (ESDI) agreement and integrated drive electronics (IDE) agreement, specialized protocol etc..
Error-correcting code (ECC) can be used to detect and correct the number read from storage arrangement 1200 in ECC circuit 1140 According to the mistake included.
Memory interface 1150 can engage with storage arrangement 1200.For example, memory interface 1150 may include that NAND connects Mouth or NOR interfaces.As reference, controller 1100 may also include the buffer storage (not shown) of interim storage data.Buffering Memory can be used for interim storage by be transferred to from HPI 1130 external device (ED) data or will be from memory interface 1150 It is transferred to the data of storage arrangement 1200.Controller 1100 may also include the ROM for store code data, the code data For being engaged with main frame.
Due to including the storage arrangement with improved integrated level and characteristic according to the accumulator system 1000 of embodiment 1200, therefore accumulator system 1000 can be miniaturized, while there is good characteristic.
Figure 11 is the figure for the example arrangement for showing accumulator system in accordance with an embodiment of the present disclosure.Herein, will omit or Simplify the detailed description of any repetition.
Reference picture 11, storage arrangement 1200' and controller may include according to the accumulator system 1000' of embodiment 1100.Controller 1100 may include RAM 1110, CPU 1120, HPI 1130, ECC circuit 1140, memory interface 1150 etc..
Storage arrangement 1200' can be non-volatile memory device, and may include to be retouched above with reference to Figure 1A to Fig. 9 The memory string stated.In addition, storage arrangement 1200' may include first module structure, second unit structure, pad structure, electricity Road and one or more openings.Pad structure may be provided between first module structure and second unit structure, and can Electricity Federation It is connected to first module structure and second unit structure.Pad structure can have multiple hierarchic structures.Circuit can be arranged on pad Below structure.One or more opening may pass through pad structure and exposed circuits.One or more opening may be provided at multiple ranks Between terraced structure.Storage arrangement 1200' structure and its manufacture method is same as above, therefore will omit it specifically It is bright.
In addition, storage arrangement 1200' can be the multi-chip package for including multiple memory chips.Multiple storage cores Piece is divided into multiple groups.Multiple groups can communicate by first to kth channel CH1 to CHk with controller 1100.Every group deposits Memory chip may be adapted to communicate with controller 1100 by common signal channel.Alterable memory system 1000' so that deposited per single Memory chip is connected to corresponding individual channel.
As described above, according to embodiment, because accumulator system 1000' includes depositing with improved integrated level and characteristic Reservoir device 1200', therefore accumulator system 1000' can be miniaturized, while there is good characteristic.Can be with multi-chip package Form manufacture storage arrangement 1200', with improve accumulator system 1000' data storage capacity and improve its driving speed Degree.
Figure 12 is the figure for the example arrangement for showing computing system in accordance with an embodiment of the present disclosure.Herein, will omit or simple Change the detailed description of any repetition.
Reference picture 12, computing system 2000 in accordance with an embodiment of the present disclosure may include storage arrangement 2100, CPU 2200th, RAM 2300, user interface 2400, power supply 2500, system bus 2600 etc..
Storage arrangement 2100 can store the data provided via user interface 2400, the data handled by CPU 2200 Deng.Storage arrangement 2100 can be electrically coupled to CPU 2200, RAM 2300, user interface 2400, electricity by system bus 2600 Source 2500 etc..For example, storage arrangement 2100 can be connected to system bus 2600 via controller (not shown).Alternatively, deposit Reservoir device 2100 may be coupled directly to system bus 2600.System bus 2600 is directly connected in storage arrangement 2100 In the case of, the function of the execution controller such as CPU 2200, RAM 2300 can be passed through.
Storage arrangement 2100 can be nonvolatile memory, and including above with reference to described by Figure 1A to Fig. 9 Memory string.In addition, storage arrangement 2100 may include first module structure, second unit structure, pad structure, circuit and One or more opening.Pad structure may be provided between first module structure and second unit structure, and may be electrically coupled to First module structure and second unit structure.Pad structure can have multiple hierarchic structures.Circuit may be provided under pad structure Side.One or more opening may pass through pad structure and exposed circuits.One or more opening can be arranged on multiple ladder knots Between structure.The structure and its manufacture method of storage arrangement 2100 are same as above, therefore by description is omitted.
In addition, as described above with reference to Figure 11, storage arrangement 2100 can be equipped with the more of multiple memory chips Chip package.
Computing system 2000 with above-mentioned configuration can be as one kind in the various elements of such as following electronic installation It is provided：Computer, super mobile PC (UMPC), work station, net book, personal digital assistant (PDA), portable computer, net Network flat board, radio telephone, mobile phone, smart phone, e-book, portable media player (PMP), game console, Guider, black box, digital camera, 3-dimensional TV, digital audio recorder, digital audio-frequency player, digital picture record Device, digital picture player, digital video recorder, video frequency player ,/receive information can be sent in wireless environments Device, one kind in the various devices for forming home network, for being formed in the various electronic installations of computer network One kind, one kind in the various electronic installations for forming teleprocessing network, RFID device etc..
As noted previously, as include the storage with improved integrated level and characteristic according to the computing system 2000 of embodiment Device device 2100, therefore computing system 2000 can be miniaturized, while there is good characteristic.
Figure 13 is the figure for showing computing system in accordance with an embodiment of the present disclosure.
Reference picture 13, computing system 3000 in accordance with an embodiment of the present disclosure may include software layer, and the software layer includes behaviour Make system 3200, using 3100, file system 3300, conversion layer 3400 etc..Computing system 3000 may include such as memory device Put 3500 hardware layer.
Operating system 3200 can manage software resource and hardware resource of computing system 3000 etc., and control CPU program Perform.It may include the various application programs that are performed by computing system 3000 using 3100, and can be by operating system 3200 The utility program of execution.
File system 3300 can refer to the logical construction that data, file etc. are provided to control in computing system 3000.File The file or data that system 3300 can will be stored in the grade of storage arrangement 3500 according to given rule come tissue.File system 3300 can determine according to the operating system 3200 used in computing system 3000.For example, if operating system 3200 is base In Microsoft Windows system, then file system 3300 can be file allocation table (FAT), NT file system (NTFS) etc..Such as Fruit operating system 3200 is the system based on Unix/Linux, then file system 3300 can be extension file system (EXT), Unix file system (UFS), JFS (JFS) etc..
Although in the accompanying drawings operating system 3200, using 3100 and file system 3300 be represented as single block, grasp Make to may include to apply 3100 and file system 3300 in system 3200.
Conversion layer 3400 may be in response to the request from file system 3300, by address conversion into suitable for storage arrangement 3500 form.For example, the logical address as caused by file system 3300 can be converted into storage arrangement by conversion layer 3400 3500 physical address.The map information of logical address and physical address is storable in address translation table.For example, conversion layer 3400 can be flash translation layer (FTL) (FTL), general flash storage link layer (ULL) etc..
Storage arrangement 3500 can be nonvolatile memory.Storage arrangement 3500 may include above with reference to Figure 1A extremely Memory string described by Fig. 9.In addition, storage arrangement 3500 may include first module structure, second unit structure, pad knot Structure, circuit and one or more openings.Pad structure may be provided between first module structure and second unit structure, and It may be electrically coupled to first module structure and second unit structure.Pad structure can have multiple hierarchic structures.Circuit may be provided at Below pad structure.One or more opening may pass through pad structure and exposed circuits.One or more opening may be provided at more Between individual hierarchic structure.The structure and its manufacture method of storage arrangement 3500 are same as above, therefore it is detailed to omit its Describe in detail bright.
Computing system 3000 with above-mentioned configuration can be divided into the operating system layer operated in higher level region With the controller layer operated in reduced levels region.It may include using 3100, operating system 3200 and file system 3300 In operating system layer, and by the operation storage drive of computing system 3000.Conversion layer 3400 may include in operating system layer or In controller layer.
As noted previously, as include the storage with improved integrated level and characteristic according to the computing system 3000 of embodiment Device device 3500, therefore computing system 3000 can be miniaturized, while there is good characteristic.
According to embodiment, program speed can be improved by reducing the distance between circuit and cellular construction.In addition, it can lead to Cross and reduce the area of welding disking area and improve integrated level, and manufacturing process can be simplified.
Example embodiment disclosed herein, despite the use of particular term, but these terms are only with general and description Meaning is used and explained, rather than the purpose limited.In some cases, it is general for this area such as when submitting the application It is logical it is obvious to the skilled person that unless otherwise indicated, feature, feature and/or the member otherwise described with reference to specific embodiment Part can be used alone or can be applied in combination with combining feature, feature and/or the element of other embodiments description.Therefore, this area Technical staff will be appreciated that in the case where not departing from the spirit and scope of the present invention as described in appended claims, The change on various forms and details can be carried out.

Claims (27)

1. a kind of semiconductor device, it includes：
Circuit；
Pad structure, it is arranged on above the circuit, and the pad structure includes the comprising the first pad to overlie one another One hierarchic structure, the second hierarchic structure comprising the second pad to overlie one another and comprising the 3rd pad to overlie one another Three hierarchic structures；
First opening, it is arranged between first hierarchic structure and second hierarchic structure and passes through the pad knot Structure and the exposure circuit；
Second opening, it is arranged between second hierarchic structure and the 3rd hierarchic structure and passes through the pad knot Structure and the exposure circuit；
First interconnection structure, it electrically connects first pad and the 3rd pad each other, and is open by described first Or first pad and the 3rd pad are connected to the circuit by second opening；And
Second interconnection structure, it electrically connects second pad each other, and is open by described first or second opening Second pad is connected to the circuit.
2. semiconductor device according to claim 1, wherein, first hierarchic structure and second hierarchic structure are closed It is symmetrical in the described first opening, and each there is stairstepping in first hierarchic structure and second hierarchic structure The height of a part for shape, wherein hierarchic structure increases with a part for the hierarchic structure close to the described first opening.
3. semiconductor device according to claim 1, wherein, second hierarchic structure and the 3rd hierarchic structure are closed It is symmetrical in the described second opening, and each there is stairstepping in second hierarchic structure and the 3rd hierarchic structure The height of a part for shape, wherein hierarchic structure reduces with a part for the hierarchic structure close to the described second opening.
4. semiconductor device according to claim 1, wherein, the pad structure includes：
First cable architecture, it includes the First Line to overlie one another, and the First Line is electrically coupled to respective first pad；
Second cable architecture, it includes the second line to overlie one another, and second line is electrically coupled to respective second pad；With And
Three wire configuration, it includes the 3rd line to overlie one another, and the 3rd line is electrically coupled to respective 3rd pad, and And
Wherein, in the First Line into the 3rd line, it is arranged on First Line to the 3rd line at phase same level and is isolated from each other.
5. semiconductor device according to claim 4, it further comprises：
First module structure, it includes the first drain selection line to overlie one another and the second drain selection line to overlie one another, and It is formed so that among the first drain selection line and the second drain selection line, be arranged at phase same level One drain selection line and the second drain selection line are isolated from each other；And
Second unit structure, it includes the 3rd drain selection line to overlie one another and the 4th drain selection line to overlie one another, and It is formed so that among the 3rd drain selection line and the 4th drain selection line, be arranged at phase same level Three drain selection lines and the 4th drain selection line are isolated from each other,
Wherein, the First Line is electrically coupled to the respective second drain selection line, each common connection in second line The first source electrode being arranged at phase same level being connected among the first drain selection line and the 3rd drain selection line Selection line and the 3rd drain selection line, and the 3rd line is electrically coupled to the respective 4th drain selection line.
6. a kind of semiconductor device, it includes：
First module structure；
Second unit structure；
Pad structure, it is arranged between the first module structure and the second unit structure, and is electrically coupled to described One cellular construction and the second unit structure, the pad structure have multiple hierarchic structures；
Circuit, it is arranged on below the pad structure；And
One or more opening, it is arranged on through the pad structure and the exposure circuit, one or more of openings Between the multiple hierarchic structure.
7. semiconductor device according to claim 6, wherein, the multiple hierarchic structure includes：
First hierarchic structure, it includes the first pad to overlie one another, and first pad is electrically coupled to the first module knot Structure；
Second hierarchic structure, it includes the second pad to overlie one another, and second pad is electrically coupled to the first module knot Structure and the second unit structure；And
3rd hierarchic structure, it includes the 3rd pad to overlie one another, and the 3rd pad is electrically coupled to the second unit knot Structure.
8. semiconductor device according to claim 7, wherein, the opening includes：
First opening, it is arranged between first hierarchic structure and second hierarchic structure, and is formed to make described First pad and second pad are isolated from each other；And
Second opening, it is arranged between second hierarchic structure and the 3rd hierarchic structure, and is formed to make described Second pad and the 3rd pad are isolated from each other.
9. semiconductor device according to claim 7, it further comprises：
First interconnection structure, it electrically connects first pad and the 3rd pad each other, and is open by described by institute State the first pad and the 3rd pad is connected to the circuit；And
Second interconnection structure, it electrically connects second pad each other, and is coupled second pad by the opening To the circuit.
10. semiconductor device according to claim 7, wherein, the pad structure includes：
First cable architecture, it includes the First Line to overlie one another, and the First Line is electrically coupled to respective first pad；
Second cable architecture, it includes the second line to overlie one another, and second line is electrically coupled to respective second pad；With And
Three wire configuration, it includes the 3rd line to overlie one another, and the 3rd line is electrically coupled to respective 3rd pad, and And
Wherein, in the First Line into the 3rd line, it is arranged on the first to the 3rd line at phase same level and is isolated from each other.
11. semiconductor device according to claim 10, wherein：
The first module structure includes the first drain selection line to overlie one another and the second drain selection line to overlie one another, and And among the first drain selection line and the second drain selection line, the first drain selection for being arranged at phase same level Line and the second drain selection line are isolated from each other；And
The second unit structure includes the 3rd drain selection line to overlie one another and the 4th drain selection line to overlie one another, and And among the 3rd drain selection line and the 4th drain selection line, the 3rd drain selection that is arranged at phase same level Line and the 4th drain selection line are isolated from each other.
12. semiconductor device according to claim 11, wherein：
The First Line is electrically coupled to the respective first drain selection line；
Each it is commonly coupled in second line among the second drain selection line and the 3rd drain selection line The second drain selection line being arranged at phase same level and the 3rd drain selection line；And
3rd line is electrically coupled to the respective 4th drain selection line.
13. semiconductor device according to claim 7, it further comprises：
Slit insulating barrier, it extends to cross the opening and pass through the pad knot in the stacking direction in one direction Structure；
Fourth order ladder structure, it is towards first hierarchic structure so that the slit insulating barrier is arranged on first rank Between terraced structure and the fourth order ladder structure, the fourth order ladder structure includes the 4th pad that overlies one another, and the described 4th Pad is electrically coupled to the first module structure；
5th hierarchic structure, it is towards second hierarchic structure so that the slit insulating barrier is arranged on the second-order Between terraced structure and the 5th hierarchic structure, the 5th hierarchic structure includes the 5th pad that overlies one another, and the described 5th Pad is electrically coupled to the first module structure and the second unit structure；And
6th hierarchic structure, it is towards the 3rd hierarchic structure so that the slit insulating barrier is arranged on the 3rd rank Between terraced structure and the 6th hierarchic structure, the 6th hierarchic structure includes the 6th pad that overlies one another, and the described 6th Pad is electrically coupled to the second unit structure.
14. semiconductor device according to claim 13, wherein, the opening includes：
First opening, it is arranged on first hierarchic structure and the fourth order ladder structure and second hierarchic structure and institute Between stating the 5th hierarchic structure, and it is formed such that first pad and the 4th pad and second pad and described 5th pad is isolated；And
Second opening, it is arranged on second hierarchic structure and the 5th hierarchic structure and the 3rd hierarchic structure and institute Between stating the 6th hierarchic structure, and it is formed to make second pad and the 5th pad and the 3rd pad and described 6th pad is isolated.
15. semiconductor device according to claim 13, it further comprises：
First interconnection structure, it electrically connects first pad and the 3rd pad each other, and is open by described by institute State the first pad and the 3rd pad is connected to the circuit；
Second interconnection structure, it electrically connects second pad each other, and is coupled second pad by the opening To the circuit；
3rd interconnection structure, it is configured to each other electrically connect the 4th pad and the 6th pad, and by described 4th pad and the 6th pad are connected to the circuit by opening；And
4th interconnection structure, it is configured to each other electrically connect the 5th pad, and by the opening by the described 5th Pad is connected to the circuit.
16. semiconductor device according to claim 13, wherein, the pad structure includes：
First cable architecture, it includes the First Line to overlie one another, and the First Line is electrically coupled to respective first pad；
Second cable architecture, it includes the second line to overlie one another, and second line is electrically coupled to respective second pad；
Three wire configuration, it includes the 3rd line to overlie one another, and the 3rd line is electrically coupled to respective 3rd pad；
4th cable architecture, it includes the 4th line to overlie one another, and the 4th line is electrically coupled to respective 4th pad；
5th cable architecture, it includes the 5th line to overlie one another, and the 5th line is electrically coupled to respective 5th pad；With And
6th cable architecture, it includes the 6th line to overlie one another, and the 6th line is electrically coupled to respective 6th pad；
Wherein, in the First Line into the 6th line, it is arranged on First Line to the 6th line at phase same level and is isolated from each other.
17. semiconductor device according to claim 16, wherein：
The first module structure includes the first drain selection line to the 4th drain selection line being isolated from each other, and described second Cellular construction includes the 5th drain selection line to the 8th drain selection line being isolated from each other；
The First Line is electrically coupled to the respective second drain selection line；
Each it is commonly coupled in second line among the first drain selection line and the 5th drain selection line The first drain selection line being arranged at phase same level and the 5th drain selection line；
3rd line is electrically coupled to the respective 6th drain selection line；
4th line is electrically coupled to the respective 3rd drain selection line；
Each it is commonly coupled in 5th line among the 4th drain selection line and the 8th drain selection line The 4th drain selection line being arranged at phase same level and the 8th drain selection line；And
6th line is electrically coupled to the respective 7th drain selection line.
18. semiconductor device according to claim 7, wherein, first hierarchic structure and second hierarchic structure Symmetrically, second hierarchic structure and the 3rd hierarchic structure are symmetrical.
19. a kind of method for manufacturing semiconductor device, it includes：
Circuit is formed on the welding disking area of substrate, the substrate includes the first module area being sequentially arranged in a first direction Domain, the welding disking area and second unit region；
Stacked structure is formed on the substrate formed with the circuit, the stacked structure includes first group to overlie one another To n-th (n is greater than or equal to 3 natural number) group；
The welding disking area of stacked structure described in the pattern of part, and it is single to form first be arranged in the first module region Meta structure, the second unit structure being arranged in the second unit region and the pad knot being arranged in the welding disking area Structure, the pad structure include multiple hierarchic structures and are electrically coupled to the first module structure and the second unit structure； And
One or more openings through the pad structure and the exposure circuit are formed, one or more of openings are set Between the multiple hierarchic structure.
20. according to the method for claim 19, wherein, forming the stacked structure includes：
Described first group is formed, the described first group first material layer and second material layer for including stacking alternating with each other；
The first slit insulating barrier is formed, the first slit insulating barrier is in the welding disking area through described first group and in institute First party is stated to upwardly extend；And
Second group is formed above described first group to the n-th group, each includes that in described second group to the n-th group This first material layer and second material layer for being alternately stacked.
21. according to the method for claim 20, it further comprises：After the pad structure is formed, second is formed Slit insulating barrier, the second slit insulating barrier in the welding disking area through described first group to the n-th group and with The second party that the first direction intersects upwardly extends, and the second slit insulating barrier is connected to the first slit insulating barrier.
22. according to the method for claim 19, wherein, forming the pad structure is included n-th described in the pattern of part Group stacked structure, and the first hierarchic structure and the second hierarchic structure are formed, and wherein：
First hierarchic structure includes the first pad to overlie one another, first pad and the first module form touch And it is electrically coupled to the n-th group first module structure；And
Second hierarchic structure includes the second pad to overlie one another, second pad and the second unit form touch And it is electrically coupled to the n-th group second unit structure.
23. according to the method for claim 22, it further comprises being formed is electrically coupled to described the by first pad First interconnection structure of two pads.
24. according to the method for claim 19, wherein, forming the pad structure is included first described in the pattern of part Group organizes stacked structure to (n-1), and forms the 3rd hierarchic structure being arranged between the opening, the 3rd ladder knot Structure includes the 3rd pad to overlie one another, and the 3rd pad is commonly coupled to described second group and organizes first module to (n-1) Structure and it is described second group to (n-1) organize second unit structure.
25. according to the method for claim 24, it further comprises：
Slit insulating barrier is formed, the slit insulating barrier extends to cross the 3rd hierarchic structure in said first direction, So that the 3rd pad of the 3rd hierarchic structure is separated by the slit insulating barrier；And
Form the second interconnection structure, the 3rd ladder knot that second interconnection structure will be divided by the slit insulating barrier The 3rd pad being arranged at phase same level among 3rd pad of structure electrically connects each other.
26. according to the method for claim 19, wherein, forming the pad structure includes：
Stacked structure is organized described in the pattern of part to (n-1) for first group, and forms fourth order ladder structure, the 5th ladder knot Structure and the 6th hierarchic structure, the fourth order ladder structure include overlieing one another and being electrically coupled to first group of first module structure The 4th pad, the 5th hierarchic structure includes overlieing one another and being electrically coupled to first group of first module structure and described 5th pad of first group of second unit structure, the 6th hierarchic structure include overlieing one another and being electrically coupled to described first group 6th pad of second unit structure.
27. according to the method for claim 26, it further comprises：
The 3rd interconnection structure is formed, the 4th pad is electrically coupled to the 6th pad by the 3rd interconnection structure, and is led to Cross the opening and the 4th pad and the 6th pad are connected to the circuit；And
The 4th interconnection structure is formed, the 5th pad is connected to the electricity by the 4th interconnection structure by the opening Road.
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KR102415206B1 (en) 2022-07-01
CN111952310A (en) 2020-11-17
CN107546229B (en) 2020-07-14
US10930666B2 (en) 2021-02-23
US20170373088A1 (en) 2017-12-28
US9853051B1 (en) 2017-12-26
US12120871B2 (en) 2024-10-15
KR20180001301A (en) 2018-01-04

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