CN107533202A - Optical bench sub-component with integrated photonic device - Google Patents
Optical bench sub-component with integrated photonic device Download PDFInfo
- Publication number
- CN107533202A CN107533202A CN201680023080.XA CN201680023080A CN107533202A CN 107533202 A CN107533202 A CN 107533202A CN 201680023080 A CN201680023080 A CN 201680023080A CN 107533202 A CN107533202 A CN 107533202A
- Authority
- CN
- China
- Prior art keywords
- optical
- component
- photonic device
- sub
- optical bench
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/40—Cutting-out; Stamping-out using a press, e.g. of the ram type
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
- G02B6/3648—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
- G02B6/3652—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
- G02B6/3684—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier
- G02B6/3696—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier by moulding, e.g. injection moulding, casting, embossing, stamping, stenciling, printing, or with metallic mould insert manufacturing using LIGA or MIGA techniques
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/424—Mounting of the optical light guide
- G02B6/4243—Mounting of the optical light guide into a groove
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4245—Mounting of the opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4251—Sealed packages
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
- Light Receiving Elements (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
Abstract
The present invention discloses a kind of optical bench sub-component including integrated photonic device.Before photonic device is attached into photoelectric packaging part component, the optical alignment of photoelectric device and optical bench can be performed outside photoelectric packaging part component.Photonic device is attached to the pedestal of optical bench in the case of optics output end/input optical alignment of its optical input port/output end and optical bench.Optical bench is supported the array of optical fiber on structured reflecting surface with exact relationship.Photonic device is installed on sub- base, to be attached to optical bench.Photonic device actively or passively can be aligned with optical bench.After achieving optical alignment, the sub- base of photonic device is securely attached to the pedestal of optical bench.Optical bench sub-component can be structured, to be airtightly sealed into airtight feedthrough component, so as to airtightly be attached to airtight photoelectric packaging part.
Description
Background technology
1. priority claim
The application：
(1) priority of U.S. Provisional Patent Application the 62/136th, 601 submitted on March 22nd, 2015 is required；
(2) be the U.S. Patent Application No. 13/861,273 submitted on April 11st, 2013 part continuation application, the portion
Divide continuation application：
(a) priority of U.S. Provisional Patent Application the 61/623rd, 027 submitted on April 11st, 2012 is required,
(b) priority for the U.S. Provisional Patent Application the 61/699th, 125 that September in 2012 is submitted on the 10th is required, and
(c) be the U.S. Patent Application No. 13/786,448 submitted on March 5th, 2013 part continuation application, the portion
Divide the priority of the continuation application requirement U.S. Provisional Patent Application the 61/606th, 885 that on March 5th, 2012 submits.
(3) be the U.S. Patent Application No. 14/714,211 submitted on May 15th, 2015 part continuation application, the portion
Divide continuation application：
(a) priority of U.S. Provisional Patent Application the 61/994th, 094 submitted on May 15th, 2014 is required,
(b) be the U.S. Patent Application No. 14/695,008 submitted on April 23rd, 2015 part continuation application.
These applications are fully incorporated as illustrating completely herein by reference.It is described below all
It is open to be fully incorporated by reference as illustrating completely herein.
2. technical field
The present invention relates to optical bench sub-component, more particularly to the optical fiber sub-component based on optical bench, and more particularly relate to
Airtight optical fiber feedthrough component sub-component based on optical bench.
3. prior art
Lot of advantages be present via fibre-optic waveguide transmission optical signal, and it is various that it, which is used,.Single and multiple optical fiber
Waveguide can be simply used for transmitting visible ray to remote location.Complicated phone and data communication system can transmit multiple specific lights
Signal.Data communication system involves with the device of end-to-end relation splicing optical fibers, including photoelectricity or photonic device, and it includes carrying
For, optics and electronic unit to be changed between optical signal and electric signal of detection and/or control light.
For example, transceiver (Xcvr) is with the transmitter (Tx) of electrical combination and connecing in optical-electric module, including module housing
Device (Rx) is received, it is packaging part that its is well known in the art.Packaging part can be hermetically sealed, to protect its content not by ring
Border influences.Transmitter includes light source (for example, VCSEL or Distributed Feedback Laser), and receiver includes optical sensor (for example, light
Electric diode (PD)).Before this, circuit (e.g., including laser driver, trans-impedance amplifier (TIA) etc.) quilt of transceiver
It is soldered on printed circuit board (PCB).Such transceiver totally have formed the bottom of packaging part either bottom substrate (it is airtight or
It is non-hermetically sealed), then the photoelectric device of such as laser and photodiode etc is soldered in substrate.Optical fiber is connected to encapsulation
The outside of part or using airtight feedthrough component come through the wall of packaging part, (see US20130294732A1, it is commonly assigned to this
Assignee/applicant of application, and be fully incorporated as illustrating herein completely).
The end of optical fiber is attached to the photoelectric device kept in shell by light.Feed-through element supports the optical fiber through wall opening
A part.For a variety of applications, it may be desirable to photoelectric device is hermetically sealed within the shell of optical-electric module, with guard block
Do not influenceed by corrosive medium, humidity etc..Because the encapsulation of optical-electric module must be used as entirety to be hermetically sealed, feedthrough
Element must be hermetically sealed, make it that the optoelectronic components in optical-electric module shell reliably and are constantly protected from
Environment influences.
For appropriate operation, the photoelectric device supported on a printed circuit needs light being efficiently attached to exterior light
It is fine.Some photoelectric devices need single-mode optics connector, and single-mode optics connector needs the strict alignment tolerance between optical fiber and device,
Typically less than 1 micron.This is challenge especially for multiple fiber optic applications, and in multiple fiber optic applications, multiple optical fiber need to use
Active optics alignment methods (wherein, adjust the position and orientation of (multiple) optical fiber, until optical fiber and phototube by plant equipment
Untill the light quantity transmitted between part is maximized) by optical alignment to multiple photoelectric devices.
Figure 1A and 1B illustrates the gas-tight seal photoelectric packaging part 500 with airtight multi fiber feedthrough component 502, wherein, gas
Close feedthrough component 502 is actively aligned with the photonic device 504 on the sub- base 506 supported by the bottom of packaging part 500.
In this illustration, feedthrough component 502 is similar to the light coupling device disclosed in US2016/0016218A1, US2016/
0016218A1 has been commonly assigned to present assignee/applicant, and complete as illustrating completely herein
It is incorporated to entirely.Photonic device 504 can include VCSEL array and/or PD arrays, and it is for example via sub- base 506 and printed circuit
Plate 508 is supported on packaging part bottom.Printed circuit board (PCB) 508 is provided with other electronic units and circuit, and packaging part 500 can
With including some printed circuit board (PCB)s.The sub- base 506 of photonic device 504/ and miscellaneous part are being assembled to it in packaging part 500
Afterwards, the opening 503 that feedthrough component 504 is limited by the ozzle 50 in the side wall by the shell 501 of packaging part 500 is inserted.Optical cable 21
The array of optical fiber 20 supported by feedthrough component 502, and with 504 active alignment of photonic device, to realize photonic device and optical fiber
Expectation light connection efficiency between 20 array.This crosses range request photonic device 504 and associated electronic device (does not show
Go out) it is preassembled in packaging part 500.Photonic device 504 is activated/encouraged to send optical signal 22/ to the array of optical fiber 20
From the array received optical signal 22 of optical fiber 20.Substantially, when the signal 22 transmitted between optical fiber 20 and photonic device 504 is by most
During bigization, photonic device 504 is optimally connected to optical signal of the optical fiber 20/ from optical fiber 20.Then feedthrough component 502 is in light
In the ozzle 50 for learning the packaging part side-walls for being soldered to shell 501 in the state of alignment.
Active optics alignment involves relative complex, low output process, because VCSEL or PD is in active alignment procedures
Period must be energized.The manufacturer of integrated circuit generally have be capable of sub-micron alignment expensive capital equipment (for example, with
In the wafer prober and processor of test integrated circuit), and the machinery that the company for encapsulating chip typically has ability poor is set
Standby (some microns of alignment tolerances, be generally unsuitable for single mode device), and commonly using manually operated.
Use and assembling process of the current state of prior art except common electronic device, due to comprising packaging part and
Costliness, and/or often it is not suitable for single mode application.Relative to airtight feedthrough sub-component, packaging part is relatively more expensive component
(it includes the circuit block of costliness, such as IC or the like).Assuming that require the active optical alignment of support in pre-assembled packaging part
Part required pre-assembled and it is further assumed that active alignment and brazing process involve the knot for overall package process
Beam has the step of excessive risk, then the failure due to realizing active alignment caused by defective FRU will cause whole encapsulation to be lost
Abandon, the defective FRU may introduce in active alignment procedures, and whole packaging part includes photonic device and encapsulated therein
Miscellaneous part.
In addition, although VCSEL and PD parts can be tested in the quiescent state before assembly, until with driving
The electronic device for moving these parts is assembled in an enclosure, and they can not be tested in operational conditions.Therefore, VCSEL and
The ageing process of PD parts can be only in these parts (to identify that life-span early stage part is unqualified according to simulation loading condition)
Carried out after being assembled into packaging part.Due to defective but relatively not expensive VCSEL and PD parts, this will cause to be group
The further waste (that is, low packaging part yield) of the packaging part of the relatively more expensive module of dress.It is right known to VCSEL and PD components
The unqualified of the relative high number of packaging part after assembling contributes.
Cause to waste the other unqualified pattern of the packaging part after assembling by structure ring that is relatively bigger and better conforming to
(being represented by the dotted line in Figure 1B) causes, and the structure ring maintains the optical alignment between photonic device and feedthrough component, such as Figure 1B institutes
Show.Long structure ring is more sensitive for heat-mechanically deform (it enables to packaging part to be offset to outside desired design specification), thus
Cause unqualified pattern.
Need the input of optical fiber/output end optical alignment to be connected to the improvement of optoelectronic components/photonic device
Structure, it improves output, tolerance, manufacturing capacity, property, feature and reliability easy to use in the case where reducing cost.
The content of the invention
The present invention, which provides, contributes to photonic device to which overcome existing skill to the improved structure of the optical alignment of optical bench
The shortcomings that art.The present invention combines photonic device and optical bench in sub-component, to cause the optics of photonic device and optical bench to join
Connecing can be carried out outside optoelectronic package component.
According to the present invention, photonic device is attached to the pedestal of optical bench, and the light of its light input end/output end and optical bench is defeated
Go out end/input optical alignment.
In one embodiment, the optical component of the form of optical bench support fiber waveguide (for example, optical fiber).Particularly
In embodiment, the pedestal of optical bench limits align structures in the form of at least one groove, with the end portion of accurate support optical fiber
Point.Optical element (for example, lens, prism, reflector, speculum etc.) can be provided with exact relationship to the end face of optical fiber.
In another embodiment, optical element includes patterned surface, and it can be flat reflecting surface or recessed reflecting surface (for example, aspherical
Mirror surface).
In one embodiment, photonic device may be mounted on sub- base, sub- base and optical bench optical alignment ground quilt
It is attached to the pedestal of optical bench.Sub- base can be provided with circuit, electrical contact pad, circuit block (for example, VCSEL driver,
PD TIA) and the miscellaneous part and/or circuit associated with the operation of photonic device.
Photonic device can be passively aligned (for example, dependent on the alignment mark set on optical bench) with optical bench.Can
Alternatively, photonic device and optical bench can by communicating optical signals between the fiber waveguide in optical bench and photonic device and by
Actively it is aligned.Photonic device (for example, VCSEL and/or PD) can be activated, to allow the light wave with being supported in optical bench
The active alignment of (for example, optical fiber) is led, without dependent on the miscellaneous part in packaging part.After achieving optical alignment,
The sub- base of photonic device is securely attached to the pedestal of optical bench.
The pedestal of optical bench is preferably formed by the extendable material of punching press (for example, metal), to form optical bench
Precise geometry and feature.Optical bench sub-component can be structured, to be hermetically sealed.
In another embodiment of the invention, optical bench is structured, with support multiple waveguides (for example, multiple optical fiber) and
Structured reflecting surface (for example, array of mirror), with the array with the photonic device installed on sub- base (VCSEL and/or PD)
Work together.
The present invention is before bigger photoelectric packaging part is assembled to, by optical element and part and photonic device accurately
In the pre-assembled sub-component to optical bench.Sub-component can optoelectronic package will outside, in sub-component level by functional test, including old
Change test, thus reduce more expensive photoelectricity caused by the early stage for the photonic device being assemblied in photoelectric packaging part is unqualified
The waste of packaging part.
Brief description of the drawings
For the preference pattern that the property of the present invention and advantage is more fully understood and uses, should refer to read with reference to accompanying drawing
Detailed description below reading.In following figure, identical reference number represents same or similar portion in whole accompanying drawing
Point.
Figure 1A shows the airtight photoelectric packaging part for including airtight optical fiber feedthrough component；Figure 1B is cut along Figure 1A line 1B-1B
The sectional view taken.
Fig. 2A shows the form of the airtight feedthrough component according to an embodiment of the invention including integrated optoelectronic device
Optical bench sub-component；Fig. 2 B are the sectional views intercepted along the line 2B-2B in Fig. 2A, are shown mounted at airtight photoelectric packaging part
In.
Fig. 3 A are the enlarged views of the optical bench of Fig. 2 according to an embodiment of the invention optical bench sub-component；Figure
3B is the view after the assembling of optical bench.
Fig. 4 A are the enlarged views of the optical bench in optical bench sub-component according to another embodiment of the invention；Fig. 4 B
Be optical bench assembling after view.
Fig. 5 shows the alternate embodiment of the sub- base of the photonic device in optical bench sub-component.
Fig. 6 A to 6C show the assembling sequence of airtight photoelectric packaging part, wherein, Fig. 6 A illustrate the group of photonic device component
Dress；Fig. 6 B illustrate the assembling of photonic device component and optical bench and active alignment；Fig. 6 C illustrate airtight photoelectric packaging part
Assembling.
Fig. 7 shows the airtight feedthrough component being arranged in airtight photoelectric packaging part.
Embodiment
Below with reference to the accompanying drawings the present invention is described with reference to each embodiment.Although according to the optimal mould for realizing the purpose of the present invention
Formula description the present invention, it will be appreciated, however, by one skilled in the art that can without departing from the spirit or scope of the present invention,
In view of modification is completed in these teachings.
Present invention offer contributes to photonic device, and to the improved structure of the optical alignment of optical bench, it overcomes prior art
The shortcomings that.The present invention combines photonic device and optical bench in sub-component, to cause photonic device to couple with the optics of optical bench
Alignment can be carried out outside optoelectronic package component.
According to the present invention, photonic device is attached to the pedestal of optical bench, the light of its optical input port/output end and optical bench
Learn output end/input optical alignment.Various embodiments of the present invention are incorporated to some by assignee of the present invention
The inventive concept of (nanoPrecision Products, Inc.) exploitation, including various patented products (including passed with optical data
It is defeated to associate the optical bench sub-component that uses), including patent discussed below disclose it is public in (it has been commonly assigned to assignee)
The design opened.The priority of co-pending application is required herein.
For example, the light that U.S. Patent Application Publication No. US2013/0322818A1 discloses for routeing optical signal couples
Device, the device are the forms with the optical bench for being used for the punching structure surface for routeing light data signal.Optical bench includes
Metal base, metal base, which has, limits patterned surface therein, wherein, patterned surface has and makes incident bendingof light, anti-
The surface profile penetrated and/or reshaped.Pedestal further defines align structures, and the align structures are configured with surface characteristics, in order to
Optical component (for example, optical fiber) is alignedly accurately located on pedestal by patterned surface precise optical, so as to allow light along
Restriction path transmission between patterned surface and optical component, wherein, patterned surface and align structures can be prolonged by punching press
The metal material of exhibition is integrally limited on pedestal with forming optical bench.
U.S. Patent Application Publication No. US2015/0355420A1 also disclose used in optical communications module be used for road
By the light coupling device of the light coupling device of optical signal, particularly optical bench form, wherein, having makes incident bendingof light, reflection
And/or the patterned surface of the surface profile reshaped is limited on metal base.Align structures are limited on pedestal, are configured with
Surface characteristics, in order to which with patterned surface optical registration light part (for example, optical fiber) is positioned on pedestal, so as to allow light
Along the restriction path transmission between patterned surface and light part.Patterned surface and align structures by punch pad can
The metal material of extension and be integrally limited on pedestal.Align structures be easy to patterned surface optical alignment by light part without
Source is aligned on pedestal, to allow light along the restriction path transmission between patterned surface and light part.
U.S. Patent Application Publication No. US2013/0294732A1 also discloses the airtight optical fiber pair with integral optical element
Prospective component, the particularly airtight optical fiber including optical bench include the metal ferrules with multiple grooves to prospective component, the optical bench
Part, the multiple groove are used for reception optical fiber end sections, wherein, groove limits positioning of the end sections on ferrule portion
And orientation.The component includes the optical element of one, for the photoelectricity being connected to input/output end of optical fiber in optical-electric module
Device.Optical element can be the form of structured reflecting surface.The end of optical fiber distance structure reflecting surface limit away from
It is aligned from place and with structured reflecting surface.Structured reflecting surface and optical fiber align groove can pass through punching press ductile metals
To limit these features on metal base to be formed.
U.S. Patent No. 9,213,148 also discloses similar airtight optical fiber to prospective component, but does not need the knot of one
Structure reflecting surface.
U.S. Patent No. 7,343,770 discloses the novel accurate stamping system for manufacturing small tolerance parts.This
The invention stamping system of sample can be implemented with various punching courses, to produce the device that patent described above is disclosed in
Part.These punching courses are related to punching press large volume material (for example, metal stock), so as to be formed finally with tight (that is, small) tolerance
The geometry of whole geometry and surface characteristics, including it is several with the expectation that the surface characteristics limited with other is accurately aligned
The reflecting surface of what shape.
U.S. Patent Application Publication No. US2016/0016218A1 also discloses a kind of composite construction, including with main
Partial pedestal and the slave part of dissimilar metal material.Pedestal and slave part pass through stamping.In slave part quilt
During punching press, it is interlocked with pedestal, while, desired structured features, such as unstructured reflective are formed on slave part
Surface, optical fiber align feature etc..Profit in this way, can be shaped relatively less with less effort in the volume of pedestal
Crucial structured features, to maintain relatively bigger tolerance, and the relatively more crucial structured features quilt on slave part
More accurately shape, further to consider to be sized in relatively smaller tolerance lower limit, geometry and/or finish.Auxiliary
Part can include other composite construction, and it has associated from the different performance of the structured features different for punching press
Two kinds of dissimilar metal materials.This process for stamping improves the Sheet Metal Forming Technology earlier in U.S. Patent No. 7,343,770, its
In, the large volume material by punching press is homogeneous material (for example, bonding jumper, such as Kovar alloy (Kovar), aluminium
Deng).Punching course produces the architectural feature for coming from single homogeneous material.Therefore, the property that different characteristic will have the material jointly
Can, this cannot be optimized for one or more feature.For example, may with the performance suitable for punching press alignment characteristicses
Not possessing has suitable for punching press to reduce the performance of the reflecting surface feature of the optimal light reflection efficiency of optical signal loss.
U.S. Patent No. 8,961,034 discloses the side that production is used for the lasso by fiber support in the joints of optical fibre
Method, including stamped metal blank, to form the main body of the longitudinal opening groove with multiple overall U-shapeds, each groove, which has, to be set
Longitudinal opening in the on the surface of the body, wherein, each groove size is arranged to securely keep optical fiber by grip optical fiber
In a groove.Optical fiber is securely held in the main body of lasso, without additional optical fiber holding member.
PCT Patent Application discloses No. WO2014/011283A2 lasso disclosed for the joints of optical fibre, which overcomes
The lasso of prior art and many shortcomings of connector, and further improve no pin alignment lasso described above.Optical fiber
Connector includes optical fiber ferrule, and it has overall oval cross section, for using sleeve by the array of multiple optical fiber with it is another
The optical fiber align kept in lasso.
Inventive concept above is incorporated herein by reference, and will be cited below in order to the open present invention.
The present invention is disclosed on the exemplary embodiment of the airtight optical fiber feedthrough component for airtight photoelectric packaging part, and it includes having collection
Into the optical bench sub-component of photonic device.
Fig. 2A and 2B illustrates one embodiment of the hermetic fiber feedthrough component of the form of optical bench sub-component 10, and it includes
Optical bench 11 according to an embodiment of the invention with integrated photonic device 12.In the illustrated embodiment, photon device
The opening position (see optical signal 22 in Fig. 2 B) that part 12 is aligned in optical input port/output end with optical bench 11 is arranged on sub- bottom
On seat 14, sub- base 14 is attached to optical bench 11.
Fig. 3 A and 3B more clearly illustrate the structure of the optical bench 11 in optical bench sub-component 10.In this embodiment,
Optical bench 11 is similar to the airtight multi fiber alignment sub-component disclosed in the US2016/0016218A1 of above-cited assignee.
Optical bench support is one or more fiber waveguide of multiple optical fiber 20 of optical cable 21 in the illustrated embodiment.For multiple light
Fine situation, the pedestal 13 of optical bench 11 limits multiple open recess 16 of support optical fiber 20, and limits or support optics
Element (for example, lens, prism, reflector, mirror etc.).In the illustrated embodiment, optical element includes structured reflecting surface
17 array, the corresponding optical fiber 20 of each structured reflecting surface 17.Reflecting surface can be flat reflecting surface or contoured
For recessed reflecting surface (for example, aspherical mirror surface) or convex reflecting surface.In the illustrated embodiment, pedestal 13 includes composite junction
Structure, composite construction include the material slave part dissimilar with the material of the remainder (that is, major part 13 ') of pedestal 13
30.Pedestal 13 including slave part 30 is special to form main body geometry and desired surface by extendable material punching press
Sign.In this case, slave part is shaped by the extendable metal material of punching press, to form the reflecting surface of structuring
17 and the array of groove 18, and pedestal 13 is by different extendable metal material punching presses, to form groove 16 and shown its
His structure.As disclosed in US2016/0016218A1, when slave part 17 is stamped, it is interlocked with pedestal 13, similar riveting
Nail, while forming desired structured features on slave part 30, includes the array and use of structured reflecting surface 17
In the optical fiber align groove 18 of the end sections of support optical fiber 20, to cause the end face of each reflecting surface 17 and corresponding optical fiber 20
(that is, input/output end) maintains exact relationship.In the present embodiment, slave part 17 and major part 13 ' use dissimilar
Metal material punching press.
Open recess 16 and 18 can (it will according to the punched openings groove disclosed in U.S. Patent No. 8,961,034
Optical fiber is firmly sandwiched in groove, without additional fastening member (for example, without epoxy resin etc.)) it is configured and shape
Into.In the illustrated embodiment, lid 15 is set to cover pedestal 13, without covered structure reflecting surface 17.Apply gas
Close sealing epoxy resin (for example, glass epoxy resin), to fill in the chamber 19 between lid 15 and pedestal 13 of optical fiber 20
The space of portion, gas-tight seal so as to be formed, to cause optical bench 11 for feedthrough component, it can be with the airtight feedback with Fig. 1
The similar function of parts 502 is used together with photoelectric packaging part, except optical bench 11 has being integrated in thereon according to the present invention
To be formed outside the photoelectric device of optical bench component 10.Further elaborating for similar airtight feedthrough component structure can be
Found in US2013/0294732A.
Fig. 4 A and 4B illustrate the another of similar to Fig. 3 A and 3B optical bench 11 optical bench 11 ' in addition to optical cable 21
Individual embodiment.In the present embodiment, optical bench 11 ' is provided with the removable connector of the form of lasso 30.Substitute from optical bench
11 ' the optical fiber 21 being extended, lasso 30 supports the proximal cross-section of the short part of optical fiber 20, and the remote fore-end of optical fiber is by light
The groove 16 and 18 having in seat 11 ' supports.Lasso 30 can be structured, with total non-circular cross-section, such as WO2014/
Disclosed in 011283A2.Sleeve (not shown) can be attached to for example with similar lasso terminate optical cable (for example, plug wire light
Cable).In the present embodiment, if connection optical cable becomes defective, it can be disconnected and be replaced, whole without replacing
Individual photoelectric packaging part, optical bench 11 ' forever or are regularly attached to the photoelectric packaging part.
Turning now to photonic device, in Fig. 2A and 2B diagram embodiment, photonic device 12 is mounted to sub- base 14
On, to form photonic device component 23.Sub- base 14 can be provided with circuit, electrical contact pad, circuit block (for example, VCSEL
The TIA of driver, PD) and the miscellaneous part and/or circuit associated with the operation of photonic device 12.
Fig. 6 A to 6C illustrate the assembling sequence of airtight photoelectric packaging part.Fig. 6 A illustrate photonic device (transmitter or reception
Device or transceiver) component assembling；Fig. 6 B illustrate the assembling of photonic device component and optical bench and active alignment；Fig. 6 C are illustrated
The assembling of airtight photoelectric packaging part.
With reference to figure 6A, in the case where photonic device 12 is transmitter (such as VCSEL etc), itself and driver chip one
Rise and be arranged on sub- base 14.VCSEL can be attached to the circuit on sub- base 14 with lead.It can be surveyed after assembling
Examination, to confirm that VCSEL is operable to send optical signal.In the case where photonic device 12 is receiver (such as PD etc), its
It is installed along with TIA chips on sub- base 14.PD can be attached to the circuit on sub- base 14 with lead.Can be after assembling
Tested, to confirm that PD is operable to receive optical device and export electric signal.In the case of transceiver, combine above
Process is to test the reception of separation and sending function.Photonic device 12 can include the multiple receptions being arranged on sub- base 14
Device, transmitter and/or transceiver.
With reference to figure 6B, the sub- base 14 of photonic device component is in the position of photonic device 12 and the optical alignment of optical bench 11
It is attached (in the position, input/output end of photonic device 12 and the output end of optical bench 11 and input optical alignment)
The apparent surface of the pedestal 13 of optical bench 11 is connected to, to cause optical path 12 to realize the expectation between photonic device and optical fiber 20
Light couples efficiency.In the embodiment of Fig. 2 B diagrams, optical path 22 is in the end face of input/output end of optical fiber 20 and correspondingly
Between output end/input of optical device 12, the optical path 22 is bent simultaneously by reflecting surface 17 (for example, aspherical mirror surface)
And reshape.More specifically, in the illustrated embodiment, optical path is from the direction that the plane of pedestal 13 comes out, the party
To the plane for being generally perpendicular to pedestal 13.As shown in Figure 2 B, the plane of sub- base 24 is parallel with the plane of pedestal 13.Framework 32 is set
The distance piece being set between the apparent surface of sub- base 14 and pedestal 13, to be provided between sub- base 14 and pedestal 13 to hold
Receive the space of photonic device 13.In the illustrated embodiment, four reflecting surfaces corresponding with the array of four optical fiber 20 be present
17 array.
Photonic device 12 can be passively aligned with optical bench 11 (for example, by being set on the pedestal dependent on optical bench 11
The alignment mark (not shown) put).Alternatively, photonic device 12 and optical bench 11 can pass through the light wave in optical bench 11
Lead and optical signal is transmitted between (that is, optical fiber 20) and photonic device 12 and measures the intensity of optical signal in optical path to determine to refer to
Show that the optics of optical alignment state couples to be actively aligned.Photonic device 12 (for example, VCSEL and/or PD) can be swashed
It is living, to allow the active alignment of the optical fiber with being supported in optical bench 11, without dependent on other in photoelectric packaging part
Part, optical bench component 10 are mounted to the photoelectric packaging part.For example, it is transmitter (for example, VCSEL) in photoelectric device 12
In the case of, it is energized to launch light to reflecting surface 17, to be directed to the end face of corresponding optical fiber 20.Via reflecting surface 17
Send and be measured through the intensity for the optical signal for corresponding to optical fiber, to determine that the light between transmitter and optical bench 11 couples.
In the case where photoelectric device is receiver (for example, PD), the optical signal supply that corresponding receiver is reflexed to by reflecting surface is worn
Cross optical fiber.It can be determined according to the electricity output (intensity of its corresponding optical signal received) of receiver between optical fiber and receiver
Light connection degree, to identify alignment.Active alignment procedures involve the plane in sub- base 14 on reflecting surface 17
Middle mobile photonic device 12, while determine that light couples efficiency for alignment point.In order to contribute to electrical connection to implement active alignment,
Conductive pad is arranged far from the surface of sub- base of pedestal 13.
Once realize desired optical alignment, the sub- base 14 of photonic device 12 for example by laser welding, soldering or
Epoxy resin is securely attached to the pedestal of optical bench.
After optical bench sub-component 10 is assembled, it can be aging, unqualified to eliminate life-span early stage, and be entered one
Walk functional test.
Embodiment before optical bench sub-component 10 including integrated photonic device 12 is with integrated photonic device 12
Airtight feedthrough component.
With reference to figure 6C, and as shown in Figure 2 B, once complete the assembling of optical bench sub-component 10, the gas of optical bench sub-component 10
Thickly (for example, passing through soldering) is attached to photoelectric packaging part 500 ', and photoelectric packaging part 500 ' may be with Figure 1A phase of packaging part 500
Seemingly, in addition to photonic device 12 is integrated into optical bench sub-component 10 with the optical alignment of optical bench 11.Photoelectric packaging part
500 ' are provided with various parts (for example, IC, chip, sub- base, circuit board etc.).Optical bench sub-component as airtight feedthrough component
10 are inserted through the opening of the ozzle 50 in the side wall of the shell 501 ' of seal 500 ', and by airtightly (for example, passing through
Soldering) sealing.Compared with Figure 1B situation, the position on seal 500 ' of the feedthrough component is not crucial, because not depositing
The optical alignment required between external photonic device in feedthrough component and packaging part 500 '.As shown in Figure 2 B, sub- base 14 can
To be attached to (its of printed circuit board (PCB) 39 in packaging part 500 ' using the through hole 36 for setting the substrate by sub- base 14, soldering
Can be flexible printed circuit board), with the photonic device 12 being connected on the opposite side of sub- base 14.With micro- soldering spherojoint
Ball grid array (BGA) can be only fitted on sub- base 14.Other electrical connectors can be including the optical bench in Fig. 5 embodiment
Sub-component 10 ', wherein, the circular trace 38 being arranged on the sidepiece of sub- base 14 ' is combined by lead or flexible circuit joint 37
The circuit board (not shown) being electrically connected in packaging part 500 '.Alternately, spring catch (not shown) can be configured to form
The electrical connector between printed circuit board (PCB) in sub- base and packaging part 500 '.These electrical connectors are absorbed due to thermal expansion/receipts
Error motion caused by contracting and stress, this will not influence to be integrated into optical bench in photonic device and optical bench sub-component on plate
Between optical alignment.
Fig. 7 illustrates airtight feedthrough component/optical bench sub-component 10 in airtight photoelectric packaging part 500 '.Other electricity
Sub- device and circuit block omit from Fig. 7 view.The airtight cover of airtight photoelectric packaging part 500 ' also omits from view.
After optical bench sub-component 10 is assembled into airtight photoelectric packaging part 500 ', packaging part 500 ' can be aging,
It is unqualified to eliminate life-span early stage, and by further functional test.
Assuming that the present invention is smart by optical element and part and photonic device before bigger photoelectric packaging part is assembled to
Really in the pre-assembled sub-component to optical bench, then optical bench sub-component can be outside photoelectric packaging part, in sub-component level by work(
It can test, including burn-in test, thus reduce and cause because the early stage of the photonic device in photoelectric packaging part is unqualified
More expensive photoelectric packaging part (including expensive circuit block, IC etc etc.) waste.Optical bench sub-component has
Source alignment procedures are easily more.In addition, much smaller and more robust structure ring is provided between optical bench and photonic device.By
This, the photoelectric packaging part for including the airtight feed according to the present invention, it is possible to achieve overall higher yield, it is higher can
By property and lower manufacturing cost.
Although the present invention is specifically shown and described by reference to preferred embodiment, skilled person will understand that
The change of various forms and details can be made in the case where not departing from the spirit, scope and teaching of the present invention.Therefore, originally
Invention disclosed is considered only as exemplifying and is limited in the range of specified in only appended claims.
Claims (20)
1. a kind of optical bench sub-component for being used to route optical signal, including：
Optical bench, including：
Pedestal；
Patterned surface, it is limited on pedestal, wherein, patterned surface has so that incident light reshapes and curved surface
Profile；
Optical component；And
Align structures, it is limited on pedestal, is configured with surface characteristics, it is fixed by optical component and patterned surface optical alignment
Position is on pedestal, so as to allow optical path transmission of the optical signal along the restriction between patterned surface and optical component, its
In, optical path is extended to outside pedestal from patterned surface；And
Photonic device component, including photonic device, wherein, photonic device component is attached to pedestal, and wherein photonic device is along light
Ways for education footpath optical alignment is to patterned surface.
2. optical bench sub-component as claimed in claim 1, wherein, optical component includes fiber waveguide.
3. optical bench sub-component as claimed in claim 2, wherein, fiber waveguide includes the array of optical fiber, and patterned surface
Array including structured reflecting surface.
4. optical bench sub-component as claimed in claim 3, in addition to lid, the lid is airtightly attached to pedestal, with airtightly close
The space sealed around the section of the array of optical fiber, wherein, lid does not extend with covered structure surface, is consequently formed airtight feedthrough
Part.
5. optical bench sub-component as claimed in claim 4, wherein, it is mounted thereto that photonic device component includes photonic device
Sub- base, and wherein, sub- base is attached to the pedestal of optical bench, wherein photonic device and patterned surface optical alignment.
6. optical bench sub-component as claimed in claim 5, wherein, photonic device includes transmitter, receiver or transceiver.
7. optical bench sub-component as claimed in claim 6, wherein, photonic device is passively aligned to patterned surface.
8. optical bench sub-component as claimed in claim 6, wherein, photonic device is actively aligned to patterned surface.
9. optical bench sub-component as claimed in claim 1, wherein, patterned surface and align structures by punch pad can
The material of extension and be integrally defined on pedestal.
10. optical bench sub-component as claimed in claim 9, wherein, pedestal includes：
The major part of first material, for limiting first structure feature；And
The slave part of second material, for limiting the second structured features on the second material, wherein, the second material and first
Material is dissimilar,
Wherein, pedestal is attached in slave part structure, to be consequently formed including special with the first structureization being limited to thereon
The major part of first material of sign and slave part with the second material for being limited to the second structured features thereon
Composite construction, and wherein, the first and second structured features limit optical path to route optical signal.
11. a kind of airtight photoelectric packaging part, including：
Shell；
Electronic unit, it is arranged in shell；And
Optical bench sub-component as shown in claim 4, is attached to shell.
12. airtight photoelectric packaging part as claimed in claim 11, wherein, optical bench sub-component airtightly seal to shell it
It is preceding functionally to be tested.
13. a kind of method for assembling the optical bench sub-component for routeing optical signal, including：
Optical bench is provided, optical bench includes：
Pedestal；
Patterned surface, it is limited on pedestal, wherein, patterned surface has so that incident light reshapes and curved surface
Profile；
Optical component；And
Align structures, it is limited on pedestal, is configured with surface characteristics, it is fixed by optical component and patterned surface optical alignment
Position is on pedestal, so as to allow optical path transmission of the optical signal along the restriction between patterned surface and optical component, its
In, optical path is extended to outside pedestal from body structure surface；
There is provided includes the photonic device component of photonic device；
Along optical path by photonic device optical alignment to patterned surface；And
Once optical alignment, photonic device component is attached to pedestal.
14. method as claimed in claim 13, wherein, optical component includes the array of optical fiber, and patterned surface includes
The array of structured reflecting surface, and wherein, methods described also includes providing lid, and the lid is airtightly attached to pedestal, with
Space around the section of the array of gas-tight seal optical fiber, wherein, lid does not extend with covered structure surface, is consequently formed airtight
Feedthrough component.
15. method as claimed in claim 14, wherein, photonic device component includes photonic device bottom mounted thereto
Seat, and wherein, sub- base is attached to the pedestal of optical bench, wherein photonic device and patterned surface optical alignment.
16. method as claimed in claim 15, wherein, photonic device includes transmitter, receiver or transceiver.
17. method as claimed in claim 16, wherein, photonic device is actively aligned to patterned surface.
18. method as claimed in claim 17, wherein, optical bench component is functionally tested in sub-component level, including aging
Test.
19. a kind of method for forming airtight photoelectric packaging part, including：
Shell is provided；
Electronic building brick is set in shell；And
The optical bench sub-component assembled according to claim 14 is airtightly attached to shell.
20. method as claimed in claim 19, wherein, optical bench sub-component is before airtightly sealing to shell by functionally
Test, including burn-in test.
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562136601P | 2015-03-22 | 2015-03-22 | |
| US62/136,601 | 2015-03-22 | ||
| US14/695,008 US20150355420A1 (en) | 2012-03-05 | 2015-04-23 | Coupling device having a stamped structured surface for routing optical data signals |
| US14/695,008 | 2015-04-23 | ||
| US14/714,211 US9782814B2 (en) | 2012-03-05 | 2015-05-15 | Stamping to form a composite structure of dissimilar materials having structured features |
| US14/714,211 | 2015-05-15 | ||
| PCT/US2016/023636 WO2016154229A1 (en) | 2015-03-22 | 2016-03-22 | Optical bench subassembly having integrated photonic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107533202A true CN107533202A (en) | 2018-01-02 |
| CN107533202B CN107533202B (en) | 2021-01-15 |
Family
ID=55802455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201680023080.XA Active CN107533202B (en) | 2015-03-22 | 2016-03-22 | Optical bench subassembly with integrated photonic device |
Country Status (11)
| Country | Link |
|---|---|
| EP (1) | EP3274108A1 (en) |
| JP (1) | JP6898245B2 (en) |
| KR (1) | KR20170129236A (en) |
| CN (1) | CN107533202B (en) |
| AU (1) | AU2016235324B2 (en) |
| BR (1) | BR112017019567A2 (en) |
| CA (1) | CA2978955A1 (en) |
| IL (1) | IL254364A0 (en) |
| MX (1) | MX2017012155A (en) |
| RU (1) | RU2717374C2 (en) |
| WO (1) | WO2016154229A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA3117540A1 (en) * | 2018-10-23 | 2020-04-30 | Cudoquanta Florida, Inc. | A demountable connection of an optical connector and an optical bench based connector using an alignment coupler |
| US20240085633A1 (en) * | 2022-09-14 | 2024-03-14 | Senko Advanced Components, Inc. | Configurable optical connector module |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001027676A1 (en) * | 1999-10-14 | 2001-04-19 | Digital Optics Corporation | Optical subassembly |
| US20080008426A1 (en) * | 2006-07-07 | 2008-01-10 | Seiko Epson Corporation | Optical module package and optical module |
| CN101266325A (en) * | 2007-03-15 | 2008-09-17 | 日立电线株式会社 | Optical system connection structure, optical component, and optical communication module |
| CN102621641A (en) * | 2011-01-27 | 2012-08-01 | 鸿富锦精密工业（深圳）有限公司 | Optical fiber connector |
| WO2013134326A1 (en) * | 2012-03-05 | 2013-09-12 | Nanoprecision Products, Inc. | Coupling device having a structured reflective surface for coupling input/output of an optical fiber |
| US20130294732A1 (en) * | 2012-03-05 | 2013-11-07 | Nanoprecision Products, Inc. | Hermetic optical fiber alignment assembly having integrated optical element |
| CN103630988A (en) * | 2012-04-24 | 2014-03-12 | 新科实业有限公司 | Optoelectronic assembly and active optical cable using same |
| CN103676029A (en) * | 2012-09-14 | 2014-03-26 | 鸿富锦精密工业（深圳）有限公司 | Photoelectric coupling module |
| CN103792626A (en) * | 2012-11-02 | 2014-05-14 | 信泰光学(深圳)有限公司 | Optical coupling device |
| CN104220915A (en) * | 2012-03-02 | 2014-12-17 | 泰科电子公司 | Modularized interposer |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IT1240310B (en) * | 1989-07-24 | 1993-12-07 | Pirelli Cavi Spa | SEPARABLE CONNECTION GROUP FOR OPTICAL FIBERS COMBINED WITH BELT AND RELATED METHOD OF REALIZATION. |
| DE69430876T2 (en) * | 1993-03-31 | 2002-12-19 | Sumitomo Electric Industries, Ltd. | Optical fiber array and method of making it |
| DE19748989A1 (en) * | 1997-11-06 | 1999-07-15 | Daimler Chrysler Ag | Optical transmit / receive module |
| WO2002057821A1 (en) * | 2001-01-19 | 2002-07-25 | Primarion, Inc. | Optical interconnect with integral reflective surface and lens, system including the interconnect and method of forming the same |
| US20020110328A1 (en) * | 2001-02-14 | 2002-08-15 | Bischel William K. | Multi-channel laser pump source for optical amplifiers |
| AU2002318132A1 (en) * | 2001-05-15 | 2002-11-25 | Peregrine Semiconductor Corporation | Small-scale optoelectronic package |
| US7343770B2 (en) | 2002-08-16 | 2008-03-18 | Nanoprecision Products, Inc. | Stamping system for manufacturing high tolerance parts |
| US20070172175A1 (en) * | 2006-01-26 | 2007-07-26 | Talapker Imanbayev | Hermetic fiber optic ferrule |
| RU2638965C2 (en) | 2011-04-05 | 2017-12-19 | Нанопресижен Продактс, Инк. | Connecting clamp for optical fibres with grooves for clamping open fibres |
| US20150355420A1 (en) | 2012-03-05 | 2015-12-10 | Nanoprecision Products, Inc. | Coupling device having a stamped structured surface for routing optical data signals |
| EP2836865B1 (en) | 2012-04-11 | 2023-09-06 | Senko Advanced Components Inc. | Hermetic optical fiber alignment assembly having integrated optical element |
| JP6325522B2 (en) | 2012-04-11 | 2018-05-16 | ナノプレシジョン プロダクツ インコーポレイテッドＮａｎｏｐｒｅｃｉｓｉｏｎ Ｐｒｏｄｕｃｔｓ， Ｉｎｃ． | Fiber optic connector ferrule with curved external alignment surface |
-
2016
- 2016-03-22 MX MX2017012155A patent/MX2017012155A/en unknown
- 2016-03-22 RU RU2017136256A patent/RU2717374C2/en active
- 2016-03-22 WO PCT/US2016/023636 patent/WO2016154229A1/en active Application Filing
- 2016-03-22 CA CA2978955A patent/CA2978955A1/en not_active Abandoned
- 2016-03-22 BR BR112017019567A patent/BR112017019567A2/en not_active Application Discontinuation
- 2016-03-22 JP JP2017546852A patent/JP6898245B2/en active Active
- 2016-03-22 AU AU2016235324A patent/AU2016235324B2/en not_active Ceased
- 2016-03-22 EP EP16717731.0A patent/EP3274108A1/en active Pending
- 2016-03-22 KR KR1020177030028A patent/KR20170129236A/en not_active Application Discontinuation
- 2016-03-22 CN CN201680023080.XA patent/CN107533202B/en active Active
-
2017
- 2017-09-06 IL IL254364A patent/IL254364A0/en unknown
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001027676A1 (en) * | 1999-10-14 | 2001-04-19 | Digital Optics Corporation | Optical subassembly |
| US20080008426A1 (en) * | 2006-07-07 | 2008-01-10 | Seiko Epson Corporation | Optical module package and optical module |
| CN101266325A (en) * | 2007-03-15 | 2008-09-17 | 日立电线株式会社 | Optical system connection structure, optical component, and optical communication module |
| CN102621641A (en) * | 2011-01-27 | 2012-08-01 | 鸿富锦精密工业（深圳）有限公司 | Optical fiber connector |
| CN104220915A (en) * | 2012-03-02 | 2014-12-17 | 泰科电子公司 | Modularized interposer |
| WO2013134326A1 (en) * | 2012-03-05 | 2013-09-12 | Nanoprecision Products, Inc. | Coupling device having a structured reflective surface for coupling input/output of an optical fiber |
| US20130294732A1 (en) * | 2012-03-05 | 2013-11-07 | Nanoprecision Products, Inc. | Hermetic optical fiber alignment assembly having integrated optical element |
| CN103630988A (en) * | 2012-04-24 | 2014-03-12 | 新科实业有限公司 | Optoelectronic assembly and active optical cable using same |
| CN103676029A (en) * | 2012-09-14 | 2014-03-26 | 鸿富锦精密工业（深圳）有限公司 | Photoelectric coupling module |
| CN103792626A (en) * | 2012-11-02 | 2014-05-14 | 信泰光学(深圳)有限公司 | Optical coupling device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2018509655A (en) | 2018-04-05 |
| IL254364A0 (en) | 2017-11-30 |
| MX2017012155A (en) | 2018-02-19 |
| KR20170129236A (en) | 2017-11-24 |
| WO2016154229A1 (en) | 2016-09-29 |
| AU2016235324A1 (en) | 2017-11-09 |
| EP3274108A1 (en) | 2018-01-31 |
| AU2016235324B2 (en) | 2021-05-20 |
| CN107533202B (en) | 2021-01-15 |
| RU2017136256A3 (en) | 2019-09-26 |
| JP6898245B2 (en) | 2021-07-07 |
| BR112017019567A2 (en) | 2018-05-02 |
| RU2717374C2 (en) | 2020-03-23 |
| RU2017136256A (en) | 2019-04-23 |
| CA2978955A1 (en) | 2016-09-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11803020B2 (en) | Optical bench subassembly having integrated photonic device | |
| US10761280B2 (en) | Hermetic optical subassembly | |
| US20190137705A1 (en) | Optical alignment of an optical subassembly to an optoelectronic device | |
| US6795461B1 (en) | Optoelectric module | |
| US6056448A (en) | Vertical cavity surface emitting laser array packaging | |
| JP4690963B2 (en) | Manufacturing method of multi-channel optical module | |
| CN104364689B (en) | For coupling the coupling device with structured reflecting surface of optical fiber input/output | |
| JP4477677B2 (en) | Optical module and manufacturing method thereof | |
| KR20170012339A (en) | Vision-based passive alignment of an optical fiber subassembly to an optoelectronic device | |
| US8265487B2 (en) | Half-duplex, single-fiber (S-F) optical transceiver module and method | |
| US20030210866A1 (en) | Optical transceiver module and optical communications system using the same | |
| US20060159404A1 (en) | Optical transmitter module with an integrated lens and method for making the module | |
| WO2009107671A1 (en) | Photoelectric conversion device | |
| US20170261701A1 (en) | Optical module | |
| CN101685183A (en) | Optical module, optical transmission device, and surface optical device | |
| CN107533202A (en) | Optical bench sub-component with integrated photonic device | |
| WO2007037364A1 (en) | Optical module | |
| KR20070113651A (en) | Passively aligned optical subassembly and manufacturing method thereof | |
| KR100551548B1 (en) | Optical sub-assembly(osa) module with passive optical alignment and method for manufacturing thereof | |
| KR102665420B1 (en) | Optical coupling structure, optical coupling method, camera module | |
| US6948860B1 (en) | Optical subassembly for optoelectronic devices | |
| KR100601033B1 (en) | Optical Sub-AssemblyOSA module with passively aligned optical fibers | |
| JP2008046367A (en) | Optical transceiver and optical module | |
| JP2001291923A (en) | Light transmission-reception module | |
| JP2005222003A (en) | Mount, optical component, optical transmission/reception module, and bidirectional optical communication module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |