CN107360666A - A kind of PCB black holes attribute test plate and method for quickly detecting - Google Patents
A kind of PCB black holes attribute test plate and method for quickly detecting Download PDFInfo
- Publication number
- CN107360666A CN107360666A CN201710541848.9A CN201710541848A CN107360666A CN 107360666 A CN107360666 A CN 107360666A CN 201710541848 A CN201710541848 A CN 201710541848A CN 107360666 A CN107360666 A CN 107360666A
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- Prior art keywords
- black holes
- pcb
- hole
- holes
- black
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
- H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The present invention is by designing special test group and sets of vias covering the corner of copper dual platen and middle part, so that PCB black holes attribute test plates are made；Then PCB black holes attribute tests plate is subjected to black holes Direct Electroplating, the resistance R1 two testing weld pads in each test group and the resistance value R3 between the line pad at through hole both ends are detected again, and respectively compared with black holes film resistance standard value R4 in default surface black holes film resistance standard value R2, default hole, so as to reach the purpose quickly examined.Can be before the black holes Direct Electroplating of PCB product be carried out, test verification is carried out using the PCB black holes attribute tests plate, so as to prejudge the processing quality of black holes film in the surface black holes film and hole of black holes Direct Electroplating, can be to find defective workmanship ahead of time, adjusting process parameter provide reference, prevent carry out PCB product black holes Direct Electroplating when because it is poor quality and caused by waste.
Description
Technical field
The present invention relates to pcb board black holes Direct Electroplating technology, more particularly to a kind of PCB black holes attribute test plate and quick
The method of inspection.
Background technology
Black holes Direct Electroplating technology is a kind of copper-plated new technology of substituted chemistry.It uses extremely strong fine of conductive capability
The dark solution of carbon black or graphite composition, is referred to as blank hole liquid, English name Blackhole.It is characterized in simplifying plated through-hole
Technique, save man-hour, reduce material consumption, and efficiently controlled the discharge capacity of waste water, reduce being produced into for printed board
This.Blank hole liquid has good stability, and no hydrogen separates out in completing to the adsorption process of the copper-clad plate after through hole.But black holes
Whether technique could use the method detection black holes quality of backlight section normal after needing copper facing, therefore can not be effectively to black holes product
Matter carries out prevention management and control.
The content of the invention
In view of the above-mentioned problems, the present invention provides a kind of PCB black holes attribute test plate, including square cover copper dual platen, institute
State and a test group is respectively equipped with the corner for covering copper dual platen, the test group includes two testing weld pads；Cover in copper dual platen
Portion is provided with multiple sets of vias, and the sets of vias includes the different through hole of multiple diameters；Cover corresponding each on the two sides of copper dual platen
The both ends of through hole are provided with line pad.
Preferably, the size for covering copper dual platen is not less than 50*50mm.
Preferably, the centre-to-centre spacing of two testing weld pads is 5mm in test group;The centre-to-centre spacing of adjacent through-holes is in sets of vias
5mm。
Preferably, the testing weld pad is circular and a diameter of 1mm.
Preferably, the line pad is annular and big 0.25mm more unilateral than respective through hole.
Preferably, sets of vias is followed successively by 0.2mm, 0.25mm, 0.3mm, 0.35mm including diameter, 0.4mm, 0.45mm,
0.5mm 7 through holes；7 through holes line up by diameter order.
Further, cover and be provided with 6 sets of vias in the middle part of copper dual platen, 6 sets of vias are in 6 rows and parallel from top to bottom
Arrangement.
Further, the through hole in two neighboring sets of vias is respectively according to diameter from greatly to small and diameter from as low as big suitable
Sequence arranges.
The present invention also provides a kind of method for quickly detecting using above-mentioned PCB black holes attribute test plate, by PCB black holes qualities
Test board carries out black holes Direct Electroplating；The resistance in each test group between two testing weld pads is tested using universal meter, is obtained
The resistance value R1 of surface black holes film between two testing weld pads, and compared with default surface black holes film resistance standard value R2, if
R1 is less than R2, then judges that the quality of surface black holes film is up to standard, be otherwise determined as not up to standard；Each through hole two is tested using universal meter
Resistance value R3 between the line pad at end, and compared with black holes film resistance standard value R4 in default hole, if R3 is less than R4, sentence
It is up to standard to determine the quality of black holes film in hole, is otherwise determined as not up to standard.
Preferably, the default surface black holes film resistance standard value R2 is 500M Ω, black holes film resistance standard value in hole
R4 is 200M Ω.
The present invention is by designing special test group and sets of vias covering the corner of copper dual platen and middle part, so that PCB is made
Black holes attribute test plate；Then PCB black holes attribute tests plate is subjected to black holes Direct Electroplating, then to two in each test group
Resistance R1 between testing weld pad and the resistance value R3 between the line pad at through hole both ends are detected, and respectively with default surface
Black holes film resistance standard value R4 compares in black holes film resistance standard value R2, default hole, so as to reach the purpose quickly examined.Can
So that before the black holes Direct Electroplating of PCB product is carried out, test verification is carried out using the PCB black holes attribute tests plate, so as to
The processing quality of black holes film in the surface black holes film and hole of black holes Direct Electroplating is prejudged, can be to find that technique lacks ahead of time
Fall into, adjusting process parameter provide reference, prevent carry out PCB product black holes Direct Electroplating when because it is poor quality and caused by wave
Take.
Brief description of the drawings
Fig. 1 is PCB black holes attribute test plate example structure schematic diagram provided by the invention.
Embodiment
The technology contents of the present invention are understood for convenience of those skilled in the art, below in conjunction with the accompanying drawings and embodiment is to this hair
It is bright to be described in further detail.
PCB black holes attribute test plates as shown in Figure 1, including the square of 60*60mm cover copper dual platen 1, cover copper dual platen 1
Corner at be respectively equipped with a test group 2, test group includes two testing weld pads, and testing weld pad is circular and a diameter of 1mm,
The centre-to-centre spacing of two testing weld pads is 5mm；Cover the middle part of copper dual platen 1 and be provided with 6 sets of vias 3, include 7 in each sets of vias 3
Through hole, diameter are followed successively by 0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm, 0.5mm, arranged by diameter order
Embark on journey, the centre-to-centre spacing of adjacent through-holes is 5mm.Cover and the both ends of each through hole are corresponded on the upper and lower surface of copper dual platen 1 be respectively equipped with
Line pad, line pad are annular and big 0.25mm more unilateral than respective through hole.6 sets of vias 3 are in 6 rows and parallel from top to bottom
Arrangement, through hole in two neighboring sets of vias to small and diameter from as low as big order respectively according to diameter from arranging greatly, and first
Through hole in capable sets of vias is pressed from being arranged to small order greatly, and the through hole in the sets of vias of the second row is pressed from as low as big order
Arrangement, replaces successively.
When quickly being examined, PCB black holes attribute tests plate is first subjected to black holes Direct Electroplating；Reuse universal meter
The resistance between two testing weld pads in each test group is tested, obtains the resistance value of the surface black holes film between two testing weld pads
R1, the black holes film of conduction can be formed after being electroplated due to black holesization in plate surface, then should be turned between two testing weld pads, therefore by institute
The resistance value R1 measured is compared with default surface black holes film resistance standard value R2, if R1 is less than R2, judges surface black holes film
Quality it is up to standard, be otherwise determined as not up to standard；The resistance value R3 tested using universal meter between the line pad at each through hole both ends,
Also the black holes film of conduction can be formed after black holesization plating in through hole, should also be turned between the line pad at through hole both ends, therefore will
Resistance value R3 between the line pad at each through hole both ends is compared with black holes film resistance standard value R4 in default hole, if R3 is less than
R4, then judge hole in black holes film quality it is up to standard, be otherwise determined as it is not up to standard, so as to reach the effect quickly examined.As one
The preferable scheme of kind, by the data statistics in actual production, 500M Ω is set to by R2, R4 is set to 200M Ω, when resistance is less than
During this value, quality is normal in plating metapore, and when more than this value, copper facing cavity, hole copper fracture equivalent risk are had in hole.
In the design of PCB black holes attribute test plates, the corner of copper dual platen is being covered into test group design, it is two-sided covering copper
The multigroup drilling group of plate central design, and the alternating being sized by the design to sets of vias inner via hole size and through hole is set
Meter, can widely examine plate face and be distributed in the black holes quality of the through hole of different piece different pore size on plate, due to through hole
When being electroplated, its electroplating quality can be by pore size influences, so that it may when examining by counting through hole not up to standard, so as to look for
Go out defective workmanship, be improved.
It is the specific implementation of the present invention above, its description is more specific and detailed, but can not therefore be interpreted as
Limitation to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, this hair is not being departed from
On the premise of bright design, various modifications and improvements can be made, these obvious alternative forms belong to the present invention's
Protection domain.
Claims (10)
- A kind of 1. PCB black holes attribute test plate, it is characterised in that：Including square cover copper dual platen, the copper dual platen that covers A test group is respectively equipped with corner, the test group includes two testing weld pads；Cover and be provided with multiple through holes in the middle part of copper dual platen Group, the sets of vias include the different through hole of multiple diameters；Cover and the both ends of each through hole are corresponded on the two sides of copper dual platen be provided with Line pad.
- 2. according to PCB black holes attribute test plates described in claim 1, it is characterised in that：It is described cover copper dual platen size it is not small In 50*50mm.
- 3. according to PCB black holes attribute test plates described in claim 1, it is characterised in that：In test group in two testing weld pads The heart is away from for 5mm；The centre-to-centre spacing of adjacent through-holes is 5mm in sets of vias.
- 4. according to PCB black holes attribute test plates described in claim 1, it is characterised in that：The testing weld pad is circular and diameter For 1mm.
- 5. according to PCB black holes attribute test plates described in claim 1, it is characterised in that：The line pad is annular and compares phase Answer the unilateral big 0.25mm of through hole.
- 6. according to PCB black holes attribute test plates described in claim 1, it is characterised in that：Sets of vias is followed successively by including diameter 0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm, 0.5mm 7 through holes；7 through holes are suitable by diameter Sequence lines up.
- 7. according to PCB black holes attribute test plates described in claim 6, it is characterised in that：Cover and be provided with 6 through holes in the middle part of copper dual platen Group, 6 sets of vias are in 6 rows and arranged in parallel from top to bottom.
- 8. according to PCB black holes attribute test plates described in claim 7, it is characterised in that：Through hole point in two neighboring sets of vias Not according to diameter from being arranged to small and diameter from as low as big order greatly.
- 9. a kind of method for quickly detecting based on PCB black holes attribute test plate described in claim 1, including：By PCB black holes qualities Test board carries out black holes Direct Electroplating；The resistance in each test group between two testing weld pads is tested using universal meter, is obtained The resistance value R1 of surface black holes film between two testing weld pads, and compared with default surface black holes film resistance standard value R2, if R1 is less than R2, then judges that the quality of surface black holes film is up to standard, be otherwise determined as not up to standard；Each through hole two is tested using universal meter Resistance value R3 between the line pad at end, and compared with black holes film resistance standard value R4 in default hole, if R3 is less than R4, sentence It is up to standard to determine the quality of black holes film in hole, is otherwise determined as not up to standard.
- 10. according to method for quickly detecting described in claim 9, it is characterised in that：The default surface black holes film resistance standard Value R2 is 500M Ω, and black holes film resistance standard value R4 is 200M Ω in default hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710541848.9A CN107360666A (en) | 2017-07-05 | 2017-07-05 | A kind of PCB black holes attribute test plate and method for quickly detecting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710541848.9A CN107360666A (en) | 2017-07-05 | 2017-07-05 | A kind of PCB black holes attribute test plate and method for quickly detecting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107360666A true CN107360666A (en) | 2017-11-17 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710541848.9A Pending CN107360666A (en) | 2017-07-05 | 2017-07-05 | A kind of PCB black holes attribute test plate and method for quickly detecting |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111025130A (en) * | 2020-01-07 | 2020-04-17 | 电子科技大学 | SMT detection method for multilayer interconnected FPC |
| CN111077435A (en) * | 2020-01-09 | 2020-04-28 | 惠州市大亚湾科翔科技电路板有限公司 | Monitoring method for abnormal copper in printed circuit board hole |
| CN112954889A (en) * | 2021-01-20 | 2021-06-11 | 江门崇达电路技术有限公司 | Copper deposition process test board and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111025130A (en) * | 2020-01-07 | 2020-04-17 | 电子科技大学 | SMT detection method for multilayer interconnected FPC |
| CN111077435A (en) * | 2020-01-09 | 2020-04-28 | 惠州市大亚湾科翔科技电路板有限公司 | Monitoring method for abnormal copper in printed circuit board hole |
| CN112954889A (en) * | 2021-01-20 | 2021-06-11 | 江门崇达电路技术有限公司 | Copper deposition process test board and manufacturing method thereof |
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Application publication date: 20171117 |